Class / Patent application number | Description | Number of patent applications / Date published |
361811000 | With passive components | 28 |
20080205023 | ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME - A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints. | 08-28-2008 |
20080205024 | ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME - A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints. | 08-28-2008 |
20080218988 | Interconnect for an electrical circuit substrate - A passive surface mount part such as a capacitor or a resistor is employed to attach a first substrate to a second substrate, or a semiconductor device to a substrate, for an electrical circuit assembly. Applicable forms of substrates include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates can be utilized for a structure such as optical glass structure to be situated between the substrates for use with an optical circuit assembly. | 09-11-2008 |
20080304245 | SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE - A method for discharging an electronic device on a substrate is provided. A metal pin mounted on a wire bonder is used to touch with a specific finger disposed on the substrate which is in electrical connection with the electronic device. As a result, the electric charge previously stored in the electronic device will be conducted to the wire bonder through the specific finger and metal pin thereby discharging the stored charge. Another method for discharging an electronic device on a substrate is also provided. A metal wire protruding out from the capillary of a wire bonder is heated to form a metal ball at the capillary. The capillary is moved to bring the metal ball into contact with the specific finger. As a result, the electric charge previously stored in the electronic device will thus can be discharged to the wire bonder. The present invention further provides a semiconductor package. | 12-11-2008 |
20090052152 | Electronic Sensor - A high-temperature platform chip has at least three electrodes on an electrically insulating substrate constructed as a heating plate with a heat conductor on the back side. | 02-26-2009 |
20090122506 | GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY, AND MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A glass ceramic composition includes a SrZrO | 05-14-2009 |
20090161332 | Socket with power supply - The present invention discloses a socket with power supply, comprising a housing having a upper cover and a lower cover which are connected together to form a receiving space; a transformer connected with an alternate current source through a plug protruding out of the first opening; at least a socket capable of outputting the alternate current; a rectifying circuit capable of rectifying the alternate current to direct current; and an output power plug coupled with the rectifying circuit and protruding out of the second opening through a power cord to output the direct current to an electronic device. | 06-25-2009 |
20090168387 | Packaged Integrated Circuits Having Inductors and Methods to Form Inductors in Packaged Integrated Circuits - Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit. | 07-02-2009 |
20090196005 | Multiple Electronic Components: Combination Capacitor and Zener Diode - A Zener diode—capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit. | 08-06-2009 |
20090213564 | Drive device control unit - A drive device control unit that controls a drive device including a rotating electrical machine, the drive device control unit includes a control substrate that controls the drive device; a switching element module that forms an inverter that drives the rotating electrical machine; a smoothing capacitor that smoothes an input power supply of the inverter; a first base having the switching element module fixed thereto; and a second base supported by the first base and having the smoothing capacitor fixed to a first surface of the second base, wherein the control substrate is fixed to a second surface of the second base opposite to the first surface having the smoothing capacitor fixed thereto. | 08-27-2009 |
20100142173 | Signal filter module - A signal filter module includes an electrically insulative housing having protruding blocks respectively protruded from the bottom edge of each of two opposite vertical sidewalls thereof and a wire groove defined between each two adjacent protruding blocks, metal terminals each having a base partially embedded in one of the vertical sidewalls of the electrically insulative housing and partially exposed to the outside of the associating vertical sidewall to provide a bonding surface and a bonding tip extended from one end of the base and suspending outside the electrically insulative housing for bonding to an external circuit board, and filter elements each having coils wound thereon with lead ends of the coils respectively inserted through the wire grooves of the electrically insulative housing and bonded to the bonding surfaces of the bases of the metal terminals. | 06-10-2010 |
20100157565 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT - A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components. | 06-24-2010 |
20100214758 | DETACHABLE CAPACITOR DEVICE - A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor. | 08-26-2010 |
20100232130 | CAPACITOR MOUNTING CONSTRUCTION - A capacitor mounting construction includes housing, a bracket and an urging member. The housing has a capacitor accommodating space configured to accommodate a capacitor and a wire accommodating space configured to accommodate a wire extended from the capacitor. The bracket is engaged with the housing, is configured to fix and electrically connect the wire to a conductive member in the wire accommodating space, and covers the capacitor accommodating space to define a capacitor accommodating chamber. The urging member is provided on an inner wall of the capacitor accommodating chamber, and is configured to urge the capacitor to contact another inner wall of the capacitor accommodating chamber. | 09-16-2010 |
20100238640 | ELECTRONIC DEVICE HAVING IMPROVED INPUT DEVICE - An electronic device includes a body and an input device. The body includes a shell and a non-conductive rear cover. The shell defines an opening. The rear cover tightly covers the opening and defines a through hole. The input device includes a resistor, a wire, a non-conductive rotating plate, and a conducting member. The resistor and the wire both are discontinuous ring-shaped, and concentrically disposed on the rear cover surrounding the through hole. The rotating plate is rotatably inserted through the through hole. The conducting member is disposed on the rotating plate and connects the resistor and the wire. The conducting member is operable to move around the resistor and the wire such that a resistance between one end of the resistor and one end of the wire is changed. | 09-23-2010 |
20110170275 | INTEGRATED POWER INSERTER - The present invention relates to an integrated power inserter, comprises: a housing; a voltage lowering and rectifying member; and a coupling member having a power input end, a radio frequency signal coupling circuit, a radio frequency signal input end and a radio frequency signal output end, wherein the radio frequency signal input end is input with a radio frequency signal and outputs a power signal, the radio frequency signal output end outputs a radio frequency signal being coupled to a television; with the mentioned structure of the integrated power inserter, a power inserter can be integrated in a power adaptor for simplifying wire layout and lowering production cost. | 07-14-2011 |
20110228507 | MOLDED POWER-SUPPLY MODULE WITH BRIDGE INDUCTOR OVER OTHER COMPONENTS - An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components. | 09-22-2011 |
20110228508 | POWER CONVERSION APPARATUS - A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case. | 09-22-2011 |
20110235302 | Semiconductor device and semiconductor device manufacturing method - A semiconductor device and manufacturing method to effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element. | 09-29-2011 |
20120002391 | Apparatus for Indicating a Status of an Apparatus That Energizes a Protective Device, and Associated Method - An improved overload relay includes a number of current transformers that draw power from a circuit it protects in order to evaluate the circuit and also to power itself. The overload relay advantageously includes a visual indicator that includes an LED that is able to provide a visual indication of a status of the overload relay. | 01-05-2012 |
20120044661 | CAPACITOR HOLDER - A holder for mounting multiple capacitors onto a circuit board includes a main structure and a plurality of latching member. The main structure has a top plate and a plurality of side plates. The top plate includes a plurality of holding slots, with the latching members off the side plates. Each latching member has an extension portion and an engaging member. The engaging member is located at the end of the extension under the bottom edge of the side plate. The capacitor includes a main body and a pair of electric leads at one end of the main body. At the opposite end of the electric leads, the main body is bounded on top by the top plate of the main structure, where the main body of each capacitor emerges partially above the upper surface of the top plate. | 02-23-2012 |
20120188742 | IMPLEMENTING SURFACE MOUNT COMPONENTS WITH SYMMETRIC REFERENCE BALANCE - A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure. | 07-26-2012 |
20120206897 | Green electricity saver model 3000 - A universal capacitive power factor corrector usable with single phase inductive loads encases one capacitor, of 10 microfarads, one 240 volt varistor, one 22 microhenry coil, and a 330 k ohm resistor within a housing having a power cord, on off switch, 4 amp fuse, and a indicator lamp. Overall design to correct poorly designed single phase inductive current loads for home or small business. | 08-16-2012 |
20130107492 | VERTICALLY MOUNTED CAPACITOR ASSEMBLY | 05-02-2013 |
20130271941 | CONVERTER POWER UNIT AND ITS BUS BARS - A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter. | 10-17-2013 |
20140198475 | ELECTRICAL BUSBAR, ELECTRICAL CONNECTOR ASSEMBLY AND POWER CONVERTER - An electrical connector assembly is provided with an electrical busbar for conducting power. The busbar has a width, a length, and a thickness. The busbar has a first portion with a first length, and a second portion with a second length. The second portion is oriented at a non-zero angle relative to the first portion. A connector is mounted to the busbar. One of the width and the thickness is reduced for receipt of a sensor about the busbar. A power converter assembly is provided with a direct current bus capacitor and a power module oriented in a housing. A plurality of the electrical connector assemblies are each connected to at least one of the direct current bus capacitor and the power module. | 07-17-2014 |
20140240946 | Electronic Device - Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet ( | 08-28-2014 |
20140369018 | POWER CONVERTERS HAVING CAPACITIVE ENERGY TRANSFER ELEMENTS AND ARRANGEMENTS OF ENERGY STORAGE ELEMENTS FOR POWER CONVERTERS - A power converter includes a PCB and a semiconductor die coupled to the PCB. The semiconductor die includes first through fourth switching devices. The power converter further includes a first energy storage element electrically connected to the first and second switching devices and a second energy storage element electrically connected to the third and fourth switching devices. The first energy storage element is mounted over the first and second switching devices and the second energy storage element is mounted over the third and fourth switching devices. | 12-18-2014 |