Class / Patent application number | Description | Number of patent applications / Date published |
361808000 | Mounting pad | 29 |
20080232077 | CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME - The present invention relates to a conversion substrate for a leadframe and the method for making the same. The conversion substrate comprises a core layer, a first copper layer, a first metal plating layer and a first brown/black oxide layer. The first copper layer is on a first surface of the core layer, and has a plurality of discontinuous sections. The first metal plating layer is on the first copper layer, and has a plurality of discontinuous sections. The first brown/black oxide layer is on the first copper layer, so as to protect the first copper layer. Thus, the polymeric solder mask is not used in the conversion substrate of the present invention, so that the metal plating layer will not be polluted, and the yield rate can be raised. | 09-25-2008 |
20080239690 | SELF-ADJUSTING CLAMP SYSTEM - A wedge lock clamping assembly, system and method wherein the module to be clamped in a slot in a chassis has a pair of wedge surfaces oppositely inclined to spaced-apart side surfaces of the slot. The clamping assembly comprises a pair of wedge elements on opposite sides of a movement axis and each wedge element is configured to be disposed within the slot between a respective wedge surface of the module and a respective side surface of the slot. An actuator operates to forcibly urge the wedge elements along the movement axis for causing the wedge elements to be wedged between the respective wedge surfaces of the module and respective side surfaces of the slot for clamping the module in the slot. A toggle is interposed between the wedge elements and the actuator for equalizing the force acting on each wedge element such that the wedge elements will move axially relative to one another to accommodate any difference in gap widths between the wedge surfaces of the module and side surfaces of the slots thereby to minimize any lateral shifting of the module relative to the slot while still securing clamping the module in the slot. | 10-02-2008 |
20080253103 | MANUFACTURING METHOD OF A TRAY, A SOCKET FOR INSPECTION, AND A SEMICONDUCTOR DEVICE - The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved. | 10-16-2008 |
20080298038 | WIRING BOARD AND ITS FABRICATING METHOD - A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad is smaller than an area of a surface plating layer thereof. | 12-04-2008 |
20080310138 | Electronic Enclosure Having Elastomeric Circuit Board Standoffs - Electronic enclosures, enclosed circuit board assemblies, and computers having elastomeric truncated standoffs are provided. More particularly, systems and devices may comprise a computer case in which a plurality of elastomeric standoffs are mounted so as to support one or more circuit boards. The case may be formed of a first enclosure and a second enclosure with the standoffs secured therebetween. The elastomeric truncated standoffs pass partially through apertures in the circuit board such that the circuit board is supported by the standoffs and so that the circuit board is mechanically isolated from the case. Advantages include efficiently providing mechanical isolation to the circuit board and the components mounted to it, providing design flexibility by reducing or eliminating the necessity of permanently tooled or fixed boss mounts, and allowing elastomeric standoffs to be constructed of different materials than their corresponding enclosure. | 12-18-2008 |
20080316728 | METAL CORE FOLDOVER PACKAGE STRUCTURES - Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip-scale packages and assemblies are also disclosed. | 12-25-2008 |
20090034224 | Support arrangement - The invention relates to a support arrangement for an inner module in an outer module, particularly for an inner vibrating frame in an outer frame of an outer housing, with a damping device between the inner and outer modules for absorbing forces acting in up to three coordinate directions relative to the inner and outer modules. The damping device is essentially constructed as an elastic polymer profile, particularly two polymer profiles, running round between the inner and outer modules and that the inner and outer modules are constructed with a bearing device for the elastic polymer profile or profiles. | 02-05-2009 |
20090122503 | BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE SYSTEM - A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface. | 05-14-2009 |
20090244873 | OPTICAL PACKAGE - A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed. | 10-01-2009 |
20090279275 | METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE - A method of attaching an integrated circuit chip to a module and a resultant structure. The method includes placing a solder bump tape between the chip and the module, the solder bump tape including an array of solder columns embedded in a dielectric sheet; aligning and contacting top surfaces of solder columns with respective chip pads of an array of chip pads of the chip and aligning and contacting bottom surfaces of the solder columns with respective module pads of an array of module pads; and reflowing the solder columns to form solder interconnections between chip pads and respective module pads. | 11-12-2009 |
20090279276 | ELECTRONIC COMPONENT - There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member. | 11-12-2009 |
20090316378 | Wafer level edge stacking - A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween. | 12-24-2009 |
20100134998 | Adapter, socket, electronic device, and mounting method - An adapter has a body having a plate-like shape, a holding portion which holds the semiconductor package on a first surface of the body to be electrically connected to terminals of the semiconductor package, and first terminals provided on a second surface of the body and electrically connected to the fitting portions. The adapter is designed mountable to a board via a socket by inserting the first terminals into the socket. | 06-03-2010 |
20100290206 | CRYSTAL OSCILLATOR FOR SURFACE MOUNTING - A crystal oscillator for surface mounting comprising: a case main body including concave portions on both principal surfaces; a crystal element hermetically encapsulated in one concave portion; an IC chip housed in the other concave portion; mounting terminals provided on four corner portions of an opening end face of the other concave portion; and a protrusion serving as identifying marks along a direction of sides of the case main body and provided in some of the mounting terminals. The mounting terminals, to which the protrusions are provided, are provided on both corner portions on one end side of the case main body. The protrusions extend in a same direction from the mounting terminals at an inner or outer circumference side of the opening end face. The mounting terminals including the protrusions are symmetric with respect to a center line between both corner portions on the one end side. | 11-18-2010 |
20100309643 | MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME - A multi-chip hybrid-mounted device is provided that is fabricated by an extremely simple fabrication process, thereby enabling excellent reliability and yield. During the mounting process, the submount is kept at a bias temperature slightly below the solder melting point. For each chip to be mounted, an auxiliary heater element located adjacent to the actual mounting/soldering position is temporarily energized. Using a bias temperature, a local temperature increase of only a few degrees Celsius in the mounting/soldering area will initiate the soldering process and affix the chip. Such a small temperature increase is readily achieved by the laterally displaced heater element with only a minimal amount of thermal stress. The fabrication process is fully scalable and enables mounting of an arbitrarily large number of chips using only a single solder material. | 12-09-2010 |
20110228505 | PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A package having a base substrate in which an area, in which a resonator element is mounted, and an area, in which a semiconductor device is mounted, are disposed so as to be aligned in a horizontal direction, includes on one face of the base substrate: a resonator element mounting pad that is used for mounting the resonator element; a first semiconductor device connecting pad that is electrically connected to the resonator element mounting pad; a second semiconductor device connecting pad that is electrically connected to a mounting terminal formed on the other face of the base substrate; and a cutting pattern that electrically connects the first semiconductor device connecting pad and the second semiconductor device connecting pad. | 09-22-2011 |
20120033397 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device and a method of manufacturing the same are disclosed. The display device includes a first panel, a panel supporter including a bottom part in which the first panel is received, a first pad that is positioned on the bottom part of the panel supporter and attaches the first panel to the panel supporter, a second panel positioned on the first panel, a cover including a surface part covering a partial outer wall of the second panel, and a second pad that is positioned under the surface part of the cover and attaches the second panel to the cover. | 02-09-2012 |
20120106116 | ELECTRONIC COMPONENT AND ELECTRONIC DEVICE - An electronic component to be mounted on a substrate, including an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land. | 05-03-2012 |
20120106117 | ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS - A 3D interconnect structure comprising an ultra-thin interposer having a plurality of ultra-high density of through-via interconnections defined therein. The 3D interposer electrically connects first and second electronic devices in vertical dimension and has the same or similar through-via density as the first or second electronic devices it connects. The various embodiments of the interconnect structure allows 3D ICs to be stacked with or without TSVs and increases bandwidth between the two electronic devices as compared to other interconnect structures of the prior art. Further, the interconnect structure of the present invention is scalable, testable, thermal manageable, and can be manufactured at relatively low costs. Such a 3D structure can be used for a wide variety of applications that require a variety of heterogeneous ICs, such as logic, memory, graphics, power, wireless and sensors that cannot be integrated into single ICs. | 05-03-2012 |
20120230001 | ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes an interposer, a first chip being mounted on a first surface of the interposer, the first chip having a first surface facing the first surface of the interposer and a second surface opposite to the first surface of the first chip, a second chip being mounted on a second surface of the interposer opposite to the first surface of the interposer, the second chip having a first surface facing the second surface of the interposer and a second surface opposite to the first surface of the second chip, a first metal plate being connected to the second surface of the first chip, a second metal surface being provided over the second surface of the second chip, and a via penetrating through the interposer and connected to the first metal plate and the second metal plate. | 09-13-2012 |
20120293976 | REMOVABLE ELECTRIC CONTROLLER FOR GARAGE DOOR OPENER - A removable electric controller for a garage door opener includes a base unit, a cover and a control box unit. A box lid of the control box unit is slidably connected to a connecting surface of the cover. A guide insertion end of a control circuit board of the control box unit is connected to a main connecting port module of a circuit terminal connecting plate on the base unit. The cover and the control box unit are detachable. A driving member, a light source member, an inductive circuit line and a power member of the base unit are connected to wiring port modules of the circuit terminal connecting plate, so that the wiring is in the way of modulization. The control circuit board of the control box unit can be replaced with ease, providing a convenient and simply assembly. | 11-22-2012 |
20130088844 | Base of Display Device - The invention relates to a base of a display device, comprising a base body, a first wing connected to one side of the base body and a second wing connected to the other side of the base body. The base body comprises a pillar which supports the display device. The first wing and the second wing are hinged on base body in a swivelable manner so that the first wing and the second wing can swivel relative to the base body. Alternatively, the first wind and the second wing are detachably connected to the base body so that the first wing and the second wing can form different aspects relative to the base body. As a result, the first wing and the second wing can be adjusted relative to the base body in terms of positions and aspects according to requirements. | 04-11-2013 |
20130094168 | WALL MOUNTING FOR ON-BOARD ENTERTAINMENT CONTROL UNITS - A standardized wall mounting is provided for mounting control units of system components in an aircraft cabin with a fastening unit and at least one plug unit. The fastening unit is designed for guiding the control unit during an installation movement of the control unit on the wall mounting. The plug unit is designed for producing a plug connection between the control unit and the wall mounting during the installation movement of the control unit on the wall mounting. | 04-18-2013 |
20130194770 | MEMS VIBRATION ISOLATION SYSTEM AND METHOD - A microelectromechanical vibration isolation system includes a microelectromechanical structure having a plurality of fin apertures etched therethrough, and a plurality of fins each disposed within a respective one of the plurality of fin apertures and spaced apart from the microelectromechanical structure so as to define a fluid gap therebetween. The fluid gap is configured to provide squeeze film damping of vibrations imparted upon the microelectromechanical structure in at least two dimensions. The system further includes a frame surrounding the microelectromechanical structure, and a plurality of springs each coupled to the microelectromechanical structure and to the frame. The plurality of springs is configured to support the micromechanical structure in relation to the frame. | 08-01-2013 |
20130215591 | METHOD AND APPARATUS FOR ATTACHMENT OF INTEGRATED CIRCUITS - Method and apparatus for bonding an electrical circuit component onto a substrate. A first electrically conductive bonding pad is formed on the component, and a second electrically conductive bonding pad is formed on the substrate. One of said first and second bonding pads is physically split into at least two parts, with electrical discontinuity between the two parts. An electrically conductive bond is formed between the first and second bonding pads such that electrical continuity is established from one part of the one bonding pad, through the other of the bonding pads, and through the second part of the one bonding pad. The integrity of the electrically conductive bond is evaluated by testing electrical continuity between the at least two parts. | 08-22-2013 |
20130294042 | METHODS AND APPARATUS FOR CONNECTING PLANAR POWER ELECTRONICS DEVICES - The present disclosure teaches a power module that includes a chip, a first substrate, and one or more electrically conductive inserts disposed between the chip and the first substrate. The inserts can be corrugated metal sheets, metal tubes, metal wires, or metal rods. One or more of those inserts form a layer in the planar direction of a first interstitial space between the chip and the first substrate. | 11-07-2013 |
20140254124 | Stud Bump Bonding in Implantable Medical Devices - Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps. | 09-11-2014 |
20150055315 | Electronic package structure and method for making the same - An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices. | 02-26-2015 |
20160073524 | ASSEMBLY STRUCTURE FOR USE IN STORAGE MEDIA OF SERVER - An assembly structure for use in a storage media of server includes: a base, formed with an accommodation space for accommodating a storage media; and a rotary cover plate, one end thereof is rotatably pivoted on the base, and the rotary cover plate includes a top plate, a push plate and a force plate. The push plate and the force plate are oppositely arranged at two sides of the top plate. The rotary cover plate is able to be engaged relative to the base thereby enabling the force plate to push the storage media for being electrically connected to the base, or to be opened relative to the base thereby enabling the push plate to push the storage media for being disconnected with the base. Accordingly, the storage media is enabled to be easily assembled or detached. | 03-10-2016 |