Class / Patent application number | Description | Number of patent applications / Date published |
361785000 | With separable connector or socket means | 60 |
20080298036 | PRINTED CIRCUIT BOARD AND FUEL CELL - An FPC board includes a base insulating layer made of polyimide, for example. A conductor layer made of copper, for example, is formed on one surface of the base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and extraction conductor portions extending in long-sized shapes from the collector portions. A coating layer is formed on the base insulating layer so as to coat the conductor layer. The coating layer is formed so as to coat the collector portions and the extraction conductor portions of the conductor layer. The coating layer is made of a resin composition containing carbon. | 12-04-2008 |
20080310134 | Method and apparatus for routing and distributing signals - A method and apparatus are disclosed for distributing multiple signals having audio and/or video components for processing by an audio and/or video processor, including a chassis having a midplane connection and number of slots for receiving plural circuit boards, where at least one of the circuit boards receives a combination of multiple audio and/or video signals via a common slot of the midplane. The midplane is configured to electrically connect to one or more of the plural circuit boards and distribute portions of the multiple signals to plural circuit boards. The midplane has electrical signal interconnects within it for electrically connecting a first one of the plural circuit boards, when inserted into a first one of the slots, to multiple other circuit boards, inserted in other slots. A video signal received from an external device via the first circuit board is supplied to at least one of the circuit boards for video signal processing. | 12-18-2008 |
20090027867 | High-speed signal transmission apparatus - A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors. | 01-29-2009 |
20090040740 | Wiring circuit board - Wiring circuit board for connecting an electronic control system or an electronic control module to a connection circuit board, on which service lines for the electronic control system or the electronic control module can be hooked up in terminals, wherein the wiring circuit board has a plug and socket connector, which can be plugged directly or via a connection cable into a mating connector of the connection circuit board, which is in electrically conducting connection with the terminals of the connection circuit board, and at least one socket, into which the electronic control system or the electronic control module can be plugged, and the plug and socket connector is joined in electrical conduction via the wiring circuit board to the at least one socket. | 02-12-2009 |
20090175015 | PRINTED BOARD UNIT AND FIXING PARTS THEREOF - A technique is provided for improvement in convenience and in cost reduction of a fixing part of a printed board unit. A printed board unit includes a plurality printed board including a first printed board and a second printed board; and at least one fixing part, interposed between the first printed board and the second printed board, fixing the first printed board and the second printed board such that the first printed board and the second printed board overlap and keep a predetermined space between the first printed board and the second printed board, and the fixing part variably determines the predetermined space. | 07-09-2009 |
20100039785 | CFP MECHANICAL PLATFORM - In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device. | 02-18-2010 |
20110080716 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a case, a main circuit board in the case, a connector on the main circuit board, an auxiliary circuit board includes one end portion connected to the connector and an extending portion extending outside the main circuit board, and a spring supporting mechanism between the case and the extending portion of the auxiliary circuit board. The spring supporting mechanism includes a spring portion configured to support the extending portion elastically deformable in a direction across a surface of the auxiliary circuit board, and is fixed to the extending portion to prevent the auxiliary circuit board from moving along the surface thereof. | 04-07-2011 |
20120057320 | PRINTED BOARD ARRANGEMENT - The invention relates to a printed circuit board arrangement ( | 03-08-2012 |
20120320551 | EXPANSION STRUCTURE - An expansion structure is used for electrically connecting an expansion card to a motherboard and includes a flexible printed circuit board (FPC) and a connection board. The FPC is electrically connected to the motherboard. One end of the FPC is electrically connected to the motherboard, another end of the FPC is electrically connected to the connection board. The connection board is electrically connected to the expansion card as the FPC permits deformation, and the expansion card is electrically connected to the motherboard through the connection board and the FPC. | 12-20-2012 |
20130050969 | STORAGE CARD - A storage card includes a circuit board, a USB interface arranged on the circuit board and connected to a storage device interface of a motherboard. A control chip arranged on the circuit board and connected to the USB interface, and a number of storage chips arranged on the circuit board and connected to the control chip and the USB interface. A first extending board is extended from a bottom edge of the circuit board, to be inserted into an expansion slot of the motherboard. | 02-28-2013 |
20130083505 | WIRING BOARD, CONNECTOR AND ELECTRONIC APPARATUS - Disclosed herein is a wiring board including: a differential-line pair including two lines for transmitting differential signals; and two connection pads each electrically connected to one of the two lines pertaining to one of the differential-line pairs, wherein a plurality of the differential-line pairs are laid out side by side; a plurality of the connection pads are provided to form a plurality of columns; and on each of the columns of the connection pads, any two the connection pads electrically connected to the lines pertaining to the same differential-line pair are provided at locations adjacent to each other on the same one of the columns. | 04-04-2013 |
20130088843 | MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE - A motherboard assembly includes a motherboard having an expansion slot and two storage device interfaces, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A first extending board is formed on a top side of the circuit board. An edge connector is arranged on the first extending board and connected to the second storage device interface and a universal serial bus (USB) control chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the first storage device interface. A bottom side of the second extending board is in alignment with a bottom side of the circuit board. A second edge connector is arranged on the bottom edges of the second extending board and the circuit board. | 04-11-2013 |
20130100627 | EXPANSION CARD AND MOTHERBOARD FOR SUPPORTING THE EXPANSION CARD - A motherboard assembly includes a motherboard and an expansion card. The motherboard includes an expansion slot, a storage device interface, a power connector, and a central processing unit (CPU). The expansion slot includes a protrusion, first signal pins connected to the CPU, first power pins connected to the power connector. The expansion card includes a circuit board. A storage unit, a display unit, a power circuit, and a serial advanced technology attachment (SATA) connector connected to the storage unit and the storage device interface of the motherboard are all arranged on the circuit board. A notch is defined in a bottom edge of the circuit board, to receive the protrusion. An edge connector is arranged on a bottom edge of the circuit board and includes second power pins connected to the power circuit, and second signal pins connected to the display unit. | 04-25-2013 |
20130114229 | Interconnect Board - A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals. | 05-09-2013 |
20130223035 | MOTHERBOARD - A motherboard is disclosed, which allows an expansion circuit board to be electrically connected to it. The motherboard includes a primary circuit board and an adapter component. The primary circuit board includes an expansion slot. The adapter component is connected to the expansion slot. The adapter component is used for being electrically connected to the expansion circuit board, such that the primary circuit board and the expansion circuit board can perform signal transmission via the adapter component. The expansion circuit board and the primary circuit board are not located on the same plane. | 08-29-2013 |
20130258629 | FIXING APPARATUS FOR EXPANSION CARD - A fixing apparatus is used to parallel mount an expansion card to a motherboard. The fixing apparatus includes a mounting bracket fixed to the motherboard, and a retaining member rotatably connected to the mounting bracket. The mounting bracket includes a supporting board supporting the expansion card. The retaining member includes an abutting arm and a locking portion. When the retaining member is rotated to a locking position, the abutting arm abuts against a top of the expansion card to sandwich the expansion card with the supporting board, and the locking portion engages with the mounting bracket to prevent a rotation of the retaining member. When the retaining member is rotated to a releasing position, the abutting arm will move away from the expansion card. | 10-03-2013 |
20130258630 | HARD DISK DRIVE CONNECTOR - A hard disk drive (HDD) connector includes a motherboard port, a HDD port, and a signal processing circuit. The motherboard port and the HDD port are connected to a motherboard and a HDD, respectively. The signal processing circuit includes a signal processing module. The signal processing module is connected between the motherboard port and the HDD port to enhance signal transmission integrity between the motherboard and the HDD. | 10-03-2013 |
20140063769 | Component Mounting Structures with Breakaway Support Tabs - Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations. | 03-06-2014 |
20140126170 | Backplane, Cabinet-Level Communication Device, and Method for Replacing Backplane - Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, related to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board. | 05-08-2014 |
20140160711 | PRINTED CIRCUIT BOARD FOR USE IN MORTISE LOCKS - A mortise lock includes: a first printed circuit board; a contact pad arranged on the first printed circuit board; a second printed circuit board; a printed circuit board connector arranged on the second printed circuit board, the printed circuit board connector being configured to connect the first printed circuit board to the second printed circuit board; and a plug contact arranged on the second printed circuit board. The plug contact is configured to be accessible from outside of the mortise lock. | 06-12-2014 |
20150049451 | Perpendicular and Orthogonal Interconnection System and Communications Device - An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Curved male connectors re arranged on each of the first boards and curved female connectors are arranged on each of the second boards. The curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence. | 02-19-2015 |
20150131256 | BLACKPLANE BOARD AND WIRING METHOD OF BACKPLANE BOARD - The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector and the second connector are arranged so that pin arrangement of the first connector may be shifted by at least one column in a longitudinal direction against pin arrangement of the second connector. | 05-14-2015 |
20150146399 | PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION - An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die. | 05-28-2015 |
20150351233 | Flexible Midplane And Architecture For A Multi-Processor Computer System - A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section. | 12-03-2015 |
361786000 | Having key connection | 2 |
20130050970 | MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE - A motherboard assembly includes a motherboard having an expansion slot and a storage device interface, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A control chip and a storage chip are arranged on the circuit board. Two voids are defined in a top side of the circuit board. A first extending board is formed on the top side of the circuit board between the voids. An edge connector is arranged on the first extending board and connected to a power supply. The edge connector includes power pins connected to the control chip and the storage chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the storage device interface of the motherboard. A bottom side of the second extending board is in alignment with a bottom side of the circuit board. | 02-28-2013 |
20130163217 | ELECTRONIC SYSTEM AND GUIDE PIN DEVICE THEREOF - An electronic system includes a first circuit board having a first connection interface, and a second circuit board having a second connection interface and a guide pin device. The guide pin device includes a convex connector and a concave connector. The convex connector includes a guide member and a connection portion. The connection portion connects the guide member to the first circuit board and has two first inclined surfaces formed on two opposite sides of the guide member. The concave connector is secured on the second circuit board and includes a guide sliding slot and two second inclined surfaces formed on two opposite sides of the guide sliding slot. When the guide member is aligned with and is inserted into the guide sliding slot, the two first inclined surfaces mat with the two second inclined surfaces, and the first connection interface is engaged with the second connection interface. | 06-27-2013 |
361787000 | Having spring member | 2 |
20090175016 | CLIP FOR ATTACHING PANELS - Clip for attaching two outer panels to an intermediate panel, the clip comprising two arm portions each arm portion being configured to apply pressure to one of the outer panels in order to force the panel against a surface of the intermediate panel, and a bridge portion connecting the two arm portions, the bridge portion comprising a central section configured to provide mechanical coupling to the intermediate panel. | 07-09-2009 |
20090244870 | APPARATUS AND METHOD FOR A CLIP DEVICE FOR COUPLING A HEAT SINK PLATE SYSTEM WITH A BURN-IN BOARD SYSTEM - In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, the each semiconductor chip has a heat sink has heat sink spring-loaded against the semiconductor chips. Posts coupled to one board engage posts located on the second board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate. | 10-01-2009 |
361788000 | Having backplane connection | 13 |
20080218987 | MONOLITHIC BACKPLANE HAVING A FIRST AND SECOND PORTION - A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane. A virtual carrier manager, where the virtual carrier manager provides a control management function for the Advanced Mezzanine Card module, where the virtual carrier manager provides a central switching function for the Advanced Mezzanine Card module, and where the virtual carrier manager provides a power control function for the Advanced Mezzanine Card module. | 09-11-2008 |
20080239687 | Server infrastructure having independent backplanes to distribute power and to route signals - Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis. | 10-02-2008 |
20080285248 | High-speed router with backplane using tuned-impedance thru-holes and vias - A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via. | 11-20-2008 |
20090067146 | Electronic Board Arrangement and Electronic Interconnect Board of an Electronic Board Arrangement - The invention relates to an electronic-board arrangement, comprising at least two electronic boards ( | 03-12-2009 |
20090073669 | DOUBLE-WIDTH ADVANCED MEZZANINE CARD, COMMUNICATION SYSTEM AND UNIT - The present invention discloses a double-width Advanced Mezzanine Card, comprising a functional circuit, a first Tongue, and a second Tongue; both the first and second Tongues have interfaces that are connected to the functional circuit. The present invention further discloses a communication system with an Advanced Mezzanine Card, wherein a backplane has a slot that can accommodate two single-width AMCs or one double-width AMC; a double-width AMC having a first Tongue and a second Tongue is plugged in the slot; both the first and second Tongues have backplane interfaces, and the backplane interfaces are connected to the corresponding backplane interfaces on the slot. The present invention further discloses a communication unit, including an AMC carrier board and a double-width AMC with a first Tongue and a second Tongue; both the first and second Tongues have carrier board interfaces, and the carrier board interfaces on both Tongues are respectively connected to the carrier board signals via two AMC Backplane Connectors on the carrier board. The present invention can extend the connection resources of the standard AMC and improve the resource usage efficiency. | 03-19-2009 |
20090201658 | INTERCONNECTION ASSEMBLY FOR PRINTED CIRCUIT BOARDS - A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane. The clearance contains air that serves as a dielectric to increase the impedance between adjacent signal holes, and thereby to reduce crosstalk and other problems associated with close proximity between signal holes. Additional through holes provide additional impedance at locations between adjacent conductor through holes. Such additional through holes for impedance control can be included in the circuit boards as well as the backplane. | 08-13-2009 |
20100188831 | AVIONIC EQUIPMENT ITEM - The invention relates to avionics equipment including a motherboard ( | 07-29-2010 |
20100271793 | PRINTED CIRCUIT BOARD WITH OPTIMIZED MOUNTING HOLES AND ALIGNMENT PINS - A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes. | 10-28-2010 |
20100271794 | HARDWARE MODULE AND BACKPLANE BOARD FOR AN IED - The present disclosure provides a flexible and space-saving arrangement of hardware modules in an Intelligent Electronic Device (IED). A module for an IED is configured to engage a slot or socket of a backplane of the IED in order to communicate, in a point-to-point mode over a serial backplane bus system that encompasses the slot or socket, with two neighboring modules in the IED. The module includes a source selector configured to select, in a receiving mode, between reception of signals transmitted via a nearest neighbor slot, or via a next-nearest neighbor slot. The source selector evaluates signals directed towards a rear side of a circuit board of the module, with the rear side being substantially devoid of electronic components. | 10-28-2010 |
20120106114 | BACKPLANE ELECTRONIC CIRCUIT BOARD OF AN ELECTRONIC APPARATUS, IN PARTICULAR FOR AN AIRCRAFT - A backplane electronic circuit board of an electronic apparatus ( | 05-03-2012 |
20140049931 | ACTIVE BACKPLANE DESIGNS - A backplane device may include an electrical bus, an optical fabric, and a plurality of card sockets. A particular one of the plurality of card sockets may include a first socket configured to receive a first electrical connector of a card and electrically connect the first electrical connector to the electrical bus; and a conversion device comprising a second socket configured to receive a second electrical connector of the card; and an optical transceiver configured to convert electrical signals received from the second electrical connector to optical signals and provide the optical signals to the optical fabric; and convert optical signals received from the optical fabric to electrical signals and provide the electrical signals to the second electrical connector. | 02-20-2014 |
20140126171 | BACKPLANE FOR ELECTRICALLY COUPLING MODULAR INFORMATION HANDLING RESOURCES TO ONE OR MORE OTHER INFORMATION HANDLING RESOURCES - In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots. | 05-08-2014 |
20140268620 | EXPANDABLE BACKPLANE - An expandable backplane is provided. The expandable backplane includes a baseboard management controller for connecting several disks, a first expansion board, a second expansion board, and a multiplexer. The multiplexer is connected between the baseboard management controller, the first expansion board, and the second expansion board. The multiplexer is used to control the second expansion board to be connected to the baseboard management controller via the first expansion board or control the second expansion board to be directly connected to the baseboard management controller according to a connection state of a Mini-SAS Cable connected between the first expansion board and the second expansion board. | 09-18-2014 |
361789000 | Having flexible connector | 1 |
20120106115 | PRINTED CIRCUIT BOARD HAVING STIFF AND FLEXIBLE CHARACTERISTICS - A printed circuit board comprising a hard portion of at least one main hard PCB, and at least one secondary hard PCB; and a flexible portion to connect the main hard PCB to the secondary hard PCB both physically and electrically and enabling the secondary hard PCB to move in relation to the main hard PCB. | 05-03-2012 |
361790000 | Stacked | 11 |
20090067147 | CIRCUIT BOARD CONNECTION STRUCTURE AND CIRCUIT BOARD CONNECTION METHOD - A circuit board connection structure and a circuit board connection method, which can extend an area for mounting electronic components and can simplify the manufacturing process, are provided. | 03-12-2009 |
20090168383 | ELECTRONIC APPARATUS AND SYSTEM - An electronic apparatus has a first circuit board and a second circuit board. The first circuit board has a first connector mounted thereto. The second circuit board has a second connector which is mounted to a first surface and is mechanically coupled to the first connector, and a third connector which is mounted to a second surface positioned on a backside of the first surface in an overlapping relation to the second connector with the second circuit board interposed between the second and third connectors, and which is mechanically coupled to a connector of an external device. | 07-02-2009 |
20090207577 | Modular Stackable Angled Patch Panel for Enclosure - A modular patch panel module is mountable on an electronics enclosure and includes an angled patch face and mounting structure that enables stacking of modular patch panels without interference of patch panel cords with the top of the enclosure or another patch panel stacked thereon. The patch panel modules may each contain a plurality of RJ-45 ports and punchdown blocks. A cover plate may snap fit to the module to retain the patch panel electrical components therebetween. | 08-20-2009 |
20100149777 | ELECTRONIC CIRCUIT CONNECTION STRUCTURE AND ITS MANUFACTURING METHOD - First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit. | 06-17-2010 |
20100195303 | ELECTRONIC APPARATUS - An electronic apparatus includes an outer cover member, an internal structure member, first and second external connection connectors, and first and second printed circuit boards. The first printed circuit board has a first surface on which the first external connector is mounted thereon, a signal pattern of the first external connector is formed on the first surface, and a second surface. The second printed circuit board has a first surface on which the second external connector is mounted thereon, a signal pattern of the second external connector is formed on the first surface, and a second surface. Ground patterns are formed on the second surfaces of the printed circuit boards. The first and second external connectors overlap and are arranged in a space surrounded by the outer cover member and the internal structure member so that the second surfaces of the first and second printed circuit boards face each other. | 08-05-2010 |
20130107488 | WIRING STRUCTURE OF HEAD SUSPENSION HAVING A STACKED INTERLEAVED PART AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
20150146400 | TWO-PIECE UNMATE-ASSIST STANDOFF - A connector system includes a first substrate, a second substrate, and a standoff arranged between the first substrate and the second substrate. The standoff includes a first part with an external threading and a second part with an internal threading configured to engage with the external threading of the first part. The first part is configured to engage with the first substrate, the second part is configured to engage with the second substrate, and the external threading of the first part and the internal threading of the second part are configured such that the first part and the second part are configured to be unscrewed from each other to cause the distance between the first and second substrates to increase. | 05-28-2015 |
20160073501 | IMPLEMENTING SIMULTANEOUSLY CONNECTING OF MULTIPLE DEVICES IN A MULTI-TIERED, MULTI-DIRECTIONAL, ENHANCED TOLERANCE SYSTEM WITH MECHANICAL SUPPORT STRUCTURES - A method and apparatus are provided for implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures. A main system planar assembly and an elevated planar assembly share a direct connection provided by a plurality of connectors with no cables. A mechanical support bracket is attached to a top surface of the main system planar assembly positioning and supporting the elevated planar assembly spaced appropriately for accurately connecting respective connectors with respective chassis connectors. The elevated planar assembly includes a stiffening component to facilitate proper spacing between upper and lower levels of respective connectors and tool-less insertion and extraction of the elevated planar assembly. | 03-10-2016 |
20160128192 | SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING - Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets. | 05-05-2016 |
20160128193 | SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING - Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets. | 05-05-2016 |
20160165720 | MULTILAYER SUBSTRATE MANUFACTURING METHOD AND MULTILAYER SUBSTRATE - In a method for manufacturing a multilayer substrate, conductive patterns to define mounting electrodes are formed on a principal surface of a first base layer, and conductive patterns are formed on principal surfaces of other base layers. The base layers are stacked such that the principal surface of the first base layer is the outermost surface. The stacked base layers are laminated by pressing an elastic body to the side of the first base layer to form a multilayer body. In the multilayer body, the conductive patterns are arranged such that the proportion of the conductive patterns in regions overlapping the conductive patterns on the first base layer as viewed in the stacking direction is lower than that in a region surrounding the regions overlapping the conductive patterns. | 06-09-2016 |
361791000 | Multiple contact pins | 7 |
20090244871 | Structured light-emitting module for lighting apparatus - A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal blocks and the buckles. The light-emitting module is adaptive to be used in a billboard, a traffic sign, a three-dimensional lighting apparatus or a lighting display screen. | 10-01-2009 |
20120195017 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate. | 08-02-2012 |
20120275129 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus fixing an expansion card includes an expansion slot, two locking members connected to opposite ends of the expansion slot, for clamping the expansion card, and two latching members pivotably mounted to opposite ends of the expansion card, respectively. A latching portion protrudes from each of the latching members, for latching the corresponding locking member. | 11-01-2012 |
20130094167 | SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE - A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A space is defined between the first and the second extending boards. A first edge connector is arranged on the first extending board and connected to the control chip. A second edge connector is arranged on bottom edges of the second extending board and the circuit board. A third edge connector is arranged on a top edge of the circuit board opposite to the bottom edge of the circuit board. | 04-18-2013 |
20130155637 | SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE ASSEMBLY - A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit. | 06-20-2013 |
20130258631 | Printed Circuit Assembly - A Printed Circuit Assembly has a multiplicity of connectors with each connector containing insulating matrices with each matrix containing a multiplicity of conducting or non-conducting standoffs with each standoff contacting one or more printed circuit boards. The standoffs permit controlled-impedance electrical connections, thermal management and mechanical rigidity of the overall assembly making the assembly suitable for use in any environment including the most harsh extremes. | 10-03-2013 |
20140098508 | DIRECT CONNECT ORTHOGONAL CONNECTION SYSTEMS - A direct-connect orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The signal conductors may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly connected connectors. | 04-10-2014 |