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Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361748000 - Printed circuit board

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361803000 Interconnection details 104
361796000 With housing or chassis 49
361785000 With separable connector or socket means 39
361792000 Plural contiguous boards 19
361804000 Spacer details 4
20100128452STUD, CIRCUIT BOARD DEVICE USING THE STUD, AND METHOD OF MOUNTING THE CIRCUIT BOARD DEVICE - A stud is a structure for supporting, on a printed circuit board, a mounting component such as another printed circuit board or a device. This structure is surface-mounted on the printed circuit board by soldering or press-fitting. The structure is a constituted by a columnar-shaped structure and the like. One end of the columnar-shaped structure is surface-mounted on the printed circuit board, and the other end thereof is fixed to the mounting component.05-27-2010
20090154132PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.06-18-2009
20120069539PRINTED BOARD FIXING APPARATUS - To provide a printed board fixing device capable of reducing the thickness and size with a simple structure. The printed board fixing device includes a coupling member which two-folds a flex rigid printed board that includes one and the other rigid printed boards via a flexible part and mutually couples and fixes the one and the other boards. The length of the coupling member is set to be within a range of entire thickness including the one and the other rigid printed boards. The coupling member is provided at two points on the one and the other rigid printed boards.03-22-2012
20100195304PRINTED CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS - A printed circuit board unit includes a printed wiring board. A socket supports one end of a module substrate. A fixation member is spaced from the socket at a predetermined distance. A movable member is connected to the fixation member for relative horizontal movement in parallel with the surface of the printed wiring board. The movable member receives the other end of the module substrate. A first restriction member is connected to the movable member. The first restriction member is configured to restrict horizontal movement of the module substrate in parallel with the surface of the printed wiring board. A second restriction member connected to the movable member. The second restriction member is configured to restrict perpendicular movement of the module substrate in the direction perpendicular to the surface of the printed wiring board.08-05-2010
Entries
DocumentTitleDate
20110194266ELECTRONIC DEVICE - An electronic device includes a main frame structure, a plurality of functional modules fixed to the main frame structure, a plurality of cables connecting the functional modules, a cable collector board fixed to the main frame structure, and a motherboard detachably connected to the main frame structure. The cable collector board includes a plurality of first printed circuits electrically collecting the cables, and a first connector electrically collecting the first printed circuits. The motherboard includes a plurality of second printed circuits and a second connector collecting the second printed circuits. The second connector is detachably electrically connected to the first connector.08-11-2011
20130077276COMPACT ISOLATED SWITCHING POWER CONVERTERS - An isolated switching power converter includes a power isolation transformer having at least one primary winding, at least one secondary winding and a plurality of sides, a first power board mechanically coupled to a first side of the transformer, and a second power board mechanically coupled to a second side of the transformer. The first power board includes a primary side circuit electrically coupled to the at least one primary winding, and the second power board includes a secondary side circuit electrically coupled to the at least one secondary winding.03-28-2013
20130033841PROTECTIVE COVER FOR PRESSURE SENSOR ASSEMBLIES - The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.02-07-2013
20130094165HIGH-CAPACITY MODULE INCLUDING THE PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD AND THE CIRCUIT BOARD CONCERNED FOR PERIPHERAL CIRCUITS OF A HIGH-CAPACITY MODULE04-18-2013
20100124038MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR - A method of fabricating a multi-piece board includes: adhering a first frame element connected to multiple piece portions to a second frame element, the first frame element forming a board main portion of a multi-piece board, the first frame element and the second frame element forming a frame portion of the multi-piece portion, thereby yielding the multi-piece board; mounting multiple electronic components on the piece portions, respectively; separating the piece portions from the frame portion; separating, from the first frame element, the second frame element adhered thereto; and adhering the second frame element to a first frame element of another board main portion.05-20-2010
20090237905Motor Drive Apparatus - A motor drive apparatus includes an assembly of first and second subassemblies. The first subassembly includes a first board and at least one connecting member, such as a bus bar, formed in the first board, and arranged to form a current supply path from a power source to the motor. The second subassembly includes a second board and at least one switching device mounted on the second board. The first and second subassemblies are stacked with an interspace between the first and second boards. A terminal segment of the switching device is connected with a terminal segment of the connecting member.09-24-2009
20090009979Substrate Joining Member and Three-Dimensional Structure Using the Same - Three-dimensional structure (01-08-2009
20090310323Printed circuit board including electronic component embedded therein and method of manufacturing the same - The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed12-17-2009
20090147492Data processing system - The invention relates to a data processing system with a main board, in which main board has at least one multipoint connector, in which at least one riser card is accommodated, and a first daughter card is accommodated in first riser card in such a manner that first daughter card is arranged parallel to main board. The data processing system further comprises a second multipoint connector, wherein a second riser card is accommodated in second multipoint connector, and a second daughter card is accommodated in second riser card in such a manner that second daughter card is arranged parallel to main board. The First multipoint connector and the second multipoint connectors are arranged on opposite outer sides of the main board. Each daughter card comprises a respective I/O interface which each cooperates with a common rear panel and is pointed towards the common rear panel. Relative to second daughter card, first daughter card is arranged rotated by 180° about an axis running parallel to main board.06-11-2009
20090147491RECEIVING APPARATUS AND BOARD INSTALLATION MEMBER - A receiving apparatus according to the present invention comprises: a first board including a mount surface whose outer edge is substantially quadrilateral; and a board installation member including a plate portion that has an installation surface whose outer edge is substantially quadrilateral, the first board is installed on the installation surface (called a front surface) side and the surface (called a rear surface) of the rear side of the installation surface is installed on a given second board, the apparatus applies a predetermined processing to a received broadcast signal using a circuit disposed on the first board, and the board installation member includes a connecting terminal to electrically connect the first board with the second board and a leg portion used for the installation on the second board, the connecting terminal protrudes from the plate portion in the direction substantially perpendicular to the plate portion on the front surface side and on the rear surface side, and comes into contact with the first board on the front surface side and comes into contact with the second board on the rear surface side, and the leg portion protrudes from the plate portion in the direction substantially perpendicular to the plate portion on the rear surface side.06-11-2009
20100053924ANISOTROPIC CONDUCTIVE MATERIAL - [Problem] A conventional anisotropic conductive material using low melting point particles exhibits a low degree of conductivity between the upper and lower conductors and the insulation resistance between adjoining conductors is also low.03-04-2010
20120106113TAMPER SECURE CIRCUITRY ESPECIALLY FOR POINT OF SALE TERMINAL - Tamper secure circuitry including a first printed circuit board having mounted thereon circuit components and a slotted anti-tamper grid containing printed circuit board mounted onto the first printed circuit board defining at least one slot and arranged to overlie at least some of the circuit components, which are located in a volume defined by the at least one slot and the first printed circuit board.05-03-2012
20090284944SPLIT THIN FILM CAPACITOR FOR MULTIPLE VOLTAGES - An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted. The microprocessor may use a lower voltage power supply level for minimum sized fast transistors in the fast core logic portions of the microprocessor, and a more normal voltage power supply voltage level for the cache memory and I/O transistor portions of the microprocessor. Thus a compact capacitor with multiple power and reference supply levels may be needed to provide the required power for a high frequency IC.11-19-2009
20100277883DOWNWARD-FACING OPTICAL COMPONENT MODULE - A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.11-04-2010
20080278922Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations - A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.11-13-2008
20120293974ELECTRONIC DEVICE MODULE - An electronic device module includes a first substrate having a first wiring layer and a first alignment mark, the first alignment mark being transparent in a visible region of the electromagnetic spectrum, and a second substrate facing a part of the first substrate and having a second wiring layer and a second alignment mark facing the first alignment mark.11-22-2012
20110007490RESIN COMPOSITION AND CURED FILM THEREOF - The present invention relates to a resin composition comprising resin (A), a filler (B) and a solvent (C), wherein the solvent (C) contains at least one organic solvent selected from a group consisting of propylene carbonate, dimethylsulfoxide and sulfolane; a cured film obtained by curing the resin composition; and use of the cured film as an overcoat for electronic circuit boards or the like. The resin composition of the present invention has a high filtration rate when it is prepared and has excellent productivity. A cured film obtained by curing the resin composition has excellent long-term electric reliability and is useful in the fields of solder resists, electrical insulating materials such as interlayer dielectric films, encapsulating materials for ICs and ultra LSIs, laminates and the like.01-13-2011
20090257212SEMICONDUCTOR DEVICE - A semiconductor device includes first and second assembled bodies (10-15-2009
20100014265FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE - A flex-rigid wiring board including a flexible printed wiring board, a rigid printed wiring board, a first connection terminal formed over the rigid printed wiring board and positioned to be mounted onto a motherboard, and a second connection terminal formed over the rigid printed wiring board and positioned to mount an electronic component. The flexible printed wiring board has a first conductive layer, the rigid printed wiring board has a rigid base material, an insulation layer over the rigid base material and a second conductive layer formed over the insulation layer. The insulation layer covers at least a portion of the flexible printed wiring board and at least a portion of the rigid base material while exposing at least a portion of the flexible printed wiring board, and the first conductive layer and the second conductive layer are connected through a plated metallic layer penetrating through the insulation layer.01-21-2010
20110128713SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of wiring substrates each mounting an electronic component are stacked and sealed by a resin, the semiconductor device can be downsized, thinned, and highly reliable, and its manufacturing cost can be reduced. By using a metal paste for electrical connection between the stacked lower-layer side wiring substrate and upper-layer side wiring substrate, a connecting pitch can be smaller than that in a connecting method of using a solder ball including Cu core, and the connection at low temperature can be achieved. Also, by coating a metal paste by a print-coating method or a dispense-coating method, manufacturing steps are simplified, so that the manufacturing cost is reduced.06-02-2011
20100259912Electronic device - Provided is an electronic device which may include a first structure having a first surface, a first land region on the first surface, a second structure having a second surface facing the first surface, a second land region on the second surface, and a connection structure between the first and second structures electrically connecting the first land region to the second land region. As provided, the first land region may have a major axis and a minor axis on the first surface and the second land region may have a major axis and a minor axis on the second surface. Furthermore, the major axes of the first and second land regions may have different orientations with respect to one another.10-14-2010
20130148321EXPANSION SLOT AND MOTHERBOARD HAVING THE EXPANSION SLOT - An expansion slot used to fix an expansion card includes a main body and two latching members. The main body includes a fixing portion defining a connecting slot for receiving a bottom side of the expansion card, and two clamping portions extending from opposite ends of the fixing portion. The latching members are mounted to the corresponding clamping portions for fixing opposite ends of the expansion card. A groove is defined in a top of one of the latching members.06-13-2013
20110026233Apparatus and method for manufacturing elastic cable and electronic device using the same - Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.02-03-2011
20110019382ELECTRONIC APPARATUS - an electronic apparatus includes a flexible printed circuit having a first surface on which a switch is mounted, a reinforcement plate having a first surface arranged to face a second surface of the flexible printed circuit opposite to the first surface of the flexible printed circuit on which the switch is mounted, and a spacer arranged to face a second surface of the reinforcement plate opposite to the first surface of the reinforcement plate that faces the second surface of the flexible printed circuit.01-27-2011
20110242783CHIP CARD HOLDER AND ELECTRONIC DEVICE USING THE SAME - A chip card holder is secured to a circuit board. The chip card holder comprises a hollow frame including an opening, a first board, a second board opposite to the first board, two opposite sidewalls and an end board opposite to the opening. The frame has two securing blocks protruding from the first board toward the second board and two latching blocks protruding from the end board; the securing blocks and the latching blocks are for latching the chip card holder to the circuit board.10-06-2011
20110085312COMPUTER HOST AND MOTHERBOARD USED IN THE COMPUTER HOST - A motherboard includes a square circuit board having an indention at a corner thereof. A memory module is disposed on the circuit board near the indention. A first I/O module is disposed on an edge of the circuit board near the indention. A chip module is disposed at an area of the circuit board away from the indention. The motherboard is fixed at a half portion of a chassis of a computer host. A heat dissipation unit is accommodated in the indention of the circuit board. The other half portion of the chassis accommodates a hard disk drive.04-14-2011
20090034219Electronic Assemblies Without Solder Having Overlapping Components - An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 02-05-2009
20110149542ELECTRONIC APPARATUS - An electronic apparatus includes a card board on which a card slot at least a part of which is formed of metal and into which a recording medium can be inserted is mounted, and a memory board on which memories are mounted. The card board is disposed facing to a surface of the memory board on which the memories are mounted, and the card slot and at least a part of the memories are disposed so as to be overlapped when viewing from a direction orthogonal to the board surface of the card board.06-23-2011
20120033395PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME - A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.02-09-2012
20110080715PROTECTIVE STRUCTURE OF ELECTRONIC COMPONENT - The present invention discloses a protective structure of an electronic component comprises a first circuit board, a second circuit board, and a chip module. The first circuit board is provided thereon with a hollow accommodating space and a plurality of first electrode contacts. The second circuit board is provided thereon with a plurality of second electrode contacts. The chip module is disposed in an area enclosed by the second electrode contacts. The hollow accommodating space is topped with the second circuit board such that the chip module is encapsulated between the second circuit board and the hollow accommodating space. Upon detection of separation of the first and second circuit boards under an external force or detection of a short circuit caused to an electrical circuit inside the first circuit board or the second circuit board, the chip module activates a security protection mechanism for deleting information stored thereon so as to prevent the information from being abused.04-07-2011
20100214755BACKPLANE FOR AN ELECTRONIC MOUNTING RACK - A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.08-26-2010
20110261545POWER DISTRIBUTION APPARATUS - A power distribution apparatus includes an outlet board, a fuse board, and at least one connector. The outlet board is connected to the fuse board through the at least one connector.10-27-2011
20100195302Flexible guiding module - A flexible guiding module for electronic connector backplane enclosures having one or more molded plastic prongs or protrusions from a base body that is attached to the back plane by a threaded screw and secured to the base body by a threaded insert or directly by a threaded hole in the base body. The plastic prongs or protrusions are molded of high impact plastic having a spring back memory giving flexible guidance at the top or tip of the prongs or protrusions and gradually having additionally more accurate alignment at the base body when mated with the plug in card. This flexible polyether imide plastic guiding module is also resilient to damage caused by bent metal pins that can damage the plug in card or daughter card.08-05-2010
20120014080ELECTRONIC DEVICE HAVING CIRCUIT BOARD WITH CO-LAYOUT DESIGN OF MULTIPLE CONNECTOR PLACEMENT SITES AND RELATED CIRCUIT BOARD THEREOF - An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.01-19-2012
20090135571CIRCUIT MODULE AND CIRCUIT BOARD ASSEMBLY HAVING SURFACE-MOUNT CONNECTOR - The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.05-28-2009
20100246153FLIP-CHIP FET CELL - A method and system for a FET cell is presented. The FET cell includes multiple individual transistors and interconnect bumps that are configured to flip-chip connect to a substrate. The substrate may have the majority of a matching structure for the FET cell. Furthermore, the FET cell may include a stability circuit in communication with the terminals of the individual transistors and further in communication with the interconnect bumps. Additionally, different materials can be used in combination in the FET cell and the separate substrate having the majority of the matching structure. Various materials may be more efficiency used in a FET cell, while other materials are suitable for the separate substrate.09-30-2010
20120127685STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME - A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.05-24-2012
20110199747STORAGE DEVICE AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first board, a second board facing the first board, a cover facing the second board from a side opposite to the first board, a first fixing portion attached to the first board and the cover, and a second fixing portion attached to the first board and the second board.08-18-2011
20120075823DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A display panel and a method of manufacturing the same are provided. The display panel includes a plurality of chip panels, each chip panel having an upper surface, a lower surface disposed parallel to the upper surface, a side surface between the upper surface and the lower surface and a connection portion between the side surface and at least one of the upper surface and the lower surface, the connection portion having a rounded configuration, and an adhesive layer interposed between the chip panels in order to vertically stack the chip panels to connect the chip panels. Therefore, in the display panel, the strength of the edge portion can be improved. Also, by forming a connection portion, a stress can be suppressed from being concentrated at the edge portion by an external mechanical stress.03-29-2012
20100008056STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN - A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.01-14-2010
20120257365DEVICE FOR SECURING AT LEAST ONE CIRCUIT BOARD TO A RECEIVING ELEMENT - The invention relates to a device for securing at least one circuit board (10-11-2012
20120262896MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for mounting an expansion card includes a bracket, and a mounting member mounted to the bracket. The mounting member includes a base mounted to the bracket, and a clamping member extending from a first side of a top of the base to clamp a rear end of the expansion card.10-18-2012
20130170168SIGNAL CONVERSION DEVICE WITH DUAL CHIP - The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.07-04-2013
20080298035Printed circuit board unit - A second printed wiring board is opposed to a surface of the first printed wiring board. A support member supports the first and second printed wiring boards. A first connector is mounted on the first printed wiring board. A second connector is mounted on the second printed wiring board. A wiring connects the first printed wiring board to the second printed wiring board. The first and second connectors are separately mounted on the first and second printed wiring boards, respectively. The sizes of the first and second printed wiring boards can be reduced as compared with the case where connectors are arranged in a row on a single printed wiring board, for example. This results in a reduction in the size of the printed circuit board unit. A large number of the printed circuit board units can be coupled to the back panel.12-04-2008
20100220455BONDING STRUCTURE OF CIRCUIT SUBSTRATE FOR INSTANT CIRCUIT INSPECTING - The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.09-02-2010
20120287590MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for fixing an expansion card includes a motherboard, an expansion slot installed on the motherboard, an expansion card inserted into the expansion slot, and two latching members respectively fixed to two ends of the expansion card. Each latching member includes a base plate fixed to the end of the expansion card, and a resilient hook extending from the base plate to latch an end of the expansion slot.11-15-2012
20090323300Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board - The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C).12-31-2009
20120243195PRINTED CIRCUIT BOARD ASSEMBLY FOR A MOBILE TERMINAL AND METHOD FOR FABRICATING THE SAME - A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.09-27-2012
20130094164CABLE HOLDER AND ELECTRONIC SYSTEM - A cable holder includes: a pair of arm portions to form a holding space for holding a cable; and a guide portion, provided at an end portion of each of the pair of guide portions to block the holding space, to guide the cable into the holding space while elastically deforming the pair of arm portions in directions in which the pair of arm portions move away from each other when contacting with the cable.04-18-2013
20130094166DISPLAY APPARATUS - A plurality of display panels (04-18-2013
20090103275Assembly Structure of Flexible Board and Rigid Board - An assembly structure of flexible board and rigid board includes a rigid board, a sub-board and a flexible board. The rigid board defines a locking gap having two side surfaces projecting toward each other to form two resisting portions. The sub-board has a standing portion inserted in the locking gap. Bilateral sides of the standing portion extend outward to form two preventing arms against a bottom surface of the rigid board. The flexible board has a base portion inserted in the locking gap of the rigid board. The base portion has a front surface and a back surface located to a front surface of the sub-board. The front surface of the base portion is against the resisting portions.04-23-2009
20110235299Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components - A method of aligning electronic components comprising providing a positioning member 09-29-2011
20100309642SIGNAL CONVERSION DEVICE WITH DUAL CHIP - The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.12-09-2010
20100315797Display Device - According to one embodiment, a display device includes an assembly of a frame and a sub frame provided on a rear side of a display panel, and respective circuit boards provided inside the frame and the sub frame.12-16-2010
20130188326Security Protection Device and Method - A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further includes a security frame between the base circuit board and the cover circuit board, at least one electrically conductive wire being wound and included within the security frame to form at least one winding protection layer around sides of the security frame. The cover circuit board, the security frame, and the base circuit board form an enclosure enclosing a security zone, and the at least one inner wiring layer within the cover circuit board, the at least one inner wiring layer within the base circuit board, and the at least one electrically conductive wire within the security frame are connectable to a security mechanism configured to detect an intrusion into the security zone.07-25-2013
20130201646CARD ADAPTOR APPARATUS - Card adaptor apparatus are disclosed herein. An example card adaptor apparatus includes a first frame having an outer perimeter configured to define a first card and an opening configured to receive a second card having a dimensional profile that is smaller than a dimensional profile of the first card. A first adhesive substantially spans across the entire opening of the first adaptor to retain the second card in the opening of the first frame.08-08-2013
20130201647FLEXIBLE SILICONE CABLE JUNCTION SYSTEM AND METHOD - The embodiments disclose a method for creating a silicone encased flexible cable using manufacturing machinery including automatically arranging plural individual conduits, into custom grouped arrangements including electrical wiring, pneumatic tubing and fluid tubing, inserting the custom grouped arrangements including connectors and flexible silicone junction devices into a shaped silicone encasement extrusion apparatus, depositing a mixture of silicone and additives to the custom grouped arrangements encasement using the extrusion apparatus, customizing the mixture of silicone and additives to create differing characteristics of the custom grouped arrangements, using the extrusion apparatus to create a singular encasement and to cure the singular encasement to a desired shape of the custom grouped arrangements and integrating one or more encased flexible junction box to the custom grouped arrangements, wherein the one or more flexible junction box contains at least one incoming and two outgoing conduit connections and one or more functional devices.08-08-2013
20120069538PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD OF MANUFACTURING THE SAME - A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.03-22-2012

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