Class / Patent application number | Description | Number of patent applications / Date published |
361773000 | Shaped lead on components | 24 |
20100014263 | LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONIC PART APPARATUS UTILIZING THE SAME - The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 μm, and (D) an inorganic filler having an average particle diameter of less than 2 μm. | 01-21-2010 |
20100214752 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a substrate, a conductive pattern formed over the substrate, and an electronic component mounted to the substrate and having an electrode. The electrode of the electronic component is connected to the conductive pattern through a via hole. The thickness of the electrode of the electronic component is made less than the thickness of the conductive pattern. | 08-26-2010 |
20120113610 | CIRCUIT BOARD - A circuit board includes a first circuit area, a first processing unit and a conductive pattern. The first circuit area includes a plurality of first electrically contacts. The first processing unit, which includes a ball grid array (BGA) substrate, is disposed on the first circuit area and is electrically connected to the first electrically contacts. The BGA substrate has a plurality of solder balls and a bypass circuit. The conductive pattern is electrically connected to the first electrically contacts. | 05-10-2012 |
20120182705 | SYSTEMS FOR SURFACE MOUNTING AN INTEGRATED CIRCUIT USING A Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENT - A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. A portion of the body is composed of an insulator. The Z-directed component has at least one conductive channel therethrough. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit is positioned directly above the Z-directed component and is electrically connected to the at least one conductive channel of the Z-directed component. | 07-19-2012 |
20130120948 | CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME - The present invention provides a circuit component that enables satisfactory connection between a substrate and an IC chip and a method of making the same. The circuit component includes an IC chip and a substrate connected to each other using an electrically conductive adhesive containing electrically conductive particles. Bump electrodes and a non-electrode surface are provided on a mounting surface of the IC chip. The non-electrode surface is a portion of the mounting surface other than a portion where the bump electrodes are formed. Electrically conductive particles are placed in a first state between the surfaces of the substrate and the non-electrode surface so as to be in contact with both surfaces. Electrically conductive particles are placed in a second state between the surfaces of both the substrate and the bump electrodes, so as to be more flattened than the first state and dig into the bump electrodes. | 05-16-2013 |
20130128486 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 05-23-2013 |
20130235542 | 3-D INTEGRATED PACKAGE - In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes. | 09-12-2013 |
20130250534 | SHIELD WITH RESILIENT SPRING SNAPS FOR REMOVABLE ATTACHMENT TO AN ELECTRICAL CIRCUIT BOARD WITHOUT THE USE OF ADHESIVE OR SOLDER - A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall. | 09-26-2013 |
20130258624 | BALL GRID ARRAY SYSTEMS FOR SURFACE MOUNTING AN INTEGRATED CIRCUIT USING A Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENT - A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit has a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component. | 10-03-2013 |
20130271937 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a substrate, a first electronic component, and a reinforcing member. The substrate includes first electrodes. The first electronic component includes a base, second electrodes, and solders configured to connect the first electrodes to the second electrodes. The reinforcing member includes a supporting member between the substrate and the base and a reinforcing material fixed to the supporting member, the reinforcing member fixed to the substrate and the base, and the reinforcing material formed of a thermosetting resin configured to remove an oxide film and fastened to the solders and the substrate. | 10-17-2013 |
20130335939 | SHAPED AND ORIENTED SOLDER JOINTS - The present description relates to the field of fabricating microelectronic assemblies, wherein a microelectronic device may be attached to a microelectronic substrate with a plurality of shaped and oriented solder joints. The shaped and oriented solder joints may be substantially oval, wherein the major axis of the substantially oval solder joints may be substantially oriented toward a neutral point or center of the microelectronic device. Embodiments of the shaped and oriented solder joint may reduce the potential of solder joint failure due to stresses, such as from thermal expansion stresses between the microelectronic device and the microelectronic substrate. | 12-19-2013 |
20140029226 | DISPLAY DEVICE - An integrated circuit chip includes first and second electrode terminals electrically connected to an internal circuit, and a dummy bump arranged between the first and second electrode terminals on a back surface thereof. A wiring pattern includes first lines electrically connected to the first electrode terminals below the back surface of the integrated circuit chip and extend in the direction toward a display region outside the integrated circuit chip, and second lines electrically connected to the second electrode terminals below the back surface of the integrated circuit chip and extend in the direction opposite to the display region outside the integrated circuit chip. The dummy bump is configured to avoid at least one of the electrical connection between the dummy bump and all of the first lines and all of the second lines and the electrical connection between the dummy bump and the internal circuit. | 01-30-2014 |
20140085850 | Printed circuit board with compact groups of devices - Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted. | 03-27-2014 |
20140140027 | INTERCONNECT ARRANGEMENT FOR HEXAGONAL ATTACHMENT CONFIGURATIONS - The present description relates to the field of fabricating microelectronic devices, wherein a microelectronic device may have a hexagonal confirmation for signal nodes and ground nodes which utilizes the cross-talk reduction by cancellation property of geometrically symmetry and orthogonality to reduce signal node to ground node ratio for increasing signaling density. | 05-22-2014 |
20140160709 | TUNER MODULE, CIRCUIT BOARD, AND METHOD FOR ASSEMBLING CIRCUIT BOARD - Provided is a tuner module including a tuner module main body involving a tuner board, a first leg projected from the tuner module main body and to be inserted into a first hole formed on a circuit board main body, a second leg projected from the tuner module main body and to be inserted into a second hole formed on the circuit board main body, the second leg being shorter than the first leg, and a signal terminal projected from the tuner board and to be inserted into a third hole formed on the circuit board main body, the signal terminal being shorter than the second leg. A taper is formed on at least tip end parts of the first leg and the second leg. | 06-12-2014 |
20140168922 | SEMICONDUCTOR DEVICE - A semiconductor device has a control terminal attached to a patterned insulating substrate; a first projection formed on the control terminal; a second projection formed on the control terminal; a concave formed between the first projection and the second projection; a resin case disposed to cover the patterned insulating substrate, and having an opening for passing the control terminal therethrough; a first concave portion; a beam portion disposed at the opening of the resin case; a second concave portion formed in the beam portion; a resin block inserted into the opening of the resin case and sandwiching the control terminal together with the sidewall of the opening of the resin case to fix the control terminal to the resin case; a convex step portion; a third projection formed on a side surface of the resin block; and a fourth projection thinned on a bottom surface of the resin block. | 06-19-2014 |
20140198469 | ELECTRONIC CIRCUIT, LIGHT SOURCE DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT - An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing the electronic circuit on which the electronic component is mounted on the substrate are described. The electronic component has a plurality of lead pins to be electrically connected to wirings on the substrate. The substrate is formed with a hole having a larger dimension than a maximum distance between at least two lead pins of the lead pins. The lead pins are inserted into the hole from sides of tips of the lead pins while being bent at a plurality of bending portions, and fixed to the substrate by a solder. | 07-17-2014 |
20140204552 | SENSOR AND METHOD FOR MANUFACTURING SENSOR - A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump. | 07-24-2014 |
20150116970 | MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME - A mounting structure includes a bonding material ( | 04-30-2015 |
20150348882 | Three-dimensional stack of leaded package and electronic member - An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead. | 12-03-2015 |
20150351234 | SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES - Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results. | 12-03-2015 |
20160157374 | WELDING AND SOLDERING OF TRANSISTOR LEADS | 06-02-2016 |
20160205771 | ELECTRONIC BOARD UNIT | 07-14-2016 |
20190150285 | Electronic Module with a Magnetic Device | 05-16-2019 |