Class / Patent application number | Description | Number of patent applications / Date published |
361771000 | Having particular material | 23 |
20080253098 | Damage Prevention Interposer for Electronic Package and Electronic Interconnect Structure - An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed in the interposer that extend from the first side to the second side. The electronic package is configurable to comprise one or more electronic structures; the interposer is configured for placement between the electronic package and the electronic interconnect structure; the locus of a wall of each of the holes is configured to facilitate insertion of a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure; the wall of each hole is configured to provide complete encirclement of that hole; and the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure. | 10-16-2008 |
20090002963 | METHOD OF ATTACHING DIE TO CIRCUIT BOARD WITH AN INTERMEDIATE INTERPOSER - A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board. | 01-01-2009 |
20100321908 | ELECTRONIC CIRCUIT DEVICE, PRODUCTION METHOD THEREOF, AND DISPLAY DEVICE - The present invention provides an electronic circuit device that can be downsized, a production method thereof, and a display device. The present invention is an electronic circuit device including:
| 12-23-2010 |
20110044017 | ELECTRONIC COMPONENT - An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal. | 02-24-2011 |
20110317385 | WAFER LEVEL PACKAGE (WLP) DEVICE HAVING BUMP ASSEMBLIES INCLUDING A BARRIER METAL - WLP semiconductor devices include bump assemblies that have a barrier layer for inhibiting electromigration within the bump assemblies. In an implementation, the bump assemblies include copper posts formed on the integrated circuit chips of the WLP devices. Barrier layers formed of a metal such as nickel (Ni) are provided on the outer surface of the copper posts to inhibit electromigration in the bump assembly. Oxidation prevention caps formed of a metal such as tin (Sn) are provided over the barrier layer. Solder bumps are formed over the oxidation prevention caps. The oxidation prevention caps inhibit oxidation of the barrier layer during fabrication of the bump assemblies. | 12-29-2011 |
20120033394 | METHOD OF FABRICATING EMBEDDED COMPONENT PACKAGE STRUCTURE AND THE PACKAGE STRUCTURE THEREOF - The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time. | 02-09-2012 |
20120092844 | Product Packaging - A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks. | 04-19-2012 |
20120106109 | POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD THEREOF - Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module. | 05-03-2012 |
20120224345 | MEMBER MOUNTING METHOD AND MEMBER ASSEMBLY - A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member. | 09-06-2012 |
20130063917 | PRINTED CIRCUIT BOARD INCLUDING UNDER-FILL DAM AND FABRICATION METHOD THEREOF - The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device. | 03-14-2013 |
20130286616 | CIRCUIT DEVICE - A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate ( | 10-31-2013 |
20140016288 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured. | 01-16-2014 |
20140071645 | Electronic Component comprising a Ceramic Carrier and use of a Ceramic Carrier - An electronic component for high-temperature applications includes a ceramic carrier and a semiconductor element. The ceramic carrier comprises a ceramic substrate having a content of alkali metal compounds of ≦0.5%, more particularly ≦0.05%, and the ceramic substrate is selected from the group consisting of: a ceramic substrate comprising aluminium oxide, anorthite, a filler having a coefficient of thermal expansion of ≦4.0*10 | 03-13-2014 |
20140078706 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads. | 03-20-2014 |
20140111956 | JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A joining method using a metal foam, a method of manufacturing a semiconductor device by using the joining method, and a semiconductor device produced by the manufacturing method are disclosed. A metal foam body is sandwiched between members to be joined, which are then brought into contact with each other and subjected to heat treatment. In this heat treatment, films of low-melting-point metal, such as Sn films covering the members to be joined, are melted. An alloy layer—an intermetallic compound—is formed by bringing about solid-liquid diffusion of Cu of a skeleton of open cells of the metal foam body in the molten Sn. At this stage, a Cu skeleton is left in the metal foam body. Highly thermally resistant and highly reliable joining can be realized by joining the members to be joined together by using this alloy layer. | 04-24-2014 |
20140146505 | BALL GRID ARRAY AND LAND GRID ARRAY HAVING MODIFIED FOOTPRINT - An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere. | 05-29-2014 |
20140218886 | ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE - An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1−T3<50° C. | 08-07-2014 |
20140369016 | PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material. | 12-18-2014 |
20150043186 | JOINED STRUCTURAL BODY OF MEMBERS, JOINING METHOD OF MEMBERS, AND PACKAGE FOR CONTAINING AN ELECTRONIC COMPONENT - According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal. | 02-12-2015 |
20150077962 | SOLDER ATTACH APPARATUS AND METHOD - An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures. | 03-19-2015 |
20150296618 | SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF - A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier. | 10-15-2015 |
20150351275 | Thin-Film Radio Frequency Power Terminator - A thin-film, radio frequency terminator is provided that includes a mounting flange and a thin-film termination chip mounted on a surface of the mounting flange. The mounting flange grounds the termination chip. The termination chip includes a substrate, a terminal, a metallization layer including a resistor pad electrically connecting the terminal to the mounting flange, and a cover. The terminator has a low physical profile but provides high power handling capability. | 12-03-2015 |
20160174371 | METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES | 06-16-2016 |