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With mounting pad

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361748000 - Printed circuit board

361760000 - Connection of components to board

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361768000 Having leadless component 14
361771000 Having particular material 10
361770000 Having spacer 4
20110019377Modular Integrated Circuit Chip Carrier - An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.01-27-2011
20100246150Interconnect Structure And A Method Of Fabricating The Same - An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.09-30-2010
20120212918Electrical Component Having an Electrical Connection Arrangement and Method for the Manufacture Thereof - An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.08-23-2012
20130128484SOLDER IN CAVITY INTERCONNECTION STRUCTURES - The present disclosure relates to the field of fabricating microelectronic packages, wherein cavities are formed in a dielectric layer deposited on a first substrate to maintain separation between soldered interconnections. In one embodiment, the cavities may have sloped sidewalls. In another embodiment, a solder paste may be deposited in the cavities and upon heating solder structures may be formed. In other embodiments, the solder structures may be placed in the cavities or may be formed on a second substrate to which the first substrate may be connected. In still other embodiments, solder structures may be formed on both the first substrate and a second substrate. The solder structures may be used to form solder interconnects by contact and reflow with either contact lands or solder structures on a second substrate.05-23-2013
361769000 Having spring member 4
20090091905CONTACT PRESSURE ANALYSIS TOOL - A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.04-09-2009
20120099286ELECTRONIC APPARATUS - To provide an electronic apparatus that can prevent electronic components from being separated from a circuit board.04-26-2012
20120195015SYSTEM AND METHOD FOR SECURING A SEMICONDUCTOR DEVICE TO A PRINTED WIRE BOARD - In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.08-02-2012
20090034217Panel mount connector - A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.02-05-2009
Entries
DocumentTitleDate
20130044449CIRCUIT BOARD MOUNTING APPARATUS - A circuit board mounting apparatus comprises a chassis and a securing structure. The chassis comprises a bottom board and two sidewalls located on two opposite sides of the board. The securing structure comprises a reinforcing member and a securing member secured to the reinforcing member. The reinforcing member is secured to the bottom board. The securing member defines a securing hole. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing the circuit board from moving laterally.02-21-2013
20130077273PRINTED CIRCUIT BOARD FOR PROVIDING OPERATION VOLTAGES - A printed circuit board (PCB) includes two power supply units, a central processing unit (CPU), two inductors and a temperature compensation resistor. One of the inductor is electrically connected between one power supply unit and the CPU, the other inductor is electrically connected between another power supply unit and the CPU. The temperature compensation resistor is electrically connected between the power supply units and ground, and is positioned between the two inductors to adjust output voltage from the CPU.03-28-2013
20100073892CIRCUIT BOARD INCLUDING STUBLESS SIGNAL PATHS AND METHOD OF MAKING SAME - A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.03-25-2010
20130039025PRINTED CIRCUIT BOARD - A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.02-14-2013
20130033835APPARATUS FOR IMPROVING GROUNDING FOR AN ELECTRICAL COMPONENT AND METHOD OF MAKING SAME - A multi-layer cradle comprises a first layer comprising first and second contact pads configured to be electrically coupled to a signal input and a signal output of the electronic component, respectively. The first layer also comprises a first ground plane configured to be electrically coupled to a ground of the electronic component and a first fence positioned about the first ground plane. The first ground plane is positioned at least between the first and second contact pads. A second layer comprising a second ground plane is also included. The cradle further comprises a first dielectric material positioned between the first and second layers, a ground plane via extending through the first dielectric material and electrically coupled to the first and second ground planes, and a plurality of fence vias extending through the first dielectric material and electrically coupled to the first fence and to second ground plane.02-07-2013
20130077274CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF - A card structure for a socket structure provided with a plurality of first elastic plates and a plurality of second elastic plates is disclosed, and the card structure includes a body, a plurality of first pad portions, and a plurality of second pad portions. The body includes a outer surface. The plurality of first and second pad portions are respectively disposed on the outer surface of the body and corresponding to the plurality of first and second elastic plates of the socket structure and respectively contact the plurality of first and second elastic plates of the socket structure when the card structure is disposed on the socket structure.03-28-2013
20130070437HYBRID INTERPOSER - An interconnection component includes a low coefficient of thermal expansion (“CTE”) element having first and second surfaces defining a thickness, the element consisting essentially of a material having a first CTE of less than 10 parts per million per degree Celsius, the element having a plurality of contacts exposed at a first surface thereof. The component further includes a circuit panel having a dielectric element with first and second surfaces defining a thickness and a plurality of terminals exposed at the first surface, the circuit panel having a thickness greater than 50% of the thickness of the low-CTE element. A bonding layer including a dielectric material bonds the second surfaces of the circuit panel and the low CTE element to one another. Metalized vias are electrically connected with the terminals and the contacts, at least some vias extending through the bonding layer and through the thickness of the low-CTE element.03-21-2013
20130070438INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact surface and a lower contact surface, the surface area of the extension contact surface being smaller than the surface area of the lower contact surface; and forming a package encapsulation on the substrate, the interposer, and the interposer pad extension, the package encapsulation having a recess exposing the top interposer surface, the interposer pad extension embedded only in the package encapsulation.03-21-2013
20090303690INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES - An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.12-10-2009
20120188736DATA CARRIER FOR CONTACTLESS DATA TRANSMISSION AND A METHOD FOR PRODUCING SUCH A DATA CARRIER - Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-coated prepreg layer.07-26-2012
20120188735CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.07-26-2012
20090268419PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT - Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.10-29-2009
20130063916Protection for Circuit Boards - A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external contacts so that external access to the external contacts is prohibited by the cover.03-14-2013
20130063915ELECTRONIC DEVICE - An electronic device includes a printed circuit board that a substrate contact part acting as a point of contact with another component is formed on a board surface thereof, a conductive member that has a first contact portion in contact with the substrate contact part, a plate-like extending portion extending from the first contact portion to the outside of the printed circuit board, and a second contact portion formed on a plate surface of the extending portion on the outside of the printed circuit board, and an electrical component that includes a component contact part in contact with the second contact portion and a body part on which the component contact part is formed, and is placed so that the component contact part or at least a part of the body part is opposed to an end face of the printed circuit board.03-14-2013
20090231821Head Substrate and Thermal Head Substrate - A head substrate for mounting a driver IC that selectively drives a plurality of driving elements is provided. An input signal wiring pattern electrically connects external connection terminals with the pads in a first pad array and a second pad array. The input signal wiring pattern includes a clock signal line for supplying the clock signal to the driver IC and a logic power line for supplying the logic power to the driver IC. A part of the clock signal line and a part of the logic power line are disposed between the first pad array and the second pad array.09-17-2009
20120113609Quad flat package with exposed paddle - A quad flat package (QFP) includes a semiconductor chip, a paddle to support the semiconductor chip, a molding portion to surround the semiconductor chip, a plurality of leads formed on four sides of the molding portion, and a plurality of bonding wires to electrically connect the plurality of leads to the semiconductor chip, wherein the paddle is exposed to outside from at least one corner of a lower surface of the molding portion.05-10-2012
20080298032ELECTRONIC DEVICE ASSEMBLY WITH TRANSFER CARD - An electronic device assembly includes an electronic device, a transfer card configured for connecting the electronic device to another electronic device, and a fixing board for mounting the transfer card to the electronic device. The electronic device includes a front wall defining a port. The transfer card is coupled to the electronic device. The transfer card comprises a printed circuit board perpendicular to the front wall, a first connector arranged on the elongated printed circuit board and protruding beyond a first longitudinal edge thereof for engagement in the port in the front wall of the electronic device, and a second connector arranged on the printed circuit board and protruding beyond an opposite second longitudinal edge thereof.12-04-2008
20100202122CARRIER ASSEMBLY FOR AN INTEGRATED CIRCUIT - A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This connection allows resilient deflection between the island defining portions.08-12-2010
20120081868Electronic Assemblies and Methods of Forming Electronic Assemblies - An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.04-05-2012
20100053921Printed Circuit Board and Electronic Device - According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.03-04-2010
20100091471CIRCUIT BOARD HAVING ISOLATION COVER AND ASSEMBLING METHOD THEREOF - The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.04-15-2010
20090154125SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device includes: a wiring substrate including multiple connection pads provided on a top surface thereof and multiple lands that are provided on a bottom surface thereof and electrically connected to the corresponding connection pads; a semiconductor chip mounted on the top surface of the wiring substrate and electrically connected to the connection pads; a solder resist deposited on the bottom surface of the wiring substrate and having multiple openings to which the lands are respectively exposed, each of the openings being shifted with respect to a corresponding land of the lands; multiple external terminals connected respectively to the lands through the openings; and a dummy wiring arranged on the bottom surface of the wiring substrate and separately from the corresponding land so that a corresponding external terminal of the external terminals is connected to the corresponding land and the dummy wiring partially exposed to the corresponding opening.06-18-2009
20090147488PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHOD OF FABRICATING SAME - Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.06-11-2009
20080266824PAD AND CIRCUIT BOARD, ELECTRONIC DEVICE USING SAME - A pad for soldering a lead of an electronic element includes a solder portion and one or more non-contiguous extending portions. The solder portion is configured for positioning the lead of the electronic element thereon and has a size and shape substantially equal to the size and shape of the footprint of the lead. The one or more non-contiguous extending portions extending from the solder portion and configured for providing additional solder paste in the soldering process. The pad can limit the position of the leads of the electronic element in the solder portion, thus ensuring accurate positioning of the electronic element.10-30-2008
20080266823CIRCUIT BOARD ASSEMBLY - A circuit board assembly (10-30-2008
20090310319DEVICE FOR ELECTRICAL CONNECTION OF AN INTEGRATED CIRCUIT CHIP - A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.12-17-2009
20100079965PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING PRINTED CIRCUIT BOARD - According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting face, the mounting face configured to mount the plurality of solder balls; a first bonding member including a first glass transition temperature, the first bonding member disposed around the parallelepiped body and configured to bond the semiconductor package and the printed wiring board; an electronic component mounted on the mounting face on an opposite side to the semiconductor package with respect to the first bonding member; and a second bonding member including a second glass transition temperature that is higher than the first glass transition temperature, the second bonding member disposed onto the mounting face to cover the electronic component.04-01-2010
20110188217BOARD CONNECTOR - In a board connector wherein fixing portions 08-04-2011
20090207575OC2 ORIENTED CONNECTIONS 2 - The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.08-20-2009
20090279272SOLDERING PAD AND CIRCUIT BOARD UTILIZING THE SAME - An exemplary soldering pad includes two opposite sides and defining interleaved cutouts at the opposite sides. Outer extremities of the soldering pad at the cutouts are in closer proximity to a lead soldered to the soldering pad than that at other parts. During soldering, soldering tin near the cutouts can significantly prevent shrinkage toward other parts of the soldering pad.11-12-2009
20090290316PRINTED WIRING BOARD - A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently provided for each of the processor cores, respectively. Accordingly, even when the electric potentials of the processor cores instantaneously drop, an instantaneous drop of the electric potential can be suppressed by action of the layered capacitors corresponding to the processor cores, respectively. In addition, even when the voltage of one of the processor cores varies, the variation in the voltage does not affect the other processor core, and thus malfunctioning does not occur.11-26-2009
20090296359Optimized Two-Socket/Four-Socket Server Architecture - An information handling system is set forth which includes a fully connected 4S topology that can also be populated with two processors and two link modules (e.g., two passive “slugs”) to implement a fully connected 2S topology. More specifically, the link module is a printed circuit board that implements a loopback connection between certain links of the architecture. In certain embodiment, the link module includes no electrical components. The link module merely includes a set of electrical connections (e.g., copper traces) connecting pads (e.g., gold plated pads) on a thick printed circuit board (PCB) dielectric material that is shaped to fit the processor socket. The link module is used to carry user data when the information handling system is configured in a 2S topology. The link module includes proper lane assignment that allows the module to be passive without performance reduction.12-03-2009
20090196000SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING - According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.08-06-2009
20080212301ELECTRONIC PART MOUNTING BOARD AND METHOD OF MOUNTING THE SAME - An electronic part mounting board includes an insulating board, a pad formed on the insulating board, a bump formed on the pad, and a film having heat resistance and electrical insulating properties and formed on the insulating board except the pad and the bump. A method of mounting an electronic part on the mounting board is also disclosed.09-04-2008
20100046185PRINTED CIRCUIT BOARD - A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.02-25-2010
20100103636Substrate device and its manufacturing method - A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.04-29-2010
20110205719ELECTRONIC COMPONENT - An electronic component is mounted on a circuit board. The electronic component includes: a lead frame including a fixed portion, a lead portion connected to the fixed portion, and a heat-dissipating portion connected to the fixed portion; a semiconductor chip fixed on the fixed portion by a first binder; and an encapsulation resin for encapsulating the fixed portion, the semiconductor chip, and a base portion of the lead portion. A groove is provided in the fixed portion and the heat-dissipating portion of the lead frame. The groove extends from a portion of the fixed portion where the first binder is present toward the heat-dissipating portion.08-25-2011
20090296360VOLTAGE REGULATOR ATTACH FOR HIGH CURRENT CHIP APPLICATIONS - A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground plane, wherein each of the power and ground planes is coupled to one or more of the electrical connections. The voltage regulator further includes a DC-DC converter that is electro-mechanically attachable to and detachable from the interposer. The interposer includes a socket, on a second side, that is suitable to receive two or more electro-mechanical connecting members of the DC-DC converter. When the DC-DC converter is attached to the interposer, at least one of the electromechanical connecting members is electrically coupled to a power plane of the interposer, while at least one other one of the electromechanical connecting members is electrically coupled to the ground plane.12-03-2009
20110267789ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING METHOD THEREOF - A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad.11-03-2011
20080247144INTEGRATED CIRCUIT CARRIER ASSEMBLY - Provided is a carrier assembly for an integrated circuit. The assembly includes a printed circuit board (PCB), and a carrier fast with the PCB. The carrier has a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection of such contacts relative to each other, the matrix surrounding a passage defined through the carrier. Also included is a retainer for operatively locating the integrated circuit within said passage so that the integrated circuit is electrically connected to the carrier.10-09-2008
20110007488POWER SUPPLY CURRENT CIRCUIT STRUCTURE - The present invention discloses a power supply current circuit structure including: a conducting plate device, made of an electrically conducting material, and including a plurality of separated conducting plates, a plurality of insert holes disposed on the conducting plates, and each conducting plate having a polarity opposite to the polarity of an adjacent conducting plate; an insulating layer, fixed onto the conducting plate device, and made of a non-conductive material; an electronic component module, installed on the insulating layer, and including a plurality of electronic components, each having two insert pins passed through the insulating layer and inserted into the insert holes of the adjacent conducting plate to constitute a current path. The invention provides a convenient and economic way of manufacturing a printed circuit board with a large current path and achieves the effect of preventing related electronic components from being damaged.01-13-2011
20080316724UNIVERSAL SOLDER PAD - A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.12-25-2008
20090052150WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE HAVING WIRING BOARD - There is provided a wiring board. The wiring board includes: a plurality of laminated insulating layers including a first insulating layer, the first insulating layer being either one of an uppermost layer or a lowermost layer; wiring patterns formed in the plurality of insulating layers; external connection pads provided on the first insulating layer; external connection terminals provided on the external connection pads; and a molding resin provided on a surface of the first insulating layer on which the external connection pads are provided, the molding resin having openings from which the external connection pads are exposed. A thickness of the molding resin is set such that the molding resin does not protrude above the external connection terminals.02-26-2009
20130120947ELECTRICAL DEVICE WITH CONNECTION INTERFACE, CIRCUIT BOARD THEREOF, AND METHOD FOR MANUFACTURING THE SAME - The present invention discloses an electrical device with a connection interface, a circuit board thereof, and a method for manufacturing the same. The electrical device with a connection interface includes: a circuit board on which a first circuit layer and a second circuit layer are formed and the second circuit layer has plural terminal pads, wherein a cavity is formed in the terminal pads and extends to the first circuit layer, and a metal layer is disposed in the cavity and connected to the first circuit layer and the terminal pads and defines an opening; a semiconductor chip electrically connected to the first circuit layer; and a conductive element interlaid in the opening. The electrical device with a connection interface does not need to be formed by assembling a terminal module because the conductive element is directly mounted on the circuit board.05-16-2013
20110228501ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device having a base substrate on which a resonator element and a semiconductor device are mounted by being disposed in a horizontal direction, includes on one primary face of the base substrate: a resonator element mounting pad that is used for mounting the resonator element; a first semiconductor device connecting pad that is electrically connected to the resonator element mounting pad; a relay pad that is electrically connected to a monitoring electrode terminal formed on the other primary face of the base substrate; and a cutting pattern that electrically connects the first semiconductor device connecting pad and the relay pad, wherein the cutting pattern is cut off in a state in which the semiconductor device is mounted, and a concave dent portion is included on the surface of the base substrate that is a cutting-off position of the cutting pattern.09-22-2011
20090251873Surface Mount Power Module Dual Footprint - A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.10-08-2009
20080316725Connector, printed circuit board, connecting device connecting them, and method of testing electronic part, using them - The invention has an object of providing a connector for connecting between a printed circuit board and a test device, capable of easily attaching and detaching the connector at low cost. The connector includes at least one conducting pin 12-25-2008
20100259909Widebody Coil Isolators - Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.10-14-2010
20130215586WIRING SUBSTRATE - A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line.08-22-2013
20100238638Semiconductor package - Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.09-23-2010
20100290203PRINTED CIRCUIT BOARD EQUIPPED WITH PIEZOELECTRIC ELEMENT - An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.11-18-2010
20090073668Carrier Assembly For An Integrated Circuit - A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This arrangement allows resilient deflection between the island defining portions.03-19-2009
20090027864Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.01-29-2009
20130148320METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF THE COMPONENTS - An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.06-13-2013
20110110058BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.05-12-2011
20110242779 METHOD FOR MAKING CONTACTLESS PORTABLE DEVICES WITH DIELECTRIC BRIDGE AND PORTABLE DEVICES - The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate (10-06-2011
20100046183INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.02-25-2010
20100046184RADIO-FREQUENCY PACKAGE - A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device.02-25-2010
20110075388SOLDER CONTAINMENT BRACKETS - Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.03-31-2011
20110249418CHIP ADAPTER - A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter.10-13-2011
20080247145INTEGRATED CIRCUIT CARRIER ARRANGEMENT WITH ELECTRICAL CONNECTION ISLANDS - An integrated circuit carrier arrangement includes a printed circuit board (PCB), a receiving plate to which an integrated circuit can be mounted, and a carrier fast with the PCB. The carrier has a plurality of resilient interconnection arms and a plurality of electrical connection islands. A number of the interconnection arms interconnect adjacent electrical connection islands, and a number of the interconnection arms interconnect an electrical connection island and the receiving plate, so that a plurality of electrical connection islands surrounds the receiving plate.10-09-2008
20080198566PRINTED CIRCUIT BOARD, SOLDER CONNECTION STRUCTURE AND METHOD BETWEEN PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD - There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 08-21-2008
20080205014THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME - A three-dimensional interconnect interposer adapted for use in system in package (SIP) includes a wafer, at least an embedded passive device and at least an interconnect pattern disposed on the front surface of the wafer, a plurality of cavities exposing the inner contact pads of the interconnect pattern formed on the back surface of the wafer, and a back connect pattern disposed on the back surface of the wafer electrically connected to the interconnect pattern and the embedded passive device through the inner contact pads.08-28-2008
20080205012CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE - A chip card module including a substrate and also conductor patterns, which are applied on at least one side of the substrate without any adhesive. A chip is arranged on one side of the substrate and connected in an electrically conducting manner to the conductor patterns. A mold cap encapsulates at least part of the chip and of the conductor patterns. The method of producing such a chip card module includes providing a substrate, applying conductor patterns to at least one side of the substrate without any adhesive, mounting a chip on one side of the substrate, connecting the chip to the conductor patterns, and applying a molding compound on the substrate, so that at least part of the chip and of the conductor patterns is covered.08-28-2008
20080205013SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE - A solder layer and an electronic device bonding substrate having high bonding strength of a device and low bonding failure even by a simplified bonding method of a device to a substrate and a method for manufacturing the same are provided.08-28-2008
20110096519SEMICONDUCTOR DEVICE - A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.04-28-2011
20090175013SYSTEM OF COMPONENTS IN AN ELECTRONIC DEVICE - The invention provides a system of components in an electronic device. The system comprises: a printed circuit board (PCB); a first component mounted to the PCB; a cap located about the first component, the cap having an arm extending outwardly from a body of the cap; a second component; and a platform for the second component.07-09-2009
20100277882MOTHERBOARD AND MOTHERBOARD LAYOUT METHOD - A motherboard layout method includes positioning two electronic elements on a top layer of a motherboard, and positioning another two electronic elements on a bottom layer of the motherboard, connecting one end of a first electronic element on the top layer to the same end of a first electronic element on the bottom layer with a first via hole, and connecting the same end of a second electronic element on the top layer to the same end of a second electronic element on the bottom layer with a second via hole. The method further includes connecting the other ends of the two electronic elements on the top layer to a first part, and connecting the other ends of the two electronic elements on the bottom layer to a second part.11-04-2010
20120307467Oxygen-Barrier Packaged Surface Mount Device - An electrical component includes a plurality of core devices arranged within a housing so as to be electrically isolated from one another. For each of the plurality of core devices, a first contact pad and a second contact pad is formed on an outside surface of the housing. The first and second contact pads are electrically connected to a respective core device of the plurality of core devices.12-06-2012
20120307468ELECTRONIC APPARATUS - An electronic apparatus includes a circuit board on which a plurality of electronic components are mounted, and a housing that is provided on the circuit board. The housing includes a mounting member that mounts the housing on the circuit board. The circuit board includes a plurality of circuit regions, an insulating region, and a mounting region. The plurality of electronic components is included in the plurality of circuit regions. The plurality of circuit regions are spaced from one another. The insulating region is located between adjacent circuit regions of the plurality of circuit regions to insulate between the adjacent circuit regions. In the mounting region, the mounting member is mounted on the circuit board. The mounting region is provided in the insulating region located between the adjacent circuit regions in a state where the housing is mounted on the circuit board.12-06-2012
20120120623LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME - Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate.05-17-2012
20100290202Semiconductor package, lead frame, and wiring board with the same - A semiconductor package comprises a conduction member, a semiconductor chip mounted on and electrically connected to the conduction member, and a sealing body configured to seal the conduction member and the semiconductor chip. The conduction member comprises a power supply section configured to supply a power voltage to said semiconductor chip, a ground section configured to supply a ground voltage to the semiconductor chip, and a signal section connected to a signal terminal of the semiconductor chip. The power supply section, the ground section, and the signal section are arranged so as not to overlap each other. At least a part of said ground section is exposed on an under surface of the sealing body. The power supply section comprises an exposed region of which bottom surface is exposed on the under surface, and a plurality of power hanging-pin region configured to extend to a side of the sealing body from the exposed region.11-18-2010
20100246149CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT - A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.09-30-2010
20120314391CIRCUIT BOARD AND METHOD FOR MAKING THE SAME - A circuit board includes a base board defining a number of via holes, a power supply connection unit, a load connection unit, and at least one capacitor connection unit(s). Each of the at least one capacitor connection unit(s) includes two capacitor connectors, and one of the two capacitor connectors is positioned nearer to the power supply connection unit and farther away from the load connection unit than the other. The via holes are divided into at least one group(s) corresponding to each of the capacitor connection unit(s), and all of the via holes in each of the group(s) are equidistantly positioned along a semicircle arc surrounding the capacitor connector of the capacitor connection unit corresponding to the group that is positioned nearer to the power supply connection unit.12-13-2012
20120212917Three-Dimensional Stack Structure Of Wafer Chip Using Interposer - The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board.08-23-2012
20090059544Socket - A socket, for holding a semiconductor package, comprises a housing receiving a plurality of contacts and defining a space, a plurality of actuators assembled to the housing around the space, a lid movably assembled to the housing, a plurality of push fingers and a plurality of springs urging the push fingers. When the lid moves downwardly, the actuators are actuated to open the space and let the semiconductor package locate in the space, synchronously, the push fingers are forced by the lid to slide away from the space; When the lid moves upwardly, the actuator rotates to close the space and press the semiconductor package, and then the push fingers move back toward the space to position the semiconductor package by restore forces of the springs.03-05-2009
20120229997PRINTED CIRCUIT BOARD - A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.09-13-2012
20120170238ELECTRONIC DEVICE - An electronic device includes a circuit board, a connector and an electronic module. The connector includes an insulating body and a first terminal set. The insulating body includes a concave. The first terminal set is fastened on the insulating body and is electrically connected to the circuit board. The electronic module is detachably disposed in the concave and includes a second terminal set. The second terminal set contacts the first terminal set to be electrically connected to the circuit board.07-05-2012
20120170237SUBSTRATE ASSEMBLY PROVIDED WITH CAPACITIVE INTERCONNECTIONS, AND MANUFACTURING METHOD THEREOF - An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding to the first surface; a second substrate having a second surface, housing a third electrical-interconnection element and a fourth electrical-interconnection element in a position corresponding to the second surface, and provided with a dielectric layer extending on top of the third interconnection element; and a first bump and a second bump made of conductive material, extending between the first electrical-interconnection element and the third electrical-interconnection element and, respectively, between the second electrical-interconnection element and the fourth electrical-interconnection element, at least partially aligned to the respective electrical-interconnection elements, the first bump being ohmically coupled to the first interconnection element and capacitively coupled to the third interconnection element, and the second bump being ohmically coupled to the second interconnection element and to the fourth interconnection element.07-05-2012
20100309640SURFACE MOUNT ELECTRONIC DEVICE PACKAGING ASSEMBLY - A surface mount electronic device packaging assembly includes a body having an aperture defined therethrough. The aperture is adapted to receive an electronic device therein. The body has a first surface and a second surface. An electrically conductive contact pad is disposed on the first surface of the body. The contact pad is adapted to receive a lead from the electronic device. A thermally conductive base pad is disposed on the second surface of the body. A top surface of the base pad is adapted to receive the electronic device thereon.12-09-2010
20120176759ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.07-12-2012
20100271792ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME - An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.10-28-2010
20120218727SHIELD CASE FOR EMI SHIELDING - Provided is a shield case for electromagnetic interference shielding, including a main body having an opening in a lower surface thereof, wherein at least one portion of an upper surface of the main body is flat for vacuum pickup, and the main body has a box shape and is electrically conductive, a flange extending outward from an edge of the opening and integrally formed with the edge, and a support coupled to the flange to contact at least a lower surface of the flange. The support is adapted for soldering and is electrically conductive. After the main body and the support are mounted on a printed circuit board through a surface mount process, a lower surface of the support is electrically and mechanically connected through solder cream to a conductive pattern of the printed circuit board through a reflow soldering process.08-30-2012
20130170164ADHESIVE DAM - On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.07-04-2013
20110122592First-level interconnects with slender columns, and processes of forming same - A column is coupled to a last metallization of a die and the column is mated to a mounting substrate with that aid of a solder. The column may have the solder attached thereto before mating to the mounting substrate and the mounting substrate may be a bare-board (no solder mask) during the mating process. The column has an aspect ratio between 0.75 and 10.05-26-2011
20120087098PACKAGE SUBSTRATE - Disclosed herein is a package substrate, including: a printed circuit board having a connection terminal and a conductive adhesive layer formed thereon; components mounted in the connection terminal; wires coupled to the components; a wall printed circuit board coupled to the conductive adhesive layer and configured to cover the components; and a metal cap coupled to an upper end of the wall printed circuit board to cover the components, thereby ensuring firmness and reliability despite external impact.04-12-2012
20100220454PRINTED CIRCUIT BOARD - A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.09-02-2010
20120140427PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE - A printed circuit board assembly (PCB) assembly is provided, including a printed circuit board (PCB) comprising a plurality of conductive pads and an advanced quad pack no-lead chip (a-QFN) package soldered to the printed circuit board. In one embodiment, the conductive pads have a first surface area and the QFN package includes a plurality of leads facing the conductive pads, having a second surface area, wherein a ratio between the second surface area and the first surface area is about 20% to 85% to ensure a physical connection between the PCB and the a-QFN package.06-07-2012
20110157852SEMICONDUCTOR DEVICE AND CIRCUIT BOARD - A semiconductor device for mounting on a wiring board includes: a container for containing a semiconductor chip; and a plurality of leads, each of the plurality of leads includes a mount connection portion at one end for the semiconductor device to be connected to the wiring board, wherein the plurality of leads includes first leads and second leads, a signal transmission rate of the first leads is higher than that of the second leads, and the mount connection portion of each of the first leads is smaller than that of each of the second leads.06-30-2011
20120243193MOTHERBOARD INTERCONNECTION DEVICE AND MOTHERBOARD INTERCONNECTION METHOD - A motherboard interconnection method includes positioning a first and a third electronic elements on a top layer of a motherboard interconnection device, and positioning a second and a fourth electronic elements on a bottom layer of the motherboard interconnection device. The method connects a first end of the first electronic element on the top layer to the first end of the second electronic element on the bottom layer with a first via hole, and connects the first end of the third electronic element on the top layer to the first end of the fourth electronic element on the bottom layer with a second via hole. The method further connects a second ends of the two electronic elements on the top layer to a first part, and connects the second ends of the two electronic elements on the bottom layer to a second part.09-27-2012
20120243192THREE-DIMENSIONAL POWER ELECTRONICS PACKAGES - Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane.09-27-2012
20080225501Printed circuit board and manufacturing method thereof - A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.09-18-2008
20080225500Printed circuit board unit and printed wiring board - An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.09-18-2008
20080225499Selectively supporting different memory technologies on a single motherboard - A motherboard may be adapted to selectively implement one of two different memory technologies. For example, the motherboard may be able to subsequently implement a subsequently developed memory technology. In some embodiments, the motherboard is capable of detecting whether a memory module is in a slot dedicated to a first or a second memory technology and, based on the presence of a memory module in an appropriate slot, the motherboard may be adapted to operate with the particular, selected memory technology.09-18-2008
20130114224ATTACHMENT OF A CONTROL UNIT FOR A TRANSMISSION CONTROL MODULE TO A CARRIER BOARD - A control unit for a transmission control module of a motor vehicle transmission includes a circuit mounting device and at least one attachment device configured to attach the circuit mounting device to a carrier board. The circuit mounting device includes an electronic circuit and has a first bearing side with which it is configured to be pressed against a second bearing side of the carrier board by the attachment device. The attachment device has at least one attachment element which is connected to the circuit mounting device and protrudes with a first end from the circuit mounting device on the first bearing side. The attachment element is configured to project through an attachment opening in the second bearing side of the carrier board.05-09-2013
20130100623ELECTRONIC DEVICES FOR RF FRONT END SIGNAL PROCESSING - An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.04-25-2013
20130114223SEMICONDUCTOR DEVICE - A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates 05-09-2013
20130141884Electronic Component Structure and Electronic Device - According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.06-06-2013
20110273856Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board - A circuit board includes a board, a first conductive land over the board, a second conductive land over the board, a resist extending over the board, and a conductive material within the opening. The second conductive land is distanced from the first conductive land. The resist has an opening that extends over at leat a portion of the first conductive land, at least a portion of the second conductive land, and at least a portion of an intervening region of the board. The intervening region extends between the first and second conductive lands. The conductive material extends over the at least a portion of the intervening region, the at least a portion of the first conductive land, and the at least a portion of the second conductive land.11-10-2011
20080212300CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and electrically connected to each other through the interconnecting circuit. The circuit board further includes an insulating layer on the substrate. The insulating layer has first openings that allow the pair of the first land pads to be exposed through the insulating layer.09-04-2008
20080205011In-grid decoupling for ball grid array (BGA) devices - A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein the conductive pads have octagonal shapes and four sides of each octagonal pad are mutually parallel.08-28-2008
20110222254ELECTRICAL CONNECTION STRUCTURE OF ELECTRONIC BOARD - An electrical connection structure of an electronic board includes: a board support member formed of synthetic resin; an electronic board fixed to the board support member; an electrical connection pad disposed on the electronic board; a bus bar disposed in the board support member; and a bonding wire that electrically connects the electrical connection pad and the bus bar. The bus bar includes: an exposed portion exposed in a face of the board support member; an embedded portion embedded in the board support member; and a connection portion extending from the exposed portion and being electrically connected to an electrical component. An end of the bonding wire is bonded to the exposed portion, and a first cut portion is formed in the embedded portion.09-15-2011
20110242780MOUNT BOARD AND ELECTRONIC DEVICE - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 10-06-2011
20110235293SHIELD CASE, CONNECTOR AND ELECTRONIC EQUIPMENT - The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.09-29-2011
20100302747SYSTEM AND METHOD FOR COUPLING A LENS TO A PRINTED CIRCUIT - An optical assembly is disclosed which may include a lens having first and second electrodes; and a flexible printed circuit (FPC) configured for placement in proximity to the lens, wherein the FPC may include a bottom insulating layer; a top insulating layer; and an FPC electrode configured to contact the second electrode of the lens, wherein the FPC electrode may include a center portion disposed between the bottom and top insulating layers of the FPC; a post connected to the center portion and extending through the top insulating layer of the FPC; and a contact layer connected to the post and configured to provide the contact with the second electrode of the lens.12-02-2010
20130155635AUTOMOTIVE ALTERNATOR RECTIFYING APPARATUS - An automotive alternator rectifying apparatus includes a circuit board that connects a positive-side rectifying element mounted to the positive-side heatsink and a negative-side rectifying element mounted to the negative-side heatsink to configure a bridge circuit. The circuit board includes a tubular lead guiding portion that includes a lead insertion aperture; and a terminal that is disposed so as to extend outward in an aperture direction of the lead insertion aperture from an exit edge portion of the lead insertion aperture, and to which is connected a lead that is subject to connection that is inserted through an entrance of the lead insertion aperture and that extends outward from an exit, and the lead insertion aperture is formed such that cross-sectional area thereof becomes gradually smaller from the entrance toward the exit.06-20-2013
20120281377VIAS FOR MITIGATING PAD DELAMINATION - A signal carrier medium is disclosed including support vias for maintaining laminated portions of the signal carrier medium together. The signal carrier medium includes metal portions such as a contact pad. The metal portions may have one or more adjacent support vias for dissipating stresses which build in the metal portions.11-08-2012
20110310577ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.12-22-2011
20120075819ELECTRONIC PART AND CONNECTION STRUCTURE OF THE ELECTRONIC PART - An electronic part includes an electronic part body, an electrode terminal that protrudes from the electronic part body, and that electrically connects the electronic part to an external electrode when a flexible conductor is joined to an electrode surface, and a holder made of an insulating material, and joined to the electronic part body. The holder is interposed between a mounting plate and the electronic part body when the electronic part is mounted to the mounting plate, and the holder is in contact with a surface of the electrode terminal opposite from the electrode surface.03-29-2012

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