Entries |
Document | Title | Date |
20080198566 | PRINTED CIRCUIT BOARD, SOLDER CONNECTION STRUCTURE AND METHOD BETWEEN PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD - There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board | 08-21-2008 |
20080205011 | In-grid decoupling for ball grid array (BGA) devices - A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein the conductive pads have octagonal shapes and four sides of each octagonal pad are mutually parallel. | 08-28-2008 |
20080205012 | CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE - A chip card module including a substrate and also conductor patterns, which are applied on at least one side of the substrate without any adhesive. A chip is arranged on one side of the substrate and connected in an electrically conducting manner to the conductor patterns. A mold cap encapsulates at least part of the chip and of the conductor patterns. The method of producing such a chip card module includes providing a substrate, applying conductor patterns to at least one side of the substrate without any adhesive, mounting a chip on one side of the substrate, connecting the chip to the conductor patterns, and applying a molding compound on the substrate, so that at least part of the chip and of the conductor patterns is covered. | 08-28-2008 |
20080205013 | SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE - A solder layer and an electronic device bonding substrate having high bonding strength of a device and low bonding failure even by a simplified bonding method of a device to a substrate and a method for manufacturing the same are provided. | 08-28-2008 |
20080205014 | THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME - A three-dimensional interconnect interposer adapted for use in system in package (SIP) includes a wafer, at least an embedded passive device and at least an interconnect pattern disposed on the front surface of the wafer, a plurality of cavities exposing the inner contact pads of the interconnect pattern formed on the back surface of the wafer, and a back connect pattern disposed on the back surface of the wafer electrically connected to the interconnect pattern and the embedded passive device through the inner contact pads. | 08-28-2008 |
20080212300 | CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and electrically connected to each other through the interconnecting circuit. The circuit board further includes an insulating layer on the substrate. The insulating layer has first openings that allow the pair of the first land pads to be exposed through the insulating layer. | 09-04-2008 |
20080212301 | ELECTRONIC PART MOUNTING BOARD AND METHOD OF MOUNTING THE SAME - An electronic part mounting board includes an insulating board, a pad formed on the insulating board, a bump formed on the pad, and a film having heat resistance and electrical insulating properties and formed on the insulating board except the pad and the bump. A method of mounting an electronic part on the mounting board is also disclosed. | 09-04-2008 |
20080225499 | Selectively supporting different memory technologies on a single motherboard - A motherboard may be adapted to selectively implement one of two different memory technologies. For example, the motherboard may be able to subsequently implement a subsequently developed memory technology. In some embodiments, the motherboard is capable of detecting whether a memory module is in a slot dedicated to a first or a second memory technology and, based on the presence of a memory module in an appropriate slot, the motherboard may be adapted to operate with the particular, selected memory technology. | 09-18-2008 |
20080225500 | Printed circuit board unit and printed wiring board - An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon. | 09-18-2008 |
20080225501 | Printed circuit board and manufacturing method thereof - A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability. | 09-18-2008 |
20080247144 | INTEGRATED CIRCUIT CARRIER ASSEMBLY - Provided is a carrier assembly for an integrated circuit. The assembly includes a printed circuit board (PCB), and a carrier fast with the PCB. The carrier has a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection of such contacts relative to each other, the matrix surrounding a passage defined through the carrier. Also included is a retainer for operatively locating the integrated circuit within said passage so that the integrated circuit is electrically connected to the carrier. | 10-09-2008 |
20080247145 | INTEGRATED CIRCUIT CARRIER ARRANGEMENT WITH ELECTRICAL CONNECTION ISLANDS - An integrated circuit carrier arrangement includes a printed circuit board (PCB), a receiving plate to which an integrated circuit can be mounted, and a carrier fast with the PCB. The carrier has a plurality of resilient interconnection arms and a plurality of electrical connection islands. A number of the interconnection arms interconnect adjacent electrical connection islands, and a number of the interconnection arms interconnect an electrical connection island and the receiving plate, so that a plurality of electrical connection islands surrounds the receiving plate. | 10-09-2008 |
20080266823 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly ( | 10-30-2008 |
20080266824 | PAD AND CIRCUIT BOARD, ELECTRONIC DEVICE USING SAME - A pad for soldering a lead of an electronic element includes a solder portion and one or more non-contiguous extending portions. The solder portion is configured for positioning the lead of the electronic element thereon and has a size and shape substantially equal to the size and shape of the footprint of the lead. The one or more non-contiguous extending portions extending from the solder portion and configured for providing additional solder paste in the soldering process. The pad can limit the position of the leads of the electronic element in the solder portion, thus ensuring accurate positioning of the electronic element. | 10-30-2008 |
20080298032 | ELECTRONIC DEVICE ASSEMBLY WITH TRANSFER CARD - An electronic device assembly includes an electronic device, a transfer card configured for connecting the electronic device to another electronic device, and a fixing board for mounting the transfer card to the electronic device. The electronic device includes a front wall defining a port. The transfer card is coupled to the electronic device. The transfer card comprises a printed circuit board perpendicular to the front wall, a first connector arranged on the elongated printed circuit board and protruding beyond a first longitudinal edge thereof for engagement in the port in the front wall of the electronic device, and a second connector arranged on the printed circuit board and protruding beyond an opposite second longitudinal edge thereof. | 12-04-2008 |
20080316724 | UNIVERSAL SOLDER PAD - A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit. | 12-25-2008 |
20080316725 | Connector, printed circuit board, connecting device connecting them, and method of testing electronic part, using them - The invention has an object of providing a connector for connecting between a printed circuit board and a test device, capable of easily attaching and detaching the connector at low cost. The connector includes at least one conducting pin | 12-25-2008 |
20090027864 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved. | 01-29-2009 |
20090052150 | WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE HAVING WIRING BOARD - There is provided a wiring board. The wiring board includes: a plurality of laminated insulating layers including a first insulating layer, the first insulating layer being either one of an uppermost layer or a lowermost layer; wiring patterns formed in the plurality of insulating layers; external connection pads provided on the first insulating layer; external connection terminals provided on the external connection pads; and a molding resin provided on a surface of the first insulating layer on which the external connection pads are provided, the molding resin having openings from which the external connection pads are exposed. A thickness of the molding resin is set such that the molding resin does not protrude above the external connection terminals. | 02-26-2009 |
20090059544 | Socket - A socket, for holding a semiconductor package, comprises a housing receiving a plurality of contacts and defining a space, a plurality of actuators assembled to the housing around the space, a lid movably assembled to the housing, a plurality of push fingers and a plurality of springs urging the push fingers. When the lid moves downwardly, the actuators are actuated to open the space and let the semiconductor package locate in the space, synchronously, the push fingers are forced by the lid to slide away from the space; When the lid moves upwardly, the actuator rotates to close the space and press the semiconductor package, and then the push fingers move back toward the space to position the semiconductor package by restore forces of the springs. | 03-05-2009 |
20090073668 | Carrier Assembly For An Integrated Circuit - A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This arrangement allows resilient deflection between the island defining portions. | 03-19-2009 |
20090147488 | PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHOD OF FABRICATING SAME - Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer. | 06-11-2009 |
20090154125 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device includes: a wiring substrate including multiple connection pads provided on a top surface thereof and multiple lands that are provided on a bottom surface thereof and electrically connected to the corresponding connection pads; a semiconductor chip mounted on the top surface of the wiring substrate and electrically connected to the connection pads; a solder resist deposited on the bottom surface of the wiring substrate and having multiple openings to which the lands are respectively exposed, each of the openings being shifted with respect to a corresponding land of the lands; multiple external terminals connected respectively to the lands through the openings; and a dummy wiring arranged on the bottom surface of the wiring substrate and separately from the corresponding land so that a corresponding external terminal of the external terminals is connected to the corresponding land and the dummy wiring partially exposed to the corresponding opening. | 06-18-2009 |
20090175013 | SYSTEM OF COMPONENTS IN AN ELECTRONIC DEVICE - The invention provides a system of components in an electronic device. The system comprises: a printed circuit board (PCB); a first component mounted to the PCB; a cap located about the first component, the cap having an arm extending outwardly from a body of the cap; a second component; and a platform for the second component. | 07-09-2009 |
20090196000 | SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING - According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder. | 08-06-2009 |
20090207575 | OC2 ORIENTED CONNECTIONS 2 - The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages. | 08-20-2009 |
20090231821 | Head Substrate and Thermal Head Substrate - A head substrate for mounting a driver IC that selectively drives a plurality of driving elements is provided. An input signal wiring pattern electrically connects external connection terminals with the pads in a first pad array and a second pad array. The input signal wiring pattern includes a clock signal line for supplying the clock signal to the driver IC and a logic power line for supplying the logic power to the driver IC. A part of the clock signal line and a part of the logic power line are disposed between the first pad array and the second pad array. | 09-17-2009 |
20090251873 | Surface Mount Power Module Dual Footprint - A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect. | 10-08-2009 |
20090268419 | PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT - Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof. | 10-29-2009 |
20090279272 | SOLDERING PAD AND CIRCUIT BOARD UTILIZING THE SAME - An exemplary soldering pad includes two opposite sides and defining interleaved cutouts at the opposite sides. Outer extremities of the soldering pad at the cutouts are in closer proximity to a lead soldered to the soldering pad than that at other parts. During soldering, soldering tin near the cutouts can significantly prevent shrinkage toward other parts of the soldering pad. | 11-12-2009 |
20090290316 | PRINTED WIRING BOARD - A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently provided for each of the processor cores, respectively. Accordingly, even when the electric potentials of the processor cores instantaneously drop, an instantaneous drop of the electric potential can be suppressed by action of the layered capacitors corresponding to the processor cores, respectively. In addition, even when the voltage of one of the processor cores varies, the variation in the voltage does not affect the other processor core, and thus malfunctioning does not occur. | 11-26-2009 |
20090296359 | Optimized Two-Socket/Four-Socket Server Architecture - An information handling system is set forth which includes a fully connected 4S topology that can also be populated with two processors and two link modules (e.g., two passive “slugs”) to implement a fully connected 2S topology. More specifically, the link module is a printed circuit board that implements a loopback connection between certain links of the architecture. In certain embodiment, the link module includes no electrical components. The link module merely includes a set of electrical connections (e.g., copper traces) connecting pads (e.g., gold plated pads) on a thick printed circuit board (PCB) dielectric material that is shaped to fit the processor socket. The link module is used to carry user data when the information handling system is configured in a 2S topology. The link module includes proper lane assignment that allows the module to be passive without performance reduction. | 12-03-2009 |
20090296360 | VOLTAGE REGULATOR ATTACH FOR HIGH CURRENT CHIP APPLICATIONS - A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground plane, wherein each of the power and ground planes is coupled to one or more of the electrical connections. The voltage regulator further includes a DC-DC converter that is electro-mechanically attachable to and detachable from the interposer. The interposer includes a socket, on a second side, that is suitable to receive two or more electro-mechanical connecting members of the DC-DC converter. When the DC-DC converter is attached to the interposer, at least one of the electromechanical connecting members is electrically coupled to a power plane of the interposer, while at least one other one of the electromechanical connecting members is electrically coupled to the ground plane. | 12-03-2009 |
20090303690 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES - An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed. | 12-10-2009 |
20090310319 | DEVICE FOR ELECTRICAL CONNECTION OF AN INTEGRATED CIRCUIT CHIP - A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row. | 12-17-2009 |
20100046183 | INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer. | 02-25-2010 |
20100046184 | RADIO-FREQUENCY PACKAGE - A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device. | 02-25-2010 |
20100046185 | PRINTED CIRCUIT BOARD - A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land. | 02-25-2010 |
20100053921 | Printed Circuit Board and Electronic Device - According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face. | 03-04-2010 |
20100073892 | CIRCUIT BOARD INCLUDING STUBLESS SIGNAL PATHS AND METHOD OF MAKING SAME - A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment. | 03-25-2010 |
20100079965 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING PRINTED CIRCUIT BOARD - According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting face, the mounting face configured to mount the plurality of solder balls; a first bonding member including a first glass transition temperature, the first bonding member disposed around the parallelepiped body and configured to bond the semiconductor package and the printed wiring board; an electronic component mounted on the mounting face on an opposite side to the semiconductor package with respect to the first bonding member; and a second bonding member including a second glass transition temperature that is higher than the first glass transition temperature, the second bonding member disposed onto the mounting face to cover the electronic component. | 04-01-2010 |
20100091471 | CIRCUIT BOARD HAVING ISOLATION COVER AND ASSEMBLING METHOD THEREOF - The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion. | 04-15-2010 |
20100103636 | Substrate device and its manufacturing method - A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other. | 04-29-2010 |
20100202122 | CARRIER ASSEMBLY FOR AN INTEGRATED CIRCUIT - A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This connection allows resilient deflection between the island defining portions. | 08-12-2010 |
20100220454 | PRINTED CIRCUIT BOARD - A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor. | 09-02-2010 |
20100238638 | Semiconductor package - Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern. | 09-23-2010 |
20100246149 | CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT - A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads. | 09-30-2010 |
20100259909 | Widebody Coil Isolators - Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price. | 10-14-2010 |
20100271792 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME - An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced. | 10-28-2010 |
20100277882 | MOTHERBOARD AND MOTHERBOARD LAYOUT METHOD - A motherboard layout method includes positioning two electronic elements on a top layer of a motherboard, and positioning another two electronic elements on a bottom layer of the motherboard, connecting one end of a first electronic element on the top layer to the same end of a first electronic element on the bottom layer with a first via hole, and connecting the same end of a second electronic element on the top layer to the same end of a second electronic element on the bottom layer with a second via hole. The method further includes connecting the other ends of the two electronic elements on the top layer to a first part, and connecting the other ends of the two electronic elements on the bottom layer to a second part. | 11-04-2010 |
20100290202 | Semiconductor package, lead frame, and wiring board with the same - A semiconductor package comprises a conduction member, a semiconductor chip mounted on and electrically connected to the conduction member, and a sealing body configured to seal the conduction member and the semiconductor chip. The conduction member comprises a power supply section configured to supply a power voltage to said semiconductor chip, a ground section configured to supply a ground voltage to the semiconductor chip, and a signal section connected to a signal terminal of the semiconductor chip. The power supply section, the ground section, and the signal section are arranged so as not to overlap each other. At least a part of said ground section is exposed on an under surface of the sealing body. The power supply section comprises an exposed region of which bottom surface is exposed on the under surface, and a plurality of power hanging-pin region configured to extend to a side of the sealing body from the exposed region. | 11-18-2010 |
20100290203 | PRINTED CIRCUIT BOARD EQUIPPED WITH PIEZOELECTRIC ELEMENT - An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction. | 11-18-2010 |
20100302747 | SYSTEM AND METHOD FOR COUPLING A LENS TO A PRINTED CIRCUIT - An optical assembly is disclosed which may include a lens having first and second electrodes; and a flexible printed circuit (FPC) configured for placement in proximity to the lens, wherein the FPC may include a bottom insulating layer; a top insulating layer; and an FPC electrode configured to contact the second electrode of the lens, wherein the FPC electrode may include a center portion disposed between the bottom and top insulating layers of the FPC; a post connected to the center portion and extending through the top insulating layer of the FPC; and a contact layer connected to the post and configured to provide the contact with the second electrode of the lens. | 12-02-2010 |
20100309640 | SURFACE MOUNT ELECTRONIC DEVICE PACKAGING ASSEMBLY - A surface mount electronic device packaging assembly includes a body having an aperture defined therethrough. The aperture is adapted to receive an electronic device therein. The body has a first surface and a second surface. An electrically conductive contact pad is disposed on the first surface of the body. The contact pad is adapted to receive a lead from the electronic device. A thermally conductive base pad is disposed on the second surface of the body. A top surface of the base pad is adapted to receive the electronic device thereon. | 12-09-2010 |
20110007488 | POWER SUPPLY CURRENT CIRCUIT STRUCTURE - The present invention discloses a power supply current circuit structure including: a conducting plate device, made of an electrically conducting material, and including a plurality of separated conducting plates, a plurality of insert holes disposed on the conducting plates, and each conducting plate having a polarity opposite to the polarity of an adjacent conducting plate; an insulating layer, fixed onto the conducting plate device, and made of a non-conductive material; an electronic component module, installed on the insulating layer, and including a plurality of electronic components, each having two insert pins passed through the insulating layer and inserted into the insert holes of the adjacent conducting plate to constitute a current path. The invention provides a convenient and economic way of manufacturing a printed circuit board with a large current path and achieves the effect of preventing related electronic components from being damaged. | 01-13-2011 |
20110075388 | SOLDER CONTAINMENT BRACKETS - Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste. | 03-31-2011 |
20110096519 | SEMICONDUCTOR DEVICE - A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier. | 04-28-2011 |
20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 05-12-2011 |
20110122592 | First-level interconnects with slender columns, and processes of forming same - A column is coupled to a last metallization of a die and the column is mated to a mounting substrate with that aid of a solder. The column may have the solder attached thereto before mating to the mounting substrate and the mounting substrate may be a bare-board (no solder mask) during the mating process. The column has an aspect ratio between 0.75 and 10. | 05-26-2011 |
20110157852 | SEMICONDUCTOR DEVICE AND CIRCUIT BOARD - A semiconductor device for mounting on a wiring board includes: a container for containing a semiconductor chip; and a plurality of leads, each of the plurality of leads includes a mount connection portion at one end for the semiconductor device to be connected to the wiring board, wherein the plurality of leads includes first leads and second leads, a signal transmission rate of the first leads is higher than that of the second leads, and the mount connection portion of each of the first leads is smaller than that of each of the second leads. | 06-30-2011 |
20110188217 | BOARD CONNECTOR - In a board connector wherein fixing portions | 08-04-2011 |
20110205719 | ELECTRONIC COMPONENT - An electronic component is mounted on a circuit board. The electronic component includes: a lead frame including a fixed portion, a lead portion connected to the fixed portion, and a heat-dissipating portion connected to the fixed portion; a semiconductor chip fixed on the fixed portion by a first binder; and an encapsulation resin for encapsulating the fixed portion, the semiconductor chip, and a base portion of the lead portion. A groove is provided in the fixed portion and the heat-dissipating portion of the lead frame. The groove extends from a portion of the fixed portion where the first binder is present toward the heat-dissipating portion. | 08-25-2011 |
20110222254 | ELECTRICAL CONNECTION STRUCTURE OF ELECTRONIC BOARD - An electrical connection structure of an electronic board includes: a board support member formed of synthetic resin; an electronic board fixed to the board support member; an electrical connection pad disposed on the electronic board; a bus bar disposed in the board support member; and a bonding wire that electrically connects the electrical connection pad and the bus bar. The bus bar includes: an exposed portion exposed in a face of the board support member; an embedded portion embedded in the board support member; and a connection portion extending from the exposed portion and being electrically connected to an electrical component. An end of the bonding wire is bonded to the exposed portion, and a first cut portion is formed in the embedded portion. | 09-15-2011 |
20110228501 | ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device having a base substrate on which a resonator element and a semiconductor device are mounted by being disposed in a horizontal direction, includes on one primary face of the base substrate: a resonator element mounting pad that is used for mounting the resonator element; a first semiconductor device connecting pad that is electrically connected to the resonator element mounting pad; a relay pad that is electrically connected to a monitoring electrode terminal formed on the other primary face of the base substrate; and a cutting pattern that electrically connects the first semiconductor device connecting pad and the relay pad, wherein the cutting pattern is cut off in a state in which the semiconductor device is mounted, and a concave dent portion is included on the surface of the base substrate that is a cutting-off position of the cutting pattern. | 09-22-2011 |
20110235293 | SHIELD CASE, CONNECTOR AND ELECTRONIC EQUIPMENT - The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board. | 09-29-2011 |
20110242779 | METHOD FOR MAKING CONTACTLESS PORTABLE DEVICES WITH DIELECTRIC BRIDGE AND PORTABLE DEVICES - The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate ( | 10-06-2011 |
20110242780 | MOUNT BOARD AND ELECTRONIC DEVICE - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 10-06-2011 |
20110249418 | CHIP ADAPTER - A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter. | 10-13-2011 |
20110267789 | ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING METHOD THEREOF - A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad. | 11-03-2011 |
20110273856 | Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board - A circuit board includes a board, a first conductive land over the board, a second conductive land over the board, a resist extending over the board, and a conductive material within the opening. The second conductive land is distanced from the first conductive land. The resist has an opening that extends over at leat a portion of the first conductive land, at least a portion of the second conductive land, and at least a portion of an intervening region of the board. The intervening region extends between the first and second conductive lands. The conductive material extends over the at least a portion of the intervening region, the at least a portion of the first conductive land, and the at least a portion of the second conductive land. | 11-10-2011 |
20110310577 | ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments. | 12-22-2011 |
20120075819 | ELECTRONIC PART AND CONNECTION STRUCTURE OF THE ELECTRONIC PART - An electronic part includes an electronic part body, an electrode terminal that protrudes from the electronic part body, and that electrically connects the electronic part to an external electrode when a flexible conductor is joined to an electrode surface, and a holder made of an insulating material, and joined to the electronic part body. The holder is interposed between a mounting plate and the electronic part body when the electronic part is mounted to the mounting plate, and the holder is in contact with a surface of the electrode terminal opposite from the electrode surface. | 03-29-2012 |
20120081868 | Electronic Assemblies and Methods of Forming Electronic Assemblies - An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate. | 04-05-2012 |
20120087098 | PACKAGE SUBSTRATE - Disclosed herein is a package substrate, including: a printed circuit board having a connection terminal and a conductive adhesive layer formed thereon; components mounted in the connection terminal; wires coupled to the components; a wall printed circuit board coupled to the conductive adhesive layer and configured to cover the components; and a metal cap coupled to an upper end of the wall printed circuit board to cover the components, thereby ensuring firmness and reliability despite external impact. | 04-12-2012 |
20120113609 | Quad flat package with exposed paddle - A quad flat package (QFP) includes a semiconductor chip, a paddle to support the semiconductor chip, a molding portion to surround the semiconductor chip, a plurality of leads formed on four sides of the molding portion, and a plurality of bonding wires to electrically connect the plurality of leads to the semiconductor chip, wherein the paddle is exposed to outside from at least one corner of a lower surface of the molding portion. | 05-10-2012 |
20120120623 | LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME - Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate. | 05-17-2012 |
20120140427 | PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE - A printed circuit board assembly (PCB) assembly is provided, including a printed circuit board (PCB) comprising a plurality of conductive pads and an advanced quad pack no-lead chip (a-QFN) package soldered to the printed circuit board. In one embodiment, the conductive pads have a first surface area and the QFN package includes a plurality of leads facing the conductive pads, having a second surface area, wherein a ratio between the second surface area and the first surface area is about 20% to 85% to ensure a physical connection between the PCB and the a-QFN package. | 06-07-2012 |
20120170237 | SUBSTRATE ASSEMBLY PROVIDED WITH CAPACITIVE INTERCONNECTIONS, AND MANUFACTURING METHOD THEREOF - An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding to the first surface; a second substrate having a second surface, housing a third electrical-interconnection element and a fourth electrical-interconnection element in a position corresponding to the second surface, and provided with a dielectric layer extending on top of the third interconnection element; and a first bump and a second bump made of conductive material, extending between the first electrical-interconnection element and the third electrical-interconnection element and, respectively, between the second electrical-interconnection element and the fourth electrical-interconnection element, at least partially aligned to the respective electrical-interconnection elements, the first bump being ohmically coupled to the first interconnection element and capacitively coupled to the third interconnection element, and the second bump being ohmically coupled to the second interconnection element and to the fourth interconnection element. | 07-05-2012 |
20120170238 | ELECTRONIC DEVICE - An electronic device includes a circuit board, a connector and an electronic module. The connector includes an insulating body and a first terminal set. The insulating body includes a concave. The first terminal set is fastened on the insulating body and is electrically connected to the circuit board. The electronic module is detachably disposed in the concave and includes a second terminal set. The second terminal set contacts the first terminal set to be electrically connected to the circuit board. | 07-05-2012 |
20120176759 | ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad. | 07-12-2012 |
20120188735 | CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings. | 07-26-2012 |
20120188736 | DATA CARRIER FOR CONTACTLESS DATA TRANSMISSION AND A METHOD FOR PRODUCING SUCH A DATA CARRIER - Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-coated prepreg layer. | 07-26-2012 |
20120212917 | Three-Dimensional Stack Structure Of Wafer Chip Using Interposer - The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board. | 08-23-2012 |
20120218727 | SHIELD CASE FOR EMI SHIELDING - Provided is a shield case for electromagnetic interference shielding, including a main body having an opening in a lower surface thereof, wherein at least one portion of an upper surface of the main body is flat for vacuum pickup, and the main body has a box shape and is electrically conductive, a flange extending outward from an edge of the opening and integrally formed with the edge, and a support coupled to the flange to contact at least a lower surface of the flange. The support is adapted for soldering and is electrically conductive. After the main body and the support are mounted on a printed circuit board through a surface mount process, a lower surface of the support is electrically and mechanically connected through solder cream to a conductive pattern of the printed circuit board through a reflow soldering process. | 08-30-2012 |
20120229997 | PRINTED CIRCUIT BOARD - A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component. | 09-13-2012 |
20120243192 | THREE-DIMENSIONAL POWER ELECTRONICS PACKAGES - Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane. | 09-27-2012 |
20120243193 | MOTHERBOARD INTERCONNECTION DEVICE AND MOTHERBOARD INTERCONNECTION METHOD - A motherboard interconnection method includes positioning a first and a third electronic elements on a top layer of a motherboard interconnection device, and positioning a second and a fourth electronic elements on a bottom layer of the motherboard interconnection device. The method connects a first end of the first electronic element on the top layer to the first end of the second electronic element on the bottom layer with a first via hole, and connects the first end of the third electronic element on the top layer to the first end of the fourth electronic element on the bottom layer with a second via hole. The method further connects a second ends of the two electronic elements on the top layer to a first part, and connects the second ends of the two electronic elements on the bottom layer to a second part. | 09-27-2012 |
20120281377 | VIAS FOR MITIGATING PAD DELAMINATION - A signal carrier medium is disclosed including support vias for maintaining laminated portions of the signal carrier medium together. The signal carrier medium includes metal portions such as a contact pad. The metal portions may have one or more adjacent support vias for dissipating stresses which build in the metal portions. | 11-08-2012 |
20120307467 | Oxygen-Barrier Packaged Surface Mount Device - An electrical component includes a plurality of core devices arranged within a housing so as to be electrically isolated from one another. For each of the plurality of core devices, a first contact pad and a second contact pad is formed on an outside surface of the housing. The first and second contact pads are electrically connected to a respective core device of the plurality of core devices. | 12-06-2012 |
20120307468 | ELECTRONIC APPARATUS - An electronic apparatus includes a circuit board on which a plurality of electronic components are mounted, and a housing that is provided on the circuit board. The housing includes a mounting member that mounts the housing on the circuit board. The circuit board includes a plurality of circuit regions, an insulating region, and a mounting region. The plurality of electronic components is included in the plurality of circuit regions. The plurality of circuit regions are spaced from one another. The insulating region is located between adjacent circuit regions of the plurality of circuit regions to insulate between the adjacent circuit regions. In the mounting region, the mounting member is mounted on the circuit board. The mounting region is provided in the insulating region located between the adjacent circuit regions in a state where the housing is mounted on the circuit board. | 12-06-2012 |
20120314391 | CIRCUIT BOARD AND METHOD FOR MAKING THE SAME - A circuit board includes a base board defining a number of via holes, a power supply connection unit, a load connection unit, and at least one capacitor connection unit(s). Each of the at least one capacitor connection unit(s) includes two capacitor connectors, and one of the two capacitor connectors is positioned nearer to the power supply connection unit and farther away from the load connection unit than the other. The via holes are divided into at least one group(s) corresponding to each of the capacitor connection unit(s), and all of the via holes in each of the group(s) are equidistantly positioned along a semicircle arc surrounding the capacitor connector of the capacitor connection unit corresponding to the group that is positioned nearer to the power supply connection unit. | 12-13-2012 |
20130033835 | APPARATUS FOR IMPROVING GROUNDING FOR AN ELECTRICAL COMPONENT AND METHOD OF MAKING SAME - A multi-layer cradle comprises a first layer comprising first and second contact pads configured to be electrically coupled to a signal input and a signal output of the electronic component, respectively. The first layer also comprises a first ground plane configured to be electrically coupled to a ground of the electronic component and a first fence positioned about the first ground plane. The first ground plane is positioned at least between the first and second contact pads. A second layer comprising a second ground plane is also included. The cradle further comprises a first dielectric material positioned between the first and second layers, a ground plane via extending through the first dielectric material and electrically coupled to the first and second ground planes, and a plurality of fence vias extending through the first dielectric material and electrically coupled to the first fence and to second ground plane. | 02-07-2013 |
20130039025 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors. | 02-14-2013 |
20130044449 | CIRCUIT BOARD MOUNTING APPARATUS - A circuit board mounting apparatus comprises a chassis and a securing structure. The chassis comprises a bottom board and two sidewalls located on two opposite sides of the board. The securing structure comprises a reinforcing member and a securing member secured to the reinforcing member. The reinforcing member is secured to the bottom board. The securing member defines a securing hole. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing the circuit board from moving laterally. | 02-21-2013 |
20130063915 | ELECTRONIC DEVICE - An electronic device includes a printed circuit board that a substrate contact part acting as a point of contact with another component is formed on a board surface thereof, a conductive member that has a first contact portion in contact with the substrate contact part, a plate-like extending portion extending from the first contact portion to the outside of the printed circuit board, and a second contact portion formed on a plate surface of the extending portion on the outside of the printed circuit board, and an electrical component that includes a component contact part in contact with the second contact portion and a body part on which the component contact part is formed, and is placed so that the component contact part or at least a part of the body part is opposed to an end face of the printed circuit board. | 03-14-2013 |
20130063916 | Protection for Circuit Boards - A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external contacts so that external access to the external contacts is prohibited by the cover. | 03-14-2013 |
20130070437 | HYBRID INTERPOSER - An interconnection component includes a low coefficient of thermal expansion (“CTE”) element having first and second surfaces defining a thickness, the element consisting essentially of a material having a first CTE of less than 10 parts per million per degree Celsius, the element having a plurality of contacts exposed at a first surface thereof. The component further includes a circuit panel having a dielectric element with first and second surfaces defining a thickness and a plurality of terminals exposed at the first surface, the circuit panel having a thickness greater than 50% of the thickness of the low-CTE element. A bonding layer including a dielectric material bonds the second surfaces of the circuit panel and the low CTE element to one another. Metalized vias are electrically connected with the terminals and the contacts, at least some vias extending through the bonding layer and through the thickness of the low-CTE element. | 03-21-2013 |
20130070438 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact surface and a lower contact surface, the surface area of the extension contact surface being smaller than the surface area of the lower contact surface; and forming a package encapsulation on the substrate, the interposer, and the interposer pad extension, the package encapsulation having a recess exposing the top interposer surface, the interposer pad extension embedded only in the package encapsulation. | 03-21-2013 |
20130077273 | PRINTED CIRCUIT BOARD FOR PROVIDING OPERATION VOLTAGES - A printed circuit board (PCB) includes two power supply units, a central processing unit (CPU), two inductors and a temperature compensation resistor. One of the inductor is electrically connected between one power supply unit and the CPU, the other inductor is electrically connected between another power supply unit and the CPU. The temperature compensation resistor is electrically connected between the power supply units and ground, and is positioned between the two inductors to adjust output voltage from the CPU. | 03-28-2013 |
20130077274 | CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF - A card structure for a socket structure provided with a plurality of first elastic plates and a plurality of second elastic plates is disclosed, and the card structure includes a body, a plurality of first pad portions, and a plurality of second pad portions. The body includes a outer surface. The plurality of first and second pad portions are respectively disposed on the outer surface of the body and corresponding to the plurality of first and second elastic plates of the socket structure and respectively contact the plurality of first and second elastic plates of the socket structure when the card structure is disposed on the socket structure. | 03-28-2013 |
20130100623 | ELECTRONIC DEVICES FOR RF FRONT END SIGNAL PROCESSING - An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier. | 04-25-2013 |
20130107483 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS THEREOF | 05-02-2013 |
20130114223 | SEMICONDUCTOR DEVICE - A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates | 05-09-2013 |
20130114224 | ATTACHMENT OF A CONTROL UNIT FOR A TRANSMISSION CONTROL MODULE TO A CARRIER BOARD - A control unit for a transmission control module of a motor vehicle transmission includes a circuit mounting device and at least one attachment device configured to attach the circuit mounting device to a carrier board. The circuit mounting device includes an electronic circuit and has a first bearing side with which it is configured to be pressed against a second bearing side of the carrier board by the attachment device. The attachment device has at least one attachment element which is connected to the circuit mounting device and protrudes with a first end from the circuit mounting device on the first bearing side. The attachment element is configured to project through an attachment opening in the second bearing side of the carrier board. | 05-09-2013 |
20130120947 | ELECTRICAL DEVICE WITH CONNECTION INTERFACE, CIRCUIT BOARD THEREOF, AND METHOD FOR MANUFACTURING THE SAME - The present invention discloses an electrical device with a connection interface, a circuit board thereof, and a method for manufacturing the same. The electrical device with a connection interface includes: a circuit board on which a first circuit layer and a second circuit layer are formed and the second circuit layer has plural terminal pads, wherein a cavity is formed in the terminal pads and extends to the first circuit layer, and a metal layer is disposed in the cavity and connected to the first circuit layer and the terminal pads and defines an opening; a semiconductor chip electrically connected to the first circuit layer; and a conductive element interlaid in the opening. The electrical device with a connection interface does not need to be formed by assembling a terminal module because the conductive element is directly mounted on the circuit board. | 05-16-2013 |
20130141884 | Electronic Component Structure and Electronic Device - According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions. | 06-06-2013 |
20130148320 | METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF THE COMPONENTS - An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board. | 06-13-2013 |
20130155635 | AUTOMOTIVE ALTERNATOR RECTIFYING APPARATUS - An automotive alternator rectifying apparatus includes a circuit board that connects a positive-side rectifying element mounted to the positive-side heatsink and a negative-side rectifying element mounted to the negative-side heatsink to configure a bridge circuit. The circuit board includes a tubular lead guiding portion that includes a lead insertion aperture; and a terminal that is disposed so as to extend outward in an aperture direction of the lead insertion aperture from an exit edge portion of the lead insertion aperture, and to which is connected a lead that is subject to connection that is inserted through an entrance of the lead insertion aperture and that extends outward from an exit, and the lead insertion aperture is formed such that cross-sectional area thereof becomes gradually smaller from the entrance toward the exit. | 06-20-2013 |
20130170164 | ADHESIVE DAM - On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate. | 07-04-2013 |
20130215586 | WIRING SUBSTRATE - A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line. | 08-22-2013 |
20130223034 | HIGH PERFORMANCE ELECTRICAL CIRCUIT STRUCTURE - A high performance electrical interconnect adapted to provide an interface between terminals on first and second circuit members. The electrical interconnect includes a first circuitry layer with a first surface and a second surface having a plurality of contact pads adapted to electrically coupled with the terminals on the first circuit member. At least one dielectric layer is printed on the first surface of the first circuitry layer. The dielectric layer includes a plurality recesses. A conductive material is deposited in at least a portion of the recesses to create circuit geometry electrically coupled with the first circuitry layer. A second circuitry layer includes a first surface a plurality of contact pads adapted to electrically couple with the terminals on the second circuit member and a second surface attached to the dielectric layers. The circuit geometry electrically couples the first circuitry layer to the second circuitry layer. | 08-29-2013 |
20130242518 | CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD - A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires. | 09-19-2013 |
20130250533 | WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART - A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate. | 09-26-2013 |
20130279134 | PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD - First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings. | 10-24-2013 |
20130286615 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip. | 10-31-2013 |
20130301231 | METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FIXATION OF THE COMPONENTS, AND CORRESPONDING PRODUCTION LINE - A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit. | 11-14-2013 |
20130308286 | METHOD FOR MANUFACTURING ELECTRONIC PART, METHOD FOR TESTING ELECTRONIC PART, SHEET SUBSTRATE, ELECTRONIC PART, AND ELECTRONIC APPARATUS - A manufacturing method according to an embodiment of the invention includes a first step of providing a sheet substrate having a piezoelectric resonator element and an integrated circuit disposed on a mounting surface of each substrate region, having implementation electrodes that are electrically connected to the integrated circuit disposed the side facing away from the mounting surface, and disposing wiring lines on the sheet substrate, the wiring liens electrically connecting the piezoelectric resonator element disposed in a first substrate region to the implementation electrode in a second substrate region in the vicinity of the piezoelectric resonator element, a second step of inputting and outputting a signal to and from the piezoelectric resonator element in the first substrate region via the implementation electrodes connected to the wiring lines, and a third step of dividing the sheet substrate along the substrate regions to cut the wiring lines. | 11-21-2013 |
20130314886 | WIRING BOARD AND MOUNTING STRUCTURE - A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer. | 11-28-2013 |
20130329387 | CIRCUIT BOARD MOUNTING APPARATUS - A circuit board mounting apparatus includes a circuit board, a chassis, and two mounting members. Two slots are defined in a front side of the circuit board. The chassis includes a side plate. The mounting members are fixed to the side plate and respectively connected to the slots of the circuit board. Each of the mounting members includes a hook locked to the circuit board, to perpendicularly fix the circuit board to the side plate. | 12-12-2013 |
20130329388 | MOUNTING STRUCTURE AND MOUNTING METHOD - A mounting structure includes a first ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a first strain amount, and a second ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a second strain amount greater than the first strain amount. The second ceramic electronic component is arranged above the first ceramic electronic component, and the first and second ceramic electronic components are connected to each other via each other's outer electrodes. The first ceramic electronic component to which the second ceramic electronic component is connected is connected to a land on a circuit substrate via the outer electrodes of at least the first ceramic electronic component. | 12-12-2013 |
20130335938 | HIGH-FREQUENCY MODULE - A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided. | 12-19-2013 |
20130343023 | ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME - In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more. | 12-26-2013 |
20140003013 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140003014 | MOUNTING STRUCTURE OF ELECTRIC CHIP DEVICE | 01-02-2014 |
20140003015 | MOUNT BOARD AND ELECTRONIC DEVICE | 01-02-2014 |
20140009899 | WIRING SUBSTRATE - A wiring substrate includes an insulating layer, an upper wiring pattern, and a lower wiring pattern, the wiring patterns sandwiching the insulating layer. The lower wiring pattern includes an interlayer connecting conductor integral therewith and projecting toward the upper wiring pattern for electrical connection to the upper wiring pattern. The interlayer connecting conductor is joined to the upper wiring pattern so as to penetrate into the upper wiring pattern beyond a joining interface between the insulating layer and the upper wiring pattern. Thus, the wiring substrate adaptable for a large current is provided without causing degradation of reliability in connection, which may occur by cracking, disconnection, interlayer peeling-off, etc. | 01-09-2014 |
20140029223 | CIRCUIT BOARD WITH REDUCED ADHESIVE OVERFLOW AND CIRCUIT STRUCTURE THEREOF - A circuit board with reduced adhesive overflow includes a substrate and a conductive layer. The conductive layer is disposed on the substrate. The conductive layer includes a hole, a first placement area and a second placement area. The hole is used for forming a cavity with the substrate. The first placement area is used for the first electronic element to be fixedly connected onto the circuit board through the first contact surface. The second placement area is used for the second electronic element to be fixedly connected onto the circuit board through the second contact surface. An adjacent place of the first placement area and the second placement area and the hole are overlapped. The cavity is used to accommodate the conductive adhesive for fixedly connecting the first electronic element and the second electronic element. | 01-30-2014 |
20140029224 | METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOINT PORTION, PRINTED WIRING BOARD WITH CONNECTING LAYER, AND SHEET-LIKE JOINT MEMBER - An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer. | 01-30-2014 |
20140029225 | ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CONNECTED TOGETHER AND METHODS OF FORMING SUCH ELECTRONIC DEVICES - Electronic devices may include a first substrate bearing circuitry components at a nanoscale pitch within the first substrate. The first substrate may include microscale bond pads on a surface of the first substrate. A via may electrically connect one of the microscale bond pads to one of the circuitry components. A second substrate may be electrically connected to at least one of the microscale bond pads. Methods of forming electronic devices may include positioning a first substrate adjacent to a second substrate. The first substrate may bear circuitry components at a nanoscale pitch within the first substrate. The first substrate may include microscale bond pads on a surface of the first substrate. A via may electrically connect one of the microscale bond pads to one of the circuitry components. The second substrate may be electrically connected to at least one of the microscale bond pads. | 01-30-2014 |
20140036463 | ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF - An apparatus includes a substrate and a plurality of conductive traces formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius. | 02-06-2014 |
20140036464 | Integrated System and Method of Making the Integrated System - A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads. | 02-06-2014 |
20140036465 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via. | 02-06-2014 |
20140043783 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD - Provided is a printed wiring board including a first heat dissipation pattern placed in one surface layer on which a semiconductor package is to be mounted, a second heat dissipation pattern placed in the other surface layer, and an inner layer conductor pattern placed in an inner layer, in which through holes are formed in the printed wiring board; the first heat dissipation pattern has a joint portion which is placed in an opposed region opposed to a heat sink of the semiconductor package and which is joined to the heat sink with solder; at least one of the through holes is placed in the opposed region; and the second heat dissipation pattern is formed in a pattern in which an end portion of a conductor film in the one of the through holes on the other surface layer side is separated. | 02-13-2014 |
20140055968 | Apparatus and Method for Vertically-Structured Passive Components - An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions. | 02-27-2014 |
20140078705 | DISPLAY DEVICE - A display device includes: a display substrate in which a display for displaying an image is formed; an encapsulation substrate, which is assembled on the display substrate and has a first surface facing the display substrate and a second surface opposite to the first surface; and a circuit substrate for transferring an electrical signal to the display, where a plurality of pads, which are electrically connected to the display and connected to the circuit substrate, are formed on the first surface of the encapsulation substrate, and at least one connector is formed on surfaces of the display and the encapsulation substrate which face each other, the connector configured to provide a connection path between the display and the circuit board by being adhesively pressed in a vertical direction. | 03-20-2014 |
20140092572 | BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS - A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed. | 04-03-2014 |
20140098506 | REDUCED PTH PAD FOR ENABLING CORE ROUTING AND SUBSTRATE LAYER COUNT REDUCTION - Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate. | 04-10-2014 |
20140104799 | 3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit. | 04-17-2014 |
20140104800 | PRINTED CIRCUIT BOARD WITH REDUCED EMISSION OF ELECTRO-MAGNETIC RADIATION - A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and a second supply pin electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply. | 04-17-2014 |
20140118977 | WIRING BOARD - A wiring board includes an insulating layer, and an upper wiring pattern and a lower wiring pattern arranged with the insulating layer interposed therebetween. A truncated cone-shaped projection is integral with the lower wiring pattern so as to project at the upper wiring pattern side, and a truncated cone-shaped projection is integral with the upper wiring pattern so as to project at the lower wiring pattern side. Bonding end portions of the projections are bonded to each other to form an inter-layer connection conductor. The inter-layer connection conductor conducts the upper wiring pattern and the lower wiring pattern. | 05-01-2014 |
20140133119 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the fist substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate. | 05-15-2014 |
20140140026 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - Provided is a package substrate and a semiconductor package. The package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves. | 05-22-2014 |
20140146502 | CIRCUIT BOARD MOUNTING APPARATUS - A circuit board mounting apparatus includes a chassis, a circuit board defining two recesses in a front side, two fixing members engaged in the recesses, and two fasteners. The chassis includes a side plate defining two through holes. Each recess is bounded by two sidewalls. A latching slot is defined in each sidewall. A fixing hole is defined in a front side of each fixing member. Two resilient arms are formed at opposite sides of each fixing member, and slantingly extend into the corresponding fixing hole. A projection protrudes from an outer surface of each resilient arm. The fasteners extend through the through holes of the side plate and engage in the fixing holes of the fixing members. The resilient arms are deformed outward by the fasteners, to allow the projections to engage in the corresponding latching slots. Therefore, the circuit board is perpendicularly fixed to the side plate. | 05-29-2014 |
20140146503 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - There is provided a wiring substrate. The wiring substrate includes: a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad. The connection pad includes: a solder layer; and a metal post that is entirely covered by the solder layer, wherein a portion of the solder layer is interposed between the connection pad and the metal post. | 05-29-2014 |
20140146504 | CIRCUIT BOARD, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A circuit board includes at least one core substrate, at least one insulating layer and at least one dielectric sheet. An opening is defined in the insulating layer corresponding to the core substrate. An area of cross-section of the opening is larger than that of the core substrate. The core substrate is received in the opening. The dielectric sheet is positioned on one side surface of the core substrate and the insulating layer. A cavity is defined in the circuit board. A number of pads of the core substrate are exposed via the cavity. The present disclosure also provides a method for manufacturing the circuit board and package structure. | 05-29-2014 |
20140153207 | CIRCUIT BOARD MOUNTING APPARATUS - A circuit board mounting apparatus includes a chassis and a circuit board. The chassis includes a side plate defining a slide slot and a latching hole. A latch protrudes forward from the circuit board, and includes a neck and a latching portion extending left from a front end of the neck. A cutout is defined in a front side of the circuit board. A cantilever extends into the cutout. A hook protrudes forward from the cantilever. The latch extends through the slide slot to allow the neck to abut against a portion of the side plate bounding a left end of the slide slot, and to allow the latching portion to engage with a front side of the side plate. The cantilever resists the hook to engage in the latching hole and abut against a portion of the side plate bounding a right end of the latching hole. | 06-05-2014 |
20140153208 | ADHESIVE MATERIAL FOR ELECTRIC CONNECTION, DISPLAY DEVICE USING THE ADHESIVE MATERIAL AND METHOD OF FABRICATING THE DISPLAY DEVICE - The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant. | 06-05-2014 |
20140160707 | NON-UNIFORM SUBSTRATE STACKUP - Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described. | 06-12-2014 |
20140160708 | LEAD STRUCTURE - A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion. | 06-12-2014 |
20140177194 | DBF FILM AS A THERMAL INTERFACE MATERIAL - A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package. | 06-26-2014 |
20140192498 | DIRECT METALIZATION OF ELECTRICAL CIRCUIT STRUCTURES - An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is plated on surfaces of a plurality of the first recesses to form a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A filler material is deposited in the first conductive structures. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive structures. A conductive material is plated on surfaces of a plurality of the second recesses to form a plurality of second conductive structures electrically coupled to, and extending parallel to the first conductive structures. | 07-10-2014 |
20140211438 | Methods and Apparatus for Transmission Lines in Packages - Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes. | 07-31-2014 |
20140211439 | CIRCUIT ASSEMBLY - A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole. | 07-31-2014 |
20140218885 | Device Including a Semiconductor Chip and Wires - A device includes a carrier, a first semiconductor chip arranged over the carrier and a first electrically conductive element arranged over the carrier. The device further includes a first wire electrically coupled to the first electrically conductive element and a second wire electrically coupled to the first electrically conductive element and to the first semiconductor chip. The first electrically conductive element is configured to forward an electrical signal between the first wire and the second wire. | 08-07-2014 |
20140240938 | CARRIER-LESS SILICON INTERPOSER - An interposer can have conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component can include a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. Conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements. | 08-28-2014 |
20140240939 | METHOD FOR PRODUCING A MICROELECTRONIC DEVICE - The invention concerns a method for producing a microelectronic device comprising a substrate and a stack comprising at least one electrically conductive layer and at least on dielectric layer, wherein it comprises the following steps:
| 08-28-2014 |
20140247573 | PACKAGE SUBSTRATE WITH TESTING PADS ON FINE PITCH TRACES - Some implementations provide a substrate that includes several traces, a solder resist layer covering the several traces, and a testing pad coupled to a trace from the several traces. The testing pad is at least partially exposed and at least partially free of the solder resist layer when a chip is coupled to the substrate. In some implementations, the several traces have a pitch that is 100 microns (nm) or less. In some implementations, the substrate is a package substrate. In some implementations, the package substrate is a package substrate on which a thermal compression flip chip is mounted during an assembly process. In some implementations, the testing pad is free of a direct connection with a bonding component of the chip when the chip is coupled to the substrate. In some implementations, the bonding component is one of a solder ball. | 09-04-2014 |
20140254119 | ANISOTROPIC CONDUCTIVE FILM, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE - An anisotropic conductive film includes an adhesive layer formed of a polymer resin, conductive particles dispersed in the adhesive layer, a support layer disposed at one side of the adhesive layer and maintaining the adhesive layer in a film shape, and a releasing sheet disposed at one side of the support layer. | 09-11-2014 |
20140268611 | System For Applying Power Directly Into Power Connectors For Modular Systems - A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power connector connected to the rear face of the backplane has multiple conductive members. Multiple fasteners each extend through both the daughter board and into the backplane to electrically couple each of the conductive pads of the daughter board to one of the conductive members of the power connector. | 09-18-2014 |
20140268612 | CORELESS SUBSTRATE WITH PASSIVE DEVICE PADS - Embodiments of the present disclosure are directed towards coreless substrates with passive device pads, as well as methods for forming coreless substrates with passive device pads and package assemblies and systems incorporating such coreless substrates. A coreless substrate may comprise a plurality of build-up layers, such as bumpless build-up layers (BBUL). In various embodiments, electrical routing features and passive device pads may be disposed on an outer surface of the substrate. In various embodiments, the passive device pads may be coupled with a conductive element disposed on or within the build-up layers. In various embodiments, an electrical path may be defined in the plurality of build-up layers to route electrical power between the passive device pads and a die coupled to the coreless substrate. | 09-18-2014 |
20140268613 | Apparatus for improved power distribution in an electrical component board - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 09-18-2014 |
20140285989 | METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material. | 09-25-2014 |
20140285990 | CIRCUIT BOARD FOR CONNECTING SECONDARY BATTERY - A circuit board for connecting a secondary battery including a first insulation layer, a conductive layer positioned on one surface of the first insulation layer, and a pad layer positioned on the conductive layer and divided into at least two areas is disclosed. In the circuit board, the conductive layer has an area wider than that of the pad layer. Accordingly, the conductive layer has an area wider than that of the pad layer, so that it is possible to miniaturize the circuit board and to improve the safety of the circuit board. | 09-25-2014 |
20140293563 | MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE - The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface. | 10-02-2014 |
20140293564 | INTERPOSER AND ELECTRONIC COMPONENT PACKAGE - An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer. | 10-02-2014 |
20140293565 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view. | 10-02-2014 |
20140301055 | PRINTED CIRCUIT BOARD INCLUDING THROUGH REGION AND SEMICONDUCTOR PACKAGE FORMED BY USING THE SAME - Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts. | 10-09-2014 |
20140307405 | Dual Interface Module and Dual Interface Card Having a Dual Interface Module Manufactured Using Laser Welding - A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card. | 10-16-2014 |
20140313682 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film. | 10-23-2014 |
20140321087 | INTEGRATED CIRCUIT PACKAGE SUBSTRATE - Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first surface finish on one or more electrical routing features located on a first side of a package substrate and on one or more lands located on a second side of the package substrate, the second side being opposite the first side of the substrate. The method may further include removing the first surface finish on the first side of the package substrate; and depositing a second surface finish on the one or more electrical routing features of the first side. The depositing of the second surface finish may be accomplished by one of a Direct Immersion Gold (DIG) process or an Organic Solderability Preservative (OSP) process. Other embodiments may be described and/or claimed. | 10-30-2014 |
20140321088 | DISPLAY PANEL, ELECTRONIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF - A display panel includes a display configured to display an image by receiving a drive signal, and a pad region including first and second pads groups configured to receive the drive signal from an external and to provide the received drive signal to the display, wherein the first pad group includes a plurality of first pads extending along a plurality of first imaginary lines, wherein the second pad group includes a plurality of second pads extending along a plurality of second imaginary lines, and wherein the plurality of first imaginary lines converges into a first point and the plurality of second imaginary lines converges into a second point, the first point and the second point are located at different positions. | 10-30-2014 |
20140321089 | METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYMER SOLDER MASK AND RELATED DEVICES - A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste. | 10-30-2014 |
20140328039 | SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT - In accordance with one or more aspects, a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate, placing a solder preform in the solder paste deposit, disposing a device on the solder preform and the solder paste deposit, and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects, the substrate is a printed circuit board and the device is an integrated circuit package. | 11-06-2014 |
20140334121 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer PCB comprises vias for power-supply connected to power-supply wiring, vias for ground connected to ground wiring, ball pads for power-supply connected to balls for power-supply connected to power-supply wiring, and ball pads for ground connected to balls for ground connected to ground wiring. The vias for power-supply and the vias for ground are alternately arranged in a first direction. The vias for power-supply and the vias for ground are not alternately arranged in a second direction perpendicular to the first direction. The ball pads for power-supply and the ball pads for ground are alternately arranged in at least one of the first and second directions. Areas where the ball pads for power-supply and the ball pads for ground are provided are arranged on both sides in the second direction of an area where the vias for power-supply and the vias for ground are provided. | 11-13-2014 |
20140340860 | CIRCUIT BOARD AND ELECTRICAL COMPONENTS FOR USE IN AN AGGRESSIVE ENVIRONMENT AND METHOD FOR PRODUCING SUCH A CIRCUIT BOARD - The invention comprises an at least one-layer electrical circuit board ( | 11-20-2014 |
20140340861 | ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CONNECTED TOGETHER AND METHODS OF FORMING SUCH ELECTRONIC DEVICES - Electronic devices may include a first substrate including circuitry components within the substrate, a microscale bond pad on a surface of the substrate, and a via electrically connecting the microscale bond pad to one of the circuitry components. A distance between centers of at least some adjacent circuitry components of the circuitry components may be a nanoscale distance. A second substrate may be electrically connected to the microscale bond pad. Methods of forming electronic devices may involve positioning a first substrate adjacent to a second substrate and electrically connecting the second substrate to a microscale bond pad on a surface of the first substrate. The first substrate may include circuitry components within the first substrate and a via electrically connecting the microscale bond pad to one of the circuitry components. A distance between centers of at least some adjacent circuitry components of the circuitry components may be a nanoscale distance. | 11-20-2014 |
20140347837 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes multiple insulation layers including an outermost insulation layer, a first conductive pattern formed between the insulation layers, a wiring structure positioned in the outermost insulation layer and having multiple first pads such that the first pads are positioned to connect multiple terminals of a first electronic component, respectively, and multiple second pads formed on the outermost insulation layer such that the second pads are positioned to connect terminals of a second electronic component, respectively, and are set at intervals which are greater than intervals of the first pads. | 11-27-2014 |
20140355233 | Harness Assembly - An assembly for physically securing, and providing data and power to, a portable electronic consumer product that has opposed sides that each include one or more protrusions or depressions, where the portable electronic consumer product also has an electrical power input connector and a data input connector. The assembly has first and second separate housing portions that are constructed and arranged to be separably coupled together to thereby define a housing. The first and second housing portions each define one or more protrusions or depressions that complement the depressions or protrusions on a side of the portable electronic consumer product such that the housing forms a tight locational clearance fit with the consumer product when the first and second housing portions are coupled together around the opposed sides of the consumer product. There is a cord assembly that is constructed and arranged to carry electrical power and data, the cord assembly located in part inside the housing. There is a housing power connector that terminates the power carried by the cord assembly, and a housing data connector that terminates the data carried by the cord assembly; these connectors are both carried by the housing. | 12-04-2014 |
20140362550 | SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF - One embodiment of the invention sets forth a packaging system, which includes a first package substrate, an electrically conductive pad formed on a surface of the first package substrate, and a supporting structure formed on the electrically conductive pad. The supporting structure has a top surface and a side surface, and only the top surface of the supporting structure is coupled to a solder joint to establish an electrical connection between the first package substrate and an adjacent, parallel second package substrate. By having the solder joint connected only to the top surface of the supporting structure, the resulting solder joint structure is narrower and taller. Therefore, even if solder joints are placed at a finer pitch, a standoff height between the first and second package substrates can be maintained at a desired height to accommodate a fixed-size IC chip that is disposed between the first and second package substrates. | 12-11-2014 |
20140369015 | WARP COMPENSATED ELECTRONIC ASSEMBLIES - An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA. | 12-18-2014 |
20140376201 | GUARDED PRINTED CIRCUIT BOARD ISLANDS - A device with low dielectric absorption includes a printed circuit board (PCB), a component connection area including a first conductor layered on a top surface of the component connection area and a second conductor layered on a bottom surface of the component connection area, an aperture surrounding the component connection area, a low-leakage component connecting the component connection area to the PCB across the aperture, and a guard composed of a third conductor at least substantially surrounding the aperture on a top surface of the PCB and a fourth conductor at least substantially surrounding the aperture on a bottom surface of the PCB. | 12-25-2014 |
20140376202 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced. | 12-25-2014 |
20150009644 | METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES - A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC. | 01-08-2015 |
20150009645 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes an insulating layer that is an outermost layer of the wiring substrate and includes an external exposed surface, a pad forming part formed on a side of the external exposed surface, and a pad that projects from the external exposed surface. The pad forming part includes a recess part recessed from the external exposed surface, and a weir part that projects from the external exposed surface and encompasses the recess part from a plan view. The pad includes a pad body formed within the recess part and the weir part, and an eave part formed on the weir part. The pad body includes an end part that projects to the weir part. The eave part projects in a horizontal direction from the end part of the pad body. The end part of the pad body includes a flat surface. | 01-08-2015 |
20150016080 | METHOD FOR MANUFACTURING AN EMBEDDED PACKAGE AND STRUCTURE THEREOF - A method for manufacturing an embedded package comprises the steps of: coupling at least one first embedded body including at least one connection port with a first circuit substrate and packaging the first embedded body and the first circuit substrate to form a package; and exposing the connection port of the package on an outer side of the package for other electronic carriers to couple with. The invention can overcome the disadvantage of the conventional System in Package manufacturing process which integrally packages multiple ICs in a same package to result in discard of the entire package because of failure of a single IC. The method of the invention makes assembly simpler, expansion, test and replacement of IC components easier, and also can reduce manufacturing time and accumulated heat, lower the cost and improve yield rate. | 01-15-2015 |
20150022986 | Circuit Assembly and Corresponding Methods - A circuit assembly ( | 01-22-2015 |
20150022987 | ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WITH PROJECTING ELECTRICAL CONNECTION PADS - An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way as to cover a second region situated on the passivation layer surrounding the opening. The periphery of at least one of the first and second regions has an elongate or oblong shape. Centers of the opening and the pad are aligned with each other. | 01-22-2015 |
20150029689 | BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP STRUCTURE MANUFACTURING METHOD - A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide. | 01-29-2015 |
20150036307 | CIRCUIT BOARD - A circuit board is described. The circuit board comprises a substrate ( | 02-05-2015 |
20150043184 | CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE - A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas. | 02-12-2015 |
20150043185 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes. | 02-12-2015 |
20150049448 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a board, a controller, a first line, a second line, and a pad. The board includes a first external terminal and a second external terminal. The controller is on the board. The first line extends between the first external terminal and the controller. The second line extends between the second external terminal and the controller. The pad is to be electrically connected to the second line and to be a part of a waveform adjustment circuit that makes a waveform of a signal flowing through the second line more similar to a waveform of a signal flowing through the first line. | 02-19-2015 |
20150062851 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole. | 03-05-2015 |
20150070863 | LOW PACKAGE PARASITIC INDUCTANCE USING A THRU-SUBSTRATE INTERPOSER - An interposer for a chipset includes multilayer thin film capacitors incorporated therein to reduce parasitic inductance in the chipset. Power and ground terminals are laid out in a staggered pattern to cancel magnetic fields between conductive vias to reduce equivalent series inductance (ESL). | 03-12-2015 |
20150085456 | IMPRINTED MULTI-LEVEL MICRO-WIRE CIRCUIT STRUCTURE - An imprinted multi-level micro-wire structure includes a substrate and a first layer formed over the substrate. The first layer includes first micro-wires formed in first micro-channels imprinted in the first layer. A second layer is formed in contact with the first layer. The second layer includes second micro-wires formed in second micro-channels imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires. | 03-26-2015 |
20150085457 | ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREOF - An electrical connector for electrically connecting a first electronic element having protruding conductive portions in the bottom thereof to a second electronic element, includes an insulating body located below the first and above the second electronic element, a conductor, a solder pad disposed on the lower surface of the insulating body, and a conducting line disposed in the insulating body and conducting the conductor and the solder pad. Upper surface of the insulating body has accommodation holes. Aperture of the accommodation hole is greater than outer diameter of the conductive portion. Wall and bottom of the accommodation holes form the conductor. The accommodation hole has low-melting point liquid metal conductor. When the conductive portion enters the accommodation hole, the liquid metal adheres to the conductive portion, and forms a conductive path between the conductive portion and the conductor. A manufacturing method of the electrical connector. | 03-26-2015 |
20150092371 | CONTACT PAD STRUCTURE, AN ELECTRONIC COMPONENT, AND A METHOD FOR MANUFACTURING A CONTACT PAD STRUCTURE - According to various embodiments, a contact pad structure may be provided, the contact pad structure may include: a dielectric layer structure; at least one contact pad being in physical contact with the dielectric layer structure; the at least one contact pad including a metal structure and a liner structure, wherein the liner structure is disposed between the metal structure of the at least one contact pad and the dielectric layer structure, and wherein a surface of the at least one contact pad is at least partially free from the liner structure, and a contact structure including an electrically conductive material; the contact structure completely covering at least the surface being at least partially free from the liner structure of the at least one contact pad, wherein the liner structure and the contact structure form a diffusion barrier for a material of the metal structure of the at least one contact pad. | 04-02-2015 |
20150092372 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PARALLEL CONDUCTORS AND INTRA-CONDUCTOR ISOLATOR STRUCTURES AND METHODS OF THEIR FABRICATION - Embodiments of devices and methods of their manufacture include coupling first and second package surface conductors to a package surface with an intra-conductor insulating structure between the package surface conductors. The package surface conductors extend between and electrically couple sets of pads that are exposed at the package surface. Elongated portions of the package surface conductors are parallel with and adjacent to each other. The intra-conductor insulating structure is coupled between the package surface conductors along an entirety of the parallel and adjacent elongated portions, and the intra-conductor insulating structure electrically insulates the elongated portions of the package surface conductors from each other. Some embodiments may be implemented in conjunction with a stacked microelectronic package that includes sidewall conductors and an intra-conductor insulating structure between and electrically insulating the sidewall conductors from each other. | 04-02-2015 |
20150092373 | MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY - Various exemplary embodiments relate to a printed circuit board (PCB) comprising a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern; through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads; a solder mask covering the via pad with an opening; a solder pad within said opening electrically connected to said via pad; and a two-lead component attached to said solder pad. | 04-02-2015 |
20150092374 | SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCUIT BOARDS - A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad. | 04-02-2015 |
20150092375 | Transistor arrangement with semiconductor chips between two substrates - An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, and a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface. | 04-02-2015 |
20150092376 | Power Semiconductor Module and Method for Producing a Power Semiconductor Module - A printed circuit board (PCB) has a first, structured metalization arranged on its top side and at least one second metalization arranged below the first metalization in a vertical direction, parallel to the first metalization and insulated therefrom. Also on the PCB top side is a bare semiconductor chip having contact electrodes connected by bonding wires to corresponding contact pads of the first metalization on the PCB top side. A first portion of the contact electrodes and corresponding contact pads carry high voltage during operation. All high-voltage-carrying contact pads are conductively connected to the second metalization via plated-through holes. An insulation layer completely covers the chip and a delimited region of the PCB around the chip, and all high-voltage-carrying contact pads and the plated-through holes are completely covered by the insulation layer. A second portion of the contact electrodes and corresponding contact pads are under low voltages during operation. | 04-02-2015 |
20150098204 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist. | 04-09-2015 |
20150103505 | APPARATUS FOR MAKING CONTACT WITH A DIRECTION-DEPENDENT ELECTRICAL AND/OR ELECTRONIC COMPONENT, AND CORRESPONDING COMPONENT ARRANGEMENT - A device is described for contacting a direction-dependent electrical and/or electronic component that includes a predetermined first number of functions to be contacted, having a basic body and having a predetermined first number of first contact elements that are respectively assigned, according to a predetermined connection assignment, to a function to be contacted, and are situated on the basic body with a predetermined positioning, as well as an associated component system having such a contacting device. The positioning of the first contact elements on the basic body is made rotationally symmetrical about an angle of 90°, so that when there is a rotation of the direction-dependent electrical and/or electronic component by 90°, no different component-based functions lie against one another. | 04-16-2015 |
20150116965 | EMBEDDED BRIDGE STRUCTURE IN A SUBSTRATE - Some novel features pertain to a substrate that includes a first dielectric layer and a bridge structure. The bridge structure is embedded in the first dielectric layer. The bridge structure is configured to provide an electrical connection between a first die and a second die. The first and second dies are configured to be coupled to the substrate. The bridge structure includes a first set of interconnects and a second dielectric layer. The first set of interconnects is embedded in the first dielectric layer. In some implementations, the bridge structure further includes a second set of interconnects. In some implementations, the second dielectric layer is embedded in the first dielectric layer. The some implementations, the first dielectric layer includes the first set of interconnects of the bridge structure, a second set of interconnects in the bridge structure, and a set of pads in the bridge structure. | 04-30-2015 |
20150116966 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal. | 04-30-2015 |
20150116967 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region. | 04-30-2015 |
20150116968 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film. | 04-30-2015 |
20150124419 | Partially Depopulated Interconnection Arrays for Packaged Semiconductor Devices and Printed Circuit Boards - In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnection array having (i) an inner sub-array of locations having connectors arranged in rows and columns separated by a specified pitch and (ii) an outer rectangular ring of locations having connectors arranged in rows and columns separated by the specified pitch. The outer rectangular ring is separated from the inner sub-array by a depopulated rectangular ring having a width of at least twice the specified pitch, wherein the depopulated rectangular ring has no connectors. The outer rectangular ring has empty locations having no connectors. Some of those empty locations define depopulated sets that divide the outer rectangular ring into a number of different contiguous sets of locations having connectors that enable pin escape for connectors of the device's BGA. | 05-07-2015 |
20150124420 | Electronic Device and Method of Fabricating an Electronic Device - An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices. | 05-07-2015 |
20150124421 | ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 05-07-2015 |
20150131249 | Solder Bridging Prevention Structures for Circuit Boards and Semiconductor Packages - A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically conductive traces and pads disposed on the non-conductive substrate, and a solder mask applied to the non-conductive substrate and covering the traces. Metal lines are disposed on the non-conductive substrate under the solder mask and along at least two sides of the pads disposed in corners of the non-conductive substrate, so that a metal line is interposed between the pads in the corners of the non-conductive substrate and each adjacent pad. The metal lines form a raised region in the solder mask along the metal lines which prevents solder bridging in the corners of the non-conductive substrate during solder reflow. A corresponding semiconductor package and semiconductor assembly with such solder bridging prevention structures are also provided. | 05-14-2015 |
20150131250 | SOLDER VOID REDUCTION FOR COMPONENT ATTACHMENT TO PRINTED CIRCUIT BOARDS - A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion. | 05-14-2015 |
20150131251 | PROCESS FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE MEMBER FOR AN ELECTRONIC COMPONENT COMPRISING AN END EQUIPPED WITH A CAVITY - This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim. | 05-14-2015 |
20150138742 | BUTTONED SOLDERING PAD FOR USE WITH FINE-PITCH HOT BAR SOLDERING - A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder. | 05-21-2015 |
20150146397 | WIRING BOARD AND ELECTRONIC DEVICE - There is provided a wiring board capable of strengthening the bonding between an external terminal and a wiring of an external circuit board. A wiring board includes an insulating substrate having two main surfaces facing each other, side surfaces connecting to the two main surfaces and concave portions concave from the side surfaces and connecting to at least one of the two main surfaces; and external terminals disposed from one of the main surfaces to inner surfaces of the respective concave portions, each of the external terminals having a convex-shaped section disposed on one main surface side along each of the concave portions. | 05-28-2015 |
20150296630 | BALL GRID ARRAY MOUNTING SYSTEM - A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball. | 10-15-2015 |
20150305140 | CIRCUIT BOARD REFLOW OF COMPONENTS USING ON BOARD COPPER TRACES AS HEATING ELEMENT - An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. | 10-22-2015 |
20150305149 | PRINTED CIRCUIT BOARD - A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area. | 10-22-2015 |
20150305159 | CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE - A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate. | 10-22-2015 |
20150305210 | Electronic Component Package Structure and Electronic Device - An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved. | 10-22-2015 |
20150311148 | TAPE WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE, AND DISPLAY APPARATUS INCLUDING SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region. | 10-29-2015 |
20150318188 | Substrate Pad Structure - A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads. | 11-05-2015 |
20150318235 | SUBSTRATE, SEMICONDUCTOR PACKAGE THEREOF AND PROCESS OF MAKING SAME - A substrate, a semiconductor package thereof and a process of making the same are provided. The substrate comprises an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned. | 11-05-2015 |
20150319845 | PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD - A main wire | 11-05-2015 |
20150319846 | ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE - There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element. | 11-05-2015 |
20150327367 | CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION - A combined interposer ( | 11-12-2015 |
20150333041 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - One semiconductor device includes a circuit board on which multiple connection pads are formed, a first semiconductor chip that is mounted on the circuit board, a second semiconductor chip that is laminated on the first semiconductor chip and has multiple electrodes, reinforcement plates that are laminated on the second semiconductor chip, and multiple wires that electrically connect the multiple connection pads and the multiple electrodes together, wherein the second semiconductor chip has a laminated area that overlaps with the first semiconductor chip and overhang areas that overhang from the first semiconductor chip, the electrodes are formed in the overhang areas, and the reinforcement plates are laminated on the second semiconductor chip so as to straddle the laminated area and the respective overhang areas of the second semiconductor chip. | 11-19-2015 |
20150334833 | Semi-Finished Product for the Production of a Printed Circuit Board and Method for Producing the Same - In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage. The inventive method for producing a printed circuit board with at least one recessed component, is characterised by the steps of providing at least one conductive layer, structuring said conductive layer to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, leaving at least one passage in the laser-stop device for passing-through the fan-out lines, and applying a cap layer to said conductive layer, the cap layer having an opening in registration with each passage. | 11-19-2015 |
20150334839 | COMPONENT-FIXING METHOD, CIRCUIT SUBSTRATE, AND DISPLAY PANEL - The present invention involves forming wiring sections on a substrate capable of UV-ray transmission, and fixing a component to be electrically connected to the wiring sections onto the substrate using a UV-curable ACF. When doing so, fluidity in the UV-curable ACF is produced by applying pressure to the component, and UV rays are directly projected from the surface of the substrate even onto the UV-curable ACF areas shielded by the wiring sections. The UV-curable ACF is made to be fluid by applying pressure to the component after increasing fluidity of the UV-curable ACF by heating. | 11-19-2015 |
20150340335 | SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICONDUCTOR DEVICE - A semiconductor package includes: a semiconductor integrated circuit; an interlayer film disposed on the semiconductor integrated circuit; a rewiring layer disposed on the interlayer film; post electrodes disposed on the rewiring layer; a protective layer which is disposed on the interlayer film and covers the rewiring layer and the post electrodes; and a plurality of balls which is respectively disposed on the post electrodes and is connected to the rewiring layer, wherein balls existing on a wiring path of internal wirings connected to inner lands of a plurality of lands, which is arranged on a printed circuit board substrate to face the plurality of balls and is connectable to the plurality of balls, are non-connected to the rewiring layer. | 11-26-2015 |
20150342047 | CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD - Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc. | 11-26-2015 |
20150371780 | COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THEREOF - A composite electronic component may include a composite body including a capacitor and an inductor coupled to each other; an input terminal formed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal formed on the second end surface of the composite body and connected to the first internal electrode of the capacitor; and a ground terminal formed on a first end surface of the capacitor in the composite body. The capacitor may be coupled to a side surface of the inductor, and the sum of ratio of lengths of a short axis to a long axis of the coil part is 0.7 to 1.0. | 12-24-2015 |
20150371781 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor. | 12-24-2015 |
20150373846 | WIRING BOARD, AND ELECTRONIC DEVICE - A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode. | 12-24-2015 |
20150373849 | PACKAGE SUBSTRATE STRUCTURE - A package structure includes a selective-electroplating epoxy compound, a first patterned circuit layer, second patterned circuit layers, metal studs, contact pads and conductive vias. The selective-electroplating epoxy compound includes cavities, a first surface and a second surface. The cavities disposed on the first surface in array arrangement. The selective-electroplating epoxy compound is formed by combining non-conductive metal complex. The metal studs are disposed in the cavities respectively and protruded from the first surface. The first patterned circuit layer is directly disposed on the first surface. The selective-electroplating epoxy compound exposes a top surface of the patterned circuit layer. The top surface is lower than or coplanar with the first surface. The second patterned circuit layers are directly disposed on the second surface. The conductive vias are disposed at the selective-electroplating epoxy compound to electrically connect the second patterned circuit layers to the corresponding metal studs. | 12-24-2015 |
20150373854 | ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, AND CIRCUIT BOARD - A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member. | 12-24-2015 |
20150382463 | PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE, AND METHOD OF FABRICATING THE SAME - A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side. | 12-31-2015 |
20150382467 | PACKAGE STRUCTURE - A package structure, including: a circuit board, including a first surface and a second surface opposite to the first surface, where the circuit board possesses multiple carrying units arranged in a matrix form, each of which possesses multiple input pads on the first surface and multiple output pads on the second surface, where the input pads and the output pads are interconnected electrically; a pre-packaged panel, including a first encapsulation layer, which possesses multiple integrating units arranged in a matrix form, wherein each of the integrating units possesses at least one semiconductor chip with multiple first pads, where first metal bumps are disposed on the first pads; wherein the pre-packaged panel is mounted on the first surface; a filling layer, filling a space between the first surface and the pre-packaged panel; and second metal bumps, disposed on the output pads. Accordingly, the package structure improves package efficiency. | 12-31-2015 |
20150382468 | WIRING BOARD HAVING ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME - A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces between the electrical isolator/metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal films on the electrical isolator, the metal posts and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts. | 12-31-2015 |
20160007439 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor. | 01-07-2016 |
20160007443 | CIRCUIT BOARD DEVICE AND CIRCUIT BOARD DEVICE FOR REDUCING ACOUSTIC NOISE - A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other. | 01-07-2016 |
20160007459 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME - A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads. | 01-07-2016 |
20160007463 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor. | 01-07-2016 |
20160014886 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME | 01-14-2016 |
20160014898 | PRINTED WIRING BOARD | 01-14-2016 |
20160014901 | AN ELECTRONIC SUB-ASSEMBLY, A METHOD FOR MANUFACTURING THE SAME, AND A PRINTED CIRCUIT BOARD WITH ELECTRONIC SUB-ASSEMBLY | 01-14-2016 |
20160014902 | Miniaturized Multi-Part Component and Method for Producing Same | 01-14-2016 |
20160021748 | WIRING BOARD STRUCTURE AND METHOD OF MANUFACTURING WIRING BOARD STRUCTURE - A wiring board structure includes: a first wiring board includes a first interconnection and a second interconnection constituting a power supply route; a second wiring board mounted over the first wiring board and includes a third interconnection electrically coupled to the first interconnection; a semiconductor chip mounted over the second wiring board and electrically coupled to the third interconnection; a lid mounted over the second wiring board and electrically coupled to the semiconductor chip; and a coupler electrically couples the lid and the second interconnection to each other. | 01-21-2016 |
20160027594 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction. | 01-28-2016 |
20160029486 | SOLDER JOINT STRUCTURE AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME - A solder joint structure may include a first active surface on which a plurality of connection terminals are provided, a second active surface on which a plurality of bonding pads are provided, and a plurality of solder bonding portions bonded to the connection terminals and the bonding pads. A bonding area between the connection terminal and the solder bonding portion may be smaller than a bonding area between the bonding pad and the solder bonding portion. | 01-28-2016 |
20160029491 | SEMICONDUCTOR DEVICE - This semiconductor device ( | 01-28-2016 |
20160037643 | ARRAY RESISTOR AND SEMICONDUCTOR MODULE - A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module board, the plurality of array resistors including at least a first array resistor. The first array resistor may include a substrate comprising a top surface, a bottom surface opposite the top surface, and first to fourth side surfaces connecting the top surface to the bottom surface, the first and third side surfaces being opposite each other, and the second and fourth side surfaces being opposite each other; a plurality of first electrodes disposed on the first side surface of the substrate, each first electrode including at least a first portion on the first side surface of the substrate and a second portion on the bottom surface of the substrate; a plurality of second electrodes disposed on the third side surface of the substrate, each second electrode opposite a respective first electrode and including at least a first portion on the third side surface of the substrate and a second portion on the bottom surface of the substrate; for each pair of respective first and second electrodes opposite each other, a resistor disposed on the substrate between the respective first and second electrodes; and at least one third electrode disposed on the second side surface of the substrate, the third electrode including at least a first portion on the second side surface of the substrate and a second portion on the bottom surface of the substrate. Each of the first electrodes, the second electrodes, and the third electrode may be bonded to the module board. | 02-04-2016 |
20160037644 | WIRING BOARD - In the wiring board of the present invention, the land pattern for power supply, connected to the semiconductor element connection pad for power supply through a via conductor and arranged below the segment region, includes a strip-shaped continued portion in the position corresponding to the outer peripheral portion except the outer peripheral side of the mounting portion in the segment region, and the strip-shaped continued portion and the power supply plane arranged therebelow are connected through a via conductor. | 02-04-2016 |
20160050750 | BIODEGRADABLE MATERIALS FOR MULTILAYER TRANSIENT PRINTED CIRCUIT BOARDS - The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. | 02-18-2016 |
20160056099 | INTEGRATED CIRCUIT WITH ON-DIE DECOUPLING CAPACITORS - A semiconductor device has an on-die decoupling capacitor that is shared between alternative high-speed interfaces. A capacitance pad is connected to the decoupling capacitor and internal connection pads are connected respectively to the alternative interfaces. Internal connection bond wires connect the decoupling capacitor to the selected interface through the capacitance pad and the internal connection pads in the same process as connecting the die to external electrical contacts of the device. | 02-25-2016 |
20160057855 | Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering - One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy. | 02-25-2016 |
20160057861 | METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS - An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed. | 02-25-2016 |
20160064356 | SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER - A method of making an integrated circuit package, such as a ball grid array, includes providing a flexible tape that has first and second sets of bond pads on respective first and second surfaces thereof. A carrier is attached to the first surface of the flexible tape. Then conductive pillars are formed on the second set of bond pads and an intermediate layer of polymeric compound is deposited on the second surface of the flexible tape. After the compound has cured, a surface of the intermediate layer is ground to expose ends of the conductive pillars to form a sub-assembly comprising the flexible tape and the intermediate layer. Then the carrier is removed from the sub-assembly, thereby creating an interposer. The interposer is attached to a substrate and at least one die is attached to the interposer. | 03-03-2016 |
20160066406 | ELECTRONIC MODULE AND FABRICATION METHOD THEREOF - An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed. | 03-03-2016 |
20160066414 | PATTERNED GROUNDS AND METHODS OF FORMING THE SAME - A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element. | 03-03-2016 |
20160066421 | SOLDER PASTE AND ELECTRONIC PART - A solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent. | 03-03-2016 |
20160073491 | NETWORK COMMUNICATION DEVICE - A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length. | 03-10-2016 |
20160073503 | STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF - A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band. | 03-10-2016 |
20160073504 | Electronic Control Device - The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns ( | 03-10-2016 |
20160095209 | PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFFENERS - Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates. | 03-31-2016 |
20160095219 | PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME - A printed wiring board includes a main wiring board having a main wiring pattern, and a sub wiring board mounted to the main board and having a sub wiring pattern such that the sub pattern electrically connects first and second electronic components, first conductor pads positioned to connect the first component to the main board and the sub board and having surfaces such that the first component is mounted onto the surfaces of the first pads via solder bumps, and second conductor pads positioned to connect the second component to the main board and the sub board and having surfaces such that the second component is mounted onto the surfaces of the second pads via solder bumps. The first and second pads are formed such that the surfaces of the first and second pads are formed on the same plane and have the same shape and the same size. | 03-31-2016 |
20160100500 | UNIVERSAL SERIAL BUS CONTROLLER AND WIRING SUBSTRATE - A universal serial bus controller and host are adapted for being electrically connected to a universal serial bus device. The universal serial bus host includes: a wiring substrate including a plurality of first substrate contacts and a plurality of second substrate contacts; a universal serial bus connecting port disposed on the wiring substrate via the first substrate contacts; and the universal serial bus controller including a plurality of pins electrically connected to the wiring substrate via the second substrate contacts. The universal serial bus controller and the host can decrease interferences among signals and avoid the complicated layout of the wiring substrate. | 04-07-2016 |
20160105959 | PAD ELECTRODE STRUCTURE, FLAT DISPLAY APPARATUS COMPRISING THE PAD ELECTRODE STRUCTURE, AND THE METHOD OF MANUFACTURING THE FLAT DISPLAY APPARATUS - A pad electrode structure including a substrate, an insulating layer on the substrate, a pad electrode on a portion of the insulating layer, and an organic insulating layer on the pad electrode and having an opening exposing an upper surface of the pad electrode, wherein an insertion area is in the insulating layer near the substrate, and wherein the organic insulating layer is separated from an end portion of the substrate, and a portion of the organic insulating layer is in the insertion area. | 04-14-2016 |
20160105983 | Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board - In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board. | 04-14-2016 |
20160105984 | Power Unit with Conductive Slats - In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board. | 04-14-2016 |
20160111391 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness. | 04-21-2016 |
20160113141 | INDUCTOR - An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height. | 04-21-2016 |
20160133386 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths. | 05-12-2016 |
20160141234 | INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEABLE LAYER - An integrated device package includes a base portion, a redistribution portion, a first die and a second die. The base portion includes a photo imageable layer, a bridge that is at least partially embedded in the photo imageable layer, and a set of vias in the photo imageable layer. The bridge includes a first set of interconnects comprising a first density. The set of vias includes a second density. The redistribution portion is coupled to base portion. The redistribution portion includes at least one dielectric layer, a second set of interconnects coupled to the first set of interconnects, and a third set of interconnects coupled to the set of vias. The first die is coupled to the redistribution portion. The second die is coupled to the redistribution portion, where the first die and the second die are coupled to each other through an electrical path that includes the bridge. | 05-19-2016 |
20160143133 | PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD - A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less. | 05-19-2016 |
20160143137 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE - There are provided a printed circuit board, a method of manufacturing the same, and an electronic component module. The printed circuit board comprises a first circuit layer; a first insulating layer formed to cover a portion or all of the first circuit layer; a second circuit layer formed on the first insulating layer; a second insulating layer formed on an overall surface of the board so as to cover the first circuit layer and the second circuit layer; and a third circuit layer formed in the second insulating layer. The second circuit layer has a circuit pattern of a fine pitch as compared to the first circuit layer and the third circuit layer. | 05-19-2016 |
20160148854 | PACKAGING SUBSTRATE WITH BLOCK-TYPE VIA AND SEMICONDUCTOR PACKAGES HAVING THE SAME - A packaging substrate includes a core layer having a first surface and a second surface. A group of ground pads is disposed on the second surface within a central region. A group of first power pads is disposed on the second surface within the central region. A plurality of signal pads is disposed on the second surface within a peripheral region that encircles the central region on the second surface. A first block-type via is embedded in the core layer within the central region. The group of ground pads is electrically connected to the first block-type via. A second block-type via is embedded in the core layer within the central region. The group of first power pads is electrically connected to the second block-type via. | 05-26-2016 |
20160148899 | METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUIT DEVICE, AND CIRCUIT DEVICE - A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures. | 05-26-2016 |
20160150650 | PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME - Disclosed are an electronic component-embedded printed circuit board and a method of manufacturing the same. An electronic component-embedded printed circuit board includes a laminated structure comprising resin insulation layers and conductive layers laminated alternately, a via formed in the resin insulation layers and electrically connecting the conductive layers to one another, a plurality of connection terminals formed on one surface of the laminated structure, a cavity formed on the other surface of the laminated structure, and an electronic component inserted in the cavity, and a depressed portion in which a surface of the electronic component exposed through an opening of the cavity is depressed in comparison to the other surface of the laminated structure. | 05-26-2016 |
20160157345 | WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC COMPONENT DEVICE | 06-02-2016 |
20160172286 | SEMICONDUCTOR PACKAGE, MODULE SUBSTRATE AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME | 06-16-2016 |
20160181192 | HIGH-TEMPERATURE CYCLING BGA PACKAGING | 06-23-2016 |
20160183369 | LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL | 06-23-2016 |
20160183377 | DIELECTRIC FILMLESS ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME | 06-23-2016 |
20160192471 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part. | 06-30-2016 |
20160192489 | POWER SUPPLY BOARD - A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a plurality of first through holes and a plurality of second through holes capable of being electrically connected with the processor by penetrating through the first board from the top surface to the bottom surface; a second board arranged at a position distant from the bottom surface of the first board and provided with a power supply device; a first conductor mounted on the bottom surface of the first board and electrically connects the plurality of first through holes and the power supply device, and a second conductor mounted on the bottom surface of the first board and electrically connects the plurality of second through holes and the power supply device. | 06-30-2016 |
20160192496 | CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME - A contact pad includes a solder-wettable porous network ( | 06-30-2016 |
20160192498 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT - A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection. | 06-30-2016 |
20160197051 | Chip And Electronic Device | 07-07-2016 |
20160205782 | PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME | 07-14-2016 |
20160205785 | METHOD FOR POSITIONALLY STABLE SOLDERING | 07-14-2016 |
20160255728 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND SOLDER MOUNTING METHOD | 09-01-2016 |
20160380606 | VERTICAL MAGNETIC BARRIER FOR INTEGRATED ELECTRONIC MODULE - An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components. | 12-29-2016 |
20160381801 | CONNECTION BODY AND CONNECTION BODY MANUFACTURING METHOD - Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate. | 12-29-2016 |
20170236803 | INTEGRATED CIRCUIT DIES WITH THROUGH-DIE VIAS | 08-17-2017 |
20180027655 | MOUNTING OF COMPONENTS ON A PRINTED CIRCUIT BOARD | 01-25-2018 |
20190150334 | FINE PITCH COMPONENT PLACEMENT ON PRINTED CIRCUIT BOARDS | 05-16-2019 |