Class / Patent application number | Description | Number of patent applications / Date published |
361765000 | By direct coating of components on board | 20 |
20080298031 | SHAPED INTEGRATED PASSIVES - Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy. | 12-04-2008 |
20090244866 | Circuit Device - The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The first receiving inductor is located in a region overlapping the first transmitting inductor through the first insulating layer. The first receiving inductor is constituted of a helical conductive pattern, and generates a received signal corresponding to the transmitted signal input to the first transmitting inductor. The second receiving inductor is connected in series to the first receiving inductor, and constituted of a helical conductive pattern. The second receiving inductor generates a voltage in an opposite direction to that generated by the first receiving inductor, in response to a magnetic field of the same direction. | 10-01-2009 |
20090316374 | Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications - A method including forming a layer of a first ceramic material on a substrate; and after forming the layer, forming a second ceramic material on the layer of the first ceramic material, the formed second ceramic material including an average grain size less than a grain size of the first ceramic material. An apparatus including a first electrode; a second electrode; and a sintered ceramic material, wherein the ceramic material comprises first ceramic grains defining grain boundaries therebetween and second ceramic grains having an average grain size smaller than a grain size of the first ceramic grains. A system including a device including a microprocessor, the microprocessor coupled to a circuit board through a substrate, the substrate including a capacitor structure formed on a surface, the capacitor structure including a first electrode, a second electrode, and a sintered ceramic material disposed between the first electrode and the second electrode. | 12-24-2009 |
20100014262 | MODULE WITH EMBEDDED ELECTRONIC COMPONENTS - In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions. | 01-21-2010 |
20110090658 | PROTECTIVE CIRCUIT BOARD COVER - A protective, anti-tamper coating and methods of coating creation and application are provided. The coating may include an elastomeric layer to allow for strippability/removal. The coating may also include a “smart layer” for tamper detection, imaging prevention, and tamper prevention or underlying device de-activation/alteration upon tamper detection. The coating may also include one or more ground planes around the smart layer and one or more frangible layers designed to interrupt or alter smart layer function in the event of a tamper attempt. | 04-21-2011 |
20110110057 | CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME - A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules. | 05-12-2011 |
20120044659 | COMPLIANT PRINTED CIRCUIT PERIPHERAL LEAD SEMICONDUCTOR PACKAGE - A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive material is printed in the first recesses to form contact members accessible along a first surface of the compliant printed circuit. At least one semiconductor device is located proximate the first surface of the compliant printed circuit. Wirebonds electrically couple terminals on the semiconductor device to the contact members. Overmolding material seals the semiconductor device and the wirebonds to the first surface of the compliant printed circuit. Contact pads on a second surface of the compliant printed circuit are electrically coupled to the contact members. | 02-23-2012 |
20120099285 | LAMINATED SUBSTRATE WITH COILS - A substrate for chip packaging includes a laminated board made of a plurality of ferrite sheets and a coil component disposed on the board. The coil component includes a first coil conductor, a second coil conductor, and a first via-hole conductor. The first coil conductor is disposed on a surface of a first sheet of the board. The second coil conductor is disposed on a surface of a second sheet of the board. The first via-hole conductor includes a first through hole formed at the first sheet and a first conductor filled in the first through hole. The substrate further includes a top surface having a plurality of first conductive pads, and a bottom surface having a plurality of second conductive pads. Each of the first conductive pads is electrically connected with each of the second conductive pads. | 04-26-2012 |
20140036462 | Multiple Surface Integrated Devices on Low Resistivity Substrates - The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first electrically-conductive device component disposed over a first surface. An intermediate electrically-insulating layer may be disposed between the electrically-conductive component and the low resistivity substrate. A second electrically-conductive component is disposed over the second surface of the low resistivity substrate. A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material. One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component to form a device. Exemplary devices include inductors, capacitors, antennas and active or passive devices incorporating such devices. Vertically integrated device systems can be formed using the device. | 02-06-2014 |
20140160706 | MONOLITHICALLY INTEGRATED RF SYSTEM AND METHOD OF MAKING SAME - Radio frequency system ( | 06-12-2014 |
20140204550 | MODULE BOARD - A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO | 07-24-2014 |
20140268610 | METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD - A method for forming vias in a multilayered printed circuit board is disclosed, which includes providing a multilayered printed circuit board having at least two or more layers; placing a donut pad on an upper layer of at least one layer of the multilayered printed circuit board for forming a via through one or more of the layers of the multilayered printed circuit board, the donut pad having a clearance of less than approximately 80 to 90 percent of a diameter of the via; and forming at least one via through the donut pad and at least one or more layers of the multilayered printed circuit board. | 09-18-2014 |
20150077961 | CONTROLLED IMPEDANCE PCB ENCAPSULATION - The present invention discloses methods and devices for encapsulating PCBs, assemblies of PCBs, and their electronic components. The encapsulation methods disclosed can be used to produce electromagnetic shields whose impedance is controlled. | 03-19-2015 |
20150092370 | MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS - A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate. | 04-02-2015 |
20150124418 | EMBEDDED LAYERED INDUCTOR - An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer. | 05-07-2015 |
20160007462 | METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES - A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing. | 01-07-2016 |
20160163613 | ELECTRONIC APPARATUS - An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin. | 06-09-2016 |
20160192485 | ELECTRONIC ENTITY WITH COUPLING INTEGRATED BETWEEN A MICROCIRCUIT AND AN ANTENNA AND METHOD OF FABRICATION - An electronic entity includes a module formed of a support film carrying, on an internal face, a microcircuit and a first coupling coil, and a body including a cavity in which this module is fixed, the support film having an external surface running at least approximately alongside an upper surface of this body, and containing an antenna and a second coupling coil connected to this antenna and intended for the coupling of the antenna with the microcircuit by electromagnetic coupling with the first coupling coil; this second coupling coil (likewise may be the case for the antenna and the first coupling coil) is formed on a thickness of at most a few microns in a plane situated, with respect to the upper surface of the body, at a distance of less than half the distance with respect to the surface opposite from this upper surface of this body. | 06-30-2016 |
361766000 | Capacitor and resistor | 2 |
20080253097 | INTERPOSER - An interposer is constructed with a substrate body having first and second through-holes, a capacitor formed by a laminating dielectric layer and a second electrode portion on a first electrode portion, which is structured on inner surfaces of first and second through-holes and on the first surface of the substrate body. An insulation layer is formed by filling insulation material in the space within the first through-hole surrounded by second electrode portion, and a first post passes through the insulation layer, one end being electrically connected to the first electrode portion, while the first post is electrically insulated from the second electrode portion. Furthermore, a second post is formed in the second through-hole, and is connected to the second electrode portion at its peripheral surface while being electrically insulated from the first electrode portion. | 10-16-2008 |
20100118502 | PRINTED CIRCUIT BOARD - Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large. | 05-13-2010 |