Class / Patent application number | Description | Number of patent applications / Date published |
361764000 | Integrated circuit | 68 |
20080273314 | PCB having embedded IC and method for manufacturing the same - A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated circuit arranged in a first insulating layer as one of the insulating layers so as to be embedded in the multi-layer PCB, the first integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the first integrated circuit; and a second integrated circuit stacked on a lower surface of the first integrated circuit, the second integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the second integrated circuit. | 11-06-2008 |
20090027863 | Method for making a semiconductor multipackage module including a processor and memory package assemblies - A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multi-package module substrate. In some embodiments the memory packages include stacked die packages, and in some embodiments the memory packages include stacked memory packages. In some embodiments the processor is situated at or near the center of the multi-package module substrate and the plurality of memory packages or of stacked memory package assemblies are situated on the multi-package module substrate adjacent the processor. | 01-29-2009 |
20090067143 | ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure. | 03-12-2009 |
20090091904 | Circuit Module and Radio Communications Equipment, and Method for Manufacturing Circuit Module - An electronic component | 04-09-2009 |
20090154124 | MICROWAVE CHIP SUPPORTING STRUCTURE - The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer. | 06-18-2009 |
20090231820 | CAPACITOR-INCORPORATED PRINTED WIRING BOARD AND ELECTRONIC COMPONENT - A printed wiring board includes an insulating layer and a capacitor including a ceramic high dielectric layer, a first electrode and a second electrode, the high dielectric layer being interposed between the first and second electrodes. A plurality of resin insulating layers are formed on the insulating layer and include an upper resin insulating layer provided on a first electrode side of the capacitor, and a lower resin insulating layer provided on a second electrode side of the capacitor. A semiconductor device mounting pad includes a first pad and a second pad, the semiconductor device mounting pad being formed on an outermost resin insulating layer of the resin insulating layers, and a first via conductor is formed in at least one of the resin insulating layers to electrically connect the first pad with the first electrode. A second via conductor is formed in at least another one layer of the resin insulating layers to electrically connect the second pad with the second electrode, and an underfill covered area covered with an underfill resin is provided between the semiconductor device and the printed wiring board. The underfill covered area is provided on a surface of the printed wiring board facing the semiconductor device. When the underfill covered area is projected along a lamination direction of the resin insulating layers to a face on which the high dielectric layer is formed, the underfill covered area is larger than an area in which the high dielectric layer is formed. The capacitor is located under the underfill covered area. | 09-17-2009 |
20090244865 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board having an electronic component housed therein includes forming a first conductor circuit on a first surface of a substrate. A first alignment mark is formed on the first surface of the substrate separate from the conductor circuit and forming a through bore in the substrate, the through bore extending from the first surface of the substrate to a second surface of the substrate. A seal member is disposed on the second surface of the substrate, the seal member sealing an opening on the second surface of the through bore to provide a sealed through bore. An electronic component is inserted in the sealed through bore using the first alignment mark on the first surface of the substrate. | 10-01-2009 |
20090268418 | PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT - Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof. | 10-29-2009 |
20090316373 | PCB having chips embedded therein and method of manfacturing the same - Provided is a PCB having chips embedded therein, the PCB including a first core substrate that has a first chip embedded therein, the first chip having a plurality of first pads provided on the top surface thereof, and first circuit patterns provided on both surfaces thereof; a second core substrate that is disposed under the first core substrate so as to be spaced at a predetermined space from the first core substrate and has a second chip embedded therein, the second chip having a plurality of second pads provided on the bottom surface thereof, and second circuit patterns provided on both surfaces thereof; a first insulating layer that is laminated on the first core substrate and has a plurality of first conductive bumps formed therein, the first conductive bumps passing through the first insulating layer and being connected to the first circuit patterns and the first pads; a second insulating layer that is laminated between the first core substrate and the second core substrate and has a plurality of second conductive bumps formed therein, the second conductive bumps passing through the second insulating layer and connecting the first circuit patterns to the second circuit patterns; and a third insulating layer that is laminated under the second core substrate and has a plurality of third conductive bumps formed therein, the third conductive bumps passing through the third insulating layer and being connected to the second circuit patterns and the second pads. | 12-24-2009 |
20100002405 | PACKAGE SUBSTRATE STRUCTURE - A package substrate structure includes: a substrate having a first surface and an opposing second surface and characterized by a plurality of wire-bonding pads provided on the first surface of the substrate, a plurality of ball-implanting pads provided on the second surface of the substrate, and at least a cavity formed to penetrate the first and second surfaces of the substrate; a metal board mounted on the second surface of the substrate and covering the cavity, wherein the metal board has a thickness greater than that of the ball-implanting pads and has an area greater than that of the cavity; and solder masks disposed on the first and second surfaces of the substrate respectively and having at least a solder-mask cavity corresponding in position to the cavity of the substrate, the solder masks further having a plurality of openings for exposing the wire-bonding pads, the ball-implanting pads and the metal board. | 01-07-2010 |
20100002406 | CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN - A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole and having a first active surface and an opposing second active surface, wherein first electrode pads comprising signal pads, power pads, and ground pads are provided on the first active surface; a first dielectric layer provided on the first surface of the core board and the first active surface of the semiconductor chip and configured to fill a gap between the through-hole and the semiconductor chip so as to secure the semiconductor chip in position to the through-hole; and a first circuit layer disposed in the first dielectric layer so as to be flush with the first dielectric layer, provided with first conductive vias disposed in the first dielectric layer, and electrically connected to the first electrode pads. | 01-07-2010 |
20100053920 | PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUCTOR COMPONENT AND METHOD FOR FABRICATING THE SAME - A packaging substrate with an embedded semiconductor component and a method of fabricating the same are provided, including: fixing a semiconductor chip with electrode pads to an assisting layer with apertures through an adhesive member, wherein each of the electrode pads has a bump formed thereon, each of the apertures is filled with a filling material, and the bumps correspond to the apertures, respectively; forming a first dielectric layer on the assisting layer to encapsulate the semiconductor chip; removing the bumps and the filling material to form vias; and forming a first wiring layer on the first dielectric layer and forming first conductive vias in the vias to provide electrical connections between the electrode pads and the first wiring layer, wherein the first wiring layer comprises a plurality of conductive lands formed right on the first conductive vias, respectively. | 03-04-2010 |
20100061070 | FOLDING USB DRIVE - Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device. | 03-11-2010 |
20100103635 | SINGLE-LAYER COMPONENT PACKAGE - A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer. | 04-29-2010 |
20100118501 | Integrated inductor - An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein. | 05-13-2010 |
20100128450 | SOLVENT SOFTENING TO ALLOW DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly. | 05-27-2010 |
20100134993 | ELECTRONIC COMPONENT, CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug. | 06-03-2010 |
20100177490 | COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF MANUFACTURING - Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture. | 07-15-2010 |
20100328915 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer. | 12-30-2010 |
20110085310 | SPACE SAVING CIRCUIT BOARD - The present invention is a circuit board with precision clearance holes that accommodate components that are attached to the circuit board. The components are mounted in an inverted position so that the component contacts are still connected to the top side of the circuit board and the body of the component fits substantially within the precision clearance hole. | 04-14-2011 |
20110149539 | BASE PLATE FOR USE IN A MULTI-CHIP MODULE - A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips. | 06-23-2011 |
20110279989 | PREPARATION OF MOULDED BODY WITH ELECTRIC CIRCUIT - The invention is directed to a method for preparing a moulded body comprising an integrated electric circuit, to a body comprising an integrated electric circuit, and to a device comprising the body. The method of the invention comprises—placing one or more electrical components in a mould and fixing the one or more electrical components; —at least partially moulding said body using a moulding material; —providing a conductive pattern onto said at least partially moulded body; —providing one or more conductive interconnections onto said at least partially moulded body; and—optionally further moulding said body, wherein the at least partially moulding of said body, the provision of the conductive pattern, and the provision of the one or more conductive interconnections are carried out within said mould. | 11-17-2011 |
20110317383 | MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material. | 12-29-2011 |
20110317384 | PRINTED BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT - An IC which includes a first circuit and a plurality of first paired terminals each including a first power supply terminal and a first GND terminal which are connected to the first circuit, and a second circuit and a plurality of second paired terminals each including a second power supply terminal and a second GND terminal which are connected to the second circuit. The first and second paired terminals are isolated inside. A printed board with the IC mounted has an inductor which is provided in a route that guides a wiring line from the first GND terminal to the second GND terminal and the GND of the printed board. The printed board has a portion where each of the first GND terminals is arranged inside the terminal array of the IC. The inductor suppresses a high-frequency potential variation generated by the operation of the first circuit. | 12-29-2011 |
20120008294 | PRINTED CIRCUIT BOARDS WITH EMBEDDED COMPONENTS - Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices. | 01-12-2012 |
20120069537 | INTEGRATED CIRCUIT WITH INTRA-CHIP CLOCK INTERFACE AND METHODS FOR USE THEREWITH - An integrated circuit includes a substrate. A first integrated circuit die includes a first circuit and a first intra-chip clock interface that transmits a first clock signal via the substrate. A second integrated circuit die includes a second circuit that operates based on the first clock signal and a second intra-chip clock interface that recovers the first clock signal from the substrate. | 03-22-2012 |
20120134125 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process. | 05-31-2012 |
20130010444 | CHIP PACKAGE - A chip package includes a circuit board, a chip, and wires. The circuit board includes a metal layer, a middle layer formed on the metal layer, and a wire pattern layer formed on the middle layer. The metal layer is configured to be grounded. A through hole is defined through the wire pattern layer and the middle layer to expose the metal layer. The chip is mounted on the metal layer and received in the through hole. The wires interconnect the chip and the wire pattern layer. | 01-10-2013 |
20130021765 | COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION - The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices. | 01-24-2013 |
20130027897 | PRINTED CIRCUIT BOARD RADIO-FREQUENCY SHIELDING STRUCTURES - Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding. | 01-31-2013 |
20130050967 | FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE - An object of the present invention is to provide a functional device-embedded substrate that can be thinned and suppress occurrence of warpage. The present invention provides a functional device-embedded substrate including at least a functional device including an electrode terminal, and a covering insulating layer covering at least an electrode terminal surface and a side surface of the functional device, the functional device-embedded substrate including a first pillar structure around the functional device inside the covering insulating layer, the first pillar structure including a material having a thermal expansion coefficient between thermal expansion coefficients of the functional device and the covering insulating layer, wherein the first pillar structure is arranged at a position where a shortest distance from a side surface of the functional device to a side surface of the first pillar structure is smaller than a thickness of the functional device. | 02-28-2013 |
20130083502 | PACKAGE SUBSTRATE - A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface. | 04-04-2013 |
20130128482 | SECURING MECHANISM AND ELECTRONIC DEVICE WITH CONNECTOR COVER - An electronic device includes a printed circuit board (PCB), at least one socket mounted to the PCB, at least one connector inserted into the at least one socket, a first member mounted to the PCB, a second member mounted to the PCB, and a first cover. The first cover covers and presses against the at least one connector, the first cover includes a first end for being fixed to the first member and a second end opposite to the first end for being fixed to the second member. At least one of the first member and the second member is soldered to the PCB, and a soldered area of the at least one of the first member and the second member is larger than a predetermined value. | 05-23-2013 |
20130128483 | DEVICE WITH AN INTEGRATED CIRCUIT - A device having an integrated circuit and a circuit package. A first terminal contact, a second terminal contact, and a third terminal contact are brought out of the circuit package. The first terminal contact and the second terminal contact are each connected to terminals of the integrated circuit for power supply. The third terminal contact is connected to a terminal of the integrated circuit in the circuit package for signal transmission. A first capacitor is connected to the first terminal contact and a second capacitor is connected to the third terminal contact, wherein a fourth terminal contact and a fifth terminal contact are brought out of the circuit package, and the first capacitor is connected to the fourth terminal contact, and the second capacitor is connected to the fifth terminal contact. | 05-23-2013 |
20130194765 | SEMICONDUCTOR MODULE ASSEMBLY - A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket. | 08-01-2013 |
20130286614 | COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER - A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer. | 10-31-2013 |
20130294041 | UICC ENCAPSULATED IN PRINTED CIRCUIT BOARD OF WIRELESS TERMINAL - A multilayer circuit board of a wireless terminal, a circuit assembly comprising the circuit board and a wireless terminal comprising the circuit assembly are provided. The wireless terminal is of a type which utilizes a UICC. The multilayer circuit board is configured to accommodate a UICC encapsulated within one or more interior layers of the multilayer circuit board, for example as a semiconductor die. The multilayer circuit board is further configured to accommodate one or more additional components integral to functionality of the wireless terminal, optionally also embedded within the circuit board. Integration of components into the interior layers may facilitate theft deterrence and/or tamper resistance. A physical programming interface to the encapsulated UICC may be rendered inaccessible after initial programming. | 11-07-2013 |
20130335937 | INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES - A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances. | 12-19-2013 |
20140063764 | ELECTRONIC COMPONENT INCORPORATED SUBSTRATE - An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post. | 03-06-2014 |
20140078704 | FUNCTIONAL GLASS HANDLER WAFER WITH THROUGH VIAS - A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite wiring circuit further includes an interposer layer with second electrically-conducting through vias. The second electrically-conducting through vias pass from a top surface of the interposer layer to a bottom surface of the interposer layer. The second electrically-conducting through vias are electrically coupled to the first electrically-conducting through vias. | 03-20-2014 |
20140098505 | HETEROGENEOUS ENCAPSULATION - An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according to the particular requirements of the electronic devices in that region. | 04-10-2014 |
20140104798 | HYBRID LAMINATION SUBSTRATE, MANUFACTURING METHOD THEREOF AND PACKAGE SUBSTRATE - Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed. | 04-17-2014 |
20140153206 | SYSTEMS AND METHODS FOR EMBEDDING DEVICES IN PRINTED CIRCUIT BOARD STRUCTURES - Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes. | 06-05-2014 |
20140177193 | BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER - An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface. | 06-26-2014 |
20140233200 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT AND AN INTEGRATED CIRCUIT - A method for manufacturing an integrated circuit may include forming an electronic circuit in or above a carrier; forming at least one metallization layer structure configured to electrically connect the electronic circuit; and forming a solid state electrolyte battery at least partially in the at least one metallization layer structure, wherein the solid state electrolyte battery is electrically connected to the electronic circuit. | 08-21-2014 |
20140240937 | Compact Media Player - An electronic device such as a media player may be formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts may be used to play audio and to convey digital signals. Electrical components for the device may be mounted to a substrate. The components may be encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons may remain uncovered by encapsulant during the encapsulation process. Integrated circuits may be entirely encapsulated with encapsulant. The integrated circuits may be packaged or unpackaged integrated circuit die. The substrate may be a printed circuit board or may be an integrated circuit to which components are directly connected without interposed printed circuit board materials. | 08-28-2014 |
20140268609 | SUPPORT STRUCTURE FOR INTEGRATED CIRCUITRY - Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry. | 09-18-2014 |
20140293562 | FIBROUS LAMINATE INTERFACE FOR SECURITY COATINGS - An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer. | 10-02-2014 |
20140313681 | CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME - An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part. | 10-23-2014 |
20140347835 | COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMBEDDED SUBSTRATE MANFACTURED USING THE SAME - The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper. | 11-27-2014 |
20140347836 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a conductive-patterned insulating substrate; conductive blocks fixed to conductive patterns of the conductive-patterned insulating substrate; a semiconductor chip fixed to each conductive block; a printed circuit board that has a conductive post fixed to the semiconductor chip; and a resin. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside. | 11-27-2014 |
20150062850 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board of a build-up structure in which an insulating layer and a circuit layer are stacked on a core layer, the core layer including: an electronic chip cavity in which an electronic chip is accommodated; and a dummy chip cavity in which a dummy chip is accommodated to offset warpage by the electronic chip. | 03-05-2015 |
20150077960 | LOW-TEMPERATURE PACKAGING METHODOLOGY FOR ELECTRONIC DEVICES AND OTHER DEVICES - A method includes depositing a metal seal material onto a first component of a protective module. The method also includes placing a second component of the protective module into contact with the metal seal material. The components of the protective module define a cavity configured to hold one or more devices. The method further includes heating the metal seal material to create a metal seal between the components of the protective module. In addition, the method includes depositing an outer metal material over and in contact with the metal seal. Heating the metal seal material to create the metal seal could include performing an anneal process with a peak temperature of about 150° C. to about 200° C. The method could optionally include alloying part of the metal seal with part of the outer metal material to create alloyed regions between the components of the protective module. | 03-19-2015 |
20150311146 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface. | 10-29-2015 |
20150334843 | PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME - Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element. | 11-19-2015 |
20150342055 | SEMICONDUCTOR MODULE WITH LOW INDUCTANCE LOAD CONNECTIONS - A semiconductor module includes a printed circuit board, and first and second embedded semiconductor chips. The first and second semiconductor chips each have a first load connection and a second load connection. The printed circuit board further includes a structured first metalization layer, which has a first section and a second section, and a structured second metalization layer, which has a first section, a second section and a third section. The first section of the second metalization layer and the second section of the first metalization layer have comb shaped structures having first and second protrusions. These first and second sections are electrically conductively connected to one another by a number of first plated-through holes each of which is permanently electrically conductively connected both at first protrusions to the first section of the second metalization layer and at second protrusions to the second section of the first metalization layer. | 11-26-2015 |
20150351252 | METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY - A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and -encapsulating the electronic component with the encapsulation material. | 12-03-2015 |
20160007467 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post. | 01-07-2016 |
20160037646 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip. | 02-04-2016 |
20160037647 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening. | 02-04-2016 |
20160044779 | 3-DIMENSIONAL MULTI-LAYERED MODULAR COMPUTER ARCHITECTURE - A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel. | 02-11-2016 |
20160057863 | ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electronic component device includes a cored wiring substrate, an electronic component, a reinforcing layer, a connection terminal, and sealing resin. The cored wiring substrate includes a core layer. The electronic component is mounted on the cored wiring substrate. The coreless wiring substrate is disposed on the cored wiring substrate and the electronic component. The reinforcing layer is provided in the coreless wiring substrate and in a region corresponding to the electronic component. The connection terminal connects the cored wiring substrate and the coreless wiring substrate. The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate. | 02-25-2016 |
20160066428 | COMPONENT-EMBEDDED SUBSTRATE AND COMMUNICATION MODULE - A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate. | 03-03-2016 |
20160100489 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE - This disclosure relates to integrated circuit (IC) packages and methods of manufacturing the same. In one method, a printed circuit board is provided with semiconductor die. The semiconductor die includes a Back-End-of-Line (BEOL) region, a Front-End-of-Line (FEOL) region, and a semiconductor handle such that the BEOL region, the FEOL region, and the semiconductor handle are stacked. A first polymer layer is provided over the printed circuit board so as to cover the semiconductor die. The semiconductor handle of the semiconductor die is exposed through the first polymer layer and removed. A second polymer layer is then provided so that the BEOL region, the FEOL region, and at least a portion of the second polymer layer are stacked. The second polymer layer may be provided to have high thermal conductivity and electric isolation properties thereby providing advantageous package characteristics. | 04-07-2016 |
20160118327 | PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME - This disclosure provides a package substrate, a flip-chip package circuit and their fabrication method. The package substrate includes: a first wiring layer having a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer except for the first metal wire; a conductive pillar layer formed on the first wiring layer and including a metal pillar connected to the first metal wire, a molding compound layer with a protrusion part surrounding the metal pillar, and a second dielectric material layer formed on the molding compound layer; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer. | 04-28-2016 |
20160157352 | PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED | 06-02-2016 |
20160157353 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED CIRCUIT BOARD | 06-02-2016 |
20160381795 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electronic device includes: a substrate; a Cu-containing wiring layer formed over the substrate; a barrier metal layer that covers a surface of the Cu-containing wiring layer and suppresses diffusion of Cu; and a coating insulating layer that covers the barrier metal layer, wherein the barrier metal layer has a void that does not reach the Cu-containing wiring layer, and the void is filled with the coating insulating layer. | 12-29-2016 |