Entries |
Document | Title | Date |
20080232074 | Circuit Card Assembly Including Individually Testable Layers - A method for assembling a circuit card assembly includes populating a plurality of components on a top side of a component layer, performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer. | 09-25-2008 |
20080266822 | ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF - An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element. | 10-30-2008 |
20080273313 | Carrier with embedded component and method for fabricating the same - A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate. | 11-06-2008 |
20080278921 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, AND PRINTED CIRCUIT BOARD - Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts. | 11-13-2008 |
20090046440 | METHODS AND SYSTEMS FOR FILTERING SIGNALS - The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. | 02-19-2009 |
20090080168 | PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS - A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component. | 03-26-2009 |
20090086450 | Printed circuit board, method for manufacturing printed circuit board and electronic apparatus - A printed circuit board is disclosed. The printed circuit board includes an insulation layer and a conductor layer having a GND pattern. The printed circuit board has a center portion, to which an element is to be mounted. The printed circuit board has a periphery portion and a slit pattern separating the periphery portion from the center portion. The GND pattern extends through the center portion and the periphery portion. | 04-02-2009 |
20090091903 | Stack structure of circuit boards embedded with semiconductor chips - A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit layers have a plurality of conductive structures and electrically conductive pads, and the semiconductor chip has a plurality of electrode pads, and the conductive structures of the circuit layers are electrically conductive to the electrode pads of the semiconductor chip. At least one adhesive layer is formed between the two circuit boards and disposed with a conductive material corresponding in position to the electrically conductive pads of the circuit boards. Thus, a conductive path can be formed by the conductive material between the electrically conductive pads of the circuit boards, thereby establishing electrical connection between the two circuit boards. | 04-09-2009 |
20090097218 | Capacitor-embedded printed wiring board and method of manufacturing the same - There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode | 04-16-2009 |
20090129037 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element. | 05-21-2009 |
20090154121 | Clock generator - A clock generator includes a printed circuit board, a resonant circuit and a pair of compensating capacitors. The resonant circuit is disposed on the printed circuit board. The compensating capacitors are embedded in the printed circuit board and electrically connected to both terminals of the resonant circuit respectively. | 06-18-2009 |
20090154122 | Mechanical component-containing board and method of manufacturing same - A mechanical component-containing board includes a board body and a mechanical component having a part thereof built in and integrated with the board body. | 06-18-2009 |
20090154123 | Systems and Methods for Providing a Grounded Card in an Information Handling System - An information handling system includes a chassis having a guide slot and a printed circuit board placed in guide slot of the chassis. The guide slot includes at least two opposing channels aligned adjacent the printed circuit board with a guide tab formed in one of the opposing channels. A daughter card electrically couples to the printed circuit board when placed in an attached position. The daughter card includes a first edge and a second edge that slides between the opposing channels of the guide slot such that the card aligns to couple to the printed circuit board. The card also includes a first detent formed in either the first edge or the second edge. The first detent releaseably interacts with the guide tab formed in the opposing channels such that the guide tab contacts the first detent when the card is placed in an intermediate position. | 06-18-2009 |
20090168380 | PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT - A package substrate embedded with a semiconductor component is provided. A semiconductor chip is received in a cavity of a substrate body, and has electrode pads on an active surface thereof. A passivation layer is disposed on the active surface and has openings for exposing the electrode pads. An electroless plating metal layer, a first sputtering metal layer and a second sputtering metal layer are sequentially formed on the electrode pads, the openings of the passivation layer and the passivation layer surface around the openings. Contact pads are formed on the second sputtering metal layer. A first dielectric layer is disposed on the substrate body and the passivation layer. A first circuit layer is formed on the first dielectric layer. First conductive vias are formed in the first dielectric layer and electrically connected to the contact pads. The first circuit layer is electrically connected to the first conductive vias. | 07-02-2009 |
20090175010 | Method of repair of electronic device and repair system - A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board. | 07-09-2009 |
20090175011 | PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF - When a package substrate with a built-in capacitor includes a first thin-film small electrode | 07-09-2009 |
20090195997 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer. | 08-06-2009 |
20090195998 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween. | 08-06-2009 |
20090195999 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace. | 08-06-2009 |
20090207574 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element. | 08-20-2009 |
20090237899 | Semiconductor package with embedded magnetic component and method of manufacture - A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate. | 09-24-2009 |
20090273910 | Functional Unit And Method For The Production Thereof - The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer and, on the outer side of the functional unit, contacts are provided for contacting the electrical components for further mounting. | 11-05-2009 |
20090284941 | SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE - A semiconductor package includes: a circuit board having a passive component embedded therein; and external terminals provided on a back surface of the circuit board. The passive component is provided at a different position from positions of the external terminals in a thickness direction of the circuit board. | 11-19-2009 |
20100061069 | OPTOELECTRONIC MODULE FORM-FACTOR ADAPTER - In one example embodiment, an adapter module includes a body having a first form-factor and multiple receptacles extending into the body. Each of the receptacles is configured to receive an optoelectronic module having a second form-factor. The second form-factor is smaller than the first form-factor. The first form-factor may substantially conform to the CFP MSA, for example. The second form-factor may substantially conform to the SFP+ or QSFP MSA, for example. | 03-11-2010 |
20100085717 | MULTI-DIAMETER UNPLUGGED COMPONENT HOLE(S) ON A PRINTED CIRCUIT BOARD (PCB) - In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least one through-hole electrical component. The printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component. The at least one component hole includes a first section having a first diameter and a second section having a second diameter. The first diameter is different from the second diameter. Each of the first and the second sections are configured to receive solder paste for forming a solder joint with the at least one through-hole electrical component. | 04-08-2010 |
20100085718 | WINDOW BASE MATERIAL, CARD WITH EMBEDDED MODULE, AND MANUFACTURING METHOD OF CARD WITH EMBEDDED MODULE - The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture. | 04-08-2010 |
20100103634 | FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT - A circuit board includes a functional device, a circuit board embedding therein the functional device, and first and second conductive-wiring layers formed on the front and rear surfaces of the circuit board to sandwich therebetween the functional device and each include at least one conductor layer. The surface of each of the outermost patterned interconnections of the first conductive-wiring layer is exposed, and the surface of a first dielectric layer isolating the outermost patterned interconnections from one another protrudes from the surface of the each of the patterned interconnections. The patterned interconnections of the second conductive-wiring layer are connected to respective electrode terminals of the functional device, and the surface of a second dielectric layer isolating the electrode terminals from one another is substrate within the same plane as the surface of the electrode terminals disposed adjacent to the second dielectric layer. | 04-29-2010 |
20100142169 | ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member. | 06-10-2010 |
20100149768 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is surface-mounted on the first wiring pattern. A second wiring substrate has a second wiring substrate main body and a second wiring pattern provided on a first surface of the second wiring substrate main body. The second wiring substrate is arranged under the first wiring substrate such that the first surface of the first wiring substrate main body opposes to the first surface of the second wiring substrate main body. A second electronic component is surface-mounted on the second wiring pattern, and arranged to oppose to the first electronic component. A resin member seals a space between the first wiring substrate and the second wiring substrate. | 06-17-2010 |
20100208439 | WIRING BOARD, METHOD OF MANUFACTURING SAME, TUNER MODULE, AND ELECTRONIC DEVICE - Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the n layers of inductor wiring, the inductor wiring closest to the shield layer has a smallest wiring area. | 08-19-2010 |
20100214750 | ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT - This publication discloses an electronics module comprising an insulating-material layer having two opposite surfaces, and at least one microcircuit embedded to the insulating-material layer. The microcircuit has a first contact surface comprising first contact terminals, from which the microcircuit is electrically connected to first conductor structures in the form of a patterned first conductor layer contained on first surface of the insulating-material layer, and a second contact surface opposite to the first contact surface, in which there is at least one second contact terminal, from which the microcircuit is electrically connected to second conductor structures contained in the form of a patterned second conductor layer on second surface of the insulating-material layer. According to the invention there is provided a local adhesive layer between the component and the first contact surface and first conductor layer, the adhesive layer filling the space between the component and the first conductor layer. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art. | 08-26-2010 |
20100277881 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 11-04-2010 |
20100328913 | METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is mounted on an insulating layer of a conductive foil in a first step, the active side of the electronic component pointing in the direction of the conductive foil. In a second step, the conductive foil having the at least one electronic component mounted thereon is laminated to a circuit board substrate, the at least one electronic component pointing in the direction of the circuit board substrate. Finally, circuit tracks are developed by patterning the conductive foil, and the at least one electronic component is contacted. | 12-30-2010 |
20100328914 | Placement Method of an Electronic Module on a Substrate and Device Produced by Said Method - The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps:
| 12-30-2010 |
20110019374 | Z-Directed Delay Line Components for Printed Circuit Boards - A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 01-27-2011 |
20110044016 | HIGH FREQUENCY CIRCUIT HAVING MULTI-CHIP MODULE STRUCTURE - According to one embodiment, there is a high frequency circuit having a multi-chip module structure, including a semiconductor substrate set formed with discrete transistors connected in series, a first dielectric substrate set formed with capacitors, and a second dielectric substrate set formed with strip lines. | 02-24-2011 |
20110063811 | MULTILAYER PRINTED WIRING BOARD - A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner. | 03-17-2011 |
20110075387 | Strain Measurement Chips For Printed Circuit Boards - A strain measurement chip including a body, a strain gauge provided within the body, and electrical contacts with which the strain measurement chip can be mounted to a circuit board, at least one of the electrical contacts being in electrical communication with the strain gauge to enable communication of strain data measured by the strain gauge to the circuit board. | 03-31-2011 |
20110090656 | TERMINAL STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF - A method for manufacturing an electronic device comprising a terminal provided with a conductor which penetrates a cured prepreg is provided. At least one opening is formed in the prepreg. The prepreg is attached to a substrate over which an electronic element is formed so that the conductor included in the terminal overlaps with the opening. A conductive paste is provided in a region of the prepreg where the opening is provided. Part of the conductive paste flows into the opening to be in contact with the conductor included in the terminal. Then, heat treatment is performed so that the conductive paste and the prepreg are cured. In the process for manufacturing the terminal, it is not necessary to perform a step of forming an opening with a laser beam after the prepreg is cured. Thus, an adverse effect of a laser beam on the electronic element can be eliminated. | 04-21-2011 |
20110116246 | PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate. | 05-19-2011 |
20110149538 | Electronic Devices with Embedded Electromagnetic Materials and Process of Making the Same - This provisional application relates to reducing electromagnetic interferences (EMI) using embedded magnetic material in a printable circuit board (PCB) and the applications thereof. | 06-23-2011 |
20110164391 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material. | 07-07-2011 |
20110170273 | Photostructured Magnetic Devices and Methods for Making Same - A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces. | 07-14-2011 |
20110194265 | Embedded Component Substrate and Manufacturing Methods Thereof - An embodiment of an embedded component substrate includes: (1) a semiconductor device including lower, lateral, and upper surfaces; (2) a first patterned conductive layer including a first electrical interconnect extending substantially laterally within the first patterned conductive layer; (3) a second electrical interconnect extending substantially vertically from a first surface of the first interconnect, and including lateral and upper surfaces, and a lower surface adjacent to the first surface; (4) a dielectric layer including an opening extending from an upper surface of the dielectric layer to a lower surface of the dielectric layer, where: (a) the dielectric layer substantially covers the lateral and upper surfaces of the device, and at least a portion of the lateral surface of the second interconnect; and (b) the second interconnect substantially fills the opening; and (5) a second patterned conductive layer adjacent to the upper surfaces of the dielectric layer and the second interconnect. | 08-11-2011 |
20110216513 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other. | 09-08-2011 |
20110216514 | COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MANUFACTURING METHOD OF THE SAME - A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together. | 09-08-2011 |
20110317381 | EMBEDDED CHIP-ON-CHIP PACKAGE AND PACKAGE-ON-PACKAGE COMPRISING SAME - An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board. | 12-29-2011 |
20120039056 | Component arrangement and method for production thereof - The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween. An improved electrical conductivity with constant mechanical stability is thus generated. | 02-16-2012 |
20120075818 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
20120081867 | Embedded isolation filter - The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure. | 04-05-2012 |
20120092842 | ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF - An encapsulated circuit device has a substrate, components configured on a substrate surface portion of a component side of the substrate, an encapsulation, at least one electrical contact having an outer portion projecting out of the encapsulation and an inner portion provided in the circuit device that is electrically connected to the substrate. The encapsulation includes a rigid outer encapsulation, which extends completely around the substrate, the components and the inner portion of the at least one electrical contact, as well as a compressible deformation absorption layer, which is provided between the components and the outer encapsulation and at least completely covers the substrate surface portion on which the components are configured. | 04-19-2012 |
20120106108 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided. | 05-03-2012 |
20120188734 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including an insulative substrate having a cavity portion, an electronic device positioned in the cavity portion of the insulative substrate, an interlayer insulation layer made of an insulative material and formed on the insulative substrate and on the electronic device, and a conductive layer having a conductive pattern and formed on the interlayer insulation layer. The insulative substrate has a gap formed with respect to the electronic device in the cavity portion, the gap between the electronic device in the cavity portion and the insulative substrate is filled with an insulator made of the insulative material derived from the interlayer insulation layer, and the conductive pattern of the conductive layer has an enlarged-width portion across and directly over the gap. | 07-26-2012 |
20120206889 | REPROGRAMMABLE CIRCUIT BOARD WITH ALIGNMENT-INSENSITIVE SUPPORT FOR MULTIPLE COMPONENT CONTACT TYPES - The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew. | 08-16-2012 |
20120206890 | METHOD FOR INTEGRATION OF CIRCUIT COMPONENTS INTO THE BUILD-UP LAYERS OF A PRINTED WIRING BOARD - The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout. | 08-16-2012 |
20120281375 | CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN - A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole and having a first active surface and an opposing second active surface, wherein first electrode pads comprising signal pads, power pads, and ground pads are provided on the first active surface; a first dielectric layer provided on the first surface of the core board and the first active surface of the semiconductor chip and configured to fill a gap between the through-hole and the semiconductor chip so as to secure the semiconductor chip in position to the through-hole; and a first circuit layer disposed in the first dielectric layer so as to be flush with the first dielectric layer, provided with first conductive vias disposed in the first dielectric layer, and electrically connected to the first electrode pads. | 11-08-2012 |
20120300425 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 11-29-2012 |
20120314389 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board has a core structure having a first surface and a second surface on the opposite side of the first surface of the core structure, a first buildup structure formed on the first surface of the core structure and having insulation layers and conductive layers, and a second buildup structure formed on the second surface of the core structure and having insulation layers, conductive layers and an inductor device. The conductive layers in the second buildup structure include conductive patterns forming the inductor device, and one or more of the conductive patterns forming the inductor device has the thickness which is greater than the thicknesses of the conductive layers in the first buildup structure. | 12-13-2012 |
20120314390 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first circuit layer, an insulating layer, a second circuit layer, an intermediate frame, an electronic element, and a third circuit layer. The insulating layer is disposed on the first circuit layer, and the second circuit layer is disposed on the insulating layer. The intermediate frame is disposed on the second circuit layer and has an accommodating space. The electronic element is disposed on the second circuit layer, electrically connected to the second circuit layer and located in the accommodating space. The third circuit layer is disposed on the intermediate frame. | 12-13-2012 |
20130027896 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to an electronic component embedded printed circuit board including: a substrate in which a cavity is formed; a plurality of electronic components embedded in the cavity; a metal member inserted between the plurality of electronic components; and insulating layers formed on both surfaces of the substrate to cover the plurality of electronic components, and it is possible to effectively improve heat radiation characteristics. | 01-31-2013 |
20130088841 | SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT - The present invention has an object to provide a substrate with a built-in functional element, including the functional element above a metal plate, in which crosstalk noise between signal wirings can be reduced and higher characteristic impedance matching can be achieved. An aspect of the present invention provides a substrate with a built-in functional element, including: a metal plate that includes a concave portion and serves as a ground; the functional element that is placed in the concave portion and includes an electrode terminal; a first insulating layer that covers the functional element and is placed in contact with the metal plate; a first wiring layer including first signal wiring that is opposite the metal plate with the first insulating layer being interposed therebetween; a second insulating layer that covers the first wiring layer; and a ground layer formed of a ground plane that is opposite the first wiring layer with the second insulating layer being interposed therebetween. | 04-11-2013 |
20130107481 | MULTI-PIECE SUBSTRATE | 05-02-2013 |
20130194764 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 08-01-2013 |
20130215585 | PACKAGE - A package includes a main unit having formed therein a through hole that penetrates the package from a first surface to a second surface; and a connection terminal that is provided inside the through hole. The second surface is a bottom surface of the main unit, and has an electric circuit incorporated therein. The connection terminal is electrically connected to the electric circuit incorporated in the main unit, and configured to be contactable by an insertion target that is inserted in the through hole from a side of an inserting direction. | 08-22-2013 |
20130223032 | CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES - A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator. | 08-29-2013 |
20130242516 | Method of Manufacturing Component-Embedded Substrate, and Component-Embedded Substrate Manufactured Using the Method - A thin conductive layer which is to form a conductor pattern ( | 09-19-2013 |
20130265730 | PHOTOSTRUCTURED MAGNETIC DEVICES AND METHODS FOR MAKING SAME - A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces. | 10-10-2013 |
20130286613 | LCD Module, LCD Device, and Backplane - The invention provides an LCD module, an LCD device, and a backplane. The LCD module includes a backplane, and a circuit board arranged on a back of the backplane. The backplane is provided with a slot into which a circuit board is inserted, and the circuit board are arranged on the slot. In the invention, because the backplane of the LCD module is provided with the slot, the circuit board of the LCD module is fixed in the slot of the backplane by insertion. Thus, a screw is not used for fixing a plurality of fixed points of the circuit boards, thereby improving the assembly efficiency of the circuit board and the LCD modules. | 10-31-2013 |
20130343022 | SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP - In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board. | 12-26-2013 |
20140055967 | WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD - There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component. | 02-27-2014 |
20140063763 | WIRING BOARD - A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component. | 03-06-2014 |
20140078703 | Printed Circuit Board and Method for Manufacturing the Same - Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured. | 03-20-2014 |
20140085845 | THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME - A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving area and electrically connected to the first thick-film substrate. | 03-27-2014 |
20140111955 | HIGH EFFICIENCY EMBEDDING TECHNOLOGY - Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB. | 04-24-2014 |
20140118975 | ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE PACKAGE - An environmental sensitive electronic device package may include a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device. | 05-01-2014 |
20140133117 | HIGH FREQUENCY CIRCUIT MODULE - A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction. | 05-15-2014 |
20140133118 | COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME - Provided is a component-embedded board. The board includes: a first base including first substrate incorporating a first electric component and first electrode provided on a first face of the substrate and electrically connected to the electric component; a second electronic component fixed on the first face with a first adhesion portion therebetween; a second base including second substrate in which the second electronic component is embedded and second electrode exposed at a first face of the second substrate; a second adhesion portion arranged between the first and second bases; a third base including third substrate and third electrode exposed at a first face of the third substrate; and a third adhesion portion arranged between the second and third bases. The first, second and third electrodes are electrically connected to the second electronic component, and the second electronic component is surrounded, at least, by the first and third adhesion portions. | 05-15-2014 |
20140146499 | PRINTED CIRCUIT BOARD AND DEVICE INCLUDING THE SAME - A printed circuit board (PCB) having a decoupling capacitor includes: a PCB including a power supply layer, ground layer, and first decoupling capacitor; a package mounted at a surface of the PCB, wherein the first decoupling capacitor is embedded in a via hole of the PCB, and a first electrode of the first decoupling capacitor is connected to one of power supply pins of the package, and a second electrode of the first decoupling capacitor is connected to the ground layer. | 05-29-2014 |
20140146500 | MULTI-PIECE SUBSTRATE - A multi-piece substrate includes a unit component having four sides and including multiple wiring boards arrayed in a matrix, and a frame component supporting the unit component such that the frame component is surrounding an outer periphery of the unit component. Each of the wiring boards has a semiconductor element built therein, and the frame component has multiple slit portions formed such that the slit portions are formed along the four sides of the unit component, respectively. | 05-29-2014 |
20140168921 | FULL GRAPHICS ELECTRONIC IN-MOLD LABEL AND APPLICATIONS THEREOF - An electronic in-mold label includes a substrate having a first surface and a second surface. The substrate includes an electronics mounting area on the second surface and an electronic circuit positioned in the electronics mounting area. When the electronic in-mold label is molded on to, or into, a plastic product, the electronic circuit is molded into the plastic product and is operable to perform a function. | 06-19-2014 |
20140177192 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same. In accordance with an embodiment of the present invention, a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer. | 06-26-2014 |
20140185257 | PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTURING SAME - A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer. | 07-03-2014 |
20140185258 | SUBSTRATE EMBEDDING PASSIVE ELEMENT - A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via. | 07-03-2014 |
20140204548 | SUBSTRATE WITH BUILT-IN PASSIVE ELEMENT - A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound. | 07-24-2014 |
20140204549 | CIRCUIT SUBSTRATE - A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate. | 07-24-2014 |
20140211436 | CIRCUIT BOARD, OPTOELECTRONIC COMPONENT AND ARRANGEMENT OF OPTOELECTRONIC COMPONENTS - A circuit board for an optoelectronic semiconductor chip includes an electrically conductive first metal foil, a first electrically insulating foil, an electrically conductive second metal foil, wherein the first electrically insulating foil is applied to the first metal foil at a top side of the first metal foil and mechanically connects thereto, the first electrically insulating foil has a recess in which the first metal foil is exposed, the recess electrically conductively fixes the optoelectronic semiconductor chip to the first metal foil within the recess, the second metal foil is applied at a top side of the first electrically insulating foil, the top side facing away from the first metal foil, and mechanically connects to the electrically insulating foil, the first electrically insulating foil is free of the second metal foil at least in the region of the recess, and the second metal foil electrically contacts the optoelectronic semiconductor chip. | 07-31-2014 |
20140211437 | COMPONENT BUILT-IN BOARD MOUNTING BODY AND METHOD OF MANUFACTURING THE SAME, AND COMPONENT BUILT-IN BOARD - A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump. | 07-31-2014 |
20140218883 | ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY - An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts. | 08-07-2014 |
20140233199 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY - A component built-in board of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components built in thereto in a stacking direction, wherein the plurality of unit boards include: a double-sided board that includes a first insulating layer, a first wiring layer formed on both surfaces of the first insulating layer, and a first interlayer conductive layer that penetrates the first insulating layer and is connected to the first wiring layer, and that comprises an opening in which the electronic component is housed; and an intermediate board that includes a second insulating layer, a first adhesive layer provided on both surfaces of the second insulating layer, and a second interlayer conductive layer that penetrates the second insulating layer along with the first adhesive layer, and the double-sided board is disposed above and below the intermediate board. | 08-21-2014 |
20140247571 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole. | 09-04-2014 |
20140268607 | Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices - The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device. | 09-18-2014 |
20140268608 | COMPONENT HOLDING STRUCTURES, SYSTEM, AND METHOD - A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. | 09-18-2014 |
20140285988 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other. | 09-25-2014 |
20140293559 | WIRING BOARD - A wiring board has a surface formed with a chip mounting area to which a chip component is mounted and includes embedded therein first and second multilayer capacitors, each of which has inner electrode layers laminated in a lamination direction. The first multilayer capacitors are embedded in a peripheral region of the wiring board immediately below a peripheral edge of the chip mounting area and a vicinity of the peripheral edge of the chip mounting area such that the lamination direction of the inner electrode layers of the first multilayer capacitors is perpendicular to the surface of the wiring board. The second multilayer capacitors are embedded in any other regions of the wiring board inside and outside the peripheral region such that the lamination direction of the inner electrode layers of at least one of the second multilayer capacitors is parallel to the surface of the wiring board. | 10-02-2014 |
20140293560 | SUBSTRATE EMBEDDING ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SUBSTRATE EMBEDDING ELECTRONIC COMPONENT - Disclosed herein is a substrate embedding an electronic component and a method of manufacturing the substrate embedding an electronic component, the substrate embedding an electronic component including a first insulating part having the electronic component positioned therein, the electronic component being provided with terminals on a surface thereof; a first pattern layer provided at a lower portion of the first insulating part; a second pattern layer provided at an upper portion of the first insulating part; and a conductive film structure provided between at least one the first and second pattern layers and the terminal and electrically connecting the pattern layer to the terminal, and being advantageous for a decrease of the number of layers of a structure of the substrate embedding an electronic component and slimness. | 10-02-2014 |
20140293561 | WIRING BOARD, ELECTRONIC COMPONENT EMBEDDED SUBSTRATE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole. | 10-02-2014 |
20140301054 | WIRING BOARD FOR HAVING LIGHT EMITTING ELEMENT MOUNTED THEREON - To provide a light emitting element mounting wiring substrate having a light emitting element mounting section on a substrate main body having a front surface and a back surface, and a confined component electrically connected to the light emitting element, such that the confine component does not obstruct the optical path of the light emitted from the light emitting element, resulting in uniform distribution of light intensity. The light emitting element mounting wiring substrate ( | 10-09-2014 |
20140307402 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface. | 10-16-2014 |
20140307403 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD - This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( | 10-16-2014 |
20140321084 | PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers. | 10-30-2014 |
20140328038 | ELECTRONIC COMPONENT-EMBEDDED MODULE - An electronic component-embedded module mountable on a motherboard has a multilayer board wherein a cavity is formed in order to place an electronic component. The multilayer board includes a board-side resin layer with external electrodes for mounting onto the motherboard and board-side via-conductors connected thereto, an intermediate resin layer with intermediate via-conductors connected to the board-side via-conductors, and a component-side resin layer stacked on the intermediate resin layer and having component-side via-conductors. The component-side via-conductors include first component-side via-conductors connected to the intermediate via-conductors and second component-side via-conductors bonded to the electronic component and connected to the first component-side via-conductors. An intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer. | 11-06-2014 |
20140334120 | ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY - An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts. | 11-13-2014 |
20140347833 | ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic component device, includes, a plurality of wiring layers including a component connection pad in a center part and an external connection pad in a periphery, an insulating layer formed on the wiring layers, and the insulating layer in which the component connection pad and the external connection pad are exposed, a frame member arranged on the insulating layer, and the frame member in which an opening portion is provided in an area of the center part in which the component connection pad is arranged, and a connection hole is provided on the external connection pad, an electronic component arranged in the opening portion of the frame member and connected to the component connection pad, a sealing resin formed in the opening portion of the frame member and sealing the electronic component, and a metal bonding material formed on the external connection pad in the connection hole. | 11-27-2014 |
20140355232 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other. | 12-04-2014 |
20140369013 | ELECTRONIC DEVICE - The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space. | 12-18-2014 |
20140369014 | WIRING BOARD - A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening. | 12-18-2014 |
20150022982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 01-22-2015 |
20150036305 | ELECTRONIC COMPONENT BUILT-IN MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in multi-layer wiring board that comprises collectively stacked therein a plurality of first printed wiring boards by thermal compression bonding, and that comprises an electronic component package built in thereto, wherein the electronic component package comprises a first electronic component built in thereto and a plurality of second printed wiring boards stacked to have electrodes on an outermost surface of the package at a pitch that is wider than the electrode pitch of the first electronic component and that is matched to the wiring pitch of the first printed wiring boards, the electronic component built-in multi-layer wiring board includes a second electronic component having a thickness which is greater than that of the first electronic component, and the electronic component package having a thickness which is 80% to 125% of the thickness of the second electronic component. | 02-05-2015 |
20150036306 | RDL SYSTEM IN PACKAGE - A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area. | 02-05-2015 |
20150043183 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer. | 02-12-2015 |
20150049445 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE AND ELECTRONIC COMPONENT EMBEDDING SUBSTRATE - Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate. | 02-19-2015 |
20150049446 | EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - Disclosed is an embedded electronic component which can improve reliability of connection with external wiring and efficiency of an embedding process by including: a contact pad provided on at least one surface of a body portion and made of a conductive material; a first insulating layer for covering the at least one surface of the body portion; a first pad in contact with a surface of the contact pad and made of a conductive material; a rearrangement portion provided on a surface of the first insulating layer to be in contact with the first pad; a second pad provided on the surface of the first insulating layer to be in contact with the rearrangement portion; and a second insulating layer having an opening to expose a portion of the second pad while covering the first insulating layer, the first pad, the rearrangement portion, and the second pad. | 02-19-2015 |
20150049447 | Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same - A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole. | 02-19-2015 |
20150055309 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - The present invention can improve efficiency of a process of forming a via for connecting an electronic component embedded in a substrate to external wiring by including an electronic component having at least one external terminal on at least one surface thereof; a third insulating layer having a second circuit pattern on one surface thereof and a cavity to insert the electronic component therein; a fourth insulating layer provided on the third insulating layer and the electronic component; a first via having one surface in contact with the second circuit pattern through the fourth insulating layer; a second via having one surface in contact with the external terminal through the fourth insulating layer; and a fourth circuit pattern provided on an outer surface of the fourth insulating layer to be in contact with the other surface of the first via and the other surface of the second via. | 02-26-2015 |
20150062848 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion. | 03-05-2015 |
20150062849 | PRINTED WIRING BOARD - A wiring board includes a unit section including product portions, and a frame section formed along the periphery of the unit section. The frame section has a dummy pattern which includes conductive portions and connection lines such that the connection lines are formed in spaces between the conductive portions and linking the conductive portions. | 03-05-2015 |
20150070862 | SUBSTRATE WITH BUILT-IN COMPONENT - There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction. | 03-12-2015 |
20150085454 | POWER MODULE - A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure. | 03-26-2015 |
20150085455 | ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - Embodiments of the invention provide an electronic component-embedded substrate and a manufacturing method thereof. According to at least one embodiment, the electronic component-embedded substrate includes a cavity formed in a core substrate and including two or more embedding spaces which have a rectangular shape (when viewed on a plane) and are connected to each other by a connecting space, and two or more electronic components separately accommodated in the embedding spaces of the cavity, respectively. According to at least one embodiment, neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space, and one side (when viewed on the plane) forming a connecting width of the connecting space connecting the first and second embedding spaces to each other coincides with one short side of the first embedding space, and the other side (when viewed on the plane) coincides with the other short side of the second embedding space. | 03-26-2015 |
20150098202 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′. | 04-09-2015 |
20150116963 | COIL-INTEGRATED PRINTED CIRCUIT BOARD AND MAGNETIC DEVICE - A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer. | 04-30-2015 |
20150124416 | PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED AND MANUFACTURING METHOD THEREOF - A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products. | 05-07-2015 |
20150124417 | ELECTRONIC COMPONENT PACKAGE - An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules. | 05-07-2015 |
20150131247 | Electrically conductive frame on substrate for accommodating electronic chips - A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips. | 05-14-2015 |
20150131248 | THREE-DIMENSIONAL MODULES FOR ELECTRONIC INTEGRATION - An electronic module ( | 05-14-2015 |
20150294931 | Baseplate for an electronic module and method of manufacturing the same - Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip. | 10-15-2015 |
20150296620 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE - A circuit board includes an insulating material; a conductive pattern formed on at least one surface of the insulating material; and a connection pin adapted for electrical connection with an external apparatus, attached to the one surface, and made of a metal. | 10-15-2015 |
20150296624 | PRINTED CIRCUIT BOARD FOR MOUNTING CHIP AND METHOD OF MANUFACTURING THE SAME - A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer. | 10-15-2015 |
20150318239 | APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING - An apparatus includes a base portion having an upper surface and a lower surface opposite the upper surface. The apparatus also includes a first sidewall portion having a first upper portion distal the upper surface of the base portion and a first slanted sidewall between the first upper portion and the upper surface of the base portion. The apparatus further includes a second sidewall portion having a second upper portion distal the upper surface of the base portion and a second slanted sidewall between the second upper portion and the upper surface of the base portion. The first sidewall portion and the second sidewall portion define a first reservoir between the first slanted sidewall and the second slanted sidewall, the first reservoir being configured to receive a first chip package portion and to secure the first chip package portion in a first curing position. | 11-05-2015 |
20150319863 | STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT FOR AN EMBEDDED COMPONENT PRINTED CIRCUIT BOARD - A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad. | 11-05-2015 |
20150319864 | HIGH EFFICIENCY EMBEDDING TECHNOLOGY - Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB. | 11-05-2015 |
20150327362 | MULTILAYER WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - To improve the degree of freedom of design of a multilayer wiring substrate incorporating therein an electronic component. A multilayer wiring substrate includes a first layered structure including conductor layers and insulation layers including therein via conductors each having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof; an electronic component embedded in the first layered structure; and a second layered structure stacked on the first layered structure, and including conductor layers, and an insulation layer including therein a via conductor having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof. | 11-12-2015 |
20150327365 | INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME - The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof. | 11-12-2015 |
20150327369 | Device Embedded Substrate and Manufacturing Method of Device Embedded Substrate - A device embedded substrate ( | 11-12-2015 |
20150334841 | Printed Circuit Board - A multilayer printed circuit board comprising conductive layers separated by dielectric insulation layers, at least one conductive layer being patterned and parts of conducting layers being interconnected by means of vias traversing insulation layers, and at least one component having terminals electrically connected with conducting layers is countersunk at least partly in a cavity having a floor and side walls, whereby a first component is completely countersunk in the cavity with its terminals connected face-down directly with contacts on the floor of the cavity and at least one further component is stacked above the first component, whereby an edge of the lower surface of the second component projecting over the upper surface area of the at least one further component is provided with terminals being connected directly face-down with contacts of the circuit board arranged on a level higher than the floor of the cavity. | 11-19-2015 |
20150334844 | PRINTED WIRING BOARD - A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T | 11-19-2015 |
20150334845 | PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE | 11-19-2015 |
20150342046 | PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME - A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material. | 11-26-2015 |
20150342053 | Manufacturing a Semiconductor Package Including an Embedded Circuit Component within a Support Structure of the Package - An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device. | 11-26-2015 |
20150351218 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY - A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction, the plurality of electronic components include a first electronic component, and the plurality of unit boards including: a first board having a first insulating layer and comprising an opening in which the first electronic component is housed; and an intermediate board adjacent to the first board and comprising: a second insulating layer; a first wiring layer formed on a surface on a side of the first board of the second insulating layer; a first adhesive layer provided on at least the side of the first board of the second insulating layer; and a first thermal via that penetrates the first adhesive layer above the first wiring layer and is connected to the first wiring layer, and the first wiring layer of the intermediate board being connected to the first electronic component via the first thermal via. | 12-03-2015 |
20150351228 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer. | 12-03-2015 |
20150351230 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY - A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction. The plurality of unit boards include: a first board having a first insulating layer and comprising an opening in which the electronic component is housed; and an intermediate board adjacent to the first board and comprising a first adhesive layer provided on at least a side of the first board of a second insulating layer. The intermediate board includes a first wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the electronic component of the first board on a surface on the first board side of the second insulating layer. | 12-03-2015 |
20150351247 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor. | 12-03-2015 |
20150359096 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure. | 12-10-2015 |
20150359103 | COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME - Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion. | 12-10-2015 |
20150366066 | SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF - An electronic device embedded substrate and a method of manufacturing the same are disclosed. The electronic device embedded substrate in accordance with an aspect of the present invention includes: an electronic device; and a core substrate having a cavity, in which the electronic device is embedded and of which a width of at least a portion is smaller than widths of other portions thereof. | 12-17-2015 |
20150366067 | Peripherally Mounted Components in Embedded Circuits - Semiconductor die and other components can be mounted in printed circuit boards with a binding agent at their periphery. This leaves both surfaces exposed for subsequent processing, usually over-plating with copper that is then etched to define a conductor pattern, just as in printed circuit manufacture. Methods using the surface tension of liquids for precise component placement in three dimensions (3-D) are shown. Optionally, micro-conductors can be used for the connections to the die, for reduced apparent resistance at high frequencies. The micro-channels between the micro-conductors can be a wick for liquid for evaporative cooling at the semiconductor surface as part of a heat pipe circuit. | 12-17-2015 |
20150366076 | A Method Of Encapsulating An Electric Component - An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell. | 12-17-2015 |
20150367598 | DEVICES FORMED WITH TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER - A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region. | 12-24-2015 |
20150371937 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device having a structure capable of reducing the self-inductance of internal wiring. The semiconductor device includes: a lower board having a lower conductor layer formed on the surface thereof; a switching element bonded to the lower conductor layer in an element bonding area; a terminal bonded to the lower conductor layer in a terminal bonding area; an upper board stacked on the lower board in a board bonding area between the element bonding area and the terminal bonding area, and having an upper conductor layer on the surface thereof; and a switching element connecting member which connects the switching element with the upper conductor layer. | 12-24-2015 |
20150382469 | PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF - A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface that are arranged opposite to each other. The first conductive pillar layer is disposed on the second surface of the first wiring layer, whereas the first conductive pillar layer is a non-circular conductive pillar layer. The first molding compound layer is disposed within a specific portion of the first wiring layer and the first conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the first conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer. | 12-31-2015 |
20150382470 | ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - An electronic circuit device which forms a parting line preventing the penetration of moisture into a connector and a manufacturing method thereof are provided. The electronic, circuit device ( | 12-31-2015 |
20150382478 | DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDDED SUBSTRATE - A device embedded substrate includes an insulating layer including an insulating resin material, a device embedded in the insulating layer, a metal film coating at least one face of the device, and a roughened portion formed by roughening at least part of the surface of the metal film. Preferably, the device embedded substrate further includes: a conductive layer pattern-formed on a bottom face, the bottom face being one face of the insulating layer; and a bonding agent made of a material different from the insulating layer and joining the conductive layer ( | 12-31-2015 |
20160007449 | CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof. | 01-07-2016 |
20160007469 | EMBEDDED COMPONENT SUBSTRATE AND METHOD FOR FABRICATING THE SAME - An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between the at least one electronic component and the at least one cavity. The first wiring layer extends from the first surface of the substrate to a sidewall of the at least one cavity, and directly contacts the at least one electronic component. | 01-07-2016 |
20160007470 | Method and Device for Electrically Coupling a Plurality of Semiconductor Device Layers by a Common Conductive Layer - An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer. | 01-07-2016 |
20160021753 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface. | 01-21-2016 |
20160021754 | SMD, IPD, AND/OR WIRE MOUNT IN A PACKAGE - Various package structures and methods of forming package structures are described. According an embodiment, a structure includes a first package and a package component attached to the first package by external connectors. The first package comprises a device attached to a first pad and a second pad. The device is a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof. The device is attached to the first pad and the second pad through a dielectric layer. A spacer material is disposed laterally between the first pad and the second pad and is disposed between the device and the dielectric layer. An encapsulant surrounds the device and the spacer material. | 01-21-2016 |
20160021763 | Semi-finished Product for the Production of a Printed Circuit Board and Method for Producing the Same - In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers ( | 01-21-2016 |
20160037645 | EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME - An embedded board and a method of manufacturing the same are provided. The embedded board includes a core substrate below which a mounting pad is formed, a first substrate formed below the core substrate and having a first cavity formed therein, and a second substrate formed below the first substrate and having a second cavity formed therein. The first cavity and the second cavity are connected to each other and externally expose the mounting pad. | 02-04-2016 |
20160044783 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer. | 02-11-2016 |
20160066427 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a recess; disposing an electronic element in the recess of the carrier; forming an insulating layer in the recess to encapsulate the electronic element; forming a circuit structure on the carrier, wherein the circuit structure is electrically connected to the electronic element; forming a plurality of through holes penetrating the carrier; and forming a conductive material in the through holes to form a plurality of conductors, wherein the conductors are electrically connected to the circuit structure. By using the carrier as a substrate body, the present invention avoids warping of the package structure. | 03-03-2016 |
20160073515 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity and having electrode terminals, an insulating layer formed on the substrate such that the insulating layer is covering the electronic component in the cavity, and via conductors formed through the insulating layer and including first via conductors and second via conductors such that the second via conductors are connected to the electrode terminals of the electronic component, respectively. The via conductors are formed in via formation holes penetrating through the insulating layer, respectively, and the via formation holes include first via formation holes and second via formation holes such that the second via formation holes are exposing the electrode terminals of the electronic component, respectively, and that a second via formation hole has a diameter which is smaller than a diameter of a first via formation hole. | 03-10-2016 |
20160081194 | Wiring Substrate and Semiconductor Device - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the core. The first wiring layer includes a first opening, and the second wiring layer includes a second opening. The core includes a plurality of electronic component accommodating bores that extend through the core at portions exposed from the first and second openings. An electronic component is arranged in each electronic component accommodating bore. The electronic component accommodating bores are filled with an insulating layer. The core includes a partition located between adjacent electronic component accommodating bores. The partition is formed by part of the core. | 03-17-2016 |
20160095225 | INDUCTOR SYSTEM FOR MULTI-PHASE POWER MANAGEMENT INTEGRATED CIRCUITS - A semiconductor device includes a first integrated circuit chip, a second integrated circuit chip, a coupled inductor system, and a semiconductor package. The first integrated circuit chip is connected to a substrate and configured to process digital data. The second integrated circuit chip is configured to manage power for the first integrated circuit chip. The coupled inductor system is embedded in the substrate, connected to the second integrated circuit chip, and has a first inductor configured to be magnetically coupled to a second inductor. The semiconductor package is configured to encapsulate the first integrated circuit chip and the second integrated circuit chip. | 03-31-2016 |
20160128181 | SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT AND ELECTRONIC DEVICE - There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet. | 05-05-2016 |
20160135299 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A method of fabricating a package structure is provided, including forming a plurality of openings by removing a portion of the material on one side of a conductive layer, forming an insulating material as an insulating layer in the openings, removing a portion of the material on the other side of the conductive layer to serve as a wiring layer, disposing an electronic component on the wiring layer, and forming an encapsulating layer to cover the electronic component, thereby allowing the single wiring layer to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path. The present invention further provides a package structure thus fabricated. | 05-12-2016 |
20160141236 | WIRING BOARD, ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE - A wiring board includes a first wiring layer, an insulating layer, and a pad. The insulating layer is formed on the first wiring layer. The pad is formed on the insulating layer in a region where the insulating layer overlaps the first wiring layer in a plan view. The pad includes a pad body and plural protrusion portions. The protrusion portions protrude from the pad body toward a lower side of the pad body. The protrusion portions are embedded in the insulating layer. The protrusion portions are separate from the first wiring layer. | 05-19-2016 |
20160143148 | PRINTED CIRCUIT BOARD - A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part. | 05-19-2016 |
20160150632 | PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF MANUFACTURE THEREOF - An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation. | 05-26-2016 |
20160150649 | INTEGRATED PASSIVE MODULE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An integrated passive module comprises a ceramic substrate, a planar layer and a thin film laminate. At least one first passive component is embedded in ceramic substrate. The planar layer is disposed on the ceramic substrate. The thin film laminate comprises at least one second passive component and disposed on the planar layer. The thin film laminate is electrically connected to the first passive component. This disclosure also discloses a semiconductor device comprising an integrated passive module and at least one active component. The at least one active component is electrically connected to the first passive component and the second passive component. | 05-26-2016 |
20160165731 | METHOD OF FABRICATING A POLYMER FRAME WITH A RECTANGULAR ARRAY OF CAVITIES - An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and a method of fabrication, the chip sockets are characterized by being rectangular with smooth walls that meet at corners that have radii of curvature of less than 100 microns thereby facilitating a close fit of each socket to the intended chip size, enabling compact chip packaging and miniaturization. | 06-09-2016 |
20160172260 | ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS | 06-16-2016 |
20160174381 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | 06-16-2016 |
20160198574 | SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF | 07-07-2016 |
20160198576 | PRINTED THREE-DIMENSIONAL (3D) FUNCTIONAL PART AND METHOD OF MAKING | 07-07-2016 |
20160255726 | PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF | 09-01-2016 |
20180027659 | DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE | 01-25-2018 |