| Entries |
| Document | Title | Date |
|---|
| 20090195998 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween. | 08-06-2009 |
| 20090195997 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer. | 08-06-2009 |
| 20110194265 | Embedded Component Substrate and Manufacturing Methods Thereof - An embodiment of an embedded component substrate includes: (1) a semiconductor device including lower, lateral, and upper surfaces; (2) a first patterned conductive layer including a first electrical interconnect extending substantially laterally within the first patterned conductive layer; (3) a second electrical interconnect extending substantially vertically from a first surface of the first interconnect, and including lateral and upper surfaces, and a lower surface adjacent to the first surface; (4) a dielectric layer including an opening extending from an upper surface of the dielectric layer to a lower surface of the dielectric layer, where: (a) the dielectric layer substantially covers the lateral and upper surfaces of the device, and at least a portion of the lateral surface of the second interconnect; and (b) the second interconnect substantially fills the opening; and (5) a second patterned conductive layer adjacent to the upper surfaces of the dielectric layer and the second interconnect. | 08-11-2011 |
| 20100103634 | FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT - A circuit board includes a functional device, a circuit board embedding therein the functional device, and first and second conductive-wiring layers formed on the front and rear surfaces of the circuit board to sandwich therebetween the functional device and each include at least one conductor layer. The surface of each of the outermost patterned interconnections of the first conductive-wiring layer is exposed, and the surface of a first dielectric layer isolating the outermost patterned interconnections from one another protrudes from the surface of the each of the patterned interconnections. The patterned interconnections of the second conductive-wiring layer are connected to respective electrode terminals of the functional device, and the surface of a second dielectric layer isolating the electrode terminals from one another is substrate within the same plane as the surface of the electrode terminals disposed adjacent to the second dielectric layer. | 04-29-2010 |
| 20090154122 | Mechanical component-containing board and method of manufacturing same - A mechanical component-containing board includes a board body and a mechanical component having a part thereof built in and integrated with the board body. | 06-18-2009 |
| 20130027896 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to an electronic component embedded printed circuit board including: a substrate in which a cavity is formed; a plurality of electronic components embedded in the cavity; a metal member inserted between the plurality of electronic components; and insulating layers formed on both surfaces of the substrate to cover the plurality of electronic components, and it is possible to effectively improve heat radiation characteristics. | 01-31-2013 |
| 20090175010 | Method of repair of electronic device and repair system - A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board. | 07-09-2009 |
| 20130088841 | SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT - The present invention has an object to provide a substrate with a built-in functional element, including the functional element above a metal plate, in which crosstalk noise between signal wirings can be reduced and higher characteristic impedance matching can be achieved. An aspect of the present invention provides a substrate with a built-in functional element, including: a metal plate that includes a concave portion and serves as a ground; the functional element that is placed in the concave portion and includes an electrode terminal; a first insulating layer that covers the functional element and is placed in contact with the metal plate; a first wiring layer including first signal wiring that is opposite the metal plate with the first insulating layer being interposed therebetween; a second insulating layer that covers the first wiring layer; and a ground layer formed of a ground plane that is opposite the first wiring layer with the second insulating layer being interposed therebetween. | 04-11-2013 |
| 20090091903 | Stack structure of circuit boards embedded with semiconductor chips - A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit layers have a plurality of conductive structures and electrically conductive pads, and the semiconductor chip has a plurality of electrode pads, and the conductive structures of the circuit layers are electrically conductive to the electrode pads of the semiconductor chip. At least one adhesive layer is formed between the two circuit boards and disposed with a conductive material corresponding in position to the electrically conductive pads of the circuit boards. Thus, a conductive path can be formed by the conductive material between the electrically conductive pads of the circuit boards, thereby establishing electrical connection between the two circuit boards. | 04-09-2009 |
| 20090237899 | Semiconductor package with embedded magnetic component and method of manufacture - A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate. | 09-24-2009 |
| 20110044016 | HIGH FREQUENCY CIRCUIT HAVING MULTI-CHIP MODULE STRUCTURE - According to one embodiment, there is a high frequency circuit having a multi-chip module structure, including a semiconductor substrate set formed with discrete transistors connected in series, a first dielectric substrate set formed with capacitors, and a second dielectric substrate set formed with strip lines. | 02-24-2011 |
| 20090195999 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace. | 08-06-2009 |
| 20090154121 | Clock generator - A clock generator includes a printed circuit board, a resonant circuit and a pair of compensating capacitors. The resonant circuit is disposed on the printed circuit board. The compensating capacitors are embedded in the printed circuit board and electrically connected to both terminals of the resonant circuit respectively. | 06-18-2009 |
| 20080266822 | ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF - An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element. | 10-30-2008 |
| 20100085718 | WINDOW BASE MATERIAL, CARD WITH EMBEDDED MODULE, AND MANUFACTURING METHOD OF CARD WITH EMBEDDED MODULE - The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture. | 04-08-2010 |
| 20090046440 | METHODS AND SYSTEMS FOR FILTERING SIGNALS - The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. | 02-19-2009 |
| 20110170273 | Photostructured Magnetic Devices and Methods for Making Same - A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces. | 07-14-2011 |
| 20120106108 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided. | 05-03-2012 |
| 20090273910 | Functional Unit And Method For The Production Thereof - The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer and, on the outer side of the functional unit, contacts are provided for contacting the electrical components for further mounting. | 11-05-2009 |
| 20100277881 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 11-04-2010 |
| 20090168380 | PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT - A package substrate embedded with a semiconductor component is provided. A semiconductor chip is received in a cavity of a substrate body, and has electrode pads on an active surface thereof. A passivation layer is disposed on the active surface and has openings for exposing the electrode pads. An electroless plating metal layer, a first sputtering metal layer and a second sputtering metal layer are sequentially formed on the electrode pads, the openings of the passivation layer and the passivation layer surface around the openings. Contact pads are formed on the second sputtering metal layer. A first dielectric layer is disposed on the substrate body and the passivation layer. A first circuit layer is formed on the first dielectric layer. First conductive vias are formed in the first dielectric layer and electrically connected to the contact pads. The first circuit layer is electrically connected to the first conductive vias. | 07-02-2009 |
| 20090097218 | Capacitor-embedded printed wiring board and method of manufacturing the same - There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode | 04-16-2009 |
| 20080273313 | Carrier with embedded component and method for fabricating the same - A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate. | 11-06-2008 |
| 20080278921 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, AND PRINTED CIRCUIT BOARD - Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts. | 11-13-2008 |
| 20100142169 | ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member. | 06-10-2010 |
| 20090129037 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element. | 05-21-2009 |
| 20090086450 | Printed circuit board, method for manufacturing printed circuit board and electronic apparatus - A printed circuit board is disclosed. The printed circuit board includes an insulation layer and a conductor layer having a GND pattern. The printed circuit board has a center portion, to which an element is to be mounted. The printed circuit board has a periphery portion and a slit pattern separating the periphery portion from the center portion. The GND pattern extends through the center portion and the periphery portion. | 04-02-2009 |
| 20090080168 | PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS - A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component. | 03-26-2009 |
| 20100149768 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is surface-mounted on the first wiring pattern. A second wiring substrate has a second wiring substrate main body and a second wiring pattern provided on a first surface of the second wiring substrate main body. The second wiring substrate is arranged under the first wiring substrate such that the first surface of the first wiring substrate main body opposes to the first surface of the second wiring substrate main body. A second electronic component is surface-mounted on the second wiring pattern, and arranged to oppose to the first electronic component. A resin member seals a space between the first wiring substrate and the second wiring substrate. | 06-17-2010 |
| 20080232074 | Circuit Card Assembly Including Individually Testable Layers - A method for assembling a circuit card assembly includes populating a plurality of components on a top side of a component layer, performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer. | 09-25-2008 |
| 20100208439 | WIRING BOARD, METHOD OF MANUFACTURING SAME, TUNER MODULE, AND ELECTRONIC DEVICE - Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the n layers of inductor wiring, the inductor wiring closest to the shield layer has a smallest wiring area. | 08-19-2010 |
| 20090284941 | SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE - A semiconductor package includes: a circuit board having a passive component embedded therein; and external terminals provided on a back surface of the circuit board. The passive component is provided at a different position from positions of the external terminals in a thickness direction of the circuit board. | 11-19-2009 |
| 20100328914 | Placement Method of an Electronic Module on a Substrate and Device Produced by Said Method - The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps:
| 12-30-2010 |
| 20110019374 | Z-Directed Delay Line Components for Printed Circuit Boards - A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 01-27-2011 |
| 20110116246 | PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate. | 05-19-2011 |
| 20090154123 | Systems and Methods for Providing a Grounded Card in an Information Handling System - An information handling system includes a chassis having a guide slot and a printed circuit board placed in guide slot of the chassis. The guide slot includes at least two opposing channels aligned adjacent the printed circuit board with a guide tab formed in one of the opposing channels. A daughter card electrically couples to the printed circuit board when placed in an attached position. The daughter card includes a first edge and a second edge that slides between the opposing channels of the guide slot such that the card aligns to couple to the printed circuit board. The card also includes a first detent formed in either the first edge or the second edge. The first detent releaseably interacts with the guide tab formed in the opposing channels such that the guide tab contacts the first detent when the card is placed in an intermediate position. | 06-18-2009 |
| 20110075387 | Strain Measurement Chips For Printed Circuit Boards - A strain measurement chip including a body, a strain gauge provided within the body, and electrical contacts with which the strain measurement chip can be mounted to a circuit board, at least one of the electrical contacts being in electrical communication with the strain gauge to enable communication of strain data measured by the strain gauge to the circuit board. | 03-31-2011 |
| 20110164391 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material. | 07-07-2011 |
| 20090207574 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element. | 08-20-2009 |
| 20100214750 | ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT - This publication discloses an electronics module comprising an insulating-material layer having two opposite surfaces, and at least one microcircuit embedded to the insulating-material layer. The microcircuit has a first contact surface comprising first contact terminals, from which the microcircuit is electrically connected to first conductor structures in the form of a patterned first conductor layer contained on first surface of the insulating-material layer, and a second contact surface opposite to the first contact surface, in which there is at least one second contact terminal, from which the microcircuit is electrically connected to second conductor structures contained in the form of a patterned second conductor layer on second surface of the insulating-material layer. According to the invention there is provided a local adhesive layer between the component and the first contact surface and first conductor layer, the adhesive layer filling the space between the component and the first conductor layer. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art. | 08-26-2010 |
| 20110149538 | Electronic Devices with Embedded Electromagnetic Materials and Process of Making the Same - This provisional application relates to reducing electromagnetic interferences (EMI) using embedded magnetic material in a printable circuit board (PCB) and the applications thereof. | 06-23-2011 |
| 20090175011 | PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF - When a package substrate with a built-in capacitor includes a first thin-film small electrode | 07-09-2009 |
| 20110216513 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other. | 09-08-2011 |
| 20110216514 | COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MANUFACTURING METHOD OF THE SAME - A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together. | 09-08-2011 |
| 20100085717 | MULTI-DIAMETER UNPLUGGED COMPONENT HOLE(S) ON A PRINTED CIRCUIT BOARD (PCB) - In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least one through-hole electrical component. The printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component. The at least one component hole includes a first section having a first diameter and a second section having a second diameter. The first diameter is different from the second diameter. Each of the first and the second sections are configured to receive solder paste for forming a solder joint with the at least one through-hole electrical component. | 04-08-2010 |
| 20120039056 | Component arrangement and method for production thereof - The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween. An improved electrical conductivity with constant mechanical stability is thus generated. | 02-16-2012 |
| 20110063811 | MULTILAYER PRINTED WIRING BOARD - A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner. | 03-17-2011 |
| 20100061069 | OPTOELECTRONIC MODULE FORM-FACTOR ADAPTER - In one example embodiment, an adapter module includes a body having a first form-factor and multiple receptacles extending into the body. Each of the receptacles is configured to receive an optoelectronic module having a second form-factor. The second form-factor is smaller than the first form-factor. The first form-factor may substantially conform to the CFP MSA, for example. The second form-factor may substantially conform to the SFP+ or QSFP MSA, for example. | 03-11-2010 |
| 20110317381 | EMBEDDED CHIP-ON-CHIP PACKAGE AND PACKAGE-ON-PACKAGE COMPRISING SAME - An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board. | 12-29-2011 |
| 20120206890 | METHOD FOR INTEGRATION OF CIRCUIT COMPONENTS INTO THE BUILD-UP LAYERS OF A PRINTED WIRING BOARD - The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout. | 08-16-2012 |
| 20120206889 | REPROGRAMMABLE CIRCUIT BOARD WITH ALIGNMENT-INSENSITIVE SUPPORT FOR MULTIPLE COMPONENT CONTACT TYPES - The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew. | 08-16-2012 |
| 20120300425 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 11-29-2012 |
| 20110090656 | TERMINAL STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF - A method for manufacturing an electronic device comprising a terminal provided with a conductor which penetrates a cured prepreg is provided. At least one opening is formed in the prepreg. The prepreg is attached to a substrate over which an electronic element is formed so that the conductor included in the terminal overlaps with the opening. A conductive paste is provided in a region of the prepreg where the opening is provided. Part of the conductive paste flows into the opening to be in contact with the conductor included in the terminal. Then, heat treatment is performed so that the conductive paste and the prepreg are cured. In the process for manufacturing the terminal, it is not necessary to perform a step of forming an opening with a laser beam after the prepreg is cured. Thus, an adverse effect of a laser beam on the electronic element can be eliminated. | 04-21-2011 |
| 20120314389 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board has a core structure having a first surface and a second surface on the opposite side of the first surface of the core structure, a first buildup structure formed on the first surface of the core structure and having insulation layers and conductive layers, and a second buildup structure formed on the second surface of the core structure and having insulation layers, conductive layers and an inductor device. The conductive layers in the second buildup structure include conductive patterns forming the inductor device, and one or more of the conductive patterns forming the inductor device has the thickness which is greater than the thicknesses of the conductive layers in the first buildup structure. | 12-13-2012 |
| 20120314390 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first circuit layer, an insulating layer, a second circuit layer, an intermediate frame, an electronic element, and a third circuit layer. The insulating layer is disposed on the first circuit layer, and the second circuit layer is disposed on the insulating layer. The intermediate frame is disposed on the second circuit layer and has an accommodating space. The electronic element is disposed on the second circuit layer, electrically connected to the second circuit layer and located in the accommodating space. The third circuit layer is disposed on the intermediate frame. | 12-13-2012 |
| 20120075818 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
| 20120188734 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including an insulative substrate having a cavity portion, an electronic device positioned in the cavity portion of the insulative substrate, an interlayer insulation layer made of an insulative material and formed on the insulative substrate and on the electronic device, and a conductive layer having a conductive pattern and formed on the interlayer insulation layer. The insulative substrate has a gap formed with respect to the electronic device in the cavity portion, the gap between the electronic device in the cavity portion and the insulative substrate is filled with an insulator made of the insulative material derived from the interlayer insulation layer, and the conductive pattern of the conductive layer has an enlarged-width portion across and directly over the gap. | 07-26-2012 |
| 20120081867 | Embedded isolation filter - The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure. | 04-05-2012 |
| 20100328913 | METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is mounted on an insulating layer of a conductive foil in a first step, the active side of the electronic component pointing in the direction of the conductive foil. In a second step, the conductive foil having the at least one electronic component mounted thereon is laminated to a circuit board substrate, the at least one electronic component pointing in the direction of the circuit board substrate. Finally, circuit tracks are developed by patterning the conductive foil, and the at least one electronic component is contacted. | 12-30-2010 |
| 20120281375 | CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN - A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole and having a first active surface and an opposing second active surface, wherein first electrode pads comprising signal pads, power pads, and ground pads are provided on the first active surface; a first dielectric layer provided on the first surface of the core board and the first active surface of the semiconductor chip and configured to fill a gap between the through-hole and the semiconductor chip so as to secure the semiconductor chip in position to the through-hole; and a first circuit layer disposed in the first dielectric layer so as to be flush with the first dielectric layer, provided with first conductive vias disposed in the first dielectric layer, and electrically connected to the first electrode pads. | 11-08-2012 |
| 20120092842 | ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF - An encapsulated circuit device has a substrate, components configured on a substrate surface portion of a component side of the substrate, an encapsulation, at least one electrical contact having an outer portion projecting out of the encapsulation and an inner portion provided in the circuit device that is electrically connected to the substrate. The encapsulation includes a rigid outer encapsulation, which extends completely around the substrate, the components and the inner portion of the at least one electrical contact, as well as a compressible deformation absorption layer, which is provided between the components and the outer encapsulation and at least completely covers the substrate surface portion on which the components are configured. | 04-19-2012 |
