Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Connection of components to board

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361748000 - Printed circuit board

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361783000 Having semiconductive device 179
361767000 With mounting pad 141
361761000 Component within printed circuit board 136
361782000 Having passive component 95
361772000 With specific lead configuration 71
361777000 By specific pattern on board 31
361781000 With switch 13
361765000 By direct coating of components on board 10
361780000 Different voltage layers 3
20090237903MOUNTING STRUCTURE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - A mounting structure includes: a first substrate; a second substrate; a first terminal being formed on the first substrate and having a plurality of terminal portions arranged with a gap therebetween; a different terminal being formed on the first substrate and being adjacent to the first terminal; and a second terminal being formed on the second substrate and being electrically connected to at least one of the terminal portions of the first terminal. Here, the first terminal is supplied with a potential higher than that supplied to the different terminal.09-24-2009
20090086452PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes parallel first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers at least partially overlapping in vertical alignment. Horizontal distance between midlines of the two differential traces is less than the width of either of the two differential traces.04-02-2009
20080198567MULTILAYER PRINTED CIRCUIT BOARD - Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.08-21-2008
Entries
DocumentTitleDate
20130044448Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement - A method for mounting a component to an electric circuit board (02-21-2013
20110199743Circuit board capable of loading high electrical current - The present invention is to provide a circuit board capable of loading high electrical current, which comprises an insulation plate and a plurality of conductive plates each positioned on the insulation plate by riveting. A plurality of first insertion holes of the insulation plate are aligned with a plurality of second insertion holes of the conductive plates, respectively, so that the aligned first and second insertion holes of the circuit board can be welded with a plurality of electric components (such as resistors, capacitors, fuses, etc.). Therefore, the insulation plate and each of the conductive plates can be easily combined with each other by riveting to form a finished product of the circuit board without some complicated steps including exposure, development and etching, so that the manufacturing process of the circuit board capable of loading high electrical current can be efficiently simplified.08-18-2011
20100142168DIE ASSEMBLIES - An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have first and second opposed lip surfaces and lip sidewalls extending between the first and second lip surfaces. The lip sidewalls are positioned adjacent to the flange sidewalls. The leads, which have inboard end portions and outboard end portions, are configured to preserve a seating plane. The seating plane is spaced apart from a plane of the second flange surface. The inboard end portions of the leads are embedded in the lip walls, and extend from the seating plane upward through the lip walls toward the first lip surfaces. The outboard end portions are aligned substantially within the seating plane.06-10-2010
20100149767ELECTRONIC ASSEMBLY FOR ATTACHMENT TO A FABRIC SUBSTRATE, ELECTRONIC TEXTILE, AND METHOD OF MANUFACTURING SUCH AN ELECTRONIC TEXTILE - An electronic assembly (06-17-2010
20090161328ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE - An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure.06-25-2009
20130077272Structure Design for 3DIC Testing - A work piece includes a first copper-containing pillar having a top surface and sidewalls, and a first protection layer on the sidewalls, and not over the top surface, of the first copper-containing pillar. A test pad includes a second copper-containing pillar having a top surface and sidewalls. The test pad is electrically coupled to the first copper-containing pillar. A second protection layer is disposed on the sidewalls, and not over the top surface, of the second copper-containing pillar. The first and the second protection layers include a compound of copper and a polymer, and are dielectric layers.03-28-2013
20090237898HEAT SINK ARRANGEMENT FOR ELECTRICAL APPARATUS - A printed circuit board (09-24-2009
20130033834Flat Panel Display Apparatus, Mother Substrate for Flat Panel Display Apparatus, Method of Manufacturing Flat Panel Display Apparatus, and Method of Manufacturing Mother Substrate for Flat Panel Display Apparatus - A flat panel display apparatus may include: a substrate; a display portion arranged on the substrate; an encapsulation substrate arranged to face the display portion; a sealing portion arranged between the substrate and the encapsulation substrate and surrounding the display portion; a wiring portion arranged between the substrate and the encapsulation substrate and having an area overlapping the sealing portion, and comprising a plurality of wiring members having different respective resistances; and a lead-in portion connected to the wiring portion and an external power source for applying a voltage to the wiring portion.02-07-2013
20130033833LAND GRID ARRAY INTERCONNECT FORMED WITH DISCRETE PADS - A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.02-07-2013
20090251872POWER SUPPLY ARCHITECTURE FOR STRUCTURAL ASIC - A power supply architecture for a structural application-specific integrated circuit (ASIC) is provided. The power supply architecture includes a first conductor and a second conductor. The first conductor is coupled to a fixed voltage. The first conductor at least passes through two edges of a cell. The first conductor and the second conductor are connected through a contact. The second conductor at most passes through one edge of the cell. The structural ASIC includes a first metal layer and a second metal layer. The first metal layer includes the first conductor. The second metal layer includes the second conductor.10-08-2009
20130027895INTERPOSER AND ELECTRONIC DEVICE USING THE SAME - There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness direction thereof, and a penetrating conductor disposed in the penetrating-hole. The substrate includes a first insulating layer and a second inorganic insulating layer which are separated from each other in the thickness direction, and a first resin layer interposed between the first inorganic insulating layer and the second inorganic insulating layer and being in contact with the first inorganic insulating layer and the second inorganic insulating layer. A coefficient of thermal expansion of the first resin layer in thickness and planar directions thereof is larger than those of the first inorganic insulating layer and the second inorganic insulating layer.01-31-2013
20130027894STIFFNESS ENHANCEMENT OF ELECTRONIC SUBSTRATES USING CIRCUIT COMPONENTS - Electrical components are mounted on a substrate and a stiffening member is mechanically coupled to the substrate to increase the stiffness of the substrate. The stiffening member includes passive devices that are electrically connected to the electrical components via traces on the substrate. The passive devices can be serially mechanically connected to each other so that the stiffening member extends across at least 60% of the substrate.01-31-2013
20130070436SYSTEMS AND METHODS FOR HIGH ASPECT RATIO FLIP-CHIP INTERCONNECTS - Interconnect and/or reflow methods of the present disclosure achieve high aspect ratio interconnects, for example interconnects having an aspect ratio as high as 4, in addition to wider interconnect height tolerances among interconnects (for example, interconnects having a height variability of up to about 30%) while still achieving reliable electrical connections. Moreover, flip-chip interconnects configured in accordance with principles of the present disclosure can provide improved z-axis spacing between die-to-die and/or die-to-substrate flip chip stacks, for example z-axis spacing as large as 600 μm. In this manner, additional spacing can be achieved for MEMS devices and/or similar components that are extendable and/or deformable out of the die plane.03-21-2013
20130070435POWER CONNECTOR AND MOTHERBOARD USING THE SAME - A power connector for mounting on a circuit board is provided. The power connector includes a case and several sets of pins. A set of pins includes several pins. Each one of one set of pins includes an embedded end, a median portion, and a distal end, where the embedded end protrudes from one side of the case, the median portion is angled from the embedded end; and the distal end is angled from the media portion and fixed to the circuit board. A part of the power connector case projects outside an edge of the circuit board.03-21-2013
20090303689CHIP CARD HOLDING MODULE AND ELECTRONIC DEVICE USING THE SAME - A chip card holding module (12-10-2009
20100097774ELECTRONIC COMPONENT COVER AND ARRANGEMENT - An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.04-22-2010
20090091902DISPLAY APPARATUS AND METHOD FOR REDUCING ELECTROMAGNETIC INTERFERENCE THEREOF - A display apparatus including a circuit board and a surface grounded portion which is disposed on an end portion of the circuit board and formed of a conductive layer. The display apparatus may include a signal receiver mounted on the circuit board, the signal receiver receiving a signal. The display apparatus may include a signal processor mounted on the circuit board, the signal processor processing signals received by the signal receiver.04-09-2009
20130058061ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal.03-07-2013
20110013373SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT - This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.01-20-2011
20120224343ELECTRICAL DEVICE - An electrical device includes a first substrate and a second substrate which are disposed in an opposing manner so as to interpose a functional element, a first electrode (rear surface electrode) which is provided more to the first substrate side than the functional element, a second electrode which is provided on the second substrate and is electrically connected to the first electrode, and a functional element and an electronic component which drives the functional element in a region which is a region where the first substrate and the second substrate overlap and which is interposed between the first electrode and the second electrode.09-06-2012
20120224342Flat Panel Display Apparatus, Mother Substrate for Flat Panel Display Apparatus, Method of Manufacturing the Flat Panel Display Apparatus, and Method of Manufacturing the Mother Substrate for the Flat Panel Display Apparatus - A flat panel display apparatus having improved encapsulating characteristics comprises: a substrate; a display unit on the substrate; a sealing substrate disposed facing the display unit; a sealing member between the substrate and the sealing substrate and surrounding the display unit; a wiring unit between the substrate and the sealing substrate and overlapping at least the sealing member, and including wiring members separated from each other; and an inlet unit electrically connected to a power source and the wiring unit for applying voltage to the wiring unit, and including an edge parallel with an outermost wiring member of the wiring unit. A mother substrate for the display apparatus comprises a substrate, a plurality of display units, a sealing substrate, a sealing member, wiring units, a connection unit, and an inlet unit. Methods of manufacturing the display apparatus and the mother substrate are also disclosed.09-06-2012
20120224341HEIGHT-ADJUSTABLE ELECTROMAGNETIC SHIELDING STRUCTURE - A height-adjustable electromagnetic shielding structure is located above an electronic element of a circuit board and includes an electromagnetic screen member, a connecting portion connected to the electromagnetic screen member, and a height stacking member. The height stacking member includes a coupling portion which is formed in a stepped structure and perpendicular to the electromagnetic screen member and circuit board, and contains an upper coupling portion and a lower coupling portion. The upper coupling portion has one end connected to the electromagnetic screen member through the connecting portion and another end connected to the lower coupling portion. At least two height stacking members are stacked over one another through the upper and lower coupling portions to perform height adjustment. The electromagnetic screen member, connecting portion and height stacking member are formed integrally, hence merely one set of mold is needed to reduce the cost.09-06-2012
20130063914SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT - This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.03-14-2013
20130063913POWER SOURCE CONTROL CIRCUIT MODULE - In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by an electrode non-formation portion are provided. The first, second, fourth, and fifth internal ground electrode are connected to the respective switching regulator devices. The third internal ground electrode is connected to the linear regulator device. The first to fifth internal ground electrodes are connected to respective different external ground terminals.03-14-2013
20130063912COF PACKAGING METHOD AND STRUCTURE FOR LCD DRIVER CHIPS - A COF packaging method and structure for LCD driver chips, the packaging structure comprises a substrate tape and a plurality of COF packaging units arranged consecutively along a direction the substrate tape is moved. Each of the packaging units includes a LCD driver chip, and a first lead and a second lead electrically connected to the LCD driver chip and distributed along two sides of the LCD driver chip. The LCD driver chip of each of the packaging units is parallel to the moving direction of the substrate tape, the first lead and the second lead of each of the packaging units are extended along a width of the substrate tape. By the method, the number and intervals of the leads are not limited by the width dimension of the substrate tape, in order to suit the requirements of large-sized liquid crystal panels.03-14-2013
20090237897Substrate Structures and Methods For Electronic Circuits - Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit path has a near side facing the substrate and has a far side facing away from the substrate. A circuit element has at least one bonding pad and is inserted into the opening after which the conductive bump is arranged to join the pad to the path. In another embodiment, the bump joins the pad to the near side of the path. In another embodiment, the path defines a hole and the bump fills the hole. In yet another system embodiment, the opening comprises a recess and associated vias. These embodiments may also have a second conductive circuit path carried on the first side and having a near side facing the substrate and a far side facing away from the substrate. The systems may then include a second circuit element and at least one second conductive bump. The second circuit element has at least one second bonding pad and the second conductive bump joins the second bonding pad to the far side of the second path. The substrate embodiments thus efficiently couple the second circuit element to the far side of one circuit path and couples the first circuit element to the near side of another circuit path. These system arrangements provide a number of packaging options that can be used to enhance packaging efficiency and reduce system costs.09-24-2009
20090231818ELECTRONIC ELEMENT MODULE AND ELECTRONIC DEVICE USING THE SAME - An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and at least a capacitor. In one embodiment, the circuit board has a plurality of contacts. The capacitor is disposed on the circuit board with a gap therebetween. Besides, the capacitor has a plurality of terminals electrically connected to the contacts correspondingly. The gap is filled with a glue.09-17-2009
20120113608METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.05-10-2012
20120236523BOARD UNIT AND METHOD OF FABRICATING THE SAME - A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin.09-20-2012
20120236522Method for forming an EMI shielding layer on an Electronic System - The present invention provides a method for forming a shielding layer on a sensor board. The sensor board includes an antenna array element. The sensor board is integrated into an electronic system. The method includes using a physical vapor deposition process to form the shielding layer on the sensor board to shield the sensor board from an electromagnetic signal generated by the electronic system, wherein the shielding layer and the antenna array element are respectively formed on two opposite surfaces of the sensor board.09-20-2012
20090016035ELECTRICAL POWER DISTRIBUTION UNIT AND ELECTRICAL PUNCHED GRID THEREFOR - An electrical power distribution unit (01-15-2009
20110279988MOTHERBOARD WITH CONNECTOR FOR EXTENDER - A motherboard has a cut-away so that it deviates from its rectangular outline. The motherboard has a connector disposed along one side for physically and electrically connecting the motherboard to a motherboard extender.11-17-2011
20120008293WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.01-12-2012
20080198565SURFACE MOUNT FOOT WITH COINED EDGE SURFACE - A surface mount device having a surface mount foot and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at least partially overlying the conductive base material. The stock is cut and formed to create a surface mount device having a surface mount foot extending therefrom. The surface mount foot has a top surface, a plated bottom surface and an at least one unplated side surface intermediate the top and bottom surfaces. The plated bottom surface is swaged to create a new plated coined edge surface intermediate the unplated side surface and the plated bottom surface of the surface mount foot.08-21-2008
20090034215Method and Apparatus for Providing Electrically Isolated Closely Spaced Features on a Printed Circuit Board - A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp.02-05-2009
20100134990COMPOSITE ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.06-03-2010
20090147487CABLE ROUTING STRUCTURE - A cable routing structure includes a flexible flat cable and a wiring board. The wiring board has a first side and a second side that is opposite the first side. The wiring board includes a cable attachment component, a first access component and a second access component. The cable attachment component is formed on the first side of a wiring board and electrically coupled to an end portion of the flexible flat cable. The first access component includes a first slit formed on the wiring board. The flexible flat cable extends through the first slit from the first side of the wiring board to a second side of the wiring board. The second access component is spaced from the first access component. The flexible flat cable extends through the second access component from the second side of the wiring board to the first side of the wiring board.06-11-2009
20090310318ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS - A technique for attaching components to PCBs involves providing a lead-free component and a PCB. The lead-free component has a package and lead-free component contacts, and the PCB has PCB contacts. The technique further involves disposing (e.g., printing) solder paste between the lead-free component contacts of the lead-free component and the PCB contacts of the PCB. The solder paste includes lead (Pb), a second metal (e.g., tin (Sn) and a third metal (e.g., Bismusth (Bi)). The technique further involves applying heat to melt the solder paste and form solder joints between the package of the lead-free component and the PCB contacts of the PCB. Such a technique is capable of concurrently mounting lead-free components as well as lead-based components to a PCB under lead-based assembly conditions (e.g., a temperature environment which does not exceed 230 degrees Celsius).12-17-2009
20110199744CIRCUIT MODULE - A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.08-18-2011
20100265680Pocket-enabled chip assembly for implantable devices - Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living organisms. The assembled biologically compatible pockets and circuit components can have biomedical applications, such as bioimplantable devices such as retinal, cochlear and cortical prosthesis implants, muscular stimulators, and other uses. In various embodiments, the described technology explains how to make and use pocket systems for dealing with chips having connectors on one or two surfaces, and with other circuit components such as resistors, capacitors, inductors and transistors. Operation of chips encapsulated according to the described technology is demonstrated. Accelerated life testing suggests that the pocket systems described will survive for years at 37 degrees C.10-21-2010
20130215584LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT - The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.08-22-2013
20090284939Alignment plate - A mounting material alignment plate of the present invention is operative to allow an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has dents formed on one surface, on which the electronic component is located, around the individual bores, and recesses formed on another surface opposite to the one surface on which the electronic component is located.11-19-2009
20110170272Sensor Device and Method for Manufacture - A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.07-14-2011
20120106107MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A mounting structure includes: an electronic component including: a functional element having a predetermined function; a first resin protrusion section having a surface covered by a covering film including a conductive section electrically connected to the functional element; and a second resin protrusion section that is disposed inside an area surrounded by the first resin protrusion section, and has adhesiveness at least on a surface of the second resin protrusion section, and a base member having a connection electrode and adapted to mount the electronic component. In the structure, the second resin protrusion section mounts the electronic component on the base member in a condition in which the conductive section of the covering film has conductive contact with the connection electrode due to elastic deformation of the first resin protrusion section.05-03-2012
20090154120ELECTRONIC COMPONENT AND CIRCUIT BOARD - An electronic component, including: a first terminal group including a plurality of functional terminals provided along a first side of the electronic component; a second terminal group including a plurality of functional terminals provided along a second side of the electronic component opposing the first side; and an element that is connected to at least one of the functional terminals of the first terminal group and to at least one of the functional terminals of the second terminal group. The first terminal group includes a first dummy terminal in at least one space between the functional terminals of the first terminal group; the second terminal group includes a second dummy terminal in at least one space between the functional terminals of the second terminal group; and the first and second dummy terminals are not connected to any element inside the electronic component.06-18-2009
20090279271INTRA-CONNECTION LAYOUT OF ARRAY - An intra-connection layout of array is disclosed. An alterable area is disposed between the devices of a device array. The alterable area includes an insulation layer, a plurality of first conductive wires and a plurality of second conductive wires. The first conductive wires are disposed within the alterable area along a first direction for selectively connecting electrical paths in the first direction between different devices. The second conductive wires are disposed within the alterable area along a second direction for selectively connecting electrical paths in the second direction between different devices. The insulation layer is disposed within the alterable area and between the above-mentioned first conductive wires and second conductive wires, wherein the insulation layer has an opening to allow one of the first conductive wires and one of the second conductive wires to be contacted with each other.11-12-2009
20080212297Flash Memory Device Assembly Using Adhesive - A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.09-04-2008
20080212298ELECTRICAL CONNECTOR AND SYSTEM FOR A COMPONENT IN AN ELECTRONIC DEVICE - The disclosure describes a printed circuit board (PCB) for use in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting an electronic device; and a connector for receiving connections from the electronic device. In the PCB, the connector is located on either the bottom side or the edge of the side of the PCB. The electronic device can be a display module.09-04-2008
20100110649Suspension board with circuit - A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.05-06-2010
20100277880ELECTRONIC PACKAGE STRUCTURE - The present invention discloses an electronic package structure, which comprises an electronic element, a plurality of SMA (Shape Memory Alloy) connection portions, and a plurality of solder connection members. One side of the SMA connection portion is joined to the electronic element, and the solder connection member is arranged over the other side of the SMA connection portion. The SMA connection portions can comply with the strains caused by thermal stresses during the operation of the electronic product and can restore the original shape after the thermal stresses disappear. Therefore, the preset invention can prevent the junctions between the SMA connection portions and the electronic element/the solder connection members from the crack or disconnection caused by thermal stresses.11-04-2010
20090002962Circuit protection element and a circuit board with the circuit protection element - A circuit protection element and a circuit board with the circuit protection element are disclosed. The circuit protection element includes a metal base, and at least one opening slot located at the metal base. The metal base forms a positioning portion. One end of the metal base is fastened onto a circuit board. The bottom of the free end of the metal base contacts a conducting point located on the circuit board to make the circuit be in a conducting status. When the current is overloaded or the circuit is over-heated, the bottom of the free end of the metal base is heated so that the bottom of the free end of the metal base separates from the conducting point and the positioning portion is wedged with the circuit board. Thereby, the circuit becomes a broken circuit. The circuit protection element can prevent the electronic components from being burnt down.01-01-2009
20090002961PACKAGING SYSTEM WITH HOLLOW PACKAGE - A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.01-01-2009
20090168378ELECTRONIC APPARATUS - According to an aspect of the present invention, there is provided an electronic apparatus including: a wiring that is formed on a mounting surface; a terminal that is electrically connected with the wiring; a terminal holder that is disposed above the mounting surface to face the wiring and that holds the terminal in a space between the terminal; and a blocking member that is disposed on the terminal holder at a side facing the mounting surface, that surrounds the terminal and that is separated from the mounting surface to regulate a gap between blocking member and the mounting surface so that the terminal is prevented from passing therethrough when the terminal is broken off from the terminal holder.07-02-2009
20100265681Memory Card Reader - A memory card reader is provided, which includes a printed circuit on which a memory card connector is mounted. The memory card connector has a slot intended for inserting a memory card and a set of contact points enabling data exchange between the memory card and a processor mounted on the printed circuit. The printed circuit is further equipped with an anti-intrusion device formed and positioned such that the anti-intrusion device prevents access, from the exterior of the reader, to at least one connection portion between at least one of the contact points of the set of contact points and the printed circuit.10-21-2010
20100208437MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring substrate of the present invention has a laminated structure composed of conductor layers and resin insulating layers stacked alternately. A plurality of surface connection terminals to which terminals of a chip component are to be surface-connected are formed on a main face of the laminated structure. A plurality of via conductors connected to the plurality of surface connection terminals are formed in the resin insulating layers. Each of the plurality of surface connection terminals has a structure in which a copper layer, a nickel layer, and a gold layer are stacked in this sequence. The gold layer is larger in diameter than at least the copper layer. The gold layer has an overhanging portion which extends radially outward from a circumference of the copper layer.08-19-2010
20080253096Electronic component mounting structure - An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.10-16-2008
20080285244TEMPORARY CHIP ATTACH CARRIER - A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second array of interconnects disposed on a top surface of the substrate, corresponding interconnects of the first and second arrays of interconnects electrically connected by wires in the substrate; an interposer, a first array of pads disposed on a top surface of the interposer and a second array of pads disposed on a bottom surface of the interposer, corresponding pads of the first and second arrays of pads electrically connected by wires in the interposer, and pads of the second array in direct physical and electrical contact with corresponding interconnects of the second set of interconnects; and wherein the interposer includes an interposer substrate of the same material as a substrate of the integrated circuit chip.11-20-2008
20110007487LSI PACKAGE, PRINTED BOARD AND ELECTRONIC DEVICE - A technology capable of reducing a crosstalk noise generated between through holes of an LSI package and a printed board at low cost is provided. In an electronic device in which an LSI package is mounted on a printed board, a plurality of transmission terminals and a plurality of reception terminals are provided, and the plurality of transmission terminals include transmission terminal pairs which transmit a differential signal and the plurality of reception terminals include reception terminal pairs which receive the differential signal. In the LSI package, two transmission terminal pairs and two reception terminal pairs are respectively adjacent to each other and are arranged so that a line which connects the terminals of one pair intersects with a line which connects the terminals of the other pair.01-13-2011
20110007486DUAL-LEVEL PACKAGE - Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.01-13-2011
20090097217STRUCTURE OF ELECTRONIC CONNECTOR - A structure of an electronic connector that can be plugged by inserting from top-to-down direction is disclosed. The electronic connector has a connector case and a Seat connector. The connector case has a plurality of terminal holes for receiving terminals, and a recession is formed at the center of the connector case. A buckle is formed underneath the recession, and has a protrusion hook. The seat connector case has a plurality of terminal holes for receiving terminals, and buckling troughs corresponding to the buckles on the connector case, and the buckling troughs have a buckling plate extending there-from.04-16-2009
20100142167ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION - An electronic, in particular microelectronic, functional group and to a method for its production are described. The method can include the following steps: a) coating of a mount with a non-conductive adhesive; b) application of a conductor structure to a subarea of the adhesive layer; c) arrangement of an electronic component with at least one external electrical connecting contact on the adhesive layer and on the conductor structure, with the at least one connecting contact of the electronic component being brought directly into contact with the conductor structure, and with a part of the outer casing of the component being brought directly into contact with the adhesive layer. The method can allow electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.06-10-2010
20090129036SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A semiconductor device includes: a wiring substrate that includes multiple connection pads provided on a top surface thereof and multiple lands provided on a bottom surface thereof and electrically connected to the connection pads, respectively; a semiconductor chip that is mounted on the top surface of the wiring substrate; multiple electrode pads provided on the semiconductor chip; wirings that electrically connect the electrode pads and the connection pads, respectively; a seal that is made of an insulating resin and covers at least the semiconductor chip and the wirings; and a through hole that is provided on a peripheral region of the wiring substrate, into which a fixing member is to be attached by insertion05-21-2009
20090161329SEMICONDUCTOR DEVICE - In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.06-25-2009
20080316721ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE - An electrode structure body of the present invention is composed of a metal electrode, and a solder alloy layer (a tin/nickel alloy layer) formed on a surface of the metal electrode. The solder alloy layer is obtained by reflow-heating the solder layer formed on the metal electrode and then removing the solder layer. This electrode structure body can be applied to an external connection electrode of an electronic component or a mounting substrate.12-25-2008
20080316722WIRING BOARD AND METHOD FOR MAKING THE SAME - A wiring board includes a substrate having an adhesive surface, a first wiring, and a second wiring. The adhesive surface is in contact with the first wiring and the second wiring. The first wiring has a penetrating hole extending in a direction perpendicular to the adhesive surface. The second wiring has a first region, a second region, and a third region, which are adjacent regions arranged in that order. The first region is inside the penetrating hole in the first wiring and in contact with a first portion of the adhesive surface that forms part of the penetrating hole. The second region is in contact with the first wiring and faces the first wiring and the substrate. The third region is in contact with a second portion of the adhesive surface outside the first portion.12-25-2008
20120069536INTEGRATED OVERMOLDED INTERCONNECT TAB FOR SURFACE-MOUNTED CIRCUITS - An integrated interconnect tab that provides a mechanically repeatable connection point to electrical components mounted on a printed circuit board. The integrated interconnect tab comprises a conductive pad surrounded by a vertical sidewall structure formed in an overmolded insulating layer. In one embodiment, a large pad accommodates connections to high-power circuit elements such as batteries and high-voltage capacitors. The sidewall structure helps align and guide the position of an interconnecting device such as a wire ribbon connector, facilitating automation of a subsequent attachment process. An automated method of making a PCB assembly having integrated interconnect tabs entails attaching circuit elements and interconnect tabs to a surface of a PCB substrate, encapsulating the attached components, and selectively machining the encapsulating layer to expose weld tabs, to form the vertical sidewall structure surrounding the tabs, and to create mechanical retention features to aid in welding.03-22-2012
20090141464WIRING BOARD AND ELECTRONIC COMPONENT DEVICE - A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.06-04-2009
20110141711ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An electronic component embedded printed circuit board and a method of manufacture the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a dielectric core substrate, which has a cavity formed therein, an electronic component, which is housed in the cavity and has an electrode formed on one surface thereof, an insulation layer, which is formed on both surface of the dielectric core substrate, a via, which is formed in the insulation layer such that the via is electrically connected to the electrode, and a first circuit pattern, which is formed on the insulation layer such that the first circuit pattern is electrically connected to the via.06-16-2011
20090086449OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. The recess has a two-level structure of a bottom recess and a portion located over the bottom recess. A stepped portion extends from an upper end of a first side surface of the bottom recess to a lower end of a second side surface of the bottom recess.04-02-2009
20110222253Electronic assembly with detachable components - The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.09-15-2011
20090103274WARPAGE PREVENTING SUBSTRATES AND METHOD OF MAKING SAME - Consistent with an example embodiment, there is an apparatus comprising a circuit (04-23-2009
20090244863MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - A mounting device (10-01-2009
20090257208COMPACT PACKAGING FOR POWER AMPLIFIER MODULE - A semiconductor die for power amplification includes a substrate comprising a front surface and a back surface, a power amplifier on the front surface of the substrate and is configured to amplify an input signal received at an input node and to output an amplified signal at an output node; a first electric terminal on the front surface of the substrate, wherein the first electric terminal is electrically coupled to the input node of the power amplifier; a second electric terminal on the back surface of the substrate, and a first via that runs from the front surface to the back surface of the substrate and electrically connects the first terminal and the second electric terminal. The second electric terminal can receive the input signal that is to be received by the input node of the power amplifier.10-15-2009
20100157555Process to Allow Electrical and Mechanical Connection of an Electrical Device with a Face Equipped with Contact Pads - A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device is presented. The electrical device includes a face equipped with contact pads. The method includes applying an adhesive layer on the face equipped with contact pads. The adhesive layer is composed of a substance with adhesive properties. The method further includes creating a plurality of openings through the adhesive layer over each contact pad, and growing electrolessly or electrochemically, small metal sticks in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.06-24-2010
20100165590ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - According to one embodiment, an electronic device includes an electronic component and a circuit board. The electronic component includes a metal material. The circuit board includes a first surface on which the electronic component is mounted and a second surface opposite the first surface. The electronic component includes a contact surface configured to be in contact with the first surface, and is configured to have the center of gravity at a location displaced from the center of the contact surface. The electronic component is temporarily fixed by a magnetic force that attracts the metal material from the second surface with the contact surface being in contact with the first surface.07-01-2010
20100182759 Component For Reducing Mechanical Stress On A PCB - A component for mounting on a PCB, intended to support an electronics component, with an extension in the longitudinal, lateral and vertical directions. The component has a first and a second main surface, the second main surface being intended for mounting on the PCB. The component is made in a non conducting material, with a first layer of conducting material arranged on its first main surface, the conducting layer being connected to a conducting layer on the second main surface of the component by electrically conducting means. The component's extension in the vertical direction is smaller than its extension in either the longitudinal or lateral direction.07-22-2010
20100259908EXPOSED DIE PAD PACKAGE WITH POWER RING - A packaged semiconductor is disclosed. The packaged semiconductor comprises a conductive integral frame that includes an inner portion and a ring portion encircling the inner portion, a semiconductor die that is mounted to a first surface of the inner portion of the conductive frame, and a casing that supports the conductive frame and covers the semiconductor die. Sections of the conductive frame that connect the inner portion to the ring portion are removed after the casing is applied to the conductive frame.10-14-2010
20130215583Embedded Electrical Component Surface Interconnect - An electrical component package is disclosed comprising: an electrical component having an embedded surface, a structure attached to the electrical component opposite the embedded surface, a conductive adhesive directly attached to the embedded surface, where the conductive adhesive is shaped to taper away from the embedded surface, and an encapsulation material covering the conductive adhesive and the electrical component. In various embodiments, the tapered conductive adhesive facilitates the securing of the conductive adhesive to the electrical component by the encapsulation material. Also disclosed are various methods of forming an electrical component package having a single interface conductive interconnection on the embedded surface. The conductive interconnection is configured to maintain an interconnection while under stress forces. Further disclosed in a method of applied a conductive adhesive that enables design flexibility regarding the shape and depth of the conductive interconnection.08-22-2013
20100238637SUBMOUNT FOR ELECTRONIC COMPONENTS - A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.09-23-2010
20100226107METHOD AND SEMIFINISHED PRODUCT FOR PRODUCING AN INLAY - The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two electronic components, all electronic components being arranged in a relative configuration on a carrier substrate to implement a component configuration and the component configuration being arranged in a filler material. Furthermore, the invention relates to a method for producing a card having a semifinished product and a card produced using the semifinished product.09-09-2010
20100254106LATCHING APPARATUS FOR FACILITATING DOCKING OF AN ELECTRONIC COMPONENT - A latching apparatus is coupled to a first electronic component for facilitating docking to a second electronic component. The apparatus includes a pivotable actuation handle, and slide and pivotable linkages. The slide linkage couples to the pivotable actuation handle and is slidable in directions which the first component docks to the second component. The pivotable linkage is also coupled to the slide linkage and includes a latching hook at its distal end. With the first component disposed for docking relative to the second component, pivotal actuation of the handle to open is translated to pivotal movement of the pivotable linkage to facilitate aligning the latching hook over a hook pocket of the second component, and pivotal actuation of the handle closed is translated to pivotal movement of the pivotable linkage to engage the hook pocket, and thereby draw the first component into docked relation with the second component.10-07-2010
20100208438Method for the Production and Contacting of Electronic Components by Means of a Substrate Plate, Particularly a DCB Ceramic Substrate Plate - One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.08-19-2010
20120140426PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller.06-07-2012
20090116203MOUNTING STRUCTURE - A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.05-07-2009
20090284940Alignment plate - A mounting material alignment plate of the present invention is operative to place an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has first dents formed on one surface, on which the electronic component is located, around the individual bores, and second dents formed on another surface opposite to the one surface on which the electronic component is located.11-19-2009
20090323299ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME - An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.12-31-2009
20130128480CIRCUIT ARRANGEMENT FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS - A circuit arrangement includes at least one electronic and/or electrical component and a carrier. The at least one electronic and/or electrical component is conductively connected to the carrier by at least one solder layer while forming an air space between the electronic and/or electrical component and the carrier. At least one three-dimensional mounting structure is integrated in the carrier and the at least one electronic and/or electrical component is arranged axially between at least two contact regions of the mounting structure.05-23-2013
20110032683POWER MODULE AND CIRCUIT BOARD ASSEMBLY THEREOF - A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.02-10-2011
20080304243CIRCUIT BOARD - A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.12-11-2008
20090109641Wafer of circuit board and joining structure of wafer or circuit board - A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion 04-30-2009
20130135834TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING TERMINAL STRUCTURE - The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E05-30-2013
20110122591HYBRID FABRIC MATERIALS, AND STRUCTURAL COMPONENTS INCORPORATING SAME - Composite structural components are disclosed that include electrically conducting fibres providing signal power paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component. Also disclosed is a flexible or drapable fabric containing electrically conducting fibres for similar purposes, and materials for making up said structure and fabrics and methods for the production thereof.05-26-2011
20110122590EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS - Disclosed is a low viscosity, low to no chloride containing epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of capillary underfill compositions.05-26-2011
20110122589MAGNETIC ELEMENT HAVING IMPROVED TRANSFORMERS AND COMMOM MODE CHOKES - A magnetic element (05-26-2011
20110242778Electrical Connections for Anodized Thin Film Structures - Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier. The second metallization layer is disposed over the anodized layer, making electrical contact with the first electrically conductive layer in the via connection region.10-06-2011
20110026232SYSTEM-IN PACKAGES - System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.02-03-2011
20110249417ANISOTROPIC CONDUCTIVE RESIN, SUBSTRATE CONNECTING STRUCTURE AND ELECTRONIC DEVICE - An anisotropic conductive resin includes a thermosetting resin and an alloy. A relationship of T10-13-2011
20110019372PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS - Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.01-27-2011
20110019373Sensing Arrangement - The invention relates to an arrangement for sensing ambient conditions in electric equipment. These conditions may include verification of the user, the location of the equipment and various properties of the environment. The invention is preferably applied in mobile terminals. One idea of the invention is to provide a sensor arrangement with a substrate (01-27-2011
20090034216LOW PROFILE DIMM BOARD - A primary memory board is disclosed. The primary memory board comprises a printed circuit board (PCB) having a front side and a back side, a plurality of DIMM surface mount connectors, and at least one component. The plurality of DIMM surface mount connectors are mounted on the front side of the PCB. The at least one component is mounted on the back side of the PCB and is positioned opposite the location of at least one of the plurality of DIMM surface mount connectors mounted on the front side of the PCB.02-05-2009
20110128711PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BETWEEN THE PACKAGE AND A SUBSTRATE OR ANOTHER PACKAGE - Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.06-02-2011
20110242776PRINTED CIRCUIT BOARD SENSOR MOUNTING AND ALIGNMENT - Sensors modules adapted to be mounted to a motherboard under challenging conditions by using automated manufacturing processes are disclosed. A sensor module can include a sensor mounted to a sensor PCB, a connector coupled to the sensor and having a plurality of guide pins extending therefrom in a vulnerable manner, with the guide pins being adapted to be inserted into guide pin holes on an associated motherboard, and a disposable carrier adapted to hold the connector and protect the guide pins thereof prior to mounting. The disposable carrier is removed from the sensor module before the sensor module is mounted directly to a motherboard by press-fitting the guide pins into guide pin holes on the motherboard and soldering connections thereto in an automated surface mounting operation. Disposable carrier protected sensor modules can be stored and processed in a tray or tape-and-reel automated manufacturing system.10-06-2011
20120188731FIELDBUS INTERFACE CIRCUIT BOARD SUPPORTING MULTIPLE INTERFACE TYPES AND TERMINATIONS - An interface circuit board apparatus can include a shared circuit board base, a transceiver section disposed on the circuit board base, and having circuit transceiver sites configured to receive a plurality of transceiver component types, a termination section disposed on the circuit board base, and having circuit termination sites configured to receive a plurality of termination component types, and a connection section operatively coupled to the transceiver and termination sections, wherein the transceiver section, the termination section and the connection section are configurable to support a plurality of interface types based on the plurality of transceiver component types and the plurality of termination component types.07-26-2012
20120243191MINIATURIZED ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF - A miniaturized electromagnetic interference (EMI) shielding structure is disclosed, which includes a substrate and a plurality of chip modules disposed thereon. The substrate has a plurality of ground portions formed thereon. Each chip module includes: at least one chip unit disposed on the substrate and connected electrically thereto; at least one conductive bump disposed on the substrate adjacent to the chip unit and connected electrically to the corresponding ground portion; an encapsulation layer arranged on the substrate and covers the chip unit and the conductive bump; and an EMI shielding layer covering the encapsulation layer and electrically connected with an exposed surface of the conductive bump, to allow the EMI shielding layer be electrically connected to the ground portion. The disclosure of the present invention allows each chip module to have its own EMI shielding capability.09-27-2012
20100053919Device for the Protection of an Electronic Component - The invention relates to a protection device fixed to a support and covering an electronic component. The protection device comprises at least a first wall corresponding to a first portion of printed circuit comprising at least a first conductive track, the first wall comprising at least a first mechanical guide element; at least a second wall corresponding to a second portion of printed circuit comprising at least a second conductive track, the second wall comprising at least a second mechanical guide element which interacts with the first guide element; and spot welds connecting the first wall to the second wall, at least one of the spot welds also electrically connecting the first conductive track to the second conductive track.03-04-2010
20100053918ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR - An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.03-04-2010
20110149536Electronic device having auxiliary member - An electronic device includes: a substrate having multiple terminal lands and multiple through holes; an electric element including multiple terminals coupled with respective terminal lands and a body on the substrate; and an auxiliary member for assisting fixation between the electric element and the substrate. The auxiliary member includes a base fixed to the body and multiple leg portions extending from the base and inserted into respective corresponding through holes. The leg portions include a pair of locking parts, each having a latch and a spring. The latch is disposed on an insertion end of the leg portion, and is latched around the through hole on the substrate. The spring is deformable when the latch is inserted into the through hole. The pair of locking parts are inserted into two different through holes, respectively.06-23-2011
20110044015MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME - A multichip module comprising: a base substrate; a wiring board disposed on the base substrate and having a wiring pattern; an adhesive layer configured to bond the base substrate to the wiring board while maintaining an electrical connection between the base substrate and the wiring board; and a plurality of chips connected to a surface of the wiring board, the surface being opposite the adhesive layer, wherein, assuming that α is a coefficient of thermal expansion of the wiring board, β is a coefficient of thermal expansion of the base substrate, and γ is a coefficient of thermal expansion of the adhesive layer, the relationship α<γ<β is satisfied.02-24-2011
20110249416CIRCUIT MODULE - In a circuit module, a chip element is mounted on a mount electrode, with an outer electrode interposed therebetween. The chip element is arranged such that a cut surface thereof is oriented toward a side of a circuit module that is adjacent to the mount electrode. A gap that is observable from outside of the circuit module is provided between a bottom surface of a base of the chip element and a top surface of a circuit board.10-13-2011
20100079964Method for Producing an Arrangement of Optoelectronic Components, and Arrangement of Optoelectronic Components - A method for producing an arrangement of optoelectronic components (04-01-2010
20080247143CHIP MOUNTING APPARATUS AND CHANGING METHOD FOR SEPARATION FACILITATION HEAD IN CHIP MOUNTING APPARATUS - In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allowed to access to the separation facilitation head keeping part by a moving mechanism to automatically carry out a changing operation for changing the separation facilitation head between the separation facilitation head keeping part and a separation facilitation head attaching part provided in the chip separation facilitation unit without annoying operator's hands. Thus, the separation facilitation head can be automatically changed to improve the operation rate of the apparatus.10-09-2008
20090190318Holding Member, Mounting Structure In Which Holding Member Is Mounted On Electronic Circuit Board, And Electronic Component Including Holding Member - A holding member, for an electronic component inserted into a through hole provided in an electronic circuit board which includes a plate-shaped base that is fixed to the electronic component, a first leg and a second leg. The first leg extends from the base, and is inserted into the through hole. The first leg has a catch that projects laterally and outwardly with respect to an inserting direction in which the first leg is inserted into the through hole and locked with an edge of the through hole after the first leg is inserted. The second leg extends from the base and is inserted into the through hole together with the first leg. The second leg elastically deforms when the second leg comes into contact with an inner surface of the through hole, presses the first leg to an opposite side inner surface of the through hole, and elastically holds the catch in a state in which the catch is locked with the edge of the through hole after the second leg is inserted.07-30-2009
20090109640OPTICAL ENGINE - An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material.04-30-2009
20080239683Method and Apparatus for Electrically Connecting Two Substrates Using a Land Grid Array Connector Provided with a Frame Structure Having Power Distribution Elements - A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.10-02-2008
20080205009Electronic apparatus and mounting method - An electronic apparatus includes: a package body that has a tabular outside shape and is packaged with a built-in electronic circuit; a bump that electrically connects the electronic circuit inside the package body to a wiring outside the package body; a wiring board that has a wiring at least on its surface, the wiring board mounted with the package body so that the electronic circuit of the package body is electrically connected to the wiring via the bump; and an adhesive that bonds the package body onto the wiring board so as to bond only an edge of the package body to the wiring board.08-28-2008
20110164390ELECTRICAL INTERCONNECT - There is provided an electrical interconnect. The electrical interconnect is assembled by providing at least two elongated metallic strips, and joining each one of the at least two elongated metallic strips to an operative surface of an insulating layer. The electrical interconnect is provided for electrically connecting two electrical circuits. In this respect, an electrical assembly is also provided including the electrical interconnect and first and second electrical circuits. The first and second electrical circuits are electrically connected by the electrical interconnect.07-07-2011
20100284160MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE - A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.11-11-2010
20110134617POLYMER MOLDED BODIES AND PRINTED CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF - The present invention relates to polymer moldings with conductive, especially electrically conductive, structures on the surface, and to a process for production of these polymer moldings. A further aspect of the invention relates to the use of a device for production of the conductive, especially of the electrically conductive, structures on the surface of the polymer molding. The invention additionally relates to the use of an adhesive comprising carbon nanotubes (CNTs) for electrically conductive bonding of an electronic component to another electrically conductive component or molding.06-09-2011
20120147577MOUNTING STRUCTURE FOR ANTENNA OF ELECTRONIC DEVICE - A mounting structure for an antenna of an electronic device includes a casing and a tube assembly. The tube assembly encloses the antenna of the electronic device. The mounting structure includes a securing member mounted on the casing and a protruding portion protruding out from the casing. A receiving hole is defined in the protruding portion. The securing member includes a securing portion, and the securing portion is with an opening therein. The securing portion is aligned with and spaced from the protruding portion. Opposite ends of the tube assembly are inserted into the through hole of the protruding portion and the opening of the securing portion, respectively.06-14-2012
20090207573ELECTRONIC MODULE COMPRISING MOUNTING TAGS - An electronic module MO08-20-2009
20110255257AUXILIARY BOARD JOINING STRUCTURE - The auxiliary board joining structure further includes a plurality of positioning holes 10-20-2011
20110096518ELECTRONIC CIRCUIT MODULE AND METHOD OF MAKING THE SAME - An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.04-28-2011
20100195300Electronics device module - Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.08-05-2010
20100195299Integrated multicomponent device in a semiconducting die - An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.08-05-2010
20110188216GROUNDING STRUCTURE AND ELECTRICAL DEVICE - A grounding structure, for connecting to an opposite connecting electrical device with a metal casing, is assembled on a circuit board having at least one grounding component. The grounding structure includes a conductive mechanism electrically connected to the metal casing of the opposite connecting electrical device; and at least one conductive pad, disposed between the conductive mechanism and the circuit board, and contacting the conductive mechanism and the grounding component of the circuit board. The grounding structure of the invention can transmit the disturbance to be advantageous for signal transmitting between the opposite connecting electrical device and the circuit board.08-04-2011
20110149537HEAT-RADIATING COMPONENT AND ELECTRONIC COMPONENT DEVICE - A heat-radiating component is bonded via a thermal interface material (TIM) to an electronic component (chip) mounted on a wiring board. The heat-radiating component includes a plate-like portion thermally bonded to the chip through the TIM, and a foot portion formed on a surface which faces the electronic component, of the plate-like portion. The foot portion is formed in a ring shape at a position which surrounds a region corresponding to a mounting area of the electronic component, on the inner side of the periphery of the plate-like portion.06-23-2011
20090175009Hook structure and device having hook structure - A hook structure for combining an element on a print circuit board tightly includes a body, at least one extension and at least one hooking portion. The body is fixed to the element. The extension extends from the bottom of the body. The hooking portion is provided on one end of the extension. One side of the hooking portion is formed with a hooking surface and a horizontal plane. One end of the hooking surface is connected to the horizontal plane. The height difference between two ends of the hooking surface is larger than the distance between the horizontal plane and the print circuit board. The hooking portion is hooked to the print circuit board. Via this arrangement, the element can be positioned and fixed on the print circuit board, so that the device can be combined on the print circuit board tightly.07-09-2009
20090175008Electrical connection interfaces and methods for adjacently positioned circuit components - Electrical components, such as packaged integrated circuit devices that are mountable on a substrate surface, are provided with at least one exposed electrical contact on a side surface of the component that will be substantially perpendicular to the substrate surface when the component is mounted. Two such components can be mounted side-by-side on the substrate surface with the above-mentioned contacts close to one another between the above-mentioned side surfaces. An electrical connection between the contacts can be made (or perfected) by depositing an electrically conductive connector material in contact with both of the contacts between the above-mentioned side surfaces.07-09-2009
20120307465SOLDERLESS PRINTED WIRING BOARDS - A method of forming solder-less printed wiring boards includes attaching a electronic components to a workpiece using an adhesive material. A mold material is added to partially cover the electronic components to form a sub-assembly including the electronic components attached to the mold material and a planar surface on the workpiece side. At least tops of the electronic components extend beyond a height of the mold material. The adhesive material is removed to separate the workpiece and sub-assembly. A first prepreg dielectric is attached to the planar surface of the mold material. First vias are formed in the first prepreg dielectric to expose bondable contacts of the electronic components. The first vias are filled with electrically conductive plugs to provide connections to the bondable contacts of the electronic components. A circuit layer is formed on a surface of the first prepreg dielectric to provide contact to the first plugs.12-06-2012
20100046182CIRCUIT BOARD INTERCONNECTION SYSTEM, CONNECTOR ASSEMBLY, CIRCUIT BOARD AND METHOD FOR MANUFACTURING A CIRCUIT BOARD - A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance.02-25-2010
20120039055DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD - Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion.02-16-2012
20110317380PRINTED CIRCUIT BOARD AND VOLTAGE/CURRENT MEASURING METHOD USING THE SAME - A PCB includes an outer layer and an inner layer. An electronic component is mounted on the outer layer. The outer layer further defines a first pad, a second pad, a third pad, a fourth pad, and a number of via holes. The electrical performances of the first pad and the second pad are the same to that of the inner layer. The first pad and the second pad are conducted to the electronic component. The third pad and the fourth pad are respectively conducted to the first pad and the second pad through the electronic component. The electrical performances of the third pad and the fourth pad are different from that of the inner layer. The via holes are respectively electrically connected to the third pad and the fourth pad.12-29-2011
20120002386Method and Apparatus for Improving the Reliability of Solder Joints - In accordance with an example embodiment of the present invention, a method, comprises receiving an integrated circuit component comprising at least one solder ball substantially surrounded by a first epoxy flux, applying a second epoxy flux to at least one integrated circuit component contact point of a printed circuit board, and performing a reflow process such that the integrated circuit component adheres to the printed circuit board and the first and second epoxy flux forms an encapsulating layer around at least one solder joint.01-05-2012
20090046439WLAN SIP module - The present invention provides a SiP module for wireless local area network comprising a base. A control unit is formed on a first surface of the base and a RF front end components is formed on a second surface of the base and coupled to the control unit through the base. A plurality of group of bumps is arranged on the first surface and coupled to the control unit, and separated with one another to reduce the interference.02-19-2009
20090168379ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.07-02-2009
20120014078Electronic Component Structure and Electronic Device - According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.01-19-2012
20120063105ELECTRONIC DEVICE WITH CABLE - An electronic device includes a chassis, a bracket received in the chassis and a cable. A storage device is received in the bracket, and a wire is connected to the storage device. A motherboard is attached to the chassis, and at least two inserting slots are located on the motherboard. A first circuit board is electronically connected to the wire. The cable is electronically connected to the first circuit board and includes a connecting component and at least two connectors. The connecting component is electronically connected to the first circuit board, and the at least two connectors are electronically connected to the at least two inserting slots.03-15-2012
20120206888SENSOR ARRANGEMENT AND CHIP COMPRISING ADDITIONAL FIXING PINS - An electronic chip, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin.08-16-2012
20120300424Crystal Device Without External Package and Manufacturing Method Thereof - The disclosure discloses a crystal device without an external package, which comprises: a crystal body (11-29-2012
20110080713INTERPOSER MOUNTED WIRING BOARD AND ELECTRONIC COMPONENT DEVICE - An interposer mounted wiring board includes a wiring board including outermost wiring layers respectively on both surfaces thereof, the outermost wiring layers being electrically connected to each other through an inside of the board, and first and second interposers electrically connected to the outermost wiring layers on the both surfaces of the board, respectively. Each of the first and second interposers has a value of a coefficient of thermal expansion (CTE), the value being equal or close to a value of a CTE of a corresponding one of first and second electronic components to be mounted respectively on the first and second interposers. The base member of each of the interposers is preferably formed of silicon, and the base member of the wiring board is preferably formed of resin. Further, the electronic components are mounted respectively on surfaces of the interposers and thus form a semiconductor device, the surfaces being opposite to the surfaces of the interposers facing the wiring board.04-07-2011
20120250280INSTRUMENT DEVICE - A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the front surface side of the circuit board and on which the display plate is mounted, an upper case which is disposed on the front surface side of the middle case and through which the front surface can be seen, and a lower case which covers the middle case and the circuit board. A flange section which is sandwiched and held between the upper and lower cases is provided to the peripheral edge of the middle case. One of the upper case and the lower cases is provided with engagement sections, and engagement sections which engage with the engagement sections are provided to the other of cases so as to correspond to the engagement sections.10-04-2012
20120250279STORAGE DEVICE, ELECTRONIC DEVICE, AND CIRCUIT BOARD ASSEMBLY - According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.10-04-2012
20100246148Electronic Apparatus Produced using lead-Free bonding Material for Soldering - Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.09-30-2010
20100309639CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS - A circuit board module includes: a board having a mounting surface; a frame member which is mounted on the mounting surface; an electronic component which is mounted on the mounting surface and which is provided inside the frame member; a resin portion which is embedded in the frame member; and a display device disposed on an opposite surface opposite to the mounting surface of the board. The display device is substantially equal in size to the frame member, and disposed at a position of the opposite surface which substantially corresponds to the frame member.12-09-2010
20110182046ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - The present invention provides a reduced size electronic circuit device, a manufacturing method of the same, and a display device having the same made by the manufacturing method. The electronic circuit device of the present invention is an electronic circuit device, wherein a first electronic component and a second electronic component are respectively connected electrically to a third electronic component; the first electronic component is bonded to the third electronic component through a first adhesive layer; the second electronic component is bonded to the third electronic component through the first and second adhesive layers; and one of the first adhesive layer and the second adhesive layer contains an anisotropic conductive material and the other adhesive layer does not contain the anisotropic conductive material.07-28-2011
20120075817MULTI-PART SUBSTRATE ASSEMBLIES FOR LOW PROFILE PORTABLE ELECTRONIC DEVICES - Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.03-29-2012
20120176758HAPTIC FEEDBACK DEVICE - Disclosed is a haptic feedback device used in an electronic device for providing haptic feedback. The haptic feedback device includes an electronic board defining at least two supporting elements and a receiving cavity, a piezoelectric vibrator coupling to the supporting elements and at least partially received in the receiving cavity. The piezoelectric vibrator is capable of vibrating along a direction parallel to the electronic board. At least two bolts are provided to fix the piezoelectric vibrator on the electronic board through the supporting element along a direction parallel to the electronic board.07-12-2012
20120314388SUBSTRATES WITH TRANSFERABLE CHIPLETS - A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the intermediate substrate.12-13-2012
20100271791Module for Integrated Control Electronics Having Simplified Design - A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.10-28-2010
20120188732Laminated Electronic Card Assembly - An electronic card is assembled from top and bottom graphic layers, top and bottom thermal sensitive adhesion tapes and an inlay assembly laminated together. The inlay assembly is made of a sub-assembly of a PCB base with one or more electronic components mounted to it, thermal sensitive adhesion tape and a stiffening substrate, all laminated together, while a battery insert and possible additional inserts made of PVC are mounted in openings in the sub-assembly around electronic components such as the battery. The stiffening substrate has a thermal coefficient substantially the same as that of the PCB base. The card need not contain any solder connections and is ISO 7810 compliant. Lamination is performed at a warm, not hot, temperature that does not damage the battery or melt any components together.07-26-2012
20120257364Coated Electrical Assembly - An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.10-11-2012
20120188733SUBSTRATE MOUNTING STRUCTURE, DISPLAY DEVICE EQUIPPED THEREWITH, AND SUBSTRATE MOUNTING METHOD - To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (07-26-2012
20090021923Method for Producing Planar Insulating Layers With Breakthroughs at the Correct Position by Means of Laser Cutting and Devices Produced Accordingly - In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips.01-22-2009
20120081866BRACKETS FOR ELECTRICAL COMPONENTS - An apparatus includes, in combination, an electrical component and a bracket. The electrical component has a first end configured to electrically connect to a circuit board. The electrical component defines an axis and has a width measured in a direction transverse to the axis. The bracket has a body defining a bore shaped to receive the electrical component. The body further includes a break in communication with the bore to allow expansion of the bore. In an at-rest state of the bracket, the bore has a bore width smaller than the width of the electrical component, and when the electrical component is received in the bore, the bracket is elastically deformed such that the electrical component is clamped in the transverse direction solely by the residual stress within the bracket without any additional clamp or fastener.04-05-2012
20130170162BRIDGING BOARD AND SERVER SYSTEM - A bridging board configured for connecting a processor with a hard disk backboard includes a first signal connecting apparatus, a second signal connecting apparatus, a plurality of duplexer and a signal conditioner. The first signal connecting apparatus is electronically connected to the processor. The second signal connecting apparatus electronically connected to the hard disk backboard. Each duplexer has an input terminal electronically connected to the first signal connecting apparatus, and two output terminals electronically connected to the second signal connecting apparatus to allow the processor to communicate with the backboard via the bridging board. The signal conditioner is electronically connected between the first signal connecting apparatus and the second signal connecting apparatus to amplify signals transmitted from the processor to the hard disk backboard.07-04-2013
20110038133ELECTRICAL COMPONENT MOUNTING ASSEMBLIES - An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (C02-17-2011
20120327622PRE-DISTORTION BASED IMPEDENCE DISCONTINUITY REMEDIATION FOR VIA STUBS AND CONNECTORS IN PRINTED CIRCUIT BOARD DESIGN - Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.12-27-2012
20120327621MOBILE TERMINAL - A mobile terminal including a terminal body having a ground; a first conductive member and a second conductive member mounted in the terminal body, and spaced from each other and configured to transmit and receive a radio signal; a feed connection portion connected to the first conductive member and configured to feed-connect the first conductive member to the ground; and a first ground connection portion connected to the second conductive member and configured to ground-connect the second conductive member to the ground. Further, the first conductive member and the second conductive member are connected to each other so as to form a loop.12-27-2012
20120320548FIXING MECHANISM FOR FIXING A BOARD CARD ON A CIRCUIT BOARD AND ELECTRONIC DEVICE THEREWITH - The present invention discloses a fixing mechanism for fixing a board card on a circuit board. The fixing mechanism includes a standoff for supporting the board card on the circuit board. A first end of the standoff is fixed inside a hole on the circuit board. A stepping opening is formed on a second end of the standoff, and the second end of the standoff contacts against the board card. The fixing mechanism further includes a blind rivet, a first end of the blind rivet engages inside the stepping opening, and a second end of the blind rivet fastens on the board card so as to fix the board card on the circuit board.12-20-2012
20120320550METHOD FOR ELECTRICAL CONNECTION BETWEEN ELEMENTS OF A THREE-DIMENSIONAL INTEGRATED STRUCTURE AND CORRESPONDING DEVICE - A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to be placed in front of a second element of the structure. The two end faces may be substantially parallel, and the module including a substrate having a face substantially perpendicular to the two end faces and carrying an electrically conducting pattern formed in a metallization level on top of the face and enclosed in an insulating region. The electrically conducting pattern may include a first end part emerging onto the first end face and a second end part emerging onto the second end face and connected to the first end part.12-20-2012
20120320549Conductor Structural Element and Method for Producing a Conductor Structural Element - The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.12-20-2012
20110038132Microstructure Apparatus, Manufacturing Method Thereof, and Sealing Substrate - The invention relates to a microstructure apparatus in which a microstructure is hermetically sealed. The microstructure apparatus includes a first substrate having a first surface on which the microstructure and an electrode electrically connected to the microstructure are formed; a second substrate having a second surface; an electrically-insulating sealing material surrounding the microstructure between the first surface and the second surface to hermetically seal the microstructure; a first conductor disposed on the second surface; a second conductor disposed on the second surface and electrically connected to the first conductor; and a first conductive circuit formed in an interior of the second substrate and having a portion of which is led to the second surface, connected to the second conductor and overlapped the sealing material in a plan view thereof.02-17-2011
20110235291BACK-TO-BACK PACKAGE ACCOMPLISHING SHORT SIGNAL PATH LENGTHS - This is a PCBA that can be used in any system where one component or package is connected to another component or package. This invention provides a very short connector or signal path that avoids the necessity of a signal trace termination in the PCB. The PCB has on its upper surface a first component or package and on its lower surface a second component or package in vertical physical and signal alignment with the first component or package. The first component or package has a BGA on its bottom surface and the second component has a BGA on its top surface, both of these BGAs are in electrical contact with each other. Because of the short signal trace provided, the PCB provides signal transitions as fast as 200 pS.09-29-2011
20120275128ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY APPARATUS - An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.11-01-2012
20100232126PACKAGE SUBSTRATE - A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.09-16-2010
20120087096Power Structure of Electronic Products - The present invention provides an improved power structure of electronic products, which allows to embed at least two thin button cells into the cell holder; multiple grooves are set into the cell holder and attached closely to IC circuit board, such that the anode and cathode of the cell holder are connected electrically with preset contacts on IC circuit board; next, with the circuit design of IC circuit board, the button cells in every groove can provide the electric power continuously in turn, thus extending the service time, saving the storage space of cell holder, and reducing the overall space of the electronic product for stronger competitiveness.04-12-2012
20130021764WAVEGUIDE AND METHOD FOR MAKING A WAVEGUIDE - A waveguide, printed circuit board and a method of fabricating a waveguide that includes: providing a ceramic powder and polymer binder slurry, and forming the waveguide from the slurry. The waveguide and a printed circuit that includes the waveguide are also described.01-24-2013
20130021763GROOVED CIRCUIT BOARD ACCOMMODATING MIXED-SIZE COMPONENTS - A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.01-24-2013
20130170163ELECTRICAL COMPONENT WHICH CAN BE RELIABLY SOLDERED - Electrical component (07-04-2013
20080232073INVERTER APPARATUS SUITABLE FOR BATTERY VEHICLE - An inverter apparatus is composed of an insulated metal substrate, a conductive stud, a printed circuit board, a conductive spacer, and a bus bar. An inverter output stage is mounted on the insulated metal substrate. The conductive stud is coupled to a main surface of the insulated metal substrate, and electrically connected with the inverter output stage. The printed circuit board is supported by the stud. The stud is coupled on the rear surface of the printed circuit board. Provided on the main surface of the printed circuit board is a circuit connected to the inverter output stage. The conductive spacer is coupled on the main surface of the printed circuit board, and electrically connected with the stud. The bus bar is coupled to the spacer.09-25-2008
20130176699METHOD AND APPARATUS FOR DEPOSITION - The present invention relates to a method of depositing a composition on a receiving substrate to form a printed object, the method comprising the steps of providing: (1) a receiving substrate; (2) a source of near-infra-red laser radiation which is a pulsed laser source or an array of pulsed lasers; (3) a support transparent to near-infra-red laser radiation, the support being positioned between the receiving substrate and the laser source; and a composition which is in contact with the transparent support and which is positioned between the transparent support and the receiving substrate, wherein the composition comprises: (a) a functional material in particulate form capable of absorbing near-infra-red laser radiation, (b) an oligomer and/or polymer, (c) water, and (d) optionally additives, the method comprising directing near-infra-red laser radiation through the transparent support and into the composition and thereby causing the composition to be transferred from the transparent support across a gap to the receiving substrate and causing oligomer and/or polymer to solidify on the receiving substrate, thus forming a printed object on the receiving substrate, wherein the printed object is electrically conductive.07-11-2013
20130176696ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT - An attachment mechanism for an electronic component includes a circuit board and a fastener. A first connector is fastened to the circuit board to be connected to a second connector of the electronic component. The first connector includes a mounting portion fastened to the circuit board and a main body on a top of the mounting portion. The fastener includes an engaging portion and a rotating portion rotatably connected to a first end of the engaging portion. The engaging portion sandwiches the main body. The rotating portion includes a top wall and two abutting walls extending from opposite ends of the top wall to abut a top of the main body. One of the abutting walls is rotatably connected to the first end of the engaging portion. A stop wall extends from the other abutting wall to be detachably connected a second end of the engaging portion.07-11-2013
20130176697ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT - An attachment mechanism for fastening an electronic component includes a circuit board and a fastener. The circuit board includes a first connector to connect with a second connector of the electronic component. A mounting hole is defined beside the first connector. The fastener includes a supporting plate. A bottom of the supporting plate includes a first protrusion abutting against a top of the circuit board, and a second protrusion deformably extending through the mounting hole to abut against a bottom of the circuit board. A top of the supporting plate includes a supporting protrusion. A pair of spaced engaging portions protrudes from a top of the supporting protrusion. The engaging portions extend through the mounting hole to allow the electronic component to be supported on the supporting protrusion.07-11-2013
20130176698HIGH FREQUENCY CIRCUIT COMPRISING GRAPHENE AND METHOD OF OPERATING THE SAME - A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit including graphene and which connects the first and second electronic devices, where an interlayer distance of the graphene is greater than or equal to about 0.34 nanometer.07-11-2013
20130176700ELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS - A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant-coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.07-11-2013
20130208433CIRCUIT MODULE AND METHOD FOR PRODUCING SUCH A CIRCUIT MODULE - The invention relates to a circuit module (08-15-2013
20130128481FIXING FITTING OF PARTS MOUNTED ON CIRCUIT BOARD - A fixing fitting includes a solder connecting plate part soldered and fixed to a surface of the circuit board by using a cream solder and a parts fixing part which is fixed to a connector to be mounted on the circuit board. On a solder connected surface of a lower surface of the solder connecting plate part, V grooves are formed which suck up the cream solder applied on the surface of the circuit board in accordance with a capillary phenomenon. Further, a plurality of communicating holes which communicate with tapered parts of the V grooves and can suck up the cream solder by the capillary phenomenon are bored from an upper surface to the lower surface of the solder connecting plate part with prescribed spaces provided between them in the direction where the V grooves extend.05-23-2013
20130141883ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER - Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.06-06-2013
20080212296Compression connection for vertical IC packages - An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.09-04-2008
20110273855POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS - A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape.11-10-2011
20110222252Electronic assembly with detachable components - The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.09-15-2011
20110242777KEY STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME - A key structure, and an electronic device employing the key structure, includes a housing member and a key body, and the key body is mounted within the housing member for electrically connection to a circuit board. The housing member defines at least one positioning hole; the positioning holes extend through the housing member. The key body includes at least one positioning column. Each at least one positioning column corresponds to a respective positioning hole, and each positioning column is removably received within its corresponding positioning hole to assemble the key body to the housing member.10-06-2011
20110235292THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.09-29-2011
20100302746HIGH VOLTAGE RECESSED CONNECTOR CONTACT - A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.12-02-2010
20100315795METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A method of manufacturing an electronic component including a first surface mount device and a second surface mount device is provided. The first surface mount device and the second surface mount device are joined to a substrate via joint materials such that either or both of the first and second surface mount devices are shifted from the locations corresponding to land electrodes located on the substrate so as to be aligned with each other and are subjected to a reflow process. The outer land electrodes are formed at locations shifted inwardly from the locations corresponding to a virtual arrangement state in which the first surface mount device and the second surface mount device are arranged in series such that an end surface of the first surface mount device is in contact with an end surface of the second surface mount device.12-16-2010
20100315794CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTED BOARD - When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in a state where bent-side lead wires have the same electric potential, and the electronic components are inclined so as to place the bent-side lead wires close to each other, whereby the electronic components that tend to fall in the inclined direction can be mutually supported by the bent-side lead wires. Thus, the electronic components can be prevented from falling without spoiling a heat dissipation performance of the electronic component and the board, and without greatly deteriorating an assembly performance of the board.12-16-2010
20130182400CIRCUIT BOARD HAVING BOARD-TO-BOARD CONNECTOR AND METHOD OF MANUFACTURING THE SAME - A circuit board having a board-to-board connector and a method of manufacturing the same are provided. The circuit board includes at least one of a recess and a hole having a connection portion exposed to be electrically connected to a connection portion of a connector header of another circuit board, a terminal on the circuit board, and a conduction line for connecting the terminal and the connection portion. Thereby, a cost and required space for a board-to-board connection can be reduced.07-18-2013
20120002387TRANSFORMER AND FLAT PANEL DISPLAY DEVICE INCLUDING THE SAME - There are provided a thin transformer capable of being used in a thin display device such as a liquid crystal display (LCD) device, a light emitting diode (LED) device, and a flat panel display device including the thin transformer. The transformer includes a bobbin part including inner and outer bobbins each including a pipe shaped body part having a though-hole formed in an inner portion thereof and a flange part protruding outwardly from both ends of the body part; coils respectively wound around the inner and outer bobbins; and a core electromagnetically coupled to the coils to thereby form a magnetic path, wherein the outer bobbin includes a support part formed at the flange part formed at an upper end of the body part of the outer bobbin so as to cover a portion of the through-hole, and the inner bobbin is coupled to the outer bobbin while having one end supported by the support part.01-05-2012
20120020039SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY - A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.01-26-2012
20120020038ELECTRONIC APPARATUS AND METHOD RELATED THERETO - An electronic apparatus includes a first printed circuit board on which a first connector is provided, a first member connected with the first printed circuit board and having a first hole, a second member connected with the first printed circuit board and including a projecting portion extending in a standing direction on the first printed circuit board, and a second printed circuit board that includes a second connector connected to the first connector, a first end portion that penetrates the first hole, and a second end portion having a second hole, where the projecting portion of the second member penetrates the second hole.01-26-2012
20120300423INTERCONNECT FORMATION UNDER LOAD - An apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.11-29-2012
20120075816CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.03-29-2012

Patent applications in class Connection of components to board

Patent applications in all subclasses Connection of components to board