Class / Patent application number | Description | Number of patent applications / Date published |
361757000 | With particular material | 41 |
20080198562 | PROTECTIVE JACKET OF ELECTRICAL DEVICE - A protective jacket for covering an electrical device is provided. The protective jacket includes a first shell and a second shell. The first shell includes a front cover, a rear cover, and an elastic strip. The front and the rear covers are formed apart from each other and have an individual hollow for receiving the insertion of the device. The elastic strip is formed between these covers. A space is defined on the first shell by theses covers, and the elastic strip together. The second shell is configured to be disposed within the space of the first shell, and has a slot for receiving the insertion of the device. Therefore, the protective jacket conforms to the shape of the device and is capable of covering the device compactly for preventing damages due to collision and avoiding dust and mist pollution so as to increase the life of the device substantially. | 08-21-2008 |
20080266821 | Housing for an Electronic Circuit and Method for Sealing the Housing - A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. The floor plate, the cover and the conductors are made of the same kind of material, e.g., a metal. The floor plate and the cover are made of aluminum and the conductors of copper. | 10-30-2008 |
20080316720 | Electronic components - Electronic components include a case, a circuit board, electronic parts, a plate-like electrode terminal, a metal cover, a stepped portion, a connecting terminal, and a fastening member. The case includes a connector portion and an opening. The connector portion has an external terminal. The circuit board mounting the electronic parts is accommodated in the case. The electrode terminal is accommodated in the case and electrically connected to the electronic parts. The plate-like electrode terminal includes a board-side end portion and a case-side end portion. The metal cover closes the opening so as to be spaced away from the circuit board and the electrode terminal. The connecting terminal is arranged on a stepped portion in the case. The connecting terminal is formed integrally with the external terminal. The fastening member connects the case-side end portion to the case. The fastening member electrically connects the case-side end portion to the connecting terminal. | 12-25-2008 |
20090097215 | UV-EPOXY AND ULTRASONIC CASE ASSEMBLY METHODS FOR USB FLASH DRIVE - The present invention discloses UV-epoxy and ultrasonic case assembly methods for a USB flash drive, wherein a transparent or translucent top cover is fastened to a bottom cover containing a printed circuit board assembly via an UV-cure epoxy glue or an ultrasonic weld method. As the top cover of the USB flash drive is transparent or translucent, the USB flash drive has a see-through property and presents an aesthetic taste, which can attract the attention of consumers. Further, the method of the present invention uses less case parts and fewer steps and thus can fabricate a USB flash drive having a lower cost and a better quality at a higher throughput. Furthermore, the USB flash drive fabricated according to the method of the present invention has a better moisture resistance and a better water resistance. | 04-16-2009 |
20090279269 | WATERPROOF METHOD FOR ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE - A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device. | 11-12-2009 |
20090316372 | Printed circuit board assembly - A system, apparatus and method are described for a printed circuit board assembly. The printed circuit board assembly may include a printed circuit board, a base, and a housing that includes one or more elastomeric pads that may contact the printed circuit board when the printed circuit board assembly is assembled. Other embodiments are described and claimed. | 12-24-2009 |
20090323298 | PORTABLE TERMINAL - A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part. | 12-31-2009 |
20100246146 | Electronic device and method of producing the same - A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet. | 09-30-2010 |
20100254104 | ASSEMBLY WITH A PRINTED CIRCUIT BOARD - An assembly ( | 10-07-2010 |
20100265678 | ENHANCING ADHESION OF MOLDING MATERIALS WITH SUBSTRATES - A method of enhancing adhesion of a molding material with a substrate is provided. The method includes forming one or more perforations on a substrate, forming a coat of an affinitive material on at least one of the perforations, and filling the molding material in the perforations. The affinitive material has an affinity for the molding material. Therefore, the molding material adheres to the coat of the affinitive material. | 10-21-2010 |
20110038130 | PLASMA ENHANCED POLYMER ULTRA-THIN MULTI-LAYER PACKAGING - An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor. | 02-17-2011 |
20110038131 | PACKAGING WITH ACTIVE PROTECTION LAYER - An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied at least in part by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets of layers, wherein each set has at least one layer formed by dissociation of a polymeric precursor and then deposition of that precursor, and another layer is a biocompatible liquid. | 02-17-2011 |
20110157851 | PACKAGE STRUCTURE - A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted. | 06-30-2011 |
20110182045 | PCBA LOW COST FRAME MOUNT - Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode. | 07-28-2011 |
20120063104 | CONTROL UNIT FOR OCCUPANT PROTECTION MEANS FOR A VEHICLE AND A METHOD FOR ASSEMBLING A CONTROL UNIT OF THIS TYPE - A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools. | 03-15-2012 |
20120300421 | ELECTRICAL FEEDTHROUGH FOR IMPLANTABLE MEDICAL DEVICE - An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis. | 11-29-2012 |
20130039024 | CARD KEY - A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings. | 02-14-2013 |
20130070434 | DYE-BASED CIRCUIT MOUNT TESTING - An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component. | 03-21-2013 |
20130083500 | INTERFEROMETRIC COLOR MARKING - Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black. | 04-04-2013 |
20130083501 | METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER - One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder. | 04-04-2013 |
20130094163 | Surface Mount Electronic Component - A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated. | 04-18-2013 |
20130100621 | SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contact, is covered by a second housing molded of black-colored resin, and a plurality of second housings are supported by a secondary molding carrier in high density. A linking portion of each contact and one or both of the first and second housings are integrated by insert molding. | 04-25-2013 |
20130223028 | HYBRID HOUSING FOR IMPLANTABLE MEDICAL DEVICE - Apparatuses and methods for hybrid housings as well as hybrid housing based implantable medical devices are provided. A hybrid housing comprises a ceramic substrate, a bonding structure formed on the periphery of the ceramic substrate, and a biocompatible metal cap coupled to the ceramic substrate using the bonding structure to form a hermetically sealed enclosure. One or more electronic elements may be formed within the hermetically sealed enclosure, and the electronic elements may be stably associated with the ceramic substrate. | 08-29-2013 |
20130279132 | ELECTROMAGNETIC SHIELDING COVER - An electromagnetic shielding cover disposed on a printed circuit board having thereon an electronic component includes a lid and a frame which are coupled together to shield the electronic component from electromagnetic interference and allow the electronic component to be changed and tested easily during a rework process. | 10-24-2013 |
20130329385 | ELECTRONIC DEVICE - An electronic device includes: a housing having a concave portion in the first surface of the housing; a lid made of a semiconductor material containing an impurity material; a first metal film formed in a metal film formation region on the first surface of the housing, wherein the metal film formation region is defined as a region surrounding the concave portion on the first surface of the housing; a second metal film formed on the first surface of the lid to overlap with the metal film formation region in a top view of the electronic device; a third metal film formed on the second surface of the lid to overlap with the metal film formation region in the top view; and an electronic component disposed in the concave portion. The lid is bonded onto the housing via the first and second metal films to cover the electronic component. | 12-12-2013 |
20140003009 | GLASS CLAD MICROELECTRONIC SUBSTRATE | 01-02-2014 |
20140016287 | DISPLAY DEVICE - A display device includes a display panel including a display part; a conductive film located on a front surface of the display panel and made of a conductive member; a non-conductive housing frame that is located on a surface of the conductive film opposite to a surface of the conductive film facing the display panel, covers a peripheral part of the display panel, and has at least one through hole penetrating the housing frame along a front-and-back direction; a conductive coupling member disposed in the through hole and electrically coupled to the conductive film; and a conductive decorative panel that covers a surface of the housing frame opposite to a surface of the housing frame facing the conductive film and is electrically coupled to the coupling member. | 01-16-2014 |
20140078698 | ELECTRONIC APPARATUS - An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess. | 03-20-2014 |
20140118971 | KEYBOARD SAFETY PROTECTION DEVICE - A keyboard safety protection device for protecting a point of sale (POS) device keyboard area from being attacked includes: a protection layer, a metal dome, and a keyboard printed circuit board, wherein a key gold finger and a safety processor are arranged on the keyboard PCB, the protection layer is composed of a layer of PVDF film and a first and second silver slurries, the first and the second silver slurries are coated on the surface of the PVDF film, the surfaces of the first and second silver slurries are provided with a first and second thin film layers respectively, the first and second silver slurries are electrically connected with the key gold finger, and the first and second silver slurries are electrically connected with the safety processor to form a safety detection circuit through the keyboard printed circuit board and the safety processor. | 05-01-2014 |
20140211431 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode (OLED) display device includes: a display panel including a display area and a non-display area provided in an external side of the display area; a set frame disposed on a rear surface of the display panel and supporting the display panel; a side frame surrounding a side surface of the display panel and covering the non-display area; and a cover window covering the display area disposed in an inner space surrounded by the side frame. | 07-31-2014 |
20140233197 | COVER ELEMENT AND HOUSING DEVICE FOR USE OF THE COVER ELEMENT - The invention concerns a cover element ( | 08-21-2014 |
20140301050 | SUBSTRATE ASSEMBLY, METHOD OF MANUFACTURING SUBSTRATE ASSEMBLY AND METHOD OF MANUFACTURING CHIP PACKAGE - A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied. | 10-09-2014 |
20140369012 | Electronic Devices with Moisture Guiding Structures - Electronic devices may have housings in which components are mounted. Some of the components may be sensitive to moisture. Other components may be insensitive to moisture and may form openings in a device housing that allow moisture to escape from within the housing. Components may be mounted on substrates such as printed circuit board substrates. Moisture repelling layers and moisture attracting layers may be patterned to form channels and other structures that guide moisture away from sensitive components towards insensitive components. Moisture repelling and attracting layers may also be used to limit the lateral spread of a conformal coating layer when coating components. | 12-18-2014 |
20150077957 | COMPOSITE SHEET, MOUNTING STRUCTURE INCLUDING THE COMPOSITE SHEET AND ELECTRONIC APPARATUS INCLUDING THE MOUNTING STRUCTURE - A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps. | 03-19-2015 |
20150103503 | INJECTION MOLDED PRODUCT AND METHOD OF MANUFACTURING THE SAME - An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded. | 04-16-2015 |
20150366097 | IMPERMEABLE PROTECTIVE COATINGS THROUGH WHICH ELECTRICAL CONNECTIONS MAY BE ESTABLISHED AND ELECTRONIC DEVICES INCLUDING THE IMPERMEABLE PROTECTIVE COATINGS - Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 μm and at most about 2 μm. Electronic devices that include such a protective coating are also disclosed. | 12-17-2015 |
20150382487 | DISPLAY - A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a back face of the display panel, the back-face member covering the back face, or the back face and other part of the display panel. | 12-31-2015 |
20160007486 | PACKAGE SUBSTRATE - There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post. | 01-07-2016 |
20160174403 | HOUSING, ELECTRONIC DEVICE USING SAME, AND METHOD FOR MAKING SAME | 06-16-2016 |
20160192512 | DISPLAY - A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a back face of the display panel, the back-face member covering the back face, or the back face and other part of the display panel. | 06-30-2016 |
20160379784 | REED RELAY - A reed switch relay comprises a PCB base ( | 12-29-2016 |