Class / Patent application number | Description | Number of patent applications / Date published |
361751000 | With particular conductive material or coating | 24 |
20080310129 | STRUCTURE OF TAG INTEGRATED CIRCUIT FLEXIBLE BOARD - A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board includes an insulating heat-conductive material, and a conductive circuit layer provided on a surface of the insulating heat-conductive material and formed of a plurality of sections of circuits. | 12-18-2008 |
20090195996 | IMAGE DISPLAY APPARATUS - An image display apparatus of the present invention has a display panel which has a plurality of wirings and a plurality of display devices connected to the plurality of wirings, a control circuit substrate which outputs a control signal, a flexible printed circuit board which has a flexible substrate and wirings formed on the flexible substrate and electrically connects the display panel and the control circuit substrate, and a conductive cover which covers the flexible printed circuit board from a portion connected to the control circuit substrate to a portion connected to the display panel and is connected to the control circuit substrate. | 08-06-2009 |
20090231816 | SYSTEM AND METHOD OF PREVENTING DAMAGE TO METAL TRACES OF FLEXIBLE PRINTED CIRCUITS - Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses. | 09-17-2009 |
20110149533 | INTEGRATED CIRCUIT FILM FOR SMART CARD - An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm. | 06-23-2011 |
20110182042 | Electronic Assemblies without Solder and Methods for their Manufacture - An electronic assembly | 07-28-2011 |
20110255251 | ELECTRONIC PACKAGE AND DISPLAY APPARATUS - Two bezels (BZ | 10-20-2011 |
20110279986 | FLEXIBLE CIRCUIT - A flexible circuit includes a sprocket opening and electrically conductive lines connected to a print head. | 11-17-2011 |
20120176754 | ANTENNA STRUCTURES WITH ELECTRICAL CONNECTIONS TO DEVICE HOUSING MEMBERS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. The flex circuit can include a solder flow barrier to constrain flow of solder. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss. | 07-12-2012 |
20120243187 | FLEXIBLE PRINTED CIRCUIT MODULE AND PORTABLE ELECTRONIC DEVICE USING SAME - A FPC module includes a FPC board and a supporting member. The FPC board is fixed on a cover of an electronic device, one end of the FPC board has at least one electrical terminals fixed thereon. The supporting member fixed on the end of the FPC board, and the supporting member is latched on the cover. | 09-27-2012 |
20130010436 | CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component. | 01-10-2013 |
20130335931 | SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD - A surface mount interconnection system provides a method and apparatus for mounting an auxiliary printed circuit board assembly directly to a main printed circuit board assembly without the use of leaded surface mount devices. A linear array of spaced-apart solder pads is arranged on an exposed surface of the substrate of both assemblies, with at least one of solder pad arrays being located adjacent an edge of its associated substrate. A selected plurality of aligned cooperating pairs of solder pads are electrically and mechanically interconnected by a solder ball reflowed to form a joint there between. The solder balls comprise a high melting temperature inner core and a low melting temperature outer solder core. | 12-19-2013 |
20140071639 | FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODUCT USING SAME, AND FLEXIBLE MULTILAYER WIRING BOARD - A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region. | 03-13-2014 |
20140085837 | METHOD OF FORMING FLEXIBLE CONDUCTION TRACE, FLEXIBLE CONDUCTION TRACE AND FLEXIBLE ELECTRONIC DEVICE USING THE SAME - A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line. | 03-27-2014 |
20140140021 | Component Mounting Structure With Flexible Jumper - An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit. | 05-22-2014 |
20140198466 | MULTI-FUNCTIONAL FPC ASSEMBLY - An improved multi-functional flexible printed circuit (FPC) assembly | 07-17-2014 |
20140218875 | AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION - An aqueous polyimide precursor solution composition, in which a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid. | 08-07-2014 |
20140254114 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD - Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes <100> in a surface of the metal foil. | 09-11-2014 |
20140355229 | Surface Treated Copper Foil and Laminate Using the Same - A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated copper foil comprising at least one surface treated surface with a color difference ΔE*ab of 40 or more based on JIS Z 8730, and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an end of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, after lamination of the surface treated surface to a polyimide having a ΔB (Pl) defined as above of 50 or more and 65 or less before being laminated to the copper foil, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil. | 12-04-2014 |
20150009637 | ELECTROMAGNETIC SHIELDING FILM, FLEXIBLE PRINTED WIRING BOARD WITH ELECTROMAGNETIC SHIELDING FILM, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME - A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate. | 01-08-2015 |
20150009638 | METHOD FOR ELECTROLESS NICKEL-PHOSPHOROUS ALLOY DEPOSITION ONTO FLEXIBLE SUBSTRATES - The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable. | 01-08-2015 |
20150077952 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device and a manufacturing method thereof. The display device includes a substrate including at least one plastic layer; and a display layer on the substrate and including a plurality of signal lines and a plurality of pixels. The substrate includes at least one antistatic layer. | 03-19-2015 |
20150077953 | DISPLAY APPARATUS AND METHOD OF FABRICATING THE SAME - A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa. | 03-19-2015 |
20150131240 | Method for Producing an Electronic Subassembly - The invention concerns a method for production of electronic assembly ( | 05-14-2015 |
20160105951 | DISPLAY DEVICE - A display device, including a display panel; a flexible printed circuit board (FPCB) including a driving integrated circuit (IC) and attached to a rear surface of the display panel; a conductive member at the rear surface of the display panel; an FPCB connection pad connected to the conductive member at the rear surface of the display panel and connected to the FPCB; an FPCB connection terminal connected to the FPCB connection pad and at the FPCB; and a ground at the FPCB. | 04-14-2016 |