Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Printed circuit board

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361760000 Connection of components to board 871
361752000 With housing or chassis 651
361784000 Plural 273
361749000 Flexible board 209
Entries
DocumentTitleDate
20130044441Device for Electric Insulation of a Conducting Plane - A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, and a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials.02-21-2013
20110194261PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - The present invention is to provide a prepreg capable of significantly decreasing generation of voids in a glass fiber base material and forming a printed wiring board and a semiconductor having high reliability, a laminate thereof, and a printed wiring board and a semiconductor device using the same. A prepreg comprising a glass fiber base material (A) impregnated with a thermosetting resin composition (B), wherein an inorganic particle having an average particle diameter of 500 nm or less is attached on a glass fiber surface of the glass fiber base material (A).08-11-2011
20120176753EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.07-12-2012
20100067200DATA CARRIER FOR CONTACTLESS DATA TRANSMISSION AND A METHOD FOR PRODUCING SUCH A DATA CARRIER - Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer 40 is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip 30 and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure 48 is formed in the copper layer of the first copper-coated prepreg layer.03-18-2010
20100073886Sensor board and producing method thereof - A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.03-25-2010
20130077264Sealed Overmolded Circuit Board With Sensor Seal and Edge Connector Seal and Production Method Of The Same - An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent.03-28-2013
20130039021DISPLAY DEVICE AND CUSHIONING MEMBER USABLE IN THE SAME - An object of the present invention is to provide a display device including a cushioning member which is unlikely to be shifted from a predetermined position and has a function of effectively preventing EMI and/or ESD. In a display device according to the present invention, a cushioning member (02-14-2013
20130033825Plasma-Polymerized Polymer Coating - An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.02-07-2013
20130033826ELECTRICAL COMPONENT - An electronic component includes a circuit element, a circuit board that is connected to the circuit element, and a connection terminal that is connected to the circuit board. The connection terminal includes a main body, a spring member that is formed so as to be elastically deformable in two directions including a direction of moving closer to the circuit board disposed on the main body and a direction of moving away from the circuit board, and a pair of arm portions that is extended from the main body so as to position the spring member therebetween. The pair of arm portions passes through the circuit board, ends of the respective arm portions far from the main body are bent toward the spring member, and the circuit board is held between the ends and the spring member.02-07-2013
20130027892MOBILE TERMINAL - A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance.01-31-2013
20130027891MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for expansion cards includes a cage of a chassis, a bracket secured to the cage, a positioning member, and a circuit board. The cage includes an installation plate. The installation plate is adapted to secure a first end of a first expansion card. The positioning member is removably mounted to the cage and includes a top wall. The top wall is adapted to secure a third end of a second expansion card with a height smaller than the first expansion card. The circuit board is secured to the bracket and is adapted to secure a second end of the first expansion card and a forth end of the second expansion card. A distance between the installation plate and the top wall is substantially equal to an altitude difference between the first expansion card and the second expansion card.01-31-2013
20130027893Electromagnetic Interference (EMI) Shields - Disclosed herein are exemplary embodiments of an EMI shielding apparatus. A frame of the apparatus has a sidewall and an inwardly extending lip defining at least one opening along an upper portion of the frame. A reusable cover is attachable to the frame for at least substantially covering opening(s) of the frame. A first border portion of the cover includes one or more sliding members. A second border portion of the cover includes one or more stops. The sliding member(s) and stop(s) are configured to abut, in generally opposed directions, one or more lip edges generally facing the opening(s) when the cover is attached to the frame. The shielding apparatus is operable for shielding the component(s) on the substrate that are within an interior cooperatively defined by the frame and the cover.01-31-2013
20130070430DISPLAY DEVICE - A display device includes: circuit board 03-21-2013
20130050960PORTABLE ELECTRONIC DEVICE - A portable electronic device includes an integration unit and a main circuit. The integration unit includes a carrier and at least one electronic element disposed on the carrier. The electronic element includes an antenna unit, a button input unit or a sound transmission unit. The main circuit is electrically connected to the electronic element through a conducting wire.02-28-2013
20100265670FIXING STRUCTURE FOR ELECTRONIC CARD - A fixing structure for an electronic card is suitable for mounting a long electronic card or a short electronic card within a housing. The fixing structure includes a pressing plate, a locking slice, and a locking member. Two ends of the pressing plate have two buckling portions. The locking slice connects an end of the pressing plate and has a locking hole. Besides, the locking slice leans against the housing. The locking member passes through the locking hole and is fixed into a first fixing hole or a second fixing hole. When the locking hole corresponds to the first fixing hole, the two buckling portions are fixed onto a free end of the long electronic card. When the locking hole is corresponding to the second fixing hole, the two buckling portions are fixed onto a free end of the short electronic card.10-21-2010
20100097771CIRCUIT BOARD ASSEMBLY - A circuit board assembly used in a portable electronic device includes a circuit board, a duplexer mounted on the circuit board, and a shielding member defining a hole corresponding to the duplexer therein. The shielding member is mounted on the circuit board and surrounds portions of the duplexer, and the hole exposes portions of the duplexer from the shielding.04-22-2010
20100097770PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator.04-22-2010
20130070429INTEGRATED VOLTAGE DIVIDER - A semiconductor structure including a high-voltage transistor; voltage dropping circuitry, at least part of which is overlapping the high-voltage transistor; at least one intermediate contact point to the voltage dropping circuitry, connected to at least one intermediate position between a first and a second end of the voltage dropping circuitry; and at least one external connection connecting the at least one intermediate contact point to outside of the semiconductor structure.03-21-2013
20130058055SUBSTRATE WITH BUILT-IN COMPONENT - A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component are to be built in. The substrate includes a component to be embedded in a resin layer, and a land electrode (a component mounting electrode) to which external electrodes of the component are to be bonded, the land electrode being provided with a concave groove extending in a transverse direction through which an uncured resin of the resin layer flows, and the uncured resin of the resin layer flows through the concave groove and sufficiently goes around a lower side of the component so that the resin is well filled in when the component in a mounting state is to be embedded in the resin layer.03-07-2013
20130058053POWER CONVERSION CIRCUIT AND CIRCUIT BOARD - An exemplary power conversion circuit is to convert a voltage from one voltage level to another. The circuit includes an input port, an output port, a main body circuit, a first solder bridge, and a second solder bridge. The input port of the power conversion circuit is an output port of one power conversion circuit previous in sequence to the power conversion circuit, the output port of the power conversion circuit is an input port of one power conversion circuit next in sequence to the power conversion circuit. The first solder bridge is arranged between the input port of the power conversion circuit and the main body circuit of the power conversion circuit. The second solder bridge is arranged between the output port of the power conversion circuit and the main body circuit of the power conversion circuit.03-07-2013
20130058054FIXING APPARATUS FOR EXPANSION CARD - An apparatus for fixing an expansion card includes a circuit board, a fixing device, and a latching device. The expansion card includes a protrusion formed on a first end of the expansion card, and a positioning hole defined adjacent to a second end of the expansion card away from the first end. The fixing device is mounted to the circuit board for supporting the first end of the expansion card, and defines a through hole for allowing the protrusion of the expansion card to extend through the through hole. The latching device is mounted to the circuit board for supporting the second end of the expansion card, and includes a post for engaging in the positioning hole of the expansion card, and a resilient hook for engaging with a top of the expansion card.03-07-2013
20110013369AUDIO CIRCUIT BOARD - An audio circuit board includes a main body, an audio connector, a digital ground loop, an analog ground portion and a moat. The main body includes an edge and a surface. The audio connector is disposed on one side of the main body and includes a fixing portion. The digital ground loop completely surrounds the edge of the main body. The audio connector is connected with the digital ground loop via the fixing portion. The analog ground portion is disposed on the surface of the main body and is disposed adjacent to the digital ground loop. The analog ground portion is separated from the main body via the moat.01-20-2011
20090268415Battery Backup Unit (BBU) assembly - The present invention is a Battery Backup Unit (BBU) Assembly. The BBU Assembly may include a Printed Circuit Board (PCB). The BBU Assembly may further include a protection circuit connected to the PCB. The BBU Assembly may further include a battery pack connected to the PCB. The battery pack may include a plurality of Lithium-ion (Li-ion) cells. The battery pack may be configured as a 2-cell series stack, a 3-cell series stack, or a 4-cell series stack. The BBU Assembly is configured for electrically connecting the battery pack to the protection circuit.10-29-2009
20120224334MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus is provided to mount a data storage device includes a bracket and a number of fastening members. The bracket includes two opposite clamping arms to sandwich the data storage device. The fastening members extend through the clamping arms to be locked to the data storage device. Two resilient portions are respectively formed on a top and a bottom of each clamping arm.09-06-2012
20120224333MULTI-PLATE BOARD EMBEDDED CAPACITOR AND METHODS FOR FABRICATING THE SAME - A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.09-06-2012
20130063904HANDHELD DEVICE - A handheld device includes a body, a back cover and a latch mechanism. The body has a back portion. The back cover coves the back portion. The latch mechanism is disposed between the body and the back portion to lock the back portion to the body. Reliving the lock connection between the body and the back cover performed by the latch mechanism causes the back cover is able to depart from the body.03-14-2013
20130063905CIRCUIT BOARD SENSOR AND METHOD FOR PRODUCING THE SAME - The invention relates to a circuit board sensor (03-14-2013
20130163212CIRCUIT SUBSTRATE - A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.06-27-2013
20090237894ELECTRONIC DEVICE - An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.09-24-2009
20090046436MICRO-ELECTRO-MECHANICAL-SYSTEM PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.02-19-2009
20120113602ELECTRICAL CONNECTOR ASSEMBLY HAVING ELECTRICAL CONNECTOR AND FILTER MODULE - A electrical connector assembly includes a mother board (05-10-2012
20120236512PRINTED CIRCUIT BOARD AND CARRIER - A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.09-20-2012
20120236511MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus for mounting a data storage device includes a bracket and a locking member. The bracket includes a first clamping arm and a second clamping arm pivotable relative to the first clamping arm. A number of mounting pins extend from each of the first and second clamping arms. The second clamping arm includes a first hook. The locking member is pivotably mounted to the first clamping arm and includes a second hook. When the second clamping arm is pivoted towards the first clamping arm, the first hook of the second clamping arm drives the locking member to rotate, until the second hook engages with the first hook and the mounting pins engage in opposite sidewalls of the data storage device.09-20-2012
20120236510APPARATUS FOR MANAGING HEAT DISTRIBUTION IN AN OSCILLATOR SYSTEM - A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount.09-20-2012
20120020032ELECTRIC BUTTON AND LED BUTTON MODULE - An electric button is provided. The electric button comprises a substrate with a plurality of through holes thereon, at least an electric component fixedly disposed on the surface of the substrate and electrically connecting to the substrate, and a mask sealing the electric component on the surface of the substrate. The substrate is sewed onto the fabric by at least a conductive thread through the through holes and electrically connected to the conductive thread. Thereby, if a power supply is connected through the conductive thread to the substrate, the electrical power would be further connected to the electric component so that the electric component can perform its function.01-26-2012
20120229990MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A printed wiring board has a metal layer, a resin structure having a first resin layer portion formed on a first surface of the metal layer, a second resin layer portion formed on a second surface of the metal layer, and a filler resin portion filling an opening portion of the metal layer, a first circuit formed on the first resin portion, a second circuit formed on the second resin portion, and a through-hole conductor formed through the first resin, filler resin and second resin portions and connecting the first and second circuits. The through-hole conductor has a first portion narrowing from the first circuit toward the second resin portion and a second portion narrowing from the second circuit toward the first resin portion, and the first portion is connected to the second portion at a connected position shifted from the middle point of the thickness of the metal layer.09-13-2012
20100202118SHIFTED SEGMENT LAYOUT FOR DIFFERENTIAL SIGNAL TRACES TO MITIGATE BUNDLE WEAVE EFFECT - An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.08-12-2010
20100202117Backplane Wiring For An Input-Output Panel Used For Front Or Rear Access - According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis.08-12-2010
20110279985 Electronic Circuit Breaker and a Method of Providing Protection Switching - A protection switching system in a power supply distribution system, comprises at least one protection switch (11-17-2011
20110299254SCREW-LESS FIXING ASSEMBLY FOR INTERFACE CARD - A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned to correspond to the I/O opening, and a short plate of the fixing support is received in the accommodating space. The movable cover module is mounted in the accommodating space. The elastic member has an elastic protrusion positioned to correspond to the short plate of the fixing support. The movable cover module is moved to drive the elastic protrusion to tightly fix the short plate of the fixing support to the frame. With this arrangement, the interface card can be rapidly detached from the frame or attached thereto without using screws.12-08-2011
20110292620CIRCUIT BOARD PACKAGING STRUCTURE - The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play.12-01-2011
20110292621GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES - An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.12-01-2011
20110292619ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SUCH AN ELECTRONIC COMPONENT - An electronic component having electrically conductive contacts and a printed circuit board enclosed by a sheathing made from a first plastic, and a method for manufacturing the electronic component. Such electronic components are used in oil pans of a transmission. The electrically conductive contacts are enclosed by a frame made from a second plastic. The first plastic is a duroplastic, and the second one is a thermoplastic. The thermoplastic does not represent a barrier to transmission oil. It is used for shaping the duroplastic, prepositioning the electrically conductive contacts, and preventing mechanical reworking of the duroplastic. No projections such as tabs or flash layers are created.12-01-2011
20110292622METHOD FOR ELECTRIC CIRCUIT DEPOSITION - The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern.12-01-2011
20090034213Printed Circuit Board and Related Method Capable of Suppressing Electromagnetic Wave - A method for suppressing an electromagnetic wave of noise of a printed circuit board comprises forming a metal conducting circuit in a conducting layer of the printed circuit board; and duplicating a plurality of pattern circuits, every two neighboring patterns with substantially the same patterns and separated space for forming a metal conducting circuit that is an electromagnetic wave suppressing circuit having an electromagnetic wave stop frequency band corresponding to the electromagnetic wave of noise.02-05-2009
20100033938METHOD AND APPARATUS FOR REDUCING CAPACITOR GENERATED NOISE ON A PRINTED CIRCUIT BOARD - Embodiments of the present invention provide an arrangement structure capable of reducing noise caused by a laminated ceramic capacitor mounted on a printed circuit board. A unit arrangement structure includes ceramic capacitors. Among the laminated ceramic capacitors, capacitors are arranged so that capacitor axes thereof extend along a first axis, while the other ceramic capacitors are arranged so that capacitor axes thereof extend along a second axis crossing the first axis. In accordance with such an arrangement structure, it is possible to effectively suppress noise even in the case of single-side mounting.02-11-2010
20090251869Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate - A multilayer ceramic substrate in which an active element and a passive element are surface-equipped over the outermost surface on one side is provided. The multilayer ceramic substrate comprises a plurality of laminated ceramic substrate layers, a surface layer terminal electrode provided in a via hole of an outermost ceramic substrate layer on at least one side and having a surface layer via electrode and a metal plating layer deposited over an end surface of the surface layer via electrode, and a via conductor which connects the surface layer terminal electrode and circuit patterns over the ceramic substrate layer at the inside, wherein a via hole size of a surface layer terminal electrode for connection of the active element is smaller than a via hole size of a surface layer terminal electrode for connection of the passive element.10-08-2009
20110170268ELECTROMAGNETIC BAND GAP STRUCTURE, ELEMENT, SUBSTRATE, MODULE, AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC BAND GAP STRUCTURE, AND PRODUCTION METHODS THEREOF - To provide a small-sized and thin electromagnetic band gap structure which can be surface-mounted or built in a substrate. An electromagnetic band gap structure according to an aspect of the present invention includes: an insulating substrate; a plurality of conductor pieces regularly arranged on the insulating substrate; a dielectric layer formed so as to fill a space between adjacent ones of the conductor pieces; an interlayer insulating layer formed on the dielectric layer; and a conductor plane which is formed on the interlayer insulating layer and is connected to each of the conductor pieces with a conductor penetrating through the interlayer insulating layer.07-14-2011
20090067139Large electronic component dampening fixation - An electronic assembly having a large or massive electronic component mounted to a circuit substrate is stabilized against movement due to shock and/or vibration by an elastic dampening member disposed between the large electronic component and a clamping member that compresses the dampening member between the clamping member and the electronic component and urges opposite end walls of the dampening member against opposite sidewalls of the electronic component to securely grip the electronic component between the opposite end walls of the dampening member. The arrangement is effective for reducing and/or eliminating damage and subsequent failure due to exposure of the electronic assembly to shock and/or vibration.03-12-2009
20080266818Scanning module for a scanner system having a MEMS device or the like - Briefly, in accordance with one or more embodiments, a scanning module for a scanner system comprises a frame having a first section and a second section. The first section of the frame is capable of receiving a laser to secure the laser in the first section, and the second section of the frame is capable of receiving a MEMS device having a mirror, to secure the MEMS device in the first section. The laser is aligned with the mirror by the frame to cause light emitted from the laser to impinge upon the mirror during operation of the laser. Such an arrangement may facilitate the physical and/or electrical assembly of the components of the scanner system.10-30-2008
20090213556TRACKBALL SOCKET FOR A HANDHELD WIRELESS COMMUNICATION DEVICE - A socket is configured to receive a trackball device in a receiving space formed therein. The socket has an exterior configured to fit within an installation recess in a printed circuit board. A biased electrical interconnector extends from an interior surface of the receiving space into the receiving space, the electrical interconnector oriented within the receiving space at a position that establishes biased electrical contact with a target electrical contact of the trackball device and biased electrical contact with a corresponding electrical contact on the printed circuit board when the socket is installed in an installation recess.08-27-2009
20110149530PRINTED CIRCUIT BOARD ASSEMBLY - There is provided a printed circuit board assembly including a printed circuit board having a plurality of circuit elements mounted on an upper surface thereof, and a power line mounted on a lower surface of the printed circuit board and supplying power to the circuit elements.06-23-2011
20110026228Retractable Circuit Board Guide And Bracket - A circuit board guide and bracket apparatus includes a first member collapsibly attached to a second member. The first member is attachable to a planar member in a chassis. The second member guides a circuit board being mounted into a connector on the planar member and supports the board subsequent to being mounted.02-03-2011
20120268903COVER FOR A FRAME FOR A DEVICE MOUNTED ABOVE A PRINTED CIRCUIT BOARD IN AN ELECTRONIC DEVICE - The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.10-25-2012
20110170267STRUCTURE, ANTENNA, COMMUNICATION DEVICE AND ELECTRONIC COMPONENT - A structure 07-14-2011
20120106100Backplane Wiring for an Input-Output Panel Used for Front or Rear Access - According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis.05-03-2012
20120106099PACKAGING BOARD - A packaging board is described having a structure that can positively prevent same kind electrical components having different specifications from being erroneously mounted on a printed board and that can quickly confirm a regular packaging position for each of the same kind of electrical components. The packing board includes at least two electrical components having a same kind and different specifications from each other can be provided with component side identifying marks that can discriminate between the electrical components. A printed board can be provided with mounting areas for the same kind of electrical components with board side identifying marks that correspond to the component side identifying marks.05-03-2012
20120106098Flat Panel Display Apparatus and Method of Manufacturing the Same - In a flat panel display apparatus having improved sealing and a method of manufacturing the same, the flat panel display apparatus comprises: a substrate; a display unit disposed on the substrate; a sealing substrate facing the display unit; a sealing member interposed between the substrate and the sealing substrate and surrounding the display unit; and a plurality of wiring groups comprising areas overlapping the sealing member between the substrate and the sealing substrate; wherein the wiring groups are disposed so as to surround the display unit, are spaced apart from an area corresponding to an edge of the display unit, and receive voltage from an external power source.05-03-2012
20120106097MOTHERBOARD - A motherboard includes a power circuit, a system power supply, and a central processor unit (CPU). The power circuit includes a direct current (DC) voltage input terminal. A first control circuit receives a direct current (DC) voltage through the DC voltage input terminal and outputs a first control signal. A second control circuit receives the first control signal and outputs a second control signal to the CPU and output a third control signal. A switching circuit includes a number of switches. The second control signal controls the corresponding switches to be on or off. A voltage converting circuit receives the third control signal and converts the DC voltage from the DC voltage input terminal, and outputs the converted DC voltage to the system power supply. The CPU receives the second control signal and controls the motherboard operation.05-03-2012
20120106096CONNECTOR ASSEMBLY FOR ELECTRICAL AND MECHANICAL INTERCONNECTION OF MODULES - A connector for electrical and mechanical interconnection of first and second mechanically adjacent modules with one another. The first module includes a first electrical connector and an alignment pin and the second module includes a printed circuit board floatingly and displacably mounted on the second module with at least one alignment hole aligned for alignment with the alignment pin of the first module and a second electrical connector aligned for engagement with a corresponding first electrical connector of the first module. During assembly, the alignment pin of the first module engages the alignment hole of the second module and displaces the printed circuit board to align the second electrical connector with the first electrical connector.05-03-2012
20100002401ELECTRONIC COMPONENT PACKAGING STRUCTURE HAVING TWO-LAYER MOISTURE-PROOF COATING AND METHOD FOR MANUFACTURING THE SAME - The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided.01-07-2010
20090273907CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit.11-05-2009
20090273908NETWORK TRANSFORMER, NETWORK MODULE THEREOF, AND ELECTRONIC DEVICE THEREOF - The invention discloses a network transformer, a network module thereof, and an electronic device thereof The network transformer includes a plurality of coil sets, an insulating board, a casing and a plurality of pins. The pins are disposed on the casing. The network transformer is disposed on a PCB via the pins. The insulating board is disposed in the casing and connects with at least two side walls of the casing to form a plurality of isolation chambers, each of which is for containing one coil set.11-05-2009
20110199738SUBSTRATE FOR DISPLAY DEVICE AND DISPLAY DEVICE - A substrate for a display device is disclosed which enables further reduction in area of a frame region and a display device comprising the substrate. In at least one embodiment, the present invention relates to a substrate for display device, comprising: a plurality of external connection terminals; and a plurality of lower wirings running below the plurality of external connection terminals; wherein the substrate further comprises an interlayer insulating film positioned between a layer of the plurality of external connection terminals and a layer of the plurality of lower wirings and provided with a plurality of connection holes, the plurality of lower wirings are running alongside each other in a direction across the plurality of external connection terminals and bent toward the same side with respect to the running direction in order from an endmost lower wiring, in a plan view of the substrate for display device, and each of the plurality of external connection terminals is connected through at least one of the plurality of through holes to a portion beyond the bent portion of any of the plurality of lower wirings.08-18-2011
20090284935STRUCTURE AND MANUFACTURING PROCESS FOR CIRCUIT BOARD - A circuit board structure comprising a composite layer, a fine circuit pattern and a patterned conductive layer is provided. The fine circuit pattern is inlaid in the composite layer, and the patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the composite layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density.11-19-2009
20090290314Environmental Protection Coating System and Method - A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.11-26-2009
20090052146Printed Board - The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay.02-26-2009
20120293968RETAINER FOR ADJACENT-ORIENTED CARDS - Fasteners and fastening systems for holding an electronic card on a bulkhead are disclosed. An example of a fastener includes a pin on a first side of the bulkhead. The fastener also includes a bracket to hold a portion of the electronic card on the pin of the bulkhead. The fastener also includes a connector to hold the bracket on a second side of the bulkhead, the first side of the bulkhead substantially perpendicular to the second side of the bulkhead.11-22-2012
20080212293FIXING DEVICE FOR SECURING CIRCUIT BOARD TO PLATE MEMBER - A fixing device for securing a circuit board to a plate member includes a spacer, a nut member, and a fastener. A coupling hole is defined through the spacer. A female thread is formed on a part of an interior surface of the coupling hole at an end thereof. A nut member comprises a pressing portion and a coupling portion extending from the pressing portion. A male thread is formed on a part of an exterior surface of the coupling portion at a free end thereof, corresponding to the female thread of the coupling hole of the spacer such that the coupling portion is capable of being movably retained in the coupling hole. A threaded hole is defined in the nut member. A fastener includes a head and a threaded rod extending from the head for being screwed in the threaded hole of the nut member.09-04-2008
20120293970ELECTRONIC CARD MODULE INCLUDING FUNCTION OF STORING INFORMATION REGARDING FABRICATION/MAINTENANCE/DRIVING OF A PRODUCT - An electronic card module which includes the function of storing information regarding the fabrication/maintenance/driving of a product. The electronic card module has a main function circuit unit configured by mounting various electronic components on a PCB substrate. The electronic card module is formed with the PCB module in one piece and includes an information provision unit which stores information including product fabrication information, maintenance information, and driving information, and which provides the information when a request is made from an external device.11-22-2012
20120293969METHOD AND APPARATUS FOR PROVIDING A MECHANICAL MEANS TO SUPPORT CARD SLOTS CAPABLE OF ACCEPTING CARDS OF MULTIPLE FORM FACTORS - An embodiment of the invention may comprise a reconfigurable chassis with one or more first card slots capable of being populated with a first mechanical form factor card, one or more second card slots capable of being populated with the first mechanical form factor card or with a second mechanical form factor card, and a mechanical slot adaptor configured to occupy at least one second card slot, where the mechanical slot adaptor is configured to provide mechanical support for the second mechanical form factor card in the second card slot.11-22-2012
20100271788CIRCUIT MODULE AND ELECTRONIC EQUIPMENT USING THE CIRCUIT MODULE - A circuit module of the present invention includes a circuit board, a plurality of electronic parts mounted on one face of the circuit board, a tubular body provided in an upstanding manner on the face in surrounding relation to the electronic parts, a turned-back portion turned back inwardly at a predetermined height position of the tubular body, and a resin portion formed by a sealing resin which is filled in the tubular body to a height reaching a distal end of the turned-back portion such that the resin covers at least part of the electronic parts. With this construction, the two surfaces of the sealing resin and the turned-back portion are joined together, so that the joining strength increases, and there can be provided the circuit module which is of the thin type and has a high strength. Further, through holes are provided at a region of the turned-back portion exposed from the sealing resin, and therefore a cavity within the turned-back portion (within a U-shaped portion), which is due to expansion of residual gas, can be eliminated, and besides the development of a convex portion formed on the upper surface of the resin by a cavity formed in the resin by gas moved from the interior of the turned-back portion into the resin and also the development of a crater-like irregularity portion formed on the upper surface of the resin portion when gas within the frame passes to the upper surface of the resin can be suppressed.10-28-2010
20090002958Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method - A method of fabricating a substrate core structure comprises, providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof.01-01-2009
20100149762FIXING STRUCTURE AND BACKLIGHT MODULE USING THE SAME - A fixing structure and a backlight module using the same are provided. The fixing structure is used for fixing a circuit board. The circuit board with several openings has an upper surface and a lower surface. The fixing structure includes a back plate and several hooks. The back plate has a contact surface. These hooks are disposed on the contact surface. The hooks go through the openings so that the contact surface contacts the lower surface. The hooks move toward the walls of the openings and press against the upper surface so as to fix the circuit board onto the back plate.06-17-2010
20110205714ELECTRONIC APPARATUS AND DAUGHTERBOARD - A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards.08-25-2011
20090097212Optimization of connector density and identification carrier for high density front plates - A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board.04-16-2009
20090168372EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly (07-02-2009
20080273311Enhanced Localized Distributive Capacitance for Circuit Boards - A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a second conductive layer coupled to a second surface of the first dielectric layer, and (4) a localized distributive non-discrete capacitive element adjacent the first conductive layer, wherein the capacitive element occupies a region that approximately coincides with a location over which a device to be coupled to the capacitive element is to be mounted. The embedded, localized, non-discrete, and distributive capacitive element may provide device-specific capacitance to suppress voltage/current noise for a particular device.11-06-2008
20080278920Hybrid Integrated Circuit Device and Method for Manufacturing Same - A hybrid integrated circuit device includes: an insulating substrate (11-13-2008
20080310128Variable Height Plug-In Pads and Equalizers - The electronic component mounts the circuitry and connector pins at the bottom of a substrate. The upper portion of the substrate has one or more weakened horizontal lines allowing the user to break off part of the upper portion of the substrate. Doing so allows a technician to shorten the component so that it properly fits into a cable system amplifier. A cap with indicia or color-coding may fit over the top of the substrate to help handling the component and identifying its type and electrical values.12-18-2008
20100142160ELECTRONIC DEVICE - An electronic device is described that includes a body member and a cable. The cable is mounted to and received in the body member.06-10-2010
20110205716CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE - Provided is a circuit substrate that affords a narrower frame in display devices or the like, while suppressing connection faults between wirings and external connection terminals. The invention is a circuit substrate having a substrate, on top of which wiring, an insulating film and an external connection terminal are disposed in order. The circuit substrate is provided with an anisotropic conductive film, having conductive particles, on the external connection terminal; and the external connection terminal is connected to the wiring via at least one contact hole formed in the insulating film, with the length from one end to the other end, in a plan view, of a region formed with one or more contact holes that connect to a specific external connection terminal being greater than the diameter of each of the conductive particles.08-25-2011
20110205715TRANSMISSION LINE CIRCUIT HAVING PAIRS OF CROSSING CONDUCTIVE LINES - A transmission line circuit includes a dielectric layer and a plurality of pairs of conductive lines extending generally along a first direction. The conductive lines in each pair are separated by the dielectric layer, and the conductive lines in each pair intermittently cross at crossing points that are separated by a first distance. The crossing points of adjacent pairs of the conductive lines are offset along the first direction.08-25-2011
20120069531CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS - A conducting paste and method of forming the paste for device level interconnection. The conducting paste contains metal loading in the range 80-95% that is useful for making five micron device level interconnects. The conducting paste is made by mixing two different conducting pastes, each paste maintaining its micro level individual rich region in the mixed paste even after final curing. One paste contains at least one low melting point alloy and the other paste contains noble metal fillers such as gold or silver flakes. In general, average flake size below five micron is suitable for five micron interconnects. However, 1 micron or smaller silver flakes and an LMP mixture is preferred for five micron interconnects. The amount of LMP based paste in the final mixture is preferably 20-50% by weight. The nano micro paste embodiment shows good electrical yield (81%) and low contact resistance.03-22-2012
20110222247Printed wiring board - A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.09-15-2011
20090103272DC-DC CONVERTER - A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil.04-23-2009
20090213557ELECTRONIC DEVICE WITH INTERNAL MICROPHONES DISPOSED IN FLEXIBLE HOLDERS - An electronic device includes a housing, a circuit board, a plurality of flexible holders, and a plurality of microphones. The housing includes a plurality of wall portions, a plurality of storage spaces encircled by the wall portions, and a plurality of acoustic openings connected to the storage spaces. The flexible holders are disposed in the storage spaces. Each of the flexible holders comprises a plurality of surfaces and at least one rib provided on the surfaces. The microphones are mounted on the circuit board and disposed in the flexible holders.08-27-2009
20090237893FIXING STRUCTURE FOR FIXING A CIRCUIT BOARD - A fixing structure includes a first case whereon a first boss is disposed, a circuit board whereon a hole is disposed in a position corresponding to the first boss, a fixing component for screwing in the first boss of the first case so as to fix the circuit board above the first case, a first elastic component disposed on a first side of the circuit board for supporting the circuit board above the first case, and a second elastic component disposed on a second side opposite to the first side of the circuit board for clamping the circuit board with the first elastic component.09-24-2009
20090244857CIRCUIT DEVICE - a circuit device includes a dielectric substrate including a first face and a second face opposite side of the first face; a coplanar line including a first line, a second line and ground electrodes, the first line and the second line being decupled mutually, the ground electrodes formed around the first line and the second line, the first line, the second line and the ground electrodes formed on the first face of the dielectric substrate; a capacitor for connecting the first line and the second line; a termination resistor connecting the second line; a microstrip line formed on the second face of the dielectric substrate; and a conducting portion formed in the dielectric substrate and electrically connecting the first line and the microstrip line.10-01-2009
20090244858IC CARD HAVING IMPROVED ELECTRICAL CONTACTS - An IC Card includes a microchip having memory portions storing programs and a plurality of electrical contacts including a first set of electrical contacts connected to the microchip for supporting respective and predetermined functions, according to a predetermined ISO 7816 standard that reserves a second set of the electrical contacts for future use. At least one electrical contact of the second set is further connected to the microchip and is configured by one or more of the programs for supporting respective additional functions.10-01-2009
20100177488Vinyl Addition Polycyclic Olefin Polymers Prepared With Non-Olefinic Chain Transfer Agents And Uses Thereof - A method of polymerizing poly(cyclic)olefin monomers encompassing (a) combining a monomer composition containing the poly(cyclic)olefin monomers, a non-olefinic chain transfer agent and an activator compound to faun a mixture; (b) heating the mixture; and (c) adding a polymerization catalyst containing Ni and/or Pd. The non-olefinic chain transfer agent includes one or more compounds selected from H07-15-2010
20110141704CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUACTURING THE SAME - A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.06-16-2011
20100165585CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES - Chip packages having power management integrated circuits are described. Power management integrated circuits can be combined with on-chip passive devices, and can provide voltage regulation, voltage conversion, dynamic voltage scaling, and battery management or charging. The on-chip passive devices can include inductors, capacitors, or resistors. Power management using a built-in voltage regulator or converter can provide for immediate adjustment of the voltage range to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices. Related fabrication techniques are described.07-01-2010
20100157547ELECTRONIC DEVICE MODULE - An electronic device module comprises a carrier and first and second device regions. The first device region comprises a plurality of serially-connected devices deposited on the carrier, and the second device region is adjacent to the first device region and comprises a plurality of serially-connected devices. The voltage potential of the plurality of the serially-connected devices in the first device region is substantially the same as that of the plurality of the serially-connected devices in the second device region whereby damage due to short circuit of the adjacent plurality of serially-connected devices is avoided.06-24-2010
20100259904Signal Conversion Device - The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.10-14-2010
20100182755SEMICONDUCTOR DEVICE - To provide a technique that can improve the reliability of coupling between a package with a PA module and a mounting board in mounting the package over the mounting board. The width of a back conductor pattern is made smaller than the width of each of back terminals. Specifically, for example, the back terminals are arranged in the X direction. The back terminals arranged in parallel to the X direction are coupled together by the back conductor pattern. At this time, the coupling direction (coupling line direction) of the back conductor pattern is the X direction. Taking into consideration the Y direction orthogonal to (intersecting) the X direction, the width of the back conductor pattern in the Y direction is made smaller than the width of each of the back terminals in the Y direction.07-22-2010
20100188825APPARATUS FOR ISOLATING MULTIPLE CIRCUIT BOARDS FROM VIBRATION - An apparatus for isolating an electronic device from vibration is provided. The apparatus includes a rigid frame and a circuit board assembly comprising a plurality of circuit boards. A first isolator is located on a first side of the circuit board assembly between the circuit board assembly and the rigid frame, wherein the first isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A second isolator is located on a second side of the circuit board assembly between the circuit board and the rigid frame. The second isolator is substantially opposite of the first isolator in relation to the circuit board assembly, wherein the second isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A third isolator is located on a third side of the circuit board assembly between the circuit board assembly and the rigid frame, wherein the third isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A fourth isolator is located on a fourth side of the circuit board assembly between the circuit board assembly and the rigid frame. The fourth isolator is substantially opposite of the third isolator in relation to the circuit board assembly, wherein the fourth isolator is held in place by equal and opposite forces from the rigid frame and the circuit board.07-29-2010
20100220449CIRCUIT BOARD MODULE AND I/O PORT COLLECTION BOARD THEREOF - A circuit board module includes a circuit board and an I/O port collection board. The circuit board includes at least a first transmission interface. The I/O port collection board has a substrate, a plurality of I/O ports, a plurality of traces, and at least a second transmission interface. The I/O ports, the traces, and the second transmission interface are formed on the substrate. The I/O ports are electrically connected with the second transmission interface via the traces. The second transmission interface is connecting with the first transmission interface of the circuit board.09-02-2010
20100238635Printed circuit board, manufacturing method thereof and radio-frequency device - A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.09-23-2010
20100238634CORRECTING FITTING FOR USE WITH PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD UNIT - A correcting fitting clamped by elasticity at least on one part of an edge portion of a printed circuit board for correcting warpage or flexure of the printed circuit board. The correcting fitting has a clamping portion for coming into band-shaped abutting contact with both faces of the printed circuit board along the edge portion of the printed circuit board. The clamping portion is bent in such a manner that at least a portion thereof is directed toward the edge portion of the printed circuit board. The bending strength of the correcting fitting against warpage and flexure of the printed circuit board can be enhanced by the clamping portion. Further, since fixing elements such as screws are not used to mount the correcting fitting, the number of parts of the printed circuit board and the number of steps for assembling the same can be reduced to thereby lower cost and achieve high-density packaging.09-23-2010
20110110053SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD USING THE SAME - A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.05-12-2011
20100226101Multi-Part Substrate Assemblies for Low Profile Portable Electronic Devices - Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.09-09-2010
20100220450PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.09-02-2010
20100254098Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board - Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (10-07-2010
20100254097OUTPUT ARCHITECTURE OF POWER SUPPLY - An output architecture of a power supply is disclosed, wherein the power supply includes an input portion to obtain input power and a conversion circuit board connecting to the input portion to convert the input power into output power of different voltage potential. The conversion circuit board includes plural power output areas with different preset output voltages, and after selecting the output standard, the power output areas connect to at least one power extension board via plural electrical conductive elements, so as to provide the power extension board the output power, and the power extension board has plural output wires connected to a load. Through the architecture described above, the corresponding output wires can be selected after the output standard is selected for connecting to the power extension board, and then, the power extension board is connected to the conversion circuit board.10-07-2010
20100246143Electromagnetic Interference Shielding for Compact Electronic Devices - Improved approaches for providing electromagnetic interference shielding to one or more electrical components within a housing of a portable electronic device are disclosed. According to one aspect of certain embodiments, an electromagnetic shield can be attached to one or more edges of a substrate (e.g., printed circuit board) provided within a housing of a portable electronic device. Advantageously, this allows the substrate space to be efficiently utilized such that relatively wide electrical components can be provided on the substrate without having to further increase the width of the substrate to provide space for an EMI shielding structure and its attachment to the substrate. The housing of the portable electronic device can be compact, such as a low profile housing.09-30-2010
20090141460CERAMIC MULTILAYER COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND RETAINING DEVICE - An electrical component includes a sintered ceramic and electrodes inside the sintered ceramic. The sintered ceramic and the electrodes together form a stack having a first surface and a second surface. The electrodes include a first electrode and a second electrode. The first electrode extends to the first surface but not to the second surface. The second electrode extends to the second surface but not to the first surface. At least one of the first electrode and the second electrode has a surface that contains metal. The surface is in contact with the sintered ceramic.06-04-2009
20090257206HOLDING APPARATUS - The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.10-15-2009
20090040735Tamper Respondent System - A tamper respondent system having: a physical volume containing an electronic device to be protected; an at least partially conductive surface proximate to the electronic device; and a tamper respondent sensor over the electronic device (the sensor comprising: a flexible, dielectric substrate; conductive traces on the substrate; a porous insulating layer having pores over the conductive traces; and adhesive within said pores of said porous insulating layer), wherein the adhesive is in contact with both the substrate and the at least partially conductive surface through the porous insulating layer.02-12-2009
20090213558SUPPORT METHOD AND APPARATUS FOR PRINTED CIRCUIT BOARD - An orthogonal array is formed by performing electromagnetic field analysis only once and determining a range by using the mount position and type of a capacitor and the number of capacitors as parameters to perform circuit analysis a small number of times. An estimation equation is formed by using as an index a result of the absolute value of the calculated power source impedance, and a capacitor is disposed to reduce noises by using the estimation equation.08-27-2009
20130128473METHOD FOR PRODUCING CAPACITOR, CAPACITOR, WIRING BOARD, ELECTRONIC DEVICE, AND IC CARD - There is provided a method for producing a capacitor which is capable of producing a capacitor having a high withstand voltage and low leakage current, 05-23-2013
20090109639PORTABLE ELECTRONIC DEVICE AND METHOD FOR IDENTIFYING ACCESSORY CONNECTED TO THE SAME - A portable electronic device (04-30-2009
20110128709Display array substrate and method of manufacturing display substrate - A display array substrate according to an aspect of the invention may include: a substrate wafer having a plurality of substrates and cutting portions connecting the plurality of substrates to a dummy area, the substrate wafer being diced to provide individual substrates by cutting the cutting portions; and a transparent electrode part coated over one surface of the substrate wafer.06-02-2011
20110122586Side key connection device of mobile terminal - A side key connection device of a mobile terminal simplifies a connection structure between a side key and a main circuit board. The mobile terminal includes a side key and a row and column terminal pad. The mobile terminal also includes a side key connection device installed between the side key and the row and column terminal pad. The side key connection device is electrically connected to the side key and the row and column terminal pad. Thereby, by simplifying a connection structure of a side key, a key cost, an assembly process, and a surface mounting cost can be reduced.05-26-2011
20090067140STIFFENING PLATE FOR CIRCUIT BOARD AND SWITCH ASSEMBLY - This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed.03-12-2009
20110110052MULTILAYER WIRING BOARD - A multilayer wiring board 05-12-2011
20110019368Silicon Carrier Structure and Method of Forming Same - A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.01-27-2011
20110019369ELECTRONIC CIRCUIT MODULE WITH GOOD HEAT DISSIPATION - An electronic circuit module includes a circuit board provided with the connector section, electronic parts provided on a mounting surface of the circuit board, a metallic board provided with a bonding section, which is superimposed on a part of the mounting surface of the circuit board, and an extension section which extends from the circuit board and is formed with the fixing through holes, a connection member that connects the circuit board to the metallic board, and a shim member superimposed at the same side as the circuit board with respect to the extension section of the metallic board, and having a thickness substantially identical to a thickness of the circuit board.01-27-2011
20120134119CHIP CARD HOLDING MECHANISM AND ELECTRONIC DEVICE USING THE SAME - A chip card holding mechanism includes a support bracket defining a receiving chamber and an opening communicating with the receiving chamber; a resilient member fixed to the support bracket at an end of the support bracket opposite to the opening, and partial received in the receiving chamber; a latching assembly rotatably fixed to the support bracket and further comprising a pair of latching portions; and a tray slidably assembled to the support bracket, in which the tray comprises an accommodating space defined thereon to receive a chip card, and a pair of opposite sidewalls adjacent to the accommodating space, each sidewall defining a latching groove according to the corresponding latching portion; and the tray is received in the receiving chamber by having the latching portions of the latching assembly engaged in the latching grooves and resisting against the resilient member. An electronic device using the same is also provided.05-31-2012
20110110051MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for an expansion card with a blocking piece is disclosed. The mounting apparatus includes a mounting bracket and a fixing piece. The mounting bracket includes a support plate with two bent portions. The fixing piece is pivotably mounted on the mounting bracket. The fixing piece includes a resisting piece, two resilient pressing pieces, and an engaging portion. The resisting piece secures the blocking piece to the support plate. The two resilient pressing pieces are connected to the resisting piece. The engaging portion retains the fixing piece to the mounting bracket. A pivot portion protrudes from each pressing piece and is received in each bent portion. The two pressing pieces are oppositely pressed to disengage the pivot portion from the bent portion.05-12-2011
20110116242TAMPER EVIDENT PCBA FILM - Method and apparatus for constructing and operating a printed circuit board assembly (PCBA). In some embodiments, a plurality of electronic components are attached to a first side of a substrate that has at least one electrical lead that connects the electrical components is present on an opposite second side of the substrate. A primary film is adhered to the second side of the substrate to create an air tight seal around each electrical lead. A secondary film is then adhered to the primary film and provides a cantilevered lift tab that extends outside the bounds of the primary film. The secondary film has a lower bond strength than the primary film.05-19-2011
20110085306MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open.04-14-2011
20090323295INJECTION MOLDED METAL STIFFENER AND INTEGRATED CARRIER FOR PACKAGING APPLICATIONS - In some embodiments, an injection molded metal stiffener and integrated carrier for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device, and wherein the stiffener includes an overhang that extends along a side of the package substrate and incorporates a coupling feature. Other embodiments are also disclosed and claimed.12-31-2009
20110242772PRE-LAMINATION CORE AND METHOD FOR MAKING A PRE-LAMINATION CORE FOR ELECTRONIC CARDS AND TAGS - The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core.10-06-2011
20110242773CONTROLLER, ELECTRIC POWER STEERING PROVIDED WITH THE SAME, METHOD OF MANUFACTURING BUS BAR, AND METHOD OF MANUFACTURING CONTROLLER - A controller includes: a circuit board; a retaining member; a bus bar that has an embedded portion embedded in and retained by the retaining member and an exposed portion that is exposed from the retaining member and that is electrically connected to the circuit board; and an electrical element that has a terminal connected to the exposed portion. The bus bar is formed in such a manner that a metal plate of which an outer surface is plated with a plating layer is cut along a predetermined cutting plane. The cutting plane at the exposed portion has a parallel portion that is arranged substantially parallel to a principal surface of the circuit board. The parallel portion and the terminal are joined to each other.10-06-2011
20110085305ELECTRONIC DEVICE, WASHER AND METHOD FOR MANUFACTURING WASHER - An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.04-14-2011
20110090651PACKAGE STRUCTURE - Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate.04-21-2011
20120188730INSULATING SHEET, CIRCUIT BOARD, AND PROCESS FOR PRODUCTION OF INSULATING SHEET - An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.07-26-2012
20120188729PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board (PCB) according to an exemplary aspect of the present invention includes a plate-like member, a power supply circuit, a power supply line, and a ground line. The plate-like member has a surface on which a semiconductor device is mounted. The power supply circuit is embedded in the plate-like member in a region in which the semiconductor device is mounted, and outputs a power supply voltage and a ground voltage. The power supply line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the power supply voltage output from the power supply circuit to the semiconductor device. The ground line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the ground voltage output from the power supply circuit to the semiconductor device.07-26-2012
20120188728COMPLIANT INSERT FOR ELECTRONICS ASSEMBLIES - A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.07-26-2012
20100014260ELECTRONIC DEVICE WITH CHIP CARD - A electronic device (01-21-2010
20100046176PORTABLE ELECTRONIC DEVICE WITH MAINTENANCE CAPABILITY - A portable electronic device includes a circuit board and at least one treatment element mounted adjacent to the circuit board and storing volatile maintaining matters therein. The circuit board generates heat when the portable electronic device is working to heat the treatment element, and then the maintaining matters volatilize to maintain the portable electronic device.02-25-2010
20120243185MICRO AND MILLIMETER WAVES CIRCUIT - Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board.09-27-2012
20100321901OPTICAL ELEMENT, ELECTRONIC MODULE AND METHOD OF PRODUCING ELECTRONIC MODULE - Disclosed are: an optical element which is reduced in the changes in transmittance which may be caused by a reflow processing; an electronic module; and a method of producing an electronic module. The optical element comprises an optical material which comprises a curable resin material comprising a curable resin and a curing agent and at least one additive, wherein the light transmittance of the optical material at a wavelength of 400 nm is lower by 1 to 10% than that of the curable resin material without the additive at a wavelength of 400 nm.12-23-2010
20120201009LEAD FREE LTCC TAPE COMPOSITION - The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself.08-09-2012
20110149529PROCESSING OF ELECTRIC AND/OR ELECTRONIC ELEMENTS ON CELLULOSIC SUBSTRATES - The present invention consists of the direct deposition over paper of electric and electronic elements, single or integrated, including at nano-scale. The deposition, by virtue of the materials and scale utilized, is furthermore transparent, which allows the application of the present invention in the domain of graphic arts. The deposition is executed at close-to-ambient temperatures, an in a less controlled environment than that of traditional deposition processes. Furthermore, the low cost of printing obtained allows for the application of electronic paper to large surfaces.06-23-2011
20110249409COMPUTER MOTHERBOARD - A computer motherboard includes a display controller, a digital visual interface integrated (DVI-I) connector, and a switching unit. The switching unit includes four first terminals, two second terminals, and a control terminal. Two of the first terminals are respectively connected to clock and data pins of a first display data channel (DDC) of the display controller, the other two first terminals are respectively connected to clock and data pins of a second DDC of the display controller, and the second terminals are respectively connected to DDC clock and DDC data pins of the DVI-I connector. The control terminal is connected to a hot plug detect pin of the DVI-I connector to detect a voltage and correspondingly control the second terminals to be respectively connected to the two first terminals connected to the clock and data pins of the first DDC or the second DDC.10-13-2011
20080239680METHOD OF FORMING BURIED WIRING LINES, AND SUBSTRATE AND DISPLAY DEVICE USING THE SAME - An method of forming buried wiring lines makes it possible not to limit usable materials for an insulative plate to those having excellent heat resistance and to improve the corrosion resistance of the terminals provided for the buried wiring lines. The surface of an insulative plate is selectively etched using a mask formed on the surface, thereby forming grooves in the surface. A metallic nanoparticle ink is placed over the whole surface of the plate to fill the grooves with the ink, where the mask is being left. The ink is heated for preliminary curing to form a metallic nanoparticle ink film. The part of the film placed on the mask is selectively removed by detaching the mask, thereby leaving the remainder of the film in the grooves. The remaining film in the grooves is heated for main curing, thereby forming desired buried wiring lines.10-02-2008
20110249410CARD HOLDING APPARATUS CAPABLE OF HOLDING CARD-SHAPED ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT PROVIDED WITH THE SAME - Due to the presence of a regulating part in the vicinity of a protrusion of a guide member, a card holding apparatus can prevent large deformation of the protrusion even when an excess pressure force in an insertion direction is applied to the expansion card mounted on the card holding apparatus. Thus, when the subsequent expansion cards are mounted, a guide member can be displaced normally in the insertion direction, and a heart-shaped cam mechanism can be operated normally. Therefore, the expansion card can be removed from the card holding apparatus, using the elastic restoring force of a spring.10-13-2011
20110157842USE OF HYBRID PCB MATERIALS IN PRINTED CIRCUIT BOARDS - A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.06-30-2011
20110157841PORTABLE ELECTRONIC DEVICE WITH HOLLOW SUPPORT - A portable electronic device includes a main body, a circuit board in the main body, a rear cover, at least one first conductive member exposed through the rear cover and electrically connected to the circuit board, and a support assembly. The support assembly includes a hollow support detachably connected to the rear cover, at least one second conductive member connected to the hollow support and staying in contact with the at least one second conductive member, and at least one cable extending through the hollow support and comprising a first end electrically connected to the at least one second conductive member, and a second end extending out of the hollow support for connecting with a peripheral.06-30-2011
20110157840CHIP CARD HOLDER AND ELECTRONIC DEVICE USING THE SAME - A chip card holder is configured for receiving a chip card. The chip card holder includes a housing defining a groove, a latching part received in the groove, a fixing element made of rubber material. The chip card is received in the latching part. The fixing element includes a main plate, a positioning portion, a rib, and a free end. The positioning portion is positioned on a side of the main plate. The positioning portion latches the housing. The rib is positioned on the same side which positioning the positioning portion. The rib resists the chip card. The free end extends from a peripheral edge of the main plate. The present disclosure further discloses an electronic device using the chip card holder.06-30-2011
20080291645INTERFACE RETENTION AND SUPPORT APPARATUS AND METHOD OF USE - An interface retention and support apparatus and method of use is disclosed. In one form, an extension apparatus can include a first coupling interface operable to be coupled to an first expansion terminal of a printed circuit board. The apparatus can also include a retention mechanism aligned to a surface of the first coupling interface. The retention mechanism can be used to engage a first exterior surface of the first expansion terminal upon coupling the first coupling interface to the first expansion terminal. The apparatus can further include an access terminal operably coupled to the first coupling interface and an expansion circuit coupled between the first coupling interface and the access terminal. The expansion circuit can electrically couple the first expansion terminal to access terminal.11-27-2008
20080212292ELECTRONIC DEVICE WITH WATERPROOF STRUCTURE AND FABRICATION METHOD THEREOF - An electronic device with a waterproof structure includes a housing structure, a printed circuit board and a protective layer. The housing structure includes a receptacle, a first opening and a second opening. The printed circuit board is disposed within the receptacle and includes plural electronic components and electrical trace patterns thereon. The protective layer is formed on at least a portion of the electronic components and the electrical trace patterns to protect the printed circuit board from moisture attack.09-04-2008
20100149761Apparatus and method for use in assembly of a portable apparatus - An apparatus including: a first interconnector portion configured to fasten to a side part of a first housing portion of a portable apparatus, and a second interconnector portion rigidly connected to the first interconnector portion and configured to fasten to a second housing portion of the portable apparatus.06-17-2010
20100328903CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS - A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.12-30-2010
20120275122USING A COUPLING ORTHOGONALIZATION APPROACH TO REDUCE CROSS-TALK - An apparatus is provided. The apparatus generally comprises a plurality of pairs of differential transmission lines. The plurality of pairs of differential transmission lines includes a set of pairs of differential transmission lines with each pair of differential transmission lines from the set of pairs of differential transmission lines including at least one twist to alternate current direction. Also, the plurality of differential transmission lines are arranged such that alternating current directions substantially eliminate cross-talk across the plurality of pairs of differential transmission lines.11-01-2012
20120275123CERAMIC ANTENNA MODULE AND METHODS OF MANUFACTURE THEREOF - Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end.11-01-2012
20120147569ELECTRONIC DEVICE AND PORT CONNECTOR THEREOF - An electronic device includes a main body and a port connector. The main body includes a printed circuit board, a bottom plate and a side plate cooperatively defining a opening. The printed circuit board is fixed parallelly to the bottom plate. The port connector includes an outer angled plate having a first wall, a second wall, and first pins and second pins. The first wall is attached to the bottom plate and defines first ports. The second wall is attached to the side plate and defines second ports. Each of the first pins is retained within one of the first ports and contacting the printed circuit board. Each of the second pins is retained within one of the second ports and contacting the printed circuit board.06-14-2012
20110096514SHIELD FOR A COMPONENT FOR AN ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING COMPONENTS IN THE DEVICE - The disclosure provides a shield for a component in an electronic device. The shield comprises a cap for locating on the PCB about the first component, the cap having a first and a second arm extending outwardly from a body of the cap. For the shield, a platform is mountable on the cap to provide a top surface for mounting a second component thereon; and a connector is disposable on the PCB, located against the cap and the arm, the connector providing electrical connections between the PCB and the platform for the second component. The disclosure also provides a method of assembling components in an electronic device. The method comprises: assembling the cap on the PCB; and assembling the platform onto the cap without utilizing an external jig and utilizing alignment features provided on the cap and the platform, such that the platform is placed on top of the cap at a predetermined location about the cap defined by the alignment features.04-28-2011
20110096515ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 04-28-2011
20100165584DETACHABLE NETWORK COMMUNICATION DEVICE, ELECTRONIC DEVICE AND COMMUNICATION DEVICE - A detachable network communication device comprising a first antenna is disclosed. The detachable network communication device is operable to be coupled to a second electronic device comprising a second antenna, wherein the first antenna is coupled to the second antenna to form a combined antenna structure. The combined antenna structure is operable to receive and/or transmit radio signals such as, for example, digital television signals. The detachable network communication device may also comprise an additional sub-antenna that may be operable as a diversity antenna.07-01-2010
20100165583Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module - In the specification and drawing a display module is disclosed. The display module comprises a backboard, a display component and a printed circuit board with at least one locating pin formed thereon. The backboard has at least one locating hole. The display component is disposed on the backboard. The at least one the locating pin is inserted in the locating hole. Moreover, a method for manufacturing the printed circuit board and a method for fabricating the display module are also disclosed in the specification and drawing.07-01-2010
20100067201FLIP ELECTRONIC DEVICE - A flip electronic device includes a cover, a display module, a casing, a circuit board, and an electrical connection element. The casing is pivotally connected with the cover. The cover has a light-transparent portion. The display module is disposed at the cover. The circuit board is disposed in the casing. The electrical connection element is electrically connected with the display module and the circuit board. At least one portion of the electrical connection element is viewable through the light-transparent portion.03-18-2010
20100195292ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR - When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.08-05-2010
20100195291ELECTRONIC CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic circuit module includes a plurality of electronic parts mounted on a substrate, the space separating the electronic parts being filled with thermosetting insulating resin, the insulating resin being covered by metal foil so as to expose the profiles and the heights of the electronic parts, the outer periphery of the metal foil being electrically connected to a grounding electrode arranged on the substrate by means of a conductive material.08-05-2010
20100195293METHOD FOR PRODUCING CAPACITOR, CAPACITOR, WIRING BOARD, ELECTRONIC DEVICE, AND IC CARD - There is provided a method for producing a capacitor which is capable of producing a capacitor having a high withstand voltage and low leakage current, 08-05-2010
20090316370ELECTROMAGNETIC NOISE SUPPRESSOR, STRUCTURE WITH ELECTROMAGNETIC NOISE SUPPRESSING FUNCTION AND THEIR MANUFACTURING METHODS - An electromagnetic noise suppressor of the present invention has magnetic resonance frequency of 8 GHz or higher, and the imaginary part of complex magnetic permeability at 8 GHz is higher than the imaginary part of complex magnetic permeability at 5 GHz. Such an electromagnetic noise suppressor is capable of achieving sufficient electromagnetic noise suppressing effect over the entire sub-microwave band. The electromagnetic noise suppressor can be manufactured by forming a composite layer on the surface of a binding agent through physical deposition of a magnetic material on the binding agent. The structure with an electromagnetic noise suppressing function of the present invention is a printed wiring board, a semiconductor integrated circuit or the like that is covered with the electromagnetic noise suppressor on at least a part of the surface of the structure.12-24-2009
20090316369TOOL-LESS VERTICAL PCBA INSULATOR AND SUPPORT/SHIPPING BRACE - A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard.12-24-2009
20090284936Combination of a Main Carrier and a Printed Circuit Board with Components - A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.11-19-2009
20110188213THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE - A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.08-04-2011
20110149531ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, a substrate installed in the housing, a trace provided on an inner surface of the housing, and a connector including a connector body formed of an elastic body and compressed between the inner surface of the housing and the substrate, and a conductor buried in the connector body so as to penetrate the connector body, the connector electrically connecting the trace and a terminal of the substrate by the conductor. The housing includes a holder integrally formed therewith, the holder defining an attachment position of the connector. The holder protrudes from the inner surface of the housing in such a manner as to support the substrate and controls a degree of compression of the connector body.06-23-2011
20110149528METHODS AND COMPOSITIONS FOR DIELECTRIC MATERIALS - The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.06-23-2011
20110149532LAMINATE, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - Disclosed is a laminate including an insulating resin layer and a metallic foil formed in contact with the insulating resin layer. The laminate is characterized in that the interface stress between the insulating resin layer and the metallic foil represented by the following formula (1) is not more than 7×1006-23-2011
20100020509Integrated Power Passives - A multi-layer film-stack and method for forming the multilayer film-stack is given where a series of alternating layers of conducting and dielectric materials are deposited such that the conducting layers can be selectively addressed. The use of the method to form integratable high capacitance density capacitors and complete the formation of an integrated power system-on-a-chip device including transistors, conductors, inductors, and capacitors is also given.01-28-2010
20110051378Wafer-Level Molded Structure for Package Assembly - An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound.03-03-2011
20110051377CIRCUIT BOARD HOLDING MEMBER AND IMAGE FORMING APPARATUS - A circuit board holding member includes a body portion, holding portions and first attachment portions. The body portion is made of resin, and is provided to hold a circuit board. The holding portions are made of resin. The holding portions are formed integrally with the body portion, and are provided to hold connection lines to be connected from electric modules of an apparatus to the circuit board. The first attachment portions are provided in the body portion and serve for removably attaching the circuit board to the apparatus.03-03-2011
20080316715Coated Copper, Method for Inhibiting Generation of Whisker, Printed Wiring Board and Semiconductor Device - A coated copper is provided which inhibits the growth of whiskers and is composed of a copper substrate or a copper alloy substrate, a copper-diffused tin layer formed on the surface of the substrate, and a pure tin layer formed on the surface of the copper-diffused tin layer. The thickness of the copper-diffused tin layer is 55% or more with respect to the total thickness of the copper-diffused tin layer and the pure tin layer. Further, a printed wiring board is provided having a wiring pattern of the copper substrate or the copper alloy substrate, and a semiconductor device. Accordingly, the generation of long whiskers having a length exceeding 15 μm which cause short circuits can be inhibited.12-25-2008
20120147570SWITCH STRUCTURE, ELECTRONIC COMPONENT PART INSTALLING STRUCTURE, AND ELECTRONIC MUSICAL INSTRUMENT INCLUDING THE SAME - An intermediate member includes: a base section including a fixing portion provided on a circuit board along the outer periphery of a switch section, and a cylindrical held portion formed integrally with the upper end of the fixing portion; a operator portion operable to drive the switch section; and a resilient connection portion resiliently connecting the operator portion to the base section. A panel member and the circuit board are fixed in face-to-face pressed engagement with each other with the intermediate member sandwiched therebetween. The operator portion is partly exposed out of an opening portion formed in the panel member, the held portion is held fitted with a cylindrical holding portion provided on the lower surface of the panel member, and the fixing portion is sandwiched between the lower end of the holding portion and the upper surface of the circuit board.06-14-2012
20110304994CONDUCTIVE VIA STRUCTURES FOR ROUTING POROSITY AND LOW VIA RESISTANCE, AND PROCESSES OF MAKING - An integrated circuit structure includes a first conductive layer (MET12-15-2011
20120039049CARD DEVICE AND POWER SUPPLY METHOD OF CARD DEVICE - One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body (02-16-2012
20120147568PRINTED CIRCUIT BOARD FOR USE IN GIGABIT-CAPABLE PASSIVE OPTICAL NETWORK AND METHOD FOR LAYING OUT THE PRINTED CIRCUIT BOARD - A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnetic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.06-14-2012
20110063806HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.03-17-2011
20120120614WIRING BOARD - There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.05-17-2012
20120120616WIRING BOARD, METHOD FOR MANUFACTURING SAME, DISPLAY PANEL, AND DISPLAY DEVICE - A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area.05-17-2012
20120120617FEED LINE STRUCTURE, CIRCUIT BOARD USING SAME, AND EMI NOISE REDUCTION METHOD - Provided is a feed line structure that enables suppression of noise entering a primary power supply from an electronic circuit without using a circuit component such as a choke coil and a capacitor and also without increasing an occupied area on the circuit board, so that an EMI countermeasure is achieved. The feed line structure includes a feed line composed by pairing a power supply wire 41 and a reference potential wire 42 in an insulator 40, and is characterized in that a wire 43 in a floating state in potential is provided.05-17-2012
20120120615CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.05-17-2012
20120044655GPS-Timing Module - A GPS-timing module for a wireless communication system comprises an “in line” power-over-Ethernet system and a modular surge protection means for protecting the device and a connected wireless access point/backhauls from power or Ethernet surges. The “in line” Power-over-Ethernet system allows the GPS-timing device to directly power the wireless access point/backhaul to which it is providing a GPS-timing signal. The modular surge protection means comprises a removable component that can be quickly replaced following a power surge. The GPS-timing module further comprises a plurality of DIP switches. The DIP switches allow a user to turn the GPS-timing module on and off, turn the communication module on or off, switch between the GPS-timing module's internal GPS-antenna and external GPS-antenna, and remotely revert the communication module to it “default” mode from its “normal” mode.02-23-2012
20120044656ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer.02-23-2012
20120002378BACKPLANE AND BACKPLANE COMMUNICATION SYSTEM - The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.01-05-2012
20120002377GALVANIC ISOLATION TRANSFORMER - An integrated circuit die system comprises a first integrated circuit die, a second integrated circuit die and a transformer formed on a dielectric (e.g., quartz) substrate and electrically connected between the first integrated circuit die and the second integrated circuit die to provide galvanic isolation therebetween.01-05-2012
20100226102PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.09-09-2010
20120057310TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a module in the housing, and an electrical interconnection. The housing includes a first portion, a second portion including a step between the first portion and the second potion, and a slope between the first portion and the second portion. The electrical interconnection extends from the first portion to the second portion via the slope and is electrically connected to the module.03-08-2012
20120014073CONDUCTIVE NANOPARTICLE SUBSTRATE AND METHOD OF MANUFACTURE - A device comprising a substrate with first and second layers is prepared by applying a cellulosic base layer on the substrate followed by a silver nanoparticle coating. The nanoparticle coating is durable and highly electrically conductive. This conductive substrate maybe used for the application of integrated circuitry components, and does not outgas upon application of reflow solder.01-19-2012
20120206886HIGH-FREQUENCY MODULE - In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal.08-16-2012
20120026698INTEGRATED CIRCUIT BOARD - An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.02-02-2012
20080298028AMC CARRIER FACEPLATES - A faceplate for AMC carriers is fabricated from extruded aluminum using a combination of extruded cross-sectional features and machined features to achieve the structural and functional characteristics of an AdvancedTCA faceplate. The extruded aluminum faceplate significantly improves on sheet-metal alternatives while substantially conforming to the AdvancedTCA specification.12-04-2008
20120155036HYBRID CIRCUIT - A hybrid circuit includes a high-voltage circuit and a low-voltage circuit having different power supply voltages, respectively, a board on which a connecting terminal for connecting an external element outside of the hybrid circuit is mounted; and a hybrid integrated circuit mounted on the board. The low-voltage circuit includes a control unit for controlling an operation of the high-voltage circuit. The control unit and the high-voltage circuit are integrated in the hybrid integrated circuit.06-21-2012
20110069459SUBSTRATE LAYER ADAPTED TO CARRY SENSORS, ACTUATORS OR ELECTRICAL COMPONENTS - This invention relates to a substrate layer structure adapted to carry electronic device, or components, or electro-mechanical, or electro-chemical sensors, or a combination thereof, and adapted to be attached to a surface of a human or animal body or biological species. The surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry-formed by one or more slits, but this geometry being selected such that the stretchability of the substrate layer structure becomes adapted to the geometry of the body surface under it.03-24-2011
20120300417Power Distribution Mounting Component and Inverter Apparatus Using Same - The present invention is a power distribution mounting component operable at high voltages. More specifically, the power distribution mounting component includes: an insulating layer; current-carrying first conductor layers sandwiching the insulating layer; and a second conductor layer (thinner than the first conductor layers) interposed between the insulating layer and at least one of the first conductor layers. Each the second conductor layer between the insulating layer and the overlying current-carrying first conductor layer is sufficiently thinner than the first conductor layer and is therefore formed in close adhesion to the insulating layer, thereby increasing the partial discharge inception voltage of the power distribution mounting component and therefore its insulation reliability.11-29-2012
20110103026MOUNTING APPARATUS FOR PERIPHERAL COMPONENT INTERCONNECT CARD - A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a blocking plate and a first engaging portion. The mounting piece includes an elongated body and a mounting end extending from the elongated body. The mounting end abuts the blocking plate. The securing member is pivotably attached to the mounting bracket and abuts the mounting end to sandwich the mounting end between the securing member and the blocking plate. The securing member includes a second engaging portion, a handling portion, and an elastic arm. The second engaging portion engages the first engaging portion. The handling portion is for driving the second engaging portion to disengage from the first engaging portion by biasing the handling portion.05-05-2011
20100172110ELECTRONIC APPARATUS - An electronic apparatus includes a printed board having a mounting surface and a ground layer, a peripheral circuit of a memory, which is mounted in the electronic apparatus, being mounted on the mounting surface, a metal plate disposed above the mounting surface, and a plurality of conductive portions that electrically connect the ground layer and the metal plate to each other, wherein the peripheral circuit is mounted between the conductive portions.07-08-2010
20120250268PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM - An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.10-04-2012
20120127676ARRANGEMENT FOR CONNECTING ELECTRICAL CONDUCTORS TO TERMINAL CONNECTIONS OF INTERCONNECTED CELLS - In order that even the cell connectors (05-24-2012
20120127675APPARATUS HAVING A WIRING BOARD AND MEMORY DEVICES - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL05-24-2012
20120162933MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for an expansion card includes a bracket, and a securing member. The bracket is capable of fixing a front end of the expansion card. The securing member is slidably mounted to the bracket back and forth, for fixing a rear end of the expansion card.06-28-2012
20120162934ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.06-28-2012
20120162932POWER AND GROUND PLANES HAVING MODIFIED RESONANCE FREQUENCIES - Adjusting the resonance of a power distribution network in a device to ensure a resonance frequency of the device is outside of a frequency band of wireless signals, other interference signals, or interference signals intrinsic to the device. The resonance frequency may be adjusted by cutting slices into the power and/or ground planes such that a serpentine pattern (or other desired pattern) is formed. The serpentine pattern increases the length that the current travels along the power/ground plane and thus, changes the resonance frequency of the device.06-28-2012
20120314381ANTENNA DESIGNING METHOD AND DATA CARD SINGLE BOARD OF WIRELESS TERMINAL - An antenna designing method and a data card single board of a wireless terminal are provided. The antenna designing method provided by an embodiment of the present invention includes: dividing a semi-closed area without other metal wirings on a data card single board of the wireless terminal; and arranging an antenna wiring in the semi-closed area, where a gap exists between the antenna wiring and the data card single board, and the antenna wiring is coupled with the data card single board via the gap. The embodiments of the present invention also disclose a data card single board of the wireless terminal. According to the embodiments of the present invention, a Specific Absorption Rate (SAR) value of the antenna is reduced, and meanwhile, a working bandwidth of a broadband is realized.12-13-2012
20120212911ELECTRONIC DEVICE HAVING ADJUSTABLE MOUNTING MODULE - An electronic device having an adjustable mounting module is disclosed. The adjustable mounting module comprises a shaft bracket, a base and an adjusting member. The shaft bracket has at least one fixing member and a bracket body. The bracket body is pivotally mounted on the fixing member. The base is pivotally mounted on the bracket body and is for an electronic assembly to be mounted thereon. The adjusting member is pivotally mounted on bracket body and correspondingly geared with the base. With the foregoing structure, a user can use the adjusting member to drive the base or the bracket body to rotate and thereby adjusts view angle of the electronic assembly.08-23-2012
20120134121ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: a vibrator disposed within a cavity on a substrate and electrically driven; an enclosure wall which has electric conductivity and sections the cavity from an insulation layer surrounding the circumference of the cavity; a first wiring and a second wiring which connect with the vibrator and penetrate the enclosure wall; and a liquid flow preventing portion disposed at the position where the first wiring and the second wiring penetrate the enclosure wall to prevent flow of etchant dissolving the insulation layer from the cavity toward the insulation layer and insulate the first wiring and the second wiring from the enclosure wall.05-31-2012
20120134118SINGLE SIDED FEED CIRCUIT PROVIDING DUAL POLARIZATION - A feed circuit for connecting adjacent components includes: a printed circuit board having a first portion and an axis of symmetry extending along a longitudinal direction of the first portion, second portions extending in substantially opposite directions from one end of the first portion, and third portions extending in substantially opposite directions from another end of the first portion; at least two circuits electrically connecting respective ones of the second portions with corresponding ones of the third portions; and connection areas at each of the second portions configured to be connected to one of the adjacent components, and at each of the third portions configured to be connected to another one of the adjacent components.05-31-2012
20120134120DRIVER ELEMENT AND DISPLAY DEVICE - To broaden a substantial area for wiring between a display portion and a driver element, and to increase the number of wirings between the driver element and the display portion.05-31-2012
20090059541Electronic assembly having housing with embedded conductor connecting electrical component - An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization.03-05-2009
20120229992MULTILAYERED COMPOSITE SYSTEMS, PRODUCTION THEREOF AND USE THEREOF - Multilayered composite system comprising 09-13-2012
20120229991ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces.09-13-2012
20120170229FIXING DEVICE FOR CIRCUIT BOARD - A fixing device for circuit boards of different thicknesses includes a base board, a number of posts protruding from the base board, a number of resilient brackets respectively mounted to the posts, a number of blocks respectively received in the resilient brackets and stacked on top of the corresponding posts, and a number of fasteners inserted through the circuit board, and the resilient brackets, and the blocks, to engage in the posts.07-05-2012
20120236513Hermetically Sealed Radio-Frequency Front End - A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.09-20-2012
20120176752Assembly Apparatus - An assembly apparatus is provided. The assembly apparatus includes a fixed apparatus that includes a body element, a first fixed element protruding from an outer curved surface of the body element in a radial direction of the body element, and a second fixed element extending in a first direction that is vertical to the radial direction of the body element, and a support apparatus that includes a first receiving element in which the first fixed element is inserted, rotated, and fixed, and a second receiving element in which the second fixed element is inserted, rotated, and fixed. An end of the second fixed element is connected to the body element. Another end of the second fixed element protrudes from a lower surface of the body element.07-12-2012
20100008052Integrated photovoltaic cell and antenna - RF device powered by photovoltaic cells. A device comprises a substrate having one or more photovoltaic cells mounted on one side of the substrate, and an RF antenna mounted on the other side of the substrate. Electronics powered by the photovoltaic cells and communicating via the RF antenna are preferably mounted on the same side of the substrate as the antenna, but may be mounted on the same side of the substrate as the photovoltaic cells.01-14-2010
20120218723MOBILE TERMINAL - Disclosed herein is a mobile terminal including a terminal body comprising a circuit board formed to process radio signals, a first and a second member configured to form an external appearance of the terminal and disposed to cover a lateral surface of the circuit board, a power feed connecting portion to allow the first member and the circuit board to be power feed connected, and a ground connecting portion to allow the first member and the circuit board to be ground connected. Accordingly, an electrical element and an antenna are disposed adjacent to each other, allowing the effective use of a space within the terminal.08-30-2012
20120314379WIRING DEVICE AND DISPLAY DEVICE - A wiring device includes a main conductive line, a plurality of branch conductive lines, a passivation layer, a plurality of contact holes, a plurality of conductive patterns, and a plurality of outside device bonding regions. The branch conductive lines are electrically connected to the main conductive line. The passivation layer is disposed on the branch conductive lines. Each the contact hole partially exposes one of the branch conductive lines. The conductive patterns are disposed on the passivation layer, and each of the conductive patterns is disposed respectively corresponding to each of the branch conductive lines. Each of the conductive patterns is electrically connected to the corresponding branch conductive line via the contact holes. Each of the outside device bonding regions is disposed corresponding to each of the branch conductive lines. At least one of the outside device bonding regions does not overlap the contact hole in a vertical projective direction.12-13-2012
20120314380INJECTION MOLDED CONTROL PANEL WITH IN-MOLDED DECORATED PLASTIC FILM THAT INCLUDES AN INTERNAL CONNECTOR - Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.12-13-2012
20120257360FIXING APPARATUS FOR ELECTRONIC DEVICE - A fixing apparatus includes a circuit board and a support member. A connector is installed on the circuit board. The support member includes a first connection portion to be electrically connected to an electronic device, and a second connection portion formed below the first connection portion and electrically connected to the first connection portion. The second connection portion is plugged into the connector of the circuit board, to elevate the electronic device.10-11-2012
20120257359Circuit Layout of Image Capturing Device - A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit.10-11-2012
20120262885SIGNAL TRANSFER CIRCUIT - Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.10-18-2012
20120257361DISPLAY DEVICE AND ELECTRONIC APPARATUS - Disclosed herein is a display device including: a display substrate having wires on a particular one of the surfaces of the display substrate, and having penetration holes each provided at a position exposed to the wire and penetrating the display substrate from the particular surface to the other display-substrate surface; and a wiring substrate provided on the side of the other surface of the display substrate and electrically connected to the wires through the penetration holes.10-11-2012
20120081862STRUCTURE FOR FIXING CIRCUIT BOARD - A structure for fixing circuit board, adapted for fixing a circuitboard at the rear of a cage, is disclosed, which comprises: a circuitboard; and a clamp, configured with a clipping part, a fixing part and an elastic part; wherein, the clipping part is coupled to the fixing part while the fixing part is coupled to the elastic part; the clipping part has a first hook formed at a surface facing toward the fixing part; the elastic part has a second hook formed extruding out form a surface facing away from the fixing part; the clipping part and the fixing part are arranged straddling across the top edge of the circuitboard while enabling the first hook to couple to a fastener of the circuitboard; and the elastic part is arranged facing toward the cage while enabling the second hook to secure to the bottom of the cage.04-05-2012
20090016031CIRCUIT CONNECTION STRUCTURE AND PRINTED CIRCUIT BOARD - While gradually increasing the widths of signal lines (01-15-2009
20090016030CIRCUIT BOARD, CONNECTION STRUCTURE, AND APPARATUS - A circuit board is connected to a connector including a connection port and contact portions located at upper and lower positions of the connection port. The contact portions face each other in the vertical direction, and each contact portion is connected electrically to the opposite contact portion. The circuit board includes a base substrate, a first wiring layer, and a second wiring layer. First terminals connected to the first wiring layer are provided on one principal surface of the base substrate, and second terminals connected to the second wiring layer are provided on the other principal surface. The first terminals and the second terminals come into contact with the contact portions and are arranged so as not to overlap each other in the vertical direction.01-15-2009
20100020510HIGH-VOLTAGE POWER SUPPLY - Provided is a high-voltage power supply including a board having at least one bent portion separating a first region of the board from a second region of the board, the first region not being coplanar with the second region of the board; a first circuit, on the first region of the board, generating a second voltage according to a first voltage; and a second circuit, on the second region of the board, amplifying the second voltage and then rectifying the amplified second voltage.01-28-2010
20100328902Coil Transducer Isolator Packages - In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.12-30-2010
20120320540PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR - A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.12-20-2012
20120320539PACKAGE STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR REPAIRING PACKAGE STRUCTURE - A package structure including an electronic component 12-20-2012
20120320538SERIAL ADVANCED TECHNOLOGY ATTACHMENT DIMM - A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip and a power circuit are set on the board body. An edge connector is set on a side of the board body and inserted into a memory slot of a motherboard. The edge connector includes a number of power pins, a number of ground pins, and a number of signal pins. The power pins are connected to the power circuit. The signal pins are connected to the control chip.12-20-2012
20100254099SILICON-CERAMIC COMPOSITE SUBSTRATE - The invention relates to a silicon-ceramic composite substrate (10-07-2010
20110235285INTERFACE PORT CONFIGURATION TO REDUCE CONNECTION INTERFERENCE - Methods and apparatuses for reducing connection interference within and across adjacent interfaces are provided. An interface includes ports arranged along at least a first axis and second axis. The ports on the first axis are offset from the ports on the second axis. When two interfaces are provided adjacent to each other, the ports on the last axis of the first circuit board are offset from the ports on the first axis of the second circuit board.09-29-2011
20100232120ELECTRICAL COMPONENT - An electrical component system and method is provided. In an embodiment, the electrical component system includes a circuit carrier onto which at least one electrical component has been mounted. The circuit carrier is injection molded around using a molding compound. An embedding length of a circuit-board conductor in the molding compound, situated between the contacting area on the circuit carrier and the exit location, is maximized.09-16-2010
20120275121Power Module with Press-Fit Clamps - According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one output current pad providing output current from the module. At least one press-fit input power clamp engages a top side of the at least one input power pad, and engages a bottom surface of the substrate. Also, at least one press-fit output current clamp engages a top side of the at least one output current pad, and engages the bottom surface of the substrate. The at least one press-fit input power clamp can include at least one top prong and at least one bottom prong. Furthermore, the at least one bottom prong can press the input power pad into the at least one top prong.11-01-2012
20120327612CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads.12-27-2012
20120327613CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present disclosure discloses a conductive substrate with a conductive pattern formed on a float glass and a method for manufacturing the same, which can prevent a yellowing phenomenon from occurring in the float glass during firing of the conductive substrate. The method for manufacturing the conductive substrate according to the present disclosure includes manufacturing a float glass by injecting molten glass onto a molten tin contained in a float bath, removing a top face of the float glass not contacting the molten tin, by a predetermined thickness, and forming a conductive pattern on the top face of the float glass, which was removed by a predetermined thickness.12-27-2012
20120287586WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.11-15-2012
20100208436Multilayer Circuit Board and Use of a Multilayer Circuit Board - A multilayer circuit board having a security cell having security-related electronic components disposed thereon. The security cell is covered by a circuit path arrangement having circuit path segments disposed close to one another, and by an insulation layer. Penetration and thus manipulation of the security-related components is thus largely prevented.08-19-2010
20120140423Printed Circuit Board With Integral Radio-Frequency Shields - Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.06-07-2012
20130010432PRINTED BOARD ASSEMBLY INTERFACE STRUCTURES - Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.01-10-2013
20130010434NETWORK DEVICE AND COMMUNICATION MODULE - On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.01-10-2013
20130010433Integrated Appliance - An integrated appliance is disclosed in the present disclosure. The integrated appliance comprises a backplate and a circuit board. The circuit board comprises a baseplate and an electronic component disposed on the baseplate. The baseplate is fixed to an inner wall of the backplate, and the electronic component is located between the baseplate and the backplate. With the aforesaid arrangement, an uneven surface structure of the backplate itself is utilized in the integrated appliance of the present disclosure to dispose the circuit board on the inner wall of the backplate in such a way that the electronic component on the circuit board is disposed facing towards an inner wall surface of the backplate. As this eliminates the use of the back cover, the structure is simplified and both the mold cost and the material cost associated with the back cover are saved, thus resulting in a reduced manufacturing cost.01-10-2013
20130010435FRAME UNIT, MOUNTING SUBSTRATE UNIT, AND MANUFACTURING METHOD FOR THE SAME - Provided is a frame unit, a mounting substrate unit, and a mounting substrate that can achieve both high shield performance and reduction in the height of a shield member. The frame unit according to the present invention is a frame unit (01-10-2013
20110157839ELECTRONIC DEVICE, FILTERING MODULE THEREOF AND METHOD FOR REDUCING COMMON MODE NOISE - A filtering module includes a circuit board, a connector, a core and a plurality of coils. The connector and the core are disposed on the circuit board. The coils wind around the core and are electrically connected to the connector.06-30-2011
20130021761EXPANSION CARD - An expansion card has at least one connector electrically coupled with at least one expansion slot of a server, and includes a shell defining at least one through slot, a main body, and a transmission element received in the shell. The transmission element includes a locating element, a connecting pole, and a fixing shaft. The connecting pole includes a head portion and a tail portion. The head portion defines a notch sleeving on the locating element. The tail portion extends outwards from the shell and defines a first hole. The fixing shaft is fixed on the shell and extends through the first hole. When the tail portion is pushed, the connecting pole rotates around the fixing shaft, the head portion drives the at least one connector to extends outwards or inwards from the at least one through slot, to electrically connected or disconnected to the at least one expansion slot.01-24-2013
20130170155PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIRING FOR PRINTED WIRING BOARD - Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring.07-04-2013
20100085716CHIP CARD HOLDER - The chip card holder includes a body member, a card receiving space formed on the body member and a releasing piece. The card receiving space has an opening to insert a chip card along a direction perpendicular to the longitudinal direction of the card receiving space. The releasing piece is slidablely mounted on the body member along the longitudinal direction and is configured for either exposing the opening to insert the chip card or locking the chip card in the card receiving space.04-08-2010
20130176691MASKS FOR USE IN APPLYING PROTECTIVE COATINGS TO ELECTRONIC ASSEMBLIES, MASKED ELECTRONIC ASSEMBLIES AND ASSOCIATED METHODS - One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.07-11-2013
20130176692METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD - For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.07-11-2013
20130141877FAN-OUT CIRCUIT AND ELECTRONIC DEVICE HAVING THE SAME - A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L06-06-2013
20130141878TRANSFORMER CONDUCTIVE STRUCTURE AND TRANSFORMER - The present application discloses a transformer conductive structure, which comprises a primary coiling, a printed circuit board and a secondary coiling unit comprising a plurality of conductive sheets; wherein each conductive sheet comprises an annular body and an output terminal arranged at the edge of the annular body and protruded to the outside; the annular bodies of the conductive sheets and the primary coiling are staggered arrangement together; and the output terminal of the conductive sheet directly clamps on the printed circuit board. The present application further discloses a transformer, which can effectively reduces the output path of the transformer, the AC and DC loss and the volume of the transformer device, so as to increase the power density and efficiency of power supply.06-06-2013
20130170151DISPLAY SUBSTRATE, MOTHER SUBSTRATE FOR MANUFACTURING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY SUBSTRATE - A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.07-04-2013
20130170152PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. Each of the conductive wires includes a first conductive wire section, a second conductive wire section, and a first connection section. The first connection section includes a first end and a second end opposite to the first end, the first end of the first connection section is connected to the first conductive wire section, and the second end of the first connection section is connected to the second conductive wire section. An angle between the first conductive wire section and the first connection section can be in a range from about 90 degrees to about 180 degrees.07-04-2013
20130170153PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. The conductive wires include at least one first conductive wire section, at least one second conductive wire section, and at least one first connection section. An angle between the at least one first conductive wire section and the at least one first connection section is defined as angle α07-04-2013
20130170154PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.07-04-2013
20080218983METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD - A method of manufacturing a circuit board is provided. The method includes forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes with an insulating layer, filling the first holes filled with the insulating layer on the bottom side thereof with a first electro-conductive layer, polishing the semiconductor substrate from the back surface thereof until the respective insulating layers filled in the plurality of first holes are exposed, and forming a second hole in each of the exposed insulating layers so as to reach the first electro-conductive layer, and forming a second electro-conductive layer by filling each second hole with the second electro-conductive layer to connect the first electro-conductive layer.09-11-2008
20120250267RADIO FREQUENCY COMMUNICATION MODULE - Disclosed herein is a radio frequency (RF) communication module. The RF communication module includes: a main substrate having a plurality of electronic components mounted on an upper surface thereof and having at least one ground pad formed at corners thereof; an insulating material encapsulating the electronic components mounted on the upper surface of the main substrate and having a metal layer formed on an upper surface thereof; and a side shielding layer formed on a side of the insulating material.10-04-2012
20120250266ELECTRONIC DEVICE WITH CONDUCTIVE RESILIENT SHEET - An electronic device includes a supporting member, a circuit board fixed to the supporting member, a bottom cover assembled with the supporting member, and at least one conductive resilient sheet fixed on the circuit board. The conductive resilient sheet includes a fixing portion fixed on the circuit board and a conductive portion. The conductive portion defines a first elastic sheet and a second elastic sheet. The bottom cover is fixed between the first elastic sheet resisting the outer side of the bottom cover and the second elastic sheet resisting the inner side of the bottom cover.10-04-2012
20130114218ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND MOUNTING MEMBER - An electronic circuit includes: a semiconductor chip provided with a single-ended I/F including a pad on which single-ended signals are exchanged; and a mounting unit on which a differential transmission path transmitting a differential signal is formed, and on which the semiconductor chip is mounted so that the pad of the single-ended I/F is directly electrically connected to a conductor configuring the differential transmission path.05-09-2013
20130114217PRINTED CIRCUIT BOARD LAMINATE - A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards.05-09-2013
20130094158CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF - A card structure includes a first substrate, a second substrate, an intermediate unit, and a connector. The first substrate includes a base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the first substrate. The connector is disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit and coupled to the first substrate.04-18-2013
20130201634SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS - The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity.08-08-2013
20130201635FLUORINATED SILANE COATING COMPOSITIONS FOR THIN WAFER BONDING AND HANDLING - This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month.08-08-2013
20110267783Circuit board having holes to increase resonant frequency of via stubs - A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.11-03-2011
20130128471Display Device Back Panel with Adjustable PCB Mounting Seat - The present invention provides a display device back panel with adjustable PCB mounting seat, which includes a hollow body and paired mounting seats. The mounting seats are arranged in a hollow portion of the body and have opposite ends extended to connect to the body. Each of the mounting seats includes a first bracket and a second bracket that are symmetrically arranged and a connection board connected between the first bracket and the second bracket. The first bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The second bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The first bracket has a first bent section that is bent downward, and the second bracket has a second bent section that is bent down. The pair of mounting seats forms a receiving space between the two first bent sections and the two second bent sections that receive a PCB supported and mounted thereon. The assembling is simple and through the adjustable connection formed between the first bracket, the second bracket, the body, and the connection board, it is suitable for mounting and fixing PCBs of various sizes.05-23-2013
20130128470Backlight Module, Backplane and LCD Device - The present invention discloses a backlight module, a backplane and an LCD device. The backlight module comprises a backplane, a PCB and locking pieces for fixing the PCB on the backplane; the backplane surface is provided with multiple through holes, and the locking pieces are selectively arranged in the through holes. In the present invention, because the backplane surface is provided with through holes for arranging hillocks, the hillocks are arranged in the through holes in random positions. Thus, the hillocks are arranged in the through holes in the corresponding positions in accordance with the PCB size, so that the backplane can be adapted for PCBs of different size, and its generality can be increased. In addition, hillocks and through holes of corresponding number can be arranged in accordance with the number of different components. Thus, the backplane has higher generality, and then the production cost and the processing cost of the backplane can be reduced.05-23-2013
20130128469PORTABLE ELECTRONIC DEVICE - A portable electronic device is provided. The portable electronic device includes a body, an operation interface, a supporting element and an image capturing unit. A receiving recess is formed on the body. The operation interface is disposed on the body. The supporting element is rotated between a first orientation and a second orientation relative to the body, wherein when the supporting element is in the first orientation, the supporting element is in the receiving recess, and when the supporting element is in a second orientation, a supporting included angle is formed between the supporting element and the body, wherein the supporting included angle is greater than 0 degree. The image capturing unit is disposed in the supporting element.05-23-2013
20130128472PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate.05-23-2013
20130141879PRESSURE-SENSITIVE ADHESIVE LAYER FOR TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM WITH PRESSURE-SENSITIVE ADHESIVE LAYER, TRANSPARENT CONDUCTIVE LAMINATE, AND TOUCH PANEL - Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 μm.06-06-2013
20110273853COMPUTER SYSTEM WITH RISER CARD - A computer system includes a riser card. The riser card includes a board body and a first socket. The board body includes a first surface. The first socket is located on the first surface. A first socket height of the first socket relative to the first surface is in the range of about 15 mm to about 16 mm.11-10-2011
20110228489DEVICES WITH PNEUMATIC, HYDRAULIC AND ELECTRICAL COMPONENTS - Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet/inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components.09-22-2011
20130148314CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD - A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released.06-13-2013
20130135829DISPLAY MODULE - A display module is disclosed which includes a display panel, a printed circuit board, a flexible printed circuit board interconnecting the display panel and the printed circuit board, and a reinforcing piece interconnecting the display panel and the printed circuit board for supporting the printed circuit board. The reinforcing piece prevents drooping or shifting of the printed circuit board relative to the display panel during assembly or transport, thereby preventing severed wires of the flexible printed circuit board.05-30-2013
20110235284CIRCUIT BOARD - A circuit board includes a printed substrate, a number couple of high signal transmission ports and a number of auxiliary testing ports. The couples high signal transmission ports are electrically connected to printed substrate, and each of the couples high signal transmission ports has an space smaller than 50 mil measured from the centers of the high signal transmission ports. The auxiliary testing ports respectively mounted on the high signal transmission ports, and every two testing ports mounted on a couple of high signal transmission ports are interspaced by an space larger than or equal to 70 mil.09-29-2011
20130094157POWER CONVERTERS WITH INTEGRATED CAPACITORS - An apparatus having a power converter circuit having a first active layer having a first set of active devices disposed on a face thereof, a first passive layer having first set of passive devices disposed on a face thereof, and interconnection to enable the active devices disposed on the face of the first active layer to be interconnected with the non-active devices disposed on the face of the first passive layer, wherein the face on which the first set of active devices on the first active layer is disposed faces the face on which the first set of passive devices on the first passive layer is disposed.04-18-2013
20100315790Circuit Substrate Structure And Circuit Apparatus - A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.12-16-2010
20130155630Touch Sensor with Passive Electrical Components - In one embodiment, an apparatus includes a substrate, a touch sensor, and a passive electrical component. The touch sensor is disposed on the substrate. The passive electrical component is disposed on a surface of the substrate. The passive electrical component is formed at least in part of conductive material.06-20-2013
20130155631POWER GENERATING DEVICE AND POWER GENERATING MODULE USING SAME - The power generating device has a power generating section including a piezoelectric body; and a plurality of electrode pairs each constituted by a pair of electrodes placed on opposite sides of the piezoelectric body with regard to a thickness direction thereof to define a functional section therebetween, each of the functional sections is cooperated with the related electrode pair to define a power generating element. A plurality of the power generating elements includes a first and second power generating elements that give a polarization orientation opposite to each other in the thickness direction. The first and second power generating elements have the corresponding electrodes that are connected to each other by means of a wiring member on the same surface of the piezoelectric body with regard to the thickness direction thereof, such that all of the plurality of the power generating elements are connected in series.06-20-2013
20120281370CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME - A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.11-08-2012
20120281369LEAD LINE STRUCTURE AND DISPLAY PANEL HAVING THE SAME - A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.11-08-2012
20130182397Circuit Board Structure Used for Vehicle-Mounted Electronic Device - Provided is a highly reliable ceramic circuit board which can be manufactured at a low cost and is friendly to environment as a material from which lead is eliminated in forming the multilayered structure.07-18-2013
20110310569Method and System For Innovative Substrate/Package Design For A High Performance Integrated Circuit Chipset - Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC power and a grounding function on a metal 12-22-2011
20120020033Skin-Safe Conductive Ink and Method for Application on the Body - An ink comprising a particulate conductive material, a binder and a humectant, the conductive material being present in sufficient amount that the ink, once dry, is electrically conductive, may be applied, for example, to the human or animal body and enables such a body to function as part of an electrical circuit.01-26-2012
20120020031ELECTRONIC DEVICE AND CONNECTION MECHANISM FOR TOUCH BUTTONS THEREOF - An electronic device includes a housing, a capacitive touch button, a PCB and a connection mechanism. The capacitive touch button is secured in the housing and includes a number of button bodies. The PCB is secured in the housing. The connection mechanism includes a circuit board and a connection element. The circuit board is secured in the housing and includes a number of sensor electrodes and a number of electrical protrusions, which are all arranged corresponding to the number of button bodies of the capacitive touch button. The sensor electrodes are connected to the capacitive touch button and the electrical protrusions. The connection element includes a first end and a second end. The first end is fixed on the PCB. The second end resists against the electrical protrusions for electrically connecting the capacitive touch button and the controller of the PCB.01-26-2012
20130194759TOUCH SENSOR WITH INTEGRATED SIGNAL BUS EXTENSIONS - A touch sensor may be formed from a flexible substrate such as a sheet of polymer. The flexible substrate may have a main rectangular portion and a protruding portion. Capacitive touch sensor electrodes may be formed on the upper and lower surfaces of the flexible substrate. Signal lines may be coupled to the touch sensor electrodes. The ends of the signal lines may extend onto the protruding portion. Signal lines may be formed on upper and lower surfaces of the flexible substrate. The signal lines may be coupled to circuitry on a printed circuit using a connector that receives the end of the protruding portion. Ground structures on the protruding portion may be configured to overlap the signal lines or may be laterally interposed between upper surface signal lines and lower surface signal lines.08-01-2013
20130201633STRUCTURE OF SURVEILLANCE DEVICE - The present invention relates to a surveillance device, which includes a device body, a display module mounted to at least one side surface of the device body, and at least one light-emitting diode mounted to at least one side of the device body. The display module can be a liquid crystal display (LCD) or an LED display screen. With the above arrangement, the operation of light-emitting diode helps identifying the location where the device body is mounted and also helps identifying if the device body is in normal operation and further, the arrangement of the display module provides practical advantages of criminal deterrence, advertisement effect, status notification, and information transmission.08-08-2013
20120300418SEMICONDUCTOR DEVICE - A semiconductor device that can suppress variation of GND potential of a control board and prevent malfunction of IC without restricting a mounting direction of the IC of the control board is provided. In a power module 11-29-2012
20120300416MULTILAYER SUBSTRATE - A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.11-29-2012
20120300415RELEASING APPARATUS FOR SIM CARD - A releasing apparatus for a subscriber identity module (SIM) card includes a bracket, a rack received in the bracket for manipulating the SIM card, a pivot pole pivotably received in the bracket, and a movable member pivotably attached to the bracket. The movable member includes a biasing portion and an engaging portion formed from opposite ends of the movable member. A tab and a biasing protrusion are formed from opposite ends of the pivoting member. The engaging portion is operated to rotate the movable member. The biasing portion presses the tab of the pivot pole to rotate the pivot pole. The biasing protrusion biases the rack and SIM card away from the bracket.11-29-2012
20120092836Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.04-19-2012

Patent applications in class Printed circuit board

Patent applications in all subclasses Printed circuit board