Class / Patent application number | Description | Number of patent applications / Date published |
361743000 | Solder connection | 8 |
20090091895 | ELECTRONIC CIRCUIT MODULE - An electronic circuit module includes a circuit substrate whose two opposite side surfaces are provided with cutout portions; and a box-shaped cover body made of a metallic plate and having two claw segments individually disposed within the cutout portions, the cover body being attached to the circuit substrate so as to cover the top surface thereof. The circuit substrate has notches extending linearly inward beyond the opposite ends of each cutout portion from the corresponding side surface of the circuit substrate. The opposite ends of each claw segment in the width direction thereof are disposed facing linear sections of the corresponding notches within the corresponding cutout portion. | 04-09-2009 |
20100085715 | PRINTED ELECTRONIC COMPONENT ASSEMBLY ENABLED BY LOW TEMPERATURE PROCESSING - A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system | 04-08-2010 |
20110063805 | STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME - A method of forming a stack-type semiconductor package includes preparing a lower printed circuit board including a plurality of interconnections and a plurality of ball lands for connection on an upper surface thereof. One or more first chips, which are electrically connected to the plurality of interconnections and sequentially stacked, are mounted on the lower printed circuit board. A lower molded resin compound is formed on the lower printed circuit board to cover the first chips, and is formed to have via holes exposing the ball lands for connection. An upper chip package, under which solder balls are formed, is aligned so that the solder balls correspond to the via holes of the lower molded resin compound, respectively. The solder balls are reflown to form connection conductors filling the via holes. A stack-type semiconductor package structure and an electronic system including the same are also provided. | 03-17-2011 |
20140168909 | GAPPED ATTACHMENT STRUCTURES - Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling. Further, the connection area between the pad and outside circuitry may be maximized, so that the impact to electrical performance due to the pad design may be minimized. | 06-19-2014 |
20140369008 | FLEXIBLE ELECTRONIC COMPONENT MODULE - A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate. | 12-18-2014 |
20150009633 | DISPLAY APPARATUS AND CIRCUIT BOARD MODULE THEREOF - A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 001-08-2015 | |
20150366063 | MODULE, MODULE COMPONENT COMPOSING THE MODULE, AND METHOD OF MANUFACTURING THE MODULE - To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board. | 12-17-2015 |
20160143143 | OPTOELECTRONIC MODULES AND ASSEMBLIES COMPRISING OPTOELECTRONIC MODULES - Optoelectronic modules and assemblies comprising optoelectronic modules are provided. An optoelectronic module includes an optoelectronic module printed circuit board, an optoelectronic component mounted to the optoelectronic module printed circuit board, an electrical connector affixed to the optoelectronic module printed circuit board, and a mounting bracket affixed to the optoelectronic module printed circuit board. The electrical connector is in electrical communication with an input of the optoelectronic component. The electrical connector is configured to removably plug into a mating electrical connector of a main printed circuit board. The mounting bracket includes an optoelectronic component engagement surface for engaging the optoelectronic component. The mounting bracket further includes a main printed circuit board engagement surface for engaging the main printed circuit board. | 05-19-2016 |