Entries |
Document | Title | Date |
20080205008 | Low Profile Flip Chip Power Module and Method of Making - A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described. | 08-28-2008 |
20090059539 | RADIO FREQUENCY MODULE ASSEMBLY - A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate. | 03-05-2009 |
20090086443 | Interface module - An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the contacts of the component on the circuit board, the interface module being divided into an adaptor part as a base module and a protocol converter part as a tool access module. | 04-02-2009 |
20090116201 | CIRCUIT BOARD MODULE AND METHOD FOR REINFORCING STRUCTURE THEREOF - A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of the circuit board module is also disclosed. | 05-07-2009 |
20090201650 | Controller Assemblies For Electric Drive Utility Vehicles - Controller assemblies and packaging for electronic control systems of electric motors utilized in utility vehicles or other power equipment. Features of the controller assemblies and packaging described herein allow for, among other things, modularity, scalability, and improved heat transfer. | 08-13-2009 |
20090244854 | Integrated-inverter electric compressor and inverter device - The invention provides an integrated-inverter electric compressor and an inverter device thereof which allow handling of the inverter device by neither touching nor holding a CPU substrate. An integrated-inverter electric compressor includes an inverter module integrating a power-related metal substrate on which a power semiconductor switching device is mounted and a resin case integrally insert-molded with a plurality of terminals, and is provided with a CPU substrate on which a control and communication circuit having a device that operates at low-voltage is mounted on the upper surface of the inverter module, wherein the resin case is integrated with a grip which extends in a horizontal direction at an upper edge of a circumference thereof. | 10-01-2009 |
20090244855 | Data Processing Modules And Systems - Data processing modules including a housing and connectors carried by the housing, and systems including the same. | 10-01-2009 |
20090268414 | Over-molded electronic module - An over-molded electronic module ( | 10-29-2009 |
20090323293 | Battery Cell Interconnect and Voltage Sensing Assembly and Method for Coupling Battery Cell Assemblies Thereto - A battery cell interconnect and voltage sensing assembly and a method for coupling a battery cell assembly thereto are provided. The battery cell interconnect and voltage sensing assembly includes a circuit board, electrical interconnect members, and an electrical connector. The circuit board further has slots therethrough for receiving the electrical interconnect members thereon. Electrical terminals from battery cell assemblies are coupled to the electrical interconnect members. The circuit board also has electrical traces for routing voltages at the electrical interconnect members to the electrical connector for sensing voltages of the battery cell assemblies. | 12-31-2009 |
20100002400 | DAUGHTER BOARD WITH SOLID-STATE STORAGE DEVICE FOR USE IN COMPUTER SYSTEM - A daughter board of a computer system is connected to a front panel of a computer housing. The daughter board includes a main body mounted thereon a solid-state storage device for storing data and a control circuit for control data access to the solid state storage device, for example, by surface mount technology. | 01-07-2010 |
20100014259 | MODULAR CIRCUIT BOARD STRUCTURE FOR LARGE CURRENT AREA - A modular circuit board structure for a large current area includes a circuit board having an electric conducting circuit and at least one large current area, and a conducting plate device having conducting plates installed onto the circuit board according to the shape of the large current area. When electronic components are inserted onto the circuit board by a surface mount technology, the conducting plates are attached onto the large current area to form a solder area portion on the conducting plates for allowing a large current to pass through, so as to provide a flexible combination function for the large current area of the circuit board and simplify the stamping molds of different shapes. The invention can avoid a waste of copper plates, assure the reliability, quality and safety of the circuit board, and enhance the cost effectiveness of the manufacture and the competitiveness of the product. | 01-21-2010 |
20100027225 | COMPONENT-EMBEDDED MODULE AND MANUFACTURING METHOD THEREOF - A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained. | 02-04-2010 |
20100124029 | INPUT/OUTPUT MODULE FOR AN AUTOMATION DEVICE - An input/output module for an automation device includes a housing having a lower part separable from an upper part; a first printed circuit board disposed in the housing; and an electronic subassembly for an input/output function of the input/output module. The electronic subassembly includes a plurality of connection elements disposed on the first printed circuit board and configured to connect signal lines and process voltage lines, the plurality of connecting elements being accessible from a front side of the upper part; and a plurality of optical waveguides disposed on the front side, wherein each one of the plurality of optical waveguides is assigned to a respective one of the plurality of connection elements and each configured to signal a state of at least one input/output channel of the input/output module. | 05-20-2010 |
20100134985 | Image-sensing module for reducing overall thickness thereof and preventing EMI - An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB. | 06-03-2010 |
20100188823 | Method for Manufacturing an Electronic Module - This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet ( | 07-29-2010 |
20100265668 | FLEXIBLE DISPLAY SCREEN - A flexible display screen includes a plurality of flexible display modules joined side by side, each flexible display module having a flexible circuit board, which is fixedly arranged with a plurality of display chips on its front face, and a plurality of magnets on its back face, so that the flexible display screen can be attracted on a metal medium by the magnets, wherein the magnets are distributed at least on the perimeter of the back face of the flexible circuit board so that the joining sides of two adjoining flexible circuit boards are arranged respectively and symmetrically with a same number of magnets, and each pair of magnets disposed on the respective joining sides having opposite polarity orientations. | 10-21-2010 |
20100290198 | Sliding Module With Electrical Connection Paths - A sliding module for an electronic device, the module comprising first and second parts slideably connected together, the first and second parts comprising respective circuit connectors for connection with corresponding respective circuit boards, and wherein the module comprises one or more conductors arranged to provide electrical connection between the respective circuit connectors to thereby provide electrical connection paths between respective circuit boards connected at the circuit connectors. | 11-18-2010 |
20110058343 | MODULE CONNECTION STRUCTURE - According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module. | 03-10-2011 |
20110128708 | COAX-BALUN MODULE - A coax-balun module for converting from a balanced signal to an unbalanced signal includes a housing having a balun well adapted to receive a balun transformer. The module includes a printed circuit board electrically connected to a balun transformer and a threaded connector. The printed circuit board is further electrically connected to electrical conductors adapted to carry input signals. The housing is adapted to receive a potting material to seal the other components therein. | 06-02-2011 |
20110141703 | MOUNT AND ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a device housing, a circuit board, a module, and a projection. The electronic device includes a base in which a containing portion is provided. The circuit board is housed in the device housing. The module is housed in the containing portion of the device housing and electrically connected to the circuit board. The projection is provided with a supporting part and an opening portion. The supporting part projects from the module and is supported by the base. The opening is positioned between the supporting part and the module. | 06-16-2011 |
20110182039 | COMPOSITE MODULE - A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate. | 07-28-2011 |
20110255248 | ELECTRICAL FIELD DEVICE AND EXPANSION MODULE FOR INSERTION INTO AN ELECTRICAL FIELD DEVICE - An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured. | 10-20-2011 |
20110279984 | ELECTRONIC MODULE WITH SEAMLESS ANTI-EMI DEVICE - An electronic module ( | 11-17-2011 |
20110304993 | CIRCUIT MODULE - In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition. | 12-15-2011 |
20120008287 | Electronic component module and method of manufacturing the same - Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided. | 01-12-2012 |
20120008288 | Module and portable terminal - Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions. | 01-12-2012 |
20120081859 | ELECTRONIC MODULE POWER SUPPLY - Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supping power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module. | 04-05-2012 |
20120113601 | CIRCUIT MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A circuit module is provided that is configured to allow a shield member to be securely mounted to a board. The circuit module includes a board with a mounting surface on which an electronic component is mounted and a shield member that is mounted to the board. The shield member includes a shield frame having a frame portion that is solder-joined to the mounting surface and a shield cover having a top surface portion and a side portion that is attached to the frame portion of the shield frame. Furthermore, an L-shaped slit is formed at a predetermined corner among four corners of the top surface portion of the shield cover so as to extend along two sides forming the predetermined corner. | 05-10-2012 |
20120281368 | MODULAR SHIELDED ELECTRONICS ENCLOSURE - A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency. | 11-08-2012 |
20120287585 | MODULAR CORE ENGINE (CE) RADIO ARCHITECTURE - A compact communications radio core engine (CE) module includes a modem circuit board having a first connector, and a radio frequency (RF) circuit board having a second connector configured to mate with the first connector of the modem circuit card. A module shell is constructed and arranged to contain the modem and the RF circuit boards in such an orientation so that the second connector of the RF circuit board can operatively engage the first connector of the modem circuit card. | 11-15-2012 |
20130039018 | Three-Dimensionally Molded Electronic Substrate - A device, system and process for fabricating a three-dimensional electronic substrate are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics and conductors may be placed onto the three-dimensional surface of the molded substrate, thereby creating a three-dimensional electronic substrate. The three dimensional substrate may then be connected to an exterior frame to allow for electronic functionalities across frame form factors. | 02-14-2013 |
20130039019 | POWER SUPPLY MODULE - A power supply module adapted to supply power to a peripheral device includes a power supply and an output-structure detachably assembled to the power supply and electrically connected between the power supply and the peripheral device. The height of the output-structure relatively to the bottom portion of the power supply is adjustable and the power supply, output-structure and the peripheral device together form a concave combination-structure. As a result, by using a separated output-structure in the invention, the power supply is able to maneuverably adjust the interconnection position of the peripheral device and the power supply through the second circuit board. Meanwhile, the power supply has a larger usable space therein. | 02-14-2013 |
20130050959 | WIRELESS MODULE WITH EXTERNAL ANTENNA AND CONNECTOR HAVING THE SAME - A wireless module with an external antenna and a connector with the wireless module are disclosed. The wireless module includes a printed circuit board, a plurality of conductive terminals, a wireless transmission chip, an antenna connector and an external antenna. The plurality of conductive terminals, the wireless transmission chip, and the antenna connector are electrically coupled to a printed circuit board, and the external antenna is coupled to the antenna connector through a connected circuit. The wireless module further includes a casing for covering the printed circuit board, the conductive terminals, the wireless transmission chip, and the antenna connector. A pivot hinge is installed at an end of the casing, and the external antenna is pivotally coupled to the pivot hinge of the casing, so that users can change the angle of the external antenna to adjust the intensity and range of receiving/transmitting signals of the wireless module freely. | 02-28-2013 |
20130070427 | Pre molded can package - A pre molded can package includes a circuit board, a MEMS die, a pre mold cavity and a can. The MEMS dies are connected to the circuit board by conductive wires and the MEMS dies are separated by the pre mold cavities. A cap is connected to the top of each pre mold cavity to form MEMS die units. The MEMS die units are packed to as to reduce their volume. The manufacturing cost is reduced and the processes are simplified. The MEMS die units are able to be applied to the smaller and fine electronic devices. | 03-21-2013 |
20130083495 | TUNER MODULE - There is provided a tuner module used for a television (TV) or a set top box, and more particularly, to a tuner module having a significantly reduce size. The tuner module includes: a tuner including a circuit board having at least one electronic component mounted thereon, and a cover coupled to the circuit board and having an opened bottom portion so as to allow the circuit board to be received therein; and a main board having the tuner mounted on one surface thereof, wherein the main board includes a ground pad formed thereon to correspond to a position in which the tuner is mounted. | 04-04-2013 |
20130148312 | TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME - A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern. | 06-13-2013 |
20130155628 | MOTOR STARTER MODULE - A motor starter module is provided, the module according to the present disclosure including a PCB (Printed Circuit Board) substrate configured to communicate with and control the magnetic contactor, a mechanism part operating in association with an operation of the magnetic contactor, and an upper case covering the PCB substrate and an outer case of the mechanism part, whereby the magnetic contactor can be locally and directly driven, and controlled via communication to reduce a line cost, to shorten an operation time and to promote maximization of spatial utilization. | 06-20-2013 |
20130163209 | ELECTRONICS ASSEMBLY DIVIDER PLATE - Small form-factor pluggable (SFP) ports are often employed in telecommunications hardware to take advantage of their lower profile and to provide connections to other network elements. The use of SFP ports has increased the density of ports possible for a given circuit board size, but this increase has previously meant that individual ports are difficult to access. Also, identification of those ports is frustrated by a lack of free space to place labeling. Example embodiments of the present invention address these issues by placing a divider plate between columns of SFP ports that provides surface area adjacent to the SFP ports for affixing labeling. The divider plate is offset from the SFP ports to allow access when the plate is installed. As a result, hardware employing embodiments of the present invention can achieve a higher density of SFP ports with ease of access by personnel assembling or servicing the hardware. | 06-27-2013 |
20130176688 | PORTABLE EXTERNAL POWER-SUPPLYING DEVICE - A portable external power-supplying device is disclosed. The portable external power-supplying device implements a unique mechanism to detachably assemble battery units whose number can be adjusted according to user needs, which means the overall aggregate capacity of the portable external power-supplying device is adjustable. The portable external power-supplying device is adaptive to connect and charge a portable electronic device | 07-11-2013 |
20130208431 | DEVICE MODULE - The invention provides a device module including a device, a connecting part, and a plastic part. The device is a sensor, an electronic component, or a circuit board. The connecting part is connected to the device and includes an external connecting portion. The device and the connecting part are embedded in the plastic part. The plastic part is provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside. | 08-15-2013 |
20130271925 | WIRELESS COMMUNICATION MODULE, LED LIGHTING DEVICE, SOLAR PHOTOVOLTAIC SYSTEM, SELF-START SYSTEM AND DETECTION DEVICE - A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected. | 10-17-2013 |
20130279120 | SHELL FOR FIXING MAIN BOARD THERETO AND ELECTRONIC DEVICE HAVING SAME - A shell for fixing main board of an electronic device including a base wall, and sidewalls around the base wall, is provided. The base wall includes supporting projections. The internal surface of sidewalls includes restriction elements. The main board is laid on the supporting projections and abuts against the restriction elements. The base wall includes positioning pins and the main board defines positioning holes into which the positioning pins can be engaged. | 10-24-2013 |
20130286602 | WIRELESS MODULE AND CONNECTOR APPARATUS HAVING THE SAME - A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module. | 10-31-2013 |
20130294036 | MODULE FOR USE WITH A MONITORING SYSTEM AND METHOD OF ASSEMBLING SAME - A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour. | 11-07-2013 |
20130322027 | ELECTRONIC DEVICE AND MEMORY ASSEMBLY - An electronic device includes a chassis, a first printed circuit board (PCB), a second PCB, a third PCB, and a number of memory modules. Each memory module includes two edge connectors respectively formed on two opposite sides of the memory module. A plurality of parallel sockets is formed on each of the first and second PCBs. | 12-05-2013 |
20130329378 | Universal Serial Bus Device with Improved Package Structure and Method Thereof - A Universal Serial Bus device includes a PCB module, a plastic package shell and a power module. The PCB module includes a PCB, and a storage chip and a control chip both arranged on the PCB module. The PCB includes opposite front end and rear end, and opposite upper surface and lower surface. The upper surface has a number of contacting portions, and the storage chip and the control chip being arranged on the lower surface. The plastic package shell at least encapsulates the lower surface of the PCB to encapsulate the storage chip and the control chip. The power module is electrically connected to the part of the PCB module where is not encapsulated by the plastic package shell. | 12-12-2013 |
20130329379 | SWITCHING DEVICE FOR SUPPLYING HIGH-ENERGY FUNCTIONAL COMPONENTS - A high-voltage switching device ( | 12-12-2013 |
20140003003 | MOBILE TERMINAL HAVING BOARD SUPPORT STRUCTURE | 01-02-2014 |
20140022739 | CONDUCTIVE SUBSTRATE AND TOUCH SCREEN HAVING SAME - The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer. | 01-23-2014 |
20140055960 | DISPLAY DEVICE - A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device. | 02-27-2014 |
20140063754 | PRINTED-CIRCUIT BOARD ARRANGEMENT FOR MILLIMETER-WAVE SCANNERS - A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver unit and the at least one antenna element are at least partially integrated into the printed-circuit board arrangement. In this context, the printed-circuit board arrangement includes different printed circuit boards, which are mechanically connected to one another in a rigid manner. A first part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a first material which is suitable for high-frequency, and a second part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a second material different from the first material, which is still sufficiently suitable for a low frequency and/or for a direct-voltage range. | 03-06-2014 |
20140126159 | ELECTRONIC DEVICE, SYSTEM PACKAGE MODULE AND METHOD OF MANUFACTURING SYSTEM PACKAGE MODULE - A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad. | 05-08-2014 |
20140146487 | CONTACT PIN AND POWER MODULE PACKAGE HAVING THE SAME - Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end. | 05-29-2014 |
20140160691 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor module capable of being easily manufactured. The semiconductor module includes: a control part including at least one control device; and a power part including at least one power device, wherein any one of the control part and the power part includes contact pins having elasticity, and the control part and the power part are electrically connected to each other by the contact pins. | 06-12-2014 |
20140160692 | METHOD FOR SURFACE DECORATION OF AN OBJECT WITH 3-DIMENSIONAL GEOMETRY AND THE OBJECT OBTAINED THEREFROM - The present invention provides a method for surface decoration of a three-dimensional object with ease. In one embodiment of the invention, a planar construction article that is foldable into the object is utilized. In another embodiment of the invention, multiple angle plates that are assembled into the object are utilized. The surface decoration process is carried out before the planar construction article is folded or before the angle panels are assembled together thereby to significantly simplify the decoration process of object faces in different orientations. The invention also provides a three-dimensional object obtained from the methods of the invention. | 06-12-2014 |
20140185249 | WIRELESS MODULE - An embodiment of the present invention provides a wireless module comprising a circuit board module, a USB connector and a wave absorbing film. The USB connector is connected to the circuit board module. The wave absorbing film is disposed on the circuit board module and is extended to overlap at least a part of the USB connector. In addition, a wave-absorbing cavity is formed between the wave absorbing film and the USB connector. | 07-03-2014 |
20140285976 | MODULE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD OF MANUFACTURING MODULE - A module includes an insulating substrate having an upper surface as a principal surface, a lid member having an internal space with the insulating substrate, and bonded to the upper surface in a first surface, a device element housed in the internal space, a semiconductor element connected to a top surface, which forms the both sides of the lid member together with the first surface, using a resin adhesive, electrodes electrically connected to the device element, and disposed on an upper surface of the insulating substrate in an area other than the connection area with the lid member, and a projection section formed of the same member as the lid member on the upper surface in an area between the electrodes and the lid member in a plan view. | 09-25-2014 |
20140355222 | ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS - The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased. | 12-04-2014 |
20140355223 | ELECTRICAL MODULE AND DEVICE USING THE SAME - An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite component is disposed on the base and comprises a pad and a conductive sheet. The conductive sheet is embedded in the pad, and the pressing sheet presses on the pad. The pad comprises a main body and a protrusion. The main body has a surface. The protrusion is disposed on the surface of the main body and is compressed between the surface of the main body and the base. | 12-04-2014 |
20140376193 | ELECTRIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate. | 12-25-2014 |
20150016067 | HIGH FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF - A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at a position corresponding to a first electronic component relatively low in height, among first electronic components mounted on the first PCB. Upper and lower ends of a plurality of vias formed within the second PCB are connected to a copper layer existing within a body of the third PCB and a copper layer existing within a body of the first PCB to constitute a single electromagnetic wave shielding unit overall. | 01-15-2015 |
20150022976 | Electronic Module for a Control Unit - An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the component-carrier printed circuit board element and the printed circuit board element. The covering element and component-carrier printed circuit board element are positioned on the first side of the carrier element, and the printed circuit board element is positioned on the second side of the carrier element. The carrier element has at least one opening, and the contact-connection element is led through the opening. | 01-22-2015 |
20150049440 | TRANSPARENT CONDUCTIVE LAMINATE AND ELECTRONIC DEVICE OR MODULE - The present invention is a transparent conductive laminate comprising a base, a low-refractive-index layer, an intermediate-refractive-index layer, and a transparent conductive layer, the low-refractive-index layer, the intermediate-refractive-index layer, and the transparent conductive layer being sequentially stacked on at least one side of the base either directly or through one or more layers, the low-refractive-index layer having a refractive index of 1.40 to 1.50, and the intermediate-refractive-index layer having a refractive index of 1.50 to 1.80 and a film density of 2.5 to 4.5 g/cm | 02-19-2015 |
20150062834 | JUMPER MODULE MOUNTING CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY - A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module. | 03-05-2015 |
20150070852 | COMPOSITE MODULE - Provided is a composite module that includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate | 03-12-2015 |
20150085449 | INDUSTRIAL PROCESS FLUID DEVICE WITH HUMIDITY-SEALED ELECTRONICS MODULE - A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component. | 03-26-2015 |
20150138734 | 360 DEGREE DIRECT COOLED POWER MODULE - A power module for a motor traction inverter system of a vehicle includes a body portion configured to be inserted into a cooling device and having circuitry established thereat that generates heat during operation of the power module. The body portion has a surface area that is disposed in the cooling device and provides 360 degree direct cooling of the power module around the body portion for cooling the circuitry during operation of the power module. The power module may be transfer molded into a shape with a head terminal for sealing at the cooling device, and electrical connections of the power module share only one side surface or end of the power module, with all other sides and surfaces of the power module being disposed in the cooling device and used for cooling. The power module may not include thermal grease layers and may or may not be insulated. | 05-21-2015 |
20150138735 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device is included. The semiconductor device includes a semiconductor memory device, comprising: a first substrate including a first semiconductor device mounted on the first substrate and a first connection terminal disposed at an edge of the first substrate; a second substrate including a second semiconductor device mounted on the second substrate and a second connection terminal at an edge of the second substrate; and an interface connector including a first socket portion configured to receive the first connection terminal and a second socket portion configured to receive the second connection terminal. The interface connector further includes: first socket terminals of the first socket portion are connected with the first connection terminals; second socket terminals of the second socket portion are connected with the second connection terminals; and an internal wiring for electrically connecting the first socket terminals with the second socket terminals. | 05-21-2015 |
20150296636 | ELECTRONIC APPARATUS FOR SOLAR POWER SYSTEM - An electronic apparatus for a solar power system includes a first shell, a waterproof member, and a second shell. The first shell has a surrounding plate, a receiving space formed in the surrounding plate, and at least one clasp portion disposed on an inner side of the surrounding plate. A surrounding notch is formed on the top of the surrounding plate. | 10-15-2015 |
20150366086 | Vehicle-Mounted Electronic Module - There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board | 12-17-2015 |
20150367967 | ADAPTABLE, MODULAR, MULTI-PURPOSE SPACE VEHICLE BACKPLANE - An adaptable, modular, multi-purpose (AMM) space vehicle backplane may accommodate boards and components for various missions. The AMM backplane may provide a common hardware interface and common board-to-board communications. Components, connectors, test points, and sensors may be embedded directly into the backplane to provide additional functionality, diagnostics, and system access. Other space vehicle sections may plug directly into the backplane. | 12-24-2015 |
20150373860 | ELECTRIC CONNECTOR, PLUG-IN MODULE THEREOF AND METHOD FOR MANUFACTURING PLUG-IN MODULE - An electric connector, a plug-in module thereof and a production method of the plug-in module are provided. The plug-in module comprises a base, an input unit, an output unit and an output end. The base comprises a top plate, a bottom plate and one connection plate. A plurality of input terminals and a plurality of intermediate terminals are fixed to the base. The input unit comprises one input circuit board provided vertically to the base and electrically coupled to an end portion of the input terminals. At least one channel are provided on the input circuit board. Each channel comprises a transformer electrically coupled to the input circuit board. The output unit comprises an output circuit board horizontally provided to the base and electrically coupled to the input circuit board via the intermediate terminals. The output end are fixed to and electrically coupled to the output circuit board. | 12-24-2015 |
20150373867 | ELECTRONICS HOUSING - An electronics housing is provided. The electronics housing includes a first enclosure portion, a bending portion unitarily formed with the first enclosure portion, and a second enclosure portion unitarily formed with the bending portion. The bending portion is configured to be bent from an initial position to a final position. The first and second enclosure portions cooperate to define an internal cavity therebetween when the bending portion is in the final position. An engine control unit and a method of forming an engine control unit are also provided. | 12-24-2015 |
20160029478 | Power Semiconductor Module System Having a High Isolation Strength and Method for Producing a Power Semiconductor Module Arrangement Having a High Isolation Strength - A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state. | 01-28-2016 |
20160035679 | DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING SUBSTRATE CAVITY - Devices and method related to dual-sided radio-frequency package having substrate cavity. In some embodiment, a packaged RF device includes a packaging substrate configured to receive a plurality of components, the packaging substrate including a first side and a second side, the second side of the packaging substrate defining a pocket. The packaged RF device also includes a shielded package implemented on the first side of the packaging substrate, the shielded package including an RF circuit, the shielded package configured to provide RF shielding for at least a portion of the RF circuit. The packaged RF device further includes a component mounted substantially within the pocket of the second side of the packaging substrate. | 02-04-2016 |
20160037670 | MODULAR POWER DEVICE - A modular power device is used for mounting on a main plate. The modular power device includes a first substrate, a driving module, and a converting module. The first substrate having a first axial direction and a second axial direction perpendicular to the first axial direction is inserted into the main plate to make the second axial direction be perpendicular to the main plate. The driving module is located on one side of the first substrate, and the converting module is located on the other side of the first substrate and includes a second substrate, wherein the second substrate is inserted into the main plate. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 02-04-2016 |
20160073499 | MODULE - A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and | 03-10-2016 |
20160150647 | PRINTED CIRCUIT BOARD COPPER PLANE REPAIR - A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board. | 05-26-2016 |
20160157364 | ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME | 06-02-2016 |
20160192525 | STACKED PACKAGE STRUCTURE - A stacked package structure is provided. The stacked package structure includes a first substrate, a first electronic component disposed on and electrically connected to the first substrate, and a second substrate disposed on the first substrate and covering the first electronic component, the second substrate having an opening corresponding in position to the first electronic component. Therefore, the first electronic component is prevented from colliding with the second substrate to cause displacement, such that loss of yield is reduced. | 06-30-2016 |
20160381823 | ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; and a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource. | 12-29-2016 |