Class / Patent application number | Description | Number of patent applications / Date published |
361735000 | Stacked | 20 |
20080304241 | Electronic Device, a Housing Part, and a Method of Manufacturing a Housing Part - The present invention relates to an electronic device ( | 12-11-2008 |
20080304242 | STACK MODULE, CARD INCLUDING THE STACK MODULE, AND SYSTEM INCLUDING THE STACK MODULE - Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First selection lines are electrically connected to selection terminals of first unit substrates disposed in odd-number layers, pass through some of the unit substrates, and extend to a lowermost substrate of the unit substrates. Second selection lines are electrically connected to selection terminals of second unit substrates disposed in even-number layers, pass through some of the unit substrates, and extend to the lowermost substrate of the unit substrates. The selection terminal is disposed between the first selection lines and the second selection lines. | 12-11-2008 |
20100246141 | ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF - One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels. | 09-30-2010 |
20100284156 | VERTICALLY-STACKED ELECTRONIC DEVICES HAVING CONDUCTIVE CARBON FILMS - Vertically-stacked electronic devices having conductive carbon films are disclosed. The vertically-stacked devices exhibit non-linear current-versus-voltage response over a voltage sweep range in various embodiments. The vertically-stacked devices may be assembled into arrays where the vertically-stacked devices may be electrically addressed independently of one another. Uses of the vertically-stacked electronic devices and arrays as two-terminal memory devices, logic units, and sensors are disclosed. Crossbar arrays of vertically-stacked electronic devices having conductive carbon films and nanowire electrodes are disclosed. | 11-11-2010 |
20110038127 | MULTIPLE CHIP MODULE AND PACKAGE STACKING METHOD FOR STORAGE DEVICES - Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A combination of these modules and dies in a substrate creates a package with specific function or a range of memory capacity. Several example system configurations are provided using BGA and PGA to illustrate the stacking technique. Several pin assignment and signal routing techniques are illustrated wherein internal and external signals are routed from main board to various stacked modules. Expansion can be done both on the vertical and horizontal orientations. | 02-17-2011 |
20110058342 | Semiconductor Device - An object of the present invention is to provide a semiconductor device having a small-sized, thin, and high heat-dissipating multilayer frame mounting structure. To achieve the object, the invention provides a semiconductor device having a multilayer frame obtained by stacking a plurality of lead frames on which electronic parts are mounted and sealing the stack with a resin. An interlayer distance between a lead frame on which an electronic part is mounted and a lead frame which is stacked above the lead frame and on which an electronic part is mounted is shorter than a distance from a face of the lead frame to a top face of the electronic part. | 03-10-2011 |
20110188210 | THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES - A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements. | 08-04-2011 |
20120020030 | ELECTRICAL PACK WITH SEPARATE CONTROL AND POWER MODULES - An electrical housing includes power components grouped together in power modules and control components grouped together in a control module that is separate from the power modules. | 01-26-2012 |
20120069530 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a stacked chip includes semiconductor chips which are stacked, the semiconductor chips comprises semiconductor substrates and through electrodes formed in the semiconductor substrates, respectively, the through electrodes being electrically connected, and deactivating circuits provided in the semiconductor chips, respectively, and configured to deactivate a failed semiconductor chip. | 03-22-2012 |
20120218719 | System and Method of Forming Semiconductor Devices - Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems. | 08-30-2012 |
20130083494 | THREE-DIMENSIONAL ELECTRONICS PACKAGING - Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit assembly (PCA), or co-accommodated in adjoining cavities of adjacent, stacked PCAs or PCBs. The cavities allow for closer stacking of the PCAs or PCBs. In some embodiments, a PCA comprises an encapsulant conformally layered over a PCB with electronic components mounted on top and bottom. Power and/or signal channels are routed through the encapsulant to the top and/or bottom layers. The encapsulated PCAs may be stacked. In various embodiments, stackable PCAs are modular, facilitating customization. | 04-04-2013 |
20130094155 | ELECTRONIC DEVICE AND ELECTRONIC DEVICE ASSEMBLY THEREOF - An electronic device assembly includes at least two electronic devices. Each electronic device has a body, two circuit boards and a flexible circuit board. A male connector and a female connector are installed at the positions corresponding to two ends of the body respectively, and the male and female connectors matching with each other in terms of specification. The two circuit boards are disposed at the two ends of the body respectively, and the two circuit boards are located between the male and female connectors and connected to the male and female connectors respectively. The two circuit boards are connected through the flexible circuit board to electrically connect the male and female connectors, in which the male connector of one electronic device and the female connector of the other electronic device are joined. | 04-18-2013 |
20130100616 | MULTIPLE DIE STACKING FOR TWO OR MORE DIE - A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses. | 04-25-2013 |
20130176687 | EXPANDABLE CONTROL UNIT AND CONTROL SYSTEM FOR INDUSTRIAL APPLICATIONS - A control unit for industrial applications is provided comprising a first compute box having a first microprocessor and being configured to run at least one first operating system. A second compute box may also be provided having a second microprocessor and being configured to run at least one second operating system. The first and second operating systems may be the same or different. The compute boxes may be mechanically coupled together or connected via one or more copper or fiber-optic cables, for example. Additional compute boxes may be added to expand the capabilities of each control unit. An integrated or detachable display may also be added. A control system for controlling a plurality of local input and output drops or devices is also provided. The control system includes a plurality of control units that may be distributed around an industrial installation and capable of data transfer between each control unit. | 07-11-2013 |
20130223018 | HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF - A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate, and the IC chip is connected to the organic laminated substrate by the bonding wire; the height and the shape of a wire arc is controlled, an injection procedure is controller by using multi-stage injection model software; then, marking and cutting are performed to obtain the SIM card package. The dimension of the package of the present invention is 12 mm×18 mm×0.63 mm, devices of multiple kinds are molded, thereby meeting use requirements for multiple functions. | 08-29-2013 |
20140009894 | COMMUNICATION DEVICE HAVING MULTI-MODULE ASSEMBLY - A communication device having multi-module assembly is provided. The communication device includes a body, a first communication module and a second communication module. The body has a front side, a rear side and a plurality of lateral sides. The front side and the rear side both have a length dimension and a width dimension, and the lateral sides have a thickness dimension. The body is a combination of a plurality of housings with the same length dimension and the same width dimension, and the rear side of a housing ahead is connected with the front side of another housing behind. The first communication module is disposed in a first housing of the body. The second communication module is disposed in a second housing of the body. | 01-09-2014 |
20140036454 | BVA INTERPOSER - A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds. | 02-06-2014 |
20140078686 | Stackable Communications System - A stackable communications apparatus comprises modules to be powered on in a sequence. Each of the modules comprises components that perform an individual function or group of functions of the apparatus, each module in the plurality of modules comprising an individual chassis stackable with at least another individual chassis of at least another module in the plurality of modules. The modules comprise at least two modules establishing surface contacts by stacking. The surface contacts maintain, without physical cabling, power connection between the at least two modules. A preceding module in the sequence determines, via a power controller in communication with a power controller of a next module, a power requirement of the next module. The power controller of the preceding module in the sequence enables power to the next module if a remaining power from the preceding module is greater than the power requirements of the next module. | 03-20-2014 |
20140168908 | ELECTRONIC MODULE - An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence. | 06-19-2014 |
20140355221 | POWER CONVERTER WITH BUS BARS - A power converter is equipped with a semiconductor module stack, a positive bus bar stack, and a negative bus bar stack. The positive bus bar stack has a first positive bus bar and a second positive bus bar stacked. The negative bus bar stack also has a first negative bus bar and a second negative bus bar stacked in a stacking direction Z of the positive bus bar stack. The first semiconductor modules of the semiconductor module stack are connected to the first positive bus bar and the first negative bus bar, while the second semiconductor modules of the semiconductor module stack are connected to the second positive bus bar and the second negative bus bar. This results in a decreased variation in mutual inductance among the semiconductor modules, which leads to a decrease in overall inductance of the power converter. | 12-04-2014 |