Entries |
Document | Title | Date |
20080198556 | HEATSINK STRUCTURE FOR SOLID-STATE IMAGE SENSOR - The heatsink structure for solid-state image sensors comprises a foil-like heatsink sheet made of a high heat conductivity material, the heatsink sheet having a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member, and having a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the invention realizes a heatsink structure for cooling the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure. | 08-21-2008 |
20080212288 | Electronic component package and manufacturing method thereof - An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side. | 09-04-2008 |
20080225493 | Three-Dimensional Multichip Module - A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips. | 09-18-2008 |
20090016027 | CONDUCTING LIQUID CRYSTAL POLYMER MATRIX COMPRISING CARBON NANOTUBES, USE THEREOF AND METHOD OF FABRICATION - Conducting liquid crystal polymer matrix comprising carbon nanotubes aligned in the matrix is provided, along with use thereof and method of fabrication. | 01-15-2009 |
20090046432 | Packaging substrate structure with electronic components embedded therein and method for manufacturing the same - A packaging substrate structure with electronic components embedded therein and a method for manufacturing the same are disclosed. The packaging substrate structure comprises: a core board; a built-up structure disposed on at least one surface of the core board, wherein the built-up structure has a plurality of conductive pads and an electronic component-disposing part on the surface thereof; a solder mask disposed on the surface of the built-up structure, where the solder mask has a open area to expose the electronic component-disposing part and a plurality of openings to expose the conductive pads of the built-up structure; and an electronic component disposed on the electronic component-disposing part and in the open area. Accordingly, the packaging substrate disclosed by the present invention exhibits enhanced electrical performance and product reliability. | 02-19-2009 |
20090141455 | CIRCUIT ARRANGEMENT FOR ELECTRICALLY CONTROLLING POWER AND COOLING ARRANGEMENT - The disclosure relates to a circuit arrangement for electrically controlling power, comprising at least one power control device and at least one heat extraction device. The at least one extraction device is in thermal contact with the at least one power control device. The heat extraction device is arranged such that it can be clamped to a fixed predefined electric potential and electrically insulated by the at least one power control device. | 06-04-2009 |
20090168364 | HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME - A semiconductor package module having a heat dissipation device includes one or more semiconductor packages with each semiconductor package having semiconductor chips and solder balls connected to the semiconductor chips. A printed circuit board is electrically connected to each of the semiconductor packages. The heat dissipation device dissipates heat generated within the semiconductor package module and includes a fastening member having a fastening body. The fastening member is placed in the space between the semiconductor chips and the printed circuit board, which occurs due to the presence of the solder balls. A coupling groove is defined in an upper surface of the fastening body, and a heat dissipation member covers the semiconductor packages. A through-hole is defined in the heat dissipation member at a position corresponding to the coupling groove, and a coupling member is disposed within the through-hole and is coupled to the coupling groove. | 07-02-2009 |
20090279266 | LOAD DRIVING SEMICONDUCTOR APPARATUS - A load driving semiconductor apparatus includes: a driving transistor, which operates based on an input voltage from an external circuit; a power semiconductor device controlling power supply to a load in such a manner that the power semiconductor device supplies electric power to the load when the transistor operates, and the power semiconductor device stops supplying electric power to the load when the transistor stops operating; and a mounting board, on which the driving transistor and the power semiconductor device are mounted. The mounting board includes a heat radiation pattern for emitting heat generated in the power semiconductor device. The heat radiation pattern includes a heat receiving pattern, on which the driving transistor is mounted. | 11-12-2009 |
20090316366 | System and Method for Dissipating Heat From A Semiconductor Module - The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe. | 12-24-2009 |
20100008048 | STRAIN REDUCTION FIXING STRUCTURE - A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates. | 01-14-2010 |
20100079958 | TRANSISTOR CLAMPING DEVICE - A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is provided between the holding block and the transistor. The spring fixes the pressure plate on the transistor, so that a uniform pressure is applied to the transistor via the pressure plate, and, at the side facing away from the pressure plate, the latter accordingly provides a good thermal conduction to a cooling element. | 04-01-2010 |
20100079959 | SEMICONDUCTOR DEVICE COMPRISING AN IN-CHIP ACTIVE HEAT TRANSFER SYSTEM - By providing thermoelectric elements, such as Peltier elements, in a semiconductor device, the overall heat management may be increased. In some illustrative embodiments, the corresponding active cooling/heating systems may be used in a stacked chip configuration to establish an efficient thermally conductive path between temperature critical circuit portions and a heat sink of the stacked chip configuration. | 04-01-2010 |
20100124027 | Switching Circuit Layout With Heatsink - A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction. | 05-20-2010 |
20100128445 | Clamp for mounting semiconductor laser bar chips and method of mounting chips - A clamp includes a base, a limiting member, a positioning assembly, and a pressing assembly. The base defines a gap. The limiting member defines a limiting slot corresponding to the gap. The positioning assembly is positioned at a first side of the limiting member. The positioning assembly includes a positioning handle and a pushing member. The pushing member extends in the limiting slot, and the positioning handle runs through the limiting member and is connected to the pushing member. The pressing assembly is positioned at a second side opposite to the first side. The pressing assembly runs through the limiting member and extends in the limiting slot. A chip is capable of being pushed to the position of the gap by the pushing member with operating the positioning handle and resists against the pressing assembly, thus being clamped. The present disclosure also provides a mounting method using the clamp. | 05-27-2010 |
20100157542 | POWER DEVICE PACKAGE HAVING ENHANCED HEAT DISSIPATION - A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device. | 06-24-2010 |
20100165577 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. | 07-01-2010 |
20100172104 | HEAT DISSIPATION DEVICE AND POWER MODULE - A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate. | 07-08-2010 |
20100195286 | HEAT SINK MECHANISM FOR INTERNALLY INTEGRATED INVERTER HUB (I3H) MOTOR FOR LIGHT ELECTRIC VEHICLES - A heat sink assembly having excellent heat dissipation for internally integrated inverter hub motor for light electric vehicles and comprising of a thermally conducive ring, the electronic board consisting of multiple inverter switches, a potential secondary electronic board and a heat sink base, where the thermally conductive one piece ring is pressed down on the inverter switches to affix the switches to the hub of the motor thereby creating a mechanism for heat dissipation. | 08-05-2010 |
20100208432 | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use - A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM | 08-19-2010 |
20100238633 | POWER CIRCUIT - A power circuit ( | 09-23-2010 |
20100246138 | METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES - Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed. | 09-30-2010 |
20100265665 | ELECTRONIC DEVICE HAVING A HEAT SINK - The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface. | 10-21-2010 |
20100271785 | HEAT-DISSIPATING AND FIXING MECHANISM OF ELECTRONIC COMPONENT AND PROCESS FOR ASSEMBLING SAME - A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has multiple insertion holes. The pins of the electronic component are inserted into corresponding insertion holes of the circuit board. The thermally-conductive adhesive interface has a first surface bonded with the heat-dissipating element and a second surface bonded with the electronic component. As a consequence, the electronic component is fixed on the heat-dissipating element through the thermally-conductive adhesive interface, and the heat generated by the electronic component is transmitted to the heat-dissipating element through the thermally-conductive adhesive interface. | 10-28-2010 |
20100302741 | POWER SEMICONDUCTOR MODULE FEATURING RESILIENTLY SUPPORTED SUBSTRATES AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR MODULE - The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied. | 12-02-2010 |
20110038123 | SOLID STATE DATA STORAGE ASSEMBLY - A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering. | 02-17-2011 |
20110038124 | THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF - A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent. | 02-17-2011 |
20110044007 | Heat sink, semiconductor device, and method of manufacturing heat sink - A heat sink | 02-24-2011 |
20110058337 | SMART JUNCTION BOX FOR SOLAR CELL MODULE - The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body. | 03-10-2011 |
20110090650 | THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL CONDUCTIVE MEMBER, HEAT RADIATING COMPONENT, AND SEMICONDUCTOR PACKAGE - A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer. | 04-21-2011 |
20110103022 | Indium compositions - Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed. | 05-05-2011 |
20110134609 | POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK - A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression. | 06-09-2011 |
20110157834 | HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE - A heat/electricity discrete metal core-chip on board Module includes a heat dissipation substrate, which has a surface that is recessed to form a carriage zone and a relatively elevated engagement section; a dielectric layer, which is formed of a compound that is formed on the heat dissipation substrate through conversion coating and covers the carriage zone of the heat dissipation substrate, the dielectric layer defining a window like heat conduction zone at a location corresponding to the engagement section of the heat dissipation substrate, so that the heat conduction zone corresponds exactly to the engagement section of the heat dissipation substrate; and an electrical connection layer, which is formed on the dielectric layer. A chip is set on the heat conduction zone and is connected to the electrical connection layer through wire bonding, whereby the paths for heat transfer and electricity transmission are separated. | 06-30-2011 |
20110164386 | HEAT-RELEASE CONFIGURATION, BRACKET FOR SUPPORTING HEAT-RELEASE PLATE AND METHOD OF ASSEMBLING HEAT-RELEASE CONFIGURATION - A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape. | 07-07-2011 |
20110182035 | ELECTRONIC DEVICE - An electronic apparatus includes: a semiconductor device including an electrically conductive portion to be grounded, the semiconductor device being configured to be mounted on a circuit board; a heat sink configured to radiate heat generated by the semiconductor device; a fastener configured to fasten the heat sink to the circuit board; and a first spring member wound around the fastener to electrically connect the heat sink to the electrically conductive portion. | 07-28-2011 |
20110194256 | POWER SEMICONDUCTOR DEVICE ADAPTIVE COOLING ASSEMBLY - The invention relates to a power semiconductor device ( | 08-11-2011 |
20110235279 | COOLING DEVICE - A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member. | 09-29-2011 |
20110292611 | SEMICONDUCTOR-DEVICE COOLING STRUCTURE AND POWER CONVERTER - A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the first cooling element, and an insulating casing receiving the semiconductor modules to electrically isolate the semiconductor devices from each other. | 12-01-2011 |
20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
20120002373 | HEAT PIPE TYPE COOLING DEVICE AND RAILCAR CONTROL EQUIPMENT USING THE SAME - An economical heat pipe type cooling device with high performance and stable start at low environmental temperatures below 0° C., and a railcar control equipment using the invented heat pipe type cooling device are provided. The midsection between two bents formed on a heat pipe is used as an evaporator; lengths of two distal sections to be used as the condenser sections are intentionally differentiated each from the other; and the condenser section of greater length is provided with heat radiating fins more than those on the condenser section of shorter length. This configuration permits each of two condenser sections to be provided with mutually different condensing capacity and accordingly the condenser section of shorter length works to cool heat-generating elements even though the condenser section of greater length would suffer from freezing problem at low temperatures. A sufficient cooling effect is rendered at ordinary temperature. | 01-05-2012 |
20120014068 | ELECTRONIC DEVICE - An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material. | 01-19-2012 |
20120026693 | Cooling Apparatus - According to one embodiment, a cooling apparatus includes: a cooling fin which cools heat-generating components by radiating heat of the heat-generating components; a first semiconductor module which serves as one of the heat-generating components; a second semiconductor module which serves as another one of the heat-generating components; a first heat sink which cools the first semiconductor module; a second heat sink which cools the second semiconductor module; a first heat pipe which thermally couples the cooling fin to the first heat sink; and a second heat pipe which thermally couples the first heat sink to the second heat sink. A functional upper limit of a junction temperature of the first semiconductor module is lower than a functional upper limit of a junction temperature of the second semiconductor module, and a heat generation of the first semiconductor module is larger than a heat generation of the second semiconductor module. | 02-02-2012 |
20120092834 | HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - A heat dissipation structure for an electronic device includes a body having a first surface and a second surface opposite to the first surface. A silicon-containing insulating layer is disposed on the first surface of the body. A chemical vapor deposition (CVD) diamond film is disposed on the silicon-containing insulating layer. A first conductive pattern layer is disposed on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the CVD diamond film. A method for fabricating a heat dissipation structure for an electronic device and an electronic package having the heat dissipation structure are also disclosed. | 04-19-2012 |
20120106087 | BASE PLATE - The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminium, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other. | 05-03-2012 |
20120188721 | NON-METAL STIFFENER RING FOR FCBGA - PCB or similar material is used for stiffener rings supporting heat sinks in Flip Chip Ball Grid Array (FCBGA) packages. The substrate material of the package and the stiffener ring share the same or similar Coefficient of Thermal Expansion. Stiffener rings may be manufactured from PCB or similar material using a router. | 07-26-2012 |
20120218716 | SEMICONDUCTOR DEVICE - A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board. | 08-30-2012 |
20120218717 | POWER MODULE - A reliable power module is realized, in which a good performance of radiating heat of the power semiconductor element is secured and it is hard for the heat of a power semiconductor element to be conducted to a driving element. A power module includes a power semiconductor element mounted on a lead frame, and a driving element mounted on the lead frame, and a heat radiating plate radiating heat which is generated by the power semiconductor element, and a resin holding the power semiconductor element, the driving element, and the heat radiating plate, wherein the heat radiating plate has a portion disposed at a side opposite to a surface of the lead frame where the power semiconductor element is mounted, a portion disposed between the power semiconductor element and the driving element, and a portion disposed below the power semiconductor element, as the portions being in a body. | 08-30-2012 |
20130058045 | HEATSINK WITH SUBSTANCE EMBEDDED TO SUPPRESS ELECTROMAGNETIC INTERFERENCE - A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench. | 03-07-2013 |
20130114213 | ELECTRONIC DEVICE - An electronic device having a base includes a circuit board, a electronic element, and a heat sink. The electronic element is mounted on the circuit board. The heat sink attaches to the electronic element. The heat sink includes an attaching wall and at least one side wall. The attaching wall attaches to the electronic element and having two opposite ends. At least one side wall connects to the ends of the attaching wall. The side wall and the attaching wall form a tube with an intake opening and an outtake opening. The intake opening faces the base and the outtake opening is opposite to the intake opening. | 05-09-2013 |
20130155621 | ELECTRONIC DEVICE WITH HEAT SINK - An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members. | 06-20-2013 |
20130188319 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin. | 07-25-2013 |
20130208426 | SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME - A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern. | 08-15-2013 |
20130258603 | SEMICONDUCTOR SWITCH INSULATION PROTECTION DEVICE AND POWER SUPPLY ASSEMBLY - A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall. | 10-03-2013 |
20130286594 | CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders ( | 10-31-2013 |
20130308274 | THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS - Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device may include a thermal spreader having graduated thermal expansion parameters. In some embodiments, the thermal spreader may have a first layer with a first coefficient of thermal expansion (CTE) and a second layer with a second CTE that is greater than the first CTE. Other embodiments may be described and/or claimed. | 11-21-2013 |
20130308275 | ELECTRONIC COMPONENT MOUNTING MODULE AND POWER CONVERSION APPARATUS - An electronic component mounting module according to an embodiment includes a mounting member, a pressing member, and a fastening member. The mounting member includes a component housing frame that houses an electronic component generating heat during operation so as to be in contact with at least a part of a side face thereof, and that holds the electronic component so as to expose a main heat radiating surface thereof toward a heat sink. The pressing member is mounted on the mounting member, and presses the mounting member and the electronic component at the same time toward the heat sink through a heat sink layer. The fastening member presses the pressing member toward the heat sink, and thus presses to fix the component housing frame and the electronic component to the heat sink layer. | 11-21-2013 |
20130308276 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME - A semiconductor device has, at least, a cooling base and a plurality of insulating substrates with conductive patterns fixed onto the cooling base through a solder. A solder pool portion is provided on the cooling base to contact a position of the cooling base directly below an edge of each of the insulating substrates with conductive patterns with a shortest distance from a center point of the cooling base. | 11-21-2013 |
20130343000 | THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP DEVICE - A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side. | 12-26-2013 |
20130343001 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein. | 12-26-2013 |
20130343002 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively. | 12-26-2013 |
20140002998 | HIGH HEAT CAPACITY ELECTRONIC COMPONENTS AND METHODS FOR FABRICATING | 01-02-2014 |
20140085829 | MULTI-LAYERED BOARD AND SEMICONDUCTOR PACKAGE - The invention provides a multi-layered board and a semiconductor package including the multi-layered board with improved heat dissipation performance of the semiconductor package. A multi-layered board includes an anisotropically-conductive member that includes an insulating base which is an anodized film of an aluminum substrate and in which through-holes are formed in a thickness direction and a plurality of conduction passages which are formed of a conductive material filled in the through-holes and which extend through the insulating base in the thickness direction with the conduction passages insulated from each other, a heat conducting layer that includes heat conducting portions and is disposed on at least one surface of the anisotropically-conductive member, and heat dissipating portions formed of the conductive material and protruding from the insulating base. | 03-27-2014 |
20140118951 | INTERPOSER AND PACKAGE ON PACKAGE STRUCTURE - A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure. | 05-01-2014 |
20140146479 | FLEXIBLE THERMAL TRANSFER STRIPS - A system for use between a heat generating electronic device having a die having a shape placed thereon and a heat sink, includes a thermally conductive slug having a plurality of edges; a plurality of discrete strips each of the strips having a proximal end attaching to one of the edges of the thermally conductive slug, a distal end wherein the distal end is rigid for attachment to the heat sink, a flexible portion between the distal end and the thermally conductive slug wherein the slug may move as the electronic device moves and wherein the strips are comprised of two of more discrete layers, or strands that create a braid. | 05-29-2014 |
20140168901 | Power Module - A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body. | 06-19-2014 |
20140211421 | Circuit Board Assembly - A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards. | 07-31-2014 |
20140340849 | SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME - A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat spreader includes an upper plate and an extension part connected to the upper plate. At least a part of each of the first and second upper packages vertically overlaps the semiconductor chip. The upper plate may be arranged on the first upper package and the second upper package. The extension part may be arranged between the first upper package and the second upper package. The extension part has a vertical height that is greater than its horizontal width. | 11-20-2014 |
20140347820 | SYSTEMS AND METHODS FOR COOLING OF POWER ELECTRONIC DEVICES - The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components. | 11-27-2014 |
20150009631 | Cooling Assemblies and Power Electronics Modules Having Multiple-Porosity Structures - Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity. | 01-08-2015 |
20150070847 | POWER CONVERTER - A power converter is provided. The power converter includes a heat sink provided with a holding unit, a plurality of semiconductor devices disposed on the heat sink, and a fixing assembly pressing each of the semiconductor devices toward the heat sink to fix the semiconductor device. The fixing assembly includes a lower push unit disposed on the semiconductor device, and an upper push unit disposed on the lower push unit to press the lower push unit downward, the upper push unit being coupled to the holding unit. The upper push unit includes a central bent part that partially protrudes downward, an insertion part disposed on each of both ends of the central bent part in a left/right direction, the insertion part having a left/right distance therebetween that gradually increases upward, and a fixing bar inserted into the insertion part. | 03-12-2015 |
20150109738 | UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit. | 04-23-2015 |
20150351245 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device and a connection element. The first conductive layer is formed on the substrate and has a first pad and a second pad separated from the first pad. The second conductive layer is formed on the substrate and has a third pad and a fourth pad electrically connected with the third pad through the second conductive layer. The first surface mount device is mounted on the first pad and the third pad. The second surface mount device is mounted on the second pad and the fourth pad. The connection element electrically connects the first pad with the second pad. | 12-03-2015 |
20160093550 | ELECTRONIC DEVICE HAVING A HEAT RADIATING UNIT - An electronic device includes a first electronic unit, a second electronic unit disposed adjacent to the first electronic unit, and a heat radiating unit. The second electronic unit has a first portion and a second portion that is closer to the first electronic unit than the first portion. The heat radiating unit is disposed such that heat generated in the second portion of the second electronic unit is directed towards the first portion of the second electronic unit and from the first portion towards an outside of the electronic device. | 03-31-2016 |
20160093553 | ON DEMAND COOLING OF AN NVM USING A PELTIER DEVICE - Some examples relate to an electronic system that includes a substrate and a non-volatile memory (NVM) mounted on the substrate. The electronic system further includes a Peltier device mounted to a portion of the NVM to provide on demand short term cooling to the NVM during operation of the NVM. Other examples relate to a method that includes operating a plurality non-volatile memories (NVMs) that is part of an electronic system, and using a plurality of Peltier devices to provide on demand short term cooling to a portion of each NVM. | 03-31-2016 |
20160128197 | System and Method - In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer. | 05-05-2016 |
20160205761 | THERMAL SWITCHES FOR ACTIVE HEAT FLUX ALTERATION | 07-14-2016 |