| Entries |
| Document | Title | Date |
|---|
| 20110182035 | ELECTRONIC DEVICE - An electronic apparatus includes: a semiconductor device including an electrically conductive portion to be grounded, the semiconductor device being configured to be mounted on a circuit board; a heat sink configured to radiate heat generated by the semiconductor device; a fastener configured to fasten the heat sink to the circuit board; and a first spring member wound around the fastener to electrically connect the heat sink to the electrically conductive portion. | 07-28-2011 |
| 20110194256 | POWER SEMICONDUCTOR DEVICE ADAPTIVE COOLING ASSEMBLY - The invention relates to a power semiconductor device ( | 08-11-2011 |
| 20090016027 | CONDUCTING LIQUID CRYSTAL POLYMER MATRIX COMPRISING CARBON NANOTUBES, USE THEREOF AND METHOD OF FABRICATION - Conducting liquid crystal polymer matrix comprising carbon nanotubes aligned in the matrix is provided, along with use thereof and method of fabrication. | 01-15-2009 |
| 20080198556 | HEATSINK STRUCTURE FOR SOLID-STATE IMAGE SENSOR - The heatsink structure for solid-state image sensors comprises a foil-like heatsink sheet made of a high heat conductivity material, the heatsink sheet having a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member, and having a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the invention realizes a heatsink structure for cooling the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure. | 08-21-2008 |
| 20130058045 | HEATSINK WITH SUBSTANCE EMBEDDED TO SUPPRESS ELECTROMAGNETIC INTERFERENCE - A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench. | 03-07-2013 |
| 20130114213 | ELECTRONIC DEVICE - An electronic device having a base includes a circuit board, a electronic element, and a heat sink. The electronic element is mounted on the circuit board. The heat sink attaches to the electronic element. The heat sink includes an attaching wall and at least one side wall. The attaching wall attaches to the electronic element and having two opposite ends. At least one side wall connects to the ends of the attaching wall. The side wall and the attaching wall form a tube with an intake opening and an outtake opening. The intake opening faces the base and the outtake opening is opposite to the intake opening. | 05-09-2013 |
| 20090046432 | Packaging substrate structure with electronic components embedded therein and method for manufacturing the same - A packaging substrate structure with electronic components embedded therein and a method for manufacturing the same are disclosed. The packaging substrate structure comprises: a core board; a built-up structure disposed on at least one surface of the core board, wherein the built-up structure has a plurality of conductive pads and an electronic component-disposing part on the surface thereof; a solder mask disposed on the surface of the built-up structure, where the solder mask has a open area to expose the electronic component-disposing part and a plurality of openings to expose the conductive pads of the built-up structure; and an electronic component disposed on the electronic component-disposing part and in the open area. Accordingly, the packaging substrate disclosed by the present invention exhibits enhanced electrical performance and product reliability. | 02-19-2009 |
| 20100195286 | HEAT SINK MECHANISM FOR INTERNALLY INTEGRATED INVERTER HUB (I3H) MOTOR FOR LIGHT ELECTRIC VEHICLES - A heat sink assembly having excellent heat dissipation for internally integrated inverter hub motor for light electric vehicles and comprising of a thermally conducive ring, the electronic board consisting of multiple inverter switches, a potential secondary electronic board and a heat sink base, where the thermally conductive one piece ring is pressed down on the inverter switches to affix the switches to the hub of the motor thereby creating a mechanism for heat dissipation. | 08-05-2010 |
| 20110292611 | SEMICONDUCTOR-DEVICE COOLING STRUCTURE AND POWER CONVERTER - A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the first cooling element, and an insulating casing receiving the semiconductor modules to electrically isolate the semiconductor devices from each other. | 12-01-2011 |
| 20110038124 | THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF - A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent. | 02-17-2011 |
| 20100172104 | HEAT DISSIPATION DEVICE AND POWER MODULE - A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate. | 07-08-2010 |
| 20100124027 | Switching Circuit Layout With Heatsink - A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction. | 05-20-2010 |
| 20100079959 | SEMICONDUCTOR DEVICE COMPRISING AN IN-CHIP ACTIVE HEAT TRANSFER SYSTEM - By providing thermoelectric elements, such as Peltier elements, in a semiconductor device, the overall heat management may be increased. In some illustrative embodiments, the corresponding active cooling/heating systems may be used in a stacked chip configuration to establish an efficient thermally conductive path between temperature critical circuit portions and a heat sink of the stacked chip configuration. | 04-01-2010 |
| 20100079958 | TRANSISTOR CLAMPING DEVICE - A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is provided between the holding block and the transistor. The spring fixes the pressure plate on the transistor, so that a uniform pressure is applied to the transistor via the pressure plate, and, at the side facing away from the pressure plate, the latter accordingly provides a good thermal conduction to a cooling element. | 04-01-2010 |
| 20120106087 | BASE PLATE - The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminium, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other. | 05-03-2012 |
| 20090279266 | LOAD DRIVING SEMICONDUCTOR APPARATUS - A load driving semiconductor apparatus includes: a driving transistor, which operates based on an input voltage from an external circuit; a power semiconductor device controlling power supply to a load in such a manner that the power semiconductor device supplies electric power to the load when the transistor operates, and the power semiconductor device stops supplying electric power to the load when the transistor stops operating; and a mounting board, on which the driving transistor and the power semiconductor device are mounted. The mounting board includes a heat radiation pattern for emitting heat generated in the power semiconductor device. The heat radiation pattern includes a heat receiving pattern, on which the driving transistor is mounted. | 11-12-2009 |
| 20080212288 | Electronic component package and manufacturing method thereof - An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side. | 09-04-2008 |
| 20090168364 | HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME - A semiconductor package module having a heat dissipation device includes one or more semiconductor packages with each semiconductor package having semiconductor chips and solder balls connected to the semiconductor chips. A printed circuit board is electrically connected to each of the semiconductor packages. The heat dissipation device dissipates heat generated within the semiconductor package module and includes a fastening member having a fastening body. The fastening member is placed in the space between the semiconductor chips and the printed circuit board, which occurs due to the presence of the solder balls. A coupling groove is defined in an upper surface of the fastening body, and a heat dissipation member covers the semiconductor packages. A through-hole is defined in the heat dissipation member at a position corresponding to the coupling groove, and a coupling member is disposed within the through-hole and is coupled to the coupling groove. | 07-02-2009 |
| 20080225493 | Three-Dimensional Multichip Module - A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips. | 09-18-2008 |
| 20090141455 | CIRCUIT ARRANGEMENT FOR ELECTRICALLY CONTROLLING POWER AND COOLING ARRANGEMENT - The disclosure relates to a circuit arrangement for electrically controlling power, comprising at least one power control device and at least one heat extraction device. The at least one extraction device is in thermal contact with the at least one power control device. The heat extraction device is arranged such that it can be clamped to a fixed predefined electric potential and electrically insulated by the at least one power control device. | 06-04-2009 |
| 20100265665 | ELECTRONIC DEVICE HAVING A HEAT SINK - The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface. | 10-21-2010 |
| 20090316366 | System and Method for Dissipating Heat From A Semiconductor Module - The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe. | 12-24-2009 |
| 20100157542 | POWER DEVICE PACKAGE HAVING ENHANCED HEAT DISSIPATION - A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device. | 06-24-2010 |
| 20100238633 | POWER CIRCUIT - A power circuit ( | 09-23-2010 |
| 20110058337 | SMART JUNCTION BOX FOR SOLAR CELL MODULE - The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body. | 03-10-2011 |
| 20100128445 | Clamp for mounting semiconductor laser bar chips and method of mounting chips - A clamp includes a base, a limiting member, a positioning assembly, and a pressing assembly. The base defines a gap. The limiting member defines a limiting slot corresponding to the gap. The positioning assembly is positioned at a first side of the limiting member. The positioning assembly includes a positioning handle and a pushing member. The pushing member extends in the limiting slot, and the positioning handle runs through the limiting member and is connected to the pushing member. The pressing assembly is positioned at a second side opposite to the first side. The pressing assembly runs through the limiting member and extends in the limiting slot. A chip is capable of being pushed to the position of the gap by the pushing member with operating the positioning handle and resists against the pressing assembly, thus being clamped. The present disclosure also provides a mounting method using the clamp. | 05-27-2010 |
| 20100302741 | POWER SEMICONDUCTOR MODULE FEATURING RESILIENTLY SUPPORTED SUBSTRATES AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR MODULE - The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied. | 12-02-2010 |
| 20110044007 | Heat sink, semiconductor device, and method of manufacturing heat sink - A heat sink | 02-24-2011 |
| 20100271785 | HEAT-DISSIPATING AND FIXING MECHANISM OF ELECTRONIC COMPONENT AND PROCESS FOR ASSEMBLING SAME - A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has multiple insertion holes. The pins of the electronic component are inserted into corresponding insertion holes of the circuit board. The thermally-conductive adhesive interface has a first surface bonded with the heat-dissipating element and a second surface bonded with the electronic component. As a consequence, the electronic component is fixed on the heat-dissipating element through the thermally-conductive adhesive interface, and the heat generated by the electronic component is transmitted to the heat-dissipating element through the thermally-conductive adhesive interface. | 10-28-2010 |
| 20110164386 | HEAT-RELEASE CONFIGURATION, BRACKET FOR SUPPORTING HEAT-RELEASE PLATE AND METHOD OF ASSEMBLING HEAT-RELEASE CONFIGURATION - A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape. | 07-07-2011 |
| 20110134609 | POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK - A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression. | 06-09-2011 |
| 20100165577 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. | 07-01-2010 |
| 20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
| 20120002373 | HEAT PIPE TYPE COOLING DEVICE AND RAILCAR CONTROL EQUIPMENT USING THE SAME - An economical heat pipe type cooling device with high performance and stable start at low environmental temperatures below 0° C., and a railcar control equipment using the invented heat pipe type cooling device are provided. The midsection between two bents formed on a heat pipe is used as an evaporator; lengths of two distal sections to be used as the condenser sections are intentionally differentiated each from the other; and the condenser section of greater length is provided with heat radiating fins more than those on the condenser section of shorter length. This configuration permits each of two condenser sections to be provided with mutually different condensing capacity and accordingly the condenser section of shorter length works to cool heat-generating elements even though the condenser section of greater length would suffer from freezing problem at low temperatures. A sufficient cooling effect is rendered at ordinary temperature. | 01-05-2012 |
| 20120014068 | ELECTRONIC DEVICE - An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material. | 01-19-2012 |
| 20120026693 | Cooling Apparatus - According to one embodiment, a cooling apparatus includes: a cooling fin which cools heat-generating components by radiating heat of the heat-generating components; a first semiconductor module which serves as one of the heat-generating components; a second semiconductor module which serves as another one of the heat-generating components; a first heat sink which cools the first semiconductor module; a second heat sink which cools the second semiconductor module; a first heat pipe which thermally couples the cooling fin to the first heat sink; and a second heat pipe which thermally couples the first heat sink to the second heat sink. A functional upper limit of a junction temperature of the first semiconductor module is lower than a functional upper limit of a junction temperature of the second semiconductor module, and a heat generation of the first semiconductor module is larger than a heat generation of the second semiconductor module. | 02-02-2012 |
| 20110090650 | THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL CONDUCTIVE MEMBER, HEAT RADIATING COMPONENT, AND SEMICONDUCTOR PACKAGE - A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer. | 04-21-2011 |
| 20110103022 | Indium compositions - Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed. | 05-05-2011 |
| 20100246138 | METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES - Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed. | 09-30-2010 |
| 20100208432 | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use - A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM | 08-19-2010 |
| 20100008048 | STRAIN REDUCTION FIXING STRUCTURE - A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates. | 01-14-2010 |
| 20120218717 | POWER MODULE - A reliable power module is realized, in which a good performance of radiating heat of the power semiconductor element is secured and it is hard for the heat of a power semiconductor element to be conducted to a driving element. A power module includes a power semiconductor element mounted on a lead frame, and a driving element mounted on the lead frame, and a heat radiating plate radiating heat which is generated by the power semiconductor element, and a resin holding the power semiconductor element, the driving element, and the heat radiating plate, wherein the heat radiating plate has a portion disposed at a side opposite to a surface of the lead frame where the power semiconductor element is mounted, a portion disposed between the power semiconductor element and the driving element, and a portion disposed below the power semiconductor element, as the portions being in a body. | 08-30-2012 |
| 20120218716 | SEMICONDUCTOR DEVICE - A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board. | 08-30-2012 |
| 20120188721 | NON-METAL STIFFENER RING FOR FCBGA - PCB or similar material is used for stiffener rings supporting heat sinks in Flip Chip Ball Grid Array (FCBGA) packages. The substrate material of the package and the stiffener ring share the same or similar Coefficient of Thermal Expansion. Stiffener rings may be manufactured from PCB or similar material using a router. | 07-26-2012 |
| 20110038123 | SOLID STATE DATA STORAGE ASSEMBLY - A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering. | 02-17-2011 |
| 20110235279 | COOLING DEVICE - A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member. | 09-29-2011 |
| 20120092834 | HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - A heat dissipation structure for an electronic device includes a body having a first surface and a second surface opposite to the first surface. A silicon-containing insulating layer is disposed on the first surface of the body. A chemical vapor deposition (CVD) diamond film is disposed on the silicon-containing insulating layer. A first conductive pattern layer is disposed on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the CVD diamond film. A method for fabricating a heat dissipation structure for an electronic device and an electronic package having the heat dissipation structure are also disclosed. | 04-19-2012 |
| 20110157834 | HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE - A heat/electricity discrete metal core-chip on board Module includes a heat dissipation substrate, which has a surface that is recessed to form a carriage zone and a relatively elevated engagement section; a dielectric layer, which is formed of a compound that is formed on the heat dissipation substrate through conversion coating and covers the carriage zone of the heat dissipation substrate, the dielectric layer defining a window like heat conduction zone at a location corresponding to the engagement section of the heat dissipation substrate, so that the heat conduction zone corresponds exactly to the engagement section of the heat dissipation substrate; and an electrical connection layer, which is formed on the dielectric layer. A chip is set on the heat conduction zone and is connected to the electrical connection layer through wire bonding, whereby the paths for heat transfer and electricity transmission are separated. | 06-30-2011 |
