Class / Patent application number | Description | Number of patent applications / Date published |
361713000 | Electrically insulating thermally conductive | 14 |
20080218980 | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology - Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load. | 09-11-2008 |
20100002397 | BASE FOR POWER MODULE - A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate. | 01-07-2010 |
20100246137 | THERMAL-ELECTRICAL ASSEMBLY FOR A PORTABLE COMMUNICATION DEVICE - A thermal-electrical assembly ( | 09-30-2010 |
20100302739 | THERMAL INTERFACE MATERIAL AND METHOD OF USING THE SAME AND ELECTRONIC ASSEMBLY HAVING THE SAME - An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature. | 12-02-2010 |
20100328898 | Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures - The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices. | 12-30-2010 |
20110261536 | Electronic Component Assembly Comprising a Varistor and a Semiconductor Component - An electric component assembly comprising a semiconductor component ( | 10-27-2011 |
20120039045 | POWER MODULE AND METHOD FOR DETECTING INSULATION DEGRADATION THEREOF - A method and device for detecting insulation degradation of a power module, which detects, in advance, degradation of an insulating sheet based on a current change immediately before breakdown of an insulation characteristic from a current value of a current flowing through the insulating sheet, thereby detecting a failure of a power module caused by the degradation of insulation. The device includes: a current detector sampling and detecting a current value of a current flowing through an insulating sheet of the power module at a predetermined time interval; a calculator determining, based on the current value, a state in which the insulation characteristic of the insulating sheet is so degraded that the breakdown is imminent, and outputting a degradation determination result of YES when it is determined that the insulating sheet is in the state immediately before the breakdown; a current storage storing a current value i(n−1) at a previous sampling time point; and an alarm generating an alarm in response to the degradation determination result of YES. The calculator outputs the degradation determination result of YES when a present current value in exceeds ten times the previous current value i(n−1). | 02-16-2012 |
20120182693 | REVERSIBLY ADHESIVE THERMAL INTERFACE MATERIAL - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 07-19-2012 |
20120218714 | POWER ELECTRONICS ASSEMBLIES, INSULATED METAL SUBSTRATE ASSEMBLIES, AND VEHICLES INCORPORATING THE SAME - A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed. | 08-30-2012 |
20120224327 | Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures - The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices. | 09-06-2012 |
20130083487 | Driver Package - A driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member. | 04-04-2013 |
20130188318 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE WITH THE SAME - An electronic device includes a circuit board, a plurality of electronic components, a heat dissipation structure and a casing. The electronic components are disposed on the circuit board. The heat dissipation structure includes a first electrically insulating and thermally conductive layer and a metal layer. The first electrically insulating and thermally conductive layer covers the circuit board and/or the electronic components. The thermal conductivity coefficient of the first electrically insulating and thermally conductive layer is greater than 0.5 W/m.k. The metal layer is combined and thermal contacted with the first electrically insulating and thermally conductive layer. The casing has an accommodating space. The circuit board, the electronic components and the heat dissipation structure are received in the accommodating space, and the metal layer is disposed between the casing and the first electrically insulating and thermally conductive layer. | 07-25-2013 |
20130322020 | ELECTRONIC DEVICE AND PROTECTIVE ELEMENT THEREFOR FOR USE IN EXPLOSION ENDANGERED AREAS - An electronic device for use in explosion endangered areas, comprising a superordinated electronic unit, a plurality of electronic components connected to the superordinated unit and supplied with energy by the superordinated unit, and a protective element installed in a number of connection lines for connecting respective ones of the components to the superordinated unit. In the case of a malfunctioning of one of the components, a space saving, safe conversion of the power available via the superordinated unit into heat occurs. The protective element comprises an electrically insulating, heat conductive, base body, and a number of resistors applied on the base body and corresponding to the number of connection lines, wherein each of the resistors is provided an input and output side with a connection, via which it is connected to a respective one of the connection lines. | 12-05-2013 |
20150116946 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT - An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover. | 04-30-2015 |