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Heat sink

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361688000 - With cooling means

361704000 - Thermal conduction

361707000 - Through support means

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361710000 Details 63
361711000 Cooling plate or bar 20
Entries
DocumentTitleDate
20090195989HEAT SINK COMPONENT AND A METHOD OF PRODUCING A HEAT SINK COMPONENT - A heat sink component for a semiconductor package includes a thermal interface member including a thermally conductive material, and a heat sink member having a surface thereof that includes at least one projecting portion having a pointed shape or edge shape, a tip of which digs into the thermally conductive material.08-06-2009
20110188207MOBILE TERMINAL - A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.08-04-2011
20130077250DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink - A power supply converter (03-28-2013
20100157539HEATSINK MOUNTING SYSTEM - A heatsink system (06-24-2010
20100073883FILM FORMING METHOD, THERMAL CONDUCTION MEMBER, POWER MODULE, VEHICLE INVERTER, AND VEHICLE - There is provided a film forming method capable of enhancing adhesion efficiency of a metal powder by use of a low-pressure compressed gas even in the case of spraying the metal powder remaining in a solid-phase state to a substrate, to form a film, the method being a film forming method of spraying a metal powder p in a solid-phase state to a surface 03-25-2010
20130077251HEAT SINK MOUNTING DEVICE - A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.03-28-2013
20080266807ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK - An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring.10-30-2008
20100046171FASTENING MEMBER - A fastening member for fastening a peripheral device in an electronic device casing and performing heat exchange with the peripheral device is presented. The fastening member includes a supporting plate and a pair of side plates. This pair of side plates is respectively disposed on two sides of the supporting plate to support the peripheral device. The side plates can be fastened to the electronic device casing. The supporting plate has a plurality of heat-conductive connecting pieces in contact with the casing for transferring heat generated by the peripheral device to the electronic device casing, so as to perform heat exchange.02-25-2010
20130135824Power Semiconductor Device - The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 05-30-2013
20100103623LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a low-temperature-cofired-ceramic (LTCC) package and a method of manufacturing the same. The LTCC package includes: an LTCC substrate including a plurality of LTCC layers and a recess in which a device is mounted; a thermal conductive element adhered onto a first LTCC layer exposed by the recess using a first thermal conductive adhesive member; the device adhered onto the thermal conductive element using a second thermal conductive adhesive member; and a connection member for electrically connecting the device with the LTCC substrate. In the LTCC package and the method, portions of the LTCC layers disposed under a high-heating device except a lowermost LTCC layer contacting a heat sink, which correspond to a thermal transmission path, are removed and replaced by a higher thermal conductive material to minimize heat dissipation resistance and heat resistance caused by thermal conduction. Thus, heat resistance and thermal stress between the bottom of the high-heating device and the heat sink can be minimized.04-29-2010
20120262883HEAT RADIATOR AND MANUFACTURING METHOD THEREOF - A back metal layer (10-18-2012
20090154109HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a clip for securing the heat sink to a circuit board with a pair of securing members mounted thereon. The clip is a bent resilient wire including a positioning portion disposed on the heat sink and a pair of arms extending from opposite ends of the positioning portion. Each arm includes an operation portion suspended above the heat sink and a hook connecting with the operation portion. The securing members are located at opposite lateral sides of the electronic component respectively. The two hooks are configured for engaging with the securing members, correspondingly.06-18-2009
20090154108CLIP AND HEAT DISSIPATION ASSEMBLY USING THE SAME06-18-2009
20130027887SWITCHING POWER SUPPLY DEVICE - A switching power supply device includes a case, a board that has circuit parts containing a switching element mounted thereon and is accommodated in the case, and a heat sink that is provided in the case so as to partition the inside of the case into a part mount chamber having the board accommodated therein and an air flow path through which air flows. The switching element of the circuit parts is mounted on the board while brought into contact with a surface of the heat sink that faces the part mount chamber, and cooled through the heat sink by the air flowing in the air flow path.01-31-2013
20130083486SPRINGY CLIP TYPE APPARATUS FOR FASTENING POWER SEMICONDUCTOR - The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.04-04-2013
20120182692DOUBLE-SIDED SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR THE SAME - A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink.07-19-2012
20110002104BRACKET FOR MOUNTING HEAT SINK - A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plurality of heat sinks having different sizes.01-06-2011
20130050946FASTENING MECHANISM FOR FIXING RADIATOR - A fastening mechanism for fixing a radiator having a plurality of heat sinks to a circuit board includes two fixing rods fixed on the circuit board, a connecting member positioned between the heat sinks; and two fastening arms respectively connecting the connecting member to the fixing rods. An electronic device using the fastening mechanism is also provided.02-28-2013
20100002396HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip assembly. The clip assembly includes a clip and a pair of movable fasteners pivotally connected to the clip. The clip includes a main body, two pressing portions extending from two opposite ends of the main body and two locking arms extending oppositely from the two pressing portions, respectively. The movable fasteners each include a main body, a pair of receiving portions curved upwardly from the main body and receiving a corresponding locking arm therein and a hook extending downwardly from the main body and engaging with a clasp on a printed circuit board. A distance from each of the hooks of the movable fasteners to a corresponding clasp can be adjustable via rotation of the movable fasteners around the locking arms of the clip.01-07-2010
20090310312APPARATUS FOR MOUNTING A MODULE AND ENABLING HEAT CONDUCTION FROM THE MODULE TO THE MOUNTING SURFACE - An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body. Each of the plurality of electronic modules comprises: a plurality of electronic components, a heat conducting side configured to contact the heat conducting surface of the heat dissipating body, a second flange adjacent the heat conducting side, the second flange configured to couple with the first flange, and a second part of the latch mechanism adjacent the heat conducting side, the second part of the latch mechanism configured to couple with the first part of the latch mechanism. The second flange and the second part of the latch mechanism are on opposite edges of the heat conducting side.12-17-2009
20100097767Machine for passively removing heat generated by an electronic circuit board - A machine for passively removing heat generated by an electronic circuit board is disclosed. In a typical embodiment an electronic circuit board of any type or size is comprised of electronic components producing heat during operation. High thermal conductivity moldable pads applied to both sides of the electronic circuit board form a conductive pathway to transport heat away from electronic circuits and components. A two piece rigid heat sink having thin rigid conductive fins on its top base is coupled together forming a cavity into which the computer board/conductive pad assembly fits, thereby forming a second conductive pathway for heat transport away from board features. The thin rigid conductive fins collectively form yet a third conductive pathway for heat transport from the solid base of the two piece rigid heat sink. Exposure of the thin rigid conductive fins to cooler surrounding air provides convective transfer of heat from the fins to ambient air.04-22-2010
20090040728Fixing Structure and Heat Dissipation Device - A fixing structure includes a back plate, a fixing plate, a first elastic element, a second elastic element and a fastener. The back plate has a positioning pillar thereon. The fixing plate presses a heat dissipation element to allow the heat dissipation element to contact a chip above the back plate. Both the first elastic element and the second elastic element are connected to the fixing plate. The fastener fastens the first elastic element and the second elastic element to the positioning pillar or just fastens the first elastic element to the positioning pillar to allow the second elastic element to be suspended. Furthermore, a heat dissipation device employing the fastening structure is also disclosed.02-12-2009
20090059534ELECTRONIC EQUIPMENT - In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced.03-05-2009
20090268407HEAT SINK CLIP - A heat sink clip (10-29-2009
20130163206SEMICONDUCTOR DEVICE - A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact.06-27-2013
20090237887ELECTRONIC DEVICE - An electronic device includes a circuit board on which a device generating heat in an operation state is mounted, a chassis to accommodate the circuit board, and a temperature-responsive arrangement. The chassis includes a holding part. The temperature-responsive arrangement extends and contracts in accordance with temperature so as to dispose the device apart from the holding part at a first temperature less than a threshold temperature, and to dispose the device in contact with the holding part at a second temperature exceeding the threshold temperature.09-24-2009
20090046431High Capacity Thin Module System - Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.02-19-2009
20090027858HEAT DISSIPATING DEVICE ASSEMBLY - A heat dissipating device assembly for dissipating heat generated by an electronic component (01-29-2009
20090021916SEMICONDUCTOR ASSEMBLY HAVING A HOUSING - A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.01-22-2009
20120113597HEAT SINK FOR AN ELECTRONIC OR ELECTRICAL COMPONENT - The invention relates to a heat sink (05-10-2012
20120236505ELECTRONIC SUBSTRATE DEVICE - An electronic substrate device capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipator without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member includes a central protruding portion which is accommodated in a penetrating portion while facing a die pad through an intermediary first gap, and first separated protruding portions provided around the central protruding portion have a height dimension smaller than that of the central protruding portion, the first separated protruding portions having a top surface which abuts a rear surface portion of the electronic substrate to form a second gap, and in which a first heat transfer bond which is a heat conductive adhesive is applied to the first gap and the second gap communicating with the first gap.09-20-2012
20110032678NANO-TUBE THERMAL INTERFACE STRUCTURE - A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.02-10-2011
20080291635HEAT DISSIPATIVE STRUCTURE, OPTICAL PICKUP APPARATUS, AND OPTICAL RECORDING/REPRODUCING APPARATUS - A heat dissipative structure that offers high heat dissipation effect with a simple configuration, an optical pickup apparatus having the same, and an optical recording/reproducing apparatus are provided. A heat-dissipating component is provided for a heat-producing component. Heat generated in the heat-producing component can be transferred to the heat-dissipating component and released therefrom. The heat-dissipating component has a heat-dissipating plate, whereby a large surface area and high heat dissipation effect is obtained. The heat-dissipating portion having the heat-dissipating plate is disposed in a region including a side opposite from a heat-receiving portion which receives heat from the heat-producing component, whereby heat is released at a location as far away from the heat-receiving portion as possible. The heat dissipative structure which offers high heat dissipation effect can be implemented with a simple configuration, and the heat-producing component can be cooled effectively.11-27-2008
20120314371GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR FABRICATING - A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.12-13-2012
20110103020Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices - One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm05-05-2011
20090195988ELECTRONIC APPARATUS - According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the peat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.08-06-2009
20100091460ELECTRONIC MODULE WITH HEAT SINK - An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.04-15-2010
20100091461MOUNTING STRUCTURE FOR POWER MODULE, AND MOTOR CONTROLLER INCLUDING THE SAME - A mounting structure for a power module, in which a power module and a heat sink can be easily separated without additional labor and time and without requiring an extra disassembly space in a product and in which parts are not damaged during the disassembly. In the heat sink (04-15-2010
20100008045HEAT SINK - A heat sink used to dissipate a heat source includes a heat-dissipating portion and a heat-conducting portion secured into the heat-dissipating portion. The heat-dissipating portion includes a base and fins extending from the base. The base defines a threaded hole in a bottom thereof. The heat-conducting portion includes a substrate for contacting with the heat source and a threaded portion extending from the substrate. The threaded portion of the heat-conducting portion is positioned in the base of the heat-dissipating portion and secured in the base of the heat-dissipating portion by the threaded portion engaging in the threaded hole of the base of the heat-dissipating portion.01-14-2010
20100039775THERMAL MANAGEMENT OF ELECTRONIC DEVICES - Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.02-18-2010
20100128439THERMAL MANAGEMENT SYSTEM WITH GRAPHENE-BASED THERMAL INTERFACE MATERIAL - A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like.05-27-2010
20110149520HEAT SINK ASSEMBLY - An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes a locating portion fixed between the second fins of the heat sink, a pair of elastic portions extending outwardly from opposite ends of the locating portion and oriented towards substantially opposite directions, and two hooks extending outwardly from ends of the operating members, respectively. An acute included angle is formed between each elastic portion and the locating portion of the clip in an original relaxed position, and the acute included angles become approximately right angles when the clip is preassembled in the heat sink with the elastic portions abutting the second fins.06-23-2011
20100079957UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFENER FOR THIN CORE PANEL PROCESSING - A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.04-01-2010
20090213554POWER AMPLIFICATION DEVICE AND TRANSMITTER USING IT - A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.08-27-2009
20090213552Component arragement with an optimized assembly capability - The invention relates to a component arrangement comprising: an electronics module (08-27-2009
20090213553Power Module - A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors.08-27-2009
20090168356MEMORY MODULE ASSEMBLY WITH HEAT DISSIPATION DEVICE - A memory module assembly (07-02-2009
20110170265HEAT DISSIPATING DEVICE AND HEAT DISSIPATING SYSTEM - A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.07-14-2011
20090279263SECURING DEVICE FOR ASSEMBLING HEAT DISSIPATION MODULE ONTO ELECTRONIC COMPONENT - A securing device (11-12-2009
20090262505Heat radiator - A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall outward extended therefrom to divide the heat radiator into a first heat-dissipating zone, which consists of a plurality of curved radiation fins outward extended from the contact section toward the two longer sides, and a second heat-dissipating zone, which consists of a plurality of straight or curved radiation fins outward extended from the contact section and the extension wall toward the two shorted sides. These radially outward extended radiation fins not only provide increased heat radiating areas, but also guide airflow produced by a cooling fan to smoothly flow therethrough to carry heat away from the heat radiator in different directions.10-22-2009
20090262504HEAT SINK CLIP AND ASSEMBLY - A clip includes a body, a moveable fastener and an actuating member. The body includes a pressing part, a flat portion and a latching leg. The movable fastener includes a connecting portion, a pivot axis connected at a top end of the connecting portion and an engaging portion. The connecting portion extends through the flat portion. The actuating member defines a guiding groove therein. The guiding groove angles outward to form a height difference along a longitudinal axis of the actuating member between a topmost end and a bottommost end thereof. The actuating member is above the flat portion and connected to the pivot axis of the moveable fastener. The actuating member is levelly moveable relative to the movable fastener so that the pivot axis can slide along the guiding groove to render the moveable fastener vertically moveable between a locked position and a released position.10-22-2009
20090296351MECHANISM TO MAKE A HEAT SINK IN CONTACT WITH A PLUGGABLE TRANSCEIVER, A PLUGGABLE OPTICAL TRANSCEIVER AND A CAGE ASSEMBLY PROVIDING THE SAME - An inventive heat-dissipating mechanism between the pluggable optical transceiver and the heat sink with the thermo-conducting sheet is disclosed. One of the optical transceiver and the heat sink is adhered with the thermo-conducting sheet. The heat sink is assembled with the cage so as to be movable in vertical as causing the downward force. The optical transceiver provides a projection in the surface to be come in contact with the heat sink, while, the heat sink provides a rail with a pocket. When the transceiver is inserted into the cage, the projection first runs on the rail to lift the heat sink upward; subsequently, is fallen within the packet to adhere the thermo-conducting sheet to the transceiver.12-03-2009
20090296350HEAT-DISSIPATING MECHANISM IMPLEMENTED IN CAGE FOR OPTICAL TRANSCEIVER - A mechanism for the heat sink to adhere to the transceiver inserted in the cage is disclosed. The heat sink provides a guide in the side thereof, while, the cage provides a slit in the side. A pair of elastic tabs is diagonally formed in the slit. The transceiver slides the heat sink rearward as the insertion thereof into the cage, then, the guide of the heat sink slips down the rear tab in the slit, which presses the heat sink downward to adhere to the transceiver. The heat conducting path from the transceiver to the heat sink is formed.12-03-2009
20090161318THERMAL MANAGEMENT SYSTEMS AND METHODS - Thermal management systems and methods for electronics. A printed circuit board assembly may include a soldered-in heat sink in communication with inner layers of a printed circuit board for cooling. The heat sink may include a plurality of leads received by plated through-holes in the printed circuit board. The heat sink may include features to augment surface area, as well as features to increase turbulence in a supplied cooling medium for enhanced convection. The heat sink may also include a heat pipe to facilitate cooling. The number, placement and configuration of the heat sinks may be optimized for a particular application to make efficient use of available surface area on the printed circuit board.06-25-2009
20080212284Electronic construction unit and electrical circuit carrier - An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified.09-04-2008
20100110638SEMICONDUCTOR DEVICE - A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element.05-06-2010
20090002950Multi-layer electrically isolated thermal conduction structure for a circuit board assembly - A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.01-01-2009
20110267779LED LIGHTING SYSTEM WITH A THERMAL CONNECTOR - There is described an LED lighting system comprising: at least one light emitting diode (LED); a heat sink thermally connected to the at least one LED for dissipating heat generated by the at least one LED; an electrical connector for electrically connecting the LED lighting system to a power source; and a thermal insulating connector having a first end connected to the heat sink and a second end connected to the electrical connector, the thermal connector comprising a chamber adapted to receive an electronic circuit therein, the electronic circuit being operatively connected to the at least one LED and the electrical connector.11-03-2011
20100128440HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and two first and two second fins mounted on a top surface of the base. The first and second fins are spaced from each other. The first fins are located between the second fins. Each second fin includes a body and a ridge formed at an inner surface of the body. The clip includes a pressing member, two engaging members angling upwardly from opposite ends of the pressing member, and two locking members extending from ends of the engaging members respectively. The pressing member of the clip is sandwiched between the first fins and abuts the top surface of the base. The engaging members of the clip span the first fins and resist the ridges and the second fins respectively.05-27-2010
20090168354Thermally and electrically conductive interconnect structures - An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.07-02-2009
20090168358Power drive unit - A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. With this, the power module can be fastened to the heat sink without incurring layout limitation, degradation of heat release performance and the like. Also, since the power drive unit further includes a projection that protrudes from the press member to be engaged with an engagement hole bored at the center of the spring member, engagement of the projection of the press member with the engagement hole of the spring member functions to prevent displacement of the press member relative to the spring member, thereby making loads acting on the power modules uniform.07-02-2009
20080291636Semiconductor device - The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners.11-27-2008
20080278914Connector with a heat sink - A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being lo disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card.11-13-2008
20090161319Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement - An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.06-25-2009
20090129024INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK - The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board.05-21-2009
20090141453HEAT DISSIPATION DEVICE HAVING A CLIP ASSEMBLY - A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.06-04-2009
20090052140HEAT DISSIPATION DEVICE ASSEMBLY WITH RETAINER DEVICE - A heat dissipation device assembly includes a heat dissipation device mounted on a printed circuit board and a retainer device mounted below the printed circuit board. The retainer device includes a back plate and a crank pivotably mounted to the back plate. The crank includes a pressing portion and a handle for receiving a rotation force. Posts are extended from the heat dissipation device through the printed circuit board to engage with the back plate, thereby to pre-assemble the heat dissipation device on the printed circuit board. The handle is pushed to rotate between a released position and a locked position. In the locked position, the pressing portion extends through the back plate to push the printed circuit board toward the heat dissipation device, whereby an electronic component on the printed circuit board has an intimate contact with the heat dissipation device.02-26-2009
20090219696POWER CONVERSION DEVICE AND FABRICATING METHOD FOR THE SAME - A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.09-03-2009
20090244848Power Device Substrates and Power Device Packages Including the Same - Provided are power device substrates that comprise thermally conductive plastic materials, and power device packages including the same. An exemplary power device package includes a power device substrate that comprises a thermally conductive plastic material, and has a first principal plane that provides an electrically insulating surface and a second principal plane of which at least a portion is exposed outside a molding member. The exemplary power device package further includes one or more power devices disposed on the first principal plane of the power device substrate, and a plurality of conductive members that are electrically connected to the power device(s) in order to electrically connect the power device(s) to an external circuit.10-01-2009
20090237889Power Converter Having Multiple Layer Heat Sinks - A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.09-24-2009
20090237888ELECTRICAL ASSEMBLY AND FASTENING ASSEMBLY THEREOF - An electric assembly includes a heat sink defining a through hole and a notch communicating with the through hole; a circuit board defining a fixing hole; and a fastening assembly. The fastening assembly includes a fastener comprising a stem, a head connected one end of the stem, and a clamp connected to an opposite end of the stem; a limiting member comprising a main body slideably disposed on the stem and a limiting portion extending from the main body, the main body received into the through hole, and the limiting portion engageably inserted into the notch; and an elastic member disposed around the stem and between the head and the main body. Wherein the limiting portion is capable of sliding out of the notch and against the heat sink to compress the elastic member.09-24-2009
20090257195Electronic apparatus - An electronic apparatus in which a circuit substrate is installed in a casing, including: first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively, the heat sink discharging heat from a heat element on the circuit substrate to the outside of the casing; and a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink.10-15-2009
20090316364HIGH FREQUENCY DEVICE - A high frequency device includes an antenna connector adapted to be connected with an antenna, a board, a conductor layer provided on an upper surface of the board, a filter mounted on the upper surface of the board and connected with the antenna connector, and a high frequency circuit mounted on a lower surface of the board and connected with the filter. The filter includes a case having a hollow shape having an opening which opens downward, and a resonator accommodated in the case. The case has a lower end around the opening. The lower end of the case is joined to the conductor layer. The high frequency device has a small size.12-24-2009
20090279264ELECTRONIC DEVICE AND HEAT DISSIPATION UNIT THEREOF - A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.11-12-2009
20100014253Electronic Component Module and Method for Production Thereof - An electronic component module comprising at least one ceramic circuit carrier (01-21-2010
20110128707POWER SEMICONDUCTOR MODULE FOR WIDE TEMPERATURE APPLICATIONS - A power semiconductor module includes an insulating substrate with a conductive circuit layer attached to one side and a baseplate attached to the other side. A power semiconductor device is attached to the conductive circuit layer. The conductive circuit layer and the baseplate are formed of a material with a coefficient of thermal expansion less than about 8.0×1006-02-2011
20100259899PASSIVE COOLING SYSTEM AND METHOD FOR ELECTRONICS DEVICES - An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.10-14-2010
20090109630HEAT SINK ASSEMBLY HAVING A FIXING BASE THEREOF - A heat sink assembly includes a fixing base and a heat sink mounted on the fixing base. The fixing base has a bottom face attached to an electronic component mounted on a printed circuit board. The fixing base includes a pair of hooks extending from a rear side thereof and engaging with a support beam fixed to the printed circuit board. A pair of sleeves extend from a front side of the fixing base and two fasteners are received in the sleeves and threadedly engage with the printed circuit board. The rear and front sides of the fixing base are firmly secured to the printed circuit board, whereby the heat sink mounted on the fixing base can dissipate heat from the electronic component via the fixing base.04-30-2009
20100238632Load driving device - A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced.09-23-2010
20100128441ARC DISCHARGE DEVICE - [Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device.05-27-2010
20090116195HEAT SINK FOR DISSIPATING HEAT AND APPARATUS HAVING THE SAME - A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.05-07-2009
20090073659Heat sink structure for a power supply - A structure comprises a high thermally conductive case with a receiver space for a power module, a thermally conductive part being provided on the case to contact a heating component of the power module in the power supply to induct the heat by the heating component to the case and contact the exterior air through the outside surface of case to dissipate the heat; and a housing the inner surface of which directly contact and cover the outside of high thermally conductive case, a grid-formed structure being formed at most of the region of housing to prevent the heat from scalding the person who touches or takes the power supply. With the large heat dissipation area, the heat is transferred through the external air to increase the efficiency of heat dissipation, and further all power parts may operate in a lower temperature to increase the work efficiency of power supply.03-19-2009
20090323287Integrated Circuit Cooling Apparatus for Focused Beam Processes - A fixture and method are provided for cooling an IC in the performance of focused beam processes. The method provides a holding/cooling fixture with thermal electric (TE) jaws having an IC interface surface and a heatsink interface. An IC die is secured between the IC interface surfaces of the jaws. Electrical energy is supplied to the TE jaws, creating a negative temperature differential between the IC interface and heatsink interfaces. As a result, the IC die is cooled. A focused beam is applied to a local region of the IC die. Some examples of the focused beam include a focused ion beam (FIB), scanning electron microscope (SEM), E-beam, or a laser scanning microscope (LSM). The focused beam heats the local region of the IC, while the bulk of the IC remains cooled. Typically, each TE jaw includes a plurality of TE elements thermally connected in series.12-31-2009
20080310117METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.12-18-2008
20090129025Illumination device comprising a substrate plate and a heat sink - The invention relates to an illumination device (05-21-2009
20100321894HEATSINK MOUNTING SYSTEM - A heatsink mounting system (12-23-2010
20090067134ELECTRONIC DEVICE - According to one embodiment, a heat sink includes an extended end screwed to a printed circuit board. The extended end includes a screw hole and an engagement projection. A notch is formed by cutting the side of the printed circuit board to a position at which the notch does not interfere with signal lines. The notch is engaged with an engagement projection extending from the extended end, thereby preventing the heat sink from rotating when the heat sink is screwed to the printed circuit board.03-12-2009
20090067133HEAT SINK HAVING PROTECTIVE DEVICE FOR THERMAL INTERFACE MATERIAL SPREAD THEREON - A protective device (03-12-2009
20110026226VEHICULAR ELECTRONICS ASSEMBLY - An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive layer conformally molded to the electronic component and disposed between the electronic component and the heat sink.02-03-2011
20110110046REINFORCEMENT FRAME, COMPONENT UNIT, AND DISPLAY - Disclosed is a reinforcement frame (05-12-2011
20110044003Heatsink structure - An improved heatsink structure is disclosed. The present invention provides a type of heatsinks formed by stacking a plurality of particulates, in order to achieve a larger heat-dissipation surface area and higher heat-dissipation efficiency.02-24-2011
20110044004HEAT TRANSFER APPARATUS HAVING A THERMAL INTERFACE MATERIAL - A heat-transfer apparatus includes a heat-producing body, a heat sink adjacent to the heat-producing body, and a thermal interface material that includes a plurality of heat-transfer particles bridging the heat-producing body and the heat sink.02-24-2011
20090034204APPARATUS FOR TRANSFERRING HEAT FROM A HEAT SPREADER - An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact.02-05-2009
20110116237RF PACKAGE - An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper surface of the substrate to tapered lower surfaces of the cover. The cover includes a recess to receive the substrate. The recess includes stress distribution surface areas to engage and press outer edge portions of opposite sides of the substrate against a base plate or heat sink. The tapered lower surfaces of the cover engage with and press against the stepped source leads when securing the RF package to the base plate or heat sink using one or more fasteners or bolts. The cover includes structural features to improve preferential deformation when a mounting force is applied.05-19-2011
20130155620Package - An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.06-20-2013
20110242765SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced.10-06-2011
20090086437ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE - In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.04-02-2009
20090034205HEAT SINK ASSEMBLY WITH A LOCKING DEVICE - A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.02-05-2009
20100039774Power Semiconductor Module And Method For Its Production - A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.02-18-2010
20100053902ELECTRONIC DEVICE WITH CIRCUIT BOARD SUPPORT - An electronic device includes a circuit board comprising a first surface and a second surface, a heat sink positioned on the first surface, and a support positioned on the second surface to support the circuit board. The circuit board includes a pair of first locating holes extending through the first surface and the second surface. The heat sink includes a pair of second locating holes corresponding to the first locating holes. The support includes a pair of locating posts projecting from a pair of diagonal corners thereof and extending through the corresponding first and second locating holes to limit unwanted movement of the heat sink and a shim projecting from a center thereof to prevent the circuit board from flexing. Dimensions of the shim are contoured to provide compensation for bending of the support under an applied load.03-04-2010
20100134979POWER SEMICONDUCTOR APPARATUS - A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof; and a conductive connecting member having the plural external terminals. The surfaces of the power semiconductor units that have the insertion holes of tubular sockets are arrayed in the same direction in the plural power semiconductor units. Electrical wiring connection between the plural power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plural power semiconductor units.06-03-2010
20090027859Surface mounted heat sink and electromagnetic shield - A single-piece, high performance, inexpensively fabricated heat sink and electromagnetic interference (EMI) shield makes thermal contact with a heat generating device. Capillary forces exerted on the heat sink by cooling flowed solder draw the heat sink toward the PCB. The heat sink attaches directly to a printed circuit board (PCB), thus not stressing ball grid array (BGA) solder joints between the heat generating device and the PCB in applications with BGAs. The heat sink does not require any special tools for installation or removal nor any additional PCB space. The heat sink is designed to allow automated surface mounting techniques, such as pick and place. The single-piece construction eliminates the need for a separate clip, thereby increasing heat transfer area.01-29-2009
20110075377Heat Sink Interface Having Three-Dimensional Tolerance Compensation - A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.03-31-2011
20080253091Electronic Device - An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.10-16-2008
20090290309HEAT DISSIPATION DEVICE - A securing device includes a securing member defining a securing hole, and a fastener. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes an inner portion and an outer portion extending horizontally from the inner portion to an outside. A width of the outer portion is smaller than the fixing portion and larger than the main portion. The main portion enters into the inner portion through the outer portion. The fixing portion abuts against a bottom of the securing member. The spring is compressed between a top of the securing member and the head portion. A concave is depressed from the securing member and surrounds the inner portion. A lower portion of the spring is fittingly received in the concave.11-26-2009
20080247139ELECTRICAL CIRCUIT ASSEMBLY FOR HIGH-POWER ELECTRONICS - An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.10-09-2008
20090168357PLASMA DISPLAY APPARATUS - A plasma display apparatus includes a plasma display panel, a chassis having the plasma display panel fixedly mounted on one face thereof, and having reinforcing members disposed as bulges on another face thereof to extend alongside each other, a heat sink fixedly mounted on the reinforcing members extending alongside each other to bridge between the reinforcing members, and a circuit board fixedly mounted on the heat sink to drive the plasma display panel.07-02-2009
20080285236Heat transfer system for a receptacle assembly - A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween.11-20-2008
20080212283Electrical Component - According to one variant, an electrical component is specified, with a substrate (09-04-2008
20080266808Cooling Assembly - A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink.10-30-2008
20080266806ELECTRONIC ASSEMBLY THAT INCLUDES A HEAT SINK WHICH COOLS MULTIPLE ELECTRONIC COMPONENTS - The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection.10-30-2008
20110255247HEAT SINK ASSEMBLY AND ELECTRONIC DEVICE EMPLOYING THE SAME - A heat sink assembly with shielding frame is mounted on a circuit board and includes a heat sink, a shielding frame and a heat transmitting film. The circuit board comprises at least one electronic component and a plurality of latching slots surrounding the electronic component. The heat sink includes a base and a plurality of heat fins extending upwardly from the base. A plurality of slots are defined between the plurality of heat fins. The shielding frame includes a hollow frame, a plurality of latch portions and a plurality of limitation portions. The plurality of latch portions are disposed on one end of the hollow frame and evenly spaced apart from each other. The plurality of limitation portions extend from the other end of the hollow frame. The shielding frame cooperates with the heat sink to shield the electronic component from electromagnetic interference (EMI).10-20-2011
20080253090Ic Component Comprising a Cooling Arrangement - An IC component has a cooling arrangement that is embodied as an electronic housing provided with a cooling body. The IC component is directly disposed on the cooling body in the electronic housing. The invention advantageously provides a cooling arrangement for IC components that enables the IC component to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automotive field.10-16-2008
20100284151Sealed Power Supply and Platform for Military Radio - An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power supply and at least one DC power supply. The AC supply and DC power supply are configured to switch automatically to the DC power supply should the AC power supply fail. The housing of the platform is sealed from the exterior environment with gaskets.11-11-2010
20110134608SEMICONDUCTOR DEVICE - A semiconductor apparatus 06-09-2011
20080218975MOUNTING STRUCTURE WITH HEAT SINK FOR ELECTRONIC COMPONENT AND FEMALE SECURING MEMBER FOR SAME - A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.09-11-2008
20100165576POWER SYSTEM MODULE AND METHOD OF FABRICATING THE SAME - Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.07-01-2010
20090316363AIR VOLUME CONTROL MODULE FOR VEHICULAR AIR CONDITIONING APPARATUS - An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.12-24-2009
20110134607SOLID STATE SWITCH ARRANGEMENT - A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the switch. An example method of arranging a switch includes mounting a gallium nitride based switch relative to a bus bar and communication heat away from the gallium nitride based switch using the bus bar.06-09-2011
20090175005Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module - The support is for fitting on a heat dissipation mass. The support comprises an electrically insulating plate and a heat conductor plate for conducting heat to the heat dissipation mass. In particular, the heat conductor plate is in contact with the electrically insulating plate. The heat conductor plate includes a layer forming a junction with the heat dissipation mass, referred to as its bottom layer, and a layer for stiffening the heat conductor plate, referred to as its intermediate layer. More particularly, the stiffener layer is made of a material of hardness greater than that of the material of the bottom layer.07-09-2009
20100020500HEAT DISSIPATION DEVICE - A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion, and a step between the upper and lower portions. The securing member includes a handling portion and an engaging portion extending downwardly from the handling portion. A pair of flanges are formed on the engaging portion facing the main body and abutting the step. A clearance is defined between the flanges and the engaging portion receiving the upper portion. One of the engaging portion and the one locking member forms an engaging hole, and the other one forms a hook engaging into the engaging hole.01-28-2010
20100020499ELECTRONIC CHIP MODULE - Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.01-28-2010
20110051374IMAGE CAPTURING DEVICE - An image capturing device a circuit base, an image sensor, a cooling member, and an elastic member. The image sensor is disposed on the circuit base. The circuit board defines a first opening covered by the image sensor. The elastic member is interposed between the circuit board and the cooling member. The elastic member comprises a bulged elastic flange running through the first opening and compressively abutting against the image sensor and the circuit board and an elastic arm bent towards the cooling member and elastically abutting against the cooling member.03-03-2011
20110051373 CAGE HAVING A HEAT SINK DEVICE SECURED THERETO IN A FLOATING ARRANGEMENT THAT ENSURES THAT CONTINUOUS CONTACT IS MAINTAINED BETWEEN THE HEAT SINK DEVICE AND A PARALLEL OPTICAL COMMUNICATIONS DEVICE SECURED TO THE CAGE - A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.03-03-2011
20120307454LED backlit sign - An illuminated sign includes a plurality of straight fin heat sinks framed together; a plurality of LED plates framed together, each LED plate comprising a plurality of LEDs arranged in rows on a front surface, and a plate heat sink on a rear surface, the plate heat sinks being in contact with the straight fin heat sinks; and an LCD panel mounted in front of the LED plates by framing.12-06-2012
20110116238HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS - A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure.05-19-2011
20120039044ELECTRONIC DEVICE AND HEAT DISSIPATION APPARATUS OF THE SAME - A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.02-16-2012
20110063802ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.03-17-2011
20120044649HEAT DISSIPATION DEVICE - A heat dissipation device is used for heat dissipating for an electronic element. The heat dissipation device includes a heat sink and a buffer arranged between the heat sink and the electronic element. The buffer is made of elastic and thermally conductive material.02-23-2012
20120002371ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - An electronic device includes an enclosure, a circuit board disposed within the enclosure, a heat sink, and a thermally conductive member. A heat-generating electronic component is fixed to the circuit board. The heat sink is in contact with the heat-generating electronic component. Two ends of the thermally conductive member are respectively fixed to the enclosure and the heat sink.01-05-2012
20120014067HEAT SINK FOR POWER CIRCUITS - The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.01-19-2012
20120206881SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES - Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.08-16-2012
20100008046THERMAL DISSIPATION HEAT SLUG SANDWICH - In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing.01-14-2010
20090135564DIGITAL MICROMIRROR DEVICE MODULE - A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The DMD element is electrically connected to the circuit board. The soft elastic pad is disposed on the first surface of the circuit board and surrounds the through hole. The heat dissipation pad passes through the through hole and contacts the DMD element. The soft elastic pad is sandwiched between the circuit board and the heat sink, the heat dissipation pad is sandwiched between the heat sink and the DMD element, and the heat sink contacts the soft elastic pad and the heat dissipation pad, so as to apply a force to the soft elastic pad and the heat dissipation pad.05-28-2009
20120300405ELECTRONIC CONTROL DEVICE - The invention relates to an electronic control device (11-29-2012
20110090649TILT-TYPE HEAT-DISSIPATING MODULE FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND DECREASING LENGTH OF SOLDER PIN - A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The substrate unit has a heat-dissipating body disposed on the circuit substrate, and one part of a top surface of the heat-dissipating body is a first inclined plane. The heat-dissipating unit has a plurality of heat-dissipating fins connected to the heat-dissipating body. The electronic unit has a plurality of electronic elements disposed on the first inclined plane of the heat-dissipating body. Each electronic element has a plurality of pins bent downwards from a bottom thereof in order to electrically connect to the circuit substrate, and heat generated by the electronic elements is transmitted to external environment by matching the heat-dissipating body and the heat-dissipating fins.04-21-2011
20100290193Stacked-chip packaging structure and fabrication method thereof - A stacked-chip packaging structure includes chip sets, a heat sink, a substrate, a circuit board, and solder balls. The chip sets are stacked together, each of which has a heat-dissipation structure and a chip. The heat-dissipation structure has a chip recess, through holes arranged in the chip recess, and an extending portion extending from the chip recess. The chip disposed in the chip recess has bumps. Each bump on the chip is correspondingly disposed in one of the through holes of the heat-dissipation structure. The extending portion of the heat-dissipation structure of each chip set contacts that of the neighboring chip set. The heat sink and the substrate are disposed at two opposite sides of the chip sets, respectively. The circuit board is below the substrate. The solder balls are between the circuit board and the substrate.11-18-2010
20100309633ELECTRONIC CIRCUIT COMPOSED OF SUB-CIRCUITS AND METHOD FOR PRODUCING THE SAME - To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.12-09-2010
20120127667HEAT SINK PACKAGE AND METHOD OF MANUFACTURING - A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.05-24-2012
20120127666Heat-Radiating Substrate and Method Of Manufacturing The Same - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.05-24-2012
20100208430HEAT DISSIPATION ARRANGEMENT FOR COMMUNICATION CHASSIS - A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.08-19-2010
20100208431Patterned Composite Structures and Methods of Making the Same - The present disclosure relates to a patterned surface composite structure. The structure includes a first material having a specific coefficient-of-thermal-expansion and a second material having a different coefficient-of-thermal-expansion. The first material can be patterned with specific features and the second material may be located between those features, thereby forming areas having a coefficient-of-thermal-expansion between that of the first and second materials. A thermally emissive device, such as a laser diode, may be attached to a surface of the patterned composite structure.08-19-2010
20110182034COMPOSITE COVER WITH INTEGRAL HEAT SINK - A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.07-28-2011
20090059532ELECTRONIC SYSTEM WITH A HEAT SINK ASSEMBLY - An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.03-05-2009
20090059533HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component.03-05-2009
20090116194Circuit Module and Manufacturing Method Thereof - A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.05-07-2009
20100271784HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two arms extending slantwise and upwardly from opposite ends of the pressing portion, two connecting portions extending outwardly from the two arms, two securing portions engaging with the printed circuit board, and two operating portions. When the two operating portion are operated, the connecting portions are rotated and the securing portions rotate with the connecting portions to engage with the printed circuit board.10-28-2010
20090027857Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry - The invention includes a heat spreader having a base which has a perimeter surface surrounding a heat-receiving region. A frame portion interfaces the perimeter surface and has an opening traversing a thickness of the frame. The invention includes a method of forming a heat spreader construction by forming a base portion having a perimeter region surrounding a heat-receiving surface. An independent frame portion is joined to the base portion. The invention includes integrated circuitry having a heat spreader construction in thermal communication with a heat-generating device. The heat spreader has a base having a heat-receiving surface and a perimeter surface which interfaces a frame portion. The invention includes methodology for forming integrated circuitry which includes providing an integrated circuitry board having a heat generating device mounted thereon, and providing a multi-part heat spreader in thermal communication with the heat-generating device.01-29-2009
20090016026Switching device with two controlled phases - In a switching device with two controlled phases, in which each phase is associated with a respective printed circuit board assembly with at least one component to be cooled on a heat sink, the heat sink has a T-shaped cross section transversely with respect to its extent direction. In at least one embodiment, the printed circuit board assemblies are arranged on both sides of the center limb of the heat sink, with the components of the two printed circuit board assemblies facing one another and resting on in each case one side of the center limb.01-15-2009
20130170145THERMAL CONNECTOR - A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.07-04-2013
20100328897HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY - A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.12-30-2010
20090168355HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base.07-02-2009
20120268894SOCKET AND HEAT SINK UNIT FOR USE WITH REMOVABLE LED LIGHT MODULE - A socket and heat sink unit for use with a removable LED light module includes separate socket and heat sink portions that are coupleable to each other. The socket can releasably couple to a removable LED light module. The heat sink can couple to the socket and extends about a central axis. The heat sink includes a plurality of fin members that extend outward from a central core portion. At least two adjacent fin members define a channel therebetween at the junction of the fin members to the central core portion. The channel can receive a fastener therein to couple the socket to the heat sink. An extrusion process can be used to manufacture the heat sink portion, and to form one or more fastener holes in the heat sink portion sized to receive one or more fasteners to fasten the heat sink portion to the socket portion.10-25-2012
20100232113HEAT DISSIPATION DEVICE WITH FASTENER - An electronic device comprises a printed circuit board, an electronic component mounted on the printed circuit board, a heat dissipation device dissipating heat generated by the electronic component and a plurality of wires on the printed circuit board. The heat dissipation device comprises a heat sink and a pair of fasteners securing the heat sink to the printed circuit board. Each fastener comprises a frame body having a gap defined at a top portion thereof. The wires in a form of a wire harness extend through the gap of the frame body and into the frame body.09-16-2010
20100172102SOLDERLESS HEATSINK ANCHOR - A heatsink may be releasably secured to a substructure of an electronic system, such as a circuit board, in engagement with a heat-generating component, such as a processor. One embodiment provides an anchor that includes an anchor body, a hook coupled to the anchor body, a pair of flexible retention prongs extending from the anchor body in a common direction and spaced for insertion into openings on a circuit board, an optional pair of stabilization prongs extending from the anchor body adjacent to the flexible retention prongs, each having a width greater than the adjacent flexible retention prong, a barb disposed at the end of each prong and configured for retaining the anchor body on the circuit board upon insertion of the prongs into the openings on the circuit board, a spring integrated with the anchor body and having a free end spaced from the barbs a distance of less than the thickness of the circuit board, and a stop integrated with the anchor body for limiting the amount of insertion of the prongs beyond an initial contact of the free end of the spring with the circuit board. A heatsink clip releasably secures the heatsink to the hook of the anchor.07-08-2010
20120140417HOUSING FOR AN ON-BOARD ELECTRONIC CARD - A housing (06-07-2012
20110157833RETENTION MODULE FOR TOOLLESS HEAT SINK INSTALLATION - An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.06-30-2011
20130021753STRUCTURE FOR FIXING ELECTRIC PART FOR MOTOR-DRIVEN COMPRESSOR - An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed.01-24-2013
20100091462ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME - A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board (04-15-2010
20080225491System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices - System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.09-18-2008
20130141871POWER MODULE FOR ELECTRIC POWER STEERING AND ELECTRIC POWER STEERING DRIVE CONTROL APPARATUS USING THE SAME - An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (06-06-2013
20130170144ELECTRONIC DEVICE WITH HEAT SINK MECHANSIM - An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat sink mechanism includes at least one first conducting portion secured to an end of the heat sink holes, for dissipating heat produced by the electronic component away from the electronic device.07-04-2013
20080218974Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier - A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease.09-11-2008
20130094149STRUCTURE FOR MOUNTING HEAT SINK, AND HEAT SINK MOUNTED USING THE STRUCTURE - A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.04-18-2013
20110267780THERMAL DISSIPATOR UTILIZNG LAMINAR THERMAL TRANSFER MEMBER - A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.11-03-2011
20080198554Cooling Assembly - A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a location remote from the electronic component. A heat sink is mounted to the circuit board at the distant location. The heat sink has at least one groove formed on an underside thereof. The heat sink is mounted so that is overlies the heat pipe and the heat pipe is introduced into the groove, thereby securing the heat pipe between the heat sink and the circuit board.08-21-2008
20100302737POWER ELECTRONICS POWER MODULE WITH IMBEDDED GATE CIRCUITRY - A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.12-02-2010
20100309634Thermal Interface with Non-Tacky Surface - A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.12-09-2010
20100309632MOTHERBOARD WITH MOUNTING HOLES - A motherboard includes a printed circuit board, and a heat generating component mounted on the printed circuit board. A plurality of mounting holes is defined in the printed circuit board for mounting a heat sink apparatus on the heat generating component. At least a ground via is defined in the printed circuit board and adjacent to each of the mounting holes. The heat sink apparatus is capable of electrically contacting the ground via, and the ground via is capable of reducing electromagnetic interference of the motherboard and grounding static electricity on the heat sink apparatus.12-09-2010
20100315787System and Method for Dissipating Heat from Semiconductor Devices - A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes.12-16-2010
20100315786SEMICONDUCTOR DEVICE - A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.12-16-2010
20100315785ELECTRONIC EQUIPMENT - An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board.12-16-2010
20100315784FASTENING CLAMP - The invention relates to a fixing element (12-16-2010
20120281363HEAT SPREADER FOR ELECTRICAL COMPONENTS - A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.11-08-2012
20120092832ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS - A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.04-19-2012

Patent applications in class Heat sink

Patent applications in all subclasses Heat sink