| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361705000 | By specific coating | 31 |
| 20100085713 | LATERAL GRAPHENE HEAT SPREADERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICES AND CIRCUITS - A device and associated method of heat removal from electronic optoelectronic and photonic devices via incorporation of extremely high thermally conducting channels or embedded layers made of single-layer graphene (SLG), bi-layer graphene (BLG), or few-layer graphene (FLG). | 04-08-2010 |
| 20110194254 | POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS - Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices. | 08-11-2011 |
| 20090122490 | Heat Sink Having Enhanced Heat Dissipation Capacity - A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer. | 05-14-2009 |
| 20130077249 | OVERMOLDED IN-LINE PHOTOVOLTAIC CURRENT REGULATING AND HEAT SINK DEVICE - An overmolded in-line photovoltaic current regulating and heat sink device includes one or more diode elements connected at one or more leads to coils of electrically conductive material. The coils serve a dual purpose; they act as heat sinks to draw heat away from the diode and conduct it to the outside environment; and they act as inductor coils to regulate current through the device. These coils can either be of air core or ferromagnetic core construction. On the opposite end of the diode leads, the coils are connected to either a wire lead protruding from the device or a terminal housed in a connector. The entire assembly is encapsulated in a thermoplastic, thermoset, or combination thereof that maintains intimate thermal contact with the diode and coils. The device may include one or more fuse elements in place of, or in addition to, the one or more diode elements. | 03-28-2013 |
| 20090009973 | Nanotube-Based Fluid Interface Material and Approach - A thermal interface material ( | 01-08-2009 |
| 20100296253 | METHOD OF FORMING CARBON PARTICLE-CONTAINING FILM, HEAT TRANSFER MEMBER, POWER MODULE, AND VEHICLE INVERTER - A method of depositing a carbon particle-containing film that contains carbon particles includes: manufacturing film deposition slurry by mixing liquid into film deposition powder that contains carbon powder formed of the carbon particles; and depositing the carbon particle-containing film by spraying the film deposition slurry to a surface of a base material so that the liquid is vaporized. | 11-25-2010 |
| 20100124023 | METHOD FOR PLATING FILM ON A HEAT DISSIPATION MODULE - A method for plating film on a heat dissipation module includes the steps of: cleaning the heat dissipation module; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby plating an adherent film on the heat dissipation module; injecting hydrocarbon gas together with the hydrogen and tetra-methylisilane gases into the working chamber, thereby plating a mixed film on the adherent film; and injecting the hydrogen and tetra-methylisilane gases together with hydrocarbon gas into the working chamber, thereby plating a noncrystalline DLC film on the mixed film. | 05-20-2010 |
| 20100124024 | ELECTRONIC SUBSTRATE DEVICE - This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member ( | 05-20-2010 |
| 20120106085 | VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE - A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate. | 05-03-2012 |
| 20090296349 | COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME - According to one embodiment, a component-embedded printed circuit board includes an opening for member fixation provided on part of a peripheral edge of an outer layer side of the first substrate, a metal member for heat radiation laminated to outer layer side, except for the opening for member fixation, of the first substrate with an insulating layer therebetween, a through-hole penetrating the first and second substrates and communicating with the opening for member fixation, and a through-hole conductor provided on an internal wall of the through-hole. | 12-03-2009 |
| 20080304238 | ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM - The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material. | 12-11-2008 |
| 20080225490 | Thermal interface materials - In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a low indium content. | 09-18-2008 |
| 20110228481 | THERMALLY CONDUCTIVE INTERFACE MEANS - A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together. | 09-22-2011 |
| 20120195004 | Porous Thermoplastic Foams as Heat Transfer Materials - Interconnected, open-celled porous or microporous polymeric foams are used for the preparation of heat transfer devices. The use of such porous polymeric foams can generate a turbulent flow within a heat exchanging liquid, thus enabling increased heat transfer to and from the fluid. The present disclosure provides devices having a heat transfer element containing a heat exchange region wherein a heat exchange fluid can be circulated through a porous polymeric foam; and method for making and using such devices. | 08-02-2012 |
| 20110228482 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-22-2011 |
| 20100254092 | DEVICE AND METHOD FOR MITIGATING RADIO FREQUENCY INTERFERENCE - Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced. | 10-07-2010 |
| 20090040727 | Circuit Carrier Structure with Improved Heat Dissipation - A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end of a joining area into the recess and fixed in place with a layer of heat-conducting cement and connected to the component in a heat-conducting manner. Further the die has on its other side a linkage area, whose cross-sectional area is at least in part of larger dimensions than the recess in the circuit carrier and whose end is connected to a heat sink in a heat-conducting manner. | 02-12-2009 |
| 20110242764 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer. | 10-06-2011 |
| 20110063801 | ELECTRONIC DEVICE WITH A HEAT INSULATING STRUCTURE - An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for preventing heat generated by the heat source from directly transmitting toward the enclosure, and a space being formed between the heat insulating plate and the enclosure. The heat insulating structure further includes a thermal conductive layer disposed on a side of the heat insulating plate facing to the heat source. The heat insulating structure further includes the thermal conductive layer disposed on a side of the heat insulating plate facing to the enclosure. Therefore, the heat insulating plate can be for altering heat current generated by the heat source so as to dissipate the heat current via holes on the enclosure uniformly. | 03-17-2011 |
| 20080198553 | ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE COMPONENT AND MEMBER - A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution. | 08-21-2008 |
| 20110176276 | CTE-MATCHED HEAT PIPE - Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices. | 07-21-2011 |
| 20110188206 | THERMAL INTERFACE - Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device. | 08-04-2011 |
| 20100020497 | SUBSTRATE STRUCTURE - It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure | 01-28-2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-30-2010 |
| 20100309631 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material. | 12-09-2010 |
| 20080298021 | Notebook computer with hybrid diamond heat spreader - Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value. | 12-04-2008 |
| 361706000 | Containing silicon or aluminum | 5 |
| 20090262503 | Control Device - A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts. | 10-22-2009 |
| 20090116193 | STRUCTURE AND MANUFACTURING METHOD OF SUBSTRATE BOARD - A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn. | 05-07-2009 |
| 20100302736 | HEAT RADIATION STRUCTURE OF ELECTRIC APPARATUS - A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member. | 12-02-2010 |
| 20110255246 | METHOD FOR MANUFACTURING A RIGID POWER MODULE SUITED FOR HIGH-VOLTAGE APPLICATIONS - Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:
| 10-20-2011 |
| 20110096505 | PACKAGE SUBSTRATE - A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover. | 04-28-2011 |
