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Thermal conduction

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361688000 - With cooling means

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361707000 Through support means 388
361720000 For printed circuit board 186
361717000 For active solid state devices 177
361715000 For module 57
361714000 Through component housing 39
361705000 By specific coating 34
361722000 For electronic circuit 14
361723000 For lead frame 1
20100091464HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATING STRUCTURE BASE BOARD, AND METHOD FOR MANUFACTURING HEAT DISSIPATING STRUCTURE BASE BOARD - The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.04-15-2010
Entries
DocumentTitleDate
20110199732ELECTRONIC SUBSTRATE DEVICE - This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member (08-18-2011
20090201646RETAINING DEVICE - A retaining device is used to press a heat conducting plate to in contact with a heat-generating element disposed on a circuit board. The retaining device includes a bracket, a plurality of elastic members, and a plurality of fasteners. The bracket is disposed on a side surface of the circuit board while the bracket and the heat conducting plate are spaced by the circuit board. One end of the elastic members is disposed on the bracket. The fasteners pass through the heat conducting plate, the circuit board, and the bracket in sequence, so as to be fixed to the elastic members, such that the heat conducting plate is pressed by the elastic members to be continuously contact with the heat-generating element.08-13-2009
20090195986Sectional modular heat sink - A sectional modular heat sink is formed from a plurality of stacked modular heat radiating units, each of which is provided on one side along each longitudinal edge with an upright ridge portion having two inclined sidewalls, at least one of which being provided with a groove; and on an opposite side with a channel corresponding to the ridge portion to have two inclined sidewalls, at least one of which being provided with a flange corresponding to the groove on the ridge portion. A plurality of the modular heat radiating units may be sequentially stacked and connected through engagement of the ridge portions and the grooves on a first modular heat radiating unit with the channels and the flanges on a second modular heat radiating unit, respectively, and thereby form a sectional modular heat sink.08-06-2009
20090195985THERMAL MODULE ASSEMBLY - A thermal module assembly is applied to dissipate heat energy released from a lighting assembly when working, and comprises a plurality of heat-dissipating fins being chain-connected and a fixing ring. The heat-dissipating fins are radially extended from a central region, and each heat-dissipating fin comprises a fin body, a chain-connected mechanism and an extended folded plate. The chain-connected mechanism is located on an inner side of the fin body for chain-connecting the neighbor heat-dissipating fin, and the extended folded plate is located on an outer side of the fin body. The fixing ring hitches the outer side of each heat-dissipating fin, and the fixing ring is formed with a plurality of positioning folded plates along an inner ring edge thereof, so as to fix the extended folded plate and keep any two neighboring heat-dissipating fins in a unit pitch distance.08-06-2009
20080310115Metal screen and adhesive composite thermal interface - An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.12-18-2008
20080259569THERMALLY ENHANCED BATTERY MODULE - A thermally enhanced battery module including a casing, at least a cell and a heat dissipation fin is provided. The casing has at least an opening, and the cell and the heat dissipation fin are both disposed in the casing. The cell has a contact surface, and the heat dissipation fin has an inner surface and an outer surface. Part of the inner surface contacts the contact surface of the cell. The outer surface has a plurality of notches and contacts the casing. At least one notch is exposed through the opening. The heat generated by the cell is capable of being dissipated by the heat dissipation fin and the opening in the invention to avoid overheating or decreasing the charging or discharging efficiency.10-23-2008
20090122489Electronic control device and method of manufacturing electronic control device - Provided is an electronic control device, including: a housing (05-14-2009
20100118495HEAT TRANSPORT ASSEMBLY - The invention relates to a heat transport assembly comprising a first part being a plastic part and a second part, and having a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m-K.05-13-2010
20100073881SMART CARD HEAT SINK - A heat sink for a smart card, the heat sink having a contact plate having a contact surface, a riser extending upward from the contact plate, and a hook extending upward from the contact plate and located opposite the riser is disclosed. A smart card socket having a frame having a slot for receiving a smart card, the slot being defined by at least one wall, and a smart card heat sink at least partially abutted to the at least one wall is also disclosed. Finally, a method of transferring heat energy away from a smart card, comprising the steps of associating a smart card heat sink with a smart card socket and positioning at least a portion of the smart card heat sink between at least a portion of a smart card and at least a portion of the smart card socket is disclosed.03-25-2010
20130077248ELECTRONIC DEVICE WITH HEAT DISSIPATING ASSEMBLY - An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.03-28-2013
20130033821CAGE ASSEMBLY FOR RECEIVING A PLUGGABLE MODULE - A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.02-07-2013
20130033822IMAGE ACQUISITION APPARATUS AND IMAGE ACQUISITION SYSTEM - An image acquisition apparatus includes an imaging optical system configured to form an image of a subject, an imaging unit including an image sensor configured to capture the image of the subject formed by the imaging optical system, a cooler thermally connected to the image sensor, and a heat-transfer reduction unit with an opaque portion located between the imaging optical system and the imaging unit, wherein the opaque portion includes an aperture through which incident light to the image sensor passes.02-07-2013
20100046168Heat dissipating device - A heat dissipating device includes a plurality of heat dissipating fins are sequentially connected together to form a continuous and cascaded heat dissipating fin set. The heat dissipating fin set having an outward radial shape. The heat dissipating fins comprise at least one local arc shape. Surfaces of the heat dissipating fins having projections and depressions to enlarge a heat dissipating area. Edges of the fins are formed with curved surface corners to prevent an operator from being cut and hurt.02-25-2010
20100020496ELECTRONIC DEVICE CONTAINING A THERMALLY CONDUCTIVE SHEET - Provided is an electronic device comprising a thermally conductive sheet including a methacrylic polymer, a thermally conductive filler containing aluminum hydroxide in an amount of at least 10% by volume of the thermally conductive sheet, a combination of a phenolic antioxidant and a sulfur based antioxidant in an amount sufficient to impart thermal stability to the thermally conductive sheet, and a heat radiator.01-28-2010
20130027886THERMAL CONDUCTORS IN ELECTRONIC DEVICES - In one implementation, an electronic device includes a first body portion, a second body portion movably coupled to the first body portion, a heat source, and a thermal conductor in thermal communication with the heat source. The heat source is disposed within one of the first body portion or the second body portion. The thermal conductor has a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion. The first end portion of the thermal conductor is disposed within the first body portion. The second end portion of the thermal conductor is disposed within the second body portion.01-31-2013
20090091889Power electronic module having improved heat dissipation capability - A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.04-09-2009
20120182691INTEGRATED DEVICE OF HEAT DISSIPATION UNIT AND PACKAGE COMPONENT AND A FASTENING STRUCTURE FOR THE SAME - The integrated device of a heat dissipation unit and a package component includes a non-insulation type package component, an insulation sheet, a heat dissipation unit, a fastener, a washer and a sleeve. The non-insulation package component has a metal tab with a through hole. The insulation sheet is provided with a via hole and attached on one side of the metal tab. The heat dissipation unit is provided with a tapped hole corresponding to the through hole. The sleeve includes a narrow portion penetrating the via hole and through and a wide portion sandwiched between the insulation sheet and heat dissipation unit. When the fastener penetrates into the through hole of the metal tab and the via hole of the insulation sheet and screws into the tapped hole, the fastener will pass through the sleeve without contact with the insulation sheet due to the protection of the narrow portion in the via hole.07-19-2012
20130050945Electronic Device Enclosures with Engagement Features - An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.02-28-2013
20090091890Heat-dissipating structure for an optical isolator - A heat-dissipating structure for an optical isolator is capable of suppressing an increase in temperature caused by light absorption in a magnetic garnet crystalline film by radiation fins extending from the inside of an external heat conducting cover. The heat-dissipating structure for the optical isolator is formed by housing a magnetic garnet crystalline film (04-09-2009
20090091888EMI SHIELDING AND HEAT DISSIPATING STRUCTURE - The present invention discloses an EMI shielding and heat dissipating structure for dissipating heat generated by a chip inside a portable electronic device. The EMI shielding and heat dissipating structure includes an EMI shielding housing for shielding the chip. A first opening is formed on the EMI shielding housing. The EMI shielding and heat dissipating structure further includes a thermal pad disposed on the chip, and an EMI shielding gasket installed on the EMI shielding housing. A second opening is formed on the EMI shielding gasket and located in a position corresponding to the first opening. The EMI shielding and heat dissipating structure further includes a heat-dissipating component installed on the EMI shielding gasket and connected to the thermal pad for dissipating the heat transmitted from the thermal pad.04-09-2009
20090016025THERMALLY CONDUCTIVE EMI SHIELD - Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink.01-15-2009
20130063898Heat-conducting system between two component parts and method for preparing a heat-conducting system - A heat-conducting system has a heat-generating first component part and a second component part for dissipating the heat of the first component part, the two component parts being situated in operative connection to each other using a heat-conducting medium. The heat-conducting medium includes metal constituents, particularly metal ions, which are situated in a carrier material, especially in a polymer matrix; and the heat-conducting medium at an end state has dendrites made of the metal constituents, which are connected to the contact surfaces of the two component parts in a heat-conducting manner.03-14-2013
20130163204DISPLAY DEVICE AND ASSEMBLY METHOD THEREOF - A display device includes a rear bezel, a display panel and at least two heat dissipation sheets. The display panel is disposed on the rear bezel. The display panel includes at least one power line having an extension direction. The heat dissipation sheets are disposed between the rear bezel and the display panel. The heat dissipation sheets have at least one seam formed therebetween. The at least one seam is substantially parallel to the extension direction of the at least one power line.06-27-2013
20090237885HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. The clip includes a pressing body, two bending portions slantwise to the pressing body and extending from two opposite ends of the pressing body, and two locking arms extending from two ends of the bending portions. The pressing body of the clip abuts against the top surface of the base. The bending portions are extended downwardly from the pressing body to be located adjacent to two sides of the base to prevent the clip from moving horizontally along a lateral direction of the heat sink.09-24-2009
20090231814Protective cap for thermal grease - A protective cap for thermal grease of a heat sink includes a sheet member having a main concavity recessed downward from a center thereof; and four corner concavities recessed downward from four corners located a periphery of the main concavity respectively. Each of at least two of the corner concavities has an interference hole formed at a bottom sidewall thereof. The interference holes are to be interference fit with respective screw bolts located at the bottom side of the heat sink to fasten the sheet member, whereby the thermal grease located at a bottom side of the heat sink can be covered for protection.09-17-2009
20090016024MOTHERBOARD - A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.01-15-2009
20090009972HEAT DISSIPATION MODULE - A heat dissipation module is disclosed. The heat dissipation module suitable to dissipates heat generating by for a heat source, and multiple fixing parts are disposed around the heat source. The heat dissipation module includes a heat sink, two first rods, and two second rods corresponding to the first rods. The first rods and the second rods are pivotally provided on the heat sink. Each first shaft rod is suitable to rotate about a first axis. Two hooks of each first rod fasten the fixing parts easily. Each second rod is suitable to rotate about a second axis and leans against the heat sink. Thus, each second rod tightly fits with each first rod, and two hooks of each first rod tightly fasten the fixing parts. The heat sink is forced by the first rods, and the heat sink and the heat source abut against each other tightly.01-08-2009
20090009971Fixing structure - A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.01-08-2009
20090009970Control device housing for an electronic brake - A control device housing for an electronic brake system includes a lid, a housing part closable by the lid, a component support member for electronic components, and a cooling element that is in direct or indirect thermal contact with at least part of the electronic components. The cooling element may be either a planar additional cooling plate or a lid that is at least partly made of metal. The cooling element and the component support member are spaced from each other, and thin heat conductive elements are arranged in the resulting intermediate space between the cooling element and the electronic components that are to be cooled or the component support member. The heat conductive elements are configured flexibly for tolerance compensation and inhere good heat conductivity in addition.01-08-2009
20120099279HEAT TRANSFER APPARATUS FOR USE WITH ELECTRICAL DEVICES - An electrical device includes an enclosure having an interior surface, at least one bus bar, and an element enclosing at least a portion of the bus bar, wherein the element includes a first surface contacting the interior surface and is configured to transfer heat from the bus bar to the enclosure and configured to provide electrical isolation between the enclosure and the bus bar.04-26-2012
20110149518HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS - An electronics module designed to efficiently remove heat from enclosed circuit boards via one or more configurable heat conduits. Each heat conduit is custom-configured to provide good thermal contact between the corresponding heat-generating electronic device of an enclosed circuit board and the clamshell housing that encloses the circuit board. Good thermal contact between the clamshell housing and the outer case of the electronic module facilitates efficient heat transfer to the finned exterior surface of the outer case, where the heat is dissipated into the ambient environment via thermal conduction, natural convection, forced convection, and/or thermal radiation. Depending on the topology of the circuit board and the individual characteristics of the electronic device to be cooled, the corresponding configurable heat conduit might be based on a nested heat-sink coupler, a fitted movable plug, or a flexible ribbon-shaped heat pipe.06-23-2011
20120099280IC Thermal Management System - The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.04-26-2012
20110299251LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.12-08-2011
20110299250WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate 12-08-2011
20110299249HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS - An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms.12-08-2011
20130215574POWER LINE COMMUNICATION APPARATUS - A communication apparatus performs communication through a power line. The communication apparatus includes an electrical power plug which is capable of connecting to the power line and provides the communication apparatus with a power supply. The communication apparatus also includes a power line communication unit which performs communication through the power line, and a heat radiator which radiates heat generated from the power line communicator, wherein the heat radiator is disposed at a location where is not to overlap the power plug.08-22-2013
20110292609LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.12-01-2011
20100265661HEAT SINK OF AT LEAST ONE ELECTRONIC COMPONENT - The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on the first cooling body section, between the cooling body and the at least one component.10-21-2010
20100008044Flat Display Apparatus - A flat display apparatus includes a display unit; a housing configured to accommodate the display unit; a support member configured to support the housing; and a cooling device configured to radiate heat of a heating element which is mounted in the housing, wherein the cooling device includes a first far infrared ray transfer member which is thermally connected to the heating element in the housing and a second far infrared ray transfer member which is thermally connected to an external portion of the housing at a rear surface side, wherein a radiating surface of the first far infrared ray transfer member and an absorbing surface of the second far infrared ray transfer member are disposed to oppose to each other with the housing interposed therebetween, and wherein heat radiated from the first far infrared ray transfer member is radiated at both plane surface of the second far infrared ray transfer member.01-14-2010
20090129023THERMAL MODULE ALLOWING ADJUSTMENT IN THE HEIGHT OF HEAT SINK RELATIVE TO FIXING RACK - A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with a plurality of stoppers and a plurality of projected portions located adjacent to the stoppers with a height difference existed between them. The heat sink is provided along an outer periphery with a plurality of vertically extended grooves. The heat sink may be selectively fitted in the fixing rack with the grooves corresponding to or not corresponding to the projected portions on the fixing rack, so that an upper surface of the heat sink may be upward abutted on the upper stoppers or the projected portions, respectively, to restrict the fixing rack from sliding downward. Meanwhile, due to the height difference between the stoppers and the projected portions, a distance between the upper surface of the heat sink and the fixing rack is adjustable.05-21-2009
20090310310Heat sink, electronic device, and method of manufacturing electronic device - A heat sink includes a base including a first surface and a second surface facing away from each other, the base being configured to have the first surface thermally connected to a heat generator; and multiple radiation fins extending from the second surface of the base, the radiation fins being reduced in length in accordance with a decrease in the temperature of the base due to the heat conducted from the heat generator, the radiation fins being shaped to bend outward.12-17-2009
20090207569PORTABLE ELECTRONIC APPARATUS - A portable electronic apparatus includes a first unit, a second unit, and a hinge unit. The first unit includes a first housing, a heat generating component inside the first housing, a first heat diffusing member disposed inside the first housing and diffusing heat from the heat generating component, and a heat dissipating part dissipating heat diffused by the first heat diffusing member to the outside of the first housing. The second unit includes a second housing, a second heat diffusing member disposed inside the second housing and diffusing heat inside the second housing, and a heat receiving part conducting heat from the heat dissipating part to the second heat diffusing member upon the heat receiving part being in contact with the heat dissipating part.08-20-2009
20090279261ELECTRONIC APPLICANCE PROVIDED WITH A COOLING ASSEMBLY FOR COOLING A CONSUMER INSERTABLE MODULE, AND COOLING ASSEMBLY FOR COOLING SUCH MODULE - The invention relates to an electronic appliance (11-12-2009
20090201647Heat dissipation device - A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.08-13-2009
20090279262HEAT DISSIPATING STRUCTURE - A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.11-12-2009
20090284927HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.11-19-2009
20120293959HEAT TRANSFER ELEMENT TEMPERATURE VARIATION SYSTEM - A heat transfer element temperature variation system is disclosed. In one embodiment, the system includes: a heat transfer element configured to thermally couple to an insulating fluid within an electrical device; an ambient temperature sensor; and a control system coupled to the heat transfer element and the ambient temperature sensor, the control system for instructing the heat transfer element to adjust a temperature of the insulating fluid within the electrical device based upon a temperature indicator from the ambient temperature sensor.11-22-2012
20100103621LAMP BASE HAVING A HEAT SINK - A lamp base having a heat sink is connected to a bulb having two electrodes. The lamp base includes a heat sink, a first electrically conductive piece, a second electrically conductive piece, and leads. The heat sink comprises a heat-dissipating base formed with a trough for accommodating the bulb therein. The first electrically conductive piece is fixed in the trough and is electrically connected to an electrode of the bulb. The second electrically conductive piece is fixed in the trough and is electrically connected to the other electrode of the bulb. The second electrically conductive piece is electrically insulated from the first electrically conductive piece. The leads are electrically connected to the first electrically conductive piece and the second electrically conductive piece respectively. With the heat sink dissipating the heat generated by the bulb, the lamp base has extended lifetime.04-29-2010
20080239673APPARATUS FOR TRANSFERRING HEAT BETWEEN TWO CORNER SURFACES - An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side.10-02-2008
20110267778Apparatus for Supplying Voltage to a Motor Vehicle Having Optimized Heat Dissipation - A voltage supply apparatus for a motor vehicle, especially a passenger car, truck or a motorcycle, includes a storage cell arrangement having one or more electrochemical storage cells and/or double layer capacitors that are mounted on top of each other. The storage cell arrangement is releasably connected in a form-fitting way to a heat-conducting cooling device that removes heat from the storage cells and/or double layer capacitors such that at least some of the storage cells and/or double layer capacitors of a respective storage cell group can each be thermally connected with the heat-conducting cooling device.11-03-2011
20110205709SANDWICH STRUCTURE WITH DOUBLE-SIDED COOLING AND EMI SHIELDING - A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current.08-25-2011
20100128438HEAT DISSIPATION MODULE - A heat dissipation module suitable for a heating element includes a heat dissipation unit and a cooling unit. The heat dissipation unit includes a body suitable for being contacted with the heating element and a heat dissipation fins set connected to the body. The cooling unit has a cooling surface and a heating surface, and is disposed on the heat dissipation fins set by the cooling surface.05-27-2010
20080291631Illumination unit - There is described an illumination unit with a planar carrier part having a plurality of light-emitting semiconductor components, in particular high-power light-emitting diodes, arranged on both sides of a main surface. On each side of the carrier part a heat sink is provided in each case. Each of the semiconductor components is connected in an efficient heat-conducting manner to a heat sink provided on an opposite side of the carrier part by way of a heat conducting means that is fed through an opening in the carrier part. At least one reflector is embodied on each heat sink having a reflective surface which concentrates the emitted light from a semiconductor component which is arranged on the side of the carrier part facing this heat sink.11-27-2008
20080273308MAGNETICALLY COUPLED COOLING BLOCK - A cooling mechanism comprises a first cooling block and a second cooling block. At least one of the first and second cooling blocks comprises a magnet to retain at least one of the blocks in place when cooling a heat-producing component.11-06-2008
20080247138Electronic device and recording medium - In an electronic device whose source of electric power is a fuel cell and which has a heat radiator that radiates heat by evaporating water generated in accordance with electric power generation of the fuel cell, there are provided a use condition detector that detects use condition of the electronic device, a heat radiation suppression discriminator that discriminates whether to suppress heat radiation by the heat radiator based on use condition detected by the use condition detector, and a heat radiation suppression controller that controls to suppress heat radiation by the heat radiator as a result of the discrimination by the heat radiation suppression discriminator.10-09-2008
20080266804THERMALLY CONDUCTIVE GREASE - The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D10-30-2008
20090190311ELECTRONIC ELEMENT PACKAGING - An electronic element packaging is provided, the unit is formed with a colloid layer in a predetermined shape, and a chipset is adhered and mounted inside the colloid layer and comprises a predetermined chip and a conductor so that the unit is packaged without any substrate, thereby the costs of substrate use and design being decreased when the unit is fabricated. No consideration of the difference of heat expansion coefficient of the chip from that of substrate is made, thereby the reliability being increased and the service life being prolonged.07-30-2009
20100271780DEVICE FOR REDUCING THERMAL STRESS ON CONNECTION POINTS - The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device 10-28-2010
20090185350APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF LIGHT EMITTING DIODES - An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.07-23-2009
20090141452APPARATUS FOR DIRECTING HEAT TO A HEAT SPREADER - An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat sink. The heat spreader is oriented such that the thermal conductor propagates heat along a length of the heat sink. A heat channel composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat spreader. The heat channel is oriented to propagate heat towards the heat spreader.06-04-2009
20080316710Power Converter Device - A power module having three unit power modules and a control circuit board including a gate drive circuit are set up side by side and mounted on a heat exchanger. A pair of positive and negative direct current terminals for connecting the smoothing capacitor and a plurality of alternating current terminals for inputting and outputting polyphase alternating current are integrally-molded into a power module case of the power module. A plurality of control pins for providing switching devices mounted on the unit power modules with control signals are set up on the opposite side of the side where the direct current terminals and the alternating current terminals are set up, which is figured as located in the right of the drawing. The control pins of the switching devices of the unit power modules and the gate signal output terminals of the control circuit board are wire-bonded. The smoothing capacitor is mounted on the side or top of the power module.12-25-2008
20080316709Thermally Conductive Electrical Structure and Method - An electrical structure and method of forming. The electrical structure includes a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally conductive structure in mechanical contact with a first portion of the first thermally conductive film layer, and a first thermal energy extraction structure formed over the first thermally conductive structure. The first thermal energy extraction structure is in thermal contact with the first thermally conductive structure. The first thermal energy extraction structure is configured to extract a first portion of thermal energy from the first electrical component through the first thermally conductive film layer and the first thermally conductive structure.12-25-2008
20090251864METHOD FOR INTEGRATING HEAT TRANSFER MEMBERS,AND AN LED DEVICE - Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: 10-08-2009
20090251863MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axis pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.10-08-2009
20110141694DISPLAY PANEL AND IMAGE DISPLAY APPARATUS - A display panel includes an airtight casing and a thermally conductive member. A thermal conductivity of the thermally conductive member in a longitudinal direction of spacers is higher than a thermal conductivity of the thermally conductive member in a direction in which the spacers are provided side by side, and the thermal conductivity of the thermally conductive member in the direction in which the spacers are provided side by side is higher than a thermal conductivity of the thermally conductive member in a thickness direction.06-16-2011
20090080160HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.03-26-2009
20090213548THERMALLY CONDUCTIVE PERIODICALLY STRUCTURED GAP FILLERS AND METHOD FOR UTILIZING SAME - A method for conducting heat between a heat source and a heat sink includes disposing under a compressive force therebetween a plurality of thermally conducting unit cell structures that mechanically cooperate to form thereby a body structure having an aggregate thermal conductivity that changes in response to a compressive force exerted thereon, wherein an amount of said plurality of thermally conducting unit cell structures disposed therein is selectable to affect thereby a desired aggregate thermal conductivity in response to the compressive force.08-27-2009
20090213550ELECTRONIC DEVICE - According to one embodiment, an electronic device comprises a circuit component, a heat sink configured to dissipate heat generated by the circuit component to the outside, and a first heat transfer sheet and a second heat transfer sheet that are arranged adjacent to each other between the circuit component and the heat sink and have thermal conductivity for thermally connecting the circuit component to the heat sink. The second heat transfer sheet has a rigidity greater than that of the first heat transfer sheet and is provided with through-holes. The first heat transfer sheet has a thermal conductivity and an elasticity greater than those of the second heat transfer sheet, and is pushed into the through-holes to thermally connect the circuit component to the heat sink.08-27-2009
20090097207Heat Removal From Electronic Modules - An electronics assembly for an underwater well installation, comprises a housing; an electrical module located within the housing; and a resiliently deformable member located between the electrical module and the housing for conducting heat between the electrical module and the housing.04-16-2009
20090257194Electronic apparatus - An electronic apparatus includes a chassis and a heat sink. The heat sink configures one of side walls of the chassis. The heat sink has inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis. The heat sink has a guide portion guiding a drop of water adhered to the heat sink to the outer wall side.10-15-2009
20080259568Display device and electronic apparatus - A display device includes: a frame that holds a display panel having a thin member and a light source that irradiates the display panel with light; and a cover that covers the frame. The display device further includes: a heat sink situated in the central portion in the width direction of the display panel in the frame and extending in and out of the frame; and a heat dissipation component provided in the cover and being in contact with the heat sink at a position outside the frame.10-23-2008
20100157538THERMAL INTERFACE MATERIAL AND METHOD OF USING THE SAME AND ELECTRONIC ASSEMBLY HAVING THE SAME - An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.06-24-2010
20120188720HEAT DISSIPATING STRUCTURE FOR HEATING ELEMENT - A heat dissipating structure for heating element includes a heating element having a heat generating element for generating heat by being driven, and a first plate member and a second plate member bonded to one surface of the heating element so as to be stacked together. The first plate member has a cutout portion opened to penetrate therethrough and is bonded to the heating element so as to block the cutout portion, the second plate member has a protruding portion fitted to the cutout portion of the first plate member, the protruding portion being structured to penetrate through the cutout portion to be bonded to the heating element, and a modulus of longitudinal elasticity of a material constituting the first plate member is larger than a modulus of longitudinal elasticity of a material constituting the second plate member.07-26-2012
20100157536HEAT RADIATING MEMBER MOUNTING STRUCTURE - A heat radiating member mounting structure for enabling multiple heat radiating members to be fastened together in a stack without tools is disclosed. Each heat radiating member has convex portions and lugs formed on each of two upright side flanges at two sides of a flat base thereof such that multiple heat radiating members can be fastened together by means of engaging protruding portions of the lugs of one heat radiating member into locating grooves in the convex portions of another heat radiating member.06-24-2010
20100188819COOLING ARRANGEMENT FOR CONDUCTOR IN ELECTRICAL INSTALLATION - Cooling arrangement for an electrically conductive element in an electrical installation. A casting body (07-29-2010
20090109626APPARATUS AND METHOD PROVIDING METALLIC THERMAL INTERFACE BETWEEN METAL CAPPED MODULE AND HEAT SINK - An apparatus and method for creating a metallic thermal interface is shown for connecting an electronic module to a heat sink. Using an interface metal such as indium or malleable indium alloys, which have superior heat transfer capability, but are subject to oxidization and degraded thermal transfer capability; a layer of interface material is confined in a recess in the heat sink base into which the module cap is received. The thermal interface region is then evacuated to bring the module top surface and recess major surface into intimate contact and sealed along the interface of the module and recess side walls to exclude air from the metallic interface region.04-30-2009
20100157537FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation units are connected together with their axes along length directions thereof being parallel to each other. Each of the heat dissipation units can resiliently deform to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink.06-24-2010
20090109627HEAT SINK RETAINING CLIP FOR AN ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly is provided that includes a guide frame having an internal compartment configured to receive an electrical component. The guide frame extends a length between a plug end portion having a plug opening and a rear end portion opposite the plug end portion. The guide frame includes a first wall that extends between the rear end portion and the plug end portion. The first wall includes a heat sink retention area that is configured to receive a heat sink. The rear end portion includes a rear wall. A clip is configured to be mounted on the guide frame. The clip is configured to extend over and engage at least a portion of the heat sink when the heat sink is received by the heat sink retention area. The clip is configured to engage the rear wall of the guide frame and extend along at least a portion of the first wall of the guide frame.04-30-2009
20110110044HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE - A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.05-12-2011
20100238631SECURING DEVICE AND THERMAL MODULE INCORPORATING THE SAME - A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.09-23-2010
20110058335DEVICES HAVING A THERMAL INTERFACE AND METHODS OF FORMING THE SAME - A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.03-10-2011
20100254091FIXATION STRUCTURE FOR CONNECTOR OF IN-VEHICLE CONTROLLER - A connector fixation structure includes: a connector having a rectangular connector body, protrusions protruding from facing sides in a wing like manner, and a terminal embedded in and protruding from the connector body; a heat sink having a plate shape body, a through hole and columnar convexities; and a printed board. The bottom of the connector is inserted into the through hole of the heat sink. Each columnar convexity is disposed on the plate shape body at a predetermined position corresponding to the protrusion. The top of the connector contacts a first surface of the printed board, and each columnar convexity is fixed to the printed board via the corresponding protrusion with a first screw.10-07-2010
20100296252INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF - Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.11-25-2010
20100321890Avionics Chassis - An avionics chassis comprises a housing having opposing walls, a pair of spaced card rails with one rail mounted to each of the opposing walls where each rail has a channel to define an effective slot having a predetermined height extending between the rails. The avionics chassis also includes a circuit card assembly comprising a printed circuit board and a thermal plane in overlying relationship with the printed circuit board, with the printed circuit board defining a first primary plane, and the thermal plane defining a second primary plane. The spatial relationship between the printed circuit board and the thermal plane is such that the first and second primary planes are located within the slot when the circuit card assembly is mounted to the card rail assembly and the thermal plane is conductively coupled to at least one of the rails to form a first conductive path from the thermal plane to at least one of the opposing walls and the printed circuit board is conductively coupled to at least one of the rails to form a second conductive path from the printed circuit board to at least one of the opposing walls.12-23-2010
20090161317PORTABLE HAND HELD MULTI-SOURCE POWER INVERTER WITH PASS THROUGH DEVICE - A portable hand held power inverter/converter having a pass through device for simultaneously sourcing A.C. and multiple voltage D.C. power consuming devices through a single D.C. power source connection. Inverter and converter circuitry is provided to invert and convert D.C. voltage to an A.C. voltage source and a lower DC voltage. A.C. electrical outlets are provided to facilitate a connection to an external A.C. power-consuming device and a DC outlet to a lower volt DC power-consuming device. The pass through device provides an independent and simultaneous connection to an additional D.C. outlet that would otherwise be eliminated when occupied by the inverter thus allowing simultaneous connection and operation of both A.C. and multi source D.C power consuming devices through a single external D.C. power outlet of a single D.C. power source.06-25-2009
20110002103Interlocking Structure For Memory Heat Sink - An interlocking structure is arranged on two separable heat dissipating plates that together form a memory heat sink, and includes two elongated flanges, at least two locating tabs, at least one catch tab, at least one expanded head portion, at least one retaining slot in a number corresponding to the expanded head portion, and at least one stopper. Two sets of the interlocking structure are diagonally symmetrically provided near two opposite ends of the two heat dissipating plates. Once the expanded head portions have been extended through the retaining slots and the two heat dissipating plates are outward turned relative to each other, the locating tabs and the expanded head portions will firmly hook to the stoppers and the catch tabs, respectively, without the risk of separating from the retaining slots due to turning open or close, vibrating, or impacting of the two heat dissipating plates.01-06-2011
20100177481HEAT SINK PROTECTIVE COVER - A heat sink protective cover includes a main body, on which at least one receiving space is defined for receiving a heat sink therein. The receiving space includes at least one positioning section and a dust-proof section. The positioning section is located at two opposite inner wall surfaces of the receiving space. The dust-proof section includes a raised portion and a recess portion, the raised portion is extended along a periphery of the dust-proof section to limit the recess portion on four sides thereof, and the dust-proof section is located on a bottom of the receiving space. The heat sink is stably hold in place in the receiving space by the positioning section and isolated from dust by the dust-proof section, and can therefore be effectively protected against collision, damage, and contamination while being transported.07-15-2010
20100172101THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A thermal interface material includes a carbon nanotube array having a plurality of carbon nanotubes, a matrix, and a plurality of heat conductive particles. The carbon nanotube array includes a first end and a second end. The first and second ends are arranged along longitudinal axes of the carbon nanotubes. The matrix is formed on at least one of the first and second ends of the carbon nanotube array. The heat conductive particles are dispersed in the matrix, and the heat conductive particles are thermally coupled to the carbon nanotubes.07-08-2010
20110044002METHOD FOR ARRANGING COOLING FOR A COMPONENT AND A COOLING ELEMENT - In the method according to the invention, the discrete electric component to be cooled is connected to the cooling element without a circuit board or substrate. In the method, a layer of insulating material is thermally sprayed on one surface of the cooling element. The connection points and conductors required by the discrete electric component are formed on top of this insulating layer. The discrete electric component is glued onto the insulating layer. Subsequently, the electrical connections for the discrete component are made. After the discrete component has been electrically connected, it can still be protected using a layer of thermally sprayed insulating material.02-24-2011
20090034200HEAT SINK ASSEMBLY HAVING A FASTENER ASSEMBLY FOR FASTENING THE HEAT SINK TO AN ELECTROINC COMPONENT - A heat sink assembly for dissipating heat from an electronic component (02-05-2009
20110116236HEAT CONDUCTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENTS - A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.05-19-2011
20110128706ELECTRONIC APPARATUS - An electronic apparatus 06-02-2011
20130155618ELECTRONIC MODULE - An electronic module including a supporting frame, a handle, an electronic device, and a heat dissipating member is provided. The handle assembled to the supporting frame is open or closed relative to the supporting frame. The electronic device is detachably assembled on the supporting frame. The heat dissipating member detachably assembled to the handle moves relative to the supporting frame with the handle. When the handle is closed relative to the supporting frame, the electronic device is fixed on the supporting frame by the handle, and the heat dissipating member leans against the electronic device. When the handle is opened relative to the supporting frame, the heat dissipating member is far away from the electronic device.06-20-2013
20110242762ELECTRONIC APPARATUS INCLUDING ELECTRONIC COMPONENT SERVING AS HEAT-GENERATING SOURCE - An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components. The electronic apparatus comprising a substrate, an electronic component mounted thereon, a heat-dissipating member for releasing heat generated by the electronic component to the outside, a heat-conducting sheet having flexibility, a first portion thereof being in contact with a rear surface of the electronic component between the substrate and the electronic component, a second portion thereof being in contact with the heat-dissipating member, a hard member disposed between the first portion of the heat-conducting sheet and the substrate, a material of the hard member being harder than that of the heat-conducting sheet, and a pressing unit disposed between the hard member and the substrate and configured to press the heat-conducting sheet against the rear surface of the electronic component.10-06-2011
20110128705HEAT SINK ASSEMBLY, PORTABLE ELECTRONIC DEVICE USING SAME AND WIRELESS MODEM USING THE HEAT SINK ASSEMBLY - A heat sink assembly, a portable electronic device using the same and a wireless modem using the heat sink assembly are disclosed. The heat sink assembly assembled within the portable electronic for dissipating the heat source generated within the portable electronic device to the outside. The heat sink assembly includes a frame, a cover and an absorbing sheet. The frame includes a through opening formed and surrounded thereby. The cover foldably or bendably extends outwardly from one side of the frame and is configured to be alternatively accommodated within the opening of the frame for covering the opening or forming an angle relative to the frame. The absorbing sheet is fixedly covered on the other side of the frame opposite to the cover.06-02-2011
20090086435HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×1004-02-2009
20110242763ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device includes: an element substrate and an opposing substrate disposed so as to oppose each other; liquid crystals encapsulated and sealed between the two substrates; a display region that displays an image by modulating incident light based on image information; a heat dissipation member disposed opposing a second surface of the element substrate, the second surface being on the opposite side as the opposing substrate; and a thermal conductive member disposed between the element substrate and the heat dissipation member. The dimension from the end portion of where the thermal conductive member and the element substrate make contact with each other to the end portion of the display region on the second surface of the element substrate is greater than the thickness of the element substrate.10-06-2011
20090244847MOUNTING DEVICE FOR CHIPS - A mounting device for chips has a heat sink and at least one clamp. The heat sink has at least one conductive side, two ends, multiple chip units and two connecting bases. The chip units are arranged on the at least one conductive side. The connecting bases are formed on the ends of the heat sink. The at least one clamp is mounted across the at least one conductive side of the heat sink and has two ends, a middle sheet, multiple pressing tabs and two connecting arms. The pressing tabs extend from the middle sheet to press the chip units against the conductive side of the heat sink. The connecting arms are formed respectively on the ends of the clamp and are mounted respectively on the connecting bases.10-01-2009
20090034202HEAT-DISSIPATING MODULE - A heat-dissipating module suitable for dissipating heat for a heat-generating element is provided. The heat-dissipating module includes a heat-dissipating base, a cooling fan having a case and a blades assembly disposed in the case, a heat pipe and a thermoelectric converter. The heat-dissipating base is disposed on the heat-generating element, and the case has an air inlet and an air outlet. The heat pipe is connected between the heat-dissipating base and the cooling fan, and the heat pipe has a first end connected to the heat-dissipating base and a second end disposed in the case adjacent to the air outlet. The thermoelectric converter is disposed on the second end, and the thermoelectric converter is suitable for converting a temperature difference between the second end and an environment near the air outlet into output electrical energy.02-05-2009
20090034201OPTOELECTRONIC DEVICE WITH UPCONVERTING LUMINOPHORIC MEDIUM - A microelectronic device that in operation generates or includes component(s) that generate heat, in which the device comprises a heat conversion medium that converts such heat into a light emission having a shorter wavelength than such heat, to thereby cool the device and dissipate the unwanted heat by such light output. The heat conversion medium can include an upconverting luminophoric material, e.g., an anti-Stokes phosphor or phosphor composition. The provision of such heat conversion medium enables thermal management of microelectronic devices, e.g., optoelectronic devices, to be achieved in an efficient manner, to prolong the operational service life of devices such as LEDs, laser diodes, etc. that are degraded in performance by excessive heat generation in their operation.02-05-2009
20090034199HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.02-05-2009
20090034198APPARATUS AND METHOD FOR ATTACHING HEATSINKS - An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.02-05-2009
20100053900HEAT DISSIPATION STRUCTURE AND VEHICULAR INVERTER - A heat dissipation structure is equipped with a heating element; a substrate, on which the heating element is provided; and a heat dissipation member that is in contact with the substrate via thermally conductive grease. The substrate and the heat dissipation member have contact surfaces that are in contact with each other, and at least one of the contact surfaces has a first contact region on which the thermally conductive grease is disposed, and a second contact region that surrounds the first contact region. A surface roughness of the second contact region is lower than a surface roughness of the first contact region.03-04-2010
20110249405HEAT DISSIPATING MEMBER, ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS - A heat dissipating member is formed so as to be opposed to a reflection type liquid crystal panel. The heat dissipating member includes a heat receiving portion that is opposed to a reflection type light modulation element and has a heat receiving surface for receiving heat from the element, a heat dissipating fin that dissipates heat received on the heat receiving portion to the outside. The heat receiving portion has heat receiving convexes which project to the side at which the element is arranged from the heat receiving surface, and the convexes are formed such that ratios of areas of tip surfaces of the heat receiving convexes with respect to a unit area are larger on a center portion of a heat reception acceleration region rather than on an end of the heat reception acceleration region.10-13-2011
20110075374RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.03-31-2011
20110249404MOUNTING APPARATUS AND MOUNTING ASSEMBLY FOR HEAT DISSIPATING COMPONENT - A mounting apparatus includes a support, a first lever and a second lever. A first pair and a second pair of positioning portions are located on the support. A first hook portion and a second hook portion are located on the support and bent towards each other. The first and second levers are rotatably secured to the positioning portions. The first lever includes a first pressing portion located between the first pair of the positioning portions. The second lever includes a second pressing portion located between the second pair of the positioning portions. The first and second levers are disengaged from the first and second hook portions when in an unlocked position, and engaged with the first and second hook portions when in a locked position. The first and second pressing portions are capable of pressing retaining portions of a heat dissipating component.10-13-2011
20100259898ELECTRIC POWER CONVERTER - An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.10-14-2010
20120069523SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE - A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.03-22-2012
20080310114HEAT-TRANSFER DEVICE FOR AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD USING CONDUCTIVE BRISTLES - In one embodiment, an apparatus for electronic equipment has a bristle pad having an anchor end and a free end, wherein the bristle pad has a plurality of flexible bristles each having an anchor end corresponding to the anchor end of the bristle pad and a free end corresponding to the free end of the bristle pad. The bristle pad is adapted to be placed between an electronic component and an electromagnetic interference (EMI) shield for the electronic component, wherein the EMI shield provides EMI shielding for the electronic component. The plurality of flexible bristles are adapted to provide a conductive thermal path between the electronic component and the EMI shield, and one or more of the flexible bristles are adapted to flex when the RF shield is attached to a circuit pack.12-18-2008
20080285235SYSTEM FOR THERMAL CONDUCTION INTERFACING - A system is disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the system includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a system would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the system would be modular, reusable, and easy to install or replace without a significant mess.11-20-2008
20090021915Multi-layer heat-dissipating device - A multi-layer heat-dissipating device is provided. The multi-layer heat-dissipating device does not use fans, absorbs heat energy sequentially with heat-conducting elements and a heat-dissipating metal sheet, and effectively blocks heat radiation of a heat-generating element, so as to achieve the effects of power saving, no noise, and less occupied space.01-22-2009
20100328896ARTICLE INCLUDING THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION - An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.12-30-2010
20080218973Apparatus, system and method for use in mounting electronic elements - The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one lateral side surface. A recess is formed in the first surface and extends into the casing. A plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.09-11-2008
20100067196HEAT SINK ASSEMBLY FOR A PLUGGABLE MODULE - A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred between the recessed position and the elevated position.03-18-2010
20090213549HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.08-27-2009
20110216506HEAT SINK BUCKLE - A heat sink buckle is provided. The heat sink buckle includes a frame and a side plate. The frame includes a plurality of frame sides. The side plate is substantially perpendicular with the frame, and is configured extending from one of the frame sides. A central portion of the side plate is jointly connected to the frame side. The side plate includes a pressing member and a fixing member. The pressing member is positionally higher than the frame side and the fixing member is positionally lower than the frame side. The fixing member has an inner side surface. The fixing member includes a clasp extruded from a bottom edge of the inner side surface of the fixing member. When the pressing member is inwardly pressed, the fixing member is outwardly widened, and when the pressing member is released, the fixing member recovers to the original position.09-08-2011
20120307453ELECTRONIC DEVICE WITH HEAT PIPE CHAMBER COVER FOR DISSIPATING HEAT - An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.12-06-2012
20110304989SUBSTRATE UNIT AND ELECTRONIC DEVICE - According to one embodiment, a substrate unit includes an electronic circuit substrate which includes a first width dimension portion, and a second width dimension portion continuous with the front direction side of the first width dimension portion. A first concave portion is formed on the first direction side of the first width dimension portion and a second concave portion is formed on the second direction side of the first width dimension portion in the electronic circuit substrate. The substrate unit includes a heat sink which includes a first side frame portion fixed to the first width dimension portion from the first concave portion, a second side frame portion fixed to the first width dimension portion from the second concave portion, and a sink main body portion continuous from the first side frame portion to the second side frame portion.12-15-2011
20100254090MULTI-LAYER MESH WICKS FOR HEAT PIPES - Methods for fabricating heat pipes and heat pipes therefrom are provided. The heat pipe (10-07-2010
20130010428FIXING SPRING AND HEAT SINK STRUCTURE FOR ELECTRONIC COMPONENT - A fixing spring for fixing an electronic component to a heat sink member includes a seat part that extends in a horizontal direction, a holding part that is provided to extend from one of two first sides of the seat part that face each other toward the horizontal direction of the first sides and that presses the electronic component onto the heat sink member, a leg part that is provided to extend substantially perpendicularly downwardly from one of two second sides of the seat part that face each other, a leg part body that extends from the leg part, and a claw part that is provided at a tip end of the leg body. The holding part biases the electronic component downwardly and thereby fixes the electronic component on the heat sink member when the claw part is engaged with the engagement hole.01-10-2013
20110096504Organic Electronic Components - There is made available a substrate base and a cover element and also disposed at least partially between the substrate base and the cover element: a first electrode, an organic layer system which has at least one layer consisting of at least partially an organic material, and a second electrode. There are disposed at least partially between the substrate base and the cover element: a drying agent layer, which contains a dry material and also a thermally conductive material, and a thermally conductive layer, the drying agent layer and the thermally conductive layer being coupled to each other thermally.04-28-2011
20120113595Method of Making an Electronic Device - An electronic device includes an electronic component with a mating surface. A thermal interface sheet is attached to the mating surface. A substrate carries the electronic device and includes a face. The electronic component is secured to the substrate with the thermal interface sheet positioned between the mating surface and the face. The mating surface is relatively less flat than the face and the mating surface is relatively smoother than the face.05-10-2012
20120057303HEAT VALVE FOR THERMAL MANAGEMENT IN A MOBILE COMMUNICATIONS DEVICE - A thermal valve for controlling heat transfer between two electronic components is disclosed. The thermal valve includes a first thermally conductive strip that is secured to the first electronic component and a second thermally conductive strip that is secured to the second electronic component. The first strip and the second strip are located between the two electronic components. The first strip changes its shape toward making contact with the second strip in response to a temperature increase of the first electronic component, and the second strip changes its shape away from making contact with the first strip in response to a temperature increase of the second electronic component. Other embodiments are also described and claimed.03-08-2012
20120155030MOLDED PART FOR ACCOMMODATING MULTIPLE ELECTRICAL COMPONENTS - A molded part is provided for accommodating multiple electrical components and for fastening to an electrical assembly, the molded part including at least one heat sink for cooling an electrical component to be cooled, the molded part being provided to be electrically nonconductive.06-21-2012
20120155029ADAPTIVE THERMAL GAP PAD - The present invention relates to a thermal gap pad for transferring heat from a heat-supplying component such as an electronic device, and more specifically to a thermal gap pad with reduced compressive loading. In one embodiment, a thermal assembly includes a heat-supplying component, a cooling structure, a gap pad having a first surface, and a lubricant provided along the first surface of the gap pad. The lubricant has a viscosity of about 500 cP or less. The gap pad is compressed between the heat-supplying component and the cooling structure, such that the first surface of the gap pad is in thermal contact with the cooling structure.06-21-2012
20100172100FLAT PANEL DISPLAY - A flat panel display including a base frame, a display panel module, and a heat-conductive structure is provided. The base frame includes a control unit. The display panel module is disposed in the base frame and includes a back bracket, a first heating element, and a second heating element. The first heating element and the second heating element are disposed in the back bracket and electrically connected to the control unit. A first distance is formed between the back bracket and the base frame to define a first air passage, a second distance is formed between the back bracket and the base frame to define a second air passage, and the first distance is shorter than the second distance. The heat-conductive structure is disposed in the first air passage, and the position of the heat-conductive structure is corresponding to the position of the first heating element.07-08-2010
20120120607FLEXIBLE CIRCUIT ASSEMBLIES WITH STACKED FLEX INTERCONNECTS AND CONNECTOR ASSEMBLIES HAVING THE SAME - A flexible circuit assembly including a pair of mating panels. Each of the mating panels has an engagement face and a power contact. The circuit assembly also includes adjacent first and second flex interconnects that mechanically and electrically couple the mating panels. The first and second flex interconnects extend alongside each other and have respective interior surfaces. The first and second flex interconnects are stacked with respect to each other such that the interior surfaces face each other and define a heat-dissipating interspace therebetween. The circuit assembly also includes a plurality of power conductors that extend through the first and second flex interconnects between the mating panels. The power conductors are electrically parallel to one another between the power contacts. At least one of the power conductors extends proximate to the interior surface of one of the first and second flex interconnects.05-17-2012
20120120608PRINTED CIRCUIT BOARD WITH HEAT SINK - A printed circuit board includes a heat sink and a circuit board. The heat sink includes four magnetic poles extending from four corners of a bottom of the heat sink. The circuit board includes a heat-generating component and four magnetic holders corresponding to the magnetic poles. Each magnetic holder defines an inserting hole to receive a corresponding magnetic pole. The heat sink is fixed on the circuit board and the heat-generating component contacts to the bottom of the heat sink in response to the magnetic poles being inserted into the inserting holes of the magnetic holders.05-17-2012
20120120606PRINTED CIRCUIT BOARD WITH HEAT SINK - A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.05-17-2012
20100246131HEAT SINK AND MOTHERBOARD ASSEMBLY UTILIZING THE HEAT SINK - A heat sink for dissipating heat for a motherboard, includes a package portion, a heat dissipating device made of heat conducting material, and a number of grounding pins made of heat conducting material. The package portion includes a top wall. The heat dissipating device is exposed out of the top wall of the package portion. The number of grounding pins extending down through the package portion, to be soldered to a number of bonding grounding pads of a corresponding idle chip installing area of the motherboard, respectively. Top portions of the grounding pins contact the heat dissipating device. A motherboard assembly utilizing the heat sink is also disclosed.09-30-2010
20100246132FASTENER AND HEAT SINK ASSEMBLY HAVING THE SAME - A heat sink assembly is mounted on a printed circuit board to dissipate heat generated by an electronic component. The heat sink assembly includes a heat sink and a plurality of fasteners fixing the heat sink to the printed circuit board. The fastener includes a head, a post extending downwardly from the head through the heat sink, an elastic member encircling the post and compressed between the head and the heat sink, and an engaging member fixed to the printed circuit board. A top of the engaging member is fastened to a bottom of the post. When the post, together with the head, is rotated relative to an axis thereof toward a locked position, the post would be driven by the engaging member to automatically lock with the engaging member at the locked position.09-30-2010
20100246130Translating Hinge - A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.09-30-2010
20120127665HEAT SINK ASSEMBLY FOR A PLUGGABLE MODULE - A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder extends from the end surface of the heat sink. A thermal interface material (TIM) layer extends on the module side of the heat sink. The TIM layer is configured to engage the pluggable module. The TIM layer includes an end that is engaged between the end surface and the holder of the heat sink.05-24-2012
20120162919HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component, includes two heat dissipating boards attached to two opposite lateral sides of the electronic component, respectively, and an elastic member securing the heat dissipating boards on the electronic component. Each of the heat dissipating boards includes a heat absorbing body, two heat dissipating arms extending upwardly from the heat absorbing body, and a plurality of fins extending outwardly from each of the heat dissipating arms.06-28-2012
20100208429Thermally Conductive Composition - A composition for use as a thermally conductive composition in a heat-generating electronic device is provided. The composition comprises physically treated fillers modified with a surface area modifying agent and one or more resins.08-19-2010
20090059530BOLSTER PLATE ASSEMBLY FOR PRINTED CIRCUIT BOARD - A bolster plate assembly for a printed circuit board includes a first structure member, a second structure member rotatably mounted to the first structure member, and a plurality of locking members. Two spaced, elongated sliding slots are defined in the first structure member. Two spaced, elongated sliding slots are defined in the second structure member. The locking members are slidably attached in the sliding slots of the first and second structure members.03-05-2009
20090059529ELECTRONIC MODULE PACKAGING - An electronic module packaging system and an electronic module packaging apparatus are disclosed. The electronic module packaging system includes an exterior packing box, an electronic module packaging apparatus, and antistatic packing foam holding the electronic module packaging apparatus within the exterior packing box. The electronic module packaging apparatus includes a top component made of an antistatic material, and a bottom component made of a conductive material. The bottom component includes multiple support members to hold an electronic module in a stable position. The top component and the bottom component may be coupled with multiple securing clips.03-05-2009
20120236502SHEET-SHAPED STRUCTURE, METHOD FOR MANUFACTURING SHEET-SHAPED STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.09-20-2012
20120314370TRANSLATING HINGE - A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.12-13-2012
20100271781Cooling System, Cold Plate and Assembly Having a Cooling System - A cooling system comprising a heat sink having, a first contact zone and a second contact zone, which are configured to absorb, a first heat flow from a first component, a second heat flow from a second component, and a first transmission means for transmission of the first heat flow via the first contact zone into the heat sink. In addition, a first transmission means is arranged between the first component, and the heat sink and include a first plug means that is shaped such that the first plug means forms a first fit with a first bushing means that is arranged in the heat sink, where the first fit provides tolerance compensation between first and second contact zones.10-28-2010
20120218712SPRING FIXTURE FOR ELECTRONIC COMPONENT AND HEAT SINK STRUCTURE - A spring fixture includes a base, first and second holding parts extending in opposite lateral directions from the base, and a height registration part extending downwardly from the base relative to the lateral directions. The heat sink member has a height adjustment hole at a location corresponding to the height registration part. The height registration part is inserted through the height adjustment hole so that electronic components are fixed to a heat sink member by the first and second holding parts. A distance between the base and the heat sink member can be changed by varying a size of the height adjustment hole to accommodate varying heights of the electronic components. Therefore, the spring fixture can be used for various types of the electronic components with different heights without changing the designs and manufacturing methods for the spring fixture.08-30-2012
20120257355BALANCED COOLING SYSTEM AND METHOD FOR HIGH-DENSITY STACKED CAGES - Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.10-11-2012
20120229984THERMAL MODULE FOR SOLAR INVERTER - A thermal module for mounting to and using with a solar inverter includes a heat sink, at least one cooling module, and a thermal insulator. The heat sink has a heat-receiving portion and a heat-radiating portion, and the cooling module has a hot side and a cold side. The hot side of the cooling module is in contact with the heat-receiving portion of the heat sink while the cold side is in contact with a heat-producing source on the solar inverter. The thermal insulator is provided in a space between the heat-receiving portion of the heat sink, the cooling module, and the heat-producing source of the solar inverter. With the cooling module provided between the heat sink and the solar inverter, the solar inverter can have largely upgraded heat dissipation efficiency.09-13-2012
20100328895Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use - A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.12-30-2010
20080298020Heat dissipation device having holes - An exemplary heat dissipation device (12-04-2008
20100232112Semiconductor module - A semiconductor module includes a base plate whose one surface is formed with a fin region in which a cooling fin is provided; a substrate that is disposed on the other surface of the base plate and provided with a switching device; and a case member having an internal space an opening formed in one wall of the case member so that the opening is smaller than the one surface of the base plate and larger than the fin region.09-16-2010
20110157831LOCKING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME AND HEAT DISSIPATION DEVICE USING THE SAME - A locking structure for assembling a first component to a second component. The locking structure includes a nut embedded into the first component and a bolt. The nut defines a groove in a circumferential periphery thereof. The first component forms a protrusion engaging into the grove of the nut. The bolt extends through the second component and screws into the nut.06-30-2011
20080253089Semiconductor module - A semiconductor module has a housing, including a power semiconductor, a cooler bearing against the latter and serving for dissipating heat loss. In at least one embodiment, a spring element, which is supported between housing and cooler, is arranged on the side of the cooler remote from the power semiconductor and prestresses the cooler against the power semiconductor.10-16-2008
20080225489Heat spreader with high heat flux and high thermal conductivity - A heat spreader for transferring heat from a heat source to a heat sink using a phase change coolant, includes an array of cells, each cell having at least one microporous wick for supporting flows of the coolant in the liquid phase, via capillary action, within the spreader from proximate the heat sink to proximate the source and at least one macroporous wick for supporting flows of the coolant, in the liquid and vapor phase, within the spreader from proximate the source to proximate the heat sink.09-18-2008
20130170143HEAT SINK MECHANSIM AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes an electronic component and a heat sink mechanism. The heat sink mechanism includes a first heat sink component and a second heat sink component arranged on opposite surfaces of the electronic component. The first heat sink component includes a first conduction portion and a second conduction portion extending from the first conduction portion. The first conducting portion is secured to the electronic component, and the second conducting portion is secured to the second heat sink component, for dissipating the heat produced by the electronic component away from the electronic device.07-04-2013
20080218972Cooling device, system containing same, and cooling method - A cooling device includes a heat sink (09-11-2008
20080218971METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.09-11-2008
20130114211CONNECTOR SYSTEM WITH THERMAL COOLING - A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can be thermally coupled to the corresponding heat spreader(s) so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates.05-09-2013
20130128461COOLING DEVICE AND ELECTRONIC DEVICE - The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.05-23-2013
20110211313CARBON NANOTUBES FOR THE SELECTIVE TRANSFER OF HEAT FROM ELECTRONICS - Under one aspect, a method of cooling a circuit element includes providing a thermal reservoir having a temperature lower than an operating temperature of the circuit element; and providing a nanotube article in thermal contact with the circuit element and with the reservoir, the nanotube article including a non-woven fabric of nanotubes in contact with other nanotubes to define a plurality of thermal pathways along the article, the nanotube article having a nanotube density and a shape selected such that the nanotube article is capable of transferring heat from the circuit element to the thermal reservoir.09-01-2011
20110222244POWER CONDITIONER DEVICE AND MODULE SUBSTRATE STRUCTURE USING THE SAME - When raising the DC power supplied from a solar cell or a fuel cell by using a DC/DC converter circuit and converting to the AC power by using an inverter circuit, an electronic circuit such as the DC/DC converter circuit and the inverter circuit, and a CPU for controlling the operation of the circuits, may be accommodated within a case body to supply the AC power to a general load, the DC/DC converter circuit and the inverter circuit are mounted on a DC/DC converter circuit mounting substrate and an inverter circuit mounting substrate, which are separately (and independently) mountable for modularization.09-15-2011
20080198552Package board and method for manufacturing thereof - A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.08-21-2008
20110228480Heat-dissipating apparatus and electronic device having the same - A heat-dissipating apparatus is installed on a circuit board which includes a board body formed with a plurality of apertures, a heat-generating element, and a lock member having an engaging hole. The heat-dissipating apparatus includes a base plate and a plurality of fastening elements. The base plate is abutted against the heat-generating element, and includes an engaging hook for engaging the engaging hole, and a plurality of through holes corresponding in position to the apertures. A plurality of connecting elements are disposed below the board body and correspond in position to the apertures. Each fastening element extends through a respective through hole, and is engaged to a respective connecting element after extending through a respective aperture. A plurality of spring members are respectively sleeved on and bias the fastening elements to move away from the base plate.09-22-2011
20110249406HEAT DISSIPATION SYSTEM FOR ELECTRICAL COMPONENTS - The present invention relates to a system for dissipating heat for one or more electrical components. A first solid heat dissipation structure is connected to a heatsink connection pad of the component while a second heat dissipation structure surrounds the first structure but not in contact with the connection pad to thermally regulate the heat of the electrical component.10-13-2011
20130148302ELECTRONIC DEVICE - An electronic device includes a heat source, a heat-absorbing cold point, a thermally insulating material for insulating the heat source from the cold point with a conductivity at a use-temperature of electronic device, that is below a thermal-conductivity threshold, and a thermal bridge having first and second ends connected by pads to the heat source and the cold point, and a thermal switch. The thermal bridge extends between the two ends and switches reversibly between conductive and non-conductive states. It includes material of variable thermal conductivity capable of switching over, in response to an addition of energy, between a conductive phase and a resistive phase, and a control module for causing the thermal switch to switch between the conductive state and the resistive state.06-13-2013
20100290191SYSTEM-IN PACKAGES - System-in packages, or multichip modules, are described which can include multi-layer chips in a multi-layer polymer structure, on-chip metal bumps on the multi-layer chips, intra-chip metal bumps in the multi-layer polymer structure, and patterned metal layers in the multi-layer polymer structure. The multi-layer chips in the multi-layer polymer structure can be connected to each other or to an external circuit through the on-chip metal bumps, the intra-chip metal bumps and the patterned metal layers. The system-in packages can be connected to external circuits through solder bumps, meal bumps or wirebonded wires.11-18-2010
20120281360PASSIVE COOLING AND EMI SHIELDING SYSTEM - An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.11-08-2012
20110310563CLAMP-TYPE HEAT SINK FOR MEMORY - A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.12-22-2011
20110310562THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS - A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.12-22-2011
20120020025COOLING STRUCTURE OF CAPACITOR AND INVERTER DEVICE - A cooling structure of a capacitor includes a snubber capacitor in which lead terminals are joined to external electrodes of a laminated ceramic electronic component; a circuit board which is for mounting the snubber capacitor and semiconductor switching elements; and a heat dissipation plate which is made of metal that dissipates the heat generated in the circuit board. The cooling structure of the capacitor is configured such that an insulating member having a high coefficient of thermal conductivity intervenes between the snubber capacitor and the heat dissipation plate.01-26-2012
20130201629POWER CORD HEAT SINK - A power cord (08-08-2013
20120092831HEAT DISSIPATION STRUCTURE FOR PORTABLE ELECTRONIC DEVICE - A heat dissipation structure for removing heat generated by electronic elements of a portable electronic device includes a base unit for mounting the electronic elements thereon and a heat dissipation unit detachably mounted on the base unit. The heat dissipation unit includes a base board and a number of thermal fins connected to the base board. The base board defines a receiving space therein, and a depth of the receiving space is larger than a thickness of each electronic element. The base board covers the electronic elements and the receiving space receives the electronic elements therein, such that heat generated by the electronic elements is transmitted to the thermal fins through the base board and dissipated by the thermal fins.04-19-2012
20130208423SOLAR POWERED APPARATUS HAVING A THERMALLY DECOUPLED SOLAR PANEL FOR TRACKING A PORTABLE ASSET - An apparatus for tracking a portable asset includes a solar panel, an electronics assembly integrated into an enclosure, and a heat spreading assembly adjacent the solar panel, the heat spreading assembly located to form an air gap separating the heat spreading assembly from the electronics assembly such that heat generated by the solar panel is dissipated in the air gap before reaching the electronics assembly.08-15-2013

Patent applications in class Thermal conduction

Patent applications in all subclasses Thermal conduction