Class / Patent application number | Description | Number of patent applications / Date published |
361703000 | With cooling fins | 14 |
20080247137 | Cooling System For Electronic Devices, In Particular, Computers - The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator ( | 10-09-2008 |
20090034197 | HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME - A heatsink comprises a base ( | 02-05-2009 |
20090052138 | Wing-spanning thermal-dissipating device - A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets connect with each other. The thermal-dissipating fin is extended outwardly and spread out from the connecting portion. The sub-thermal-dissipating fins are extended from at least one side of the thermal-dissipating fin. | 02-26-2009 |
20090154105 | HEAT DISSIPATION DEVICE AND A METHOD FOR MANUFACTURING THE SAME - A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base. | 06-18-2009 |
20090316362 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE - A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins. | 12-24-2009 |
20100079955 | Microfins for cooling an ultramobile device - The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device. | 04-01-2010 |
20100079956 | POWER TRANSDUCER - A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided. | 04-01-2010 |
20100128437 | AUTOMOTIVE INVERTER ASSEMBLY - In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body defines at least part of a volume through which flows a cooling fluid coupled thermally with the at least one component for cooling. | 05-27-2010 |
20100182751 | Heat Sink - A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The set of extended surfaces may define a primary flow direction for a cooling fluid. A first subset of the set of extended surfaces may have a first length measured in the primary flow direction. A second subset of the set of extended surfaces may have a second length measured in the primary flow direction. Each of the first and second subsets of extended surfaces may include one or more extended surfaces. The second subset of extended surfaces may be generally proximate the hotspot of the electronic component. The second length may be less than the first length such that the flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces. | 07-22-2010 |
20110032676 | POWER INVERTER - Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained. | 02-10-2011 |
20110044001 | COOLING DEVICE FOR A PLURALITY OF POWER MODULES - The invention relates to a cooling device for a plurality of power modules ( | 02-24-2011 |
20110188205 | ACTIVE ANTENNA ARRAY HEATSINK - An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink. | 08-04-2011 |
20120257354 | POWER ELECTRONICS CARD ASSEMBLIES, POWER ELECTRONICS MODULES, AND POWER ELECTRONICS DEVICES - A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer. | 10-11-2012 |
20130050944 | HIGH PERFORMANCE LIQUID COOLED HEATSINK FOR IGBT MODULES - A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins. | 02-28-2013 |