Class / Patent application number | Description | Number of patent applications / Date published |
361701000 | With heat exchanger unit | 69 |
20080205004 | SYSTEM COMPRISING HEAT-GENERATOR AND COOLER THEREOF, AND DISK ARRAY SYSTEM - A system comprises: a plurality of heat-generators; at least one cooler that cools the heat-generators by letting a cooling medium flow; and at least one cooling medium flow regulator that regulates the amount of the flow of said cooling mediums in accordance to the heat of said heat-generators; wherein the heat of said heat-generators is transmitted to said cooling medium flow regulator without recourse to transmitting through said cooling medium or air. The system may be a disk array system. | 08-28-2008 |
20080212281 | Cooling System for Electronics Housing - A cooling system through which liquid flows for carrying away waste heat for electronics housings is particularly suited for the automotive industry. The cooling system is adapted to the dimensions of the housing. The novel device is the first to create an effective cooling system for electronics housings with and for a number of circuit board levels, yet with a space-saving compact design. | 09-04-2008 |
20080212282 | METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING - A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path. | 09-04-2008 |
20080225488 | PUMP STRUCTURES INTEGRAL TO A FLUID FILLED HEAT TRANSFER APPARATUS - Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid. | 09-18-2008 |
20080239672 | Cooling of High Power Density Devices Using Electrically Conducting Fluids - A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink. | 10-02-2008 |
20080298019 | COOLING SYSTEM AND METHOD OF USE - A system of cooling and method of use that includes a connector having a data reader capable of reading a wireless identifier and/or a breaker box capable of routing liquid cooling to at least one server. In a preferred embodiment, both the quick connector and the breaker box are used in conjunction with a liquid coolant such as refrigerant or water. | 12-04-2008 |
20080310112 | System and Method for Providing Dewpoint Control in an Electrical Enclosure - A system and method is provided for an electrical component enclosure that controls the temperature of the coolant in the internal coolant loop through the enclosure to prevent the formation of condensation on the coolant tubes. Warm coolant is diverted from a heat exchanger to a mixing valve where it is mixed with chilled coolant before entering the enclosure. Humidity and temperature levels are monitored within the enclosure and processed by a microprocessor to determine the temperature of the coolant needed in the tubes. | 12-18-2008 |
20090002948 | Avionics cooling - An avionics cooling system including an avionics cooling circuit operating with a liquid coolant; a fuel circuit; and a vapour cooling cycle operating with a refrigerant. The avionics cooling circuit transfers heat withdrawn from avionics to the fuel circuit, whereby the heat is dumped into fuel, and the vapour cooling cycle transfers heat that cannot be dumped into the fuel from the fuel circuit to ram air. | 01-01-2009 |
20090046429 | Deformable duct guides that accommodate electronic connection lines - A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes. | 02-19-2009 |
20090046430 | Method and apparatus for providing supplemental cooling to server racks - A cooling system includes a re-configurable duct work assembly for a server rack or other electronics enclosure. Heat generating devices are positioned within the electronics enclosure and heat exchangers are coupled to the heat generating devices via the duct work. The duct work is positioned within a plenum between the back of the electronics servers and the heat exchangers. The interior of the electronics enclosure is conceptually segmented into heat zones. The duct work is used to selectively direct heated air to the heat exchangers. In some embodiments, the heated air output from a single heat zone is directed by the duct work to a corresponding single heat exchanger. In other embodiments, the heated air output from a group of adjacent heat zones is combined within a single duct work guide that directs the combined heated air to a corresponding number of adjacent heat exchangers. | 02-19-2009 |
20090059528 | APPARATUS FOR COOLING OF ELECTRICAL ELEMENTS - Apparatus for cooling electrical elements, comprising a heat sink ( | 03-05-2009 |
20090073658 | Modular Liquid Cooling System - A method and kit of components for configuring electronics cooling configurations, the kit comprising a plurality of passageway forming members, each forming member including an extruded member having first and second ends and forming at least one passageway and at least one of an input port and an output port that opens into the passageway, each forming member also including at least one plug insert secured to the second end of the forming member to block the at least one passageway, a plurality of elastomeric seals, a plurality of mechanical fasteners, wherein forming members can be arranged adjacent each other with ports aligned and the fasteners can be used to mechanically fasten the forming members together with seals there between to form various cooling configurations. | 03-19-2009 |
20090080159 | HEAT SINK AND COOLING UNIT USING THE SAME - A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence. | 03-26-2009 |
20090097206 | LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT - A loop heat pipe includes a vessel having a flow path formed in a looped shape and a working fluid sealed in the vessel, and the vessel includes a first wick provided at least in a opposing area in an evaporation part and a second wick adjacent to the first wick | 04-16-2009 |
20090116192 | Method and System for Removing Heat - A system and method for removing heat, in particular for removing heat from a multi-chip module or integrated circuit. The system is a closed system and includes a sealed container, and an evaporator, housed within the sealed container. The evaporator is in thermal communication with a heat source, and includes an evaporator inlet, a plurality of evaporator outlet ports and a plurality of tubes, each tube connecting the evaporator inlet with a tube outlet, each tube containing at least one substance. The system further includes a condenser, also housed within the sealed container, having a plurality of condenser inlet ports, a condenser outlet and closed condenser channels connecting the condenser inlet ports with the condenser outlet. The system further includes a conduit joining the condenser outlet to the evaporator inlet. When the substance is in liquid form in the evaporator inlet, it is in thermal communication with the heat source. As a result of such thermal communication, the substance changes from liquid to gas and moves out of the evaporator, the expanded volume forces the gas into the condenser inlet ports where it moves through the condenser channels and changes from gas to liquid. The liquid moves via wicking from the condenser outlet through the conduit and into the evaporator inlet to begin the cycle again. | 05-07-2009 |
20090262501 | Rack With Integrated Rear-Door Heat Exchanger - Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices. | 10-22-2009 |
20090262502 | HEAT SINK - A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange. | 10-22-2009 |
20100014251 | Multidimensional Thermal Management Device for an Integrated Circuit Chip - The present invention generally relates to a multidimensional thermal management device for an integrated circuit chip, and more particularly, to thermal management devices with a synthetic jet ejector adapted to operate along a hollow fin and a fin with cross-flow heat exchanger tubes. A thermal management device | 01-21-2010 |
20100053899 | HEAT SPREADER, ELECTRONIC APPARATUS, AND HEAT SPREADER MANUFACTURING METHOD - According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member. | 03-04-2010 |
20100061062 | MULTI-ORIENTATIONAL COOLING SYSTEM WITH A BUBBLE PUMP - The present invention relates to a multi-orientational cooling system with a bubble pump for generation of a circulating flow of cooling fluid. The cooling system is a closed cooling system comprising at least one hollow member facilitating flow of the cooling fluid, comprising a first heat-receiving part, a heat-emitting part, and a tubular first part adapted for functioning, in a first angular orientation of the system, as a first bubble pump for generation of a fluid flow in the system and being positioned down-stream the first heat-receiving part, and a tubular second part adapted for functioning, in a second angular orientation of the system, as a second bubble pump for generation of a fluid flow in the system and being positioned downstream the first heat-receiving part. | 03-11-2010 |
20100079954 | Display Device - A display device according to the present invention comprises a display panel, a housing sealing around the display panel and making a display screen of the display panel viewable from outside, and a heat exchanger collecting heat, which is arranged on a rear surface side of the display panel. Another display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a display panel arranged in the accommodation room and including a display screen viewable from a front surface side of the housing, a heat exchanger collecting heat generated from the display panel and arranged on a rear surface side of the display panel, and a second heat exchanger releasing heat collected by the heat exchanger to outside of the housing and arranged outside the accommodation room. | 04-01-2010 |
20100091459 | STREAMING-BASED MICRO/MINI CHANNEL ELECTRONIC COOLING TECHNIQUES - Micro-cooling technology for thermal control in the fabrication and operation of micro- and nano-scale such as high speed, high density micro scale electronic devices, micro sensors and micro machines Micro/mini heat exchangers and heat pipes have at least one channel through which the streaming flow is passed therethrough. The oscillating flow can be generated by diaphragms, vibrators, electrokinenatic force and thermal acoustic force. | 04-15-2010 |
20100103619 | Interchangeable Heat Exchanger for a Circuit Board - Various circuit board fluid cooling systems and methods of using the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first member to a circuit board where the first member has a first opening with a first internal footprint. A heat exchanger is removably coupled to the first member to transfer heat from at least one component of the circuit board. The heat exchanger has an external footprint adapted so that at least a portion of the heat exchanger fits in the first opening. A plate is coupled to the circuit board to transfer heat from at least one component of the circuit board. A fluid supply line and a fluid return line are coupled to the heat exchanger such that one of the fluid supply line and the fluid return line is thermal contact with the plate to transfer heat therefrom. | 04-29-2010 |
20100118494 | HYBRID IMMERSION COOLED SERVER WITH INTEGRAL SPOT AND BATH COOLING - A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components. | 05-13-2010 |
20100142149 | Display Apparatus And Display System - A display apparatus has a display panel, an accommodating part accommodating the display panel, a circulation path surrounding the accommodating part, a heat exchanger which collects a heat from the circulation path, an electronic circuit arranged at the back side of the accommodation part, which controls the display panel, wherein, the circulation path exists between the accommodating part and the electronic circuit. | 06-10-2010 |
20100277869 | Systems, Methods, and Apparatus for Cooling a Power Conversion System - Embodiments of the invention can provide systems, methods, and apparatus for cooling a power conversion system. According to one embodiment, a system comprising a power conversion system having an electrical component with a magnetic core can be provided. The system can include a heat transfer path adjacent to a portion of the electrical component and electrically isolated from the electrical component. The system can also include a cooling medium. The cooling medium can be used in conjunction with the heat transfer path for transferring heat from the electrical component. At least in this way, a system for cooling a power conversion system can be provided that can reduce thermal effects associated with power conversion. | 11-04-2010 |
20100277870 | MULTI-ROW THERMOSYPHON HEAT EXCHANGER - A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed. | 11-04-2010 |
20100290190 | COOLED ELECTRONIC SYSTEM - A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed. | 11-18-2010 |
20100302735 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board contained in the housing, an integrated-circuit component mounted on the circuit board, a member for heat radiation opposed to the integrated-circuit component and thermally connected to the integrated-circuit component, a sheet metal member which fixes the member for heat radiation, and an electronic component mounted on the circuit board. The sheet metal member includes a main part opposed to the member for heat radiation, and a plurality of leg parts fixed to the circuit board. One leg part of the plurality of leg parts extends from the main part over the electronic component, and is fixed to the circuit board at a position which is farther from the integrated-circuit component than the electronic component is. | 12-02-2010 |
20110002102 | DIRECTLY INJECTED FORCED CONVENTION COOLING FOR ELECTRONICS - Electronic circuitry comprises a circuit board ( | 01-06-2011 |
20110051372 | STRESS RELIEVED HOSE ROUTING TO LIQUID-COOLED ELECTRONICS RACK DOOR - A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door. | 03-03-2011 |
20110075373 | SYSTEM AND METHOD FOR STANDBY MODE COOLING OF A LIQUID-COOLED ELECTRONICS RACK - System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air. | 03-31-2011 |
20110096503 | Utilization of Data Center Waste Heat for Heat Driven Engine - A method and system of utilizing waste heat from a plurality of data center equipment comprising the steps of collecting waste heat from a plurality of data center equipment and utilizing said waste heat as the driving heat input for a heat driven engine. Heat recovery means collects waste heat from heat-producing equipment and transfers it in the form of hot water to drive a heat driven engine such as a chiller or heat pump. The output of the heat driven engine may be put to many productive uses, thereby reducing the over all energy load on the data center. | 04-28-2011 |
20110110043 | ELECTRONIC APPARATUS - An electronic apparatus includes, an apparatus casing detachably connected to another electronic apparatus, a heat receiver having a flow passage of a cooling medium and assembled in the apparatus casing, and an cooling-medium input and output unit connecting the flow passage of the heat receiver to a circulatory pathway of the cooling medium, the circulatory pathway including a heat exchange taking heat from the cooling medium outside the apparatus casing. | 05-12-2011 |
20110157829 | Container-based data center having greater rack density - A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening. | 06-30-2011 |
20110157830 | HEAT DISSIPATION DEVICE WITH BRACKET - An exemplary heat dissipation device includes a base plate, a bracket engaged with the base plate, and a heat radiator mounted on the base plate and the bracket. The bracket includes two parallel arms. The bracket defines an opening between the arms. Each of the arms extends downwardly two clasps. Each clasp of each arm comprises a blocking part and a connecting part connecting the blocking part. The base plate is received into the opening of the bracket and sandwiched and secured by the blocking parts of the clasps and the arms of the bracket. | 06-30-2011 |
20120020023 | HEATING CIRCUIT AND ELECTRONICS ASSEMBLY - A heating circuit and an electronics assembly for use in a vehicle includes an external housing having outer walls and an internal wall dividing the external housing into an electronics cavity and a non-electronics cavity. A heat generating electronics assembly is located in the electronics cavity adjacent to the internal wall. A control electronics assembly is located in the electronics cavity adjacent to the heat generating electronics assembly, with the control electronics portion controlling the heat generating electronics assembly; and an internal heat shield extending between and shielding the control electronics assembly from the heat generating electronics assembly, with the internal heat shield being made of a thermally conductive material and having a contact portion attached to the internal wall, whereby heat absorbed by the internal heat shield transmitted to the internal wall. | 01-26-2012 |
20120033383 | Cooling System for Cylindrical Antenna - According to one embodiment, an antenna cooling system, comprises a first cylinder and a second cylinder substantially concentric to the first cylinder. The first and second cylinders form a chamber between the first cylinder and the second cylinder. The chamber is configured to receive a fluid flow. A plurality of fins are disposed within the chamber and rigidly coupled to the first cylinder and the second cylinder. The plurality of fins are configured to transmit thermal energy to the fluid flow. A plurality of ports are coupled to the second cylinder. Each port is configured to receive an antenna unit. | 02-09-2012 |
20120039042 | Display Enclosure - A low profile display enclosure system for enclosing a display device for viewing that protects the display device from environmental effects and is configured to dissipate heat generated within the display enclosure. The substantially sealed display enclosure comprises a rigid bezel, a substantially transparent front cover coupled to the bezel, and a rear cover assembly that includes a heat sink portion. The thickness of the bezel is minimized to provide the enclosure with a low profile about the periphery of the display device enclosed therein. Thermal control devices may be mounted within the enclosure to modulate a temperature within the enclosure. | 02-16-2012 |
20120075806 | Container-based data center having greater rack density - A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening. | 03-29-2012 |
20120087091 | Integrated Thermal And Structural Management Solution For Rechargeable Energy Storage System Assembly - A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component. | 04-12-2012 |
20120087092 | COOLING MEDIUM LINE INTERCONNECTION FOR ACHIEVING VERY UNIFORM COOLING TEMPERATURS AND HIGH AVAILABILITY PARTICULARLY OF POWER MACHINES - A uniform temperature of the machines to be cooled is obtained by way of a device for cooling at least one power component. The device has a cooling medium line, a cooling medium pump and a heat exchanger. Furthermore, streams of cooling media are to be kept low. A return runs back in the direction of an inlet along a flow up to an outlet. In this way, a counter stream interconnection for averaging a flow and a return temperature of a cooling medium is achieved. | 04-12-2012 |
20120120604 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat. | 05-17-2012 |
20120140416 | METHOD AND STRUCTURE FOR OPTIMIZING HEAT EXCHANGER PERFORMANCE - A heat exchanger structure including multiple fluid circuits, through which respective streams of a first fluid pass from a stream inlet to a stream outlet to transfer heat to or from a second medium. The fluid circuits are arranged into at least a first group and a second group, at least the first group consisting essentially of only fluid circuits that perform substantially similarly according to at least one selected performance criterion. A control sensor for at least the first group generates a signal representative of a parameter of the first fluid in the associated group. A valve for at least the first group is in fluid communication with of all the streams of the associated group so as to be able to control the flow of fluid through the streams of the associated group in parallel. | 06-07-2012 |
20120176748 | System for Thermally Controlling an Apparatus - A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor. | 07-12-2012 |
20120188719 | Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems - A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module. | 07-26-2012 |
20120201005 | ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 08-09-2012 |
20120236501 | HEAT PIPE DOCKING SYSTEM - To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method. | 09-20-2012 |
20120262881 | POWER SUPPLY DEVICE FOR VEHICLE - A power supply device includes a refrigeration cycle having a compressor, a motor, an inverter-integrated charger, a heat exchanger unit, and a controller having a determining unit. The inverter-integrated charger selectively controls operation of the motor using electrical power of a battery and charge of the battery with external power. The heat exchanger unit cools a cooling-necessary part of the inverter-integrated charger using refrigerant in the refrigeration cycle. When the vehicle is stopped and the battery is charged with the external power, the controller makes the inverter-integrated charger serve as: a charger to perform the charge of the battery; or an inverter to control the operation of the motor, thereby driving the compressor, upon determination that the cooling-necessary part needs to be cooled by the determining unit. | 10-18-2012 |
20120281359 | MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS - An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler. | 11-08-2012 |
20120300402 | FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES - A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis. | 11-29-2012 |
20120314369 | PACKAGE CARRIER AND PACKAGE STRUCTURE - A package carrier includes: a carrier having a main mounting surface and at least two side mounting surfaces connecting the main mounting surface; a dielectric layer disposed on the carrier, having multiple first openings and extending from the main mounting surface up, along boundaries between the main mounting surface and the side mounting surfaces, onto the side mounting surfaces, in which the first openings expose a portion of the main mounting surface and portions of the side mounting surfaces; a metal layer disposed on the dielectric layer and having multiple second openings disposed correspondingly to the first openings and multiple third openings exposing the partial dielectric layer at the above-mentioned boundaries; a surface treatment layer disposed on the partial metal layer; and a solder resist layer disposed on a portion of the metal layer and a portion of the dielectric layer both exposed out of the surface treatment layer. | 12-13-2012 |
20130088837 | FLOW CHANNEL MEMBER, AND HEAT EXCHANGER USING THE SAME, AND ELECTRONIC COMPONENT DEVICE - There is provided a flow channel member which is configured by laminating a plurality of side wall units and inside which a flow channel is provided, wherein occurrence of joint failure of the side wall units are reduced. A flow channel member includes a cover unit, a side wall unit, and a bottom plate unit, wherein a flow channel through which a fluid flows is provided inside the flow channel member, and a gap which communicates with the flow channel is provided between the cover unit and the side wall unit. According to the flow channel member, since the gap which communicates with the flow channel is located between the cover unit and the side wall unit, a contact area between the flow channel and the fluid increases, and thus heat exchange efficiency with the cover unit may be increased. | 04-11-2013 |
20130170142 | HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE - An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section. | 07-04-2013 |
20130258595 | Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures - Heat transfer is known to be a concern when scaling up a quantum computer. Some basic superconducting devices may dissipate some energy when switched and may interface in close proximity with the qubits. Highly conductive thermal vias may be used to transport hot electrons away from the qubits and into liquid | 10-03-2013 |
20130265719 | STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure. | 10-10-2013 |
20130279116 | APPARATUS AND METHOD FOR COOLING AND RECOVERING HEAT FROM CABLES AND TRANSFORMERS - The present invention provides an apparatus ( | 10-24-2013 |
20140009888 | ELECTRONIC DEVICE HAVING A PASSIVE HEAT EXCHANGE DEVICE - An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. A hinge device may couple to the base and the lid, and may allow the lid to move relative to the base between the closed state and the opened state. A heat exchange device may be adjacent to the hinge device in an area between the base and the lid. The heat exchange device may receive heat from a component in the base. | 01-09-2014 |
20140049917 | DEHUMIDIFYING COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector. | 02-20-2014 |
20140071629 | COOLING CIRCUIT WITH A SUFFICIENTLY ACCURATELY MEASURED HEAT EXCHANGER - An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow. | 03-13-2014 |
20140085823 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140085824 | MICRO-DIE NATURAL CONVECTION COOLING SYSTEM - A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region abutting the integrated circuit die, but are flexible between the heat exchanger region and the die region. | 03-27-2014 |
20140185240 | HEAT EXCHANGER ASSEMBLY FOR ELECTRONIC DEVICE - In one embodiment a heat exchanger assembly comprises at least one heat pipe and a casing which is to receive a blower, the casing comprising a plurality of heat exchanging plates, wherein at least one of the heat exchanging plates comprises at least one tongue which is to cover a portion of an exterior surface of the at least one heat pipe. Other embodiments may be described. | 07-03-2014 |
20140254099 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD - An electronic component includes a base substance, a cooling channel formed in the base substance and flows a cooling medium in a second direction from a first direction, a radiator formed in a surface of the cooling channel using a material of which thermal conductivity is higher than a thermal conductivity of the base substance or formed so that the radiator may project to the cooling channel, and that contacts the cooling medium. | 09-11-2014 |
20140328022 | PRESSURE-TIGHT ENCAPSULATED HOUSING WITH COOLING DEVICE - A pressure-tight encapsulated housing ( | 11-06-2014 |
20140340848 | FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES - A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis. | 11-20-2014 |
20150055301 | CARD-TYPE ELECTRONIC COMPONENT COOLING STRUCTURE AND ELECTRONIC DEVICE - A cooling structure for a card-type electronic component, including: a printed circuit board on which a card-type electronic component is detachably mounted; a thermally-conductive heat transfer member, disposed facing the card-type electronic component; a press contact portion that places the heat transfer member in press contact with the card-type electronic component; and a pair of flow path portions that are disposed at both width direction sides of the card-type electronic component, that form flow paths in which coolant flows, and that support the heat transfer member so as to enable heat exchange between the heat transfer member and the coolant. | 02-26-2015 |
20150296659 | LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE - Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus. | 10-15-2015 |
20150327399 | VARIABLE FREQUENCY DRIVE OPERATION TO AVOID OVERHEATING - Operation of a variable frequency in a manner configured to avoid overheating is provided. In one form, a method includes providing a variable frequency drive that includes a switching device in thermal communication with a heat sink including a thermal mass. The method further includes operating the drive in a first mode before active cooling of the heat sink is established and a second mode following the first mode. Operation of the drive in the first mode includes operating the switching device in a first switching frequency mode, and the first switching frequency mode and the thermal mass of the heat sink are selected to provide a temperature of the switching device below a predetermined threshold before active cooling of the heat sink is established. Further embodiments, forms, features, and aspects shall become apparent from the description and drawings. | 11-12-2015 |