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Liquid

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361688000 - With cooling means

361689000 - Fluid

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361700000 Change of physical state 136
Entries
DocumentTitleDate
20080278913COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED - A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.11-13-2008
20090316359HEAT-TRANSFER MECHANISM INCLUDING A LIQUID-METAL THERMAL COUPLING - Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.12-24-2009
20110188202Algae Oil Based Dielectric Fluid for Electrical Components - The disclosure is directed to a dielectric fluid. The dielectric fluid includes an algae oil. The algae oil includes a natural algae antioxidant. The natural algae antioxidant is selected from β-carotene, astaxanthin, tocopherol, polyunsaturated triglycerides, and combinations thereof.08-04-2011
20130044431LIQUID COOLING OF STACKED DIE THROUGH SUBSTRATE LAMINATION - A liquid cooled package for integrated circuit dies includes flex circuit boards (02-21-2013
20080259567CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM - A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.10-23-2008
20130077244Arrangement of a power semiconductor circuit - The invention relates to a power electronic assembly (03-28-2013
20130039010HEAT DISSIPATION DEVICE AND SEMICONDUCTOR DEVICE - Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.02-14-2013
20130039009INVERTER FOR VEHICLE - An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.02-14-2013
20090219693Cooling system for high voltage systems - A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to be dissipated. The cooling system can include a cooling mechanism for dissipating the heat. The cooling mechanism can include a liquid conduit thermally coupled to the electrical component. The liquid conduit can contain a cooling solution comprising an alcohol having the formula R-OH, wherein R is a hydrocarbon having the formula C09-03-2009
20090154101LIQUID-COOLED INVERTER ASSEMBLY - An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to the AC path and the DC path.06-18-2009
20130027882Safety Device of Battery Temperature Control System - To provide a safety device of a battery temperature control system for an EV or an HEV capable of preventing an electric shock due to the electrical conduction across terminals of batteries in the event of a vehicle collision.01-31-2013
20130208421Cooled Electronic System - A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.08-15-2013
20130083484COMPOSITE ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes electronic components, a conductor layer, and a support. Each of the electronic components includes a first terminal electrode and a second terminal electrode that are arranged on respective opposing surfaces of an element body. The conductor layer electrically connects the first terminal electrodes of the electronic components to one another. The conductor layer is arranged on the support. The second terminal electrodes of the electronic components function as mounting terminal electrodes to be connected to terminals of a circuit substrate.04-04-2013
20100097765Power Conversion Apparatus and Power Module - Disclosed are a power conversion apparatus and a power module that can be downsized. Four corners of a power module are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus. Thereafter, a top and a bottom of the housing are reversed, and nuts are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. That is, on the top surface of the cooling jacket facing the bolts are arranged an AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal. Accordingly, the power module can be downsized.04-22-2010
20090040724POWER INVERTER - In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.02-12-2009
20130058041SEMICONDUCTOR MODULE AND COOLER - A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.03-07-2013
20110013363Housing Used As Heat Collector - A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.01-20-2011
20120224326MODULAR BATTERY STRUCTURE - A module system is provided that includes at least one module support and at least one module support and at least one energy storage module that is connected to the at least one module support. The module support and the energy storage module have cooling fluid connections, electric contacts, and coupling elements that are adapted to each other.09-06-2012
20120195003Rotating Rectifier - A rectifier comprising an electrically conductive support 32, a first plurality of rectifier components 24 carried by the support 32 and having their anodes connected to a first bus bar 26, a second plurality of rectifier components 28 carried by the support 32 and having their cathodes connected to a second bus bar 30, the cathode of each of the first rectifier components 24 being connected to the anode of an associated one of the second rectifier components 28, and first and second resistance paths 40, 42 between the first and second bus bars 26. 30 and the support 32.08-02-2012
20090237884Electromagnetically-actuated micropump for liquid metal alloy - The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.09-24-2009
20090231811Electric Power Conversion Apparatus - An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.09-17-2009
20090231810DIRECT DIPPING COOLED POWER MODULE AND PACKAGING - A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.09-17-2009
20090009968Cooling device and electronic apparatus - According to one embodiment, a cooling device has a base substance formed in a plate form and having in its inside a channel through which a refrigerant circulates, and a flow mechanism that generates a stream of the refrigerant along the channel. The base substance has a first heat receiving part, a second heat receiving part and a heat radiating part. The first heat receiving part has in its inside a first heat receiving section thermally connected to the first heat generator. The second heat receiving part has in its inside a second heat receiving section thermally connected to the second heat generator. The heat radiating part has in its inside a heat radiating section located downstream of the first heat receiving section and the second heat receiving section.01-08-2009
20120113594Thermoelectric Converter and System Comprising a Thermoelectric Converter - An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).05-10-2012
20120236500WIRING BOARD AND POWER CONVERSION DEVICE - A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.09-20-2012
20130163203THERMALLY-STABLE DIELECTRIC FLUID - The disclosure is directed to a thermally-stable dielectric fluid. The dielectric fluid includes (a) an oil, (b) a substituted, hindered phenolic antioxidant having at least two substituted cresol groups being covalently bonded to each other through a methylene bridge, and (c) a substituted, diphenyl amine antioxidant having at least two substituted phenyl groups being covalently bonded to each other through an amine bridge.06-27-2013
20110286183WATER-COOLED COMMUNICATION CHASSIS - A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.11-24-2011
20090284922HIGH-POWER THYRISTOR MODULE HAVING COOLING EFFECT - A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. Each thyristor has a gate. The mounting frame includes a dielectric top plate disposed on a top side of the housing, and a plurality of electrodes mounted on the top plate so that the electrodes are exposed outwardly of the housing, and coupled respectively to the gates of the thyristors. Cooling oil is contained in the inner receiving space so that the thyristors are submerged thereby.11-19-2009
20100033932ELECTRONIC BOARD AND COLD PLATE FOR SAID BOARD - The invention relates to an electronic board that comprises a planar projection plate (02-11-2010
20100277867Thermal Dissipation Mechanism for an Antenna - According to one embodiment, a heat dissipation system includes an elongated radar absorbing member configured with a thermal dissipation mechanism. The radar absorbing member extends proximate a junction of a microwave antenna enclosure that houses an antenna and a radome that covers an opening in the microwave antenna enclosure. The radar absorbing member absorbs electro-magnetic energy incident upon the junction. The thermal dissipation mechanism absorbs heat generated by the absorbed electro-magnetic energy.11-04-2010
20100046167COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANNEL AND A THIN FILM THERMOELECTRIC COOLING DEVICE IN THE MICROCHANNEL - An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.02-25-2010
20090147479HEAT DISSIPATION APPARATUS - A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.06-11-2009
20090316360COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.12-24-2009
20090207568METHOD AND APPARATUS FOR COOLING IN MINIATURIZED ELECTRONICS - A method and apparatus for cooling in miniaturized electronics are provided including in an electronic circuit board. The electronic circuit includes a substrate and at least one integrated channel within the substrate configured to allow fluid flow therethrough.08-20-2009
20090279257SYSTEM AND METHOD FOR A SUBSTRATE WITH INTERNAL PUMPED LIQUID METAL FOR THERMAL SPREADING AND COOLING - A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.11-12-2009
20090201644SYSTEMS AND ASSOCIATED METHODS FOR COOLING COMPUTER COMPONENTS - Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.08-13-2009
20090201643INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES - Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.08-13-2009
20090284921Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements - Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.11-19-2009
20090279259System and method for proportional cooling with liquid metal - A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.11-12-2009
20090040723HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY - A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.02-12-2009
20100103618APPARATUS AND METHOD FOR FACILITATING PUMPED IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM - Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.04-29-2010
20100061061POWER SOURCE APPARATUS - A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is placed in the case in a state in which the fan is immersed in the cooling liquid together with the power source module, the fan forming a laminar flow of the cooling liquid, the laminar flow having a width at least substantially the same as a length of the power source element in a length direction of the power source element.03-11-2010
20100142148Liquid cooling unit and electronic apparatus - A liquid cooling unit includes a pump body. A nipple is formed in the pump body. The nipple defines an outflow passage for coolant. An elastic tube has the tip end receiving insertion of the nipple so that the elastic tube is coupled to the nipple. A fixation member defines a groove supporting the nipple inside the elastic tube over a first predetermined length from the tip end of the nipple. The groove receives the elastic tube alone ahead of the tip end of the nipple over a second predetermined length from the tip end of the nipple.06-10-2010
20080273307LIQUID-BASED COOLING SYSTEM FOR COOLING A MULTI-COMPONENT ELECTRONICS SYSTEM - A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.11-06-2008
20080291628Semiconductor module and inverter device - A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.11-27-2008
20080304236Maintaining cooling system air above condensation point - A cooling system cools air that flows through an electronic system to cool heat generating components. The cooling system maintains a temperature of the air near a set point above a condensation point.12-11-2008
20080310110SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF FABRICATION - A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.12-18-2008
20120033382HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS - A heat sink for absorbing heat which is generated by an electronic module by using a coolant which flows in its internal portion, comprises a housing which is provided with, in its internal portion, a first surface which is located in the vicinity of the electronic module and a second surface which faces the first surface and comprises fins which extend from the first surface toward the second surface, wherein a projecting portion projecting from the second surface toward the first surface is formed at the second surface, between the top edges of the fins on the second surface side and the second surface.02-09-2012
20110205706RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (08-25-2011
20080266798SYSTEM AND METHOD FOR LIQUID COOLING OF AN ELECTRONIC SYSTEM - A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion.10-30-2008
20080266799Methods and Apparatuses for Cold Plate Stability - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.10-30-2008
20110205707COMPONENT CARRIER - An extruded aluminum electrical circuit component carrier on which at least one electrical circuit component is to be mounted. A first side portion and a second side portion include areas for mounting at least one first electrical circuit component part and at least one second electrical circuit component part. An inlet to which an inlet conduit for a cooling liquid can be connected. An outlet to which an outlet conduit for the cooling liquid can be connected. At least one supply passage for the cooling liquid formed through the first side portion. At least one return passage for the cooling liquid formed through the second side portion. The at least one supply passage is connected to the at least one return passage in series. An area of a cross-section of the at least one return passage is smaller than an area of a cross-section of the at least one supply passage, whereby in use a flow velocity of the at least one return passage exceeds a flow velocity of the at least one supply passage so that an essentially uniform cooling capacity for the first and second electrical circuit component parts is achieved.08-25-2011
20120063091Cooling Apparatuses and Power Electronics Modules - A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device.03-15-2012
20100142147Electronic Device and Heat Dissipating Module Thereof - An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.06-10-2010
20090027856BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS - An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the plurality of slots. An input piping system is coupled to the wet heat sinks and configured to supply cooling fluid to each of the wet heat sinks. An exhaust piping system is also coupled to the wet heat sinks and configured to remove the cooling fluid from the wet heat sinks. At least one blade is installed into one of the slots. The blade has at least one dry heat sink attached to the blade. The at least one dry heat sink is in thermal contact with the at least one wet heat sink positioned adjacent to the first slot.01-29-2009
20090141451HEAT DISSIPATION APPARATUS - A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of the insulation substrate. The heat sink, which includes an upper case and a lower case, serves as a liquid cooling device including a cooling passage. The stress reduction member is arranged between the insulation substrate and the upper case. The stress reduction member includes stress absorption hollows. The upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case. The first portion has a thickness that is less than that of the second portion.06-04-2009
20090251862SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE - A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chips or chip stacks.10-08-2009
20130120936SCANNER PROTECTION CASING AND SYSTEM OF READING THE HEIGHT OF THE PELLET BED OF GRID CARS INSIDE A GRID FURNACE COMPRISING A SCANNER PROTECTED BY SAID CASING - A scanner protection casing including an external cabinet, an internal cabinet within which a scanner is positioned, a thermal insulation material between the external cabinet and the internal cabinet that reduces the thermal conductivity between the external cabinet and the internal cabinet. Further, the internal cabinet has a first side wall and a second side wall and the space between the first side wall and a second side wall is filled with a cooling fluid.05-16-2013
20090052134LIQUID-COOLED GROUNDED HEATSINK FOR DIODE RECTIFIER SYSTEM - A diode rectifier system for generator excitation includes a plurality of diode modules mounted on a heatsink and a coolant tube provided in the heatsink. The heatsink is electrically grounded. A method of cooling a diode rectifier system for generator excitation comprises providing a flow of liquid coolant in the coolant tube and electrically grounding the heatsink.02-26-2009
20090231812DIRECT COOLED POWER ELECTRONICS SUBSTRATE - The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.09-17-2009
20090219694Power Electronics Assembly - The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.09-03-2009
20090219692Rack for housing a liquid-cooled electric unit - The present invention provides a rack suitable for housing a liquid-cooled electric unit. A rack 09-03-2009
20090237883BOARD UNIT AND ELECTRONIC APPARATUS - A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant.09-24-2009
20090279258HINGE CONNECTOR WITH LIQUID COOLANT PATH - A hinge for moving two parts of an electronic apparatus relative to each other is disclosed. The hinge includes two coolant flow paths helically arranged between inlet and outlet connections as portions of the hinge are rotated relative to each other. Guide plates within the hinge independently rotate to suitably position the conduits of the coolant flow paths in a position of minimum twisting and stretching. The hinge can be incorporated into any electronic apparatus, for example a portable computer.11-12-2009
20090316361Method and apparatus for controlling the output of solar arrays - A method to control the temperature of a circulating fluid and thereby control the electrical output of a PV array is provided along with an apparatus for doing so which adds simple mechanical, data measurement and control elements to prior art systems. Given a set amount of sunlight, electrical output from a solar PV array will change if the temperature of the array changes. One can change the temperature of a PV array by circulating a fluid through a loop in thermal contact with the array. Controlling the temperature of this circulating fluid, allows one to control the electrical output from the array.12-24-2009
20110228478AUTOMATIC TRANSMISSION CONTROL UNIT COOLING APPARATUS - An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission disposed at a position that is higher than the oil surface in the automatic transmission when the transmission is installed in a vehicle and on a side face of a valve body in the transmission case. The apparatus further includes a radiator that contacts the electronic component or the substrate in order to conduct heat generated by the electronic component. At least a part of the radiator is immersed in the oil when the transmission is installed in the vehicle.09-22-2011
20100002392Assembled Heat Sink Structure - The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower cover and the mountain-shaped fin-like device for diversion or capillary is located inside the base, so that after a plurality of heat dissipating fins are assembled on the top of the base, they can be welded to form an integration. Then, a heat dissipating medium can be poured into the airtight chamber of the base, and thus, when the base is contacted with the contact surface, the heat can be absorbed by an absorbing end of the base, transmitted to a plurality of heat dissipating fins on the top of the base and then exhausted by a fan, thereby achieving heat dissipating effect.01-07-2010
20130215572AIRCRAFT ELECTRONICS COOLING APPARATUS FOR AN AIRCRAFT HAVING A LIQUID COOLING SYSTEM - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.08-22-2013
20100226093METHODS FOR MAKING MILLICHANNEL SUBSTRATE, AND COOLING DEVICE AND APPARATUS USING THE SUBSTRATE - A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.09-09-2010
20090109622THERMAL CONTROL SYSTEM FOR RACK MOUNTING - A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces.04-30-2009
20100254087Electric module - The electric module includes a sealed enclosure (10-07-2010
20100226094GRAVITY ASSISTED DIRECTED LIQUID COOLING - Dielectric liquid is used to cool heat generating electronic components disposed on a circuit board within a case. The liquid is poured or otherwise directed over the electronic components, with gravity assisting the liquid in flowing downward over the components, with the liquid thereafter being collected in a sump for eventual return back to the electronic components. One exemplary application of the described concepts is in cooling electronic components in computers, for example personal computers or server computers.09-09-2010
20100238629COOLING STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND INVERTER - A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins have ends facing the upstream side of a cooling water flow. The end of at least one fin among the plurality of fins is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends of the fins adjacent to both sides of the at least one fin. By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency.09-23-2010
20100208427SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE - A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.08-19-2010
20090129021GAS STATION TELEVISION - Preferred embodiments relates to a cooling system and a method for cooling an electronic display. Embodiments include a transparent liquid cooling chamber, a reservoir tank, and a pump. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a fluid compartment that is anterior to and coextensive with the electronic display surface. Circulating coolant removes heat directly from the electronic display surface by advection. In order to view the display, the coolant fluid is transparent or at least semi-transparent. The image quality of an exemplary embodiment remains essentially unchanged, even though coolant is flowing over the visible face of the electronic display surface.05-21-2009
20100296248DUAL-CHAMBER FLUID PUMP FOR A MULTI-FLUID ELECTRONICS COOLING SYSTEM AND METHOD - A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.11-25-2010
20110249402POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT - A power converter module includes at least two power semiconductor modules, which are mechanically connected to a liquid-cooled heat sink and electrically connected to terminals of the power converter module by a busbar arrangement having at least two busbars. The busbars are insulated from one another by an insulation layer. The insulation layer is composed of two insulating layers, which are materially connected with one another so as to form therebetween a cavity having a predetermined shape and an entrance side and an exit side disposed on least one side face of the insulation layer. A connector is provided on the entrance side and the exit side and fluidly connected to the liquid-cooled heat sink. The rectifier module is thus able to sustain relatively high electrical loads compared to conventional rectifier modules, whilst maintaining a permitted temperature for the insulation layer and the lamination material of the busbar.10-13-2011
20110026225Method and Apparatus for Liquid Cooling Computer Equipment - A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above the computer component. The liquid flows through an in-feed manifold to diverters that direct the liquid into in-feed tanks located above a row of the computer component. The liquid flows through the channels and flow control orifices to a drain that returns the liquid to the reservoir.02-03-2011
20110044000TRANSPARENT HEAT-SPREADER FOR OPTOELECTRONIC APPLICATIONS - An optoelectronic cooling system is equally applicable to an LED collimator or a photovoltaic solar concentrator. A transparent fluid conveys heat from the optoelectronic chip to a hollow cover over the system aperture. The cooling system can keep a solar concentrator chip at the same temperature as found for a one-sun flat-plate solar cell. Natural convection or forced circulation can operate to convey heat from the chip to the cover.02-24-2011
20110116235MOTOR DRIVE UNIT AND VEHICLE INCLUDING THE SAME - Disclosed is a motor drive unit. The motor drive unit includes a case, a capacitor provided in the case and generating heat, an inverter provided in the case and configured to convert Direct Current (DC) power into Alternating Current (AC) power, and a water cooling jacket provided in the case and configured to radiate heat generated by the inverter to the outside. The case includes a radiating plate to radiate the heat generated by the capacitor to the outside.05-19-2011
20100002393LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.01-07-2010
20100039773Narrow Gap Spray Cooling in a Globally Cooled Enclosure - Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.02-18-2010
20110075367COMPLIANT CONDUCTION RAIL ASSEMBLY AND METHOD FACILITATING COOLING OF AN ELECTRONICS STRUCTURE - Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing.03-31-2011
20110075368WATER-COOLED REACTOR - A liquid-cooled electromagnetic component (reactor, transformer) including a plurality of disc-shaped coils with one or more turns and flat radiators located between them, wherein at least two disc coils are assigned to a flat radiator, and in which all the winding elements (turns of the coil) are in direct thermal contact with the surfaces of the flat radiators. This component is used in power converter installations and in midfrequency installations.03-31-2011
20090052135ELECTRONIC APPARATUS - A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.02-26-2009
20100296247Water-cooling type cooler and inverter having the same - A water-cooling type cooler and an inverter employing the same are disclosed. A guide pin for distributing cooling water is formed in the middle of a cooling water flow path having a bent face, to make a flow rate of cooling water at the bent portion of the cooling water flow path uniform to thus improve cooling performance of the water-cooling type cooler. In addition, because the cooling performance of the water-cooling type cooler is improved without extending the cooling pin, an increase in the weight of the water-cooling type cooler can be reduced and a fabrication cost of the water-cooling type cooler can be reduced.11-25-2010
20110164385LIQUID COOLER AND METHOD OF ITS MANUFACTURE - A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plurality of parallel fins directed into and along the at least one cavity. An insert housed in the at least one cavity connects the tops of the fins in a fluid-tight manner thereby forming liquid channels for a coolant liquid between the insert and the hollow body. A lid is attached at both ends of the hollow body for forming a liquid cooling system.07-07-2011
20110043999APPARATUS AND ARRANGEMENT FOR HOUSING VOLTAGE CONDITIONING AND FILTERING CIRCUITRY COMPONENTS FOR AN ELECTROSTATIC PRECIPITATOR - A unitary-enclosure housing apparatus and arrangement for protecting and cooling the high voltage electronic conditioning and filtering circuitry components used for providing a high-voltage waveform to an electrostatic precipitator device includes a hermetically sealed dielectric liquid coolant filled tank/housing having one or more side-mounted hollow-panel type radiator structures for dissipating heat from the coolant. The disclosed unitary-enclosure housing apparatus and the particular arrangement of the internal electronic components results in a relatively external small footprint while containing both the transformer-rectifier (TR) set and high-voltage resistor-capacitor (R-C) filter components associated with a high-voltage electrostatic precipitator device in a single unitary package. The housing apparatus is outfitted with a removable top cover plate and access panel for providing easy access to the TR set and R-C filter components. A coolant drain spigot is also provided on the housing for simplifying the draining and replacement of coolant liquid.02-24-2011
20080218970Thermal Management for a Ruggedized Electronics Enclosure - The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.09-11-2008
20090190310HEAT MANAGEMENT IN AN ELECTRONIC MODULE - In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component.07-30-2009
20100165574IMAGE DISPLAY APPARATUS - An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube that is provided to be continuous with the heat-receiving tube and is filled with the cooling liquid; and a transporting pump allowing the cooling liquid to circulate through the heat-receiving tube and the heat-radiating tube. When viewed from a display surface side of the display device, at least a part of the heat-radiating tube is located outside a peripheral edge of the display device and is disposed along the peripheral edge.07-01-2010
20110188203PLUG IN LED ARRAY - An LED device comprises an LED (08-04-2011
20110051371Semiconductor Device, and Power Conversion Device Using Semiconductor Device - The present invention provides a vehicle power module and a power converter including a power semiconductor element (03-03-2011
20120307451SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES - An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device.12-06-2012
20110304987DEVICE FOR COOLING INTEGRATED CIRCUITS - The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (12-15-2011
20110317366FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED ELECTRONIC PARTS TO COOLER - In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.12-29-2011
20110317365LIQUID COOLING SYSTEM AND ELECTRONIC DEVICE INCORPORATING THE SAME - A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided.12-29-2011
20110157828Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure - According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.06-30-2011
20110157827MINIATURIZED LIQUID COOLING APPARATUS AND ELECTRONIC DEVICE INCORPORATING THE SAME - A liquid cooling apparatus for cooling an inversely mounted electronic component, includes a casing defining a receiving room therein, a diaphragm, a partition plate forming a nozzle thereon, and a piezoelectric element attached to the diaphragm in such a manner that that a vibrating direction thereof is perpendicular to the diaphragm. The diaphragm is arranged in the receiving room and divides the receiving room into a top first chamber and a bottom second chamber isolated from each other. The partition plate is arranged in the first chamber and divides the first chamber into an upper region and a lower region. The lower region is filled with a working fluid. When the diaphragm is driven to vibrate upwardly by the piezoelectric element, the diaphragm pushes the working fluid in the lower region of the first chamber to the upper region of the first chamber via the nozzle.06-30-2011
20120057302COOLING APPARATUS AND ELECTRONIC EQUIPMENT - A cooling apparatus that cools first and second high density heat dissipation components provided in a housing including a fan that provide an air convection from one opening toward the other opening, the cooling apparatus having: a conduit that contacts the first heat dissipation component and that allows a coolant to pass there through; and a fin structure that contacts the conduit and that is provided on an upwind side of the second heat dissipation component.03-08-2012
20120206879COOLING DEVICE - The invention relates to a cooling device for an electric energy supply (08-16-2012
20120063090COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An apparatus for cooling a stacked die package comprises a substrate, a first die above the substrate, a second die above the first die, and a housing containing the first and second dies. The housing seals the first and second dies from the environment. The apparatus further includes a cooling fluid in fluid communication with the first die and the second die to transfer the heat from the dies to the housing.03-15-2012
20120155028COOLING COMPONENTS OF AN ELECTRONIC UNIT - A method of enabling the cooling of components of an electronic unit is provided. The method comprises providing a thermally conductive liquid or gel in contact with the components wherein the unit is an electronic module comprising a casing comprising metallic material and housing the components. The method further comprises including such liquid or gel in the casing to fill the entire space within the casing apart from the components so that heat from the components can be conducted via the liquid or gel to the casing.06-21-2012
20100172099Metal Clad Fiber Optics for Enhanced Heat Dissipation - An integrated optical I/O and semiconductor chip with a direct liquid jet impingement cooling assembly are disclosed. Contrary to other solutions for packaging an optical I/O with a semiconductor die, this assembly makes use of a metal clad fiber, e.g. copper, which will actually enhance cooling performance rather than create a design restriction that has the potential to limit cooling capability.07-08-2010
20100290188INTEGRATED CIRCUIT STACK - The invention relates to an integrated circuit stack (11-18-2010
20100271779WATER JACKET FOR COOLING AN ELECTRONIC DEVICE ON A BOARD - A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM.10-28-2010
20090080158Comb-shaped power bus bar assembly structure having integrated capacitors - A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that are directly surface mounted, as bare die, to a semiconductor substrate. Other semiconductor substrate assemblies of the stack involve bare memory integrated circuit dice that are directly surface mounted to a semiconductor substrate. Elastomeric connectors interconnect adjacent semiconductor substrates proceeding down the stack. Tines of novel comb-shaped power bus bar assembly structures extend into the stack to supply DC supply voltages. The supply voltages are supplied from bus bars, through vias in the semiconductor substrates, and to the integrated circuits on the other side of the substrates. The power bus bars also serve as capacitors and guides for liquid coolant.03-26-2009
20120257353Carriage Chassis With A Tri-Lobed Torsion Stop - Carriage chassis for installation of a component assembly in a support structure. The support structure includes a power connector in a connector housing. The carriage chassis includes: rails adapted to receive a component assembly and a safety cover. One of the rails includes a tri-lobed torsion stop that includes a first lobe configured to contact the connector housing when no safety cover is installed, preventing a component assembly from coupling with power; a second lobe configured to receive contact from a displacement member of a safety cover, rotating the tri-lobed torsion stop; and a third lobe configured to provide contact to the displacement member when the safety cover is installed and a component assembly is coupled with power. The third lobe and the first lobe prevent removal of the safety cover when a component assembly is coupled with the power connector.10-11-2012
20120188718Assembly of an Electronic Device Casing, A Heat-Dissipating Module and a Waterproofing Module, and the Waterproofing Module - An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.07-26-2012
20120188717POWER ELECTRONICS ASSEMBLY FOR A MAGNETIC RESONANCE DEVICE - A power electronics assembly for a magnetic resonance device includes a housing and at least one printed circuit board (PCB) arranged in the housing with at least one power electronics component to be cooled. The PCB has an at least one millimeter thick backside layer that may be made of copper. The power electronics assembly also includes a stabilizing cooling plate configured as part of the housing and/or the housing includes at least one coolant channel open on at least one side, so that the PCB mounted on the cooling plate comes into direct contact with coolant guided in the coolant channel in an area of the power electronics components with the backside layer.07-26-2012
20110122583IMMERSION COOLING APPARATUS FOR A POWER SEMICONDUCTOR DEVICE - An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolant is circulated. The thermally conductive module has first and second oppositely disposed connector headers housing terminal pins or blades electrically coupled to the semiconductor device, and the connector headers protrude through openings in oppositely disposed sidewalls of the housing so that the portion of the thermally conductive module between the connector headers is suspended in the chamber and immersed in the circulating coolant. The thermally conductive module is sealed against the housing sidewalls around the openings, and one of the sidewalls is removable to facilitate installation of the thermally conductive module in the housing or its subsequent removal.05-26-2011
20100328888COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN - A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.12-30-2010
20080298017COUNTERFLOW MICROCHANNEL COOLER FOR INTEGRATED CIRCUITS - A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of channels, the first group of channels and the first pair of plena isolated from the second group of channels and the second pair of plena. Each of the pairs of manifolds includes multiple branches coupled to the channels and a common plenum. Cooling fluid is injected into the channels from different sides of the base, causing fluid to flow in different directions in the two groups of channels, the channels in thermal contact with the integrated circuit.12-04-2008
20080298018HEAT SINK AND LASER DIODE - The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.12-04-2008
20120320527BOARD ASSEMBLY, ELECTRONIC DEVICE TEST APPARATUS AND WATER JACKET - A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 12-20-2012
20110228479Electric Power Conversion Apparatus - An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.09-22-2011
20110235276POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT - A power converter module with a liquid-cooled heat sink, a busbar arrangement having at least two busbars, at least two power semiconductor modules, which are mechanically connected to the liquid-cooled heat sink for thermal conduction and are electrically connected to connections of the power converter module by the busbar arrangement has at least one coolant line forming a single structural unit with the busbar arrangement. The coolant line prevents additional power loss in the laminated busbar.09-29-2011
20100232111Power Converter - A power converter assembly includes a housing and at least one transistor module. The housing has a liquid cooled heat transfer surface. The at least one transistor module is mounted directly to the liquid cooled heat transfer surface and positioned at least partially within the housing.09-16-2010
20100232110COOLING APPARATUS AND POWER CONVERTER - A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.09-16-2010
20110242760POWER CONVERTER MODULE WITH A COOLED BUSBAR ARRANGEMENT - A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected to connections of the power converter module by the busbar arrangement. A second liquid-cooled heat sink is positively or non-positively connected to the busbar arrangement. A thermally conductive and electrically insulating layer is disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. Additional power loss arising in the busbar is dissipated by the second liquid-cooled heat sink, which is pressed with a clamping elements on a surface of the upper busbar.10-06-2011
20080239671Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle - A semiconductor element mounting substrate excellent in cooling performance and simple in structure is provided. The semiconductor element mounting substrate is a substrate 10-02-2008
20080259566EFFICIENTLY COOL DATA CENTERS AND ELECTRONIC ENCLOSURES USING LOOP HEAT PIPES - Disclosed in the present invention are ways for cooling components contained in enclosures that reject 500 or more Watts employing two phase passive heat transfer devices including Loop Heat Pipes and devices we refer to as LHPLs. The methods minimize the amount of energy employed in cooing while at the same time maximizing the quality of heat rejected to the secondary cooling loops that transmit the heat to the outside world. Where data centers provide direct access to chilled water it becomes possible to reject heat directly to cooling towers in locations as hot and humid as Atlanta Ga. eliminating 40% or more of the total energy consumed. The key advances that make this energy efficient performance employ LHPLs that have the smallest possible total thermal resistance, methods that maximize their effectiveness and ancillary devices that minimize the energy consumed in move cooling air.10-23-2008
20100085712Liquid Cooling System - A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.04-08-2010
20080225487Power Inverter - The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other.09-18-2008
20080225486HEAT-DISSIPATING DEVICE CONNECTED IN SERIES TO WATER-COOLING CIRCULATION SYSTEM - A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.09-18-2008
20080225485Distributed transmit/receive integrated microwave module chip level cooling system - A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.09-18-2008
20080225484THERMAL PILLOW - Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.09-18-2008
20080225483FRAME MOUNTED MODULAR HYBRID COOLING SYSTEM - A modular cooling system (09-18-2008
20080225482SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE - A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.09-18-2008
20130170141Method for providing power supply, and a power supply device - A device for a power supply system of a working machine, for supplying electric power to at least one actuator is disclosed. The device includes a frame part with a bottom and a cooling liquid channel system The frame part includes a recess which can be arranged in a flow connection with the cooling liquid channel system). The device may be combined with other devices to form modules for the power supply system of the working machine.07-04-2013
20130094146LIQUID SUBMERSION COOLED NETWORK ELECTRONICS - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.04-18-2013
20130094145THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.04-18-2013
20130128460COOLING DEVICE WITH LIQUID FOR ELECTRONIC CARDS, IN PARTICULAR FOR HIGH PERFORMANCE PROCESSING UNITS - Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.05-23-2013
20080205002Composite board for heat dissipation and forming methodology - A composite board for heat dissipation, comprises two or three or more flat boards connected together through welding/bonding. There are multiple pipes formed between the flat boards for the heat dissipation liquid passing through. The heat dissipation liquid is controlled by a water pump. The electronic elements that generate heat contact the composite board directly or indirectly. A circuit is formed on at least one of the surfaces of the composite board, and the electronic elements are welded to the circuit. Thus, the heat in the case and the circuit board used in a computer, especially a notebook computer, may be dissipated more efficiently, available spaces may be increased, and the heat dissipation of airflow may be facilitated.08-28-2008
20110273845HIGH POWER BAND PASS RF FILTER HAVING A GAS TUBE FOR SURGE SUPPRESSION - A high power band pass RF filtering device having a housing for containing a printed circuit board with filtering components for achieving strong attenuation of out-of-band signals. An input port and an output port on the housing electrically connect to a respective input node and output node on the printed circuit board. Surge protection elements are connected at the input port and at the output port for dissipating surge conditions present at the input port or the output port to the housing before the surge travels through the printed circuit board. A non-surge signal present on the input port can travel through the filtering components on the printed circuit board towards the output port. An oil or other fluid is disposed and completely contained within the housing and contacts the printed circuit board for cooling the printed circuit board or the filtering components.11-10-2011
20100302733STACKED BUSBAR ASSEMBLY WITH INTEGRATED COOLING - A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.12-02-2010
20100315780ELECTRIC VEHICLE AND METHOD OF COOLING VEHICULAR DC/DC CONVERTER - The present invention relates to an electric vehicle and a method of cooling a vehicular DC/DC converter. A fuel cell vehicle, as one example of an electric vehicle, includes a DC/DC converter connected between an electricity storage device and a fuel cell, for converting a voltage generated by the electricity storage device and applying the converted voltage to a motor, and converting a regenerated voltage produced by the motor in a regenerative mode or a voltage generated by the fuel cell and applying the converted voltage to the electricity storage device, and a cooling apparatus for cooling the DC/DC converter. The cooling apparatus includes a cooling fluid passage therein for a cooling fluid that flows therethrough, the cooling fluid passage including a bend. The cooling apparatus constructed such that the cooling fluid flowing upstream of the bend cools upper arm devices, while the cooling fluid flowing downstream of the bend cools lower arm devices.12-16-2010
20100315779WATER-COOLED COMMUNICATION CHASSIS - A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.12-16-2010
20120020022PRINTED CIRCUIT BOARD COOLING ASSEMBLY - A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 01-26-2012
20130201628RADIATOR AND ELECTRONIC APPARATUS INCLUDING SAME - There is provided a radiator which includes a tank including first and second chambers that are separated from each other, the first and second chambers including first and second openings, respectively, a first tube including first and second ends, the first and second ends communicating with the first and second chambers, respectively, and a second tube being next to the first tube, the second tube including first and second ends communicating with the first and second chambers, respectively, wherein the first chamber includes first and second flow channels that communicate with the first opening, the first and second channels being split so as to sandwich at least part of the second chamber, and the first ends of the first and second tubes sandwich the second ends of the first and second tubes.08-08-2013

Patent applications in class Liquid

Patent applications in all subclasses Liquid