Class / Patent application number | Description | Number of patent applications / Date published |
361698000 | And liquid | 18 |
20080273306 | SYSTEM AND METHOD OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS - A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center. | 11-06-2008 |
20080298016 | COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS - A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device. | 12-04-2008 |
20090040722 | HEAT DISSIPATION MODULE AND DETACHABLE EXPANSION CARD USING THE SAME - A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route. | 02-12-2009 |
20090103266 | COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF - A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one. | 04-23-2009 |
20090122487 | SYSTEM OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS - A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center. | 05-14-2009 |
20100110634 | METHOD AND APPARATUS FOR AN ENVIRONMENTALLY-PROTECTED ELECTRONIC EQUIPMENT ENCLOSURE - A method and apparatus for an electronic equipment enclosure that provides directed airflow only to those volumes within the enclosure that require the airflow. The electronic equipment enclosure further provides protection from contaminants such as falling dirt, rain, sleet, snow, windblown dust, splashing water, hose-directed water, and ice. A pedestal may be coupled to the electronic equipment enclosure that facilitates movement of the electronic equipment enclosure via a pallet jack, forklift, front loader, or similar jacking device. A sidecar may also be coupled to one or more sides of the electronic equipment enclosure to facilitate vertically mounted equipment within the sidecar. | 05-06-2010 |
20110019364 | System And Method For Attaching Liquid Cooling Apparatus To A Chassis - A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening large enough to receive the fan. The grill is configured to be fastened to the fan and to the chassis such that, when the grill is so fastened, the fan is disposed at least partially in the interior volume and the grill substantially covers the air flow opening. At least one recess is formed either in the chassis or the grill such that a coolant conduit may be inserted into the recess when the grill is not fastened to the chassis and the coolant conduit is confined within the recess when the grill is fastened to the chassis. | 01-27-2011 |
20120106083 | LIQUID COOLING SYSTEM FOR AN ELECTRONIC SYSTEM - A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers. | 05-03-2012 |
20120120603 | AUTOMATICALLY RECONFIGURABLE LIQUID-COOLING APPARATUS FOR AN ELECTRONICS RACK - An apparatus is provided for cooling an electronics rack, which includes an electronic subsystem across which air passing through the rack flows. A cooling unit provides, via system coolant supply and return manifolds, system coolant in parallel to the electronic subsystem and an air-to-liquid heat exchanger disposed to cool, in normal-mode, air passing through the rack. A controller monitors coolant associated with the cooling unit and automatically transitions the cooling apparatus from normal-mode to failure-mode responsive to detecting a failure of the coolant. In transitioning to failure-mode, multiple isolation valves are employed in switching to a serial flow of system coolant from the electronic subsystem to the heat exchanger for rejecting, via the system coolant, heat from the electronic subsystem to air passing across the heat exchanger. | 05-17-2012 |
20120162918 | Passive Cabinet Cooling - An arrangement and a method for transferring surplus heat away from electronic components. An arrangement ( | 06-28-2012 |
20130188314 | VAPOR PHASE COOLING APPARATUS AND ELECTRONIC EQUIPMENT USING SAME - A vapor phase cooling apparatus ( | 07-25-2013 |
20130314874 | HEAT RADIATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat radiation system for a power module, including: a heat radiation member having an internal space and a cooling medium circulated in the internal space; a heat generation module formed on the heat radiation member; and a pair of electrodes formed at regions facing each other in the internal space of the heat radiation member and having different volumes. | 11-28-2013 |
20140133099 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 05-15-2014 |
20140362530 | COOLING DEVICE - A device for cooling at least two distinct heat sources comprises a closed circuit in which a diphasic fluid flows. At least one capillary evaporator is configured to be placed in thermo contact with one of the heat sources, referred to as the primary heat source. Each other heat source referred to as a secondary heat source that is to be cooled. At least one exchanger configured to be placed in thermal contact with the secondary heat source. At least one first condenser positioned downstream of the evaporator, and upstream of the at least one exchanger. At least one last condenser positioned upstream of the evaporator and downstream of the at least one exchanger. | 12-11-2014 |
20150092349 | IMPLEMENTING REDUNDANT AND HIGH EFFICIENCY HYBRID LIQUID AND AIR COOLING FOR CHIPSTACKS - A method and apparatus are provided for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks. The apparatus includes an electronic module having a chipstack of one or more semiconductor chips; a liquid heat sink lid over the chipstack; an inlet flow and an outlet flow enabling a low viscosity dielectric liquid to pass through the lid and around the chipstack of the electronic module; a top of said electronic module providing an airflow heat sink support surface for airflow cooling used in parallel to under-lid liquid cooling. | 04-02-2015 |
20160100503 | SYSTEMS AND METHODS FOR COOLING A PROBE DISPOSED ABOUT A HOT GAS PATH - A system for cooling a probe disposed about a hot gas path is disclosed herein. The system may include a probe holder having a main body including an inner passage, an intermediate passage, and an outer passage. The intermediate passage and the outer passage may be in fluid communication. The probe may be disposed within the inner passage of the probe holder. The probe may include an internal passage. The system also may include a first cooling circuit in fluid communication with internal passage of the probe. Moreover, the system may include a second cooling circuit having an inlet in fluid communication with the intermediate passage and an outlet in fluid communication with the outer passage. | 04-07-2016 |
20160105998 | Electronic Component Cooling - A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component. | 04-14-2016 |
20190148259 | POWER CONVERTER AND POWER CONVERTER FOR RAILROAD VEHICLE | 05-16-2019 |