Class / Patent application number | Description | Number of patent applications / Date published |
361696000 | With heat exchanger unit | 74 |
20080198549 | COOLING SYSTEM AND METHOD - A system for cooling a data center includes a plurality of cooling racks, with each cooling rack including a housing and cooling system components supported by the housing. The system further includes a fluid communication system coupled to the cooling system components of the plurality of racks. The fluid communication system is configured to provide chilled coolant to and exhaust heated coolant from coolant system components of each cooling rack. The system also includes at least one controller coupled to each cooling rack of the plurality of cooling racks to control the operation of each cooling rack. The plurality of cooling racks and the fluid communication system are configured to be modular to allow placement of cooling racks in different locations in a row of equipment racks within the data center. Methods of cooling a data center are further disclosed. | 08-21-2008 |
20080204999 | Targeted Cooling for Datacenters - A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value. | 08-28-2008 |
20080291626 | METHOD AND APPARATUS FOR COOLING ELECTRONIC EQUIPMENT - A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop comprises a heat exchanger, and propagating the air out of the first enclosed area by passing through the heat exchanger into a second enclosed area, where the air is cooled by passing through the heat exchanger. | 11-27-2008 |
20090027854 | COOLING SYSTEM FOR A ROTARY TABLET PRESS - A cooling system for a rotary tablet press with which a rotor is driven by an electrical drive motor and the rotor and drive motor are arranged in a closed housing, and a control cabinet for the drive motor and further units in the housing, wherein arranged within the housing is a cooling machine whose evaporator is part of a first heat exchanger, whose other part is arranged in a coolant circuit for the drive motor, a fan is arranged in a channel in the housing closed relative to the housing interior, where the fan draws cool air in via an air inlet of the housing and gives it off via an air outlet of the housing, wherein the cool air is engaged in heat exchange with a condenser of the cooling machine. | 01-29-2009 |
20090052132 | Heat Exchanger for Outdoor Enclosures - A heat exchanger having a wet side separate from a dry side for an equipment cabinet is provided. The heat exchanger includes a heat exchanger enclosure having a wet side fan and a dry side fan. The wet side fan draws air in from the external environment and routes the air through a heat exchanger core and out the heat exchanger enclosure. The dry side fan draws air in from within the equipment cabinet and routes the air through the heat exchanger core and out back into the equipment cabinet. The air from the outside acts to cool the heat exchanger core, which in turn acts to cool the air from the dry side as the air is routed through the heat exchanger core. | 02-26-2009 |
20090052133 | ELECTRONIC APPARATUS - According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other. | 02-26-2009 |
20090073654 | Compact surface-mount heat exchanger - A temperature-stable portable device includes equipment enclosed in a portable case that seals the equipment from its surroundings, and a heat exchanger distinct from the case and attached to the exterior of the case by removable fasteners. The heat exchanger extends across at least most of a major surface of the case and is positioned to receive heat from the major surface by conduction. A sheet of material having good thermal conductivity is interposed between, and in contact with, the heat exchanger and the major surface of the case. The heat exchanger defines a chamber that is open to the atmosphere and has parallel flow passages and an arrangement for moving a heat exchange fluid through the chamber and out to the atmosphere in order to remove heat from the heat exchanger by convection. | 03-19-2009 |
20090073655 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller. | 03-19-2009 |
20090086432 | DOCKING STATION WITH CLOSED LOOP AIRLFOW PATH FOR FACILITATING COOLING OF AN ELECTRONICS RACK - A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein through an access opening in the wall. The enclosure is separate and freestanding from the electronics rack, and when the electronics rack is operatively positioned within the central opening, the enclosure surrounds the electronics rack and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly disposed within the air return pathway of the enclosure for cooling circulating air passing through the closed loop airflow path. | 04-02-2009 |
20090086433 | APPARATUS AND DOCKING STATION FOR COOLING OF COMPUTING DEVICES - An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described. | 04-02-2009 |
20090135561 | Electronic device with airflow field - An electronic device with airflow field is disclosed, which comprises a housing, several heat sources, a plurality of openings, an air inlet and an air outlet module. By the use of sealed structure of electronic device, the airflow field can be formed inside the housing to direct the airflow for passing through the surface and bottom of each heat source, for the purpose of taking the heat away from the heat sources and promoting the efficiency of heat dissipating greatly. The axial direction of the fan is vertical to the supporting body for forming a sealed space with a local high pressure. It can raise the flow rate and lower the noise of the wind shear from turbulent flow. | 05-28-2009 |
20090207567 | METHOD AND AIR-COOLING UNIT WITH DYNAMIC AIRFLOW AND HEAT REMOVAL ADJUSTABILITY - Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center. | 08-20-2009 |
20090244843 | COOLING DEVICE AND ELECTRONIC APPARATUS HAVING THE COOLING DEVICE - A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire. | 10-01-2009 |
20090268404 | ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK - Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism. | 10-29-2009 |
20090296346 | Housing With Cooling For Electronic Equipment - A housing for electronic equipment comprises a heat exchanger for exchanging heat between a liquid-containing medium and a gas. This heat exchanger comprises a medium inlet and a medium outlet and a flat heat exchanger mat. The mat comprises a number of parallel, equidistant capillaries of heat-conducting material and wires of heat-conducting material which are attached in heat-conducting contact to the capillaries, extend in transverse direction relative thereto and have a mutual distance in the order of magnitude of the diameter of the wires, wherein air can flow along the wires for heat exchange between this air and the medium flowing through the capillaries. The heat exchanger is embodied such that the air flows along the mat and at least a substantial part of the air is prevented from flowing through the mat, and that it is ensured that the air flows along the wires in longitudinal direction of these wires. | 12-03-2009 |
20090296347 | HEAT DISSIPATION DEVICE - A securing device includes a securing member defining a securing hole therein, and a fastener extending through the securing hole. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes a large portion, a small portion, and a concave around the small portion. A diameter of the small portion is greater than the main portion and smaller than the fixing portion. A diameter of the large portion is greater than the fixing portion and smaller than the spring. The main portion extends through the small portion with the fixing portion tightly abutting the securing member. The spring is mounted around the main portion and received in the concave. The spring is compressed between the head portion and a step of the securing member in the concave. | 12-03-2009 |
20090310304 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink. | 12-17-2009 |
20100020494 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a fan. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The first fin assembly includes a plurality of parallel first fins arranged side by side. A first airflow channel is formed between each two neighboring first fins and communicates with a top side of the heat sink. Each of the second fin assemblies includes a plurality of parallel second fins. A second airflow channel is formed between each two neighboring second fins and communicates with the top side of the heat sink. The first fins are perpendicular to the second fins with the first airflow channels and the second airflow channels communicating with four sides of the heat sink, respectively. | 01-28-2010 |
20100033931 | COOLING UNIT, ELECTRONIC APPARATUS RACK, COOLING SYSTEM, AND CONSTRUCTION METHOD THEREOF - A cooling unit which improves the cooling efficiency of a server rack and minimizes rise in the server room temperature. A cooling unit for a server rack housing a server with a heat source includes: a fan unit having an array of fans for discharging hot air generated by the heat source from the rack; and a radiator unit having an array of pipes for guiding coolant to remove heat from the hot air discharged from the rack by rotation of the fans; and a frame unit which integrally combines the fan unit and the radiator unit. The cooling unit constructs a back door from which the hot air inside the rack is discharged. | 02-11-2010 |
20100073876 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels. | 03-25-2010 |
20100079948 | Display Device - A display device according to the present invention comprises a display part, an accommodating part accommodating the display part, circulating means for circulating air in the accommodating part around the display part, and a heat exchanger arranged on a rear surface side of or below the display part. The circulating means includes a fan arranged adjacent to the heat exchanger, and the fan sends air toward the heat exchanger. | 04-01-2010 |
20100079949 | Display Device - A display device according to the present invention comprises a display panel, an accommodating part accommodating the display panel, circulating means for circulating air in the accommodating part around the display panel, a heat exchanger collecting heat from the air, which is arranged on a rear surface side of the display panel, and a heat insulating member provided between the heat exchanger and the display panel. Another display device according to the present invention comprises a display panel, an accommodating part accommodating the display panel, a fan forming an air flow on a display screen of the display panel, a heat exchanger collecting heat from air, which is arranged on a rear surface side of the display panel, and a heat insulating member provided between the heat exchanger and the display panel. | 04-01-2010 |
20100085708 | HIGH-EFFICIENCY, FLUID-COOLED UPS CONVERTER - An interruptible power supply (UPS) may include direct cooling for various components of the UPS that generate heat. The direct cooling may be part of a cooling system that directs the generated heat to the ambient environment external to the room or building housing the UPS such that the heat load of the UPS places a minimal or zero load on the air-conditioning system for the room within which the UPS is located. The cooling system can utilize multiple cooling loops to transfer the heat from the heat-generating components of the UPS to the ambient environment. | 04-08-2010 |
20100118492 | System for Recirculation of Air in a Component of a Wind Turbine | 05-13-2010 |
20100149754 | AIR-BASED COOLING FOR DATA CENTER RACK - A high-velocity low-pressure cooling system ( | 06-17-2010 |
20100172097 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller. | 07-08-2010 |
20100188816 | HOT AISLE CONTAINMENT COOLING SYSTEM AND METHOD - An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed. | 07-29-2010 |
20100202108 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system ( | 08-12-2010 |
20100265660 | Energy Storage Cooling System - An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure. | 10-21-2010 |
20110051369 | PLASMA DISPLAY DEVICE - A plasma display device is provided with a chassis supporting a PDP on its front surface, circuit boards located within a specific region of the back surface of the chassis, a back cover including an edge portion covering the outside of the specific region of the back surface of the chassis and a projecting portion accommodating the plurality of the circuit boards, and a fan arranged inside a space defined by the projecting portion. The peripheral wall of the projecting portion is provided with a plurality of air inlets and a plurality of air outlets. | 03-03-2011 |
20110069452 | APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively. | 03-24-2011 |
20110075362 | ELECTRONIC DEVICE - According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall. | 03-31-2011 |
20110075363 | DISPLAY APPARATUS - A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing. | 03-31-2011 |
20110110040 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a fan having a plurality of first fixing cylinders, a heat sink having a plurality of second fixing cylinders, and a plurality of fasteners fixing the fan to the heat sink. Each of the fasteners includes a screwing post, an elastic member encircling the screwing post, and an annular fastening collar engaging with the screwing post. Each of the fasteners extends through a corresponding first fixing cylinder of the fan and a corresponding second fixing cylinder of the heat sink. The elastic member of each fastener is compressed between the corresponding first fixing cylinder and the corresponding second fixing cylinder. | 05-12-2011 |
20110157825 | TEST SLOT COOLING SYSTEM FOR A STORAGE DEVICE TESTING SYSTEM - A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter. | 06-30-2011 |
20110164384 | TANDEM FAN ASSEMBLY WITH AIRFLOW-STRAIGHTENING HEAT EXCHANGER - A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly. | 07-07-2011 |
20110170263 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system ( | 07-14-2011 |
20110205705 | AIRFLOW RECIRCULATION AND COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold. | 08-25-2011 |
20110211312 | BLOWER AND ELECTRIC APPARATUS INCLUDING THE SAME - A blower includes a fan, an inlet through which air is drawn into the fan, and an outlet through which an air flow from the fan is exhausted. The inlet and the outlet have slits with a specific width or an array of through holes with a specific diameter. The relationship A09-01-2011 | |
20110279976 | LOCAL COOLING UNIT AND COOLING SYSTEM - The local cooling unit according to an aspect of the present invention includes a housing having a cavity formed in the housing, an air inlet port which is provided in a bottom surface of the housing and which takes in exhaust heat air from the electronic device, an evaporator which is provided in the housing and which evaporates a refrigerant by heat exchange with air sucked in from the air inlet port to cool the air, the refrigerant passing through an inside of the evaporator, an air outlet port which is provided in a side surface of the housing and which exhausts the air cooled by the evaporator, and a fan which is provided on a side of the air inlet port or a side of the air outlet port of the housing and which moves the air from the air inlet port to the air outlet port. | 11-17-2011 |
20110292608 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink. | 12-01-2011 |
20110317364 | SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE - An exemplary embodiment of the present invention provides a system for cooling an electronic device. The system includes a plenum disposed adjacent to an interior surface of a housing for the electronic device, wherein the plenum is placed between a heat generating component and the interior surface of the housing, and wherein the plenum reduces heat transfer from the heat generating component to an exterior surface of the housing. The system also includes a fan configured to create an airflow in the plenum. | 12-29-2011 |
20120026690 | HEAT EXCHANGE MEDIUM AND ELECTRIC STORAGE DEVICE - A liquid heat exchange medium ( | 02-02-2012 |
20120063087 | CONTAINER DATA CENTER AND AIR INTAKE APPARATUS - A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a āVā shape along an orientation toward the airflow of the cold aisle. | 03-15-2012 |
20120075804 | PORTABLE ELECTRONIC DEVICE AND THERMAL MODULE THEREOF - A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole. | 03-29-2012 |
20120106081 | SYSTEM FOR COOLING AN ELECTRONIC IMAGE ASSEMBLY WITH A HEAT EXCHANGER HAVING INTERNAL FANS - A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions. | 05-03-2012 |
20120113593 | ELECTRONIC APPARATUS - An electronic apparatus includes a host, a fan module, and a heat-dissipating module. The host includes a first housing, a second housing, and a first housing vent that is located at the edge of the second housing. The fan module includes a fan outlet. The fan module is disposed in the host obliquely, so as to make the fan outlet face the first housing vent. The heat-dissipating module is located between the fan outlet and the first housing vent, and a portion of the first housing vent is located at the bottom of the heat-dissipating module. The airflow generated by the fan module is In exhausted out of the first housing vent via the heat-dissipating module from the fan outlet. | 05-10-2012 |
20120147562 | HEAT EXCHANGER, HEAT DISSIPATION METHOD OF THE SAME AND COMMUNICATION APPARATUS - A heat exchanger, a heat dissipation method and a communication apparatus are provided. The heat exchanger includes a first and a second air passage separated from each other. The first air passage has a first fan unit and a first group of heat dissipation tubules. The second air passage has a second fan unit and a second group of heat dissipation tubules. The upper ends of the first and second group of heat dissipation tubules are communicated with each other via a steam manifold. The lower ends of the first and second group of heat dissipation tubules are communicated with each other via a liquid manifold. A closed pipeline filled with liquid vaporized when heated, is formed by the first and second group of dissipation tubules, the steam manifold and the liquid manifold. Heat dissipation fins are set among the first and second group of dissipation tubules. | 06-14-2012 |
20120155027 | PORTABLE COMPUTER SERVER ENCLOSURE - A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature. | 06-21-2012 |
20120201004 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - A method and apparatus for real-time thermal characterization of a fully operating cooling device ( | 08-09-2012 |
20120236499 | RADIATION UNIT OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING SAME - A cooling unit includes a partition board, a heat exchanger, and a blower. The partition board is disposed on one of a plurality of surfaces of an electronic device so as to partition the inner and the outer side of the electronic device. The heat exchanger is disposed on the outer side so as to exchange heat generated by the electronic device with outside air. The blower is disposed on the outer side. The heat exchanger includes hot-air passage bodies and air pathways. The hot-air passage bodies include a plurality of air passages arranged side by side at predetermined intervals in such a manner as to connect a first vent and a second vent of the partition board on the outer side. The blower blows air of the inner side from the first vent to the second vent through the hot-air passage bodies. | 09-20-2012 |
20120293958 | HEAT DISSPATING APPARATUS AND ELECTRONIC DEVICE - A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided. | 11-22-2012 |
20120320526 | HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE USING THE SAME - A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening. | 12-20-2012 |
20130083482 | LOOP HEAT PIPE AND ELECTRONIC APPARATUS - A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector. | 04-04-2013 |
20130128459 | TRANSVERSE COOLING SYSTEM AND METHOD - A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral. | 05-23-2013 |
20130155616 | HYBRID HEAT SINK AND HYBRID HEAT SINK ASSEMBLY FOR POWER MODULE - Disclosed are a hybrid heat sink and a hybrid heat sink assembly for a power module. The hybrid heat sink comprises a base provided with at least one power module on one side thereof, a first heat dissipation unit being a first heat dissipation fin group which is composed of a plurality of heat dissipation fins intervally arranged and is located on the other side of the base, and a second heat dissipation unit comprising a plurality of heat pipes and a second heat dissipation fin group. Each of the heat pipes comprises an evaporating section provided in the base and close to the power module, a condensing section, and an adiabatic section located between the evaporating section and the condensing section and comprises an extension portion and a folding portion, the second heat dissipation fin group is provided on the condensing sections. | 06-20-2013 |
20130314873 | COOLING DEVICE FOR RACK-TYPE ELECTRONIC EQUIPMENT AND DATA CENTRE - The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes. | 11-28-2013 |
20140092556 | Integrated Blower Diffuser and Heat Exchanger for Electronics Enclosure - An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening. | 04-03-2014 |
20140133098 | INLET-AIR-COOLING DOOR ASSEMBLY FOR AN ELECTRONICS RACK - A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack. | 05-15-2014 |
20140268570 | POWER POLE ISOLATED HEAT PIPE INVERTER ASSEMBLY - A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation. | 09-18-2014 |
20140293540 | Heat Exchanger for Aircraft Application - A heat exchanger includes a plurality of mini-channel tubes. The mini-channel tubes extends for an axial length defined between two manifolds. The mini-channel tubes include a plurality of generally rectangular flow passages. The generally rectangular flow passages are aligned adjacent to each other to define a lateral dimension. A first lateral width of the generally rectangular passages is defined with a ratio of the axial length to the first lateral width being between 201.3 and 215.3. An aircraft system is also disclosed. | 10-02-2014 |
20140369003 | SYSTEM FOR COOLING AN ELECTRONIC IMAGE ASSEMBLY WITH A HEAT EXCHANGER HAVING INTERNAL FANS - A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions. | 12-18-2014 |
20150009626 | ELECTRIC EQUIPMENT AND AIR CONDITIONER - An electric equipment includes: an electric component box; a control board accommodated in the electric component box and provided thereon with a heat-generating electric component; a heat sink thermally connected with the electric component; and a sheet material provided between the electric component box and the control board, wherein the sheet material is made of an elastic material and provided with an opening section through which the heat sink projects outward, the opening section is provided with a convex section formed integrally with the sheet material and configured to be elastically deformed to engage the sheet material with the heat sink, and the electric component box is provided with a heat sink hole through which the heat sink and the convex section project outward of the electric component box. An air conditioner is provided with such electric equipment. | 01-08-2015 |
20150022973 | METHOD AND APPARATUS FOR CONTROLLING A COOLANT CIRCUIT THERMALLY COUPLED TO A POWER ELECTRONICS DEVICE - A vehicle system includes a power electronics device and a coolant circuit thermally coupled to the power electronics device. The coolant circuit includes a fluidic pump and a fluid/air heat exchanger, an air pump configured to transfer air across the fluid/air heat exchanger, and a shutter device configured to control airflow across the fluid/air heat exchanger. A controller controls the fluidic pump to control coolant flow through the fluid/air heat exchanger to reject heat from the power electronics device to the coolant and correspondingly controls the air pump and the shutter device to control airflow across the fluid/air heat exchanger to reject heat from the coolant to achieve a preferred heat rejection from the power electronics device. | 01-22-2015 |
20150062817 | SERVER - A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber. | 03-05-2015 |
20150116936 | Operating a Current Converter at a Path of Travel of Land Vehicles or at a Parking Space of a Land Vehicle - The invention relates to an arrangement for operating a current converter, in particular an inverter, wherein the converter is located at a path of travel of land vehicles or at a parking space of a land vehicle, the converter being adapted to support operation of at least one vehicle, the converter is combined with a cooling device adapted to cool the converter during operation, the cooling device is designed to use a heat transport medium in order to transport heat away from the converter, the arrangement comprises at least one pole and/or at least one supporting structure which is also located at the path of travel or at the parking space, the pole and/or the supporting structure extends upwards from ground, the arrangement comprises a conduct for conducting the heat transport medium and the conduct extends from the cooling device to the pole and/or to the supporting structure and also extends inside the pole and/or inside the supporting structure so that heat can be transferred from the heat transport medium inside the pole and/or inside the supporting structure to the ambiance. | 04-30-2015 |
20150116937 | ELECTRONIC DEVICE WITH WATERPROOF ENCLOSURE - An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure. | 04-30-2015 |
20150327400 | ELECTRONIC SYSTEM AND EXPANSION BASE THEREOF - An electronic system includes an expansion base and an electronic device. The expansion base includes a base body, a first pipe line, a liquid cooler and a driving unit. The base body includes a first connecting portion disposed in the base body. The liquid cooler is connected to the first connecting portion via the first pipe line. The driving unit connects the first pipe line. The electronic device includes a main body, a second pipe line and a liquid block. The main body includes a second connecting portion, and the second pipe line is connected to the second connection portion. The liquid block is connected to the second connecting portion via the second pipe line. The first connecting portion can be connected to the second connecting portion to form a circulation flow channel to drive heat exchange medium in the circulation flow channel by the driving unit. | 11-12-2015 |
20150342023 | THERMAL CLAMP APPARATUS FOR ELECTRONIC SYSTEMS - An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger. | 11-26-2015 |
20150351216 | PASSIVE SYSTEM OF POWERING AND COOLING WITH LIQUID METAL AND METHOD THEREOF - Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed circuit board, a hollow conductive channel body attached to the printed circuit board to circulate the liquid metal to flow within the conductive channel so as to convey electrical power to the digital device during a power loss and transfer heat generated by the digital device, and a tube to deliver the liquid metal in and out of the hollow conductive channel body. A method of operating a liquid metal may involve the use of the passive system. | 12-03-2015 |
20150351282 | ELECTRONIC DEVICE AND DISPLAY DEVICE - According to one embodiment, an electronic device includes a housing, a heat-producing element inside the housing, a heat pipe contacting the housing between the housing and the heat-producing element while one end of the heat pipe is disposed in the proximity of the heat-producing element, and a heat-radiating element contacting the other end of the heat pipe to absorb heat from the heat pipe. | 12-03-2015 |
20160014928 | ELECTRONIC DEVICE AND COOLING SYSTEM | 01-14-2016 |
20160044828 | TRANSVERSE COOLING SYSTEM AND METHOD - A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral. | 02-11-2016 |
20160088753 | THERMALLY MANAGED ENCLOSURE - An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing. Also, a method of thermal management within an enclosure includes transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resisting housing. The method further includes passively removing the heat from the explosion resistant housing. | 03-24-2016 |