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Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361688000 - With cooling means

361689000 - Fluid

361690000 - Air

Patent class list (only not empty are listed)

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Class / Patent application numberDescriptionNumber of patent applications / Date published
361693000 Circular 6
Entries
DocumentTitleDate
20130044429COOLING ARRANGEMENT FOR SMALL FORM FACTOR DESKTOP COMPUTER - A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.02-21-2013
20110176274COOLING ELEMENT - A cooling element for an electronic apparatus can include an inlet for receiving fluid, an outlet for forwarding fluid from the cooling element, and multiple pipes providing parallel fluid paths for passing the fluid from the inlet to the outlet. To obtain a simple and efficient cooling element, multiple base plates for receiving electronic components can be attached to the pipes for conducting heat generated by the electronic components to the fluid in the pipes.07-21-2011
20110310557Display Apparatus and Electronic Apparatus - According to one embodiment, a display apparatus is provided. The display apparatus includes: a display panel; a case including a cover portion provided with an air outlet and a first air inlet; a mask portion provided with an opening which is connected to the cover portion via the display panel and through which the display panel is exposed, a slant portion which extends to the cover portion, and a second air inlet located at the slant portion. The apparatus further includes: a support stand which supports the case; a circuit board housed in the case and mounted with a heat generation body; a heat sink housed in the case and configured to face the air outlet; a heat pipe which thermally connects the heat generation body and the heat sink; and a fan including an air discharge outlet which is directed to the heat sink.12-22-2011
20090122484Cooling System - An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.05-14-2009
20130039008CONVERTER ARRANGEMENT WITH AN AIR COOLING SYSTEM - A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.02-14-2013
20130044428POWER SUPPLY SYSTEM - A power supply system includes a distribution board, two power supplies, an interface board, and a cable. The interface board comprises two parallel connectors arranged at a center portion of a first side of the interface board, a pair of vents respectively defined beside the two connectors, and a first adapter connector formed at an end portion of the first side. The distribution board is coupled to a second side of the interface board and comprising a second adapter connector arranged thereon. The power supplies are respectively connected to the two connectors and each defines an air vent in alignment with the vents of the interface board. The cable is connected between the first adapter connector and the second adapter connector.02-21-2013
20130027877ELECTRONIC DEVICE - An electronic device including a main body, a rotating base, a motherboard and a driving module is provided. The rotating base has a first vent. The rotating base is pivoted to the main body and suitable for being rotated between an operating position and a retracting position. When the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body. The driving module includes a controlling element and a first locking element. The controlling element is disposed on the main body and suitable for moving between an enable position and a disable position. The first locking element is connected to the controlling element, and the controlling element drives the first locking element to position the rotating base.01-31-2013
20120182688DIRECT COOLING SYSTEM AND METHOD FOR TRANSCEIVERS - Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module. The cage contains a second set of apertures such that when the transceiver module is inserted into the cage, air may flow into the cage through the second set of apertures, then flow into the transceiver module through one of the plurality of apertures in the transceiver module housing such that the air dissipates heat from the at least one internal component thermally coupled to the internal heat sink. The air may then flow out of the transceiver module through another of the plurality of apertures in the housing.07-19-2012
20120182687ADAPTIVE THERMAL MANAGEMENT FOR DEVICES - A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.07-19-2012
20130050942ELECTRONIC APPARATUS - An electronic apparatus includes: an outer casing in which an air inflow hole allowing outside air to flow into internal space and a heat releasing hole releasing air temperature of which has been increased in the internal space to the outside are formed; a circuit substrate arranged in the internal space of the outer casing and on which electronic components to be heat sources at the time of driving are mounted; and a heat sink having an attachment base attached to the circuit substrate and plural fins protruding from the attachment base, wherein the outer casing is provided with fluid guide portions positioned opposite to the plural fins of the heat sink and guiding the air with increased temperature, the fluid guide portions are inclined in directions toward the heat releasing hole and the plural fins are inclined to directions toward the heat releasing hole.02-28-2013
20130050941ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE - An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.02-28-2013
20090097201SETTOP BOX (STB) - Settop box (STB) or other housing for use in protecting electronic components. The housing may include an interior portion for protecting the components. The housing may include feet on a bottom and side to facilitate stabilizing the STB in a vertical and horizontal position. The housing may include vents to facilitate air flow to the interior. The vents may be associated with blocking aspects to protect against blocking the vents.04-16-2009
20090303681COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs) - A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.12-10-2009
20120307449CLIMATE MANAGEMENT SYSTEM, AND MANAGEMENT METHOD AND POWER SUPPLY SYSTEM USING SAME - A climate management system for a power supply system including a plurality of cabinets is disclosed. The climate management system comprises a plurality of climate control units connected and in communication with each other, wherein each climate control unit is disposed in a corresponding cabinet to monitor, manage and control the corresponding cabinet, wherein one of the climate control units is defined as a master climate control unit and the other of the climate control units are defined as slave climate control units; and a control system unit connected and in communication with the master climate control unit. The master climate control unit is configured to collect, process and integrate the information transmitted from the slave climate control units and report the collected, processed and integrated information to the control system unit.12-06-2012
20090268403SHIELDED AND INSULATED HEAT REMOVING SYSTEM - Various embodiments disclose a shielded or isolated heat dissipating system comprising a case, a heat sink base, and a circuit board comprising at least one electronic device for which heat dissipation is desired. The heat sink base is attached to the case and together with the shielding case defines an enclosed space within which electromagnetic interference is reduced. Both heat-dissipation function and electromagnetic shielding function may be achieved by the combination of the heatsink base and the case while maintain electrical isolation with one or more specially treated components. The space required for mounting the system may also be reduced without adversely affecting normal and stable operation of the electronic device.10-29-2009
20120224324ELCTRONIC DEVICE WITH HEAT AND DUST DISSIPATION MECHANISM - An electronic device includes a housing defining at least one outlet, a number of electronic components accommodated in the housing, at least one fan comprising an intake side and an opposite exhaust side, and a pipe defining a center hole and a number of small holes in the peripheral wall. The pipe includes a number of segments each being mounted adjacent to one of the electronic components. The exhaust side of the fan faces the outlet, and the intake side is coupled to the pipe for communicating with the center hole. When the fan is actuated, heat generated by the electronic components and dust retained within the housing is drawn into the pipe through the small holes and the center hole, and are finally exhausted out of the housing through the at least one outlet.09-06-2012
20130063894SERVER - A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.03-14-2013
20130063895SET-TOP BOX HAVING DISSIPATING THERMAL LOADS - A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.03-14-2013
20120194999DUCTED EXHAUST EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.08-02-2012
20090237879ELECTRONIC DEVICE HAVING A HEAT DISSIPATING MECHANISM - An electronic device having a heat-dissipating mechanism includes a housing and a cooling device. The housing is provided with an intake hole and a plurality of exhausting holes. The interior of the housing is provided with a heat-dissipating fan. The cooling device includes a cooling chip, at least one cooler and at least one heater. The cooling chip has a cold end and a hot end opposite to each other. The cooler is connected to the cold end of the cooling chip. The cooler is arranged at one side of the heat-dissipating fan in the direction of airflow generated by the heat-dissipating fan. The heater is connected to the hot end of the cooling chip. The heater is located outside the housing and corresponds to the locations of the exhausting holes. Via this arrangement, the temperature within the housing of the electronic device can be reduced efficiently.09-24-2009
20130163201ELECTRONIC DEVICE - An electronic device including a first body, a rotating base and a transmission module is provided. The rotating base has a first ventilation opening. The rotating base is pivoted on the first body and suitable for rotating between a using position and a retracted position in relative to the first body. When the rotating base is located at the retracted position, the first ventilation opening is exposed from the first body. When the rotating base is located at the using position, the first ventilation opening is retracted in the first body. The transmission module is connected to the rotating base for outputting a mechanical force to actuate the rotating base.06-27-2013
20110299246MODULAR ELECTRONICS HOUSING - A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend outwardly beyond the corresponding vertical edges of the housing side walls, respectively. Vertical side members having generally U-shaped horizontal cross-sectional configurations are mounted on the outwardly extending edge portions of the printed circuit board, respectively, with the leg portions of each side member extending between the housing side walls and the printed circuit board, respectively, whereby portions of housing side walls overlap the side member leg portions. The upper end of the chamber is closed by a lid member that is fastened between the upper ends of the side members.12-08-2011
20130163200Display Device - A display device has a display panel, a cabinet configured to accommodate the display panel, a ventilating portion configured to communicate with the space inside the cabinet, a lid configured to covers the ventilating portion, a first and second vents formed on the lid, a first hood provided on the first vent, the first hood has an opening facing the second vent, and a second hood provided on the second vent, the second hood has an opening facing the first vent.06-27-2013
20110299245FAN ASSEMBLY AND ELECTRONIC DEVICE INCORPORATING THE SAME - An exemplary fan assembly includes a fan and a muffler. The fan includes an air outlet. The muffler is disposed at the air outlet of the fan. The muffler includes a base plate. The base plate defines vents therein and blades thereon corresponding to the air outlet of the fan. The blades extend from the base plate toward the fan. An electronic device incorporating the fan assembly is also provided.12-08-2011
20120155024ELECTRONIC APPARATUS - According to one embodiment, a television attachment device includes a case, a fan unit, a fin unit and a heat pipe. The fan unit includes a case, a fan main body rotatably provided inside the case, and a motor fixed to the inner surface of a second wall and rotating the fan main body. The fin unit is arranged adjacent to a first side portion of the case. The heat pipe includes a first end portion connected to a circuit component, and a second end portion opposed to the first end portion, close to the second wall and connected to the fin unit.06-21-2012
20110292602COOLING ARRANGEMENT FOR A RACK MOUNTED PROCESSING DEVICE - To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.12-01-2011
20120033378ELECTRONIC DEVICE MODULE WITH MOVABLE SHIELD FOR ANTI-ELECTROMAGNETIC INTERFERENCE - An electronic device module includes an electronic device, a rack accommodating the electronic device, and a shield adjusting assembly. The rack defines a number of ventilation holes, and the shield adjusting assembly defines a number of through holes. The electronic device is placed in the rack to drive the shield adjusting assembly to a first position in which the through holes align with the ventilation holes. When the electronic device is detached from the rack, the shield adjusting assembly is restored by a resilient element to a second position in which the through holes offset the ventilation holes such that the ventilation holes are shielded.02-09-2012
20090207566Method for operating switched-mode power supply units - In a process for operating an air-cooled mains supply unit for industrial application, temperatures influenced by outer heat sources and by heat sources arranged in the mains supply unit are measured by thermo-elements and reported to a control system. Temperatures measured by at least two thermo-elements arranged at different measurement points are reported to the control system, and the measured temperatures are compared with temperature patterns. The comparison with known temperature patterns makes it possible to sense the totality of the thermal conditions continuously and to derive therefrom ratings for the control system.08-20-2009
20110170262Electronic Device Housing Having a Movable Foot Pad Mechanism - An electronic device housing includes a housing body, a movable foot pad mechanism disposed in housing body, a ventilation grille, a fan, and a fan switch connected electrically to the fan. The movable foot pad mechanism includes a foot pad pivoted to a bottom wall of the housing body. The foot pad is turnable pivotally to prop up the housing body so as to increase a space below a bottom of housing body. When the foot pad is being turned pivotally to prop up the housing body, the ventilation grille is moved simultaneously so as to make the space inside the housing body open to the ambient environment, and the fan is activated for heat dissipation, thereby increasing the heat dissipation efficiency of the electronic device housing.07-14-2011
20090279253Cooling configuration for communication boards - A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.11-12-2009
20120293956CAR ELECTRIC EQUIPMENT CASE MODULE - A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.11-22-2012
20120293957HEAT DISSIPATING SYSTEM FOR COMPUTER - A heat dissipating system includes an enclosure, which includes a rear plate and a side plate. A heat sink is mounted on the side plate. A power supply unit is mounted on the rear plate. A first fan is mounted in an inner room of the power supply unit. The power supply unit includes a bottom wall which defines a plurality of first vent holes and a rear wall which defines a plurality of second vent holes. The first fan is aligned to the plurality of second vent holes. The bottom wall is located above the heat sink. The first fan is adapted to rotate to drive air flowing in the power supply unit via the plurality of first vent holes from the heat sink, and following out of the power supply unit via the plurality of second vent holes.11-22-2012
20100103615FAN AND STORAGE DEVICE MOUNTING ASSEMBLY FOR ELECRONIC DEVICE04-29-2010
20110267775SIDE-EXHAUST COOLING SYSTEM WITH EXTENSIBLE DUCT FOR RACK MOUNTED EQUIPMENT - A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.11-03-2011
20080239664HEAT DISSIPATING SYSTEM FOR COMPUTER - A heat dissipating system is used for dissipating heat from a computer enclosure. The computer enclosure includes a front plate, a rear plate, and a side plate connected between the front and rear plates. First and second heat dissipating devices are accommodated in the enclosure. A motherboard is mounted on the side plate. A plurality of interface cards is mounted on the motherboard. The interface cards are located between the first and second heat dissipating devices.10-02-2008
20080266789Telecommunication cabinet with airflow ducting - A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.10-30-2008
20090129015ACOUSTICALLY ABSORPTIVE ANTI-RECIRCULATION PANEL FOR ONE OR MORE ELECTRONICS RACKS OF A DATA CENTER - An acoustically absorptive panel is provided configured to reside above multiple electronics racks disposed in a row within a data center. The acoustically absorptive panel is configured to extend a height above the multiple electronics racks sufficient to at least partially block hot air recirculation from one or more air outlet sides of the multiple electronics racks to one or more air inlet sides of the electronics racks. The acoustically absorptive panel includes an acoustically absorptive material selected to attenuate noise, and in one embodiment, includes printed material on at least one side thereof related to one or more of the multiple electronics racks.05-21-2009
20110205702APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF LIGHT EMITTING DIODES - An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.08-25-2011
20090129014Equipment Rack and Associated Ventilation System - A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.05-21-2009
20090185346Electrical enclosure cooling structure assembly and method - An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.07-23-2009
20080316702EXHAUST AIR DUCT WITH ADJUSTABLE FILLER PANEL ASSEMBLIES - An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members disposed near one end. The first and second panels are connected to one another in an overlapping arrangement to form an air-blocking panel assembly with the attachment members of the second panel being aligned with and connected to a pair of adjustment openings of the first panel. In addition, the first panel and the second panel are telescopically adjustable relative to one another such that a length of the air-blocking panel assembly is selectively adjustable to fill at least a portion of an opening in the electronic equipment enclosure, thereby blocking air from flowing through the opening.12-25-2008
20110222241HIGH DENSITY SWITCHING PLATFORM WITH INTERBAY CONNECTIONS ARRANGEMENT - A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.09-15-2011
20090219686GAS EJECTOR, ELECTRONIC DEVICE, AND GAS-EJECTING METHOD - A gas ejector capable of effectively dissipating heat generated from a heater while inhibiting noise generation as little as possible, an electronic device equipped with the gas ejector, and a gas-ejecting method are offered. A gas ejector (09-03-2009
20090237880Equipment Rack And Associated Ventilation System - A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.09-24-2009
20120195000OUTDOOR UNIT OF AIR CONDITIONER - An outdoor unit of air conditioner for efficiently cooling a board having a heater element and a heat generating component in an electrical component box, thereby enhansing heat release efficiency. Air flowing from a machinery chamber 08-02-2012
20100014247ANTI-TURBULENT CASING - An anti-turbulent casing includes a plate and an airflow guiding element. The plate has a first surface and a second surface opposite to the first surface. The first surface faces outward, and the second surface faces an interior of an electronic device. In addition, the plate has an opening passing through the first surface and the second surface. The airflow guiding element is disposed on the plate and has a curved surface and two sidewall surfaces connected between the curved surface and the second surface, and the curved surface protrudes out of the second surface and extends on top of the opening. The airflow guiding element makes the cooling airflow in a state of laminar.01-21-2010
20100188815Heat Radiation Mechanism of Electronic Apparatus and Electronic Apparatus - In a heat radiation mechanism of an electronic apparatus, an opening allowing flow of air between a first duct side and a second duct side is formed on a portion mounted with a heating device of a circuit board in an air flow route constituted by a first duct and a second duct, and heat generated from the heating device is radiated from a first vent hole or a second vent hole through the air flow route.07-29-2010
20110110038COOLING CONFIGURATION FOR COMMUNICATION BOARDS - A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.05-12-2011
20120195001ELECTRONIC DEVICE - An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.08-02-2012
20090279252Cooling air distribution scheme for communication boards - A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.11-12-2009
20100321886Enclosure Element - An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second side wall, for entering or exiting air, so that the venting element generates in the interior of the enclosure an air current that preferably flows vertically to the surface of the side walls.12-23-2010
20110026223ELECTRONIC APPARATUS - An electronic apparatus has a case having a bottom wall in which a first vent is formed and a circumferential wall connected to a perimeter of the bottom wall; a printed circuit board housed in the case; an electronic component which is mounted on the printed circuit board and generates heat when powered; a fan which has an air outlet and sends out a wind through the air outlet in such a direction that the wind goes away from a rotation axis of a rotor; a heat radiation member opposed to the first vent and the air outlet of the fan; and a heat pipe which is disposed between an associated part of the circumferential wall and the heat radiation member and transmits heat generated by the electronic component from the electronic component to the heat radiation member.02-03-2011
20110110037DRIVER MODULE STRUCTURE - Provided is a driver module structure capable of ensuring high reliability.05-12-2011
20110043997COOLING SYSTEM AND ELECTRONIC DEVICE USING THE SAME - A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.02-24-2011
20110116230SYSTEM FOR CONTROLLING TEMPERATURE OF ANTENNA MODULE - A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.05-19-2011
20130155611ELECTRONIC DEVICE HAVING DUST CLEANING APPARATUS - An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.06-20-2013
20130155612ELECTRONIC DEVICE AND ELECTRONIC INSTRUMENT - An electronic device includes: a plurality of slots where a plurality of electronic instruments are mountable; and an electronic instrument inserted in any of the plurality of slots; wherein the electronic instrument includes a flow rate limiting member that protrudes to a side of an adjacent slot where no electronic instrument is mounted and limits a flow rate of cooling air flowing through the adjacent slot.06-20-2013
20110085298COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.04-14-2011
20110085299Substrate cooling apparatus, substrate cooling method, and storage medium - A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.04-14-2011
20100053892ELECTRONIC DEVICE AND HEAT SINK THEREOF - An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.03-04-2010
20120243176SET-TOP BOX HAVING MICROPERFORATIONS - The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.09-27-2012
20100053891SYSTEM AND METHOD FOR MINIATURIZATION OF SYNTHETIC JETS - A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.03-04-2010
20110069450Network Cabinet with Thermal Airflow Management System - A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.03-24-2011
20110069449ELECTRONIC DEVICE ENCLOSURES HAVING IMPROVED VENTILATION TO DISSIPATE HEAT - Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.03-24-2011
20120201002SYSTEM AND METHOD FOR AN OPTIMIZABLE RACK SOLUTION - In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.08-09-2012
20120069520ELECTRONIC DEVICE WITH COOLING CAPABILITY - In the electronic device, an inlet 03-22-2012
20120063085Jet Impingement Heat Exchanger Apparatuses and Power Electronics Modules - A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.03-15-2012
20100284148ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a wall defining a slot therein, and a number of spaced bent plates formed on the wall bestriding the slot. Every two adjacent bent plates bound an opening in communication with the slot. The slot can allow more airflow to pass therethrough, and the number of bent plates can guide more airflow slantingly flowing towards the wall of the electronic device enclosure into or out the electronic device enclosure through the openings.11-11-2010
20100214743PORTABLE ELECTRONIC DEVICE WITH AN ACTUATING ELEMENT TO LIFT INPUT/OUTPUT MODULES - A portable electronic device includes a screen module, a main body module and an input/output module. The screen module is pivotally connected with the body module. The input/output module is electrically connected with the main body module. An actuating element is disposed at a bottom of the screen module. When the screen module is opened respectively to the body module to be opened, the actuating element is driven to swing to push a front end of the input/output module to be lifted to drive the input/output module to be out of a state that the keyboard abuts against the main body module. Therefore, the portable electronic device is easy to be operated. Moreover, the heat dissipation is improved to keep the internal temperature low and reduce energy consumption.08-26-2010
20100067195ELECTRONIC APPARATUS - An electronic apparatus includes a housing including an outlet formed in a first surface thereof and a filter storage opening formed in a second surface thereof; a heat radiating member disposed closer to the outlet than the filter storage opening in the housing and to radiate heat received from a heating electronic component to the air flowing through an inlet thereof; a filter member inserted into the housing through the filter storage opening and disposed on the front surface of the inlet; a filter receiving portion; and a fan disposed at a side the filter member across from the heat radiating member and feeding air into the inlet. The filter receiving portion receives a tip supporting portion of the filter member at a position away from the inlet. The lid portion has such a dimension that the filter storage opening is closed.03-18-2010
20090116187OPACITY ENCLOSURE FOR FIPS 140-2 - In one embodiment, an opaque enclosure for an electronics module includes an inner barrier having downward-facing louvers for allowing air flow and a cover having vent holes. The vent holes and downward-facing louvers are oriented so that the interior of the electronics module is not visible through the vent holes of the cover.05-07-2009
20120147561HEAT DISSIPATION DEVICE, HEAT DISSIPATION METHOD FOR COMMUNICATION DEVICE, AND COMMUNICATION DEVICE - Embodiments of the present invention disclose a heat dissipation device, including: a closed shell and a temperature control device. The temperature control device includes: a cold storage medium module, a first group of thermosiphons, and a second group thermosiphons; wherein the cold storage medium module is disposed at the outside of the closed shell, the first group thermosiphons are provided with a first group of evaporation ends and a first group of condensation ends, and the second group of thermosiphons are provided with a second group of evaporation ends and a second group of condensation ends. Embodiments of the present invention also disclose a communication device and a heat dissipation method for a communication device. The above technical solutions save electric energy and improve the effects of energy saving and emission reduction of the system.06-14-2012
20120099276WATERPROOF MODULE AND ELECTRICAL EQUIPMENT CABINET EMPLOYING SAME - An electrical equipment cabinet includes a main body and at least one waterproof module. The main body has a surface with an airflow outlet. The waterproof module is installed on the at least one surface of the main body, and includes a covering member, a first water-retaining structure and a second water-retaining structure. The covering member has a first opening. The first water-retaining structure has a second opening. The second opening is not aligned with the first opening. A periphery of the airflow outlet is enclosed by the second water-retaining structure. A heated airflow generated from an internal portion of the main body is exhausted out of the electrical equipment cabinet through the airflow outlet, the second opening and the first opening. If the electrical equipment cabinet is hit by rain, the rain is sequentially blocked by the covering member, the first water-retaining structure and the second water-retaining structure.04-26-2012
20120155023ELECTRONIC DEVICE - An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.06-21-2012
20110317361Mobile measurement device - A mobile measurement device, particularly for temporary use in or on vehicles, on stationary engines, or on test benches, consists of individual components (12-29-2011
20110317360Cooling structure for housing device - With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.12-29-2011
20120044641ELECTRONIC DEVICE - An electronic device includes an enclosure. The enclosure includes a main body and a cover attached to the main body. A first air intake and a second air outlet are defined in the cover. A first heat device and a circuit board are attached to the main body. The first heat device includes a plurality of first fins. A second heat device is located on the circuit board and configured to dissipate heat from a CPU located on the circuit board. A heat pipe is located between the first heat device and the second heat device. A distance between adjacent first fins is in a range of 5.3-5.7 mm, and the second heat device, the first heat device and the first air outlet cooperatively define an airflow passage configured for directing air to flow through to the electronic device.02-23-2012
20120044642Cooling Methodology for High Brightness Light Emitting Diodes - The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management.02-23-2012
20110096497EXTERNAL HEAT DISSIPATION DEVICE - An external heat dissipation device includes a housing, a circuit board placed in the housing, a fan electrically connected to the circuit board, and a wire electrically connected to the circuit board to power the fan. The housing includes an installation dock defining a receiving space for receiving the fan therein, and an insertion portion extending from the installation dock. A through hole is defined in the installation dock. An air passage is defined in the insertion portion. The fan includes a casing defining a first air hole communicating with the through hole and a second air hole communicating with the air passage.04-28-2011
20120014062COOLING DUCT ATTACHMENT AND SEALING FOR A MOTOR DRIVE - The present invention relates generally to efficiently cooling converter and inverter components of a drive system in accordance with present embodiments. More specifically, present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. These channels are formed by various duct segments coupled together or integrated to form the duct system. In particular, the duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The air inlet section may include a blower for blowing cooling air through the duct channel paths of the converter and inverter sections. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another. Further, the inverter section, converter section, and air inlet section are configured to roll into and out of a cabinet, which facilitates access to field wiring.01-19-2012
20120026687HOUSING AND ELECTRONIC DEVICE USING THE SAME - A housing of an electronic device includes a sidewall and a heat dissipating zone on the sidewall. The heat dissipating zone includes a reinforcement portion on the sidewall. The reinforcement portion defines heat dissipating holes. The reinforcement portion can extend inwardly from the sidewall of the housing or outwardly from the sidewall of the housing. Each heat dissipating hole has a width equal to or less than 3.5 millimeters.02-02-2012
20090009964Heatsink and Cooling Apparatus - A heatsink and a cooling apparatus for cooling a heating element wherein the heatsink includes a rolled metal plate having a central axis at a central portion thereof. The metal plate has a first end and a second end. The second end is arranged closer to the central axis than the first end. The metal plate has a height in a direction of the central axis that gradually increases from the first end toward the second end in a radial direction.01-08-2009
20120155022RF SHIELDED ENCLOSURE FOR AUTOMATED TESTING - An apparatus for restricting the flow of RF energy when attached to a tester wherein test equipment is positioned within the apparatus, comprising: a lid; a base; hinges for attaching the lid to the base; EMI gasket material for sealing seams; latches for attaching the lid to the base and for applying forces between the lid and the base to provide compression of the EMI gasket material for proper sealing of the seams; a connection point for providing two axis alignment of the base to the tester; and a positioning plate for providing three axis alignment of the test equipment in relation to the tester.06-21-2012
20090135559Network Cabinet with Thermal Air Flow Management System - A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.05-28-2009
20120300399ELECTRONIC DEVICE WITH HEAT DISSIPATION STRUCTURE - An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.11-29-2012
20120300398MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.11-29-2012
20090273902OUTDOOR APPARATUS - An outdoor apparatus that incorporates a heat sink and has a box-shaped casing, having a plurality of aligned ventilation holes formed on an upper plate and a lower plate so as to oppose the heat sink, and wherein inter-hole portions that are portions of the upper plate between adjacent ventilation holes are recessed downward with respect to other portions of the upper plate.11-05-2009
20100172092ELECTRONIC EQUIPMENT ENCLOSURE WITH SIDE-TO-SIDE AIRFLOW CONTROL SYSTEM - An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.07-08-2010
20120120600HORIZONTAL SUBRACK AND COMMUNICATION CABINET - A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.05-17-2012
20120250255POWER CONVERTING APPARATUS - A power converting apparatus includes a housing base, a main body, an air duct, a pair of upright air duct walls, first and second heat generators, and a protrusion. The housing base has first and second surfaces. The main body is on the first surface. The air duct is for cooling air to flow through the air duct and is on the second surface. The upright air duct walls are on the second surface and extend from an upwind side to a downwind side. The first and second heat generators are disposed in series from the upwind side to the downwind side in the air duct. The protrusion is between the first and second heat generators to protrude from at least one of the pair of air duct walls toward a center portion of an air-flowing space for the cooling air.10-04-2012
20120250254MOTOR CONTROL APPARATUS - A motor control apparatus is configured to control driving of a motor. The motor control apparatus includes a housing base, a main portion, an air duct, a heat dissipating component, and a heat sink. The housing base has one surface and another surface. The main portion is on the one surface of the housing base and includes a substrate. Through the air duct, cooling air passes. The air duct is on the other surface of the housing base. The heat dissipating component is on the one surface of the housing base and is coupled to the substrate. The heat sink includes a base portion and at least one fin. The heat sink is on the other surface of the housing base at a position corresponding to the heat dissipating component with the housing base disposed between the base portion and the heat dissipating component.10-04-2012
20100290185ELECTRONIC DEVICE WITH A FAN - An electronic device includes a fan including a frame, and an enclosure. The frame includes a plurality of mounting holes respectively positioned in a plurality of diagonal corners of the frame. The enclosure includes a plurality of sidewalls and a plurality of fixing members to fix the fan in the enclosure. Each of the plurality of fixing members projects from an inner surface of one of the plurality of sidewalls and is integrally formed with the sidewall. Each of the plurality of fixing members includes a clasping portion, and a cushioning portion between the clasping portion and the sidewall and having an angled shape. The plurality of cushioning portions are corresponding to the plurality of mounting holes and positioned between the fan and the sidewall.11-18-2010
20100246122Equipment Rack and Associated Ventilation System - A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.09-30-2010
20120162912INVERTER STACK - An inverter stack includes an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space, a heat sink having a switching element, disposed within an upper region of the internal space, and a plurality of DC-link capacitors disposed within the internal space and below the heat sink. Through this, heat generated in high heat dissipation components is immediately moved upward by convection, thereby suppressing the damage of components due to high temperature.06-28-2012
20100208425Solder and Lead-Free Electronic Circuit and Method of Manufacturing Same - An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.08-19-2010
20110182032SUPPORT PART - A support part serves is arranged in an instrument panel of a motor vehicle to hold a vehicle data display unit having an integrated navigation or radio unit. The support part has a single-piece frame composed of a magnesium pressure die cast material with a central holding frame for the unit and lateral holding frames for the air outlets. The support part is connected at one side to the instrument panel and another side to the cockpit cross member. Centering receptacles for the unit and further centering receptacles for the air outlets are arranged in the central holding frame and in the two lateral holding frames. Centering elements are arranged on the unit and on the air outlet correspondingly to the centering receptacles of the holding frames.07-28-2011
20090059520Cooling structure for rackmount-type control device and rack-type storage control device - According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.03-05-2009
20120314366ELECTRONIC DEVICE - An electronic device includes a printed circuit board, a heat generating component disposed on the printed circuit board, and a casing including the printed circuit board and the heat generating component, the casing allowing an air flow to flow from an outside to an inside of the casing. The printed circuit board includes a first and second openings and an extending portion formed between the first and second openings so as to extend in a flow direction of the air flow in the casing, and the extending portion includes a conductive pattern and is located opposite the heat generating component.12-13-2012
20090323281CONTROLLING AN AIRFLOW PASSING INTO AN ELECTRONIC COMPONENT CABINET - Controlling an airflow passing into an electronic component cabinet includes passing an airflow into the electronic component cabinet through a first passage having a first filter, sensing a parameter of the airflow passing through the first passage, detecting a change in the parameter of the first airflow associated with a flow restriction at the first filter, and shifting a first flap from a first position allowing the airflow to pass unrestricted through the first passage, to a second position, wherein the first flap creates a flow restriction for the airflow passing though the first passage, and triggers an actuation mechanism based on the change in parameter of the first airflow. Controlling the airflow further includes opening a second flap that exposes a second passage having a second filter based on the triggering of the switch, and passing an airflow into the electronic component cabinet through the second passage.12-31-2009
20120188715ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.07-26-2012
20100328884ELECTRIC EQUIPMENT - An electric equipment includes: first opening 12-30-2010
20120127663ELECTRONIC DEVICE - An electronic device includes a case having a first surface facing a second surface and a side surface along peripheries of the first and second surfaces to form an internal space, an electronic component adjacent to a first side part of the side surface with a gap between the electronic component and the first side part, and a circuit board extending along the first surface and distant from the first surface such that the electronic component is sandwiched between the circuit board and the first surface. The case includes an air intake port introducing air into the case and an air outlet port discharging air flowed along the electronic component, and the circuit board includes a vent opening including a first end portion extending to a position closer to the first side part than a first end of the electronic component facing the first side part of the case.05-24-2012
20110235275PORTABLE ELECTRONIC DEVICE HAVING A POP-UP KEYBOARD CROSS-REFERENCE TO RELATED APPLICATION - A portable electronic device includes a housing formed with a first receiving space, and a second receiving space communicating spatially with the first receiving space. A keyboard is disposed within the second receiving space. A pop-up mechanism is disposed within the first receiving space, and includes a hollow post body disposed within the first receiving space, and an ejecting member disposed movably within the hollow post body and abutting against a bottom side of the keyboard. The ejecting member is movable between first and second height positions when the keyboard is pressed downwardly. When the ejecting member is in the first height position, the keyboard is in a horizontal position within the second receiving space. When the ejecting member is in the second height position, the keyboard is in a tilted position tilting outwardly from the second receiving space.09-29-2011
20110235274HOUSING AND ELECTRONIC DEVICE USING SAME - A housing includes a main body defining a window and at least one glue injecting hole near the window. A screen guard covering the window, defines a slit between the main body and the screen guard. A glue layer located in the slit adheres the screen guard to the main body, wherein the at least one glue injecting hole communicates with the window. The glue layer is formed by injecting glue into the slit from at least one glue injecting hole.09-29-2011
20110235273CASE AND ELECTRONIC DEVICE HAVING THE SAME - A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.09-29-2011
20110235272ELECTRONIC COMPONENT HAVING A MOVABLE LOUVER - An electronic component includes a housing having an inlet section, a mid-section, and an outlet section, mounting components for mounting the housing within an electronics cabinet, at least one movable louver positioned in at least one of the inlet section, the mid-section, and the outlet section, an actuator configured to manipulate the at least one movable louver to vary a volume flowrate of airflow through the housing, and a controller configured to operate the actuator to one of substantially maintain an environmental condition change from the inlet to the outlet within a predetermined range and substantially restrict airflow through the housing when the electronic component is in a relatively low operational state.09-29-2011
20110235271MOTHER AND DAUGHTER BOARD CONFIGURATION TO IMPROVE CURRENT AND VOLTAGE CAPABILITIES OF A POWER INSTRUMENT - An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually generated current. The amount of power generated by the instrument can be increased by attaching additional daughter boards to the mother board. The total current produced by the daughter boards is provided to and output from the mother board via a low inductance output path. The low inductance output path ensures that a sudden increase in current does not result in a large voltage spike that adversely affects instrument operation.09-29-2011
20100232106ARRANGEMENT FOR A MOTOR CONTROLLER - An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.09-16-2010
20120327597Hybrid Cooling Design for Modular Systems - A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.12-27-2012
20120327598ELECTRONIC DEVICE HOUSING DEVICE - An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.12-27-2012
20120140415DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.06-07-2012
20130170136PCB HEAT SINK FOR POWER ELECTRONICS - A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings and make contact with the electronic components to act as heat sinks. A thermal pad member can be positioned between the bosses and the components to aid in the contact and heat conduction. Other embodiments include direct contact of the raised mounts or bosses with the PCB and through openings are not provided.07-04-2013
20130094143COOLING SYSTEM FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE HAVING SAME - An electronic device includes a plurality of electronic components and a cooling system. The cooling system includes a chassis defining an airflow channel including an air inlet and an opposing air outlet, a fan assembly including a plurality of fans located at the air outlet, a valve assembly including a plurality of valve plates located at the air inlet, and a control unit controlling the operation of the fan assembly and of the valve assembly. When only some of the electronic components are operated, the operated electronic components send a signal to the control unit, the control unit calculates the particular valve plates and fans which need to be activated, and activates or starts only the relevant and required valve plates and fans to cool the electronic components.04-18-2013
20130128455ENVIRONMENTAL CONTROL FOR MODULE HOUSING ELECTRONIC EQUIPMENT RACKS - A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.05-23-2013
20130094144HEAT DISSIPATION STRUCTURE AND ELECTRONIC APPARATUS - A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.04-18-2013
20110273844Solid State Switching Device with Integral Heatsink - Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.11-10-2011
20100302729HIGH POWER SOLID STATE POWER CONTROLLER PACKAGING - A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.12-02-2010
20100309629METHOD FOR MANUFACTURING VENTED BOARD, METAL PLATE FOR FORMING THE VENTED BOARD, AND METHOD FOR MAKING ELECTRONIC DEVICE HAVING THE VENTED BOARD - A method for manufacturing a vented board includes the steps of providing a metal plate, forming a mesh area in the plate, and punching a recessed portion on the plate to make at least one part of the mesh area extend to form a side wall of the recessed portion with a thickness of the mesh area substantially remaining constant. The mesh area includes a number of hole units. Each hole unit defines a hole and includes a plurality of borders bounding the hole. Every two adjacent hole units share a corresponding one of the plurality of borders. Before punching the recessed portion, a center line of each border is a curve line.12-09-2010
20110279974DISPLAY DEVICE AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a cooling fan in the housing including an intake and a discharge hole, and a wind shielding portion between the intake of the cooling fan and the discharge hole of the cooling fan. The wind shielding portion partitions at least partially an inner space of the housing.11-17-2011

Patent applications in class Plural Openings

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