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Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361688000 - With cooling means

361689000 - Fluid

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361694000 With air circulating means 638
361692000 Plural Openings 125
361691000 Pressurized or conditioned 22
361698000 And liquid 11
Entries
DocumentTitleDate
20080259561COOLING-FAN-FREE SYSTEM MODULE - A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and including a circuit board having at least one heat-producing element electrically connected thereto; a heat radiating unit including a heat-conducting pad raised from an inner side of the rear case corresponding to the heat-producing element for transferring heat produced by the heat-producing element to the rear case, and at least one fin-like heat radiating member integrally formed on a back side of the rear case; and a tightening unit including at least two sets of internally threaded posts, screw fasteners, and elastic elements to ensure tight and good contact of the heat-conducting pad with the heat-producing element.10-23-2008
20080259562Computer housing shock absorber device for a vibration source frame - A computer housing shock absorber device for a vibration source frame, which includes: 10-23-2008
20110310556INTERNAL DEVICE ARRANGEMENT FOR A PASSENGER CABIN - An internal device arrangement for a passenger cabin, for example of an aircraft, comprises an internal device element (12-22-2011
20100079942VIDEO DISPLAY APPARATUS - The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus including a base chassis on a front surface of which a displaying member is arranged and on a back surface of which a unit for driving and controlling the display device is arranged, and a plurality of frames arranged on the back surface of the base chassis in parallel with each other, a shield cover is attached to the plurality of frames to extend over those to form a crosslink structure.04-01-2010
20110194250Platform for Military Radio with Vehicle Adapter Amplifier - A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting at least one SINCGARS RT-1523 radio. The platform has a first power supply that includes a DC power converter for converting 110/220 alternating current into +28 Volt direct current and a second power supply that converts +28 Volt direct current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said SINCGARS RT-1523 radio.08-11-2011
20130077239SEMICONDUCTOR MODULE AND MODULE SYSTEM HAVING THE SAME - Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.03-28-2013
20100157529Image reading device - An image reading device, and more particularly an image reading device having a cooler capable of preventing introduction of impurities and reducing vibration and noise. The image reading device includes a body having a reading unit, and a cooler disposed in the body cooling the reading unit. The cooler includes a housing, a cooling unit disposed in the body and moving air into the body, a filter member disposed apart from the cooling unit and removing dust contained in the air, and a damper member having one side supported by the filter member and the other side supported by the cooling unit.06-24-2010
20130027876COMPUTER SYSTEM WITH HEAT DISSIPATION APPARATUS - A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.01-31-2013
20100328883Pluggable Power Cell For An Inverter - In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage.12-30-2010
20100002380HEAT SINK APPARATUS - A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.01-07-2010
20130058039PORTABLE TERMINAL WITH A COOLING STRUCTURE - A portable terminal includes a cooling structure configured to allow air flow into the portable terminal. A display support frame encompasses an opening and is arranged between the display and the main board including heat generating components of the portable terminal. The display support frame support's the display and a window of the portable terminal and has at least one air injection opening. The portable terminal may include a heat dissipating plate encompassing at least one hole therethrough and arranged on at least a portion of the opening of the display support frame. The portable terminal may include a structural body to dissipate heat and to be connected to a battery of the portable terminal.03-07-2013
20130163199ELECTRONIC DEVICE UTILIZING AIR GUIDER - An electronic device includes a main board, a plurality of add-on cards, a bracket mounted above the add-on cards, and an air guider. The add-on cards are mounted on the main board and spaced apart from each other. The add-on cards define a plurality of channels therebetween. The air guider includes a plurality of baffles pivotally connected to a bottom of the bracket, and a plurality of elastic members. Each of the elastic members pushes a corresponding baffle to contact a top of a corresponding add-on card to baffle air flowing between the bracket and the top of the corresponding add-on card and direct such air flowing through the channels.06-27-2013
20090231807Waterproof Ventilated Display Enclosure - A waterproof ventilated enclosure for housing equipment is disclosed having the ability to channel water thru the enclosure without touching the equipment and further with the ability to provide active or passive ventilation to the equipment. In the preferred case, the equipment is a video monitor which may be mounted in an outdoor environment. The enclosure includes structures which separate liquid from air through the same or related ports, but prevents commingling.09-17-2009
20090046422Protection structure for heat dispersing device of power supplier - The present invention includes a metal housing, a power input end, a power output end, and an accommodating space thereinside between the power input end and the power output end, the accommodating space has a power processing unit mounted inside and the output terminal of the power processing unit is located at the power output end of the power supplier. The metal housing of the power supplier has an assembling opening mounted thereon and located above the accommodating space for assembling at least a heat dispersing device. The protection structure includes a fixing frame, mounted in the accommodating space and fixedly connected with two sides of the heat dispersing device and the metal housing, and a metal protection case, covered on the assembling opening and tightly engaged with the metal housing, wherein the metal protection case and the fixing frame respectively have positioning portions corresponding to each other.02-19-2009
20100033928COIL ASSEMBLY, SWITCHING POWER SUPPLY, AND PROJECTOR - A switching power supply includes: a coil; and a pedestal fixed to the coil, the pedestal includes a supporting member configured to support the coil in such a manner as to form a space through which air flows on a surface of the coil attached to the pedestal.02-11-2010
20090009963Fastener and heat-dissipating device having the fastener - A fastener for a heat-dissipating device is adapted to secure a heat sink on a securing seat. The fastener includes a fastening arm having a plate body and a coupling member adapted to couple with one positioning member of the securing seat, a fastening member disposed spacedly below the plate body opposite to the coupling member and adapted to couple with another positioning member, and two linkage sets. Each linkage set is disposed between the plate body and the fastening member, and includes first and second resilient connecting elements connected respectively to the plate body and the fastening member. The linkage sets are pivotable toward each other to cause the plate body to displace toward the fastening member such that the linkage sets engage two openings in the securing seat.01-08-2009
20120075802MEANS FOR HEAT DISSIPATION FOR ELECTRICAL AND/OR ELECTRONIC APPARATUS - The invention relates to heat dissipation means for use with electrical and/or electronic apparatus to provide for the improved cooling of at least one component within the housing of the apparatus. The heat dissipation means includes a first portion located internally of the housing at or adjacent to the at least one component to be cooled and the means is formed of a material to allow the same to be passed via the first portion to an interface and onto a second portion located externally of the housing to allow the heat to be dissipated therefrom to the external environment more effectively. This allows heat to be dissipated without the need for moving heat dissipation means to be provided and avoids the noise and/or vibration which can be created.03-29-2012
20120099275CONNECTOR SYSTEM WITH AIRFLOW CONTROL - A connector assembly includes a cage with a plurality of ports for receiving modules. An air passage is associated with each port and extends from a rear wall of the cage through a front face of the cage. The air passage way is configured to provide relatively consistent airflow regardless of whether or not a module is inserted into the corresponding port.04-26-2012
20100238626Modular Air Management Devices - The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.09-23-2010
20110170261ELECTRONIC APPARATUS, ILLUMINATING DEVICE, DISPLAY DEVICE AND TELEVISION RECEIVER - A protection sheet (PS) deforms into a shape of protecting a metal terminal (07-14-2011
20080239661APPARATUS FOR COOLING ELECTRONICS - An apparatus for guiding air through electronic components is disclosed. The apparatus has an intake, a transition portion, and a focused egress. The transition portion is connected to the intake and defines a channel. The channel has a generally ‘u’ shaped cross-section and a first edge and a second edge configured to be positioned substantially opposing a surface. The focused egress is connected to the transition portion.10-02-2008
20110188200FORCED-AIR-COOLED TYPE VEHICLE CONTROL DEVICE - There is provided a first accommodating chamber that accommodates a cooling unit frame that supports a cooling unit. The cooling unit includes a cooler that cools heat generated from a snubber circuit component and a semiconductor device utilizing cooling air from an air blower, a conductor bar that electrically connects the semiconductor device and a capacitor with each other, the snubber circuit component, and the semiconductor device. There is also provided a second accommodating chamber that accommodates the capacitor. The cooling unit and the capacitor can be separated from each other by detaching one of a connecting portion between a laminated bus bar and the conductor bar and a connecting portion between the laminated bus bar and the capacitor08-04-2011
20110170260HOUSING STRUCTURE FOR VEHICLE ELECTRONIC CONTROL UNIT - A housing structure for a vehicle electronic control unit (“ECU”) includes an ECU case, a mounting bracket, and a seal ring. The ECU case is for housing a vehicle ECU and includes a ventilation opening. The mounting bracket connects with the ECU case and is configured to connect with an associated vehicle frame for mounting the ECU case to the associated vehicle frame. The seal ring surrounds the ventilation opening and seals against both the ECU case and the mounting bracket. A method for mounting an electronic control unit (“ECU”) case to a vehicle frame is also disclosed.07-14-2011
20120106080MOUNTING ASSEMBLY FOR HEAT DISSIPATING DEVICE - A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.05-03-2012
20090279251HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.11-12-2009
20090168344THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW - In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.07-02-2009
20090290305ENTRAINMENT HEATSINK USING ENGINE BLEED AIR - An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger secondary flow to carry heat away from the heatsink. The bleed air from an aircraft engine represents an ideal pressurized air source for the primary flow with respect to such a heatsink. As such, the needed high-pressure primary flow is very small and can be delivered via thin air hoses, which has the flexibility to reach constraint spaces. In addition to the entrainment effect, the distributed micro jets also induce a high level of turbulence in the heatsink, significantly enhancing heat transfer and cooling performance.11-26-2009
20100061059DUCTED EXHAUST EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.03-11-2010
20100061058ELECTRICAL UNIT COOLING STRUCTURE FOR MOTORCYCLES - Electrical units are effectively cooled, even if the longitudinal length of the cover member in which the electrical units to be cooled are accommodated is short, by easily guiding a flow of air during operation toward the electrical units. A second cover member which constitutes at least a part of a body cover together with a first cover member is positioned ahead of the first cover member which accommodates an electrical unit to be cooled. Inlets which let a flow of air during operation into the second cover member are disposed in the second cover member. An outlet for discharging a flow of air during operation out of the first cover member is provided in the first cover member.03-11-2010
20100157528Secure transparent enclosure for communication device - An enclosure comprises first and second sections formed of a transparent material, a plurality of wall sections, a plurality of vent holes, a hinge, a cable access and a lock. The wall sections are joined to the first section to form the enclosure. The vent holes are formed in the wall sections to provide thermal flow through the enclosure. The hinge connects the second section to one of the plurality of wall sections to form a door in the enclosure. The cable access is located to allow authorized power and data connections within the enclosure when the door is in an open position, and sized to prevent unauthorized data connections within the enclosure when the door is in a closed position. The lock secures the enclosure by locking the door in the closed position.06-24-2010
20080239662Sealed and cooled enclosure with voltage isolation - An enclosure 10-02-2008
20100128433Cap for Electronics Enclosure - A pedestal style electronics enclosure provides an upright housing for enclosing electronic components. Installed at the top of the housing can be a hollow enclosure cap that defines an internal air gap. The air gap can be located between an upper, dome-like shield plate exposed to the exterior and a lower, contoured guide plate exposed to the interior of the enclosure. The air gap can help buffer the enclosure from solar radiation impinging upon the exterior shield plate. The interior contoured guide plate can help direct heated air rising in the interior of the enclosure to one or more vent panels located about the periphery of the cap. The hollow enclosure cap can be comprised of thermoplastic material and can be made as a single piece, monolithic structure produced by, for example, a blow molding process.05-27-2010
20080291624APPARATUS FOR EXTENDING AN OPERATOR PANEL - An apparatus for extending an operator panel away from an electronic device. An opening in a side of a housing for the electronic device is covered with an air intake grill to provide airflow for cooling at least one electronic component within the electronic device. The operator panel that controls operation or displays a status of the electronic device is attached to a mounting element. The mounting element defines an air gap of a predetermined distance between the operator panel and the opening in the side of the housing to provide increased airflow into the housing for optimal heat dissipation for the electronic device. Then, the mounting element is connected to the housing and the operating panel is coupled to the electronic device.11-27-2008
20080310104LIQUID-BASED COOLING APPARATUS FOR AN ELECTRONICS RACK - A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.12-18-2008
20080212278Portable computer power system - A portable computer power system comprises a battery an external battery housing providing an airflow path therethrough into an airflow vent of a portable computer.09-04-2008
20090180251MULTI-POSITION HOUSING MADE OF METAL EXTRUDED SECTION MEMBER FOR MANUFACTURING A WATERPROOF POWER ELECTRONIC DEVICE - The extruded section forms a tunnel that is substantially rectangular and is provided with fins on at least one side of the rectangle. The fins allow air to flow outside the housing by natural convection in the extrusion directions. A side without fins serves as a base for fastening the housing and as a support for power electronic components of the power electronic device. The fins are machined transversely to the extrusion direction to form notches in the fins. The notches being aligned in succession to allow air to flow outside the housing by natural convection in the optimum direction.07-16-2009
20090180250PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS - Cooling device for electronic components, in particular for power electronics in an aircraft, comprising an energy storage device which is in heat-conducting communication with at least one electronic component which is to be cooled, and which storage device is in the form of a material which performs a change in phase on absorbing the waste heat from the at least one electronic component.07-16-2009
20090129013ELECTRONIC EQUIPMENT ENCLOSURE WITH EXHAUST AIR DUCT AND ADJUSTABLE FILLER PANEL ASSEMBLIES - An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.05-21-2009
20090129012METHOD AND APPARATUS FOR HEAT TRANSFER - A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader.05-21-2009
20080316701GAMING DEVICE COOLING SYSTEM - A gaming device has a housing with at least one air inlet vent and at least one air exhaust vent. In one aspect of the invention, the vents are configured with a duct or flange having at least one upwardly sloping portion configured to prevent the entry of contaminants such as liquids into the gaming device. In another aspect of the invention, a gaming machine cooling system includes at least one air flow device such as a centrifugal blower or squirrel-cage air handling device which provides high volumetric air flow at positive pressure. The air flow device is coupled to the exhaust vent, whereby the air flow device exhausts air from the interior to the exterior of the gaming device. A low pressure condition in the gaming machine causes cool air to be drawn into the interior of the housing.12-25-2008
20110141691SYSTEMS AND METHODS FOR MANUFACTURING SYNTHETIC JETS - A method for manufacturing synthetic jets is described. The method includes forming a hole extending through a portion of a first printed circuit board (PCB), wherein the hole defines a portion the synthetic jet assembly, and wherein the hole is positioned to enable the synthetic jet assembly to facilitate cooling a component coupled to a second PCB.06-16-2011
20090080154ELECTRO-OPTIC APPARATUS AND ELECTRONIC EQUIPMENT - An electro-optic apparatus includes an electro-optic panel, a wiring board, and an integrated circuit unit. The integrated circuit unit including a heat radiating member arranged so as to overlap at least partly with the integrated circuit unit.03-26-2009
20090086426AUTOMATIC AIR BLOCKAGE ASSEMBLY AND METHOD FOR COMPUTING ENVIRONMENTS - A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.04-02-2009
20090213542FLEX CIRCUIT ASSEMBLY WITH THERMAL ENERGY DISSIPATION - In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support electrically conductive paths for connection to an integrated circuit. A corresponding plurality of separation channels are formed between the adjacent electrically conductive paths, and thermal energy generated by operation of the integrated circuit is transferred through the separation channels to the stiffener member. In some embodiments, the separation channels retain a fluid, such as air or a low density inert gas, which flows through the separation channels in response to rotation of a rotatable member adjacent the flex circuit assembly. In other embodiments, a dielectric, thermally conductive material fills the separation channels.08-27-2009
20090190307DUCTED EXHAUST EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.07-30-2009
20090251860POWER-EFFICENT DATA CENTER - An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to its resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center's core functions. Various illustrative techniques for managing a power-efficient data center are also described.10-08-2009
20090257191Structural Support Module To Prevent Common Interface Deflection - A method and incorporated assembly is provided to enhance structural integrity and prevent interface deflection in a computer rack having a midplane and capable of housing a plurality of nodes. The assembly comprises at least one structural filler book capable of being disposed above or below said midplane where any node may be disposed having geometry and material properties to resist and counteract the plugging force of said node an causing a cancellation effect. The filler book have at least two horizontal supports being connected to one another via a vertical support and a plenum an air for directing air flow. The filler book is being secured to said rack or midplane via an engagement component disposed on one of its horizontal supports. The engagement component has a complementary air duct such that when said filler book and said engagement compartment are engaged and disposed in the rack, the air duct and the plenum align to provide a tuned path of air to be delivered to electronic components plugged to said rack and midplane.10-15-2009
20090257190Cooling Structure for Electricity Storage Device - A cooling structure for an electricity storage device includes: a secondary battery (10-15-2009
20100182748DUST-PROOFING METHOD FOR AN ELECTRONIC DEVICE, AND THE ELECTRONIC DEVICE - A dust-proofing method is for use in an electronic device having a housing, a heat-generating component, and a dust-proofing mechanism. The housing includes an air vent. The dust-proofing mechanism includes a shielding plate for shielding or opening the air vent, and an actuating unit for driving movement of the shielding plate. The dust-proofing method includes: causing the actuating unit to drive movement of the shielding plate to open the air vent upon detecting that the temperature of the heat-generating component has risen to a first preset temperature; and causing the actuating unit to drive movement of the shielding plate to shield the air vent upon detecting that the temperature of the heat-generating component has dropped to a second preset temperature lower than the first preset temperature. Thus, dust accumulation in the electronic device can be effectively reduced, and heat dissipation efficiency can be enhanced.07-22-2010
20130215571SEMICONDUCTOR DEVICE AND COOLING SYSTEM FOR SEMICONDUCTOR DEVICE - A semiconductor device of the present invention is a semiconductor device applicable in a cooling system including an ECU functioning as a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, and a sensor functioning as a detector that detects the temperature of the refrigerant as refrigerant's temperature. The semiconductor device generates variable heating loss. The semiconductor device includes a heating controller that controls the heating loss in the semiconductor device such that the target temperature and the refrigerant's temperature become the same.08-22-2013
20100214742Heat-sinking memory module device - A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.08-26-2010
20090244838Housing for an electronic unit - An electronic unit housing includes (i) a receiving space for receiving a printed circuit board, (ii) at least one foot, which is designed to fasten the electronic unit housing onto a base, and is disposed to the side of the receiving space relative to a projection of the receiving space onto the base, and (iii) a venting device, which opens on the underside of the electronic unit housing facing the base.10-01-2009
20090323280ELECTRONIC APPARATUS - An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.12-31-2009
20110110035ELECTRONIC DEVICE WITH HEAT DISSIPATING STRUCTURE - An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.05-12-2011
20100302728CHASSIS FOR INVERTER - The present invention provides an inverter or other electronically controlled power source for transforming electrical energy into electrical energy of predetermined voltage and/or current comprising: an inner housing for housing the main circuitry of the inverter, a cover connected to the inner housing, covering at least part of the inner housing, defining at least one cover channel between the inner housing and the cover for air to flow through that channel for cooling of the inverter, whereby the cover channel is adapted to facilitate natural convection of the air. The present invention further proposes an inverter according to any of the preceding claims, additionally comprising at least one ventilator to enhance an air flow through the channel. According to the invention the cooling properties of an inverter are to be improved.12-02-2010
20110110036PASSIVE COOLING SYSTEM FOR PHOTO VOLTAIC MODULES - The present invention discloses a cooling fin assembly for Photo Voltaic Solar (PVS) panels providing an improved passive cooling of the PVS panels. Cooling fins as such do provide a good local cooling effect underneath the contacting surface of the fins. However, due to uneven air streams around the cooling fins, the temperature difference across a transversal direction relative to the direction of the fins may be high. This causes a severe degradation of the cooling systems effectiveness, and the resulting output form the PVS panel. According to the disclosure of this invention, an arrangement of transversal heat conducting materials provides a heat bridge providing a thermal relaxation time below a predefined threshold across the whole back side of the PVS panel, thereby improving the overall cooling effect of the PVS panel.05-12-2011
20110019362DUCTED EXHAUST EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.01-27-2011
20090034189RISER CARD HOUSING - A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.02-05-2009
20120201001ELECTRONIC DEVICE AND COMPLEX ELECTRONIC DEVICE - DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.08-09-2012
20080285231APPARATUS FOR ENCLOSING ELECTRONIC COMPONENTS - An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure.11-20-2008
20080253086Thermal cooling of industrial electronic module by conductive structure - An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.10-16-2008
20110164383DEVICE PROVIDED WITH A GAP-LIKE SPACE AND A SYNTHETIC JET GENERATOR COUPLED THERE-TO07-07-2011
20110164382THERMAL MANAGEMENT FOR ELECTRONIC DEVICE HOUSING - The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.07-07-2011
20120147560OPEN FRAME ELECTRONIC CHASSIS FOR ENCLOSED MODULES - An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.06-14-2012
20100177478Cooling arrangement for an equipment assembly - An equipment assembly includes a core cooling slot to manage thermal effects brought about by the generation of heat from components therein. The cooling slot is positioned within the equipment assembly so that only air that is external to the equipment assembly passes through the cooling slot to provide external convection-based cooling for components in a core section inside the equipment assembly. The cooling slot also acts as a thermal barrier for redistributing heat generated by the one or more components inside the equipment assembly.07-15-2010
20110051367Display Apparatus - A display apparatus includes an accommodation chamber having a sealed structure, a display panel accommodated in the accommodation chamber, a cooling part which cools the air inside the accommodation chamber, a drain pipe extending from a bottom part of the accommodation chamber, and a check valve provided in the drain pipe.03-03-2011
20110304986POWER SUPPLY ASSEMBLY - A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply unit, and a positioning element. The enclosure body includes a bottom panel, a rear panel, and a side panel. The power supply unit is mounted in the enclosure body and is prevented from moving in a first direction substantially perpendicular to the rear panel and a second direction substantially perpendicular to the side panel. The positioning element includes a plate body, a first positioning portion, and a second positioning portion. The power supply unit is sandwiched between the bottom panel and the plate body. The first positioning portion is for preventing the power supply unit from moving along a first direction substantially parallel to the bottom panel. The second positioning portion for preventing the power supply unit from moving a second direction parallel to the bottom panel.12-15-2011
20100061057HOT AISLE CONTAINMENT PANEL SYSTEM AND METHOD - An air containment system includes a plurality of panel assemblies configured to be arranged in side-to-side relation to form a ceiling. In one embodiment, each panel assembly includes a flexible panel having a first end, a second opposite end, a first side and a second opposite side, a first end connector configured to secure the first end of the flexible panel to one of a rack and a wall, and a second end connector configured to secure the second end of the flexible panel to one of a rack and a wall. Other embodiments of the air containment system and related methods are further disclosed.03-11-2010
20080310103AIR BACKFLOW PREVENTION IN AN ENCLOSURE - An air backflow prevention member includes a frame assembly including a plurality of vanes and a plurality of stops. The plurality of vanes are rotatable between an open position, wherein the plurality of vanes are oriented oblique to a direction of airflow and in contact with the plurality of stops, and a closed position, wherein the plurality of vanes are oriented perpendicular to the direction of airflow.12-18-2008
20110317359FAN DUCT FOR ELECTRONIC COMPONENTS OF ELECTRONIC DEVICE - A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided.12-29-2011
20120014059POWER MODULE - A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 01-19-2012
20090002941AIR-PERMEABLE, HYDROPHOBIC MEMBRANE USED IN A COMPUTER DEVICE - A mechanism to reduce liquid intrusion into an internal volume of a computer device. In some embodiments of the invention, air-permeable, hydrophobic means reduces an intrusion of liquid into a computer device by way of an airflow system. In another embodiment, the air-permeable, hydrophobic means includes an air-permeable, hydrophobic membrane. Other embodiments are described and claimed.01-01-2009
20120155021AIR DUCT AND ELECTRONIC DEVICE HAVING THE SAME - An air duct includes a top plate, two side plates extending from two lateral sides of the top plate, a baffle plate extending from the top plate and located between the side plates, and a torsion spring connected between the top plate and the baffle plate. The top plate and the side plates cooperatively define an air passage in the air duct. The baffle plate includes a first end pivotally connected with the top plate and an opposite second end. The second end of the baffle plate is rotatable relative to the top plate. The torsion spring includes two arms abutting against the top plate and the baffle plate, respectively. When the baffle plate is rotated relative to the top plate under an external force, the torsion spring resists such force.06-21-2012
20120063084CIRCUIT BOARD CHASSIS AND METHOD INCLUDING SIDEWALL APERTURE AND BACKPLANE INSERTION SLOTS FOR SIDE ASSEMBLED BACKPLANE - A circuit board chassis and a method for assembling a backplane and a circuit board into the circuit board chassis include an aperture within at least one sidewall of the circuit board chassis. The backplane is inserted and assembled into the circuit board chassis through the aperture (that may include a counter-opposed pair of backplane insertion and assembly slots) in a first direction, and a circuit board is inserted and assembled into the circuit board chassis and the backplane in a second direction perpendicular to the first direction. By inserting and assembling the backplane into the aperture and slots, rather than assembling the backplane as an external surface component of the circuit board chassis, the embodiments provide for ease of replacement of the backplane and circuit board under space constrained limitations. The resulting embodiments also provide enhanced rigidity and enhanced thermal dissipation within the circuit board chassis.03-15-2012
20120120599APPARATUS AND METHOD FOR COOLING A SEMICONDUCTOR DEVICE - An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective first ends disposed within the chamber; wherein, during operation, respective second ends of contact elements contact a surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid.05-17-2012
20120127662ELECTRONIC APPARATUS AND KEYBOARD SUPPORTING MODULE THEREOF - An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.05-24-2012
20120162911ELECTRONIC DEVICE HAVING HEAT DISSIPATION AIRFLOW PATH - An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. When the optical disk is mounted on the rotating shaft and driven to rotate by the rotating shaft, air heated by the electronic component in the electronic device can flow out of the top cover via the through holes, and rotation of the optical disk facilitates such airflow.06-28-2012
20090059519Air duct flow optimization device - A device adapted to optimize air duct flow in an electronic system including a printed circuit board configured to support one or more electronic components having various heights. The device includes an air duct including a rigid cross-sectional member, the air duct being adapted to facilitate air flow from an inlet port to an outlet port. Further, the rigid cross-sectional member includes an opening having an interior perimeter, the interior perimeter of the opening being attached to a flexible sheet by a pressure sensitive adhesive. The rigid cross-sectional member attached to the flexible sheet is adapted to compress one or more electronic components to the printed circuit board when the rigid cross-sectional member is mounted on the printed circuit board, and is configured to form an airtight enclosure to optimize air duct flow.03-05-2009
20090116186Cooling unit and electronic apparatus - According to an aspect of an embodiment, a cooling unit includes a first heat dissipating fin member including first heat dissipating fins extending along parallel planes, respectively, the first heat dissipating fins coupled to one another through a first heat conductive member, and a second heat dissipating fin member including second heat dissipating fins extending along parallel planes, respectively, the second heat dissipating fins coupled to one another through a second heat conductive member, the tip ends of the second heat dissipating fins opposed to the first heat dissipating fin member at a predetermined interval.05-07-2009
20100271777HIGH DENSITY CHIP PACKAGES, METHODS OF FORMING, AND SYSTEMS INCLUDING SAME - Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide removal of defective chips and their replacement during the assembly process to improve manufacturing yield.10-28-2010
20100271776DISPLAY APPARATUS AND ADJUSTMENT MECHANISM - The present invention provides a display apparatus including a display panel, and a plurality of adjustment mechanisms respectively arranged for a plurality of areas on a rear surface of the display panel and configured to adjust a temperature of the display panel for each of the areas, each of the plurality of adjustment mechanisms including a heat radiating unit mounted on a rear surface of the display panel and configured to form a gas flow passage on the rear surface of the display panel, and a changing unit configured to change a flow rate of a gas flowing into the gas flow passage in accordance with a temperature of an area on the rear surface of the display panel which corresponds to the heat radiating unit.10-28-2010
20090086427SEMICONDUCTOR DEVICE - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.04-02-2009
20120314365COOLING STRUCTURE FOR ELECTRONIC DEVICE - A heat generating component (12-13-2012
20090027852AIRFLOW REDIRCTION DEVICE - An air flow redirection device is disclosed. The air flow redirection device comprises a frame with a main hinge coupled to a top back edge of the frame. A plate is coupled to the main hinge and configured to rotate about the main hinge from an open position to a closed position. In the closed position the plate rests on top of the frame with a bottom side of the plate facing the bottom of the frame. A plurality of blocking fingers are coupled to the bottom side of the plate using a secondary hinge in a line parallel with, and adjacent to, the primary hinge. Each blocking finger is spring loaded away from the plate.01-29-2009
20120262877POWER CONVERTING APPARATUS AND CAPACITOR COVER THEREOF - A power converting apparatus includes a housing, a cylindrical capacitor, and a cylindrical capacitor cover. The housing includes a housing base, a main body, and an air duct. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The capacitor penetrates through the housing base so that a part of the capacitor is disposed in the main body while a rest part of the capacitor is disposed in the air duct. The capacitor cover is disposed on the housing base and covers the rest part of the capacitor. The capacitor cover includes an elastic material and an inner surface. The capacitor cover includes a groove disposed on the inner surface in an axial direction of the capacitor cover.10-18-2012
20120262876CHASSIS EXTENSION MODULE - A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.10-18-2012
20110122578ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE - An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.05-26-2011
20120320525ELECTRONIC SYSTEM COMPRISING A FIXED STRUCTURE INCLUDING A CASING FOR PROTECTING ELECTRONIC EQUIPMENT AND A MOBILE STRUCTURE RELATIVELY TO THE FIXED STRUCTURE, THE MOBILE STRUCTURE INCLUDING AN AIR SUCTION APERTURE - This electronic system comprises : 12-20-2012
20120287576ELECTRONIC DEVICE AND POWER CONVERTER PROVIDED WITH ELECTRONIC DEVICE - This electronic device includes a filter circuit including a coil, a resistor, and a condenser, and a heat radiating member radiating heat generated from the coil and the resistor, arranged in proximity to the coil and the resistor of the filter circuit.11-15-2012
20130010426ELECTRONIC CONTROL DEVICE - An electronic control device for controlling an electric actuator, including an air passage within a casing that is fixable to an actuator housing of the electric actuator. A circuit board is accommodated in the casing. A projecting portion is formed in the casing, on which a region of the circuit board in which the heat generating part is installed is seated. A vent hole extends through the casing to communicate to an outside of the casing. A communication hole extends through the casing to communicate to an inside of the actuator housing. The air passage allows air to flow between the vent hole and the communication hole when the electric actuator is driven in a state that the casing is fixed to the actuator housing.01-10-2013
20120243175COVER, ELECTRONIC DEVICE RACK, AND AIR CONDITIONING SYSTEM - A cover is provided on one surface of a rack of an electronic device provided with an outlet, and includes a sheet that guides exhaust air exhausted from the outlet in one direction along the one surface. An electronic device rack and an air conditioning system are also disclosed.09-27-2012
20080232066ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A circuit board is mounted on the bottom wall. A pair of securing members protrudes from a top of the sidewall. The airflow guiding duct includes a top wall and a plurality of securing slots defined in the top wall corresponding to the securing members, for the securing members being lockingly engaging in the securing slots, thereby limiting movement of the airflow guiding duct in directions parallel to the circuit board. The cover is mounted on the chassis and abuts against the top wall of the airflow guiding duct, for limiting movement of the airflow guiding duct in a direction perpendicular to the circuit board.09-25-2008
20130100611HEAT SINK COOLING ARRANGEMENT FOR MULTIPLE POWER ELECTRONIC CIRCUITS - The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges.04-25-2013
20130100610AIR DUCT ARRANGEMENT FOR COOLING A GROUP OF AT LEAST TWO HEAT PRODUCING MODULES - An air duct arrangement for cooling a group (04-25-2013
20110273843POWER SUPPLY ASSEMBLY - A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply, and a positioning element mounted to the cover panel. The enclosure body includes a bottom panel, a rear panel substantially perpendicular to the bottom panel, and a side panel substantially perpendicular to the bottom panel and the rear panel. The power supply assembly is mounted in the enclosure body and is prevented from moving in a first direction, that is substantially perpendicular to the rear panel, and a second direction, that is substantially perpendicular to the side panel, and disposed between the bottom panel and the cover panel. The positioning element includes a first ladder-shaped positioning tab abutting two adjacent surfaces of the power supply and preventing the power supply assembly from moving in a third direction, that is substantially perpendicular to the cover panel and the second direction.11-10-2011
20110222240COOLING STRUCTURE FOR VEHICLE POWER SOURCE UNIT - An electrical component disposed on the top of battery modules includes an electrical component case for accommodating an inverter and a DC/DC converter, and heat sink units attached to the electrical component case on the side of the electrical component case opposite to the side with the battery modules, and constituted of a heat radiating plate having a plurality of radiating fins. In addition, a cooling path has a first cooling path for cooling the battery modules using cooling wind, and a second cooling path for cooling the heat sink units using the cooling wind having passed through the first cooling path. With this arrangement, there is provided a cooling structure for a vehicle power source unit capable of cooling the battery and the electrical component including the inverter with a compact configuration.09-15-2011
20130194747ELECTRONIC DEVICE PROVIDED WITH SOCKET FOR CARD-SHAPED COMPONENT - The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.08-01-2013

Patent applications in class Air

Patent applications in all subclasses Air