Entries |
Document | Title | Date |
20080204995 | Telecommunications Chassis and Card - A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability. | 08-28-2008 |
20080218965 | ELECTRONIC DEVICE, PACKAGE HAVING THE SAME, AND ELECTRONIC APPARATUS - There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element. | 09-11-2008 |
20080232065 | Mounting Plate for Electronic Components - A mounting plate for electronic components, including cooling conduits that are integrated into a plate body and that are traversed by a coolant, and a fixing device for mounting the electronic components being located on the plate body. The fixing device includes at least one retaining piece and a first recessed groove or channel that extends in a linear manner in the direction of extension of the mounting plate. A retaining piece, which includes a fixing thread, for securing the component can be inserted into the groove or channel. | 09-25-2008 |
20080239660 | Flux precoated solder preform for thermal interface material - In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material. | 10-02-2008 |
20080266786 | METHOD AND APPARATUS FOR HEAT DISSIPATION - Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed. | 10-30-2008 |
20080291623 | ELECTRONICS PACKAGE FOR A BATTERY - An electronics package for a battery ( | 11-27-2008 |
20080298012 | HOLDING BASE FOR A RADIATOR ASSEMBLY - A holding base for a radiator assembly includes a frame, at least a secure part and at least a threaded part. The frame is attached to a circuit board and provides a space for receiving a heat generating component on the circuit board. The secure part provides an elongated projection rib at two lateral sides of said frame and provides an engaging block at the middle of the projection rib for engaging with the first type radiator assembly. The threaded part is disposed at the frame for being joined to the second type radiator assembly with a threaded fastener. | 12-04-2008 |
20080298013 | RESILIENT FASTENER AND HEAT DISSIPATION APPARATUS INCORPORATING THE SAME - A heat dissipation apparatus includes a retention module ( | 12-04-2008 |
20080298014 | Modular electronic enclosure - A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are not compliant with AMC standards may be installed in the modular electronic enclosure. A backplane, backplane structural support, combined card guide, chassis cover, and chassis bottom cooperate mechanically to provide a stiff, stable enclosure resistant to mechanical flexure. The modular electronic enclosure includes two hot-swappable cooling units which cooperate to establish push-pull cooling airflow. The modular electronic enclosure is further adapted to receive a Power Unit and an MCH. In another embodiment, the modular electronic enclosure includes a backplane with more than one core and has mounting locations and electrical connectors for up to twenty single-width 4 HP electronic modules. A backplane having more than one core is included in some embodiments. In some embodiments, the modular electronic enclosure is adapted to receive a combination of electronic modules comprising single-width, dual-width, and quad-width electronic modules. Some embodiments optionally include an MCH, a power unit module, or a J-TAG Switch module, or combinations of these and other modules. | 12-04-2008 |
20090021908 | SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE - A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component. | 01-22-2009 |
20090027851 | Computing device cooling system access assembly - A computing device comprising a heat exchanger and an access door disposed on a housing of the computing device and the access door aligned with at least a portion of the heat exchanger to facilitate access to the heat exchanger. | 01-29-2009 |
20090097200 | MODULAR BLADE FOR PROVIDING SCALABLE MECHANICAL, ELECTRICAL AND ENVIRONMENTAL FUNCTIONALITY IN THE ENTERPRISE USING ADVANCEDTCA BOARDS - A standards-based server blade arrangement is provided wherein individual circuit boards may be compliant with a first industry driven or other standard and housed within an enclosure configured such that one aspect of the enclosure provides each circuit board with a scalable, mechanical, electrical and environmental functionality required for that circuit board to comply with the first industry driven or other standard and a second aspect of the enclosure allows the enclosure to comply with a second industry driven or other standard. | 04-16-2009 |
20090109617 | APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES - An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad. | 04-30-2009 |
20090116185 | Small form-factor pluggable transceiver module housing - A small form-factor pluggable transceiver module housing includes a metallic casing and a plurality of reinforcing ribs. The metallic casing has a top plate, two side walls, a bottom plate, a plurality of connecting legs, a plurality of locking legs and a plurality of supporting portions. The connecting legs and the supporting portions are formed by means of extending from the lower edges of the two side walls. Each of the connecting legs has an open hole. The reinforcing ribs are each straddling the side wall and the connecting leg. Via this arrangement, the reinforcing ribs can improve the structural strength of the small form-factor pluggable transceiver module housing upon connection to a printed circuit board. The supporting portions can prevent the connecting legs from being damaged due to the excessive force upon connection. | 05-07-2009 |
20090122483 | WATER-ASSISTED AIR COOLING FOR A ROW OF CABINETS - A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid. | 05-14-2009 |
20090195980 | THERMOELECTRIC COOLER CONTROLLER - The subject matter disclosed herein relates to a method and/or system for adjusting a thermoelectric cooler. | 08-06-2009 |
20090207564 | TEMPERATURE-BASED MONITORING METHOD AND SYSTEM FOR DETERMINING FIRST AND SECOND FLUID FLOW RATES THROUGH A HEAT EXCHANGER - Monitoring method and system are provided for dynamically determining flow rate of a first fluid and a second fluid through a heat exchanger. The method includes: pre-characterizing the heat exchanger to generate pre-characterized correlation data correlating effectiveness of the heat exchanger to various flow rates of the first and second fluids through the heat exchanger; sensing inlet and outlet temperatures of the first and second fluids through the heat exchanger, when operational; automatically determining flow rates of the first and second fluids through the heat exchanger using the sensed inlet and outlet temperatures of the first and second fluids and the pre-characterized correlation data; and outputting the determined flow rates of the first and second fluids. The automatically determining employs the determined effectiveness of the heat exchanger in interpolating from the pre-characterized correlation data the flow rates of the first and second fluids. | 08-20-2009 |
20090207565 | Ducted Air Temperature Sensor - A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system, wherein the fan system draws air through the chassis in an airflow direction, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet, wherein the hot air duct has a length to width aspect ratio of greater than four. A first thermal sensor is secured within, or direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a first temperature signal. A controller is in electronic communication with the first thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal. Optionally, the hot air duct may extend through, over or around a second component on the circuit board to avoid thermal effects of the second component. | 08-20-2009 |
20090219685 | THERMAL ENHANCED PLASTIC BALL GRID ARRAY WITH HEAT SINK ATTACHMENT OPTION - A thermal enhanced structure comprising a packaged electronic device and a heat sink that is removably attached thereto. The thermal enhanced structure includes a plastic ball grid array (PGBA) with an electronic chip, a plastic mold cover, and a heat spreader with a plurality of spaced apart securing studs positioned and caulked at a periphery edge thereof. The mold cover, the heat spreader and studs are molded and embedded with one another to form a single unit with improved torque strength and heat dissipation. The single molded unit and the plastic ball grid array are secured together by an adhesive material. Then the heat sink can be easily and removably attached to the molded single unit by fastening elements to the molded studs, thereby allowing more efficient controllable forces or pressures to be applied as the mechanical fastening elements are removably attached to the molded studs to thereby prevent stress and damage to the PBGA package. | 09-03-2009 |
20090316356 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure is provided for an electronic device, including a single-sheet metal enclosure, which has a frame-like board arranged at a central portion thereof. The frame-like board forms a central opening. The frame-like board has opposite edges, which are bent downward and further extend outward to form parallel side wings, in which fastening holes are defined. The side wings and the frame-like board together form an accommodation space on an underside of the frame-like board. A plurality of fastening elements is respectively fit through the side wings of the enclosure and is secured to a circuit board to have the enclosure securely fit on an electronic device. | 12-24-2009 |
20100157525 | PHASE CHANGE MATERIAL COOLING SYSTEM - A cooling system may comprise an array of plates, an array of channels, a conduit system, and a phase change material. The array of channels may have a number of a first type of channels alternating with a number of a second type of channels. The conduit system may be capable of circulating coolant through the number of the first type of channels. The phase change material may be located within the number of the second type of channels. | 06-24-2010 |
20100214741 | ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component. | 08-26-2010 |
20100259892 | MOUNTING APPARATUS FOR HEAT DISSIPATING DEVICE - An apparatus includes a base plate, a circuit board mounted on the base plate, and a supporting bracket adapted to support a heat dissipating device. A securing post protrudes from the base plate and defines a securing groove. The supporting bracket is disposed above the circuit board. Two elastic securing claws extend from the supporting bracket. The securing post is wrapped by the two elastic securing claws, and the securing claws engage the securing groove of the securing post. | 10-14-2010 |
20100259893 | PORTABLE ELECTRONIC DEVICE INCORPORATING EXTENDABLE HEAT DISSIPATION DEVICE - An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component. | 10-14-2010 |
20100259894 | ELECTRONIC DEVICE WITH EXPANSION CARD FASTERNING DEVICE - An electronic device includes a circuit board, an extension card, a cooling device, and a connecting member. The extension card is coupled to the circuit board. The cooling device includes an outer casing and an inner casing received in the outer casing. The connecting member includes a fixing end and an engaging end opposite to the fixing end. The fixing end is fixedly mounted on the outer casing. The engaging end is configured for fastening the extension card on the circuit board. The outer casing moves between a first position where the engaging end fastens the extension card and a second position where the engaging end is separated from the extension card to unfasten the extension card. | 10-14-2010 |
20100309628 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism. | 12-09-2010 |
20100315775 | METHOD AND APPARATUS FOR INSTALLATION AND REMOVAL OF OVERHEAD COOLING EQUIPMENT - Disclosed is a data center comprising a first row of equipment racks, a second row of equipment racks, a hot aisle defined by a space between the first row of equipment racks and the second row of equipment racks, and a track system above the hot aisle of the data center upon which cooling units may be mounted. Cooling units may be moved along the track system. The track system may include portions of track secured to the top sides of one or more cooling units. Also disclosed is a method for installing a cooling unit above a hot aisle of a data center including a plurality of equipment racks. | 12-16-2010 |
20100328881 | ELECTRONIC DEVICE - An electronic device is directly disposed on a lamp base and is powered by the lamp base. The electronic device includes a connection base matching with a specification of the lamp base, and an air-flow generator. The connection base may be directly screwed into the lamp base to power the air-flow generator, so that the air-flow generator operates to generate an air flow. | 12-30-2010 |
20110002100 | OVERMOLDED ELECTRONICS ENCLOSURE - An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component. A printed circuit board is located in the recess and includes a plurality of electronic components mounted thereon. The polymeric component includes at least one attachment feature that captures the printed circuit board at a select location in the recess such that: (i) at least a first one of the electronic components is electrically connected to a contact region of the metal component that is exposed through a portion of said polymeric component; (ii) at least a second one of the electronic components is electrically isolated from the metal component by an electrical isolation zone of the polymeric component; and (ii) at least a third one of the electronic components is located adjacent a thermal transfer region of the metal component that underlies the heat sink. The thermal transfer region is uncovered by the polymeric component so as to be exposed in the recess. | 01-06-2011 |
20110069448 | METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD - This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( | 03-24-2011 |
20110096495 | CIRCUIT BOARD ARRANGEMENT FOR THERMALLY STRESSED ELECTRONIC COMPONENTS, IN PARTICULAR IN MOTOR VEHICLE CONTROL APPARATUS - Circuit board arrangement, in particular multiple layer circuit board arrangement with at least one low-power circuit path, wherein the circuit board arrangement is suitable for population with at least one electronic circuit board element to be cooled, wherein the circuit board consisting of a nonconductive material includes at least one cooling inlay embedded in the circuit board for cooling of the power component, wherein the cooling inlay forms at least in part, a high power guide element for the at least one electronic power component, wherein the line cross section or the power carry capacity of the high power guide element is significantly greater than the line cross section or the current carry capacity of the low power circuit path, and wherein the high power guide element is used and/or is also used for electrical contacting of the power component. | 04-28-2011 |
20110164380 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip. | 07-07-2011 |
20110164381 | Assembly-supporting Spring Between Rigid Connectors - An assembly comprises a sub-assembly including a semiconductor package coupled to a printed circuit board (PCB). The assembly also comprises multiple rigid connectors that couple the sub-assembly to a support structure. The assembly further comprises a spring, coupled to the support structure and positioned between the multiple rigid connectors, that supports at least some of the sub-assembly. | 07-07-2011 |
20110170258 | Electronic Module - A portable power tool includes a tool housing, a motor unit located in the tool housing, and an electronic module located in the tool housing. The electronic module includes (i) an electronic module housing having at least one housing component, and (ii) at least one printed circuit board. The at least one printed circuit board is at least partially decoupled relative to the at least one housing component of the electronic module housing. | 07-14-2011 |
20110194246 | POWER CONVERSION APPARATUS - An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler. | 08-11-2011 |
20110255244 | SELF-COOLING ELECTRICAL DEVICE - The invention relates to a portable electronic device, e.g. a mobile phone, comprising a shell, a display, a battery, a processor and a receiver. In the portable electronic device is at least one of the components configured to heat exchange with a phase changing material which is arranged within the portable electronic device. | 10-20-2011 |
20110299242 | METHOD AND APPARATUS FOR INSTALLATION AND REMOVAL OF OVERHEAD COOLING EQUIPMENT - Disclosed is a data center comprising a first row of equipment racks, a second row of equipment racks, a hot aisle defined by a space between the first row of equipment racks and the second row of equipment racks, and a track system above the hot aisle of the data center upon which cooling units may be mounted. Cooling units may be moved along the track system. The track system may include portions of track secured to the top sides of one or more cooling units. Also disclosed is a method for installing a cooling unit above a hot aisle of a data center including a plurality of equipment racks. | 12-08-2011 |
20110299243 | Power Conversion Apparatus - A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler, and a pair of clamps which fix the cylindrical pipes to the frame. Each of the clamps has a fastener portion which is fastened to the frame, and a pressing portion which presses the cylindrical pipe toward the frame. Each of the cylindrical pipes is held between a concave support portion, which is formed in the frame, and the clamp. Each of the cylindrical pipes is supported by two support surfaces of the concave support portion and the pressing portion of the clamp at three support points when viewing from the direction in which the cylindrical pipe extends. | 12-08-2011 |
20110304985 | ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT - An electrical or electronic composite component is described as having a first joining partner and at least one second joining partner. According to the present system, it is provided that a sintered compact having open porosity is accommodated between the first and the second joining partner, the sintered compact is connected fixedly to the first and to the second joining partner. | 12-15-2011 |
20110310555 | IMAGE DISPLAYING APPARATUS, HOLDING MEMBER THEREOF, AND IMAGE DISPLAYING SYSTEM - An image displaying apparatus, which is excellent in heat radiation efficiency and has an excellent back design, comprises: a display panel for displaying an image; a heat generating member provided on a back side of the display panel; a cabinet for covering the display panel and the heat generating member at least from the back side of the display panel, wherein, on the cabinet, an aperture is provided at a position facing the heat generating member; and an opening/closing unit for enabling to switch between closing and opening of the aperture. In a state that the aperture is opened by the opening/closing unit and one part of a heat-transfer member is positioned on a side of the cabinet opposite to the display panel, the other part of the heat-transfer member extends through the aperture so that the heat-transfer member can thermally be connected to the heat generating member. | 12-22-2011 |
20120044640 | POWER CONVERTER - A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank. | 02-23-2012 |
20120099272 | MODULAR POWER SUPPLY - A modular power supply ( | 04-26-2012 |
20120127659 | HEATING SPREADING ELEMENT WITH ALN FILM AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat spreading element with an AlN film including: a substrate which may be composed of a single bulk material, a multi-layered sample, or a composite material; and an AlN film deposited on the surface of the substrate, wherein the thickness of the AlN film is in a range of 1 nm to 10 μm, and the AlN film is used to conduct the heat from a heat-generating device to the substrate, and method for manufacturing the same. | 05-24-2012 |
20120140412 | POWER MODULE FOR INVERTER - A power module for an inverter which includes a base which has a plurality of slots are formed thereto, a plurality of building blocks inserted into the slots and power cables interconnecting the building blocks. Further, each of these building blocks is provided with a power element which corresponds to one phase. Thus, each building block in the power module may be replaced individually without having to replace the entire power module in case of a failure in a single power element of the power module. | 06-07-2012 |
20120140413 | DUAL-PERFORMANCE LOW NOISE AMPLIFIER FOR SATELLITE-BASED RADIOFREQUENCY COMMUNICATION - A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar. | 06-07-2012 |
20120147558 | Scalable electronics, computer, router, process control and other module/enclosures employing approximated tesselation(s)/tiling(s) or electronics and other modules from tow modules to columns, rows and arrays with optional deployment utilizing palletization for build out of existing industrial space and/or new construction with nestable wiring applicable from module and assembly level to molecular and atomic levels - Scalable Electronics, Computer, Router, Process Control and other Module/Enclosures Employing Approximated Tessellation/Tiling or Electronics and Other Modules from Two Modules to Columns, Rows and Arrays with Optional Deployment utilizing Palletization for Build out of Existing Industrial Space And/or New Construction with nestable wiring applicable from module and assembly and chip level to molecular and atomic levels. | 06-14-2012 |
20120170216 | SYNTHETIC JET PACKAGING - A synthetic jet device includes a housing, a connector within the housing configured to communicate with an exterior power source, driver electronics within the housing, a first membrane within the housing, and a second membrane within the housing. | 07-05-2012 |
20120188712 | POWER CONVERTER - In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block. | 07-26-2012 |
20120188713 | ADJUSTABLE VENTILATION SYSTEM - An electronic device includes a case having a vent defining a plurality of holes. The electronic device further includes an adjusting plate movably mounted on the case and aligning with the vent, and the adjusting plate defines a plurality of holes. A plurality of vent regions are defined on the vent, at least one hollow region and at least one tangible region are defined on the adjusting plate. The adjusting plate is movable relative to the vent such that the plurality of the holes of the adjusting plate aligns with, or the adjusting plate partially blocks or totally blocks, the plurality of holes of the vent. | 07-26-2012 |
20120188714 | BATTERY MANAGEMENT SYSTEM - The present invention relates to a battery management system for a battery module comprising a plurality of cells connected to one another which each have a positive and a negative terminal. The invention is in particular concerned with a battery management system which is used with accumulators especially lithium ion cells for forming a traction battery or a traction battery module for vehicles with an electrical drive drain. Such battery modules can for example be used in electrical vehicles, hybrid vehicles with combustion engines or hybrid vehicles with fuel cells, can however also be used for other purposes, for example for stationary applications or for small traction applications, such as for example in a wheelchair. | 07-26-2012 |
20120229977 | Coaxial Capacitor Bus Termination - Parallel plate bus structures are commonly used for high-current applications where low inductance is a requirement. Such bus structures are very well suited for inverter topologies used to convert from DC to AC power and a capacitor is needed to minimize ripple on the DC bus. However, such arrangements are not able to provide sufficiently low inductance to easily eliminate bypass capacitors which typically requires a system inductance below 10 nH nor do they provide any natural EMI suppression. The present invention utilizes that natural circular symmetry of a circular film capacitor winding by implementing a coaxial shaped bus connection from the capacitor to the switching semiconductors in the DC bus application of DC to AC inverter. The result is an achievement of lower ESL and geometry based EMI suppression without the use of external-lumped filtering components. | 09-13-2012 |
20120281357 | CONTAINER DATA CENTER - A container data center includes a container, at least one power supplying assembly, at least one cooling assembly, and at least one server assembly. The power supplying assembly, the cooling assembly, and the server assembly are received in the container. The cooling assembly is positioned between the power supplying assembly and the server assembly. The power supplying assembly includes a first frame and a plurality of power boxes supported in the first frame, and is for supplying power to the cooling assembly and the server assembly. The cooling assembly includes a second frame and a plurality of cooling devices supported in the second frame, and is for cooling the power supplying assembly and the server assembly. The server assembly includes a third frame and a plurality of servers supported in the third frame. | 11-08-2012 |
20120287574 | HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE - A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate. | 11-15-2012 |
20120287575 | MODULE COOLING METHOD AND PLENUM ADAPTOR - A method and apparatus for cooling modules in a radio system is disclosed. The apparatus comprises an adaptor module with side walls and integrated heat exchanging elements. The adaptor module adapts the air flow from a chassis in the radio system such that the exiting ducting on the chassis efficiently mate with the air conduits in the modules. The adaptor allows the use of new high power density modules in the existing chassis without changing the module design. The use of adaptor module in chassis provides efficient cooling and use less volume in the chassis. | 11-15-2012 |
20130033818 | POWER SUPPLY UNIT USING HOUSING IN WHICH PRINTED CIRCUIT BOARD IS HOUSED - In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components. | 02-07-2013 |
20130100609 | CONTAINER DATA CENTER - A container data center includes a temperature control system to monitor a temperature of the container data center. The temperature control system includes a temperature sensor to sense the temperature of the container data center. The temperature control alarm system determines whether the sensed temperature is greater than first and second predetermined temperatures. The second predetermined temperature is greater than the first predetermined temperature. If the sensed temperature is greater than the first predetermined temperature, a cooling device is turned on to cool the container data center. If the sensed temperature is also greater than the second predetermined temperature, an alarm device is started and an alarm message is transmitted to a monitor center. | 04-25-2013 |
20130114206 | POWER ELECTRONIC ARRANGEMENT - A power electronics assembly having a cooling device, one or more capacitors and one or more circuits, wherein at least one capacitor is electrically connected to at least one circuit, and wherein at least one circuit is disposed on the cooling device, wherein the power electronics assembly also exhibits a bracket having a bracket base body and at least one connecting element, provided for attachment to the cooling device, wherein at least one capacitor is accommodated on the bracket base body, in particular, placed and supported thereon, and wherein the circuit disposed on the cooling device is disposed on a surface of the cooling device facing the bracket base body. | 05-09-2013 |
20130114207 | ELECTRONIC ASSEMBLY WITH COOLING DEVICE - The invention relates to an electronic assembly comprising a plurality of electronic component groups and a cooling device for cooling the electronic component groups. The cooling device provides a cooling-power distributor. A cooling power of the cooling device can be individually controlled by the cooling-power distributor for every component group. Furthermore, the assembly provides temperature-registering means for every component group for registering a temperature of every component group, and a load-determining device for determining a parameter for every component group which describes the load experienced by a component group on the basis of the temperature registered for this component group. A control unit controls the cooling-power distributor on the basis of the parameters determined for the component groups. | 05-09-2013 |
20130148296 | PROTECTING JACKET FOR ELECTRONIC PRODUCT - The present invention discloses a protecting jacket, which includes a protecting jacket body and a semiconductor cooler. The semiconductor cooler is disposed on an inner surface of the protecting jacket body. The semiconductor cooler includes a Peltier element, a thermistor sensor, a PWM controller, and a switching element. The PWM controller is respectively coupled to the thermistor sensor and the switching element, and the switching element is coupled to the Peltier element. A circuit is connected by the switching element for making the semiconductor cooler work when a temperature of an electronic product is higher than a constant value. In distinct contrast, the circuit is disconnected by the switching element for stopping the semiconductor cooler working when the temperature of the electronic product is lower than the constant value. Therefore, the electronic product can maintain a longer working time, and conserving energy is achieved. | 06-13-2013 |
20130201627 | EXPLOSION PROTECTION HOUSING HAVING AN EXPANDED AMBIENT TEMPERATURE RANGE - An explosion protection housing constructed according to an explosion protection requirement having a temperature control system. The temperature control system includes a temperature control device that includes a pipe coil thermally connected to at least one of the walls of the housing. Optionally, temperature control fluid is directed through the pipe coil by means of circulating pump in order to increase or decrease the temperature of the housing, depending upon the explosion protection requirements. | 08-08-2013 |
20140043756 | ACTIVE THERMAL CONTROL FOR STACKED IC DEVICES - Thermal conductivity in a stacked IC device can be improved by constructing one or more active temperature control devices within the stacked IC device. In one embodiment, the control devices are thermal electric (TE) devices, such as Peltier devices. The TE devices can then be selectively controlled to remove or add heat, as necessary, to maintain the stacked IC device within a defined temperature range. The active temperature control elements can be P-N junctions created in the stacked IC device and can serve to move the heat laterally and/or vertically, as desired. | 02-13-2014 |
20140071620 | POWER-SUPPLY CONTROLLING SYSTEM AND METHOD - A power-supply controlling system includes an integrated circuit that outputs a first instruction signal, which instructs an electricity-supply unit to supply electricity to a device that releases heat, a detecting unit that detects an operating status of a cooling unit that cools the device, a state signal generating unit that generates a state signal in accordance with the detected operating status, the state signal indicating whether or not the cooling unit is being driven, and an output unit that generates a second instruction signal by using the first instruction signal and the state signal, and outputs the second instruction signal to the electricity-supply unit, the second instruction signal giving an instruction to supply electricity to the device. | 03-13-2014 |
20140118931 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes: a casing comprising a display thereto, the casing being configured to house therein an electric component configured to generate heat; a wearing member configured to be wrapped around an arm of a human body to cause the casing to be worn on the arm; a plurality of electrodes configured to face, in a state that the casing is worn on an arm, a side of the arm; an impedance measurement module configured to measure impedance between two of the electrodes; and a controller configured to control the electric component so that when the impedance obtained in the impedance measurement module is lower than a threshold, an amount of the heat generated by the electric component becomes small compared with a case that the impedance is higher than the threshold. | 05-01-2014 |
20140153189 | ELECTRIC POWER CONVERTER - An electric power converter has a stacked body formed by stacking a plurality of semiconductor modules and coolers, a capacitor, and positive and negative bus bars. Each of the bus bars is formed by two sheets of plate members, respectively. Each of the plate members has a body portion, a plurality of extended portions, and a plurality of terminal connecting portions. The terminal connecting portions are connected to power terminals of the semiconductor modules. The main body portion of each plate member are joined to each other so that the terminal connecting portion of the one of the plate members and the terminal connecting portion | 06-05-2014 |
20140218862 | ELECTRICAL JUNCTION BOX - An electrical junction box includes a casing configured to be mounted in a vehicle, a start relay (a start electrical component) A housed in the casing and to which a current is supplied at least at a start of the vehicle, an operational electrical component (an operational relay, a connector, and a fuse connector) housed in the casing and to which a current is supplied at least during an operation of the vehicle, and a surrounding heat shield wall (a heat shield wall) disposed between the start relay and at least one of the operational relay, the connector, and the fuse connector that are the operational electrical components. The start relay includes a relay case (an electrical component case) and a terminal portion. The terminal portion is housed in the relay case and has a fixed contact and a movable contact. | 08-07-2014 |
20140254092 | SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector. | 09-11-2014 |
20140347816 | Display Device - A display device, comprising a display panel, a back surface enclosure disposed on a back surface side of the display panel and comprising a concave portion formed in a concave shape on a display panel side, and a heat generating component disposed between the display panel and the back surface enclosure, wherein the concave portion comprises a plurality of holes that release heat from the heat generating component to an outside of the display device. | 11-27-2014 |
20140368998 | PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE | 12-18-2014 |
20150009624 | STACKABLE COOLING RAIL BASED SYSTEM - Systems and methods providing for packaging of scalable machines are discussed herein. Some embodiments may include a stackable cooling rail based system with a plurality of stackable frames. A stackable frame may contain one or more modules that may contain functional components; one or more cooling elements to remove heat from the one or more modules (e.g., on a first side); and one or more cooling rails coupled thermally with the one or more cooling elements. The stackable frame may move (e.g., together) with at least one of its cooling rails, such that the stackable frames and cooling rails may be adjustable between an opened configuration and a stacked configuration. In the opened configuration, an access gap may be present between a pair of consecutively stacked stackable frames and their cooling rails, to provide physical access to modules and other features. | 01-08-2015 |
20150098187 | SYSTEM AND METHOD FOR MEASURING SWITCHING LOSS ASSOCIATED WITH SEMICONDUCTOR SWITCHING DEVICES - A method according to an exemplary aspect of the present disclosure includes, among other things, controlling a vehicle using switching loss information of a semiconductor switching device, the switching loss information derived from a conduction loss and a combined conduction and switching loss. | 04-09-2015 |
20150334820 | Heatsink-Less Electronic Unit - A heatsink-less electronic unit includes a metal coreless electronic substrate, a heatsink-less microcomputer and various semiconductor relays. The heatsink-less microcomputer and the various semiconductor relays are mounted on the metal coreless electronic substrate. The heatsink-less microcomputer is arranged on the metal coreless electronic substrate. Among from the various semiconductor relays, one which may reach highest temperature is separated at a longest distance from a location where the heatsink-less microcomputer is arranged, and the various semiconductor relays are arranged separately from one another. | 11-19-2015 |
20150359113 | Integrated Data and Power Cord for use with Modular Display Panels - Integrated Data and Power Cord for use with Modular Display Panels In one embodiment, a display panel includes a plurality of display elements, and image control circuitry coupled to the display elements. A power supply circuitry is coupled to the display elements. A housing encloses the display elements and the image control circuitry. The housing is sealed with respect to external elements. A first integrated data and power cable extends from outside the housing, through a housing wall and electrically connected to the image control circuitry and the power circuitry. A second integrated data and power cable extends from outside the housing, through the housing wall and electrically connected to the image control circuitry and the power circuitry. | 12-10-2015 |
20160035658 | Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure - An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device. | 02-04-2016 |
20160086521 | System and Method for a Modular Multi-Panel Display - System and Method for a Modular Multi-Panel Display Embodiments of the present invention relate to integrated modular display systems. In one embodiment, a modular multi-panel display system includes a mechanical support structure, and a plurality of display panels detachably mounted to the mechanical support structure so as to form an integrated display panel. Each LED panel includes an LED array and an LED driver coupled to the LED array. Each panel further includes a power supply unit disposed outside the housing and electrically coupled to the receiver circuit. The mechanical structure is configured to provide mechanical support to the plurality of display panels without providing hermetic sealing. Each of the plurality of display panels is hermetically sealed. | 03-24-2016 |
20160174382 | ELECTRONIC MODULE | 06-16-2016 |
20160194542 | POLYIMIDE RESIN COMPOSITION, AND HEAT-CONDUCTIVE ADHESIVE FILM PRODUCED USING SAME | 07-07-2016 |
20180024396 | DISPLAY DEVICE | 01-25-2018 |
20220141993 | COOLING APPARATUS, COOLING SYSTEM, AND COOLING METHOD - A cooling apparatus includes a duct provided above a cooling target and configured to guide an air discharged after absorbing heat generated inside the cooling target to the cooling target, a cooler provided in the duct and configured to cool the air flowing in the duct, and an adjusting mechanism provided downstream of the cooler and configured to adjust the air discharged from the duct to the cooling target, and the duct receives the air discharged from one side of the cooling target and directed upward, guides the air to another side of the cooling target, and discharges the air downward on the other side, and the adjusting mechanism changes a position of an opening at a discharge port of the duct. | 05-05-2022 |