Class / Patent application number | Description | Number of patent applications / Date published |
361328000 | Multiple capacitors | 30 |
20080218937 | VARIABLY ORIENTATED CAPACITIVE ELEMENTS FOR PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURING SAME - Variably oriented capacitive elements for printed circuit boards (PCBs) and method of manufacturing the same. In one form the disclosure, a PCB can include a first multiple-layered capacitor including a first orientation and placed along a surface operable to mount electronic components. The PCB can also include a second multiple-layered capacitor including a second orientation different from the first. The second multiple-layered capacitor can be placed along the surface near the first multiple-layered capacitor. | 09-11-2008 |
20080304205 | INTERTWINED FINGER CAPACITORS - Capacitive structures in integrated circuits are disclosed. The capacitive structures are formed on a substrate. Each capacitive structure includes a first conductive finger and a second conductive finger. The first and second conductive fingers are arranged in parallel with each other and separated from each other by a dielectric material. The first finger is connected to a first interconnect and the second conductive finger is connected to a second interconnect. A first capacitor is formed from a first group of the plurality of capacitive structures having respective interconnects coupled together. A second capacitor is formed from a second group of the plurality of capacitive structures having respective interconnects coupled together. The capacitive structures of the first group are intertwined with the capacitive structures of the second group. | 12-11-2008 |
20090009928 | Film, a capacitor, a voltage transformer and a method of using a capacitor - A film is disclosed which includes a base having an electrically insulating polymer which carries on one or both surfaces a sequence of electrically conductively coated areas which are separated by non-coated interstices. The film, or a superposition of films arranged one above another, can be shaped (for example, folded or wound) to form a capacitor with a plurality of essentially parallel electrodes which are insulated from each other and each include (e.g., consist of) one or more electrode layers formed by the coated areas and separated by dielectric layers formed by sections of the base. An exemplary electrode layer can include two adjacent coated areas pertaining to subsequent turns. The capacitor can have a high voltage withstand capacity and can be used, for example, as a high voltage capacitor in a capacitive voltage transformer in series with a known low voltage transformer wound from two superposed conductively coated films. | 01-08-2009 |
20090103240 | CAPACITOR ARRAY AND METHOD FOR MANUFACTURING THE SAME - A capacitor array includes mutually opposed first and second internal electrodes having a first capacitance portion and a second capacitance portion, respectively, a first lead portion and a second lead portion, respectively, which are electrically connected to a first outer terminal electrode and a second outer terminal electrode, and a first protrusion portion and a second protrusion portion, respectively, which partially protrude toward the second outer terminal electrode and the first outer terminal electrode. The outer terminal electrodes have plating films directly connected to the internal electrodes. The plating film is formed by electrolytic plating. In the electrolytic plating, deposition of plating proceeds while being prevented from spreading in width directions of the individual side surfaces by electric fields generated from the protrusion portions toward the vicinities of exposure portions of the respective lead portions on the side surfaces. | 04-23-2009 |
20090128991 | Methods and apparatuses for stacked capacitors for image sensors - Capacitive circuits and methods of forming capacitive circuits including a first capacitor and a second capacitor connected in parallel to the first capacitor, wherein the first capacitor is positioned at least partially above the second capacitor. | 05-21-2009 |
20090168300 | High-voltage capacitor - A high-voltage capacitor is used to transmit energy and has an insulator housing, wherein at least two serially connected capacitors, which are mounted in parallel, are arranged. Said capacitors are made of, respectively, a serial connection of individual capacitors which are embodied as stackable capacitor elements. The resulting high-voltage capacitor is compact and economical. Each capacitor element comprises several individual capacitors which are maintained in an isolated manner, whereby the number corresponds to the number of serially connected capacitors, such that said serially connected capacitors are formed by one stack of capacitor elements. | 07-02-2009 |
20090310280 | Concentrated Capacitor Assembly - A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace. | 12-17-2009 |
20100033896 | MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor element body; a first signal terminal electrode, a second signal terminal electrode, and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a ground internal electrode and first to third signal internal electrodes which are arranged within the capacitor element body. The ground internal electrode is connected to the ground terminal electrode. The first signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a first capacitor The second signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a second capacitor. The third signal internal electrode is connected to the second signal terminal electrode and opposes the ground internal electrode so as to construct a third capacitor. The first and second capacitors have respective capacitances different from each other. | 02-11-2010 |
20110134584 | Hard start kit for multiple replacement applications - A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors. | 06-09-2011 |
20110228444 | LOAD SYSTEM FOR AN MCAP ENERGY STORAGE MODULE - This invention discloses a load system for loading an Mcap energy storage module to an apparatus, comprising: a storage unit and a load unit. The storage unit further comprises: a first housing part and a seal for sealing the first housing part. The first housing part includes four side walls, a bottom wall and a first opening. A plurality of Mcap cell are disposed in the first housing part through the first opening. A first electrode formed in a side wall. A second electrode formed in another side wall facing the first side wall. The load unit comprises a second housing part and a seal for sealing the second housing part. The storage unit is loaded into the second housing part through the second opening. | 09-22-2011 |
20110228445 | CAPACITOR MODULE - A capacitor module is provided with a plurality of capacitors juxtaposedly disposed to have electrode terminals that are composed of positive electrode terminals and negative electrode terminals, respectively. Neighboring capacitors, among the plurality of capacitors, are disposed adjacent to each other to define neighboring electrode terminals, among the electrode terminals thereof, with the same polarity. | 09-22-2011 |
20120113563 | ELECTRONIC COMPONENT AND SUBSTRATE MODULE - In an electronic component and a substrate module, a laminated body includes a first capacitor conductor and a second capacitor conductor embedded therein, which define a capacitor. First and second external electrodes are connected to the first capacitor conductor and the second capacitor conductor through extraction conductors, respectively. Third and fourth external electrodes are connected to the first capacitor conductor through extraction conductors. Fifth and sixth external electrodes are connected to the second capacitor conductor through extraction conductors. On a first side surface, no external electrode having an electrical potential different from the electrical potential of the third external electrode is provided between a first end surface and the third external electrode. On the first side surface, no external electrode having an electrical potential different from the electrical potential of the fifth external electrode is provided between a second end surface and the fifth external electrode. | 05-10-2012 |
20150310993 | Plurality of Capacitors Electrically Connected in Parallel as a Single Physical Unit - A plurality of parallel capacitors is constructed using an elongate common capacitor electrode with individual capacitors formed from individual capacitor electrodes spaced along and separated from the common electrode by a layer of dielectric material. The layer of dielectric material can be a dielectric film material or a ceramic material. The layer of dielectric material can be tapered along the common electrode, and/or additional dielectric material can be positioned between edges of adjacent individual electrodes. An individual electrode at one end of the common electrode can be made wider to increase its capacitance. | 10-29-2015 |
20150340157 | DIRECT-CURRENT CAPACITOR MODULE AND LAMINATED BUSBAR STRUCTURE THEREOF - A direct-current capacitor module is disclosed in this disclosure. The direct-current capacitor module includes a plurality of direct-current capacitors and a laminated busbar structure. The direct-current capacitors are grouped into a first portion and a second portion. The laminated busbar structure is electrically connected to capacitor binding posts of the direct-current capacitors. The laminated busbar structure has a positive terminal and a negative terminal. The laminated busbar structure includes a first busbar layer, a second busbar layer and an insulation layer. The first busbar layer includes a first sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the first portion. The second busbar layer includes a second sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the second portion. The insulation layer is disposed between the first busbar layer and the second busbar layer. | 11-26-2015 |
20150370952 | CAPACITOR ARRAY AND LAYOUT DESIGN METHOD THEREOF - A layout design method is provided for generating capacitor arrays being described in four steps: first, the wiring mode of unit capacitors is defined allowing the wire being connected to the upper plate to parallel that to the lower one, second, a capacitor array layout is designed with capacitors being distributed in Mh lines, Mh is the maximum of capacitors' lines, the line numbers of Class 1 to Class K capacitors are defined in the unilateral capacitor array, third, the wiring mode is set for capacitor array making sure the lengths of the wires to the upper and lower plates of unit capacitors are equal, at last, parasitic parameters are characterized in ways that verify the layout. A capacitor array is provided as well. By eliminating capacitance mismatching caused by parasitic capacitance, the method works to generate a well-matched capacitor array in an easy and efficient way. | 12-24-2015 |
20160055971 | FORCED CONVECTION LIQUID COOLING OF FLUID-FILLED HIGH DENSITY PULSED POWER CAPACITOR WITH NATIVE FLUID - A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank. | 02-25-2016 |
361329000 | Distinct physically | 10 |
20090128992 | MOS CAPACITOR STRUCTURE AND LINEARIZATION METHOD FOR REDUCED VARIATION OF THE CAPACITANCE - A highly linearized capacitor structure is formed by a first capacitor, that is coupled between a first terminal and a common node, combine with a second capacitor, that is coupled between a second terminal and the common node. When a bias voltage is applied, the capacitance values of the first and second capacitors combine and a capacitance variation of the first capacitor is compensated by a capacitance variation of the second capacitor to reduce and linearize overall capacitance variation in the combined capacitor structure. | 05-21-2009 |
20090128993 | MULTI-TIER CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SEMICONDUCTOR SUBSTRATE EMPLOYING THE SAME - A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is induced. Therefore, a single plate capacitor structure has function of hierarchical decoupling capacitor effect. | 05-21-2009 |
20100020470 | SYSTEMS, METHODS, AND APPARATUSES FOR BALANCING CAPACITOR LOAD - Systems, methods, and apparatuses for balancing capacitor load are provided. A system includes a plurality of capacitors, a plurality of respective positive connections and a plurality of respective negative connections that connect each of the plurality of capacitors to at least one power source, where each of the plurality of positive connections has an approximately equal length, and each of the plurality of negative connections has an approximately equal length. | 01-28-2010 |
20100033897 | MULTILAYER CHIP CAPACITOR - There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency. | 02-11-2010 |
20120120548 | CAPACITOR ASSEMBLY - A capacitor apparatus includes eight capacitor elements connected in parallel to an alternating-current current source. The impedance of a bus bar between the (j+1)th (j is 1 to 6) capacitor element and the (j+2)th capacitor element from a connecting terminal is (j+1) times the impedance of the bus bar between the first capacitor element and the second capacitor element from the connecting terminal. The impedance of the bus bar between the (j+1)th capacitor element and the (j+2)th capacitor element from a connecting terminal is (j+1) times the impedance of the bus bar between the first capacitor element and the second capacitor element from the connecting terminal. | 05-17-2012 |
20120243144 | TABLESS ROLL CAPACITOR AND CAPACITOR STACK - A capacitor ( | 09-27-2012 |
20140085772 | DIRECT CURRENT CAPACITOR MODULE - A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB. | 03-27-2014 |
20140347784 | Power Factor Correction Capacitors - An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly. | 11-27-2014 |
20160172111 | CAPACITOR MODULE OF INVERTER FOR VEHICLE | 06-16-2016 |
20160203916 | Hard Start Kit for Multiple Replacement Applications | 07-14-2016 |
361330000 | Shared electrode | 4 |
20110069425 | MODULARIZED THREE-DIMENSIONAL CAPACITOR ARRAY - A modularized capacitor array includes a plurality of capacitor modules. Each capacitor module includes a capacitor and a switching device that is configured to electrically disconnect the capacitor. The switching device includes a sensing unit configured to detect the level of leakage of the capacitor so that the switching device disconnects the capacitor electrically if the leakage current exceeds a predetermined level. Each capacitor module can include a single capacitor plate, two capacitor plates, or more than two capacitor plates. The leakage sensors and switching devices are employed to electrically disconnect any capacitor module of the capacitor array that becomes leaky, thereby protecting the capacitor array from excessive electrical leakage. | 03-24-2011 |
20110149472 | METHOD OF CONNECTING BUSBARS WITH CAPACITOR AND PRODUCT MANUFACTURED BY THE SAME METHOD - There is provided a method of connecting busbars for a capacitor and a product manufactured by the same method, whereby the inductance of the capacitor is decreased and thus the amount of heat generated in the capacitor is decreased to improve the temperature characteristics and electrical characteristics of the capacitor and the reliability of the quality of the capacitor, to consistently improve the insulation between the busbars having different polarity, and to maintain the insulation between the busbars in severe environments. The method of connecting busbars for a capacitor is characterized by coating at least parts of an N-pole busbar and a P-pole busbar, each of which has different polarity, with an insulating material; exposing parts of the N-pole and P-pole busbars outside an outer case so as to form a terminal to be connected to an other component; and connecting the N-pole busbar to the P-pole busbar in a manner that at least parts of the N-pole and P-pole is busbars overlap each other. | 06-23-2011 |
20120106026 | ELECTRICAL STORAGE DEVICE - A electrical storage device has: a cell module including a plurality of cells arranged juxtaposed and each having a pair of current collector terminals protruding from electrodes, the current collector terminals of adjacent ones of the cells being connected to each other; and an electronic circuit board disposed near the cell module and electrically connected to the current collector terminals of each of the cells via a plurality of connecting wires, for controlling charging and discharging of each of the cells. A cable having flexibility or a flexible wire is used as each of the connecting wires. One end of each of the connecting wires has a connecting terminal portion for clamping the current collector terminals of the adjacent ones of the cells to each other. | 05-03-2012 |
20120134069 | LOW INDUCTANCE CAPACITOR ASSEMBLY - A low-inductance capacitor assembly ( | 05-31-2012 |