Class / Patent application number | Description | Number of patent applications / Date published |
361321300 | Including metallization coating | 12 |
20080304204 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT - In a sintered ceramic body including side gap portions arranged between sides of first and second internal electrodes and first and second side surfaces of the sintered ceramic body and between sides of the effective layer portion and the first and second side surfaces of the sintered ceramic body, regions of the side gap portions at least adjacent to the first and second internal electrodes are Mg-rich regions each having a Mg concentration greater than that of the effective layer portion. | 12-11-2008 |
20090002920 | MONOLITHIC CERAMIC CAPACITOR - In an LW-reverse-type monolithic ceramic capacitor including external terminal electrodes each including a resistance component, internal electrodes include nickel or a nickel alloy, and the external terminal electrodes each include a first layer, a second layer provided on the first layer, and a third layer provided on the second layer. The first layer has a wrap-around portion extending from an end surface to principal surfaces and side surfaces of a capacitor main body, and contains a glass component and a compound oxide that reacts with Ni or the Ni alloy. The second layer covers the first layer such that the edge of the wrap-around portion of the first layer remains exposed, and contains a metal. The third layer covers the edge of the wrap-around portion of the first layer and the second layer, and is formed by plating. | 01-01-2009 |
20090002921 | MULTILAYER CERAMIC CAPACITOR WITH INTERNAL CURRENT CANCELLATION AND BOTTOM TERMINALS - Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, defining a narrow and controlled spacing between the lands that is intended to reduce the current loop area, thus reducing the component inductance. Further reduction in current loop area and thus component equivalent series inductance (ESL) may be provided by interdigitated terminations. Terminations may be formed by various electroless plating techniques, and may be directly soldered to circuit board pads. Terminations may also be located on “ends” of the capacitors to enable electrical testing or to control solder fillet size and shape. Two-terminal devices may be formed as well as devices with multiple terminations on a given bottom (mounting) surface of the device. Terminations may also be formed on the top surface (opposite a designated mounting surface) and may be a mirror image, reverse-mirror image, or different shape relative to the bottom surface. | 01-01-2009 |
20090279229 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayer ceramic electronic component includes a first substep of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated sublayer, and a second substep of heat-treating the laminate including the plated sublayer at a temperature of at least about 800° C., wherein a plated layer including a plurality of plated sublayers is formed by continuously performing at least two cycles of the first substep and the second substep. | 11-12-2009 |
20120120547 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a ceramic electronic component and a method of manufacturing the same. The method of manufacturing the ceramic electronic component includes: forming a fluorine coating layer on a ceramic sintered body, the fluorine coating layer having wettability of an external electrode paste lower than that of the external electrode paste on the ceramic sintered body and including carbon; and forming an external electrode by applying the external electrode paste on a surface of the ceramic sintered body. | 05-17-2012 |
20120268862 | CERAMIC DIELECTRIC MATERIAL MATCHED WITH NICKEL INTERNAL ELECTRODE AND METHOD FOR PRODUCING CAPACITOR USING SAME - A high-frequency and low-dielectric-constant ceramic dielectric material matched with nicket internal electrode and a method for producing capacitor using same. The ceramic dielectric material consists of main crystalline phase, modifying additive and sintering flux. The main crystalline phase is MgZr | 10-25-2012 |
20120327557 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 12-27-2012 |
20130063865 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, MULTILAYERED CERAMIC ELECTRONIC COMPONENT USING THE SAME AND FABRICATION METHOD THEREOF - There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20≦a≦60, 20≦b≦60, and 2≦c≦25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved. | 03-14-2013 |
20130155574 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability. | 06-20-2013 |
20130258551 | CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There are provided a conductive paste composition for an internal electrode and a multilayer ceramic capacitor including the same. The conductive paste composition for an internal electrode includes metal powder; and chrome oxide (Cr | 10-03-2013 |
20140022699 | GLASS CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME - A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode. | 01-23-2014 |
20140240899 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film. | 08-28-2014 |