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361 - Electricity: electrical systems and devices

361271000 - ELECTROSTATIC CAPACITORS

361301100 - Fixed capacitor

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DocumentTitleDate
20090080139STRUCTURE OF EMBEDDED CAPACITOR - The embedded capacitor of the present invention contains a power plate, a ground plate, and a dielectric layer vertically sandwiched between the power and ground plates. Both the power and ground plates are divided laterally into a number of smaller plates with appropriate gaps therebetween; and, as such, cracks in the dielectric layers are limited to happen between gaps only. The smaller plates are then electrically connected by connectors in the gaps. The connectors for the power plate and the connectors for the ground plate are not vertically overlapped so that they do not appear simultaneously at the two ends of the cracks simultaneously.03-26-2009
20130044404Titanium-Based High-K Dielectric Films - This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO02-21-2013
20090201625CONDUCTIVE STRUCTURE HAVING CAPACITOR - A three-dimensional conductive structure has a first electrode and a second electrode of a capacitor structure, and thereby defines a capacitor space. At least a signal line is further included in the capacitor space where both the first electrode and the second electrode can cross and detour round the signal line. Therefore, the signal line can go directly through the capacitor space for transferring various signals without making a detour to avoid the whole capacitor structure.08-13-2009
20110194228DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - To increase the dielectric constant of a dielectric ceramic containing ABO08-11-2011
20130038979MULTILAYER CAPACITOR - A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes.02-14-2013
20130038981CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR - A method of manufacturing a capacitor includes forming, above a first metal foil, a first dielectric film of a ceramic material containing barium oxide by blowing dry ceramic particles to the first metal foil from a nozzle, forming, in the first dielectric film, a first via conductor connected to the first metal foil and a second via conductor connected to the first metal foil, forming, above the first dielectric film, a first electrode pattern connected to the first via conductor, and patterning the first metal foil to form a second electrode pattern connected to the second via conductor.02-14-2013
20130038980INNER ELECTRODE, AND MULTILAYERED CERAMIC CAPACITOR COMPRISING THE INNER ELECTRODE - Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.02-14-2013
20100046136Metal capacitor and manufacturing method thereof - A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming portion; a metal oxide layer being formed on the terminal increase-type metal member; an insulating layer being formed on the terminal increase-type metal member; a plurality of main electrode layers being formed in a groove forming portion; a plurality of conductive connecting layers being formed on the plurality of main electrode layers and the insulating layer; a first lead terminal being selectively connected to the first and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-type metal member; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals.02-25-2010
20100046135ELECTRIC ELEMENT - An electric element comprises a dielectric layers, conductive plates, anode electrodes, and cathode electrodes. The conductive plates and the conductive plates are alternately laminated in the width direction of the electric element. The anode electrodes are connected to each of the conductive plates with a predetermined distance. The cathode electrodes are connected to each of the conductive plates with a predetermined distance. The electric element is mounted on a substrate in a manner where the bottom surface makes contact with the substrate. The anode electrode is connected to a first signal line that has a width substantially equal to that of the electric element disposed on the substrate. The anode electrode is connected to a second signal line that has a width substantially equal to that of the electric element disposed on the substrate.02-25-2010
20100046137GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY, AND MULTILAYER CERAMIC ELECTRONIC DEVICE - A glass ceramic composition is provided which can be fired at a temperature of 1,000° C. or less to form a sintered body having a low relative dielectric constant, a small temperature coefficient of resonant frequency, a small change in capacitance before and after a loading test, a high Qf value, high electrical insulating reliability, and a high flexural strength. A glass ceramic composition forming glass ceramic layers laminated to each other in a multilayer ceramic substrate is also provided. The glass ceramic composition includes a first ceramic powder containing forsterite as a primary component; a second ceramic powder containing SrTiO02-25-2010
20090135542GLASS COMPOSITION, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME - Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi05-28-2009
20090154055MULTILAYER CAPACITOR - In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced.06-18-2009
20130027839MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; and first and second inner electrode layers formed within the ceramic body, wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first or second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td<0.30 are satisfied. According to the present invention, a large-capacity multilayer ceramic electronic component capable of improving withstand voltage characteristics and having excellent reliability can be realized by improving uniformity in the thickness of the inner electrode layers.01-31-2013
20100091426MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.04-15-2010
20130070386MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a lamination main body including a plurality of inner electrodes. When T03-21-2013
20130070385STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A stacked structure includes: first and second electrode parts, and a dielectric layer. The first electrode part has a first strip portion and a plurality of first plate portions extending from a side edge of the first strip portion. The second electrode part has a second strip portion and a plurality of second plate portions extending from a side edge of the second strip portion. The first and second electrode parts are arranged such that the first and second plate portions are stacked. The first plate portions face the second plate portions and the second strip portion. The second plate portions face the first plate portions and the first strip portion. The dielectric layer is placed between the first plate portions and adjacent ones of the second plate portions, between the first plate portions and the second strip portion, and between the second plate portions and the first strip portion.03-21-2013
20090303656MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.12-10-2009
20090303655CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.12-10-2009
20090040684CREATION OF CAPACITORS EQUIPPED WITH MEANS TO REDUCE THE STRESSES IN THE METAL MATERIAL OF THEIR LOWER STRUCTURES - The method for forming the microelectronic device having at least one two or three dimensional capacitor includes creating, on a substrate, a plurality of components and a number of superimposed metal interconnection levels. An insulating layer is formed above a metal interconnection level, and a horizontal metal zone of a next metal interconnection level in which one or more of the insulating blocks created from this insulating layer are incorporated is formed therein. The zone is designed to form a lower structural part of the capacitor.02-12-2009
20130058002PACKAGE TYPE MULTI LAYER THIN FILM CAPACITOR FOR HIGH CAPACITANCE - Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 03-07-2013
20120224296Z-DIRECTED CAPACITOR COMPONENTS FOR PRINTED CIRCUIT BOARDS - A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.09-06-2012
20130063859LOW INDUCTANCE INTEGRAL CAPACITOR ASSEMBLY - The invention provides an integral high-voltage capacitor assembly that yields very low self inductance and provides voltage and current multiplication. The capacitor assembly has two or four capacitors connected in series, with each capacitor made up of a stack of capacitor cells (03-14-2013
20130063858NANOSTRUCTURED DIELECTRIC MATERIALS FOR HIGH ENERGY DENSITY MULTILAYER CERAMIC CAPACITORS - A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially titanium dioxide dielectric layer has an average grain size of between about 200 and about 400 nanometers, wherein each respective substantially titanium dioxide dielectric layer has maximum particle size of less than about 500 nanometers. Typically, each respective substantially titanium dioxide dielectric layer further includes at least one dopant selected from the group including P, V, Nb, Ta, Mo, W, and combinations thereof, and the included dopant is typically present in amounts of less than about 0.01 atomic percent.03-14-2013
20130163143MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.06-27-2013
20090237859METHOD FOR MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a method for manufacturing a monolithic ceramic electronic component, metal thin-films to be processed into internal electrodes are formed on green ceramic sheets and include first metal particles and second metal particles that are more oxidizable than the first metal. The internal electrodes are formed in a firing step such that the second metal particles located near the interfaces between the metal thin-films and the green ceramic sheets are selectively oxidized and the second metal particles located in inner portions of the metal thin-films are deposited outside the metal thin-films and oxidized such that oxide layers including the oxidized second metal particles are formed along the interfaces and the first metal particles are sintered such that the first metal particles grow along the oxide layers.09-24-2009
20120069487STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - [Problem to be Solved]03-22-2012
20120113560MULTILAYER CAPACITOR HAVING LOW EQUIVALENT SERIES INDUCTANCE AND CONTROLLED EQUIVALENT SERIES RESISTANCE - In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced.05-10-2012
20120236460MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a multilayer ceramic capacitor, including: preparing a plurality of dielectric layers including a first ceramic powder and a first binder; applying an electrode paste including a conductive powder and a second binder to the plurality of dielectric layers to form a plurality of first inner electrode patterns and second inner electrode patterns exposed to different surfaces of the plurality of dielectric layers; forming a multilayer body by stacking the plurality of dielectric layers; and applying ceramic slurry including a second ceramic powder and a solvent without compatibility with the first binder or the second binder to at least one surface of the multilayer body to form a margin part.09-20-2012
20100271750CAPACITOR STRUCTURE - A capacitor structure is provided. The capacitor structure comprises a plurality of parallel conductive line levels and a plurality of vias. Each conductive line level comprises first conductive lines parallel to each other and second conductive lines parallel to each other. Also, the first conductive lines on different conductive line levels are aligned to each other and the second conductive lines on different conductive line levels are aligned to each other so as to form first conductive line co-planes and second conductive line co-planes. The vias are located on the conductive line co-planes and between the conductive line levels for connecting the conductive lines on the neighboring conductive line levels. The vias, on a height level of each of the conductive line co-planes, are arranged only on one of the neighboring conductive line co-planes.10-28-2010
20080273286GUARD RING DEVICE RECEIVING DIFFERENT VOLTAGES FOR FORMING DECOUPLING CAPACITOR AND SEMICONDUCTOR DEVICE HAVING THE SAME - A semiconductor device in which a decoupling capacitor is formed by supplying different power levels to a guard ring device is disclosed. The semiconductor device includes a guard ring, having conductive rings, which surrounds a memory chip. The conductive rings are stacked in a multiplayer structure, and insulation layers are formed between the conductive rings. Voltages of different levels are applied to adjacent conductive rings.11-06-2008
20110299220Electrical Multi-Layered Component and Circuit Arrangement Comprising the Same - An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes (designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode (12-08-2011
20110292565CAPACITOR STRUCTURE - A capacitor structure includes a plurality of conductive line levels located over the substrate. Each of the conductive line levels includes a first conductive line and a second conductive line. The first conductive lines in the conductive line levels form a first conductive line co-plane and the second conductive lines in the conductive line levels form a second conductive line co-plane. A first conductive end is electrically connected to the first conductive lines on the conductive line levels. A second conductive end is electrically connected to the second conductive lines on the conductive line levels. A plurality of vias are located between the neighboring conductive line levels and placed on only one of the first and second conductive line co-planes on a same level.12-01-2011
20110292564POWER STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME - To provide a method for forming an electrode for a storage battery, including the step of: forming a metal layer which is over a current collector and has an edge portion; and forming a crystalline silicon layer, which is over the etched metal layer and includes a silicon whisker, as an active material layer by a low pressure chemical vapor deposition (LPCVD) method in which heating is performed with the use of a deposition gas containing silicon.12-01-2011
20090195960Electronic Device and Production Method Thereof - Electronic device 08-06-2009
20100091424METHOD FOR REDUCING SIDEWALL ETCH RESIDUE - A method for fabricating a semiconductor device is provided. The method comprising forming a first layer over a substrate and a second layer over the first layer. A patterned masking layer is subsequently provided over the second layer and a patterned second layer with outwardly tapered sidewalls is formed by isotropically etching exposed portions of the second layer. A patterned first layer is the formed by etching the first layer in accordance with the patterned second layer.04-15-2010
20090231779MULTILAYER CAPACITOR AND MOUNTED STRUCTURE THEREOF - In a multilayer capacitor, widths of lead conductors of internal electrode and widths of lead conductors of internal electrode in an ESR control section are smaller than any one of widths of internal electrode and widths of internal electrode in a capacitance section. This narrows cross sections of the conductor portions connecting between the internal electrodes and the external electrodes, so as to her increase ESR. The widths of the respective lead conductors in the ESR control section are wider than widths of respective lead conductors in the capacitance section. This effectively prevents open failure and improves a yield of products.09-17-2009
20100008017LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes first internal electrodes and second internal electrodes that overlap each other through ceramic layers, each of the first and second internal electrodes having first and second effective portions, first and second connecting portions, and first and second extended portions whose film thickness is greater than that of the first and second connecting portions and which are exposed at the outer surface of a ceramic element assembly. When distances from side surfaces of the ceramic assembly on which first and second external electrodes are provided to the inner edges of the first and second extended portions are defined as L01-14-2010
20090296310CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS - A capacitive precursor (12-03-2009
20090207550ELECTRICAL FEEDTHROUGH COMPONENT AND METHOD FOR ITS PRODUCTION - An electrical component that is surface mountable includes a base body having first inner electrodes and second inner electrodes. A first outer electrode extends along the base body in a first direction, and a through connection extends along the base body in a second direction that is different from the first direction. The first inner electrodes are electrically connected to the first outer electrode. The second inner electrodes are electrically interconnected via the through connection.08-20-2009
20130215552LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A laminated electronic component includes a laminate formed by alternately layering multiple internal electrodes and dielectrics, with the internal electrodes alternately exposed on the respective end faces of the laminate and two sets of external electrodes formed on them, wherein the external electrodes have a cermet layer that is film-formed by the sputtering method. Stable ESR (Equivalent Series Resistance) can be set over a wide range by changing the composition and film thickness of the cermet layer. In addition, ESR can be added that ensures low temperature coefficient and resistance to the impact of humidity change.08-22-2013
20090168296THROUGH-TYPE MULTILAYER CAPACITOR ARRAY - A multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor. The capacitor body includes first and, second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The first and second signal inner electrodes, and first and second grounding inner electrodes are connected to the first and second signal terminal electrodes, and first and second outer connecting conductors, respectively. The third grounding inner electrode is connected to the grounding terminal electrodes and the first and second outer connecting conductors.07-02-2009
20110170228DIELECTRIC CERAMIC COMPOSITION AND MONOLITHIC CERAMIC CAPACITOR - There is provided a dielectric ceramic composition suitable for, for example, a car-mounted monolithic ceramic capacitor used in a high-temperature environment. It is represented by the composition formula: 100(Ba07-14-2011
20090279228MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes a capacitor body provided by a stack of a plurality of dielectric layers, a plurality of internal electrodes disposed in the capacitor body such that the internal electrodes of opposite polarities are alternately disposed to face each other with the dielectric layer interposed between each facing set of the internal electrodes, and a plurality of external electrodes disposed on an outer face of the capacitor body and electrically connected with the internal electrode. Each of the plurality of internal electrodes includes a main electrode part, and at least one lead extending from the main electrode part to a side face of the capacitor body and connected to a corresponding one of the external electrodes. The lead extends to the corresponding external electrode to be inclined with respect to the main electrode part thereof.11-12-2009
20120293909HIGH DIELECTRIC FILM - The present invention provides a high dielectric film comprising: a film-forming resin (A); and inorganic particles (B), wherein the film-forming resin (A) contains a vinylidene fluoride resin (a1), an amount of the inorganic particles (B) is not less than 0.01 parts by mass and less than 10 parts by mass for each 100 parts by mass of the film-forming resin (A), and the inorganic oxide particles (B) is at least one selected from the group consisting of: (B1) inorganic oxide particles of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table, or inorganic oxide composite particles of these; (B2) inorganic composite oxide particles represented by formula (1):11-22-2012
20090279227Multi Layer Chip Capacitor, and Method and Apparatus for Manufacturing the Same - The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.11-12-2009
20100061035Capacitative element - Disclosed herein is a capacitative element, including: a first electrode formed on a substrate; and a second electrode provided so as to sandwich a dielectric between the first electrode and the second electrode and so as to surround the first electrode on four sides along a surface of the substrate.03-11-2010
20110267738MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, dielectric, internal electrode and second external electrode prints simultaneously the first external electrode; the internal electrode which is connected with the first external electrode and formed at an invaginated portion of the dielectric invaginated to allow one side to be opened at one portion; and the second external electrode which is formed integrally with the internal electrode by employing an inkjet printing. According to the present invention, a method for manufacturing the multi-layer ceramic capacitor resolves contact problems by printing integrally the internal electrode and the external electrode and reduces the manufacturing process.11-03-2011
20080239616MULTILAYER CAPACITOR ARRAY - A multilayer capacitor array comprises a capacitor body having rectangular first and second main faces opposing each other. In the capacitor body having a dielectric characteristic, first inner electrodes are arranged in a first region, second inner electrodes are arranged in a second region, and third and fourth inner electrodes are arranged so as to extend over the first and second regions. Each of the third inner electrodes opposes at least one of the first inner electrodes and at least one of the second inner electrodes. Each of the fourth inner electrodes opposes at least one of the first inner electrodes and at least one of the second inner electrodes. The third inner electrodes are adjacent to the fourth inner electrodes, respectively.10-02-2008
20090168295MULTILAYER CAPACITOR HAVING HIGH ESR - A first inner electrode has a first main electrode, a first lead conductor, a first coupling conductor, and a second lead conductor A second inner electrode has a second main electrode, a third lead conductor, and a second coupling conductor. A third inner electrode has a third main electrode, and a fourth lead conductor. The third inner electrode is connected to only a first connection conductor. In the extending direction of the first and third lead conductors, the first and second coupling conductors have a length shorter than the lengths of the first and third lead conductors and of the first and second main electrodes, respectively. The second inner electrode is adjacent to at least one of the first and third inner electrodes so as to sandwich the insulating layer07-02-2009
20080278886Increasing the capacitance of a capacitive device by micromasking - Capacitive coupling devices and methods of fabricating a capacitive coupling device are disclosed. The coupling device could include a stack of layers forming electrodes and at least one insulator. The insulator could include a a region of doped silicon. The silicon could be doped with a species selected from Ce, Cr, Co, Cu, Dy, Er, Eu, Ho, Ir, Li, Lu, Mn, Pr, Rb, Sm, Sr, Tb, Tm, Yb, Y, Ac, Am, Ba, Be, Cd, Gd, Fe, La, Pb, Ni, Ra, Sc, Th, Hf, Tl, Sn, Np, Rh, U, Zn, Ag, and Yb in relief and forming roughnesses relative to the neighbouring regions of the same level in the stack. The electrodes and the insulator form conformal layers above the doped silicon region.11-13-2008
20080310074MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor body, first and second inner electrodes, and first and second terminal electrodes. A first terminal electrode is arranged on a first surface of the capacitor body which is parallel to a first direction, and connected to the first inner electrode. A second terminal electrode is connected to the second inner electrode. The first inner electrode has a first main electrode portion including a first no-capacity generating region and a first capacity generating region, and a first lead electrode portion. In a second direction, the first terminal electrode is set smaller than the first surface, while the first lead electrode portion is set smaller than the first main electrode portion. The first no-capacity generating region and the first lead electrode portion overlap each other in the second direction when seen in the first direction.12-18-2008
20120293908MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF - A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d11-22-2012
20090128985MULTILAYER CAPACITOR - A first internal electrode includes a first lead portion and a second lead portion. A second internal electrode includes a third lead portion and a fourth lead portion. A third internal electrode includes a main electrode portion and a fifth lead portion. A fourth internal electrode includes a main electrode portion and a sixth lead portion. A joint portion between the main electrode portion and the fifth lead portion of the third internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from an opposing direction of the third and fourth side faces. A joint portion between the main electrode portion and the sixth lead portion of the fourth internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from the opposing direction of the third and fourth side faces.05-21-2009
20090185326FILM CAPACITOR - A film capacitor comprises a wound body, a first terminal part electrically connected to one end of the wound body, and a second terminal part electrically connected to the other end of the wound body. The wound body is structured by winding into a laminate a first film laminate formed of a laminate of dielectric films and having therein a floating electrode and a second film laminate formed of a laminate of first and second metal films sandwiching the first film laminate and dielectric films and having therein a floating electrode. Each of the floating electrodes is composed of integrated small electrodes independent of each other.07-23-2009
20090141420Packaged Capacitive Device And Methods Of Making The Same - Packaged capacitive devices are described having electrical interconnects of electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes, in part, due to the use of a compliant layer. The packaged capacitive devices are adaptable to a wide range of electrode diameters and electrode stack lengths.06-04-2009
20110141654NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR - There are provided a nickel powder or an alloy powder comprising nickel as a main component, in which the nickel powder or the alloy powder has an average particle size D06-16-2011
20110141653ENERGY CONDITIONER WITH TIED THROUGH ELECTRODES - The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures.06-16-2011
20090086403MULTILAYER CAPACITOR - There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode.04-02-2009
20090244803MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR10-01-2009
20090219666Dielectric Ceramic, Manufacturing Method Thereof, And Multilayer Ceramic Capacitor - A dielectric ceramic whose primary crystal grains 09-03-2009
20120106025MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor and a method of manufacturing the same. There is provided a multilayer ceramic capacitor, including: a ceramic body having a plurality of dielectric layers stacked therein and including a first side and a second side opposite to each other and a third side and a fourth side connected to the first side and the second side; and inner electrode layers formed on the dielectric layers, including electrode drawing parts exposed to the first side or the second side and an electrode main part, and having a length between the electrode main part and the third side of 100 μm or less and a ratio of a length between the electrode drawing part and the third side to the length between the electrode main part and the third side of between 1.2:1 and 1.7:1. The multilayer ceramic capacitor may have improved reliability by suppressing cracks occurring in the ceramic laminate due to thermal impact during a sintering or mounting process.05-03-2012
20090244805DIELECTRIC CERAMIC A ND MULTILAYER CERAMIC CAPACITOR - Provided is a dielectric ceramic in which, while achieving a dielectric constant ε of 500 or more, a breakdown voltage higher than 90 kV/mm can be obtained and which is suitable for constituting dielectric ceramic layers of a multilayer ceramic capacitor for medium-to-high voltage application. As the dielectric ceramic constituting dielectric ceramic layers of the multilayer ceramic capacitor, a dielectric ceramic including, as a main component, (Ba10-01-2009
20090257169STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF - In order to avoid the capacitors in a stacked capacitor structure suiting a miniaturization process from collapsing to cause a short-circuit, separated reinforced structures are used and disposed at the outer-sidewalls of the capacitor, which not only reduces the space occupied by the reinforced structure to increase the surface areas of the upper electrode and the lower electrode of the capacitor, but also allows the capacitor to be deflected but collapse-proof and there are more spaces between the capacitors, so as to solve the filling difficulty problem due to a too small filling space in a successive process of depositing conductive material into the filling space.10-15-2009
20120194963ELECTRONIC COMPONENT AND SUBSTRATE MODULE - A multilayered body includes capacitor conductors and an internal conductor, which together define a capacitor. A first external electrode is connected to one of the capacitor conductors via a set of lead electrodes. A second external electrode is connected to the other capacitor conductor via another set of lead electrodes. The internal conductor faces the capacitor conductors.08-02-2012
20120194964ELECTRONIC COMPONENT FABRICATION METHOD USING REMOVABLE SPACERS - An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.08-02-2012
20100014210DIELECTRIC CERAMIC MATERIAL AND MONOLITHIC CERAMIC CAPACITOR - A dielectric ceramic material is composed of a perovskite compound represented by ABO01-21-2010
20100177457Interdigital capacitor with Self-Canceling Inductance - An interdigital capacitor is provided with self-canceling inductance. The capacitor is made of a first metal layer including a first set of fingers connected to a first terminal, and a second set of fingers interdigitated between the first set. A second metal layer including a third set of fingers is connected to a second terminal, and a fourth set of fingers interdigitated between the third set. Each finger in the first set is connected to an overlying finger in the fourth set with at least one via. Each finger in the second set is connected to an overlying finger in the third set with at least one via. The second terminal overlies the first terminal.07-15-2010
20100232084ELECTRIC ELEMENT AND ELECTRIC CIRCUIT - Each of the plurality of conductive plates is formed on a principal surface of each of stacked dielectric layers. Side anode electrodes are connected to positive electrodes of conductive plates, while side cathode electrodes are connected to cathodes of conductive plates. Anode electrodes are connected to the side anode electrodes. Cathode electrodes are connected to the side cathode electrodes. By passing DC currents through the positive conductive plates and cathode conductive plates so as to flow in the opposite directions, effective inductance of the positive conductive plates becomes smaller than its self-inductance. Consequently, the inductance is reduced, thereby lowering impedance.09-16-2010
20110110013STACKED ELECTRIC DOUBLE LAYER CAPACITOR - A stacked electric double layer capacitor includes a capacitor unit, an aluminum laminate film, and a current collector terminal. The capacitor unit includes a pressure plate, and a current collector plate arranged inside the pressure plate. The aluminum laminate film wraps the capacitor unit, and includes a periphery that defines and surrounds a hole at a side surface of the capacitor unit. The current collector terminal is L-shaped, and includes a contact portion in contact with the current collector plate, and a terminal portion arranged perpendicular to the contact portion, wherein at least a part of the terminal portion is exposed through the hole of the aluminum laminate film, and connected to an external circuit, and the terminal portion is heat-welded to the aluminum laminate film.05-12-2011
20100238603Capacitor structure - In a capacitor structure and method of forming the same, a first electrode, a second electrode, and a first insulation layer are sequentially formed on a substrate. The first and second electrodes and the first insulation layer are covered with a second insulation layer on the substrate. A first plug is in contact with the second electrode through the second insulation layer. A second plug is in contact with the first electrode through the first and second insulation layer. A third insulation layer is formed on the second insulation layer. Third and fourth comb-shaped electrodes are formed in the third insulation layer. The third electrode is contact with the first plug and the fourth electrode is contact with the second plug while facing the third electrode. Thus, the teeth of the comb-shaped electrodes are alternately arranged and spaced apart in the third insulation layer.09-23-2010
20110019333DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic which is capable of achieving a laminated ceramic capacitor with high reliability, in particular, favorable lifetime characteristics in a load test, even when a dielectric ceramic layer is reduced in thickness, contains one of Ba(Ti, Mn)O01-27-2011
20110032657Energy Conditioner With Tied Through Electrodes - The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures.02-10-2011
20110032656FILM CAPACITOR AND METHOD OF PRODUCING THE SAME - A film capacitor is provided which has a smaller size and improved capacity while securing a sufficient withstand voltage. The film capacitor comprising a basic element 02-10-2011
20110032655MULTILAYER CAPACITOR ARRAY MOUNTING STRUCTURE - A multilayer capacitor array 02-10-2011
20130135787MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; and first and second inner electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body, the first and second inner electrodes being alternately laminated with a difference in printing widths therebetween, wherein a difference ratio between the printing widths of the first and second inner electrodes is 20 to 80%. According to embodiments of the present invention, a multilayer ceramic electronic component having excellent reliability and withstand voltage characteristics may be realized, by reducing the occurrence of cracking through a reduction in the influence of step height while securing high capacitance.05-30-2013
20130135788MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.05-30-2013
20100321858MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME - A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.12-23-2010
20130148256LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers, and an external electrode located on an outer surface of the laminated body. In the laminated ceramic electronic component, the ceramic layers have a composition including a main constituent of a barium titanate-based compound and Bi06-13-2013
20110128665Ceramic Capacitors for High Temperature Applications - A ceramic capacitor having a ceramic dielectric layer positioned between a first electrode layer and a second electrode layer and methods of manufacturing the same are provided. The ceramic dielectric layer includes a niobium doped barium titanate, a sodium bismuth titanate, and barium zirconate. The niobium doped barium titanate is present in an amount such that the ceramic dielectric layer includes from about 5% by weight to about 50% by weight barium titanate and from about 0.1% by weight to about 2% by weight niobium. The sodium bismuth titanate is present in the ceramic dielectric layer in an amount from about 25% by weight to about 75% by weight, and the barium zirconate is present in an amount from about 5% by weight to about 30% by weight.06-02-2011
20120033342STACKED FILM CAPACITOR AND METHOD OF PRODUCING THE SAME - A stacked film capacitor including a resin protective film having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element 02-09-2012
20090034152FEEDTHROUGH CAPACITOR AND METHOD FOR PRODUCING FEEDTHROUGH CAPACITOR - In a feedthrough capacitor, a signal internal electrode layer is so arranged that an opposed portion opposed to a ground internal electrode layer is provided with a projection projecting toward a ground electrode, when viewed from a direction of a stack of dielectric layers. Therefore, if a gap amount G is abnormal between an end face with the ground electrode thereon and the signal internal electrode layer, the projection comes in contact with the ground electrode and a short circuit occurs between the ground electrode and terminal electrodes. This feedthrough capacitor thus permits easy detection of abnormality of the gap amount G, based on the presence/absence of a short-circuit failure.02-05-2009
20110116210CAPACITOR AND ITS MANUFACTURING METHOD - A method for manufacturing a capacitor includes the steps of: sequentially laminating, on a substrate, a lower electrode layer, a dielectric layer and an upper electrode layer; forming a patterned mask layer on the upper electrode layer; patterning at least the upper electrode layer and the ferroelectric layer using the mask layer as a mask; removing the mask layer; and conducting a plasma treatment to contact plasma with an exposed surface of the dielectric layer.05-19-2011
20110116209CAPACITOR AND METHOD FOR FABRICATING THE SAME - A capacitor includes a lower electrode, a first dielectric layer formed over the lower electrode, a second dielectric layer formed over the first dielectric layer, wherein the second dielectric layer includes an amorphous high-k dielectric material, a third dielectric layer formed over the second dielectric layer, and an upper electrode formed over the third dielectric layer. The third dielectric layer can be thicker than the first dielectric layer.05-19-2011
20090323253MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME - A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.12-31-2009
20100039749ULTRA BROADBAND CAPACITOR - Disclosed are apparatus and methodology for inexpensive realization of one or more secondary capacitors within a monolithic body that already includes a first, larger capacitor to provide ultra wideband structures. Alternating layers of electrodes are provided with arm portions that embrace portions of adjacent electrode layers so as to create additional coupling effects within the capacitor structure thereby producing multiple additional equivalent capacitor structures within the device.02-18-2010
20090244804C0G MULTI-LAYERED CERAMIC CAPACITOR - A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula:10-01-2009
20100097739Capacitor Comprising Flex Crack Mitigation Voids - A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.04-22-2010
20120200983Multilayer Capacitor - A first inner electrode is integrally provided with a first terminal connection part connected to a first terminal electrode and a first linking connection part connected to a first linking electrode. A second inner electrode is integrally provided with a second terminal connection part connected to a second terminal electrode and a second linking connection part connected to a second linking electrode. A third inner electrode is integrally provided with a third linking connection part connected to the first linking electrode. A fourth inner electrode is integrally provided with a fourth linking connection part connected to the second linking electrode. The third inner electrode is adjacent to the first and fourth inner electrodes in a laminating direction of the plurality of dielectric layers. The first and fourth inner electrodes overlap the third inner electrode as seen in the laminating direction of the plurality of dielectric layers.08-09-2012
20090168294CAPACITOR - A capacitor according to an embodiment can include a first dielectric layer; a first metal layer disposed below the first dielectric layer; a second dielectric layer disposed below the first metal layer; a second metal layer disposed below the second dielectric layer; a third dielectric layer disposed below the second metal layer; and a third metal layer disposed below the third dielectric layer and electrically connected to the first metal layer.07-02-2009
20090021886MULTILAYER STRIP LINE CAPACITIVE ELEMENT - The capacitive element of the present invention includes a plurality of cylindrical metal pieces having different sizes, which are disposed in multiple layers surrounding a strip-shaped metal piece. A dielectric film and a conductive material layer are located between the metal piece innermostly located among the plurality of cylindrical metal pieces, and the strip-shaped metal piece, and between adjoining cylindrical metal pieces. Further, the dielectric film and the conductive material layer are laminated and disposed at positions symmetric with respect to the side wall of respective cylindrical metal piece.01-22-2009
20090021887MULTI-LAYER CAPACITOR AND WIRING BOARD HAVING A BUILT-IN CAPACITOR - A capacitor capable of decoupling in a wide frequency band is obtained. A circuit in which capacitors having different capacitances are combined can be formed without increasing the number of components. Part of a first penetrating electrode or second penetrating electrode is cut by removing a cut portion. A penetrating electrode having a cut portion reduces the number of internal electrodes that are conductively connected, so that a capacitance to be extracted is small. The capacitance to be extracted can be adjusted, depending on which of layers of internal electrodes the cut portion is formed in.01-22-2009
20080253059LAND GRID FEEDTHROUGH LOW ESL TECHNOLOGY - Disclosed are apparatus and methodology for providing land grid feedthrough capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Low equivalent series inductance (ESL) is provided by current cancellation techniques involving opposite current flow in power or signal and ground current paths through the device.10-16-2008
20080204969MULTILAYER CAPACITOR - In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of the second capacitor portion so that the first capacitor portions contribute to low ESL, an ESR per layer of the second capacitor portion is set to be greater than an ESR per layer of the first capacitor portions so that the second capacitor portion contributes to high ESR. Furthermore, a combined ESR of the first capacitor portions is set to be less than or greater than a combined ESR of the second capacitor portion.08-28-2008
20080204968MULTILAYER CAPACITOR - In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of the second capacitor portion so that the first capacitor portions contribute to low impedance, an ESR per layer of the second capacitor portion is set to be greater than an ESR per layer of the first capacitor portions so that the second capacitor portion contributes to high ESR. Further, a combined ESR of the first capacitor portions is set to be substantially equal to a combined ESR of the second capacitor portion.08-28-2008
20100328842MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm.12-30-2010
20120147515MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.06-14-2012
20100157505Multilayer Electrical Component - A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.06-24-2010
20110149465ELECTRIC DOUBLE LAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - An electric double layer capacitor 06-23-2011
20110188169Electric double layer capacitor cell, electric double layer capacitor package having the same, and methods of manufacturing the same - There are provided an electric double layer capacitor cell, an electric double layer capacitor package having the same, and methods of manufacturing the same. An electric double layer capacitor cell according to an aspect of the invention may include: a plurality of electric double layer capacitor unit cells stacked upon each other, wherein each of the plurality of electric double layer capacitor unit cells includes first and second current collectors having first and second lead terminal portions, respectively, first and second electrodes provided on the first and second current collectors, respectively, and a separator provided between the first and second electrodes, and the first and second electrode lead terminal portions each are combined into one to provide first and second bonding portions being connected to external terminals provided to apply electricity to the electric double layer capacitor unit cells.08-04-2011
20100020465MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, and cause a short-circuit. The inner conductor is printed in such a manner that the center of each of the via conductors is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability that the inner conductor contact the via conductor and cause a short-circuit is minimized.01-28-2010
20100020464MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - A method for producing a multilayer ceramic electronic component includes a plating step including depositing a plating material on the ends of internal electrodes exposed at a predetermined surface of a laminate to form plating deposits primarily composed of a specific metal and growing the plating deposits so as to connect the plating deposits to each other to form a continuous plated layer. The specific metal primarily defining the plated layer is different from a metal defining the internal electrodes. The same or substantially the same metal as the metal defining the internal electrodes is present throughout the plated layer.01-28-2010
20100020466ARRAY TYPE MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - A method of producing an array type multi-layer ceramic capacitor is disclosed, comprising: forming dielectric films, forming dielectric sheets on which internal electrodes and interelectrode dielectrics formed on the same plane as the internal electrodes are printed simultaneously by spraying ink intended for internal electrodes and ink intended for dielectrics onto the dielectric film via a plurality of inkjet printer heads, stacking and compressing the dielectric sheets, cutting the stacked dielectric sheet to include a plurality of internal electrodes on the same plane as the dielectric sheet, and sintering the cut dielectric sheets. The array type multi-layer ceramic capacitor according to the invention can solve the problem of interlayer gaps by printing the dielectrics and internal electrodes simultaneously, and can solve the contact problem by printing the internal electrode and the external electrode as a single body.01-28-2010
20090207551DIELECTRIC CERAMIC AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic is provided which is can be stably used for a multilayer ceramic capacitor even at a high temperature of approximately 175° C. The dielectric ceramic includes a perovskite type compound represented by the composition formula (B08-20-2009
20120307415MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multilayer ceramic electronic component and a method for manufacturing the same. The multilayer ceramic electronic component includes a multilayer body in which dielectric layers and internal electrode layers are alternately stacked and external electrodes, wherein a portion in the internal electrode layers positioned in a marginal portion in which vertically neighboring internal electrode layers in the multilayer body is not overlapped with each other has a thickness thicker than that of a portion of the internal electrode layer positioned in an overlapped portion in which the vertically neighboring internal electrode layers are overlapped with each other, such that an accumulated stepped height difference in the marginal portion is reduced.12-06-2012
20120307414MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L12-06-2012
20110110014LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40° C./second or more.05-12-2011
20100103586MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a rectangular dielectric body having ceramic layers and multiple first internal electrodes and second internal electrodes alternatively arranged in between each two adjacent ceramic layers and respectively terminating in a respective contact in such a manner that the contacts of the first internal electrodes and the contacts of the second internal electrodes are respectively disposed at two diagonal corners of the dielectric body, and multiple terminal electrodes respectively bonded to the two diagonal corners of the dielectric body and respectively electrically connected with the contacts of the first internal electrodes and the contacts of the second internal electrodes. By means of arranging the terminal electrodes on the two diagonal corners to extend the electrode pitch, the multilayer ceramic capacitor prevents an electric arc effect or electrical fire caused by a surge voltage, eliminating the risk of a short circuit or other accidental events.04-29-2010
20120039015LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.02-16-2012
20120039014LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.02-16-2012
20120147516MULTILAYER CERAMIC CONDENSER AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.06-14-2012
20120147517MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor according to the embodiment of the present invention includes a capacitor body in which inner electrodes including a first electrode material and dielectric layers are alternately stacked; a diffusion barrier layer formed on an outer surface of the capacitor body to be electrically connected to the inner electrodes, including the first electrode material, and having a thickness of 1 μm to 10 μm; and a first outer electrode layer formed to cover the diffusion barrier layer and including a second electrode material having a lower reactivity to oxygen than the first electrode material.06-14-2012
20120147514CERAMIC PASTE COMPOSITION FOR MULTILAYER CERAMIC CAPACITOR, MULTILAYER CERAMIC CAPACITOR COMPRISING THE SAME, AND METHODS OF MANUFACTURING THE SAME - There are provided a ceramic paste composition for a multilayer ceramic capacitor (MLCC), a multilayer ceramic capacitor comprising the same, and methods of manufacturing the same. The ceramic paste composition for the MLCC includes: a ceramic powder, a first phosphate ester-based dispersant and a second dispersant salt-bonded by a fatty acid and an alkyl amine; a binder including polyvinyl butyral and ethyl cellulose; and a solvent. The ceramic paste composition ceramic powder has a small average particle-diameter and the ceramic powder in the paste has excellent dispersibility.06-14-2012
20120147518Manufacturing Method for Laminated Ceramic Capacitor, and Laminated Ceramic Capacitor - A method for manufacturing a laminated ceramic capacitor by firing a laminated body which includes dielectric ceramic layers containing a dielectric ceramic raw material powder and internal electrodes. The firing is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO06-14-2012
20110317327Multi-layered ceramic capacitor - There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer and a plurality of ceramic layers are stacked therebetween, first and second external electrodes each formed on an outer surface of the sintered ceramic body part, a plurality of first and second internal electrode groups adjacent to each other in a stacking direction of the plurality of ceramic layers, having the ceramic layer therebetween, and including 2N or 2N+1 (N is an integer number larger than 1) internal electrodes electrically connected to the first and second external electrodes, wherein the 2N or 2N+1 (N is an integer number larger than 1) internal electrodes are disposed to face at least one internal electrode of other adjacent internal electrode groups. A length of each internal electrode has a pyramid shape.12-29-2011
20120002346Metalized film capacitor - Disclosed is a metalized film capacitor having excellent safety preservation ability and an excellent withstand voltage at high temperatures. This capacitor has a structure for which a split electrode section wherein a split electrode is formed by spliting a metalized film along the longitudinal direction by means of plural insulating slits, and a non-split electrode section for which a vapor-deposited electrode is continuous in the longitudinal direction, are arranged alternately in the film width direction of the metalized film, with each split electrode being connected to the non-split electrode section by a fuse formed between the ends of adjacent insulating slits; and has a structure for which three rows or more of split electrode sections, which are split by means of insulating slits that are aligned in the longitudinal direction of the film, are arranged in the width direction, with each split electrode that forms a split electrode section being connected to an adjacent split electrode by a fuse, and the area of a split electrode in the center of the film being smaller than the area of a split electrode arranged on the outer side.01-05-2012
20120099241MULTILAYER CERAMIC ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic electronic component and a method of manufacturing the same. There is provided a multilayer ceramic electronic component, including: a ceramic main body in which a plurality of dielectric layers having an average thickness of 1 μm or less are stacked; and inner electrode layers formed on the dielectric layers and having connectivity of 90% or more expressed by the following Equation, wherein the ratio of the thickness of the inner electrode layer to the thickness of the dielectric layer is between 0.8:1 and 1.3:1. The Equation is as follows.04-26-2012
20090195961METHOD AND DEVICE FOR STORING ELECTRICITY IN QUANTUM BATTERIES - Quantum Batteries (super capacitors) which by a new quantum effect “virtual photon resonance” can store electrical energy as a pure electrical battery in ranges up to 15 MJ/kg and more. The battery is basically a capacitor composed of insulating matrix material with either dispersed nanocrystal particles of Rutile TiO08-06-2009
20120057268ELECTRONIC COMPONENT - In an electronic component, a first external electrode includes a first side surface electrode provided on a first side surface and a substantially rectangular first principal surface electrode that is connected to the first side surface electrode and provided on a principal surface so as to be in contact with a first corner of the principal surface. A second external electrode includes a second side surface electrode that is connected to a capacitor conductor and provided on a second side surface and a substantially rectangular second principal surface electrode that is connected to the second side surface electrode and provided on the principal surface so as to be in contact with a second corner, which is located opposite to the first corner, the second principal surface electrode facing the first principal surface electrode in an x-axis direction, in which long sides of the principal surface extend.03-08-2012
20120300361MULTILAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face.11-29-2012
20120300360CAPACITOR ELEMENT AND CAPACITOR DEVICE HAVING THE SAME - A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film.11-29-2012
20120154975Thin film capacitors - A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed.06-21-2012
20120154976CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODE, LAMINATED CERAMIC ELECTRONIC PART USING THE SAME AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for an inner electrode, and a laminated ceramic electronic part and a manufacturing method thereof using the conductive paste composition. The conductive paste composition includes metal powder coated with an organosilica compound formed by polymerization of an organosilane compound having a structure of R06-21-2012
20110090616INTEGRATED CIRCUIT AND METHOD INCLUDING STRUCTURING A MATERIAL - A method of making an integrated circuit including structuring a material. The method includes providing an arrangement of three-dimensional bodies. The material is arranged between the bodies and structured directed radiation. The projection pattern of the three-dimensional bodies is transferred into the material. The structured material connects at least two of the three-dimensional bodies.04-21-2011
20110090615CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.04-21-2011
20120250217MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes alternately arranged inside the ceramic sintered body to oppose each other in a stacking direction of the ceramic layers with the ceramic layers interposed between the adjacent first and second inner electrodes. Among the ceramic layers, a number N of the ceramic layers disposed between the first inner electrodes and the second inner electrodes is at least 232. A proportion of volume occupied by the first and second inner electrodes in the ceramic sintered body is at least about 0.37. A size of each of side gap portions is about 40 μm or less.10-04-2012
20120250216SEMICONDUCTOR CERAMIC AND A MULTILAYER SEMICONDUCTOR CERAMIC CAPACITOR - A purpose of the present invention is to provide a multilayer semiconductor ceramic capacitor, which makes coexistence of a high dielectric property and a high insulating resistance of a semiconductor ceramic possible by improving insulating property of the semiconductor ceramic component. In order to achieve such object, BaTiO10-04-2012
20110110012BIPOLAR LAYERED TYPE ELECTRIC DOUBLE LAYER CAPACITOR - There is provided a bipolar layered type electric double layer capacitor capable of suppressing upsizing of the capacitor unit and enhancing sealability of adjacent capacitor cells. The present invention relates to a bipolar layered type electric double layer capacitor including a multi-layered type body comprising a plurality of capacitor cells 05-12-2011
20120162853MULTILAYER CAPACITOR - A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor 06-28-2012
20120127626MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding one of the plurality of dielectric layers and having uneven portions formed at an edge thereof, the internal electrode having a connectivity of between 0.7 and 0.9, which is defined by an equation below, and an external electrode formed on an outer surface of the ceramic body and connected with the internal electrode,05-24-2012
20120162854MULTILAYER CERAMIC CAPACITOR - The present invention relates to a multilayer ceramic capacitor which is superior in stability of temperature characteristic of specific permittivity and has a high specific permittivity and a high reliability. Said multilayer ceramic capacitor is characterized in that the dielectric layers include BTZ based dielectric ceramic composition, in which Ti is substituted by 1 to 8 mol % of Zr with respect to Ti, as a main component, dielectric particles constituting the BTZ based dielectric ceramic composition substantially do not have shell structures, and Curie temperature of the BTZ based dielectric ceramic composition is higher than a temperature range of the multilayer ceramic capacitor used.06-28-2012
20100208410NICKEL POWDER OR ALLOY POWDER HAVING NICKEL AS MAIN COMPONENT, METHOD FOR MANUFACTURING THE POWDER, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR - Provided is a multi-layered ceramic capacitor including an internal electrode, the surface of which is smoothened and in which electrode breakage can be reliably prevented. Also provided are a conductive paste and a nickel powder or an alloy powder containing nickel as a main component, which are used in the multi-layered ceramic capacitor, and a method for manufacturing the powder. The nickel powder or the alloy powder containing nickel as a main component of the present invention has a spherical shape, a mean particle diameter D08-19-2010
20120212877CAPACITOR STRUCTURE - The disclosure relates generally to capacitor structures and more particularly, to capacitor structures having interdigitated metal fingers. Metal finger capacitors may have at least one layer, the at least one layer including: a first set of fingers, wherein each finger of the first set includes an end integrally connected to a bus segment of a first bus; a second set of fingers interdigitated with the first set of fingers, wherein each finger of the second set includes an end integrally connected to a bus segment of a second bus; an in port integrally connected to the first bus and an out port integrally connected to the second bus; and wherein a width of the first and second bus is non-uniform across a length of the first and second bus.08-23-2012
20120162852DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.06-28-2012
20090059466METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A metal-insulator-metal (MIM) capacitor capable of achieving an enhancement in the reliability of a semiconductor device, and a method for manufacturing the same are disclosed. The disclosed MIM capacitor includes a metal-insulator-metal (MIM) capacitor which may include a first insulating film, a first metal layer formed over the first insulating film and a first capacitor insulating film formed over the first metal layer. A second metal layer may be formed over a portion of the first capacitor insulating film and second capacitor insulating film may be formed over the second metal layer. A third metal layer may be formed over a portion of the second capacitor insulating film and a nitride film may be formed over the third metal layer. A multilayer insulating film may be formed over the entire upper surface of the resulting structure. First and second metal lines may be formed in contact holes extending through the first capacitor insulating film, the second capacitor insulating film, and the nitride film after extending through the multilayer insulating film.03-05-2009
20120170169DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic which is suitable for use in a laminated ceramic capacitor under a high-temperature environment, such as encountered in, for example, automobile use has a composition represented by the composition formula: (1−x) (Ba07-05-2012
20120075768DIELECTRIC CERAMIC COMPOSITION AND MANUFACTURING METHOD THEREOF, AND CERAMIC ELECTRONIC DEVICE - Dielectric ceramic composition comprising a compound having perovskite-type crystal structure and Y-oxide, and the compound is shown by a general formula ABO03-29-2012
20100271751MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, in an exposed area defined by exposed portions of a plurality of internal conductors, an area ratio of exposed portions in an end section of the exposed area is smaller than that of exposed portions in a center section of the exposed area.10-28-2010
20120218677ELECTRODE SINTERED BODY, MULTILAYER ELECTRONIC DEVICE, INTERNAL ELECTRODE PASTE, A MANUFACTURING METHOD OF ELECTRODE SINTERED BODY AND A MANUFACTURING METHOD OF MULTILAYER ELECTRONIC DEVICE - An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.08-30-2012
20100002356MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a dummy electrode having a dummy body portion and an internal electrode having an extended portion, in which the conductor density of the dummy body portion is less than the conductor density of the extended portion of an internal electrode. With this configuration, the fixing strength of an external terminal electrode to a ceramic element assembly is improved, and undesirable deformation caused by a dummy conductor provided in a monolithic ceramic electronic component is prevented.01-07-2010
20120262837LAMINATED CAPACITOR - In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.10-18-2012
20120188681MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor element body, a first terminal electrode connected to a first inner electrode, a second terminal electrode connected to a second inner electrode, a third terminal electrode connected to a third inner electrode, and a fourth terminal electrode connected to a fourth inner electrode. The capacitor element body includes therewithin a first capacitor unit having first and second inner electrodes stacked adjacent to each other through a dielectric layer and a second capacitor unit having third and fourth inner electrodes stacked adjacent to each other through a dielectric layer. The first and second terminal electrodes have high resistance layers exhibiting electrical resistances higher than those of the third and fourth terminal electrodes.07-26-2012
20120262836CERAMIC CAPACITOR AND METHODS OF MANUFACTURE - A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates. Contrary to conventional techniques of separating electrodes by a dielectric tape, this inventive system and method demonstrates that a metalized dielectric layer may be formed in-situ during sintering.10-18-2012
20120081832Chip Capacitor Precursors - A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.04-05-2012
20120257324MULTILAYER CAPACITORS, METHOD FOR MAKING MULTILAYER CAPACITORS - The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.10-11-2012
20120257323CIRCUIT MODULE - A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction.10-11-2012
20120257322MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor having a large capacity and high reliability includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes and alternately disposed inside the ceramic sintered body to be opposed to each other in a stacking direction of the ceramic layers with one of the ceramic layers being interposed between the adjacent first and second inner electrodes. The ceramic sintered body includes a first portion in which the first and second inner electrodes are opposed to each other, and a second portion positioned outside the first portion. A ratio (Ic/Ia) of c-axis peak intensity (Ic) to a-axis peak intensity (Ia) measured with an XRD analysis of the one of the ceramic layers is about 2 or more.10-11-2012
20130170094MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L07-04-2013
20100328841WATER PURIFICATION DEVICE - Improved flow through capacitors (FTC) and methods for purifying aqueous solutions are disclosed. For example, FTC electrodes that are activated with a poly-electrolyte are disclosed.12-30-2010
20120320493MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes: a body part including internal electrodes and dielectric layers and having at least one connection surface to which a portion of the internal electrodes are exposed; external electrodes coupled to the connection surface to thereby be electrically connected to the internal electrodes; and protective layers provided on the connection surface so as to shield at least portions of the internal electrodes exposed at the connection surface, wherein a width of an exposed part of the internal electrode shielded by the protective layer has 0.8 to 0.9 of that of an overall width of the internal electrode.12-20-2012
20110019334MULTILAYER CERAMIC CAPACITOR - Disclosed is a multilayer ceramic capacitor which is formed by alternately laminating (i) dielectric layers composed of a dielectric ceramic and (ii) internal electrode layers. The dielectric ceramic is composed of crystal grains mainly composed of barium titanate, while containing predetermined amounts of magnesium, vanadium, manganese and terbium, and at least one rare earth element selected from yttrium, dysprosium, holmium and erbium. In an x-ray diffraction chart of the dielectric ceramic, the diffraction intensity of the (200) plane indicating cubic barium titanate is higher than the diffraction intensity of the (002) plane indicating tetragonal barium titanate. The dielectric ceramic has a Curie temperature of 110-120° C.01-27-2011
20120268859MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.10-25-2012
20120268860MULTILAYER CERAMIC CAPACITOR CAPABLE OF CONTROLLING EQUIVALENT SERIES RESISTANCE - There is provided a multilayer ceramic capacitor capable of controlling equivalent series resistance (ESR) characteristics. The multilayer ceramic capacitor includes: a ceramic laminate including dielectric layers and a plurality of internal electrodes having different polarities and alternately stacked between the dielectric layers; and external electrodes formed on both sides of the ceramic laminate, wherein each of the internal electrodes includes a main electrode and a lead for connecting the main electrode to the external electrode, and an equivalent series resistance (ESR) value is determined by adjusting a ratio of a width to a length of the lead, whereby the ESR characteristics of the multilayer ceramic capacitor may be controlled.10-25-2012
20110235233ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE - To provide electronic device and method for producing electronic device having high mechanical strength.09-29-2011
20120275080TAPERED VIA AND MIM CAPACITOR - A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit.11-01-2012
20120275081MULTI-LAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF - A multi-layered capacitor includes a capacitor element in which a plurality of dielectric layers are multi-layered, and which comprises a first inner electrode and a second inner electrode that are alternately formed on neighboring dielectric layers of the plurality of dielectric layers, a first external electrode and a second external electrode which are formed on an outside surface of the capacitor element to be electrically connected to the first inner electrode and the second inner electrode, respectively, and a deformation suppressing electrode which is formed on the outside surface of the capacitor element and separated from the first external electrode and the second external electrode to be electrically isolated from the first inner electrode and the second inner electrode.11-01-2012
20120327551ENERGY STORAGE DEVICE AND MANUFACTURING METHOD THEREOF, AND UNIT CELL FOR ENERGY STORAGE DEVICE - An energy storage device includes a plurality of unit cells stacked therein, each of the unit cells including a cell body, a positive terminal disposed at one side of the cell body, and a negative terminal disposed in the cell body to form a constant rotation angle with the positive terminal with reference to a center of the cell body, wherein the plurality of cell units are stacked in such a manner that another unit cell is rotated as much as the constant rotation angle with reference to one unit cell. Temperature distribution, that is, heat distribution in the energy storage device can be kept even, and heat transmission efficiency between the terminals and the external air can be improved and thus cooling efficiency can be improved. Also, a resistance value is reduced by improving a cooling function so that performance and reliability of a product can be improved.12-27-2012
20120287553METHOD FOR FABRICATING A DRAM CAPACITOR HAVING INCREASED THERMAL AND CHEMICAL STABILITY - A method for fabricating a dynamic random access memory (DRAM) capacitor includes forming a first electrode film. The first electrode film comprises a conductive binary metal compound and a dopant. The dopant may have a uniform or non-uniform concentration within the first electrode film. A high-k dielectric film is formed over the first electrode film. A second electrode film is formed over the dielectric film. The second electrode film comprises a conductive binary metal compound and a dopant. The dopant may have a uniform or non-uniform concentration within the second electrode film. The dopants and their distribution are chosen so that the crystal structure of the surface of the electrode is not degraded if the electrode is to be used as a templating structure for subsequent layer formation. Additionally, the dopants and their distribution are chosen so that the work function of the electrodes is not degraded.11-15-2012
20120140376Manufacturing Method For Laminated Ceramic Capacitor, and Laminated Ceramic Capacitor - A method of manufacturing a laminated body in a raw state for a laminated ceramic capacitor, which includes dielectric ceramic layers containing a dielectric ceramic raw material powder for and internal electrodes, in which a heat treatment is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO06-07-2012
20120140375CONDUCTIVE PASTE FOR INNER ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING THE SAME - Disclosed are a conductive paste for an inner electrode and a multilayer ceramic electronic component having the same. There is provided a conductive paste for an inner electrode, including: a conductive metal powder for manufacturing the inner electrode for multilayer ceramic electronic component; an organic binder including at least one selected from a group consisting of acryl-based resin, butyral-based resin, and a cellulose-based resin to disperse the conductive metal powder; and a solvent including eucalyptol.06-07-2012
20100134950CAPACITOR - A capacitor includes a substrate, a plurality of first storage electrodes, a plurality of second storage electrodes, a first supporting layer pattern, a dielectric layer and a plate electrode. A plurality of contact pads is formed I the substrate. The first storage electrodes are arranged along lines parallel with a first direction and electrically connected to the contact pads, respectively. The second storage electrodes are respectively stacked on the first storage electrodes. The first supporting layer pattern extends in a direction parallel with the first direction between adjacent second storage electrodes and makes contact with the adjacent second storage electrodes to support the second storage electrodes. The dielectric layer is formed on the first and second storage electrodes. The plate electrode is formed on the dielectric layer.06-03-2010
20100091425ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides an electronic component which can reduce the size of a capacitor and the number of constitutional parts of the capacitor without using a case. The electronic component of the present invention includes a capacitor element, an outer package made of a norbornene resin covering the capacitor element, and external connection terminal portions electrically connected to the capacitor element and protruded from the outer package.04-15-2010
20080239617MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT - A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.10-02-2008
20100085681DIELECTRIC CERAMIC COMPOSITION AND LAMINATED CERAMIC CAPACITOR - There is provided a dielectric ceramic composition that is a dielectric ceramic material used for a laminated ceramic capacitor; that can be co-fired with internal electrodes mainly composed of Ni at a temperature of 1300° C. or less; and that has a high dielectric constant, good temperature characteristics of capacitance in a range of −55 to 175° C., and a high resistivity ρ at 175° C. The dielectric ceramic composition includes a main component represented by a composition formula (1−a) (K04-08-2010
20080218935Ultra Low Temperature Fixed X7R And BX Dielectric Ceramic Composition And Method Of Making - Multilayer ceramic chip capacitors which satisfy X7R and BX requirements and which are compatible with silver-palladium internal electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a lead-free and cadmium-free barium titanate base material doped with other metal oxides such oxides of zinc, boron, bismuth, cerium, tungsten, copper, manganese, neodymium, niobium, silver, barium, silicon and nickel in various combinations. The dielectric ceramic materials herein can be sintered together (fired) at less than 1000° C. with an inner electrode having more than 80 wt % Ag and less than 20 wt % Pd to form a multilayer ceramic capacitor (MLCC).09-11-2008
20130094119MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA04-18-2013
20130094118MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein when a region in which the internal electrodes are overlapped is defined as an active region in a cross section of a central portion in a length direction of the ceramic body, taken in width and thickness directions thereof, the entire area of the cross section taken in the width and thickness directions is defined as At, and an area of the active region is defined as Aa, the following equation is satisfied: 65%≦Aa/At≦90%.04-18-2013
20130100576MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers.04-25-2013
20130120899MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm.05-16-2013
20130120898MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.05-16-2013
20130148257METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties.06-13-2013
20130182371CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided are a capacitor and a method of manufacturing the same. A first capacitor unit and a second capacitor unit are alternately stacked to three layers or more to form a stacked body, collector lead parts of the first capacitor units are connected to contact each other, collector lead parts of the second capacitor units are connected to contact each other, and the collector lead parts of the stacked body are stacked such that side surfaces thereof form a stepped shape.07-18-2013
20130182367METHOD FOR FORMING RUTILE TITANIUM OXIDE AND THE STACKING STRUCTURE THEREOF - A method for forming a stacking structure, including forming a ruthenium oxide layer over a substrate; forming a praseodymium oxide layer over the ruthenium oxide layer; and forming a titanium oxide layer over the praseodymium oxide layer; wherein the titanium oxide layer has a rutile phase with the existence of the praseodymium oxide layer underneath. The oxide layers are deposited by a plurality of atomic layer deposition cycles using ruthenium precursor, praseodymium precursor, titanium precursor, and ozone.07-18-2013
20130182368MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T07-18-2013
20130182369MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T07-18-2013
20130182370CAPACITOR - A capacitor includes an anode made of metal, a first dielectric layer formed on a surface of the anode, a cathode made of metal, and a second dielectric layer formed on a surface of the cathode. The first dielectric layer contains an oxide of the metal forming the anode. The second dielectric layer contains an oxide of the metal forming the cathode. The anode and the cathode are stacked such that the first and second dielectric layers face each other.07-18-2013
20110310526CAPACITORS WITH HIGH ENERGY STORAGE DENSITY AND LOW ESR - Electrostatic capacitors with high capacitance density and high-energy storage are implemented over conventional electrolytic capacitor anode substrates using highly conformal contact layers deposited by atomic layer deposition. Capacitor films that are suitable for energy storage, electrical and electronics circuits, and for integration onto PC boards endure long lifetime and high-temperature operation range.12-22-2011
20130188292CERAMIC COMPOSITION AND A LAMINATED CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME THEREOF - [Problems] To provide a ceramic composition that retains a high insulation resistance after being fired in a reductive atmosphere to form a laminated body.07-25-2013
20120014034HIGH POWER DENSITY CAPACITOR AND METHOD OF FABRICATION - A ductile preform for making a drawn capacitor includes a plurality of electrically insulating, ductile insulator plates and a plurality of electrically conductive, ductile capacitor plates. Each insulator plate is stacked vertically on a respective capacitor plate and each capacitor plate is stacked on a corresponding insulator plate in alignment with only one edge so that other edges are not in alignment and so that each insulator plate extends beyond the other edges. One or more electrically insulating, ductile spacers are disposed in horizontal alignment with each capacitor plate along the other edges and the pattern is repeated so that alternating capacitor plates are stacked on alternating opposite edges of the insulator plates. A final insulator plate is positioned at an extremity of the preform. The preform may then be drawn to fuse the components and decrease the dimensions of the preform that are perpendicular to the direction of the draw.01-19-2012
20120019978CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thickness direction. The volume proportion of the plurality of first reinforcement layers in a region of the ceramic body in which the plurality of first reinforcement layers are provided is greater than the volume proportion of the first and second internal electrodes in an effective portion.01-26-2012
20130194716SOLID STATE ENERGY STORAGE DEVICES - Described in this patent application are devices for energy storage and methods of making and using such devices. In various embodiments, blocking layers are provided between dielectric material and the electrodes of an energy storage device. The block layers are characterized by higher dielectric constant than the dielectric material. There are other embodiments as well.08-01-2013
20130194715MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D08-01-2013
20130194717DIELECTRIC CERAMIC, STACK CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THESE - A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba08-01-2013
20130194718LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor having excellent lifetime characteristics in a high-temperature loading test. It includes a laminated body including a plurality of stacked dielectric layers including crystal grain and crystal grain boundaries, and a plurality of internal electrodes and external electrodes. The laminated body contains, as its main constituent, a perovskite-type compound containing Ba and Ti and optionally Ca, and further contains a rare-earth element R, and Mn, Mg, V, and Si With respect to 100 parts by mol the Ti, the total parts by mol content (100×m) of Ba and Ca is 0.950≦m<1.000, the contents in terms of parts by mol is 0.3≦R≦2.5, 0.05≦Mn≦0.5, 0.5≦Mg≦2.0, 0.05≦V≦0.25, 0.5≦Si≦3.0, and further, the molar ratio x of Ca/(Ba+Ca) is 0≦x≦0.01, and the existence of the rare-earth element R in a position of 4 nm inner from a surface of the crystal grain is 20% or more.08-01-2013
20130201600CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.08-08-2013
20130201602LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor includes multiple dielectric layers, internal electrodes having Cu as the primary component and embedded between the dielectric layers, and external electrodes. The dielectric layers contain a primary component comprised of a CaZrO08-08-2013
20130201601CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.08-08-2013
20120075767Method for Producing a Metal-Insulator-Metal Capacitor for Use in Semiconductor Devices - Methods of manufacturing metal-insulator-metal capacitor structures, and the metal-insulator-metal capacitor structures obtained, are disclosed. In one embodiment, a method includes providing a substrate, forming on the substrate a first metal layer comprising a first metal, and using atomic layer deposition with an H03-29-2012
20120075766MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.03-29-2012
20130208399LAMINATED CERAMIC ELECTRONIC COMPONENT - In a laminated ceramic capacitor, a cylindrical ceramic part of its ceramics includes, in a manner not exposed to the surface of the ceramics, a cylinder-shaped high-void-ratio part which has a void ratio higher than the void ratio in the cylindrical ceramic part other than the hjigh-void-ratio part and which has two layered parts facing the left and right sides of each layered conductor, respectively, as well as two layered parts facing the outer surfaces of the two outermost layered conductors, respectively. The laminated ceramic electronic component inhibits cracking of its sintered chip.08-15-2013
20130208398METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR - A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces.08-15-2013

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