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On patterned or topographical surface (e.g., wafer, mask, circuit board)

Subclass of:

356 - Optics: measuring and testing

356237100 - INSPECTION OF FLAWS OR IMPURITIES

356237200 - Surface condition

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DocumentTitleDate
20080259327Device for Inspecting a Microscopic Component10-23-2008
20100085561LASER SCATTERING DEFECT INSPECTION SYSTEM AND LASER SCATTERING DEFECT INSPECTION METHOD - A laser scattering defect inspection system includes: a stage unit that rotates a workpiece W and transports the workpiece W in one direction; a laser light source that emits a laser beam LB toward the workpiece W mounted on the stage unit; an optical deflector that scans the laser beam LB emitted from the laser light source on the workpiece W; an optical detector that detects the laser beam LB scattered from the surface of the workpiece W; a storage unit that stores defect inspection conditions for each inspection step of a manufacturing process of the workpiece W, where the conditions include the rotation speed and the moving speed of the workpiece W by the stage unit, the scan width on the workpiece W and the scan frequency by the optical deflector; and a control unit that reads the defect inspection conditions stored for each inspection step in the storage unit and controls the driving of the stage unit and the optical deflector under the conditions.04-08-2010
20130077092SUBSTRATE SURFACE DEFECT INSPECTION METHOD AND INSPECTION DEVICE - A substrate surface inspection device includes an inspection optical system irradiating at least one light onto a substrate, which is an inspection target and carried on a turnable stage, and having at least one detector detecting reflected or scattered light from the substrate, a detector processing the signals, which are outputted from the at least one detector and A/D converted, and detecting a defect on the substrate, an output calculator performing scattered light simulation on a defect detection model and estimating a plurality of detector outputs; and a classifier constructor constructing a classifier by mechanical learning of a rule base, wherein the classifier constructor is adapted to present collection of a necessary actual defect sample on the basis of the classifier obtained by scattered light simulation, and construct the classifier under necessary and sufficient conditions.03-28-2013
20090122306Solder Material Inspecting Device - Before an electronic component is mounted on a board 05-14-2009
20130038866AIR FLOW MANAGEMENT IN A SYSTEM WITH HIGH SPEED SPINNING CHUCK - The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.02-14-2013
20130033705INSPECTION DEVICE AND INSPECTION METHOD - An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.02-07-2013
20100007875Field Replaceable Units (FRUs) Optimized for Integrated Metrology (IM) - An Integrated Metrology Sensor (IMS) including a plurality of Field Replaceable Units (FRUs) for measuring a target on a wafer. The FRU configurations can be optimized to include the appropriate elements, so that each FRU can be pre-aligned and calibrated in the factory to minimize the time need to swap the FRU in the field due to failure or scheduled maintenance. The FRU configuration of the IMS is optimized to shorten the time to repair a failure or perform scheduled maintenance and increase the system reliability.01-14-2010
20090033925VISUAL INSPECTION APPARATUS FOR FLEXIBLE PRINTED CIRCUIT BOARDS - An exemplary visual inspection apparatus for a flexible printed circuit board includes a frame, an inspection station, a control system, a roller system and a power system. The inspection station is disposed on the frame. The inspection station has an inspection surface for placing the flexible printed circuit board thereon for visual inspection. The roller system includes a first roller for unwinding a flexible printed circuit board therefrom and a second roller for winding up the flexible printed circuit board therearound. The power system includes a driving device and a braking device. The driving device includes a torque motor engaging with the second roller to drive the second roller to roll. The braking device includes a detent engaging with the first roller to stop rolling of the first roller. The control system electrically connects to the power system for controlling the power system.02-05-2009
20090161097Method for optical inspection, detection and visualization of defects on disk-shaped Objects - A method for optical inspection, detection and visualization of defects (06-25-2009
20130083319SEMICONDUCTOR INSPECTION METHOD AND SEMICONDUCTOR INSPECTION APPARATUS - A semiconductor inspection apparatus (04-04-2013
20130083318PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD - A pattern inspection apparatus in accordance with one aspect of the present invention includes a laser light source configured to emit a laser light, an integrator lens configured to input the laser light, and form a light source group by dividing the laser light inputted, a scattering plate, arranged at a front side of an incident surface of the integrator lens, configured to scatter the laser light which is to enter the integrator lens, and an inspection unit configured to inspect a defect of a pattern on an inspection target object where a plurality of figure patterns are formed, by using the laser light having passed through the integrator lens as an illumination light.04-04-2013
20130083320High Throughput Thin Film Characterization And Defect Detection - Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical dispersion metrics are determined based on the spectral data. Band structure characteristics such as band gap, band edge, and defects are determined based on optical dispersion metric values. In some embodiments a band structure characteristic is determined by curve fitting and interpolation of dispersion metric values. In some other embodiments, band structure characteristics are determined by regression of a selected dispersion model. In some examples, band structure characteristics indicative of band broadening of high-k dielectric films are also determined. The electrical performance of finished wafers is estimated based on the band structure characteristics identified early in the manufacturing process.04-04-2013
20130088714SUCTION APPARATUS, SEMICONDUCTOR DEVICE OBSERVATION DEVICE, AND SEMICONDUCTOR DEVICE OBSERVATION METHOD - A suction unit 04-11-2013
20090040514Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection tool - A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.02-12-2009
20090040513PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD - A pattern inspection apparatus includes a light source configured to emit a pulsed light, a stage on which an inspection target workpiece is placed, a sensor, including a plurality of light receiving elements two-dimensionally arrayed, configured to capture a pattern image in a two-dimensional region of the inspection target workpiece which is irradiated with the pulsed light, by using the plurality of light receiving elements, and a comparing unit configured to compare data of the pattern image with predetermined reference pattern image data, wherein the stage moves to be shifted by a number of pixels, being the number of natural number times one pixel, between pulses of the pulsed light.02-12-2009
20090091752APPARATUS AND A METHOD FOR INSPECTION OF A MASK BLANK, A METHOD FOR MANUFACTURING A REFLECTIVE EXPOSURE MASK, A METHOD FOR REFLECTIVE EXPOSURE, AND A METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUITS - The mask blank inspection apparatus is constituted of a stage for mounting a reflective mask blank thereon, a light source for generating inspection light, a mirror serving as an illuminating optics, an imaging optical system, a beam splitter, two two-dimensional array sensors, signal storage units, an image processing unit, a main control unit for controlling operation of the whole apparatus, the first sensor being located at a position which is displaced by a predetermined distance from the focal plane of a first light beam, the second sensor being located at a position which is displaced by a predetermined distance from the focal plane of a second light beam along a opposite direction, whereby accurately and conveniently inspecting presence/absence and types of defects in reflective mask blank.04-09-2009
20090323053Optical Inspection Tools Featuring Light Shaping Diffusers - An optical inspection system or tool can be configured to adjust the distribution of light by using one or more diffusers. The diffusers can be variable in some embodiments. For example, the angular or spatial distribution of the illumination can be adjusted to minimize intensity of illumination outside of an imaged area to thereby reduce illumination loss. The angular or spatial distribution may additionally or alternatively be adjusted so that the illumination across an illuminated area is substantially uniform. The use of one or more diffusers may aid in the inspection of semiconductor objects including, but not limited to, semiconductor wafers and the like.12-31-2009
20130057855PASSIVE POSITION COMPENSATION OF A SPINDLE, STAGE, OR COMPONENT EXPOSED TO A HEAT LOAD - Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.03-07-2013
20120224173INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.09-06-2012
20100265496APPARATUS AND METHOD FOR INSPECTING DEFECTS - A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.10-21-2010
20090046281Method and System for Automated Inspection System Characterization and Monitoring - A method and system characterizing and monitoring an automated inspection system are provided. A method for automatically characterizing an automatic inspection system for photomasks may include removing portions of an optical attenuator layer disposed on a substrate in order to expose portions of the substrate and create a plurality of test features. The may further include forming a plurality of programmed defects, on the optical attenuator layer, the plurality of programmed defects comprising at least one of an optical reflector and an optical absorber.02-19-2009
20090009755METHOD FOR DETECTING POSITION OF DEFECT ON SEMICONDUCTOR WAFER - A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect.01-08-2009
20120113416OPTICAL DEFECT AMPLIFICATION FOR IMPROVED SENSITIVITY ON PATTERNED LAYERS - A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer.05-10-2012
20090009754SYSTEMS AND METHODS FOR INSPECTING A WAFER WITH INCREASED SENSITIVITY - One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.01-08-2009
20100171947PATTERN INSPECTION DEVICE AND METHOD - A pattern inspection device has a light irradiator configured to irradiate a light on an inspection area set in a pattern forming location on a semiconductor wafer and an adjustment area set different from the inspection area in association with the inspection area on the semiconductor wafer, an image pickup part for inspection configured to pick up a light which is irradiated by the light irradiator and reflected on the inspection area to generate an inspection image, a tester configured to conduct a pattern inspection of the semiconductor wafer based on the inspection image, an image pickup part for adjustment configured to pick up a light which is irradiated by the light irradiator and reflected on the adjustment area to generate an adjustment image, and a light amount adjuster configured to adjust an amount of the light irradiated on the inspection area by the light irradiator so as to reduce a fluctuation of a luminance of the inspection image due to a difference of a thickness of the pattern based on the adjustment image.07-08-2010
20100201976WAFER SURFACE MEASURING APPARATUS - A wafer surface measuring apparatus which measures a surface of the wafer by irradiating a laser beam on a wafer comprising a measuring stage that supports the outer edge of the wafer and loads the wafer in a manner not contacting the rear surface of the wafer and the stage surface, a wafer carrying means that moves the wafer over the measuring stage and loads the wafer on the measuring stage from an upward side, a rotary drive unit which rotates the measuring stage, and an ejection hole formed at a center portion of the stage surface to supply gas to a rear surface of the wafer loaded on the measuring stage. The wafer carrying means includes a chuck which sucks and holds the surface of the wafer in a non-contact manner and bends the wafer in an upwardly convex shape.08-12-2010
20120099101Gantry Apparatus - A gantry apparatus includes a structure to couple and support an optical system has enhanced rigidity, which minimizes deformation of the structure even if a plurality of optical systems is coupled to the structure. The gantry apparatus includes an optical system, a drive device to drive the optical system, and a structure to couple and support the drive device. The structure includes a plurality of first plates arranged parallel to one another, and a plurality of second plates intersecting the plurality of first plates to define receptive corridors, each of which receives the drive device.04-26-2012
20110285989INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.11-24-2011
20110285988ADVANCED INSPECTION METHOD UTILIZING SHORT PULSES LED ILLUMINATION - An illumination module that may include a LED driver; a strip cable comprising multiple conductors that have a high ratio form factor and a low impedance and a low inductance factor; the forms factor is a ratio between a width of the strip cable and a thickness of the strip cable; a group of light emitting diodes (LEDs) that comprises at least one LED; the group of LED is coupled to the LED driver via the strip cable; wherein the LED driver is arranged to activate the group of LEDs by driving a high current short duration driving signal via the strip cable; and wherein the group of LEDs is arranged to emit at least one light pulse in response to the high current short duration driving signal.11-24-2011
20080212084EDGE INSPECTION - A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.09-04-2008
20100060890APPARATUS AND METHOD FOR PATTERN INSPECTION - A pattern inspection apparatus includes a pulsed light source configured to emit pulsed light; a stage configured to mount thereon an inspection target object with a pattern formed thereon; a time delay integration (TDI) sensor configured to detect, a plurality of times with a time delay, each pixel value of an optical image of the inspection target object, wherein the optical image is acquired by emitting the pulsed light onto the inspection target object, and to integrate a detected each pixel value for each pixel of the optical image; a light quantity sensor configured to detect a light quantity of the pulsed light after emitting the pulsed light onto the inspection target object; a light quantity measurement circuit configured to input the light quantity detected by the light quantity sensor, and to measure a light quantity of each pulse while being synchronized with a period of the pulsed light; a correction unit configured to input the light quantity of each pulse and an integrated pixel value output from the TDI sensor, and to correct the integrated pixel value output from the TDI sensor, for each pixel of the optical image, using a total light quantity of the light quantity of corresponding each pulse; and an inspection unit configured to inspect whether there is a defect of the pattern, using the integrated pixel value corrected.03-11-2010
20090135414APPARATUS AND METHOD FOR TESTING IMAGE SENSOR WAFERS TO IDENTIFY PIXEL DEFECTS - An image sensor testing apparatus is disclosed. The image sensor testing apparatus includes an electronic test system having a light source for illuminating an image sensor wafer to generate pixel data and a host processor for receiving the pixel data. An interface card coupled to the electronic test system has a programmable processor for processing the pixel data to generate processed data, the processed data transmitted to and analyzed by the host processor together with the pixel data to detect pixel defects in the image sensor wafer.05-28-2009
20100079748Inspection Apparatus, Lithographic Apparatus and Method for Sphero-Chromatic Aberration Correction - A semiconductor inspection system and method are described. The system includes an illumination system transmitting light at a given wavelength and an optical system receiving light from the illumination system and transmit light at the given wavelength to a surface. The optical system includes at least one lens that is moveable (for example, a zoomable lens) to change the nominal wavelength of the semiconductor inspection system to correspond to the illumination wavelength of the illumination system so that the sphero-chromatic aberration of the semiconductor inspection system meets a user-defined tolerance.04-01-2010
20100033716Optical inspection of a specimen using multi-channel responses from the specimen - A method and inspection system to inspect a first pattern on a specimen for defects against a second pattern that is intended to be the same where the second pattern has known responses to at least one probe. The inspection is performed by applying at least one probe to a point of the first pattern on the specimen to generate at least two responses from the specimen. Then the first and second responses are detected from the first pattern, and each of those responses is then compared with the corresponding response from the same point of the second pattern to develop first and second response difference signals. Those first and second response difference signals are then processed together to unilaterally determine a first pattern defect list.02-11-2010
20110170091INSPECTION GUIDED OVERLAY METROLOGY - Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.07-14-2011
20110170092APPARATUS AND METHOD FOR INSPECTING PATTERN - A method and apparatus for inspecting defects includes emitting an ultraviolet light from an ultraviolet light source, illuminating a specimen with the ultraviolet light in which a polarization condition of the ultraviolet light is controlled, controlling a polarization condition of light reflected from the specimen which is illuminated by the polarization condition controlled ultraviolet light, detecting the light reflected from the specimen, processing the detected light so as to detect defects, and outputting information about the defects. The ultraviolet light source is disposed in a clean environment supplied with clean gas and separated from outside.07-14-2011
20090147250SEMICONDUCTOR WAFER SURFACE INSPECTION APPARATUS - The present invention provides an apparatus for inspecting the surface of a semiconductor wafer having a mirror surface and a chamfered outer circumferential portion by holding the outer circumferential portion of the semiconductor wafer, keeping the semiconductor held in the vertical direction and moving an inspection microscope lens toward the surface of the semiconductor wafer. The apparatus includes a wafer holding member holding the semiconductor wafer and including two or more contact portions that contact the outer circumferential portion of the semiconductor wafer. The contact portions include: a front surface contact portion that contacts a front-surface-side position of a chamfered portion of the semiconductor wafer; and a rear surface contact portion that contacts a rear-surface-side position of the chamfered portion of the semiconductor wafer at the same position as that where the front surface contact portion is arranged in the circumferential direction of the semiconductor wafer.06-11-2009
20090279081DEFECT INSPECTION APPARATUS - A defect inspection apparatus for inspecting a surface of a sample includes a stage for holding the sample, an illumination optical system that irradiates a laser beam to form a linear illuminated area on the surface of the sample, a detection optical system, and a signal processing system. The detection optical system includes a detector device having a plurality of pixels for detecting light scattered from the linear illuminated area of the surface of the sample, and that outputs in parallel a plurality of detection signals having mutually different sensitivities acquired from the plurality of pixels of the detector device. The signal processing system selects an unsaturated detection signal from the plurality of detection signals and detects a defect in accordance with the selected detection signal.11-12-2009
20090296082Circuit board detecting device and method thereof - A circuit board detecting device and a detecting method are provided. The circuit board detecting device includes an image capture apparatus and a main unit. The image capture apparatus is coupled to the main unit to capture images of the surfaces of a sample circuit board and a test circuit board. In addition, the main unit is used to receive a sample frame and a test frame and compare the images of every object on the sample frame with the images of every object on the test frame to confirm if the test circuit board has flaws on the surface.12-03-2009
20120293794METHOD AND APPARATUS FOR OPTICAL INSPECTION, DETECTION AND ANALYSIS OF DOUBLE SIDED AND WAFER EDGE MACRO DEFECTS - Method and apparatus for detection and characterization of defects, and working order assessment of fab processing operation.11-22-2012
20120293795DEFECT INSPECTION DEVICE AND METHOD OF INSPECTING DEFECT - Disclosed is a defect inspection device comprising: an illumination optical portion which illuminates an object to be inspected with illuminating light; a detection optical portion system illuminated by the illumination optical portion and provided with a plurality of detectors which respectively detects components of scattering light which scatter from the inspected object each in a different direction of azimuthal angle or in a different direction of angle of elevation with respect to a surface of the inspected object; and a signal processing portion which makes gain adjustments and defect decisions in parallel on plural signals based on the components of the scattering light from the inspected object detected by the detectors, respectively, the defect decisions being based on a threshold value decision, and which extracts defects based on results of the gain adjustments and of the defect decisions.11-22-2012
20100060888COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER - Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.03-11-2010
20100060891SEMICONDUCTOR WAFER INSPECTION METHOD - A semiconductor wafer inspection method includes: an imaging step in which a first image being an image of the chamfered surface seen from the main surface side and a second image being an image of the chamfered surface seen from the back surface side are taken; a calculation step in which a first width is obtained based on the first image, the first width being a width of the chamfered surface seen from the main surface side, a second width is obtained based on the second image, the second width being a width of the chamfered surface seen from the back surface side, and a ratio of the first width to the second width thus obtained is calculated; and a shape determination step in which a form of the chamfered surface is determined to be abnormal in a case where the ratio is out of a predetermined range.03-11-2010
20100060889SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD - A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.03-11-2010
20080239302Inspecting apparatus for glass substrate - An inspecting apparatus for a glass substrate detects blurs of a green color filter layer, a blue color filter layer, a column spacer layer, a pixel layer of a thin film transistor, or the like, which are generally hardly inspected. The inspecting apparatus for a glass substrate includes: a first illumination unit supplying reflective light to a surface of the substrate to inspect whether the surface of the substrate is defective or not; a second illumination unit supplying transmissive light from a rear side of the substrate to inspect whether the interior of the substrate is defective or not; a latticed rear plate provided on a rear surface of the substrate; and a driving interferometer system generating a phase difference of light by driving such that a driving guide is moved along the rear plate or the rear plate itself is moved.10-02-2008
20110141463DEFECT INSPECTION METHOD, AND DEFECT INSPECTION DEVICE - Provided are a defect inspection device and a defect inspecting method, which enlarge the uptake range of a light scattered from a fine defect thereby to heighten signal intensity. The defect inspection device is provided with: a stage unit (06-16-2011
20110141462WAFER INSPECTION SYSTEM - Apparatus for inspecting a surface, including a plurality of pump sources having respective pump optical output ends and providing respective pump beams through the pump optical output ends, and a plurality of probe sources having respective probe optical output ends and providing respective probe beams through the probe optical output ends. There is an alignment mounting which holds the respective pump optical output ends and probe optical output ends in equal respective effective spatial offsets, and optics which convey the respective pump beams and probe beams to the surface, so as to generate returning radiation from a plurality of respective locations thereon, and which convey the returning radiation from the respective locations. The apparatus includes a receiving unit which is adapted to receive the returning radiation and which is adapted to determine a characteristic of the respective locations in response thereto.06-16-2011
20080231846LEVEL DETECTION APPARATUS - A level detection apparatus includes an illumination slit in which a rectangular first opening which causes illumination light to pass is formed, an optical system configured to illuminate a target object surface by illumination light passing through the illumination slit and focuses reflected light from the target object surface, first and second detection slits which are arranged in front of and in back of a focal point and in each of which a second opening is formed such that a short side of a rectangle is shorter than a short side of a illumination slit image formed by the illumination slit and a long side of the rectangle is larger than a long side of the illumination slit image, first and second light amount sensors configured to detect amounts of light of the reflected lights passing through the first and second detection slits, and a calculating unit configured to calculate a level of the target object surface based on outputs from the first and second light amount sensors.09-25-2008
20080273196Confocal wafer inspection system and method - A semiconductor wafer inspection system and method is provided which uses a multiple element arrangement, such as an offset fly lens array. The preferred embodiment uses a laser to transmit light energy toward a beam expander, which expands the light energy to create an illumination field. An offset fly lens array converts light energy from the illumination field into an offset pattern of illumination spots. A lensing arrangement, including a first lens, a transmitter/reflector, an objective, and a Mag tube imparts light energy onto the specimen and passes the light energy toward a pinhole mask. The pinhole mask is mechanically aligned with the offset fly lens array. Light energy passing through each pinhole in the pinhole mask is directed toward a relay lens, which guides light energy onto a sensor. The offset fly lens array corresponds to the pinhole mask. The offset pattern of the offset fly lens array is chosen such that spots produced can be recombined into a continuous image, and the system utilizes a time delay and integration charge coupled device for rapid sensing along with an autofocus system that measures and cancels topological features of the specimen.11-06-2008
20080291437 METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF - A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.11-27-2008
20080304057SYSTEM AND METHOD FOR CONTROLLING LIGHT SCATTERED FROM A WORKPIECE SURFACE IN A SURFACE INSPECTION SYSTEM - In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a scattered radiation collecting assembly that collects radiation scattered from the surface. The radiation targeting assembly generates primary and secondary beams. Data collected from the reflections of the primary and secondary beams may be used in a dynamic range extension routine, alone or in combination with a power attenuation routine.12-11-2008
20080304058Coordinate measuring machine and method for structured illumination of substrates - A coordinate measuring machine (12-11-2008
20080304056METHODS FOR DETECTING AND CLASSIFYING DEFECTS ON A RETICLE - Methods for detecting and classifying defects on a reticle are provided. One method includes acquiring images of the reticle at first and second conditions during inspection of the reticle. The first condition is different than the second condition. The method also includes detecting the defects on the reticle using one or more of the images acquired at the first condition. In addition, the method includes classifying an importance of the defects detected on the reticle using one or more of the images acquired at the second condition. The detecting and classifying steps are performed substantially simultaneously during the inspection.12-11-2008
20080304055SURFACE DEFECT INSPECTION METHOD AND APPARATUS - A surface defect inspection apparatus is structured to add detection signals of multi-directionally detected scattered lights to detect a tiny defect and to individually process the respective detection signals to prevent an error failing to detect an anisotropic defect.12-11-2008
20080259326Die Column Registration - A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.10-23-2008
20080285023Optical inspection of a specimen using multi-channel responses from the specimen - A method and inspection system to inspect a first pattern on a specimen for defects against a second pattern that is intended to be the same where the second pattern has known responses to at least one probe. The inspection is performed by applying at least one probe to a point of the first pattern on the specimen to generate at least two responses from the specimen. Then the first and second responses are detected from the first pattern, and each of those responses is then compared with the corresponding response from the same point of the second pattern to develop first and second response difference signals. Those first and second response difference signals are then processed together to unilaterally determine a first pattern defect list.11-20-2008
20090161098PHOTOMASK MOUNTING/HOUSING DEVICE AND RESIST INSPECTION METHOD AND RESIST INSPECTION APPARATUS USING SAME - A resist inspection apparatus is provided which has a configuration in which a reticle is separated from a pellicle. A reticle cassette is made up of two pieces of plate members. A hollowed portion with a shape allowing the reticle to be inserted into the plate member. Another hollowed portion having a shape being slightly larger than that of the resist of the reticle is formed on the plate member. In the circumference of the hollowed portion is placed a pellicle frame on which a protective film is formed in a stretched manner. In the concave portion is housed in the reticle with a resist on the reticle directed toward the hollowed portion. The reticle is put in sealed space.06-25-2009
20100141937APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE - An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.06-10-2010
20090027664Defect inspection apparatus and its method - In a defect inspection apparatus for performing an inspection with an optical system, the dimension of a defect is measured substantially concurrently with detection of the defect. In order to promote the accuracy of measurement of the defect dimension, a collation unit is provided which collates the defect dimension by using a standard sample such as a standard grain.01-29-2009
20120069330METHOD AND APPARATUS FOR INSPECTING SUBSTRATES - A method and an apparatus for inspecting a substrate are provided. The method includes irradiating light to a semiconductor device formed on a substrate and detecting light reflected from the semiconductor device in order to inspect a defect of the semiconductor device. An irradiation position of the light may gradually move from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate. at least one semiconductor device formed on a substrate, a light irradiating member which irradiates light onto the semiconductor surface formed on the substrate; a light detecting member which detects light reflected from the semiconductor device in order to inspect the semiconductor device for defects; and an irradiation position of the light gradually moves from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate.03-22-2012
20090185178SURFACE INSPECTION TOOL AND SURFACE INSPECTION METHOD - An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 07-23-2009
20090251691Liquid Immersion Microscope - To provide a liquid immersion microscope device enabling nondestructive liquid immersion observation of a substrate without deteriorating quality of the substrate. To attain this, a liquid immersion microscope device of the present invention includes a supporting unit supporting a substrate as an observation target, an objective lens of a liquid immersion type, a first supplying unit supplying ultrapure water as a liquid for observation to a gap between a tip of the objective lens and the substrate, a first draining unit draining the liquid for observation after observation of the substrate, a second supplying unit supplying a liquid for cleaning, which is different from the liquid for observation drained by the first draining unit, to an area, of the substrate, that has been in contact with the liquid for observation, and a second draining unit draining the liquid for cleaning after the substrate is cleaned.10-08-2009
20090244531OPTICAL APPARATUS, PHOTOMASK INSPECTING APPARATUS, AND EXPOSURE APPARATUS - An optical apparatus includes a laser light source for emitting a beam of light, an integrator for dividing the beam of light into plural beams of light, and a light focusing optical system for focusing the beams of light passed through the integrator. The optical apparatus also includes a stage, on which the light concentrated by the light focusing optical system is irradiated and on which an object may be placed, and includes a projecting optical system for projecting the light transmitted through the object. The following conditions satisfy the following numerical formula (1). The projecting optical system has a visual field including an effective visual field, and the integrator has a division number N corresponding to a predetermined direction in a predetermined effective visual field. A ghost image is formed in the effective visual field in the predetermined direction and has contrast γ. The light focusing optical system has numerical aperture NA10-01-2009
20090079974METHODS AND SYSTEMS FOR LITHOGRAPHY PROCESS CONTROL - Methods and systems for evaluating and controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a wafer during the lithography process. A critical metric of a lithography process may include, but may not be limited to, a critical dimension of a feature formed during the lithography process. The method may also include altering at least one parameter of a process module configured to perform a step of the lithography process to reduce within wafer variation of the critical metric. The parameter of the process module may be altered in response to at least the one measured property of the resist.03-26-2009
20090213365Device and method for checking and rotating electronic components - The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.08-27-2009
20080316475Defect inspection apparatus and defect inspection method - An apparatus and a method for defect inspection enables a reduction in the amount of noise light from an underlying layer and a good defect inspection reliably. The apparatus includes an illumination device that irradiates, with illumination light, a substrate to be inspected including a resist layer having cyclic patterns formed on the upper layer, and an optical image forming system that forms an image of the substrate to be inspected according to light that emerges from the substrate to be inspected by the irradiation with illumination light. The wavelength of the illumination light is set so that intensity of the light from the surface of the resist layer, among the light emerged from the substrate to be inspected, is greater than that of light that has passed through the surface of the cyclic pattern layer formed below the resist layer.12-25-2008
20090219520APPARATUS AND METHOD FOR INSPECTING A SURFACE OF A WAFER - A surface inspection apparatus and method increase wafer productivity, wherein to increase an efficiency of the surface inspection apparatus to detect defects during a scanning of the wafer surface, a scanning speed for a subsequent defect detection is varied according to an increase/decrease of defect density represented on a plurality of images acquired successively. When the density of defects is reduced, the scanning speed increases and a level of a skip rule increases, and when the density of defects increases, the scanning speed decreases and a level of the skip rule decreases to precisely detect defects, thereby increasing reliability, throughput, and productivity.09-03-2009
20090219519APPARATUS AND METHOD FOR INSPECTING CIRCUIT STRUCTURES - An apparatus is described for scanning a circuit structure. The apparatus has a linear sensor (09-03-2009
20090244530MASK INSPECTION APPARATUS - A lightweight and inexpensive mask inspection apparatus having highly efficient environmental radiation resistance is provided. The mask inspection apparatus is a mask inspection apparatus for inspecting for mask defects and includes a light source, an illuminating optical system configured to irradiate a mask with an inspection light emitted from the light source, a magnifying optical system configured to cause the inspection light with which the mask is irradiated to form an image as an optical image, and image sensor configured to acquire the optical image. The image sensor has an environmental radiation shielding member of heavy metal having a specific gravity equal to or greater than that of tantalum (Ta) at least on a side opposite to a receiving surface of a sensor chip.10-01-2009
20120194810Apparatus for inspecting printed circuit board - Disclosed herein is an apparatus for inspecting a printed circuit board. The apparatus includes a first laser light source; a first light condensing unit condensing a light emitted from the first laser light source onto a printed circuit board having a via-hole; a first dichroic beam splitting unit separating fluorescent light a fluorescence generated from the printed circuit board by the light condensed by the first light condensing unit from the light emitted from the first laser light source; and a determining unit determining an unplated state of the printed circuit board from the light passing through the first dichroic beam splitting unit, wherein the via-hole formed in the printed circuit board includes an internal side surface having an unplated part which is not plated, and the light emitted from the first light condensing unit is incident at a first angle with respect to the printed circuit board and condensed to the unplated part of the internal side surface of the via-hole. Through this apparatus, the defects of the printed circuit board can be promptly determined.08-02-2012
20120242986APPARATUS FOR OPTICAL INSPECTION - An apparatus for optical inspection comprises a platform extending in a first direction, a transmitting unit for transporting at least one carrier in the first direction from an input port to an output port thereof, each of the at least one carrier to support one of at least one object to be inspected, a first detector disposed above the platform and extending in a second direction orthogonal to the first direction for inspecting the at least one object on the at least one carrier, the first detector including a first scanner extending in the second direction between the input port and the output port, and a first roller set between the first scanner and the input port to apply force onto a surface of each of the at least one object.09-27-2012
20100188657SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER - Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.07-29-2010
20100014075Method and Apparatus for Inspecting Defects - An apparatus for inspecting a substrate surface is provided, which includes illumination optics for irradiating the substrate surface linearly with rectilinearly polarized light from an oblique direction, detection optics for acquiring images of the substrate surface, each of the images being formed by the light scattered from the light-irradiated substrate surface, and means for comparing an image selected as an inspection image from the plurality of substrate surface images that the detection optics has acquired to detect defects, and another image selected from the plural images of the substrate surface as a reference image different from the inspection image; the illumination optics being formed with polarization control means for controlling a polarizing direction of the light according to a particular scanning direction of the substrate or a direction orthogonal to the scanning direction.01-21-2010
20100188658HIGH RESOLUTION WAFER INSPECTION SYSTEM - A method for inspecting a region, including irradiating the region via an optical system with a pump beam at a pump wavelength. A probe beam at a probe wavelength irradiates the region so as to generate returning probe beam radiation from the region. The beams are scanned across the region at a scan rate. A detector receives the returning probe radiation, and forms an image of the region that corresponds to a resolution better than pump and probe Abbe limits of the optical system. Roles of the pump and probe beams may be alternated, and a modulation frequency of the pump beam may be changed, to produce more information. Information extracted from the probe signal can also differentiate between different materials on the region07-29-2010
20130215420Method and System for Determining One or More Optical Characteristics of Structure of a Semiconductor Wafer - Determination of one or more optical characteristics of a structure of a semiconductor wafer includes measuring one or more optical signals from one or more structures of a sample, determining a background optical field associated with a reference structure having a selected set of nominal characteristics based on the one or more structures, determining a correction optical field suitable for at least partially correcting the background field, wherein a difference between the measured one or more optical signals and a signal associated with a sum of the correction optical field and the background optical field is below a selected tolerance level, and extracting one or more characteristics associated with the one or more structures utilizing the correction optical field.08-22-2013
20100225905INSPECTION METHOD AND INSPECTION APPARATUS FOR SEMICONDUCTOR SUBSTRATE - An inspection method for a semiconductor substrate includes irradiating an inspection beam on wires formed on a semiconductor substrate, detecting a secondary beam emitted from the semiconductor substrate, generating a contrast image, which indicates a state of an inspection surface of the semiconductor substrate, according to a gray level corresponding to signal intensity of the secondary beam, specifying a wire as an inspection target and a wire as a non-inspection target and acquiring a position and a dimension of the wire as the non-inspection target and a gray level corresponding to a wire non-forming area, replacing an image of the wire as the non-inspection target in the contrast image with an image having the gray level corresponding to the wire non-forming area, and inspecting, based on the contrast image after the replacement processing, a defect of the wire as the inspection target.09-09-2010
20100225907SURFACE INSPECTION WITH VARIABLE DIGITAL FILTERING - A semiconductor wafer, which is an inspection object, is stuck by vacuum on a chuck and this chuck is mounted on an inspection object movement stage consisting of a rotational stage and a translational stage, located on a Z-stage. The rotational stage provides a rotational movement and the translational stage provides a translational movement. And when a foreign particle or a defect on an inspection object surface is detected, the parameter of digital filtering is dynamically changed during inspection, and the foreign particle or the defect is differentiated using the result after removing a low frequency fluctuation component to be a noise component.09-09-2010
20090073430INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes: a first light source having a first plurality of surface emitting laser elements which emit fundamental waves, respectively; a first illumination optical system configured to illuminate a first plurality of fundamental waves emitted from the first plurality of surface emitting laser elements on an object to be inspected; and a stage on which the object to be inspected is placed.03-19-2009
20090323054METHOD FOR INSPECTING DEFECT AND APPARATUS FOR INSPECTING DEFECT - The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.12-31-2009
20090323052Dynamic Illumination in Optical Inspection Systems - An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.12-31-2009
20090316143VISUAL INSPECTION APPARATUS, VISUAL INSPECTION METHOD, AND PERIPHERAL EDGE INSPECTION UNIT THAT CAN BE MOUNTED ON VISUAL INSPECTION APPARATUS. - This visual inspection apparatus has a macro-inspection section and a micro-inspection section. In the micro-inspection section, a inspection stage and a microscope are loaded into a loading plate. The inspection stage can be moved in any directions of the X, Y, and Z directions, and can also be rotated in the θ direction. Moreover, a peripheral edge inspection section that acquires an enlarged image of a peripheral edge of wafer W is fixed to the loading plate. The peripheral edge inspection section is arranged so as to image the peripheral edge of wafer W held by the inspection stage.12-24-2009
20100321680CIRCUIT PATTERN DEFECT DETECTION APPARATUS, CIRCUIT PATTERN DEFECT DETECTION METHOD, AND PROGRAM THEREFOR - The present invention provides a defect detection apparatus for a circuit pattern, including: an illumination optical system that irradiates illumination light, having a predetermined polarization condition, onto a detection subject having a circuit pattern formed thereon; a detection device that detects change in the polarization condition of the illumination light between before and after the illumination light passes through the detection subject or between before and after the illumination light is reflected by the detection subject; and a defect detection device that detects a defect of the circuit pattern based on an output of the detection device.12-23-2010
20100225906Surface inspection apparatus and surface inspection method - A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.09-09-2010
20090066942METHOD AND SYSTEM FOR EVALUATING AN OBJECT THAT HAS A REPETITIVE PATTERN - A method and system for evaluating an object that has a repetitive pattern. Illumination optics of an optical unit are adapted to scan a spot of radiation over a repetitive pattern that includes multiple regularly repeating structural elements that are optically distinguishable from their background, generating a diffraction pattern that includes multiple diffraction lobes. Collection optics are adapted to focus radiation from the repetitive pattern onto a detector. The focused radiation includes a single diffraction lobe while not including other diffraction lobes. A grey field detector generates detection signals, responsive to the focused collected radiation. The optical unit is adapted to maintain, at a detection surface of the grew field detector, a radiation pattern that includes a first radiation pattern component resulting from the repetitive pattern and a second radiation pattern component resulting from a defect; wherein the first radiation pattern component is stronger than the second radiation component.03-12-2009
20090066943Apparatus And Method For Inspecting Pattern - A method and apparatus for inspecting defects includes emitting an ultraviolet light from an ultraviolet light source, illuminating a specimen with the ultraviolet light in which a polarization condition of the ultraviolet light is controlled, controlling a polarization condition of light reflected from the specimen which is illuminated by the polarization condition controlled ultraviolet light, detecting the light reflected from the specimen, processing the detected light so as to detect defects, and outputting information about the defects. The ultraviolet light source is disposed in a clean environment supplied with clean gas and separated from outside.03-12-2009
20110043798OPTICAL INSPECTION SYSTEM AND METHOD - An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump.02-24-2011
20110116085DEFECT DETECTION RECIPE DEFINITION - A method of forming a device is disclosed. The method includes providing a substrate and processing a layer of the device on the substrate. The layer is inspected with an inspection tool for defects. The inspection tool is programmed with an inspection recipe determined from studying defects programmed into the layer at known locations.05-19-2011
20110075139OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION SYSTEM - An optical semiconductor wafer inspection system and a method thereof are provided for classifying and inspecting defects such as scratches, voids and particles produced in a flattening process by a polishing or grinding technique used for semiconductor manufacturing. The present invention is an optical semiconductor wafer inspection system and a method thereof characterized by obliquely illuminating a scratch, void or particle produced on the surface of a polished or ground insulating film at substantially the same velocity of light, detecting scattered light at the time of oblique illumination from the surface of an inspection target at different angles and thereby classifying the scratch, void or particle.03-31-2011
20110085162Inspection Method and Apparatus - A method and apparatus is used for inspection of devices to detect processing faults on semiconductor wafers. Illuminating a strip of a die along a scan path with a moving measurement spot. Detecting scattered radiation to obtain an angle-resolved spectrum that is spatially integrated over the strip. Comparing the scattering data with a library of reference spectra, obtained by measurement or calculation. Based on the comparison, determining the presence of a fault of the die at the strip. The measurement spot is scanned across the wafer in a scan path trajectory comprising large (constant) velocity portions and the acquisition of the angle-resolved spectrum is taken, and comparisons are done, at full scan speed. If a long acquisition is performed along a strip across the die in the Y direction, then variation in the acquired spectrum resulting from position variation will primarily depend on the X position of the spot. Spot position variation will occur because no alignment of the spot to the wafer is performed along the high-speed scan path trajectory. A library of reference spectra are obtained for a range of scan paths at respective X-positions on the die to allow for variation in the X position of the high-speed measurement spot.04-14-2011
20100014074SYSTEMS AND METHODS FOR DETECTING SCRATCHES ON NON-SEMICONDUCTOR WAFER SURFACES - A method of detecting one or more scratches on a surface of a wafer made of a non-semiconductor material is provided. A UV beam is produced from a UV illumination source. The UV beam is incident on a front surface of the wafer. The UV beam being characterized that for scratches of a given material having a UV cutoff wavelength λ01-21-2010
20110075138External beam delivery system using catadioptric objective with aspheric surfaces - An inspection system including a catadioptric objective that facilitates dark-field inspection is provided. The objective includes an outer element furthest from the specimen having an outer element partial reflective surface oriented toward the specimen, an inner element nearest the specimen having a center lens comprising an inner element partial reflective surface oriented away from the specimen, and a central element positioned between the outer lens and the inner lens. At least one of the outer element, inner element, and central element has an aspheric surface. The inner element is spatially configured to facilitate dark-field inspection of the specimen.03-31-2011
20110069306Referenced Inspection Device - A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.03-24-2011
20110026017SURFACE INSPECTING METHOD AND SURFACE INSPECTING APPARATUS - Provided is a surface inspecting method for inspecting a surface of a semiconductor substrate having linear line patterns repeatedly arranged and hole-shaped hole patterns formed on the line patterns. The surface inspecting method has a setting step (S02-03-2011
20100118297MICROSCOPE HAVING MULTIPLE IMAGE-OUTPUTTING DEVICES AND PROBING APPARATUS FOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A microscope includes an object splitter configured to split the object image into a first optical path and a second optical path, a first imaging module positioned on the first path and a second imaging module positioned on the second path. The object splitter includes a first beam splitter configured to direct an illumination light to an object, an objective lens configured to collect the reflected light from the object and couple the reflected light on the first beam splitter, and a second beam splitter configured to split the reflected light into the first optical path and the second optical path, wherein the distance between the object and the objective lens is constant. The first imaging module includes a first close up lens configured to render a first object image to a first imaging device with auto-focusing and remote-zooming capabilities, and the second imaging module includes a second close up lens and a negative lens configured to render a second object image to a second imaging device with auto-focusing and remote-zooming capabilities.05-13-2010
20080246959Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device - Excitation light is irradiated onto a GaN layer on a silicon carbide substrate constituting a layered product that is set on a stage. Then light is emitted from a defective part caused by a structural defect of the silicon carbide substrate out of the GaN layer. By using this light luminescence phenomena, a position of a defective part of the silicon carbide substrate can be detected.10-09-2008
20100321679MEASUREMENT SYSTEM AND METHOD - A multi-station measurement system concept is presented, particularly based on an X-Y stage and plurality of horizontal load/unload units. The system allows loading/unloading of wafers from several load/unload units by the direct action of the X-Y stage, thus creating a buffer for wafers without actually requiring an additional buffer mechanism.12-23-2010
20100321678SOLID IMMERSION LENS OPTICS ASSEMBLY - A solid immersion lens optics assembly, a test station for probing and testing of integrated circuits on a semiconductor wafer, and a method of landing a SIL on an object. The optics assembly comprises an objective lens housing for receiving an objective lens, and a solid immersion lens (SIL) housing for mounting an SIL and adapted for connection to the objective lens housing; wherein a peripheral wall of the SIL housing comprises an integrated spring section adapted to provide a biased support for the SIL.12-23-2010
20080204738Method for acquiring high-resolution images of defects on the upper surface of the wafer edge - A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory.08-28-2008
20080204737MASK PATTERN INSPECTION APPARATUS WITH KOEHLER ILLUMINATION SYSTEM USING LIGHT SOURCE OF HIGH SPATIAL COHERENCY - A semiconductor device fabrication-use mask pattern inspection apparatus having an optical configuration adaptable for achievement of a Koehler illumination system using a light source high in spatial coherency is disclosed. This apparatus includes a laser light source, a beam expander which is disposed between the laser source and a mask for expanding laser light to form an optical path of collimated light rays, and a beam splitter placed in the collimated light ray optical path for splitting the optical path into two optical paths. In one of these paths, a transmissive illumination optics is placed which irradiates transmission light onto the mask; in the other path, a reflective illumination optics is placed for irradiation of reflected light onto the mask. A pattern image of this mask is detected by a photosensitive device to generate a detected pattern image, which is sent to a comparator for comparison with a fiducial image thereof.08-28-2008
20110051132Method and apparatus for producing and Measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system - A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface.03-03-2011
20110043797Image Collection - An inspection system for creating images of a substrate. A light source directs an incident light onto the substrate, and a light source timing control controls a pulse timing of the incident light. A stage holds the substrate and moves the substrate under the incident light, so that the substrate reflects the incident light as a reflected light. A stage position sensor reports a position of the stage, and a stage position control controls the position of the stage. A time domain integration sensor receives the reflected light, and a time domain integration sensor timing control controls a line shift of the time domain integration sensor. A control system is in communication with the light source timing control, the stage position control, and the time delay integration sensor timing control, and sets the pulse timing of the incident light, the position of the stage, and the line shift of the time delay integration sensor, such that a single line of the time domain integration sensor integrates reflected light from more than one pulse of the incident light from the light source.02-24-2011
20110134419Inspection Method and Apparatus, and Corresponding Lithographic Apparatus - A method and associated apparatus determine an overlay error on a substrate. A beam is projected onto three or more targets. Each target includes first and second overlapping patterns with predetermined overlay offsets on the substrate. The asymmetry of the radiation reflected from each target on the substrate is measured. The overlay error not resultant from the predetermined overlay offsets is determined. The function that enables calculation of overlay from asymmetry for other points on the wafer is determined by limiting the effect of linearity error when determining the overlay error from the function.06-09-2011
20110096324RETICLE DEFECT INSPECTION APPARATUS AND RETICLE DEFECT INSPECTION METHOD - A reticle defect inspection apparatus that can carry out a defect inspection with high detection sensitivity are provided. The apparatus includes an optical system of transmitted illumination for irradiating one surface of a sample with a first inspection light, an optical system of reflected illumination for irradiating another surface of the sample with a second inspection light, and a detecting optical system that can simultaneously detect a transmitted light obtained by the first inspection light being passed through the sample and a reflected light obtained by the second inspection light being reflected by the sample. And the optical system of transmitted illumination includes a focusing lens driving mechanism for correcting a focal point shift of the transmitted light resulting from thickness of the sample.04-28-2011
20100214561DEFECT INSPECTING APPARATUS - A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.08-26-2010
20080218751Inspection device and inspection method of an object to be inspected - An inspection device of an object, comprising: a laser beam source for oscillating a laser beam and irradiating the laser beam onto a surface of an object to be inspected, a rotary table for loading and rotating the object, a moving mechanism for moving the rotary table in a transfer direction of the object, a plurality of light receptors disposed above the object for receiving a scattering light scattered from the surface of the object when the laser beam irradiated from the laser beam source onto the surface of the object loaded on the rotary table, and a data processor for performing operations on the basis of received signals of the scattering light received by the plurality of light receptors and discriminating a boundary position between a flat plane area of the surface of the object which is irradiated with the laser beam and a predetermined area corresponding to an edge portion outside the plane area.09-11-2008
20100195096HIGH EFFICIENCY MULTI WAVELENGTH LINE LIGHT SOURCE - Embodiments of the present invention provide apparatus and method for inspecting a substrate. Particularly, embodiments of the present invention provide apparatus and method for detecting pinholes in one or more light absorbing films deposited on a substrate. One embodiment of the present invention provides an inspection station comprising an illumination assembly having a first light source providing light of wavelengths in a first spectrum and a second light source providing light of wavelengths in a second spectrum, wherein light in the first spectrum and second spectrum can be absorbed by light absorbing films on the substrate.08-05-2010
20100195097Inspection device and inspection method for the optical examination of object surfaces, particularly of wafer surfaces - An inspection device and a method of inspection, for optical examination of object surfaces, particularly wafer surfaces, wherein the object surface is illuminated by a first illumination device and a second illumination device, wherewith the light reflected and/or scattered from irregularities on the object surface is detected by means of a “scattered light detector” operating in the dark field of the first and second illumination devices, and wherewith the object surface is illuminated by a first illumination device and a second illumination device, wherewith the first illumination device has a laser for illuminating a measurement point on the object surface. The second illumination device is disposed (and oriented) to illuminate the same measurement point on the object surface but with a larger image spot, with the use of light of lower coherence and/or with less anisotropy than that of the laser.08-05-2010
20100026997APPARATUS AND METHOD FOR INSPECTING EDGE OF SEMICONDUCTOR WAFER - A linear actuator which can make a bed flat in emergency. A linear actuator (02-04-2010
20090201494Inspection Tools Supporting Multiple Operating States for Multiple Detector Arrangements - An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.08-13-2009
20100066998SURFACE INSPECTION APPARATUS - [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member.03-18-2010
20120038911DEFECT DETECTION APPARATUS - There is provided a defect detection apparatus including: a light illumination section; a group of lenses including an object lens and a focusing lens; a light splitter section that splits the light passing through the lens group into two beams; a deflecting section; a phase shifting section that shifts the phase of the at least one of the beams from the two beams; a wave combining section that wave combines the two beams phase shifted by the phase shifting section; and an imaging section that captures an optical image of light wave combined by the wave combining section, wherein the object lens and the focusing lens are disposed such that two beams that have passed through the focusing lens are parallel to each other and the main axes of the two beams that have passed through the focusing lens are parallel to each other.02-16-2012
20130010291APPARATUS AND METHOD FOR PATTERN INSPECTION - A pattern inspection apparatus includes a light source, a stage configured to mount thereon a substrate with a pattern formed thereon, a first laser measuring unit configured to measure a position of the stage by using a laser beam, a sensor configured to capture a pattern image obtained from the pattern, formed on the substrate, irradiated by light from the light source, an optical system configured to focus the pattern image on the sensor, a second laser measuring unit configured to measure a position of the optical system by using a laser beam, a correction unit configured to correct a captured pattern image by using a difference between the position of the stage and the position of the optical system, and an inspection unit configured to inspect whether there is a defect of the pattern by using a corrected pattern image.01-10-2013
20090040512Semiconductor wafer inspection device and method - The surface of an epitaxial wafer is inspected using an optical scattering method. The intensities of light scattered with a narrow scattering angle and light scattered with, a wide scattering angle reflected from laser light scatterers (LLS) on the wafer surface are detected. If the intensifies of narrowly and widely scattered lights are within a prescribed sizing range, it is judged whether the laser light scatterer is a particle or killer defect by deciding into which zone (02-12-2009
20120044486Detecting Defects on a Wafer - Systems and methods for detecting defects on a wafer are provided.02-23-2012
20120008137Active Planar Autofocus - A system for inspecting a constant layer depth relative to a particular device layer. The system has an image sensor with a fixed focal plane. A focus sensor senses the surface topography of the substrate and outputs a focus data stream. A stage moves the substrate in an XY plane, and a motor moves the substrate in a Z dimension. A controller operates the system in one of a setup mode and an inspection mode. In the setup mode the controller controls XY movement of the substrate so as to scan a first portion of the substrate. The controller receives the focus data stream, concurrently receives XY data, and stores correlated XYZ data for the substrate. In the inspection mode the controller controls XY movement of the substrate so as to scan a second portion of the substrate. The controller receives the focus data stream, concurrently receives XY data, and subtracts the stored Z data from the focus data stream to produce a virtual data stream. The controller feeds the virtual data stream plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance, regardless of the surface topography of the substrate.01-12-2012
20120008138SURFACE DEFECT INSPECTION METHOD AND APPARATUS - A surface defect inspection apparatus and method for irradiating a beam multiple times to a same region on a surface of an inspection sample, detecting each scattered light from the same region by detection optical systems individually to produce plural signals, and wherein irradiating the beam includes performing a line illumination of the beam on a line illumination region of the sample surface. The line illumination region is moved in a longitudinal direction at a pitch shorter than a length of the line illumination region in the longitudinal direction.01-12-2012
20120013899System and Method for Capturing Illumination Reflected in Multiple Directions - An optical inspection system in accordance with the disclosure can be configured to simultaneously capture illumination reflected in multiple directions from the surface of a substrate, thereby overcoming inaccurate or incomplete characterization of substrate surface aspects as a result of reflected intensity variations that can arise when illumination is captured only from a single direction. Such a system includes a set of illuminators and an image capture device configured to simultaneously capture at least two beams of illumination that are reflected off the surface. The at least two beams of illumination that are simultaneously captured by the image capture device have different angular separations between their reflected paths of travel. The set of illuminators can include a set of thin line illuminators positioned and configured to supply one or more beams of thin line illumination incident to the surface. For instance, two beams of thin line illumination can be directed to the surface at different angles of incidence to a normal axis of the surface.01-19-2012
20120057155DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS - The invention relates to a device for inspecting the edge of semiconductor wafers, including a chromatic confocal microscope (03-08-2012
20120026490SURFACE INSPECTION APPARATUS - A surface inspection apparatus for observing an edge portion of an object to be inspected includes an illumination device that irradiates an illumination light to the edge portion; and an observation device that forms an image of an observation region of the edge portion illuminated with the illumination light. The illumination device emits a first irradiation beam and a second irradiation beam as the illumination light. The first irradiation beam is incident at approximately right angles to the edge portion for compensating brightness of the image and the second irradiation beam is obliquely incident laterally to the observation region of the edge portion for generating a shadow depending on a surface state of the observation region.02-02-2012
20120062877Referenced Inspection Device - A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.03-15-2012
20120154798METHOD AND APPARATUS FOR INSPECTING PATTERNED MEDIA DISK - In an inspection apparatus that inspects both surfaces of a patterned media disk, to perform inspection while maintaining a high level of throughput, a patterned media disk inspection apparatus of the present invention includes an optical inspection unit, a table unit that includes plural substrate rotation drive units on which a substrate is mounted and rotated and rotates and conveys the substrates mounted on the substrate rotation drive units between a position at which the substrate is inspected by the optical inspection unit and a position at which the substrate is taken out and supplied, a substrate reversing unit, a cassette unit that accommodates substrates, and a substrate handling unit that takes out an uninspected substrate from the cassette unit and supplies the uninspected substrate to the table unit, and further stores a substrate, both surfaces of which have already been inspected, in the cassette unit.06-21-2012
20120154797INSPECTION APPARATUS AND INSPECTION METHOD - Reflected light caused by the state of the surface of a wafer, a foreign material, or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.06-21-2012
20100245813MULTI-MODAL IMAGING - A method for scanning a surface with a number of different illumination configurations, the method comprises capturing a plurality of images in a sequential manner during a single sweep, each image including one or more lines of pixels, sequentially altering an illumination configuration used to capture the plurality of images according to a predefined sequence of illumination configurations and shifts of the relative position of the imaging unit for capturing each of the plurality of images, and repeating the sequence of illumination configurations settings and associated image capture positions until a desired area of the surface is scanned, wherein said predefined shift is between 10 pixels and less then one pixel.09-30-2010
20100245812DEFECT INSPECTING METHOD AND DEFECT INSPECTING APPARATUS - Provided is a method and apparatus for inspecting a defect of a shape formed on a substrate. Primary inspection is sequentially performed on specific patterns in a plurality of divided regions of the substrate by using an optical method, and one or more regions on which secondary inspection is to be performed are selected from the regions. One or more defects are detected by performing the secondary inspection using an electron beam on the selected regions.09-30-2010
20120127463INSPECTION APPARATUS - An inspection apparatus includes a work stage part, an optical module, and an optical module moving part. The work stage part receives a board. The work stage part includes work stages disposed in parallel. The optical module includes a projecting part disposed over the board, an image capturing part disposed at a side portion of the projecting part to receive the grating pattern light and capture a reflection image, and an optical path changing part changing a path of the grating pattern light and guiding the grating pattern light to the image capturing part so that the grating pattern light is downwardly incident into the image capturing part. The optical module moving part is disposed over and coupled to the optical module to move the optical module. Thus, time may be reduced and a space may be secured, required for inspecting a board.05-24-2012
20100208251INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage,a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.08-19-2010
20090059217SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM, PROGRAM, AND RECORDING MEDIUM - A wafer measurement/inspection instrument receives information on at least one of a processing result and an operating state of at least one of a coater/developer that performs film forming/resist processing to a wafer and an exposure apparatus that performs liquid immersion exposure to the wafer, and optimizes inspection conditions of the wafer based on the received information (steps 03-05-2009
20090103080Surface inspecting apparatus - A surface inspecting apparatus is provided with an illuminating means for illuminating a repeated pattern formed on the surface of an object to be inspected by linear polarization; a setting means for setting an angle formed by a direction on the surface of an incidence plane of the linear polarization and a repeating direction of the repeated pattern at a prescribed value other than 0; an extracting means for extracting polarization components vertical to an oscillation surface of the linear polarization, from light generated in a specular direction from the repeated pattern; a light receiving means for receiving the light extracted by the extracting means, and outputting light intensity of the specular reflection light; and a detecting means for detecting defects of the repeated pattern, based on the light intensity of the specular reflection light outputted from the light receiving means. The setting means sets the angle formed by the direction on the surface of the incidence plane of the linear polarization and the repeating direction of the repeated pattern so that a difference between the intensity of light from a normal portion on the surface and the light intensity of light from a defective portion on the surface is at maximum.04-23-2009
20120176612METHOD OF DETECTING SPECIFIC DEFECT, AND SYSTEM AND PROGRAM FOR DETECTING SPECIFIC DEFECT - The present invention provides a detection method which allows specific defects that would occur on a wafer surface to be detected more reliably. A method of detecting a specific defect of the present invention includes the steps of: acquiring a light point map which is in-plane position information of a light point detected in a position corresponding to a defect on a surface of a wafer by irradiating the surface of the wafer with light (S07-12-2012
20120075625OPTICAL SURFACE DEFECT INSPECTION APPARATUS AND OPTICAL SURFACE DEFECT INSPECTION METHOD - The present invention is to provide an optical surface defect inspection apparatus or an optical surface defect inspection method that can improve a signal-to-noise ratio according to a multi-segmented cell method without performing autofocus operations, and can implement highly sensitive inspection. The present invention is an optical surface defect inspection apparatus or an optical surface defect inspection method in which an inspection beam is applied onto a test subject, an image of a scattered light from the surface of the test subject is formed on a photo-detector, and a defect on the surface of the test subject is inspected based on an output from the photo-detector. The photo-detector has an optical fiber bundle. One end thereof forms a circular light receiving surface to receive the scattered light. The other end thereof is connected to a plurality of light receiving devices. The optical fiber bundle is divided into a plurality of fan-shaped cells in the light receiving surface, and connected to the light emitting devices in units of the cells for performing the inspection based on the outputs of the plurality of cells.03-29-2012
20120081702METHOD OF INSPECTING SEMICONDUCTOR DEVICE - Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.04-05-2012
20120229802Surface Scanning Inspection System With Adjustable Scan Pitch - A surface scanning wafer inspection system with independently adjustable scan pitch and associated methods of operation are presented. The scan pitch may be adjusted independently from an illumination area on the surface of a wafer. In some embodiments, scan pitch is adjusted while the illumination area remains constant. For example, defect sensitivity is adjusted by adjusting the rate of translation of a wafer relative to the rate of rotation of the wafer without additional optical adjustments. In some examples, the scan pitch is adjusted to achieve a desired defect sensitivity over an entire wafer. In other examples, the scan pitch is adjusted during wafer inspection to optimize defect sensitivity and throughput. In other examples, the scan pitch is adjusted to maximize defect sensitivity within the damage limit of a wafer under inspection.09-13-2012
20100328655Diffraction Based Overlay Metrology Tool and Method - A method for determining overlay between a first grating (12-30-2010
20080297783DEFECT INSPECTION SYSTEM AND METHOD OF THE SAME - In an inspection subject substrate, there is a problem that a defect signal is overlooked due to scattered light from a pattern and sensitivity decreases in an irregular circuit pattern part. The inventors propose a defect inspection method, characterized by comprising: an illumination step of guiding light emitted from a light source to a predetermined area on an inspection subject substrate under a plurality of predetermined optical conditions; a detection step of obtaining an electric signal by guiding scattered light components propagating in a predetermined range of azimuthal angle and in a predetermined range of elevation angle to a detector for each of a plurality of scattered light distributions occurred correspondingly to the plurality of optical conditions in the predetermined area; and a defect determination step of determining a defect based on the plurality of electric signals obtained in the detection step.12-04-2008
20120268735Systems and Methods for Detecting Defects on a Wafer - Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.10-25-2012
20120268734PATTERN DEFECT INSPECTION APPARATUS AND METHOD - A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.10-25-2012
20080204739Process Excursion Detection - A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.08-28-2008
20130016346Wafer Inspection - Systems configured to inspect a wafer are provided.01-17-2013
20120242985PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD - In accordance with an embodiment, a pattern inspection apparatus includes a stage supporting a substrate with a pattern, a light source irradiating the substrate with light, a detection unit, an optical system, a focus position change unit, a control unit, and a determination unit. The detection unit detects reflected light from the substrate. The optical system leads the light from the light source to the substrate and leads the reflected light to the detection unit. The focus position change unit changes a focus position of the light to the substrate in a direction vertical to the surface of the substrate. The control unit associates the movement of the stage with the light irradiation and controls the stage drive unit and the focus position change unit, thereby changing the focus position. The determination unit determines presence/absence of a defect of the pattern based on the signal from the determination unit.09-27-2012
20080231845HIGH RESOLUTION WAFER INSPECTION SYSTEM - A method for inspecting a region, including irradiating the region via an optical system with a pump beam at a pump wavelength. A probe beam at a probe wavelength irradiates the region so as to generate returning probe beam radiation from the region. The beams are scanned across the region at a scan rate. A detector receives the returning probe radiation, and forms an image of the region that corresponds to a resolution better than pump and probe Abbe limits of the optical system. Roles of the pump and probe beams may be alternated, and a modulation frequency of the pump beam may be changed, to produce more information. Information extracted from the probe signal can also differentiate between different materials on the region09-25-2008
20080225284METHOD, APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR OPTIMIZING INSPECTION RECIPES USING PROGRAMMED DEFECTS - A method and computer program product for implementing inspection recipe services are provided. The method includes defining a modified reticle pitch for use in inspecting programmed defects on a test structure, the modified reticle pitch extending the distance of one reticle field plus a portion of an adjacent reticle field on the test structure. The test structure includes a number of arrays linearly arranged on the test structure and spaced equidistant, and each of the arrays corresponds to a reticle field and includes a number of cells. The method also includes using the modified reticle field pitch and an alignment site on the test structure to perform a random mode inspection of the test structure.09-18-2008
20080225283IMAGING SYSTEM WITH HIGH-SPECTRUM RESOLUTION AND IMAGING METHOD FOR THE SAME - An imaging system comprises a light source module configured to generate a combination beam, a controller configured to control the light source module, an image-capturing module configured to capture the reflected beam by a sample. The light source module comprises a plurality of light-emitting devices configured to emit lights of different wavelengths, and the controller is configured to drive the light-emitting devices to emit the lights to form the combination beam consisting of at least two lights of different wavelengths. An imaging method comprises the steps of forming a first combination beam consisting essentially of at least two lights of different wavelengths, capturing the reflected first combination beam by a sample to have a first image, forming a second combination beam consisting of at least two lights of different wavelengths and capturing the reflected second combination beam by the sample to have a second image.09-18-2008
20120250011PATTERN VERIFICATION-TEST METHOD, OPTICAL IMAGE INTENSITY DISTRIBUTION ACQUISITION METHOD, AND COMPUTER PROGRAM - A pattern verification-test method according to an embodiment of the present invention includes: deriving an illumination condition at a verification-test subject position in a photomask surface of a mask pattern as a verification or a test subject based on the verification-test subject position and illumination condition information about a distribution of an illumination condition in a photomask surface of exposure light incident on the mask pattern, performing lithography simulation on the mask pattern based on the derived illumination condition and the mask pattern, and verifying or testing the mask pattern based on a result of the lithography simulation.10-04-2012
20130176558DETECTING METHOD FOR FORMING SEMICONDUCTOR DEVICE - In one embodiment, a method for detecting design defects is provided. The method includes receiving design data of an integrated circuit (IC) on a wafer, measuring wafer topography across the wafer to obtain topography data, calculating a scanner moving average from the topography data and the design data to provide a scanner defocus map across the wafer, and determining a hotspot design defect from the scanner defocus map. A computer readable storage medium, and a system for detecting design defects are also provided.07-11-2013
20130114074SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD - A substrate inspection apparatus for detecting a conditionof an EBR line at a substrate edge, comprising a turntable for rotating a substrate having a film coated thereon, a light irradiator, and a photoelectric converter that receives specularly reflected light from the substrate and ouputs a captured image signal. A two-dimensional image is generation by adding detection values of electrical signals corresponding to one radial scan from a center of the substrate for one turn of a rotator, and a changing point is judged using a judgment band set along one direction of the two-dimensional image.05-09-2013
20130094018OPTICAL EQUIPMENT AND REGISTRATION METHOD - An optical equipment for inspecting and addressing a specimen is disclosed. The optical equipment comprises an optical device and a processing module. The optical device comprises a light source, a sample inspecting device and an address detecting device. The sample inspecting device comprises a first objective lens and a first detector. A beam is focused on a sample placed in an inspected site of a specimen by the first objective lens. The address detecting device comprises a second objective lens and a second detector. A beam is focused on the address coding site by the second objective lens. The processing module controls the beam to be focused on the sampling points of the inspected site to generate first optical signals, and simultaneously controls the beam of the light source to be focused on the corresponding address codes of the address coding site to generate second optical signals.04-18-2013
20130100441OPTICAL INSPECTION APPARATUS AND EDGE INSPECTION DEVICE - The invention provides an optical inspection apparatus having an edge inspection device capable of accommodating wide positional changes in the edges of wafers.04-25-2013
20130148114OPTICAL SYSTEM AND METHOD FOR INSPECTION OF PATTERNED SAMPLES - An optical inspection system for inspecting a patterned sample located in an inspection plane includes an illumination unit defining an illumination path, and a light collection unit defining a collection path, each path having a certain angular orientation with respect to the inspection plane. The illumination unit comprises an illumination mask located in a first spectral plane with respect to the inspection plane and the light collection unit comprises a collection mask located in a second spectral plane with respect to the inspection plane being conjugate to the first spectral plane. Arrangements of features of the first and second patterns are selected in accordance with a diffraction response from said patterned sample along a collection channel defined by the angular orientation of the illumination and collection paths.06-13-2013
20130148115OPTICAL SYSTEM AND METHOD FOR INSPECTION OF PATTERNED SAMPLES - An optical inspection system for inspecting a patterned sample located in an inspection plane includes an illumination unit defining an illumination channel of a predetermined numerical aperture and first predetermined angular orientation with respect to the inspection plane, and a light collection unit defining a collection channel of second predetermined angular orientation with respect to the inspection plane. The illumination unit comprises an illumination mask located in a first spectral plane with respect to the inspection plane and defining an illumination pupil comprising a first pattern formed by at least one elongated light transmitting region having a physical dimension along one axis larger than along a perpendicular axis. The light collection unit comprises a collection mask located in a second spectral plane with respect to the inspection plane being conjugate to the first spectral plane, the collection mask comprising a second predetermined pattern of spaced-apart light blocking regions.06-13-2013
20130148116INSPECTION SYSTEM, INSPECTION METHOD, AND PROGRAM - Setting a spatial filter requires repeatedly confirming a scan image through visual inspection by an operator and adjusting the spatial filter. A setting state is also dependent on the operator. Therefore, in the present invention, a scattered light image (beam image) and a diffracted light image (Fourier image) are simultaneously observed, and an intensity profile of the scattered light image (beam image) and an intensity profile of the diffracted light image (Fourier image) are simultaneously monitored. A field of view of a diffracted light image is scanned with only one spatial filter, and a state change with respect to the intensity profiles in the absence of insertion of the spatial filter is detected. A setting condition for a spatial filter is determined on the basis of the detected state change.06-13-2013
20120281207DEFECT INSPECTION DEVICE USING CATADIOPTRIC OBJECTIVE LENS - A defect inspection device comprises an inspection optical system including a light source, a half mirror for reflecting illumination light emitted from the light source, a catadioptric objective lens for collecting reflected light from the sample by illumination light reflected by the half mirror, an imaging lens for focusing the reflected light transmitted through the catadioptric objective lens, a relay lens having a blocking member provided at a position at which specularly reflected light from the sample is focused by the imaging lens, and a detector for defecting the reflected light of the specularly deflected light blocked by the blocking member; and a computation processing unit for detecting defects of the sample on the basis of the signals detected by the detector.11-08-2012
20130188179METHOD AND APPARATUS FOR MEASURING SHAPE AND THICKNESS VARIATION OF A WAFER - The invention provides a new dual-sided Moiré wafer analysis system that integrates wafer flatness measurement capability with wafer surface defect detection capability. The invention may be, but is not necessarily, embodied in methods and systems for simultaneously applying phase shifting reflective Moiré wafer analysis to the front and back sides of a silicon wafer and comparing or combining the front and back side height maps. This allows wafer surface height for each side of the wafer, thickness variation map, surface nanotopography, shape, flatness, and edge map to be determined with a dual-sided fringe acquisition process. The invention also improves the dynamic range of wafer analysis to measure wafers with large bows and extends the measurement area closer to the wafer edge.07-25-2013
20120019816DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - The present invention provides a spatial filtering technology for exposing a defect image independently of polarization properties of defect scattered light, a defect inspection method for increasing a defect capture rate by suppressing the brightness saturation of a normal pattern, and a defect inspection apparatus that uses the defect inspection method. An array of spatial filters is disposed in one or more optical paths, which are obtained by polarizing and splitting a detection optical path, to filter diffracted light and scattered light emitted from the normal pattern. An image whose brightness saturation is suppressed is obtained by controlling an illumination light amount and/or detection efficiency during image detection in accordance with the amount of scattered light from the normal pattern.01-26-2012
20130208269Extended Defect Sizing Range for Wafer Inspection - Various embodiments for extended defect sizing range for wafer inspection are provided.08-15-2013
20130208270DEFECT INSPECTING APPARATUS AND DEFECT INSPECTING METHOD - The defect inspecting apparatus is capable of easily performing adjustment with a change of an elevation angle of illumination to a substrate to be inspected, while being low in cost. A plane parallel plate and a cylindrical lens supported by a lens holder are symmetrically disposed at the same tilt angle θ with respect to a horizontal plane. A shift in optical axis at a focal position of light (08-15-2013
20130208271SURFACE DEFECT INSPECTION METHOD AND APPARATUS - A surface defect inspection apparatus and method for irradiating a beam multiple times to a same region on a surface of an inspection sample, detecting each scattered light from the same region by detection optical systems individually to produce plural signals, and wherein irradiating the beam includes performing a line illumination of the beam on a line illumination region of the sample surface. The line illumination region is moved in a longitudinal direction at a pitch shorter than a length of the line illumination region in the longitudinal direction.08-15-2013

Patent applications in class On patterned or topographical surface (e.g., wafer, mask, circuit board)