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Detection of object or particle on surface

Subclass of:

356 - Optics: measuring and testing

356237100 - INSPECTION OF FLAWS OR IMPURITIES

356237200 - Surface condition

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
356237300 Detection of object or particle on surface 89
20080259325VISION INSPECTION SYSTEM DEVICE AND METHOD - A course material that is applied to a substrate during fabrication of a composite item is inspected by a system that includes a vision assembly. The vision assembly includes an area light, a line generator, a sensor, and an image processor. The area light illuminates an area of the course material. The line generator generates a line of illumination across the area. The sensor captures an image of the area. The image processor analyzes the image. The image processor is configured to identify debris on the course material in response to the area light being activated and the image processor is configured to identify placement aberrations in response to the line generator being activated.10-23-2008
20090091750Method For Inspecting Pattern Defect And Device For Realizing The Same - When using a CCD sensor as a photo-detector in a device for inspecting foreign matters and defects, it has a problem of causing electric noise while converting the signal charge, produced inside by photoelectric conversion, into voltage and reading it. Therefore, the weak detected signal obtained by detecting reflected and scattered light from small foreign matters and defects is buried in the electric noise, which has been an obstacle in detecting small foreign matters and defects. In order to solve the above problem, according to the present invention, an electron multiplying CCD sensor is used as a photo-detector. The electron multiplying CCD sensor is capable of enlarging signals brought about by inputted light relatively to the electric noise by multiplying the electrons produced through photoelectric conversion and reading them. Accordingly, compared to a conventional CCD sensor, it can detect weaker light and, therefore, smaller foreign matters and defects.04-09-2009
20090009753INSPECTION METHOD AND INSPECTION DEVICE - An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.01-08-2009
20080204734METHOD AND SYSTEM FOR MONITORING PHOTOLITHOGRAPHY PROCESSING BASED ON A BATCH CHANGE IN LIGHT SENSITIVE MATERIAL - A method for monitoring photolithography processing includes monitoring application of a light sensitive material to the surface of each of a plurality of substrates and detecting that a supply of the light sensitive material applied to the substrates has changed from a first batch of light sensitive material to a second batch light sensitive material. A change in photolithography process results caused by the change from the first batch to the second batch of light sensitive material is determined. Also included is initiating corrective action based on the change in photolithography process results.08-28-2008
20090015824Optical Multiwavelength Window Contamination Monitor for Optical Control Sensors and Systems - A foreign-particle detection system for use with an optical instrument having a transmissive window with a first side and a second side includes a radiation source to emit a radiation signal, a diffusing reflector to diffusively spread the radiation signal emitted by the radiation source over the first side of the transmissive window, a radiation detector to detect, at the second side of the transmissive window, the diffusively spread radiation signal transmitted by the transmissive window, and to generate a detected radiation signal based on the detected diffusively spread radiation signal, and a computation module communicatively coupled to the radiation detector to detect a presence of foreign particles on at least one of the first side or the second side of the transmissive window based on at least the detected radiation signal.01-15-2009
20130021602Laser With High Quality, Stable Output Beam, And Long Life High Conversion Efficiency Non-Linear Crystal - A mode-locked laser system operable at low temperature can include an annealed, frequency-conversion crystal and a housing to maintain an annealed condition of the crystal during standard operation at the low temperature. In one embodiment, the crystal can have an increased length. First beam shaping optics can be configured to focus a beam from a light source to an elliptical cross section at a beam waist located in or proximate to the crystal. A harmonic separation block can divide an output from the crystal into beams of different frequencies separated in space. In one embodiment, the mode-locked laser system can further include second beam shaping optics configured to convert an elliptical cross section of the desired frequency beam into a beam with a desired aspect ratio, such as a circular cross section.01-24-2013
20090279080DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER - A method, a device and the application for the inspection of defects on the edge region of a wafer (11-12-2009
20090262339Inspection apparatus and inspection method - A defect inspection apparatus enable to efficiently perform a temperature control without involving an enlarged size can be achieved.10-22-2009
20090284737SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.11-19-2009
20100060887METHOD FOR DETECTING MEMBRANE MODULE FLAW WITH THE APPLICATION OF FLUORESCENT PARTICLES - Provided is a method for detecting a membrane module flaw, including: preparing fluorescent particles having a size of 0.5 to 1.5 μm using silica; injecting the fluorescent particles in a concentration of greater than 0 mg/mL and less than 0.1 mg/mL or equal into a membrane module used in a sewage and wastewater treatment process; operating a pump to apply a pressure such that the fluorescent particles injected into the membrane module leak to the outside of the membrane module, in case that the membrane module has a flaw; acquiring a digital image of the membrane module; and discriminating a colored portion from a non-colored portion in the digital image.03-11-2010
20080273195SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION - A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.11-06-2008
20080304053Apparatus and method for coating and inspecting objects - An apparatus and method for inspecting objects for an inspection criteria thereon includes a conveyor to receive a plurality of objects, a removal assembly located along the conveyor for removing the objects, and an inspection system located along the conveyor prior to the removal assembly for inspecting the objects against a predetermined inspection criteria to determine to reject or pass the inspected objects and to actuate the removal assembly to remove the inspected objects from the conveyor that are passed and to leave the inspected objects that are rejected on the conveyor to subsequently exit the conveyor.12-11-2008
20110267605FOREIGN MATTER INSPECTION METHOD AND FOREIGN MATTER INSPECTION APPARATUS - In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.11-03-2011
20090213364SURFACE INSPECTION METHOD AND INSPECTION DEVICE USING THE SAME - If an illuminance of a measurement spot is limited in order to prevent heat damage on an article to be inspected, since detection sensitivity and a detection speed are in a relation of trade-off, it is difficult to improve one of them without sacrificing the other or to improve both of them. Also, there is a problem that the detection sensitivity is lowered on an outer circumference portion than on an inner circumference portion of the article to be inspected.08-27-2009
20100020315METHOD FOR DETECTING PARTICLES AND DEFECTS AND INSPECTION EQUIPMENT THEREOF - A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.01-28-2010
20100188656Surface Inspection Method and Surface Inspection Apparatus - Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.07-29-2010
20090251690OPTICAL APPARATUS FOR DEFECT INSPECTION - An optical apparatus for defect inspection having an illuminating optical system for irradiating illumination light beams on the surface of a specimen to form a beam spot and a detection optical system for detecting a reflection light ray originating from the beam spot comprises a storage unit in which the position and size of a standard particle of known size on a specimen for correction are stored in advance, a correction processing section which, when the correction specimen is used as an inspection target, correlates a detected scattering light quantity from the standard particle with the known size of standard particle stored at a corresponding position in the storage unit to prepare a correlation between the scattering light quantity and a true value, and a signal processing section which, when an inspection wafer is used as an inspection target, converts a detected scattering light quantity into a defect dimension.10-08-2009
20100296083Detection and identification of solid matter - Detection and identification of minute quantities of condensed or solid state materials with significantly improved performance over the present state-of-the-art, comprises illuminating a small target particle with an appropriate laser radiation at a wavelength that is strongly absorbed by the target. The resulting temperature rise is observed by monitoring the increased blackbody radiation from the sample. An unambiguous determination of the target compound or the target material composition can be achieved through the use of a tunable laser that generates an absorption fingerprint of the target.11-25-2010
20090066941METHOD FOR DETECTING PARTICLES AND DEFECTS AND INSPECTION EQUIPMENT THEREOF - A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.03-12-2009
20090066940SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.03-12-2009
20110109901FOREIGN MATTER INSPECTION APPARATUS - Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.05-12-2011
20090323051OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION APPARATUS - An optical inspection apparatus irradiates a light beam onto the outer surface of an object to be inspected, in the form of an illumination spot having an illumination intensity which is higher in the outer peripheral part of the object to be inspected than in the inner peripheral part thereof while uniformly maintains a temperature rise caused by the irradiation of the light beam, over the outer surface of the object to be inspected, in order to prevent the effective entire signal value of a scattered light signal from lowering, without lowering the linear speed of a movable stage for the object to be inspected in the outer peripheral part of the object to be inspected, thereby it is possible to prevent lowering of the detectability for a foreign matter or a defect, for preventing lowering of inspection throughput.12-31-2009
20100053602HARD DISK INSPECTION APPARATUS - A hard disk inspection apparatus comprises a disk holding device which holds a hard disk; a light source which generates a light that illuminates an inspection region portion of a hard disk that is held by the disk holding device; a light guide which has a branched shape and guides a light from the light source to a plurality of light projecting parts; and an image pickup device which takes an image by receiving reflected light from the inspection region portion; wherein an illumination light is shone onto the inspection region from plural courses by shining the illumination light that is guided by the light guide onto the inspection region front the plurality of light projecting parts.03-04-2010
20110075135SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.03-31-2011
20110075136FOREIGN MATTER INSPECTION APPARATUS AND FOREIGN MATTER INSPECTION METHOD - A foreign-matter inspection apparatus is implemented which allows the stable detection sensitivity to be maintained. A laser beam emitted from a laser apparatus is applied to a beam irradiation sample via an irradiation unit and a mirror. Then, the laser beam is captured into a beam-capturing camera via an image-forming lens and a beam-direction switching mirror. Based on the captured beam image, an image computational processing unit judges inclination of the laser beam, then adjusting the irradiation unit thereby to correct the inclination of the laser beam. Also, the beam is captured into the beam-capturing camera in specified number-of-times while focus of the laser beam is being changed by an arbitrary amount by the irradiation unit. Based on the captured beam, the focus of the laser beam is corrected by adjusting the irradiation unit.03-31-2011
20090279079METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.11-12-2009
20110051131INSPECTION DEVICE AND INSPECTION METHOD - An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.03-03-2011
20110051130FOREIGN SUBSTANCE INSPECTION APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE - A foreign substance inspection apparatus includes a light projecting unit, a detector which detects the intensity of scattered light of light projected onto the surface of an object to be detected by the light projecting unit, in association with the two-dimensional coordinate position on the surface, and a processing unit. The relationship between the intensity of the scattered light detected by the detector and the particle size of the foreign substance differs depending on the two-dimensional coordinate position on the surface. The processing unit determines, a conversion curve to convert the intensity of the scattered light detected by the detector into the particle size of the foreign substance, in accordance with the two-dimensional coordinate position of the foreign substance detected by the detector, and converts the intensity of the scattered light detected by the detector into the particle size of the foreign substance using the determined conversion curve.03-03-2011
20110085161Method and device for detecting soiling - A device for detecting soiling, having a light source, which emits a light beam, and an opaque layer having a first boundary surface and a second boundary surface, whereby the light beam emitted by the light source first impinges on the first boundary surface, and part of a light beam fraction, which is scattered at the second boundary surface, impinges on a receiver and forms a measuring signal, and hereby the first boundary surface is set up to scatter part of the incident light beam, and the part impinging on the receiver of the light beam, scattered at the first boundary surface, forms a reference signal, and the device is set up further to determine a measure for the soiling of the second boundary surface from the comparison of the reference signal and measuring signal.04-14-2011
20100128261DEVICE FOR DETECTING AND CLASSIFYING RESIDUAL OXIDE IN METAL SHEET PRODUCTION LINES - Specially designed for the fully automated detection of residual oxide stains (residual scale) and classification thereof in metal sheet production lines, with no to stop the line, the invention consists of a framework or box (05-27-2010
20100225904Defect Inspection Tool For Sample Surface And Defect Detection Method Therefor - A defect inspection tool includes an illumination optical system for irradiating light to a surface of an object, and a detection optical system for detecting light scattered from the surface of the object which is irradiated. The detection optical system include an analyzer, a photoelectric converting device for receiving the scattering light passed through the analyzer, a member for saving a database prepared through an actual measurement or a calculation in correspondence with a condition of the illumination optical system, that of the detection optical system, a kind of an object to be inspected, and a rotation angle of the analyzer, and a member for adjusting an angle of the analyzer by selecting an angle of the analyzer from a database saved in the member for saving on a basis of an inspection recipe after receiving the inspection recipe to the defect inspection tool.09-09-2010
20100259750Appearance Inspection Apparatus - An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.10-14-2010
20110090491IMAGE SENSOR INSPECTION DEVICE - An inspection device for visually inspecting an image sensor of a digital recording device, such as a digital camera. The inspection device includes a tubular housing and a lens mounted therein. The housing is configured to engage a lens interface of a camera body. A lighting assembly is provided that is configured to illuminate the image sensor when the inspection device is coupled to a digital camera body so that the image sensor may be visually inspected for contamination.04-21-2011
20100290040SENSOR ELEMENT FOR A SORTING DEVICE AND METHOD FOR SORTING PRODUCTS - The invention relates to a sorting device and a method for sorting products (11-18-2010
20100271626INSPECTION METHOD AND INSPECTION DEVICE - An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.10-28-2010
20100271625Surface Inspection Method and Surface Inspection Apparatus - A surface inspection method and a surface inspection apparatus in which a plurality of photodetectors are arranged in a plurality of directions so that light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination.10-28-2010
20110255082OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION APPARATUS - In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot.10-20-2011
20120092656Defect Inspection Method and Defect Inspection Apparatus - Provided is a method for inspecting a defect on a surface of a sample, the method including the steps of comparing a haze signal distribution with a predetermined light intensity distribution to calculate pixel shift amounts of detection signals; and adding up shift corrected detection signals to detect a defect.04-19-2012
20120140212INSPECTION APPARATUS AND INSPECTION METHOD - A defect inspection apparatus emits light to a test object, detects reflected of scattered light from the test object and detects a defect in the test object The apparatus comprises a temperature-controlled part accommodating section that accommodates parts having a need for controlling a temperature, which is out of a plurality of parts in the defect inspection apparatus. A first temperature measuring instrument measures a temperature in the temperature-controlled part accommodating section; and a temperature control unit controls a temperature of the interior of the temperature-controlled part accommodating section at a prescribed temperature according to the temperature measured by the first temperature measuring instrument. Accordingly, a defect inspection apparatus can efficiently perform temperature control without involving an enlarged size can be achieved.06-07-2012
20120274931DEFECT DETECTION METHOD AND DEFECT DETECTION DEVICE AND DEFECT OBSERVATION DEVICE PROVIDED WITH SAME - The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of a smaller scale. The electron microscope (11-01-2012
20130194568SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - A surface inspection method for inspecting a surface H of an inspection subject having a specular surface H, including: a step in which the surface H of the inspection subject is irradiated with light L from an oblique direction; a step in which measurement is conducted of the intensity of diffracted light D that is diffracted by adhering foreign matter K among light that is regularly reflected by the surface H of the inspection subject; a step in which measurement is conducted of the intensity of scattered light S that is irregularly reflected by the adhering foreign matter K; and a step in which an adhering condition of foreign matter K on the surface H of the inspection subject is determined based on measurement results for the intensity of the diffracted light D that is regularly reflected, and the intensity of the scattered light S that is irregularly reflected.08-01-2013
20100020314EQUIPMENT AND METHOD FOR DETECTING FOREIGN MATTERS - A foreign matter detector and a foreign matter detecting method are provided, with which foreign matter detection performance can be improved. The foreign matter detector comprises: a means for irradiating first inspection light and second inspection light to an inspection area such that their incident planes are perpendicular to each other; a measuring means for measuring the spectrum of reflected light, the reflected light being a reflection of the inspection light at the inspection area; and a means for determining, by analyzing the spectrum of the reflected light, whether any foreign matter is intermingled or not.01-28-2010
356237400 On patterned or topographical surface (e.g., wafer, mask, circuit board) 47
20090257053High Numerical Aperture Catadioptric Objectives Without Obscuration and Applications Thereof - Disclosed are high numerical (NA) catadioptric objectives without a central obscuration, and applications thereof. Such objectives can operate through a wide spectral bandwidth of radiation, including deep ultraviolet (DUV) radiation. Importantly, refractive elements in the catadioptric objectives can be manufactured from a single type of material (such as, for example, CaF10-15-2009
20090122305DETECTION CIRCUIT AND FOREIGN MATTER INSPECTION APPARATUS FOR SEMICONDUCTOR WAFER - In a foreign matter inspection apparatus for a semiconductor wafer, a PMT which detects reflection light, an amplifier which amplifies a signal detected by the PMT and in which response characteristics of amplification are controlled by a control signal, an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code, a control circuit which generates a control signal based on information of the semiconductor wafer having a correlation with the reflection light, and a data processing circuit which detects a foreign matter on the semiconductor wafer based on the code output from the A/D converter are provided.05-14-2009
20090122304Apparatus and Method for Wafer Edge Exclusion Measurement - A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. An automatic defect characterization processor is provided.05-14-2009
20080225282Beam delivery system for laser dark-field illumination in a catadioptric optical system - A method and apparatus for inspecting a specimen are provided. The apparatus comprises a primary illumination source, a catadioptric objective exhibiting central obscuration that directs light energy received from the primary illumination source at a substantially normal angle toward the specimen, and an optical device, such as a prism or reflective surface, positioned within the central obscuration resulting from the catadioptric objective for receiving further illumination from a secondary illumination source and diverting the further illumination to the specimen. The method comprises illuminating a surface of the specimen at a variety of angles using a primary illumination source, illuminating the surface using a secondary illumination source, the illuminating by the secondary illumination source occurring at a substantially normal angle of incidence; and imaging all reflected, scattered, and diffracted light energy received from the surface onto a detector.09-18-2008
20100103409METHOD AND APPARATUS FOR DETECTING DEFECTS - An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.04-29-2010
20130050689Large Particle Detection For Multi-Spot Surface Scanning Inspection Systems - The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.02-28-2013
20090046280MASK DEFECT INSPECTION DATA GENERATING METHOD, MASK DEFECT INSPECTION METHOD AND MASK PRODUCTION METHOD - According to a mask defect inspection data generating method, a distance between inspection areas neighboring in a predetermined direction is calculated based on inspection area control information defined in photomask inspection data. It is determined whether or not the calculated distance between inspection areas is less than a predetermined distance. When it is determined that the distance between inspection areas is less than a predetermined distance, the inspection area is combined to produce an optimization inspection area. The produced optimization inspection area information is defined in inspection layout data for making a reference in die-to-database defect inspection.02-19-2009
20080316474Optical Apparatus and an Observation Apparatus Having the Same For Observing Micro Particles - Disclosed is an optical device for illuminating a chip having a sample provided thereto with a beam in an apparatus for observing the sample. The optical device comprises a light source; and a first reflector reflecting the beam of the light source to allow the reflected beam to be incident on the chip at an inclined angle. In addition, the invention provides an apparatus for observing micro particles having the optical device. When the light of the light source is incident on the sample at an incline angle according to the optical device of the invention, it is possible to maximize a transmittancy of the light. Accordingly, the light emitted from the sample is clearer and a clear image can be thus obtained.12-25-2008
20120188536IMPRINT APPARATUS, DETECTION METHOD, ARTICLE MANUFACTURING METHOD, AND FOREIGN PARTICLE DETECTION APPARATUS - The present invention provides an imprint apparatus for performing an imprint process of transferring a pattern onto a substrate by curing a resin on the substrate while the resin is in contact with a mold, and removing the mold from the cured resin, including a detection unit configured to detect a foreign particle existing on the substrate, wherein the detection unit includes an obtaining unit configured to irradiate a surface of the substrate with light, and obtain light from the surface of the substrate, and a specification unit configured to specify a shot region where a foreign particle existing on the substrate is positioned, based on the light obtained by the obtaining unit.07-26-2012
20100073671ALIGNMENT MARK AND DEFECT INSPECTION METHOD - A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection.03-25-2010
20110149276Method of Detecting a Particle and a Lithographic Apparatus - A detector detects radiation from a mask to form an image, but the focal plane of the image is in front of the mask. Any particles arranged on the mask will be in focus. However, the pattern on the mask will be out of focus. It is therefore possible to detect the existence and location of particles on a mask having an arbitrary pattern. The depth of field of the detector is small and the focal plane is no further from the surface of the patterning device than two times the depth of field.06-23-2011
20090091751MULTICHIP CCD CAMERA INSPECTION SYSTEM - In one embodiment, a surface inspection system comprises a radiation source that emits a broadband radiation beam, a radiation directing assembly to target radiation onto a surface of an object, the radiation directing assembly comprising a radiation collection assembly to collect radiation reflected from the surface of the object, the radiation collection assembly comprising at least one multi-chip detector array assembly positioned within a field of view of the inspection system.04-09-2009
20090262340OPTICAL EXTERIOR INSPECTION APPARATUS AND METHOD - An inspected object (e.g., a reticle) is stored in an immersion cassette filled with a liquid having a specific refraction factor. An inspection beam is irradiated toward the inspected object, which is subjected to precise positioning, via an objective lens while being refracted by the liquid, thus producing a reflected inspection beam reflected by the inspected object and a transmitted inspection beam transmitted through the inspected object. Image processing is performed based on at least one of the reflected inspection beam and the transmitted inspection beam, thus producing an inspected image of the inspected object. The inspected image is compared with a prescribed circuit pattern so as to inspect the existence and nonexistence of foreign matter or structural defects on the exterior of the inspected object. Thus, it is possible to secure an adequate focal depth of the objective lens while achieving a high resolution in imaging the inspected object.10-22-2009
20090103079APPARATUS AND METHOD FOR INSPECTING DEFECT IN OBJECT SURFACE - An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed.04-23-2009
20090168055Semiconductor Manufacturing Peripheral Verification Tool - Apparatus and methods for verification of the dimensions of a semiconductor manufacturing peripheral are disclosed, in which the peripheral, e.g., a wafer cassette, is positioned between, and is enveloped by, an emitter housing and an opposing receiver housing adapted for emitting and receiving, respectively, light from a selected portion of the electromagnetic spectrum, preferably infrared. The measured light is used to verify the dimensions of the target peripheral in comparison with a pre-selected standard.07-02-2009
20100271627Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system.10-28-2010
20080278717CONTAMINATION-INSPECTING APPARATUS AND DETECTION CIRCUIT - The detection part has: a subtraction module for calculating correction data from data of detection systems when a reference-voltage generation module applies a reference voltage to the detection systems; a data-holding module for holding the correction data; an addition module for making a correction of detection data; a comparison module for comparing the detection data with switching data; and a selector for switching data of the detection systems including data subjected to the correction according to the output of the comparison module.11-13-2008
20080285021WAFER INSPECTING METHOD AND DEVICE - A wafer inspecting method including the steps of scanning the surface of a wafer along a street by using a line sensor having a plurality of elements arranged in a line, and determining a deposited condition of foreign matter on the surface of the wafer near electrodes formed on both sides of the street according to image information obtained by the above scanning step. By the use of the linear sensor, it is possible to efficiently determine whether or not the electrodes are good.11-20-2008
20080304054Method for Analyzing an Integrated Circuit, Apparatus and Integrated Circuit - A method for analyzing an integrated circuit (IC) comprising a plurality of semiconductor devices is disclosed. The method comprises the steps of forming a diffraction lens (12-11-2008
20080285022Visual inspection apparatus - A visual inspection apparatus includes: a first substrate holding portion that holds a substrate so that a top surface is observable; a second substrate holding portion that holds the substrate so that a bottom surface is observable; a first substrate holding portion moving mechanism that moves the first substrate holding portion; a second substrate holding portion moving mechanism that moves the second substrate holding portion; and a control device that controls the first substrate holding portion moving mechanism and the second substrate holding portion moving mechanism so that the position of the substrate when observing the top surface of the substrate in the first substrate holding portion substantially matches the position of the substrate when observing the bottom surface of the substrate in the second substrate holding portion.11-20-2008
20090168056PATTERN FORMATION DEVICE - A pattern formation device is for forming a pattern on a substrate includes first and second foreign matter detection sensors. Each of the first and second foreign matter detection sensors includes a light projecting unit and a light receiving unit disposed across a transport path of the substrate from the first light projecting unit. The light projecting unit is configured and arranged to emit a detection light along an upper surface of the substrate. The light receiving unit being configured and arranged to receive the detection light to detect foreign matter on the substrate based on an amount of the detection light received by the light receiving unit. The light projecting units of the first and second foreign matter detection sensors are disposed on opposite sides of the transport path.07-02-2009
20090207406PARTICLE INSPECTION APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A particle inspection apparatus includes an irradiation unit configured to apply a light beam onto front and back surfaces of an object to be inspected, first and second detection units configured to detect scattering light from the surfaces, a calculation unit configured to conduct a particle inspection on the surfaces on the basis of outputs from the detection units, and a control unit configured to control the irradiation unit, the detection units, and the calculation unit. The irradiation unit can selectively apply the beam onto the front or back surface. The control unit causes the calculation unit to conduct the particle inspection on the inspection surface on which the light beam is selectively applied, on the basis of outputs made by the detection unit corresponding to simultaneous application and selective application of the light beam.08-20-2009
20090002695Method and Apparatus for Reviewing Defect - The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the defect existed on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.01-01-2009
20120194809METHOD AND APPARATUS FOR DETECTING DEFECTS - A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.08-02-2012
20100020316INSPECTION APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE - An inspection apparatus includes a projecting unit, a first receiving unit, a second receiving unit, and a controller. The projection unit is configured to project linear light on a surface of an object. The first and second receiving units are configured to receive scattered light of the projected linear light. The controller is configured to scan the projecting unit, the first and second receiving units and determine the present or absence of a foreign substance on the surface based on intensity distribution signals output from the first and second receiving units.01-28-2010
20100259751DEFECTS INSPECTING APPARATUS AND DEFECTS INSPECTING METHOD - An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.10-14-2010
20090116004Surface Inspection System with Improved Capabilities - Pixel intensities indicative of scattered radiation from portions of the inspected surface surrounding a location of a potential anomaly are also stored so that such data is available for quick review of the pixel intensities within a patch on the surface containing the location of the potential anomaly. Where rotational motion is caused between the illumination beam and the inspected surface, signal-to-noise ratio may be improved by comparing the pixel intensities of pixels at corresponding positions on two different surfaces that are inspected, where corresponding pixels at the same relative locations on the two different surfaces are illuminated and scattered radiation therefrom collected and detected under the same optical conditions.05-07-2009
20100053603Surface inspection apparatus and surface inspection method - A surface inspection apparatus includes an illuminating part illuminating an edge part of a substrate from a direction deviated from a direction of normal line of the edge part by an angle being predetermined, the edge part being inclined and the substrate being an inspection target, an imaging optics forming an image from a diffracted light from a captured area of the edge part as a dark field image, an imaging part capturing the dark field image obtained by the imaging optics, and a detecting part detecting a defect based on whether or not a striated image appears on the dark field image corresponding to the edge part obtained by the imaging part.03-04-2010
20110075137DEFECT INSPECTION SYSTEM - In a defect inspection system using a plurality of detectors such as an upright detector and an oblique detector, if illumination light and wafer height are adjusted to the detection field of view of one detector, a defocused image is detected by other remaining detectors, resulting in degradation of the detection sensitivity. The present invention solves this problem.03-31-2011
20100253938OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION APPARATUS - In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot.10-07-2010
20080204736Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system.08-28-2008
20080204735APPARATUS AND METHOD FOR MEASURING STRUCTURES ON A MASK AND OR FOR CALCULATING STRUCTURES IN A PHOTORESIST RESULTING FROM THE STRUCTURES - An apparatus (08-28-2008
20130010290SURFACE INSPECTION DEVICE AND SURFACE INSPECTION METHOD - There are provided a surface inspection device and a surface inspection method which can inspect a surface of a test object with uniform detection sensitivity. A surface inspection device includes a test object moving stage, a lighting device, an inspection coordinate detection device, a light detector, an A/D converter, and a foreign object/defect determination unit. The lighting device is configured to change a dimension of a light spot in a circumferential direction based on a position of the light spot in a radial direction obtained by the inspection coordinate detection device. The density of irradiation light intensity of the light spot is made constant while the light spot is being moved for scanning between an outer peripheral portion and a central portion on the test object.01-10-2013
20120002196System For Monitoring Foreign Particles, Process Processing Apparatus And Method Of Electronic Commerce - A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom.01-05-2012
20130293879DEFECT INSPECTION METHOD AND DEVICE THEREFOR - To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.11-07-2013
20100208250Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.08-19-2010
20090059216DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A defect inspection apparatus comprises: a stage which scans a sample in a horizontal plane; an illumination optical system which illuminates light at an oblique angle with respect to a normal of a sample surface, and illuminates light in a linear form on the sample at an angle inclined to a direction perpendicular to the scanning direction of the stage; a front scattered light detection optical system which is disposed in the same orientation as the scanning direction, positioned at an elevation angle where a specular reflection light from a pattern parallel to the scanning direction is not spatially detected, and detects scattered light from a region illuminated in the linear form; an image sensor detecting an image formed by the front scattered light detection optical system; and an image processing unit performing a comparison operation of the image detected by the image sensor, thereby determining a defect candidate.03-05-2009
20100271628METHOD AND APPARATUS FOR DETECTING DEFECTS - A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-θ directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector from the specimen is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip. If these signals are not identical to each other, the foreign matter is determined to exist on the specimen in detection.10-28-2010
20080297782WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD - A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.12-04-2008
20080297781WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD - A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.12-04-2008
20100238434FOREIGN SUBSTANCE INSPECTION APPARATUS - A foreign substance inspection apparatus includes an irradiating unit and first and second detecting units. The irradiating unit is configured to emit irradiating light to be obliquely incident on a surface to be inspected to form a linear irradiation region on the surface to be inspected. The first and second detecting units are arranged on the same side as that provided with the irradiating unit with respect to the surface to be inspected, and they are configured to detect scattered light caused by a foreign substance on the surface to be inspected. The first and second detecting units are arranged at opposite positions with respect to a plane containing the linear irradiation region.09-23-2010
20120092657METHOD OF DEFECT INSPECTION AND DEVICE OF DEFECT INSPECTION - A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 04-19-2012
20120242984SURFACE DEFECT INSPECTION APPARATUS AND SURFACE DEFECT INSPECTION METHOD - A surface defect inspection apparatus includes a light source that emits light to a first position on a surface of a target at an angle inclined with respect to the surface of the target, a first photodetector that detects first reflected light of the light from the light source, the first reflected light being reflected at the first position, a second photodetector that detects second reflected light of the light from the light source, the second reflected light being reflected at a second position, the second position being closer to the light source than the first position and being separated from the surface of the target by a given distance, and a determining unit that determines whether or not foreign matter is present on the surface of the target on a basis of detection results obtained from the first photodetector and the second photodetector.09-27-2012
20120133929INSPECTION METHOD AND INSPECTION APPARATUS - The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.05-31-2012
20130194569SUBSTRATE INSPECTION METHOD - A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object.08-01-2013
20130258330EVALUATION SUBSTRATE, DEFECT EXAMINATION METHOD AND DEFECT DETECTION DEVICE - The present invention provides an evaluation substrate for evaluating a foreign object defect included in an organic material, a defect examination method and defect detection device. The evaluation substrate of the present invention includes a substrate, a first film arranged on the substrate, and a second film arranged on the first film, wherein a film containing an organic material is formed on the second film; the first film being set lower than an etching rate of the second film with respect to an etchant used in etching the second film, the first film having the same or a smaller detection lower limit value of an optically detectable defect than a detection lower limit value of a defect of the second film; and a thickness of the second film being set to a value near an optically measured lowest or minimum Haze value.10-03-2013
20130258329Inspection Apparatus, Inspection Method and Program for Inspection - In a first platen gap, a light emitting amount is decided to obtain a light receiving amount for inspection as a first light emitting amount for inspection. Subsequently, in a second platen gap, a light emitting amount is decided to obtain a light receiving amount for inspection as a second light emitting amount for inspection. An inspection on dot forming is performed, using a smaller light emitting amount for inspection between the first and second light emitting amounts for inspection, and using the platen gap in which the smaller light emitting amount for inspection is decided.10-03-2013

Patent applications in class Detection of object or particle on surface

Patent applications in all subclasses Detection of object or particle on surface