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Surface condition

Subclass of:

356 - Optics: measuring and testing

356237100 - INSPECTION OF FLAWS OR IMPURITIES

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
356237500 On patterned or topographical surface (e.g., wafer, mask, circuit board) 156
356237300 Detection of object or particle on surface 86
Entries
DocumentTitleDate
20130044316DEVICE AND METHOD FOR INSPECTING MOVING SEMICONDUTOR WAFERS - Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.02-21-2013
20100141936OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.06-10-2010
20100149528Defect Inspection Method - A method for inspecting a defect of a surface of a sample, includes irradiating a laser beam on the sample surface a plurality of times so that at least part of an illumination field of the laser beam on the sample surface illuminates a first area of the sample surface each of the plurality of times, detecting a plurality of scattered light rays from the first area caused by the plurality of times of irradiation, correcting errors of detection timings for the plurality of scattered light rays detected in the detection step, and determining a defect on the sample surface based on the plurality of scattered light rays in accordance with the correcting errors of detection timings.06-17-2010
20080259324Process of using an inspection dye for detecting cracks and flaws in metallic surfaces - The present invention relates to the process of using a unique inspection dye to detect cracks and flaws in metallic surfaces to which the inspection dye has been applied.10-23-2008
20100073670ABNORMAL MEASUREMENT DETECTION DEVICE AND METHOD FOR INFRARED RADIATION THERMOMETER - A technique for an infrared radiation thermometer used for thermography detects measurement abnormality of the infrared radiation thermometer and estimates the causes of the measurement abnormality such as contamination of an objective lens and a malfunction in a mechanism section of the infrared radiation thermometer. The measurement abnormality detector has a dummy lens 03-25-2010
20120262709DEFECTS INSPECTING APPARATUS AND DEFECTS INSPECTING METHOD - An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.10-18-2012
20120262708UNMANNED AERIAL VEHICLE - There is herein described an unmanned aerial vehicle capable of inspecting, identifying, and/or categorising defects on objects to be inspected using visible and/or non-visible wavelengths from infra-red to ultraviolet. More particularly, there is herein described a remotely controlled or autonomous unmanned aerial vehicle capable of inspecting, identifying, and/or categorising defects on objects to be inspected using visible and/or non-visible wavelengths from infra-red to ultraviolet and displaying information relating to said defects.10-18-2012
20130027694SURFACE DEFECT INSPECTION METHOD AND APPARATUS - The present invention provides an apparatus and method which enable detecting a microscopic defect sensitively by efficiently collecting and detecting scattering light from a defect in a wider region without enlarging the apparatus. In the apparatus for inspecting a defect on a surface of a sample, including illumination means which irradiates a surface of a sample with laser, reflected light detection means which detects reflected light from the sample, and signal processing means which processes a detected signal and detecting a defect on the sample, the reflected light detection means is configured to include a scattering light detection unit which collects scattering light components of the reflected light from the sample by excluding specularly reflected light components by using an aspheric flannel lens and detecting the scattering light components.01-31-2013
20130027693SURFACE DEFECT INSPECTION METHOD AND APPARATUS - The present invention provides an apparatus and method which enable detecting a microscopic defect sensitively by efficiently collecting and detecting scattering light from a defect in a wider region without enlarging the apparatus. In the apparatus for inspecting a defect on a surface of a sample, including illumination means which irradiates a surface of a sample with laser, reflected light detection means which detects reflected light from the sample, and signal processing means which processes a detected signal and detecting a defect on the sample, the reflected light detection means is configured to include a scattering light detection unit which collects scattering light components of the reflected light from the sample by excluding specularly reflected light components by using an aspheric flannel lens and detecting the scattering light components.01-31-2013
20090303470FOREIGN MATTER INSPECTION APPARATUS AND FOREIGN MATTER INSPECTION METHOD - A foreign-matter inspection apparatus is implemented which allows the stable detection sensitivity to be maintained. A laser beam emitted from a laser apparatus is applied to a beam irradiation sample via an irradiation unit and a mirror. Then, the laser beam is captured into a beam-capturing camera via an image-forming lens and a beam-direction switching mirror. Based on the captured beam image, an image computational processing unit judges inclination of the laser beam, then adjusting the irradiation unit thereby to correct the inclination of the laser beam. Also, the beam is captured into the beam-capturing camera in specified number-of-times while focus of the laser beam is being changed by an arbitrary amount by the irradiation unit. Based on the captured beam, the focus of the laser beam is corrected by adjusting the irradiation unit.12-10-2009
20090303469CRACK MEASURING METHOD AND APPARATUS - Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines.12-10-2009
20090303468Undulation Inspection Device, Undulation Inspecting Method, Control Program for Undulation Inspection Device, and Recording Medium - An undulation inspection device of the present invention includes: illumination means (line light source 12-10-2009
20120218545OBLIQUE ILLUMINATOR FOR INSPECTING MANUFACTURED SUBSTRATES - One embodiment relates to an oblique illuminator. The oblique illuminator includes a light source emitting a light beam, a first reflective surface, and a second reflective surface. The first reflective surface has a convex cylindrical shape with a projected parabolic profile along the non-powered direction which is configured to reflect the light beam from the light source and which defines a focal line. The second reflective surface has a concave cylindrical shape with a projected elliptical profile which is configured to reflect the light beam from the first reflective surface and which defines first and second focal lines. The focal line of the first reflective surface is coincident with the first focal line of the second reflective surface. The first and second focal lines of the second reflective surface may be a same line in which case the elliptical curvature is a projected spherical profile. Other embodiments, aspects and features are also disclosed.08-30-2012
20110170090ILLUMINATION SYSTEM FOR OPTICAL INSPECTION - Apparatus for generating optical radiation includes a laser, which is configured to operate in multiple transverse modes simultaneously so as to generate an input beam, which is characterized by a first speckle contrast. The transverse modes of the input beam are optically mixed so as to generate an output beam have a second speckle contrast, which is substantially less than the first speckle contrast.07-14-2011
20090040511SYSTEMS, CIRCUITS AND METHODS FOR EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM BY AVOIDING DETECTOR SATURATION - Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. The step of detecting may include monitoring an anode current of the PMT detector, and detecting features, defects or light scattering properties of the specimen using the anode current until the anode current reaches a predetermined threshold. Thereafter, the method may use a dynode current of the PMT for detecting the features, defects or light scattering properties of the specimen.02-12-2009
20090091748Edge flaw detection device - An edge flaw detection device includes an elliptical mirror having a mirror surface on the inside thereof and having a cutout that allows an object to be inserted therethrough formed at the apex thereof, a light-emitting unit that radiates coherent light toward an edge of the object arranged in the vicinity of a first focal position of the elliptical mirror, a photo detector that is arranged in a second focal position of the elliptical mirror, and a light-shielding member that shields low-order diffracted light that is reflected regularly. The light-emitting unit is moved in the thickness direction of the object by a moving member so that the light-emitting unit can radiate the coherent light in a different radiation range in the thickness direction at the edge of the object.04-09-2009
20090091747Edge flaw detection device - An edge flaw detection device includes an elliptical mirror having an inner mirror surface, with a cut-out formed in the vertex portion to enable insertion of an object; a light-emitting portion which radiates coherent light toward an edge of the object, the edge of the object being positioned in the vicinity of a first focal position of the elliptical mirror; an optical detector positioned at a second focal position of the elliptical mirror; and a light-blocking member which blocks lower-order diffracted light which is regularly reflected. The light-emitting portion is capable of radiating coherent light at different wavelengths.04-09-2009
20120194807FLAW INSPECTING METHOD AND DEVICE THEREFOR - In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (08-02-2012
20090237653DEVICE FOR RECORDING A NUMBER OF IMAGES OF DISK-SHAPED OBJECTS - A device for recording a number of images of disk-shaped objects (09-24-2009
20130215419OPTICAL INSPECTION DEVICE - An optical inspection device comprises a first set of rollers, wherein each roller comprises a wheel, and the wheels of the first set of rollers are spaced apart by a first distance in a first direction; a second set of rollers, wherein each roller comprises a wheel, and the wheels of the second set of rollers are spaced apart by the first distance in the first direction; a scanning unit disposed between the first set of rollers and the second set of rollers; and a first image sensor configured to capture optical lights in a first region, wherein the first region is on a side of the first set of rollers opposite the scanning unit.08-22-2013
20120236296METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.09-20-2012
20090122303Apparatus And Method For Inspecting Defects - A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.05-14-2009
20110279816PHOTOMASK MOUNTING/HOUSING DEVICE AND RESIST INSPECTION METHOD AND RESIST INSPECTION APPARATUS USING SAME - A resist inspection apparatus is provided which has a configuration in which a reticle is separated from a pellicle. A reticle cassette is made up of two pieces of plate members. A hollowed portion with a shape allowing the reticle to be inserted into the plate member. Another hollowed portion having a shape being slightly larger than that of the resist of the reticle is formed on the plate member. In the circumference of the hollowed portion is placed a pellicle frame on which a protective film is formed in a stretched manner. In the concave portion is housed in the reticle with a resist on the reticle directed toward the hollowed portion. The reticle is put in sealed space.11-17-2011
20110090490Inspection apparatus using a chip - An inspection apparatus using a chip includes a rotor that holds a chip; a measurement room in which the rotor is provided and a through hole is formed; a light source that emits light for measurement to the chip through the through hole; a light measurement unit that detects the light from the chip, a rotation drive mechanism that rotates the rotor; and a cover member capable of covering or uncovering an opening portion.04-21-2011
20110299069METHOD OF INSPECTING WAFER - Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.12-08-2011
20100201975DISK SURFACE INSPECTION APPARATUS, INSPECTION SYSTEM THEREOF, AND INSPECTION METHOD THEREOF - The invention has a function of preparing a data base for a relation between a defect shape and an arrangement for the optical system capable of detecting the shape at high sensitivity and automatically adjusting the arrangement for the optical system. As the method of preparing the data base, a method of using optical simulation or an experimental method of using a sample having an optical shape is applied. A pinhole position and a beam size are adjusted automatically so as to attain the optimal arrangement for the optical system to an inputted defect shape based on the data base.08-12-2010
20100201974SURFACE MEASUREMENT APPARATUS AND SURFACE MEASUREMENT METHOD - There are provided a surface measurement apparatus and a surface measurement method. A surface measurement apparatus according to an aspect of the invention may include: a stage receiving a target object and causing linear and rotational movements of the target object; a light source irradiating a beam onto the target object and rotating relative to the stage; and a reflected-beam detection unit detecting a beam reflected from the target object.08-12-2010
20100201973APPARATUS FOR CHARACTERIZING A SURFACE STRUCTURE - An apparatus for optically characterising a surface structure of a board or sheet, includes a light source arranged at a first side of a said board and adapted to illuminate a first area of a surface of said board or sheet by emitting towards said surface a collimated light beam at a first, oblique angle of incidence relative to said surface of said board or sheet. A light receiver arranged at a second side of a said board or sheet, said second side being substantially opposite to said first side in respect of said board or sheet, is adapted to receive at least a part of said collimated light beam being reflected off said first area of said surface of said board or sheet, and includes a spatial detector adapted to receive by different parts of said detector light of said collimated light beam being reflected off respective, different parts of said first area.08-12-2010
20110285987Installation for the quality control of a surface of an object - This installation includes a support for the object, a panel having a fringe pattern alternating pale and dark lines, the pattern having a first series of parallel fringes extending in a first direction and at a first pitch, and a second series of parallel fringes extending in a second direction perpendicular to the first direction and at a second pitch, illuminating means arranged to illuminate the fringe pattern, at least one imaging capturing means to capture an image of the pattern reflected or transmitted by the surface of the object, and where at least one of the support, the panel and the capturing means is mobile between a plurality of positions, the movement between two successive positions of each chosen element being designed so as to produce a predetermined phase shift between two images of the pattern reflected or transmitted by said surface.11-24-2011
20090161094WAFER BEVEL INSPECTION MECHANISM - An imaging sensor for capturing images of the beveled surface of a wafer edge is herein disclosed. The imaging sensor is aligned with the edge of a wafer to maximize the area of the bevel that is encompassed by the depth of view of the imaging sensor. One or more sensors may be used to capture images of the wafer edge.06-25-2009
20090002694Optical Inspection of Surfaces Open to Different Directions in a Piece of Material - The invention relates to a device for optical inspection of the open surfaces (01-01-2009
20100033715Method and Apparatus for the Examination of An Object - The invention relates to a method and an apparatus for examining an object, particularly in terms of the surface morphology thereof. Said apparatus comprises a transportable housing which can be placed, especially by hand, above the surface segment of the object that is to be examined, and at least three light sources, the optical beam axes of which extend at a slanted angle of incidence relative to the surface segment that is to be examined. The light sources are disposed inside the housing and can illuminate the surface segment that is to be examined through an illumination aperture in the housing. The apparatus further comprises at least one light sensor for detecting the light reflected on the surface segment that is to be examined and a control and evaluation unit which is connected to the light sources and the light sensor. The light sources are arranged such that the optical beam axes thereof extend on different, non-parallel reference planes.02-11-2010
20090195775Defect Inspection Method - A method for inspecting a defect of a surface of a sample includes irradiating a laser beam on the sample surface a plurality of times so that at least part of an illumination field of the laser beam on the sample surface illuminates a first area of the sample surface each of the plurality of times, detecting a plurality of scattered light rays from the first area caused by the plurality of times of irradiations, correcting errors of detection timings for the plurality of detected scattered light rays, correcting at least one of adding and averaging the plurality of scattered light rays, determining a defect on the sample surface based on a calculation result in accordance with the at least one of the adding and averaging.08-06-2009
20090097018Surface inspection apparatus - A surface inspection apparatus for observing an edge portion of an object to be inspected includes an illumination device that irradiates an illumination light to the edge portion; and an observation device that forms an image of an observation region of the edge portion illuminated with the illumination light. The illumination device emits a first irradiation beam and a second irradiation beam as the illumination light. The first irradiation beam is incident at approximately right angles to the edge portion for compensating brightness of the image and the second irradiation beam is obliquely incident laterally to the observation region of the edge portion for generating a shadow depending on a surface state of the observation region.04-16-2009
20090153848APPARATUS OF INSPECTING DEFECT IN SEMICONDUCTOR AND METHOD OF THE SAME - When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.06-18-2009
20080309928Automatic Optical Inspection Device, Chip Sorting Apparatus and Method - An automatic optical inspection device for inspecting the surface defects of integrated circuits is disclosed in this invention. The automatic optical inspection device includes a tray transporting device which transports a tray carrying at least one integrated circuit and having at least one clip area, a press mechanism for fixing the tray to the tray transporting device by clamping the clip area of the tray, and an image capture device for capturing an image of one surface of the integrated circuit. The surface defects of the integrated circuit can be found by analyzing the image. Chip sorting apparatus and method are also disclosed in this invention. The chip sorting apparatus includes a pick-and-place head which picks a chip on a wafer and places the chip on a tray; and an image capture device which is disposed for examining the chip surface of the chip so as to find the surface defects of the chip. The method includes transferring a chip on a wafer to a tray by a pick-and-place head; and examining the chip surface of the chip by an image capture device.12-18-2008
20090141269Defect Inspection Method And System - An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably.06-04-2009
20080291436Defect inspection system - A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 11-27-2008
20090207405DEFECT INSPECTING APPARATUS - A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.08-20-2009
20130021601ABNORMAL MEASUREMENT DETECTION DEVICE AND METHOD FOR INFRARED RADIATION THERMOMETER - A technique for an infrared radiation thermometer used for theiniography that detects measurement abnormality of an infrared radiation thermometer and estimates the causes of the measurement abnormality such as contamination of an objective lens and a malfunction in a mechanism section of the infrared radiation thermometer.01-24-2013
20130021600IMAGING AN IMPRINTED SUBSTRATE ON A PRINTING PRESS - Systems and methods for imaging an imprinted substrate on a printing press is provided. One method comprises sensing light reflected by the substrate using a contact image sensor to produce data representative of the imprinted substrate. The substrate has been imprinted with different colors at a plurality of printing units of the printing press. Each printing unit comprises a plate cylinder. The data representative of the imprinted substrate is output by the contact image sensor as analog voltage signals. The method further comprises receiving the analog voltage signals from the contact image sensor at a sensor interface circuit and converting the analog voltage signals to digital signals using an analog-to-digital converter of the sensor interface circuit. The method further comprises processing the digital signals using the sensor interface circuit to produce corrected digital signals and storing data based on the corrected digital signals in a memory.01-24-2013
20090147249BELT INSPECTING APPARATUS - A belt inspecting apparatus applies illuminating light beams (R G. B) through light guides to a flat inner portion, a flat outer portion, flat side portions, and curved portions of a metal belt. The illuminating light beams, which are reflected by the metal belt, are guided through the light guides to color cameras, which detect the illuminating light beams as image information. A surface state decision unit compares the detected image information with normal image information in order to determine whether the metal belt contains flaws therein or not.06-11-2009
20090147248MACRO INSPECTION APPARATUS AND MICROSCOPIC INSPECTION METHOD - The invention provides a macro inspection apparatus including: a stage on which an inspection object is placed; a light source that irradiates light on an upper surface of the inspection object from an angular direction arbitrarily selected relative to the upper surface of the inspection object; and a line sensor which is placed in an angular direction selected relative to the upper surface of the inspection object so that an optical axis thereof corresponds with an edge of the upper surface area irradiated by the light source and which receives reflected light from the edge of the upper surface area of the inspection object.06-11-2009
20090147246OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus the useful life of each plane mirror can be prolonged without displacing the optical axis.06-11-2009
20090296081Metrology Tool, System Comprising a Lithographic Apparatus and a Metrology Tool, and a Method for Determining a Parameter of a Substrate - A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table, a sensor, a displacement system, a balance mass, and a bearing. The substrate table is constructed and arranged to hold the substrate. The sensor is constructed and arranged to measure a parameter of the substrate. The displacement system is configured to displace the substrate table or the sensor with respect to the other in a first direction. The bearing is configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.12-03-2009
20090284736Apparatus and Methods for Packaging Electronic Devices for Optical Testing - Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.11-19-2009
20090296080METHOD AND APPARATUS FOR MEASURING DEFORMATION OF LAMINATED BODY - There is provided a method of measuring deformation of a laminated body, the method including: laminating and pressurizing a plurality of green sheets each having a plurality of inner electrodes arranged therein to form a laminated body having a plurality of unit chips arranged therein; marking location information of each of the unit chips on an XY plane of the laminated body on a surface of the unit chip; cutting the laminated body into the plurality of unit chips; measuring a deformation level of each of the cut unit chips; and storing the deformation level measured from the each of the cut unit chips to correspond to the location information of the unit chip.12-03-2009
20110205534Defect Inspection Apparatus and Its Method - A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.08-25-2011
20110141461Surface Inspection Method and Surface Inspection Apparatus - Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.06-16-2011
20080278716IN-PROCESS VISION DETECTION OF FLAWS AND FOD BY BACK FIELD ILLUMINATION - A flaw and foreign object debris (FOD) detection system (11-13-2008
20080239301Visual inspection apparatus - A visual inspection apparatus includes an upper illuminator, a lower illuminator, a side illuminator, and a pair of inclined illuminators, which illuminate the peripheral edge of a wafer, and illuminates the peripheral edge of the wafer brightly. A gap is formed in the upper illuminator and illumination light of an epi-illumination portion is injected through the gap. The illumination light of the epi-illumination portion is refracted and reflected by a first mirror to illuminate the peripheral edge of the wafer. The illumination position is changed by moving second mirrors together as needed. An image of the peripheral edge is acquired in an imaging portion disposed at the same axis as the epi-illumination portion.10-02-2008
20080285020DEVICE HAVING A FIELD MIRROR FOR OPTICALLY TESTING A SURFACE - The invention generally relates to a compact, inexpensive-to-manufacture device consisting of few components for optically testing a surface. The zone on the surface that is to be investigated is illuminated by a semitransparent mirror and an aspheric field mirror, employing a telecentric optical train, and at least part of the light reflected or scattered by the surface is imaged onto the entrance pupil of the lens of an electronic camera by the field mirror, via the semitransparent mirror. Images recorded by the camera are analyzed using known image-processing methods.11-20-2008
20090190123METHOD AND APPARATUS FOR DETECTING DEFECTS ON A DISK SURFACE - The present invention relates to an apparatus for detecting defects on a disk surface which projects light on the disk surface by a light transmitting system, receives specula reflection light and scattered light by a light receiving system, exposes defects by performing a two-dimensional frequency filter process on a signal, and performs a defect determination process to extract a linear-shaped isolative defect candidate. Next, the present invention performs a periodicity determination process to classify and detect the periodically generated linear and circular arc defects and the isolatively generated linear and circular arc defects.07-30-2009
20090091749Multi mode inspection method and apparatus - An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.04-09-2009
20090161095DEFECT INSPECTION SYSTEM - In a defect inspection system using a plurality of detectors such as an upright detector and an oblique detector, if illumination light and wafer height are adjusted to the detection field of view of one detector, a defocused image is detected by other remaining detectors, resulting in degradation of the detection sensitivity. The present invention solves this problem.06-25-2009
20080316473Device and Method for Scanning Pieces of Solid Wood - A device for scanning pieces of solid wood has a pusher movable across a length of a piece of solid wood and at least one scanning unit mounted on the pusher. At least one side of the piece of solid wood is scanned by the at least one scanning unit as the at least one scanning unit moves together with the pusher. The at least one scanning unit has at least one camera with which the piece of solid wood is scanned. The at least one camera is adjustably mounted on the pusher.12-25-2008
20120069329SURFACE INSPECTION APPARATUS AND METHOD THEREOF - A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.03-22-2012
20090185177Apparatus and method for the inspection of the surface of a component - An apparatus for inspection of a surface of a component includes a probing device (07-23-2009
20090185176Diffractive method for control of piston error in coherent phased arrays - A high-power laser system includes a laser master oscillator, a plurality of fiber laser amplifiers producing intermediate output beamlets, a combiner for combining the intermediate beamlets into a combined output beam, and a piston error controller for minimizing errors related to beam combination that may degrade the quality of the combined output beam. A piston error controller processes a sample of the combined output beam using a Diffractive Optical Element to isolate a signal representing the total piston error of the combined beam. The controller uses amplitude modulation based on Hadamard code words to tag each non-reference intermediate beamlet with a unique code sequence orthogonal to those used for the other beamlets. For each intermediate beamlet, the associated piston error contribution is recovered using a Hadamard decoder. A very small phase dither is also introduced to allow the sign or direction of the piston error to be recovered. The decoded piston error contribution is processed by a cascaded product detector unit to derive a piston error control signal, which is provided to a phase modulator to thereby adjust the phase of a beamlet and minimize the piston error contributed thereby.07-23-2009
20090257052Device for inspecting the quality of a surface - This device for inspecting surfaces by deflectometry comprises: 10-15-2009
20090015823INSPECTION APPARATUS AND METHOD - An inspection apparatus includes a captured image acquiring unit configured to acquire a captured image that is acquired by shooting an inspection target, an acquiring unit configured to acquire from the captured image a first image region and a second image region whose intensity distributions of reflected light with respect to an incident angle of illumination light emitted to the inspection target are different, and an image processing unit configured to perform image processing for performing different surface inspections on the first image region and the second image region respectively.01-15-2009
20090079971METHOD FOR DETERMINING THE SURFACE QUALITY OF A SUBSTRATE AND ASSOCIATED MACHINE FOR CONVERTING THE SUBSTRATE - A method for determining the surface quality of a substrate passing from an initial state into a converted state during a conversion process including the steps of acquiring first information relating to surface defects detected on the initial substrate, acquiring second information relating to surface defects detected on the converted substrate, of processing the first information and the second information, and of classifying the converted substrate as a function of the first acquired information relating to the surface defects detected on the initial substrate and as a function of the second acquired information relating to the surface defects detected on the converted substrate.03-26-2009
20090079972Method and device for the detection of surface defects of a component - A method serves the detection of surface defects of a component. The surface of the component (03-26-2009
20090079973METHOD AND APPARATUS FOR INSPECTING FOREIGN PARTICLE DEFECTS - The invention relates to a device production process for forming a circuit pattern on a substrate such as semiconductor device. To enable a stable inspection of a minute foreign particle and a pattern defect occurring in manufacture of a device at a high speed and with a high sensitivity, an object to be inspected on which a transparent film is formed, is irradiated with a beam which is emitted from an illuminator whose illumination direction and illumination angle are selected from a plurality of choices to be optimum, so that scattered reflected light from a minute foreign particle defect on the object or the transparent film is effectively detected by eliminating a noise from the pattern formed on the object, and a detection optical system is optimized by evaluating and adjusting, with an image forming performance checker, an image forming performance of the detection optical system included in an inspecting apparatus.03-26-2009
20090086196Edge inspection apparatus - An edge inspection apparatus includes: an illumination means 04-02-2009
20090097017OPTICAL INSPECTION METHODS - Inspection methods. A method includes adhering an optical blocking layer directly onto and in direct mechanical contact with a semiconductor process wafer, the blocking layer being substantially opaque to a range of wavelengths of light; applying at least one layer over the blocking layer; and inspecting optically at least one wavelength at least one inspection area, the blocking layer extending substantially throughout the inspection area. An inspection method including adhering an optical absorbing layer to a semiconductor process wafer, where the absorbing layer is configured to substantially absorb a range of wavelengths of light; applying at least one layer over the absorbing layer; and inspecting optically at least one wavelength at least one inspection area of the process wafer. A manufacturing method including ascertaining if a defect is present within a photoresist layer, and changing a semiconductor manufacturing process to prevent the defect, if the defect is present.04-16-2009
20120194806APPARATUS FOR OPTICAL INSPECTION - An apparatus for optical inspection comprises a platform extending in a first direction, a transmitting unit for transporting at least one carrier in the first direction from an input port to an output port thereof, each of the at least one carrier to support one of at least one object to be inspected, a first detector disposed above the platform and extending in a second direction orthogonal to the first direction for inspecting the at least one object on the at least one carrier, the first detector including a first scanner extending in the second direction between the input port and the output port, and a first roller set between the first scanner and the input port to apply force onto a surface of each of the at least one object.08-02-2012
20090103078SURFACE INSPECTION APPARATUS AND METHOD THEREOF - An apparatus for detecting defects, including: a table unit which mounts a specimen to be inspected having a linearly moving stage and a rotationally moving stage; a first illumination optical unit which illuminates an inspection region of a surface of the specimen from a normal direction or in the vicinity of the normal direction while the specimen is rotating by the rotationally moving stage and moving in one direction by the linearly moving stage; a second illumination optical unit which illuminates the inspection region from a first elevation angle toward the inspection region while the specimen is rotating and moving; a first detection optical unit which detects light reflected from the inspection region by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors arranged in plural portions of a second elevation angle toward the inspection region; a second detection optical unit which detects light reflected from the inspection region by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors arranged in plural portions of a third elevation angle toward the inspection region; and a signal processor which processes signals outputted from the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit, wherein the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit are photomultipliers, and the signal processor processes the signals which are selected from the signals outputted from the plural detectors arranged in plural portions of the second elevation angle and the plural detectors arranged in plural portions of the third elevation angle.04-23-2009
20090225307WAFER INSPECTION USING SHORT-PULSED CONTINUOUS BROADBAND ILLUMINATION - An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.09-10-2009
20090244529Appearance Inspection Apparatus - An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.10-01-2009
20090244527SYSTEM FOR INSPECTING DEFECTS OF PANEL DEVICE - System for inspecting defects of panel device includes a to-be-inspected device, a platform for holding the to-be-inspected device, a power unit, and a light source apparatus. The light source apparatus is controlled by the power unit to provide an inspection light to the to-be-inspected device for inspecting whether or not having defects. The light source apparatus includes a cathode structure, an anode structure, a fluorescent layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure, for inducing the cathode to emit electrons uniformly. The low-pressure gas layer has an electron mean free path, allowing at least enough electrons to directly hit the fluorescent layer under an operating voltage.10-01-2009
20090147247Defect detecting apparatus and defect detecting method - A defect inspecting apparatus inspects defects of a sample having a pattern formed on the surface. The defect inspecting apparatus is provided with a stage which has a sample placed thereon and linearly moves and turns; a light source; an illuminating optical system, which selects a discretionary wavelength region from the light source and epi-illuminates the sample surface through a polarizer and an objective lens; a detecting optical system, which obtains a pupil image, by passing through reflection light applied by the illuminating optical system from the surface of the sample through the objective lens and an analyzer which satisfies the cross-nichols conditions with the polarizer; and a detecting section which detects defects of the sample by comparing the obtained pupil image with a previously stored pupil image. Conformity of the pattern on a substrate to be inspected can be judged in a short time.06-11-2009
20100149527System and Method for Controlling a Beam Source in a Workpiece Surface Inspection System - A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable scan speed beam scanning subsystem, preferably using an acousto-optic deflector, with beam compensation, so that variable scanning speeds can be achieved. Also included are methods and systems for improving the signal to noise ratio by use of scatter reducing complements, and a system and method for selectively and repeatedly scanning a region of interest on the surface in order to provide additional observations of the region of interest.06-17-2010
20120194808Appearance Inspection Apparatus - An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.08-02-2012
20080259323RETICLE DEFECT INSPECTION APPARATUS AND RETICLE DEFECT INSPECTION METHOD - A reticle defect inspection apparatus that controls damage of a reticle by irradiation with an inspection light when the reticle is caused to be at rest is provided. The reticle defect inspection apparatus is a reticle defect inspection apparatus for inspecting for defects on a reticle using a pattern image obtained by irradiating the reticle on which a pattern is formed with light. The reticle defect inspection apparatus has a dose monitoring part for measuring a dose of the light to the reticle, a comparing part for comparing, after calculating accumulated irradiation from the dose measured by the dose monitoring part, the accumulated irradiation with a preset threshold, and a stop mechanism for stopping irradiation of the reticle with the light when, as a result of the comparison, the accumulated irradiation exceeds the threshold.10-23-2008
20100188655TDI Sensor Modules With Localized Driving And Signal Processing Circuitry For High Speed Inspection - An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.07-29-2010
20100238433METHODS AND SYSTEMS FOR INSPECTION OF A SPECIMEN USING DIFFERENT INSPECTION PARAMETERS - Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.09-23-2010
20100225903PATTERN DEFECT INSPECTION APPARATUS AND METHOD - A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.09-09-2010
20110058160DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD - Disclosed herein is a defect inspection apparatus including: a light source for emitting laser light; a mirror group for splitting the wave surface of incident laser light emitted by the light source into a plurality of component wave surfaces, arranging the component wave surfaces to form an array oriented in one direction and aligning the component wave surfaces to form a single wave surface after propagating the laser light through a moving object of measurement; an interferometer for splitting the single wave surface into two partial wave surfaces to create an interference stripe; an imaging section for taking an image of the interference stripe created by the interferometer; and an analysis section for detecting a defect existing on the surface of the moving object of measurement on the basis of changes of the image, which has been taken as the image of the interference stripe, with the lapse of time.03-10-2011
20090073429ILLUMINATOR FOR DARKFIELD INSPECTION - Light from a single source is divided among several illumination arms, each of which directs light via a multimode fiber bundle from the source to the wafer location. The arms are arranged circumferentially around a common illumination region, so that the region is illuminated from several directions. For each arm, light exiting the fiber bundle enters a turning prism, reflects off the hypotenuse of the prism, and is diverged in one dimension by a negative cylindrical surface on the exiting face of the prism. The beam then reflects off an anamorphic mirror and propagates to the illumination region on the wafer. The beam has an asymmetric footprint, so that it illuminates a nearly circular region of the wafer when viewed at normal incidence. The fiber bundle is at the front focal plane in the meridional dimension. The illumination region is at the rear focal plane in both dimensions.03-19-2009
20090161096Simultaneous Multi-Spot Inspection And Imaging - A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. For patterned surface inspection, a cross-shaped filter is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface. In another embodiment, different portions of the same objective may be used for focusing the illumination beams onto the surface and for collecting the scattered radiation from the illuminated spots simultaneously. In another embodiment, a one-dimensional array of illumination beams are directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.06-25-2009
20090109430Device for Inspecting a Surface - A device that is usable to inspect the surface of a material uses an inspection system which includes an optical unit. That optical unit can register the light which is reflected by the surface to be inspected. An illumination system, that uses at least two light sources, provides the light. The optical unit and the illumination system are connected to a control unit. The at least two light sources are arranged spaced at a distance from each other and both emit light directed to a recording region of the optical unit. The optical unit is oriented toward the surface to be inspected and at least one of the illumination light sources can be subdivided into several individual light sources. The control unit controls at least two of the illumination system light sources that are arranged at a distance from each other or the respective individual light sources of at least one of the illumination sources both selectively and independently of each other. The recording region of the optical unit lies on a displacement plane of the surface to be inspected with that surface being displaced through the recording region in relation to the inspection system. The distance between the light sources of the illumination system extends in the displacement direction of the surface to be inspected. The individual light sources of at least one of the sources are arranged transversely to the displacement direction of the surface to be inspected.04-30-2009
20100309461METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAFER BY USING LASER SCATTERING METHOD - A semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out, and a judgment as to whether a semiconductor wafer is a non-defective wafer is made visually based on a haze map of the semiconductor wafer subjected to the sorting. Moreover, a semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out. Then, from the semiconductor wafers subjected to the sorting, a semiconductor wafer whose in-plane standard deviation and in-plane average value of the haze signals in a wafer plane have a specific relationship is sorted out, and this semiconductor wafer is judged to be a non-defective wafer. In this way, a method for judging whether a semiconductor wafer is a non-defective wafer or a defective wafer, the method that can make a judgment more uniform and accurate without dependence on the difference in the S/N ratio between inspection apparatuses using a laser scattering method, is provided.12-09-2010
20100315625METHODS FOR DEPTH PROFILING IN SEMICONDUCTORS USING MODULATED OPTICAL REFLECTANCE TECHNOLOGY - Methods of obtaining dopant and damage depth profile information are disclosed using modulated optical reflectivity (MOR) measurements. In one aspect, the depth profile is constructed using information obtained from various measurements such as the junction depth, junction abruptness and dopant concentration. In another aspect, a full theoretical model is developed. Actual measurements are fed to the model. Using an iterative approach, the actual measurements are compared to theoretical measurements calculated from the model to determine the actual depth profile.12-16-2010
20100315626OPTICAL APPARATUS FOR DEFECT INSPECTION - An optical apparatus for defect inspection having an illuminating optical system for irradiating illumination light beams on the surface of a specimen to form a beam spot and a detection optical system for detecting a reflection light ray originating from the beam spot comprises a storage unit in which the position and size of a standard particle of known size on a specimen for correction are stored in advance, a correction processing section which, when the correction specimen is used as an inspection target, correlates a detected scattering light quantity from the standard particle with the known size of standard particle stored at a corresponding position in the storage unit to prepare a correlation between the scattering light quantity and a true value, and a signal processing section which, when an inspection wafer is used as an inspection target, converts a detected scattering light quantity into a defect dimension.12-16-2010
20110001962METHOD FOR DEFECT DETERMINATION IN FINE CONCAVE-CONVEX PATTERN AND METHOD FOR DEFECT DETERMINATION ON PATTERNED MEDIUM - In the inspection of a defect in a fine concave-convex pattern, a spectral waveform of a detection area of an inspection object is detected, area determination as to which area section determined by a pattern type of the inspection object the detection area belongs to is performed, a feature calculation equation and a determination index value which correspond to a determined area section and vary according to defect type is selected, feature calculation on the spectral waveform data in accordance with the selected feature calculation equation is performed, and a calculated feature value and the selected determination index value are compared to perform determination processing according to defect type.01-06-2011
20110242529METHODS FOR VISUALLY INSPECTING INTERFEROMETRIC MODULATORS FOR DEFECTS - A method is provided for visual inspection of an array of interferometric modulators in various driven states. This method may include driving multiple columns or rows of interferometric modulators via a single test pad or test lead, such as test pad, and then observing the array for discrepancies between the expected optical output and the actual optical output of the array. This method may particularly include, for example, driving a set of non-adjacent rows or columns to a state different from the intervening rows or columns and then observing the optical output of the array.10-06-2011
20110128534Defect Inspection Method - A method and apparatus for inspecting a defect of a surface of a sample in which a laser beam is irradiated on a sample surface so that at least a part of an illumination field of the laser beam illuminates a first area of the sample surface, a plurality of scattered light rays from the first area caused by the irradiation in the irradiating is detected, errors of inclination of an illumination apparatus and a sensor for the plurality of scattered light rays detected are corrected, the plurality of scattered light rays corrected is at least one of added and averaged, a defect on the sample surface based on the plurality of scattered light rays in accordance with the correcting of errors of inclination of the illumination apparatus and the sensor is determined.06-02-2011
20110043795Inspection method and apparatus - In an aspect, an inspection method for detecting the presence or absence of a defect on an object, the object comprising a recess having a physical depth, is disclosed. The method includes directing radiation at the object, the radiation having a wavelength that is substantially equal to twice an optical depth of the recess, detecting radiation that is re-directed by the object or a defect on the object, and determining the presence or absence of a defect from the re-directed radiation.02-24-2011
20110043796OPTICAL INPSECTION SYSTEM AND METHOD - An inspection system includes imaging optics for imaging an object plane into an image plane. The imaging optics include an objective lens having positive optical power, a first lens group having negative optical power, and a second lens group having positive optical power. The optical elements are arranged along a common optical axis with a pupil plane of the imaging optics located between the first lens group and the second lens group.02-24-2011
20090033924Defects Inspecting Apparatus And Defects Inspecting Method - An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.02-05-2009
20110128533SURFACE-CHECK EQUIPMENT - A surface-check equipment has a frame, at least one lamp fastened to the frame and at least one dark box fastened to the frame. The dark box has a case with a working side and a dark chamber. The working side has a slot defined through the working side and allowing light to enter the dark box via the slot. The dark chamber communicates with the slot and has an incident reflector, at least one transmitting reflector, a refractor assembly, at least one terminal reflector, and a sensor corresponding to each other and allowing light from the object via the slot to be reflected and refracted and received by the sensor. Therefore, the dark box has simple and inexpensive elements, so the surface-check equipment is easily and quickly assembled and has decreased cost and size.06-02-2011
20110242528OPTICAL IMAGING SYSTEM WITH CATOPTRIC OBJECTIVE; BROADBAND OBJECTIVE WITH MIRROR; AND REFRACTIVE LENSES AND BROADBAND OPTICAL IMAGING SYSTEM HAVING TWO OR MORE IMAGING PATHS - An optical system may include an objective having at least four mirrors including an outermost mirror with aspect ratio <20:1 and focusing optics including a refractive optical element. The objective provides imaging at numerical aperture >0.7, central obscuration <35% in pupil. An objective may have two or more mirrors, one with a refractive module that seals off an outermost mirror's central opening. A broad band imaging system may include one objective and two or more imaging paths that provide imaging at numerical aperture >0.7 and field of view >0.8 mm. An optical imaging system may comprise an objective and two or more imaging paths. The imaging paths may provide two or more simultaneous broadband images of a sample in two or more modes. The modes may have different illumination and/or collection pupil apertures or different pixel sizes at the sample.10-06-2011
20100002227INSPECTION METHOD AND INSPECTION APPARATUS - The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.01-07-2010
20110075133METHOD AND DEVICE FOR INSPECTING DEFECTS ON BOTH SURFACES OF MAGNETIC DISK - A device that is capable of simultaneously inspecting both sides of surfaces of a magnetic disk to detect defects thereon includes a front-side defect detecting section and a back-side defect detecting section each of which optically detect a scratch and a defect that are present on the front and back surfaces of the magnetic disk, to improve a throughput for inspection. The back-side defect detecting section has an optical path changing section that reflects a laser beam emitted by a laser light source to change an optical path thereof and thereby to direct the laser beam toward the back surface of the magnetic disk and that reflects scattered light that has been collected by a Fresnel lens to change an optical path thereof and thereby to direct the scattered light toward a first photoelectric converter.03-31-2011
20110075134Defect Inspection Method and System - An apparatus for inspecting a specimen includes a first illumination unit having a laser light source and a first optical component for illuminating a specimen on which patterns are formed with a laser from a first elevation angle direction, a second illuminating unit having a light source and a second optical component for illuminating the specimen from a second elevation angle direction which is greater than the first elevation angle, a first detection optical unit which detects light from the specimen illuminated by the first illumination unit, a second detection optical unit which detects light from the specimen illuminated by the second illumination unit, and a signal processing unit which processes signals output from the first detector to detect defects in a first area on the specimen and processes signals output from the second detector to detect defects in a second area on the specimen.03-31-2011
20110255081APPARATUS AND METHODS FOR SETTING UP OPTICAL INSPECTION PARAMETERS - Provided are novel methods and systems for setting up ranges of optical inspection parameters. These ranges may be later used for inspection of photovoltaic cells for discoloration, for example. A set of values corresponding to an inspection parameter, such as hue, saturation, and intensity, is obtained from a set-up image. The image includes multiple set-up areas, e.g., a defined group of pixels, wherein each set-up area is assigned a corresponding value in the set. A test image is then constructed from multiple test areas that are also associated with the values in the set. Each test area is assigned a color from a set of user defined colors based on the corresponding value and user defined ranges. A user interface includes both a range diagram and test image, which are used to adjust the ranges in the diagram that result in modification of the test image. Adjusting is repeated until the test image meets predetermined criteria.10-20-2011
20110188032Far-field superlensing - An apparatus for creating a sub-wavelength image in the farfield. In an example embodiment, the apparatus includes a far-field superlens that is adapted to generate a sub-wavelength image or a sub-diffraction-limited image at a far field distance from a negative-index material included in the superlens. The example far-field superlens includes a positive-index material and an adjacent positive-index material. The negative-index material has an output aperture at a first surface. A second surface or interface is positioned at a far field distance from the negative-index material such that a cavity or gap is formed between the second surface and the first surface, wherein the second surface represents an imaging surface. The gap may be filled with a dielectric material or may include a vacuum or air. In a more specific embodiment, the superlens further includes a first mechanism for producing one or more sub-diffraction-limited beam features at a far field distance from the negative-index layer via the cavity in which propagating electromagnetic energy from the incident electromagnetic energy propagates.08-04-2011
20100321677SURFACE INSPECTING APPARATUS AND SURFACE INSPECTING METHOD - There is provided a surface inspecting apparatus capable of performing inspection at higher speed and with higher accuracy. A surface inspecting apparatus (12-23-2010
20110051129Inspection Apparatus, Lithographic Apparatus and Method of Measuring a Property of a Substrate - Scatterometers making use of a Glan-laser polarizer are described. The use of Glan-laser polarizers as described generally results in an improved extinction ratio and use over a greater range of wavelengths when compared with dielectric polarizers.03-03-2011
20110134418LIGHT SOURCE DEVICE, SURFACE INSPECTING APPARATUS USING THE DEVICE, AND METHOD FOR CALIBRATING SURFACE INSPECTING APPARATUS USING THE DEVICE - A surface inspecting apparatus can inspect a smaller defect by using a PSL of a smaller particle size. However, the particle size of the PSL is restricted. In the conventional surface inspecting apparatus, therefore, no consideration has been taken as to how to inspect the defect of such a small particle size as is not set in the PSL which will be needed in the near future in an inspection of a semiconductor manufacturing step. The invention has a light source device for generating light which simulated at least one of a wavelength, a light intensity, a time-dependent change of the light intensity, and a polarization of light which was scattered, diffracted, or reflected by an inspection object, and the light is inputted to a photodetector of the surface inspecting apparatus. The smaller defect can be inspected.06-09-2011
20120147364CONTAMINATION INSPECTION METHOD AND CONTAMINATION INSPECTION DEVICE - Provided are a contamination inspection method and a contamination inspection device for highly accurately detecting a defect in a wafer, a liquid crystal substrate and media or the like including patterns, for example, a semiconductor device or the like. The first aspect of the present invention is a contamination inspection device comprising: an irradiation optical system for irradiating lights on the inspection target substrate; and a spatial filter for shading diffracted lights form the inspection target substrate. Herein, the spatial filter comprises: a plurality of light shading materials; a control member for changing at least one of parameters selected from a shape, an angle and an interval with respect to the light shading material, and a control unit for controlling the control members.06-14-2012
20090207404System and Method for Surface Inspection of Micro- and Nanomechanical Structures - The system for surface inspection is arranged to detect relative displacement and/or vibration features of a plurality of points of a plurality of elements (08-20-2009
20110080578Method and Its Apparatus For Inspecting Defects - A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.04-07-2011
20100110419Front Quartersphere Scattered Light Analysis - A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing collectors for collecting light scattered from the surface, to greatly improve the measurement capabilities of the system. The light channel assembly has a switchable edge exclusion mask and a reflected light detection system for improved detection of the reflected light.05-06-2010
20100110420Inspecting a Workpiece Using Polarization of Scattered Light - A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable polarization a polarizing relay assembly arranged to selectively permit the scattered light having a selected polarization orientation to pass along a detector optical axis to a light detection unit in the detection subsystem. They system also features a collector output width varying subsystem for varying the width of an output slit in response to changes in the location of the location scanned on the workpiece.05-06-2010
20110149275DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD - A defect inspection device, which inspects defects such as foreign materials existing on a specimen on which a circuit pattern of wiring or the like is formed, is provided with an illumination optical system which illuminates a plurality of different areas the specimen with a plurality of linear shaped beams and an image forming optical system that forms images of the plurality of the illuminated areas on a plurality of detectors, and the detectors are configured to receive a plurality of polarization components substantially at the same time and individually, wherein the polarization components are different from each other and are contained in each of the plurality of the optical images formed by the image forming optical system, thereby detecting a plurality of signals corresponding to the polarization components and carrying out the inspection at high speed under a plurality of optical conditions.06-23-2011
20100026996SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - When measuring an edge region, a photo detector with an angle not influenced by the diffracted light, the diffracted light causing noise, is selected to thereby allow for inspection that minimizes the sensitivity reduction. This allows for the management of foreign matters in the outer peripheral portion, which conventionally could not be measured, and this also eliminates the oversight of critical defects on the wafer, thus leading to reduction of failures of IC.02-04-2010
20120147363SURFACE-DEFECT INSPECTION DEVICE - There is provided a surface-defect inspection device that forms artificial defects on a standard sample. Defects are judged by a foreign material/defect decision mechanism and data about the defects is supplied to a data processing and controlling portion. The data processing and controlling portion calculates the amounts of coordinate deviations between the artificial defects on the standard sample and the detected defects, checks the sensitivity (instrumental sensitivity (luminance, brightness, or the like)), and proceeds to execution of hardware corrections. If the coordinate deviation is less than a certain value, software corrections are carried out. In the case of the software corrections, coordinate corrections are made for the whole standard sample. The amounts of coordinate deviations are computed and checked. If the amounts of coordinate deviations are outside a tolerance, coordinate corrections are made for each region obtained by dividing the standard sample.06-14-2012
20110304848EXAMINING APPARATUS AND EXAMINING METHOD - When examination at a scan speed equal to or higher than the line rate of the sensor such as a TDI sensor is carried out, the line rate of the TDI sensor is asynchronous with the scan speed, and the image is blurred. Therefore, a TDI sensor cannot be used at a scan speed equal to or higher than the line rate of the TDI sensor. This problem has not been considered. To solve the problem, high-speed examination irrespective of the line rate of the TDI sensor is enabled. To control the line rate of the TDI sensor and stage scan speed asynchronously and to solve the problem of the image addition variation due to the charge accumulation of the TDI sensor, the object to be examined is irradiated with thin-line illumination, and only a given pixel line of the TDI sensor is made to receive light scattered by the object to be examined. The aspect ratio of the detection pixel size can be controlled by the speed ratio between the line rate of the TDI sensor and the stage scan speed.12-15-2011
20090051908Surface Particle Counter - A surface particle-counting device where the scanner element and the particle counting element have been combined so to reduce the number of lost particles and increase the overall efficiency of the particle-counting device. By removing the conventional tube that connects the scanner element and the particle counting element accuracy is increased.02-26-2009
20120038910Inspection Apparatus and Method - Ghost reflections in a catadioptric scatterometer objective are excluded from an angle-resolved spectrum measurement by using a partial pupil for illumination and for the measurement excluding the area of the pupil plane that has been illuminated. Ghost reflections are reflected back into same point in the pupil plane. The ghost reflections do not interfere with the signal in the non-illuminated area of the pupil plane. An illumination system provides a beam of electromagnetic radiation to illuminate a first area in an illumination pupil plane of the objective. The objective is arranged as to illuminate the substrate with the beam of electromagnetic radiation. The illumination pupil plane is the back projected image of the pupil plane of the objective and is also imaged into the measurement pupil plane at the back focal plane of the objective, via auxiliary optics. A detector is configured to measure an angle resolved spectrum arising from the illumination of the substrate, in a measurement area of the measurement pupil plane of the objective excluding an area corresponding to the first area.02-16-2012
20090244528BLADE BREAKAGE AND ABRASION DETECTING DEVICE - The present invention provides a blade breakage and abrasion detecting device comprising: a detecting unit including a light-emitting unit which is provided close to a side of a blade to emit a round shape light toward the blade, and a light receiving unit which is provided opposed to the light-emitting unit as sandwiching the blade to receive the round shape light from the light-emitting unit with a round shape light receiving area; a moving device which moves the detecting unit toward a rotation center of the blade; and a control unit which detects a breakage of the blade based on a change of an amount of light received by the light receiving unit of the detecting unit, and calculates an abrasion amount of the blade by accumulating a moving amount obtained by controlling the moving device to moves the detecting unit toward the rotation center of the blade.10-01-2009
20110317156INSPECTION DEVICE FOR DEFECT INSPECTION - The present invention comprises an inspection method for transparent or reflective inspection objects, by using a retro-reflective plate as a convex lens or concave mirror in such a way that defects can be detected in a stable fashion even if the inspection object is curved or if vibration occurs during movement of the inspection object; in which displacement of parallel light passing through or reflected in a measurement field is captured by using changes which occur in an inspection field, namely changes in the density gradient in the case of transmission inspection or in the reflection angle in the case of reflection inspection. The present invention also comprises an inspection device for defect inspection, in which a knife edge is provided, horizontally to the optical axis, on the front surface of a camera lens for collecting the transmitted light or reflected light, in such a way that three-dimensional defect images can be obtained since any light which diverges from the parallel light is blocked with consequent changes in the contrast of the light due to the density gradient in the inspection field at the camera.12-29-2011
20120013898Inspecting a Workpiece Using Polarization of Scattered Light - A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable polarization a polarizing relay assembly arranged to selectively permit the scattered light having a selected polarization orientation to pass along a detector optical axis to a light detection unit in the detection subsystem. The system also features a collector output width varying subsystem for varying the width of an output slit in response to changes in the location of the location scanned on the workpiece.01-19-2012
20110069305INSPECTION DEVICE AND INSPECTING METHOD FOR SPATIAL LIGHT MODULATOR, ILLUMINATION OPTICAL SYSTEM, METHOD FOR ADJUSTING THE ILLUMINATION OPTICAL SYSTEM, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - There is disclosed an inspection device for inspecting a spatial light modulator having a plurality of optical elements arrayed two-dimensionally and controlled individually, said inspection device comprising, a conjugate optical system which is arranged optically downstream the spatial light modulator and which forms a conjugate plane optically conjugate with an array plane where the plurality of optical elements are arrayed, a photodetector having a detection surface arranged on or near the conjugate plane, and an inspection unit which inspects optical characteristics of the plurality of optical elements, based on a result of detection by the photodetector.03-24-2011
20120057154OPTICAL MEASURING SYSTEM WITH MATCHED COLLECTION LENS AND DETECTOR LIGHT GUIDE - An optical surface inspection system provides dark-field detection avoiding ghost images and without capturing, stray, reflected or re-scattered light. The system includes an illumination system that generates an illumination spot on a surface under inspection collecting lens that collects substantially all light scattered from the surface under inspection from the illumination spot. The system also includes a light guide with a first end having a numerical aperture matched to an exit aperture of the collecting lens and a field of view matched to the illumination spot, and a second end coupled to a detector.03-08-2012
20120026489Multi-Spot Illumination for Wafer Inspection - Illumination subsystems for multi-spot wafer inspection are provided.02-02-2012
20120154796MATCHING IMAGING DATA TO FLEXOGRAPHIC PLATE SURFACE - An imaging apparatus for forming an image on a flexible media includes a carriage which moves relative to the flexible media. An optical displacement sensor (ODS) is mounted on the carriage for scanning a surface of the flexible media to form scanned data wherein the scanned data represents the surface of the flexible media. A digital front end is adapted to analyze the scanned data to detect and locate defects on the flexible media. An imaging head mounted on the carriage for writing an image on the flexible media wherein the location of imaging on the flexible media is adjusted to avoid the location of the defects detected on the flexible media.06-21-2012
20090135412Superconducting Wire Inspection Apparatus and Method - An apparatus inspecting a superconducting wire includes: a blue LED emitting light in a direction normal to a front surface of a superconducting wire to illuminate the front surface; a red LED emitting light in a direction forming an angle with the direction normal to the front surface of the superconducting wire to illuminate the front surface; a color line sensor mainly receiving light reflected by the superconducting wire, and mainly receiving light diffused by the superconducting wire; and a computer accumulating and outputting a quantity of light received by the color line sensor. The apparatus can inspect with high sensitivity whether the superconducting wire has a defect or not.05-28-2009
20090135413SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - When detecting light scattered by an object to be inspected by using a pulse laser as a light source, noise increases unless a sampling repletion period of an A/D converter is determined so as to be related to a pulse oscillation repetition period of the light source. (1) The sampling repletion period of the A/D converter is set equal to the pulse oscillation repetition period of the light source or an integer times thereof, and the sampling is synchronized with oscillation of the light source. Or (2) the sampling repletion period of the A/D converter is set equal to a half-integer times the pulse oscillation repetition period of the light source. Even if a ripple component resulting from emission pulses of the light source remains in the scattered light signal supplied to the A/D converter remains, therefore, its influence can be eliminated or reduced.05-28-2009
20110102781OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.05-05-2011
20100245810INSPECTION METHOD BASED ON CAPTURED IMAGE AND INSPECTION DEVICE - A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided.09-30-2010
20100245811Inspecting apparatus and inspecting method - An inspecting apparatus (09-30-2010
20120127462SURFACE INSPECTION DEVICE FOR CYLINDRICAL BODY - The present, invention relates to a surface inspection device for a cylindrical body provided with an illumination light source (05-24-2012
20120127461METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; setting up a projecting part with highest reliability in the a plurality of projecting parts to be a reference projecting part; modifying height data of remaining projecting part, referenced by height data of the reference projecting part; and obtaining integrated height data by using the modified height data.05-24-2012
20100208249Apparatus For Inspecting Defects - A defect inspection apparatus and method includes a darkfield illumination optical system which conducts darkfield illumination upon the surface of a sample with irradiation light having at least one of wavelength band, a darkfield detection optical system which includes a reflecting objective lens for converging the light scattered from the surface of the sample that has been darkfield-illuminated with the irradiation light having the at least one wavelength band, and imaging optics for imaging onto a light-receiving surface of an image sensor the scattered light that the reflecting objective lens has converged, and an image processor which, in accordance with an image signal obtained from the image sensor of the darkfield detection optical system, discriminates defects or defect candidates present on the surface of the sample.08-19-2010
20110181873SURFACE SCANNING DEVICE - A surface scanning device for inspecting a product surface includes an illumination module and an image acquisition device. The illumination module is designed to illuminate the product surface with illumination of substantially uniform illuminance. The illumination module is also designed to configure a configurable range of angles of incidence of the illumination on the product surface. The image acquisition device images the illuminated area.07-28-2011
20120133926Defect Inspection Method - A method and apparatus of inspecting a defect of a surface of a sample in which a laser beam is irradiated on a sample surface so that at least a part of an illumination field of the laser beam illuminates a first area of the sample surface, a plurality of scattered light rays from the first area caused by the irradiation is detected with a plurality of detectors, detection errors of inclination of an illumination apparatus and a sensor for the plurality of scattered light rays detected by the plurality of detectors are corrected, at least one of adding and averaging the corrected plurality of scattered light rays, and a defect on the sample surface is determined based on the plurality of scattered light rays in accordance with the correction of errors of inclination of the illumination apparatus and the sensor.05-31-2012
20120133928DEFECT INSPECTION DEVICE AND INSPECTION METHOD - A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.05-31-2012
20120133927DEFECT INSPECTION APPARATUS AND ITS METHOD - A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.05-31-2012
20120314211INSPECTING APPARATUS AND INSPECTING METHOD - Provided is a method wherein a multi-anode detector is used for the purpose of detecting scattered light from a wafer, data obtained from the detector (multi-anode) for detecting defects is used, the shape of a beam radiated to the wafer, a rotational shift between the radius direction and the beam long side, and the like are calculated, and the optical axis of the irradiation beam is adjusted. Furthermore, the method is provided with a technique which feeds back the correction quantities for rotation and amplitude to inspection signal data, on the basis of the correction data, and corrects inspection data. Since fine correction with the adjustment of an optics system and signal processing is made possible, positional accuracy of defect inspection and accuracy of defect level (defect size) are improved.12-13-2012
20090059215Systems and Method for Simultaneously Inspecting a Specimen with Two Distinct Channels - A system is provided herein for inspecting a specimen. In one embodiment, the system may include a dual-channel microscope, two illuminators, each coupled for illuminating a different channel of the dual-channel microscope and two detectors, each coupled to a different channel of the dual-channel microscope for acquiring images of the specimen. Means are provided for separating the channels of the dual-channel microscope, so that the two detectors can acquire the images of the specimen at substantially the same time. In one embodiment, the channels of the dual-channel microscope may be spectrally separated by configuring the two illuminators, so that they produce light in two substantially non-overlapping spectral ranges. In another embodiment, the channels of the dual-channel microscope may be spatially separated by positioning the two detectors, so that the illumination light do not overlap and the fields of view of the two detectors do not overlap within a field of view of an objective lens included within the system.03-05-2009
20120176611SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS - A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.07-12-2012
20120075624METHOD AND APPARATUS FOR INSPECTING MAGNETIC DISK - In magnetic disk inspection, it is made possible to perform the total operation in which magnetic disks taken out from a cassette are inspected on both surfaces thereof, classified by the grades according to the inspection results and returned again to corresponding cassettes, while maintaining high throughput. To achieve such inspection, a plurality of uninspected boards are put on a plurality of corresponding rotation-drive portions at a plurality of corresponding board taking-out and supply positions in a magnetic disk inspection apparatus and are transferred to a plurality of corresponding inspection positions. The boards are optically inspected while rotating. The optically inspected boards are transferred to the plurality of corresponding board taking-out and supply positions and the plurality of transferred boards are taken out. The taken-out boards are sorted according to the optical inspection results and stored in the corresponding cassettes into which inspected boards are stored.03-29-2012
20120081701METHOD AND APPARATUS FOR INSPECTING A SURFACE OF A SUBSTRATE - The present invention provides a method and apparatus for inspecting a surface of a substrate. The apparatus includes: a rotatable stage on which a substrate to be inspected is placed; an inspection optical system having an illumination light source for emitting light to a substrate placed on the stage and a detector for detecting light from the substrate which is irradiated with the light from the illumination light source; an A/D converter for amplifying and A/D converting signals output from the detector in the inspection optical system; and a defect detector for detecting defects in a surface of the substrate by processing signals output from the detector and converted by the A/D converter and classifying the defected defects. The defect detector extracts micro defects in the surface of the substrate by processing the signals output from the detector, and detects linear defects existing discretely in a linear region.04-05-2012
20110122404EFFICIENT TELECENTRIC OPTICAL SYSTEM (ETOS) - A new architecture for machine vision system that uses area sensor (or line sensor), with telecentric imaging optics compound with telecentric illumination module is described. The illumination module may include a bright field illumination source and/or a dark field illumination source. The telecentric imaging optics includes an upper imaging module having an aperture stop and a lower imaging module positioned between the upper imaging module and object, such that the light source and the aperture stop are located in the back focal plane of the lower imaging module. The lower imaging module images the illumination source into a plane of an aperture stop of the upper imaging module. The optical axis of the upper imaging module is offset with respect to the lower imaging module. The optical axis of the telecentric illumination module is offset with respect to the axis of the lower imaging module in the opposite direction.05-26-2011
20100328654MICROELECTRONIC SENSOR DEVICE FOR OPTICAL EXAMINATIONS ON A WETTED SURFACE - The application relates to a method and a microelectronic sensor device for making optical examinations in an investigation region (12-30-2010
20080297780Method and Configuration for Detecting Material Defects in Workpieces - A method and a configuration for automatically or visually detecting material defects, in particular cracks, in a workpiece, includes applying a test agent to the workpiece. The test agent contains color pigments which can be excited by using shortwave light. The workpiece is then irradiated with shortwave light from a light source, light emitted by the workpiece is detected by an observer's eye or by a detector, and the signals from the detector are evaluated by an electronic evaluation device in order to determine the material defects. The light source is associated with a first optical interference filter which selects the light emitted by the light source, as a bandpass filter, before the light impinges on the workpiece.12-04-2008
20080297779INSPECTION DEVICE AND INSPECTION METHOD - An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.12-04-2008
20120320372Autonomous Non-Destructive Evaluation System for Aircraft Structures - An apparatus comprises an inspection vehicle, a sensor system, a positioning system, a controller, and a support system. The inspection vehicle is configured to move on a surface of an object. The sensor system is associated with the inspection vehicle and is configured to generate information about the object when the inspection vehicle is on the surface of the object. The positioning system is configured to determine a location of the inspection vehicle on the object. The controller is configured to control movement of the inspection vehicle using the positioning system and control operation of the sensor system. The support system is connected to the inspection vehicle and is configured to support the inspection vehicle in response to an undesired release of the inspection vehicle from the surface of the object.12-20-2012
20120320373Inspection Apparatus - An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting sec and scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.12-20-2012
20100231902OPTICAL INSPECTION SYSTEM AND METHOD - A wafer inspection system has a bright field imaging beam path and a dark field imaging beam path to obtain bright field images and dark field images of a full 300 mm wafer. The optical system provides for telecentric imaging and has low optical aberrations. The bright field and dark field beam paths are folded such that the system can be integrated to occupy a low volume with a small foot print.09-16-2010
20100231901INSPECTION SYSTEM EMPLOYING ILLUMINATION THAT IS SLECTABLE OVER A CONTINUOUS RANGE ANGLES - An illumination device and method for inspecting objects having microscopic features is provided. The device includes an illuminator which provides a solid angle of angularly specific illumination defining an illumination angle, selected by a user from among a continuous range of possible illumination angles. The device further includes an object inspector which inspects the object illuminated by the illuminator. The illuminator may include an illumination source, a light concentrator, an illumination angle selector, disposed along a light path between the illumination source and the object inspector. The illumination angle selector may have a first position in which directly -reflected light propagates toward the object plane and a second position in which no light both selected by the illumination angle selector and directly reflected from the object plane enters the collecting lens. Rather, in the second position, only scattered light from the object plane enters the collecting lens.09-16-2010
20110228262APPARATUS OF INSPECTING DEFECT IN SEMICONDUCTOR AND METHOD OF THE SAME - When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.09-22-2011
20110235029PATTERN MEASURING METHOD AND PATTERN MEASURING APPARATUS - According to one embodiment, a pattern measuring method includes: irradiating, from a plurality of different incident directions, electromagnetic waves on a periodical structure pattern in which a plurality of patterns are periodically arrayed and partially overlap one another; detecting the electromagnetic waves scattered by the periodical structure pattern and detecting scattering profiles of the electromagnetic waves; and measuring, based on the detected scattering profiles, a pattern shape of the periodical structure pattern. Each of the different incident directions is an incident direction in which the patterns included in the periodical structure pattern do not partially overlap each other.09-29-2011
20120086937INSPECTION SYSTEM AND METHOD FOR FAST CHANGES OF FOCUS - An inspection system includes a first focusing unit configured to perform fast focus changes to a first focusing function applied to an incident light beam. A traveling lens acousto-optic device is arranged to receive the light beam focused by the first focusing function and produce focused spots using a plurality of traveling lenses generated in response to radio frequency signals. The traveling lenses apply a second focusing function and the traveling lens acousto-optic device is arranged to alter the second focusing function at a fast rate. The inspection system also includes optics arranged to direct the focused spots onto an inspected object and to direct radiation from the inspected object to a sensor.04-12-2012
20120327402INSPECTION DEVICE - The invention relates to a device for inspecting contact-sensitive planar materials or workpieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. Said inspection device comprises a support element (12-27-2012
20120327403SURFACE INSPECTION APPARATUS AND SURFACE INSPECTION METHOD - A surface inspection apparatus includes a blocking unit included in a subsequent processing unit that groups data items into having an arbitrary number of data items. The subsequent processing unit acquires a data item from each of the blocks. The blocking unit changes, in accordance with an instruction transmitted from a state monitoring unit, the number of data items to be blocked. A threshold processing unit acquires data items from the blocking unit that have values larger than a threshold, and transmits the data items to a memory. The state monitoring unit monitors an available capacity of the memory. When the state monitoring unit detects a reduction in the available capacity of the memory, it causes the blocking unit to increase the number of data items to be blocked into each of the blocks so that data does not overflow from the memory.12-27-2012
20120092655INSPECTION SYSTEM UTILIZING SOLID IMMERSION LENSES - An inspection system including a lens. In one instance, the lens is a solid immersion lens. The inspection system includes a component or components for providing a self aligning solid immersion lens arrangement in order to allow at most a small distance between the solid immersion lens and a device under test and components or components for constraining a force exerted on the device under test. The inspection system may include a “purge” port, or a thermal isolation configuration or an anti-contamination component. The inspection system may include software and hardware to prevent crashing of the lens. The inspection system may also include a method for ensuring that various objective lenses can be replaced while maintaining the intended spacing between lenses.04-19-2012
20120140211Inspection Apparatus - An inspection apparatus and method for detecting defects and haze on a surface of a sample includes illumination optics which emit light to illuminate an inspection region on the surface of the sample from an oblique direction relative to the inspection region, first detection optics which detect first scattered light from the inspection region and having a beam analyzer through an optical path, second detection optics which detect second scattered light from the inspection region, the second scattered light being scattered from a direction different than a direction of the first scattered light, and a signal-processing unit which treats different processings for a first signal of the detected first scattered light and for a second signal of the detected second scattered light and detecting defects and haze on the surface of the sample on the basis of at least one of the first signal and the second signal.06-07-2012
20130010289SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM HAVING PROGRAM FOR EXECUTING THE SUBSTRATE PROCESSING METHOD STORED THEREIN - Provided is a substrate processing apparatus including a placement table on which a substrate is disposed; a light source configured to irradiate light on the surface of the substrate on the placement unit; a detector configured to detect the light amount reflected from the substrate; and a control unit configured to perform a determination process of determining whether a detection value of the light amount is smaller than a predetermined value at a plurality of positions, and to determine that a holding state of the substrate is abnormal when the total number of times of determination in which it is determined that the detection value is smaller than the predetermined value reaches a predetermined number of times.01-10-2013
20100091272SURFACE INSPECTION APPARATUS - A surface inspection apparatus includes an irradiating unit that has a plurality of light sources that respectively emit a plurality of illumination light beams having different wavelength ranges, and irradiates an inspection surface as a surface of a body to be inspected with the illumination light beams, in a condition where the light sources are located adjacent to each other and arranged in a given order along the inspection surface, an imaging unit that images reflected light when the illumination light beams are reflected by the inspection surface, so as to obtain a plurality of items of image data corresponding to the respective wavelength ranges, and a control unit that detects a detection object on the inspection surface, based on the items of image data corresponding to the respective wavelength ranges which are obtained by the imaging unit.04-15-2010
20080225281Visual inspection apparatus - The present invention is related to a visual inspection apparatus which can inspect a peripheral edge of a wafer with high efficiency. The visual inspection apparatus can make an inspection of any area on the peripheral edge of the wafer by displaying an inspection area specifying screen on a monitor. The inspection area specifying screen includes a display portion for displaying an observation range and an input portion for setting the observation area. The input portion allows one of step, continuity, and point to be selected as an observation type. A recipe is registered depending on a condition set in the above and thus is used to make an inspection.09-18-2008
20080225280SURFACE FLATNESS TESTING DEVICE AND METHOD THEREOF - An exemplary surface flatness testing device (09-18-2008
20130141715FAULT INSPECTION DEVICE AND FAULT INSPECTION METHOD - Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.06-06-2013
20110211191Method And Its Apparatus For Inspecting Defects - A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.09-01-2011
20130148113INSPECTION APPARATUS AND INSPECTION METHOD - The light scattered from the sample surface and foreign matter is imaged on an image intensifier and detected by a lens-coupled multi-pixel sensor such as a TDI sensor or a CCD sensor. The light scattered by surface roughness is spatially eliminated to detect the light scattered from foreign matter with increased sensitivity. A mechanism for shifting the image intensifier is incorporated to prevent a signal intensity decrease, which may be caused by a decrease in the sensitivity of the image intensifier.06-13-2013
20130155400METHOD AND DEVICE FOR INSPECTING FOR DEFECTS - A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.06-20-2013
20130155399OPTICAL IMAGING SYSTEM WITH CATOPTRIC OBJECTIVE; BROADBAND OBJECTIVE WITH MIRROR; AND REFRACTIVE LENSES AND BROADBAND OPTICAL IMAGING SYSTEM HAVING TWO OR MORE IMAGING PATHS - An optical system may include an objective having at least four mirrors including an outermost mirror with aspect ratio <20:1 and focusing optics including a refractive optical element. The objective provides imaging at numerical aperture >0.7, central obscuration <35% in pupil. An objective may have two or more mirrors, one with a refractive module that seals off an outermost mirror's central opening. A broad band imaging system may include one objective and two or more imaging paths that provide imaging at numerical aperture >0.7 and field of view >0.8 mm. An optical imaging system may comprise an objective and two or more imaging paths. The imaging paths may provide two or more simultaneous broadband images of a sample in two or more modes. The modes may have different illumination and/or collection pupil apertures or different pixel sizes at the sample.06-20-2013
20110310382DEFECTS INSPECTING APPARATUS AND DEFECTS INSPECTING METHOD - An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.12-22-2011
20120293793METHOD OF EVALUATING SILICON WAFER AND METHOD OF MANUFACTURING SILICON WAFER - A method of evaluating a silicon wafer includes obtaining first surface distribution information indicating an surface distribution of photoluminescence intensity on a surface of a silicon wafer; after obtaining the first surface distribution information, subjecting the silicon wafer to a thermal oxidation treatment, and then obtaining second surface distribution information indicating an surface distribution of photoluminescence intensity on the surface of the silicon wafer; obtaining difference information for the first surface distribution information and third surface distribution information, with the third surface distribution information having been obtained by correcting the second surface distribution information with a correction coefficient of less than 1; and based on the difference information obtained, evaluating an evaluation item selected from the group consisting of absence or presence of oxygen precipitates and surface distribution of oxygen precipitates in the silicon wafer being evaluated.11-22-2012

Patent applications in class Surface condition

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