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For internal camera components

Subclass of:

348 - Television

348207990 - CAMERA, SYSTEM AND DETAIL

348373000 - Support or housing

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DocumentTitleDate
20130083239FOLDED TAPE PACKAGE FOR ELECTRONIC DEVICES - Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side may be left exposed for device functionality and operation with additional components or devices. The passive components may also be covered with a mold. The end sections are folded such that the end sections are in a parallel configuration with the middle section. The flexible tape substrate may be a high density interconnect flexible tape substrate with two layers. A silicon substrate may be used to interconnect a die stack to the flexible tape substrate. The folded tape package has a reduced device footprint, lower substrate warpage effects, and higher substrate yields.04-04-2013
20100165185CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.07-01-2010
20100165183CAMERA MODULE - An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.07-01-2010
20100165182COMBINATION DEVICE OF SPEAKER AND CAMERA OPTICAL SYSTEM - In the device according to this invention, a vibrating diaphragm and a magnetic conduction plate are improved, so that the vibrating diaphragm of the speaker, under the action of magnetic force excited by different electrical signals, can convert an acoustoelectric signal into voice, can resonate together with a coil, and can be as a movable lens to constitute an optical focusing/zooming system together with lens of the camera optical system, respectively, so that the space of the mobile terminal occupied by the combination device can be saved, and the sound quality of the speaker also can be improved.07-01-2010
20110194023Camera module with molded tape flip chip imager mount and method of manufacture - A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.08-11-2011
20130076976CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel part in which a plurality of lenses are stacked; a housing enclosing an outer peripheral surface of the lens barrel part; an infrared (IR)-cut filter mounted at a lower portion of the housing to remove a near infrared wavelength; an image sensor mounted on a lower portion of the IR-cut filter to convert an external image into an electrical signal; a circuit board having an opening part formed at the center thereof, the opening part receiving the image sensor therein; and a plate mounted on the circuit board and made of a thermal conductive material so as to radiate heat generated from the circuit board.03-28-2013
20130076977IMAGE PICKUP APPARATUS HAVING IMAGING SENSOR PACKAGE - An image pickup apparatus in which an imaging sensor package reflow mounted in advance to a circuit board can be fixed to a fixture member of the image pickup apparatus. A sensor holder of a digital video camera as an image pickup apparatus has a holder body that is positioned to surround an imaging sensor package mounted to a sensor board as a circuit board. Flange portions of the sensor holder are formed to project from a rear end surface of the holder body toward a heat radiation plate having a flat plate shape. The heat radiation plate is fixed to a lens barrel in a state that the flange portions are held between the lens barrel and the heat radiation plate.03-28-2013
20130038787IMAGE PICK-UP APPARATUS - An image pick-up apparatus to reduce glare includes a lens module, a light shielding plate and an image sensor. The lens module includes a lens barrel and a base plate. The base plate defines a first through hole. The light shielding plate is arranged between the lens module and the base plate, and defines a second through hole. The image sensor has an exposed portion. The exposed portion has an optically effective region. The first through hole is arranged between the light shielding plate and the effective region. A projection of a border of the second through hole on the exposed surface surrounds a projection of a border of the effective region on the exposed surface, and a projection of a border of the first through hole on the exposed surface surrounds the projection of the border of the second through hole on the exposed surface.02-14-2013
20130038788FLEXIBLE LENS MOUNT SYSTEM FOR RAPID TILT PHOTOGRAPHY - The disclosure generally relates to photography, including both still photography and video photography. One aspect of the invention is directed toward a lens system that includes a lens, a fitting mountable to a camera, and a flexible body extending between the lens and the fitting. The fitting can be the sole support for the body relative to the camera. The body can be configured to position the lens among at least two operative positions relative to the camera when the fitting is mounted to the camera.02-14-2013
20100045855CAMERA APPARATUS AND ELECTRONIC DEVICE PROVIDED WITH THE SAME - A camera apparatus (02-25-2010
20100110284COMPRESSIBLE ZOOM CAMERA - A device includes a housing capable of forming an internal space during operation of the device. The device also includes a camera having an optical zoom portion provided within the housing. The optical zoom portion is capable of expanding into the internal space when the camera is in use.05-06-2010
20100110283CAMERA LENS MODULE-INTEGRATED SPEAKER ASSEMBLY - A camera lens module-integrated speaker assembly is provided, which includes a speaker housing, a camera lens module mounted through a center of the speaker housing, and a speaker module surrounding the camera lens module along an outer circumference of the camera lens module.05-06-2010
20100321565IMAGE PICKUP MODULE - There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module.12-23-2010
20090109326CAMERA MODULES - A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material.04-30-2009
20130027607CAMERA MODULE - Disclosed herein is a camera module including: an image sensor which converts an image entering through a lens into an electric signal; a rigid-flexible substrate which includes first and second rigid substrates distanced from each other and a flexible substrate to connect the first and the second rigid substrates to each other; a first connection part which is electrically connected to the rigid-flexible substrate; and a second connection part which has one end electrically connected to the first connection part and the other end connected to a cable, and which is disconnectable from the first connection part and the cable.01-31-2013
20120182472CAMERA DRIVE DEVICE - A camera driving apparatus according to the present invention includes a camera section 07-19-2012
20120182471IMAGING DEVICE HAVING AN ANGLE ADJUSTING DEVICE FOR AN IMAGE SENSOR - The present invention relates to a digital camera which comprises a sensor holder on which an image sensor is mounted and at least one adjustment ring. The adjustment ring is configured to rotate around an optical axis (OA) of the camera. The sensor holder and the at least one adjustment ring are configured to interact via at least one cam surface such that when the at least one adjustment ring is rotated with respect to the sensor holder, a normal direction of the sensor is adjusted in relation to a direction of the optical axis.07-19-2012
20120182470COMMUNICATION APPARATUS - Disclosed is a communication apparatus including an image input unit that includes an image input member that inputs an image of an object and a retaining member that retains the image input member at its one edge; an enclosure to which a concave portion is formed at its one side surface; a uniaxial hinge device that includes a first hinge member and a second hinge member rotatably connected with each other and capable of rotating around a first axial line with respect to each other, the first hinge member being connected to the enclosure and the second hinge member being connected to the other edge of the retaining member. The image input unit is rotated via the uniaxial hinge device around the first axial line with respect to the enclosure between a housing position and a protruding position.07-19-2012
20120182469CAMERA BODY - A camera body is provided that includes a base member, a body mount, a focal plane shutter and a fastening member. The body mount is configured to support an interchangeable lens. The fastening member is configured to fasten the focal plane shutter unit to the base member. The body mount, the base member, and the focal plane shutter unit are disposed between a subject side of the camera body and a user side of the camera body in that order. The focal plane shutter unit is fastened to the base member that faces toward the user side of the camera body.07-19-2012
20130050571CAMERA MODULE HOUSING HAVING BUILT-IN CONDUCTIVE TRACES TO ACCOMMODATE STACKED DIES USING FLIP CHIP CONNECTIONS - A camera module including a housing with embedded conductive traces that allow for an increase in usable surface area of a corresponding printed circuit board (PCB) or multi-layer substrate, a reduced overall thickness of the module, a reduction in tilt management of a lens element of the module, and a facilitation in alignment of the lens element relative to the image sensor. An image sensor is electrically interconnected to first portions of the conductive traces by way of a flip chip process, and then the housing may be mounted over the PCB so that second portions of the conductive traces interconnect with corresponding conductive pads on the PCB to electrically interconnect the image sensor die to the PCB. In one arrangement, another die may be electrically interconnected to the PCB so that as assembled, the die is disposed between the image sensor and the PCB.02-28-2013
20130057756DRIVE UNIT, LENS MODULE, AND IMAGE PICKUP UNIT - A drive unit includes: a holding member holding an object to be driven; a polymer actuator device provided on one side of the object to be driven; one or more supporting members provided on the other side of the object to be driven; and a fixing member directly or indirectly fixing a first end of each of the polymer actuator device and the supporting members. A second end of each of the polymer actuator device and the supporting members is directly or indirectly connected to an end of the holding member.03-07-2013
20130057757CAMERA MODULE HAVING MEMS ACTUATOR, CONNECTING METHOD FOR SHUTTER COIL OF CAMERA MODULE AND CAMERA MODULE MANUFACTURED BY THE SAME METHOD - Disclosed is a camera module including a substrate which is provided with an electrode pad and an image sensor; a housing which is stacked on the substrate and of which an upper portion is opened so that light is incident to the image sensor; a MEMS actuator which is installed at the housing and has an electrode terminal at one side thereof, and a conductive pattern which is formed at the housing, wherein a lower end of the conductive pattern is connected with the electrode pad of the substrate, and an upper end thereof is connected with the electrode terminal of the MEMS actuator, whereby it is possible to improve electrical reliability between the electrode terminal of the MEMS actuator and the electrode pad of the substrate and facilely form the electrical connection therebetween, thereby reducing the number of processes.03-07-2013
20130057755Camera Module - A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit.03-07-2013
20130063655CAMERA MODULE AND METHOD FOR ASSEMBLING SAME - In a method for assembling a camera module, a sensor module, a lens holder, and a lens assembly are first provided. The sensor module includes a substrate and a sensor positioned on the substrate. The lens holder is positioned on the substrate and accommodates the sensor. The lens assembly is held in the lens holder. At least one of the lens holder and the lens assembly has a chamfer at an end thereof opposite to the substrate and located between the lens holder and the lens assembly. Then, curable adhesive is applied to the chamfer. The tilt of the lens is adjusted until the lens assembly is optically aligned with the sensor. The curable adhesive is cured.03-14-2013
20130162896CAMERA MODULE - Disclosed herein is a camera module, including: a lens holder including a receiving unit receiving a lens module therein; a driving unit joined to the lens holder to be movable in a direction vertical to an optical-axis direction; a housing in which the driving unit is installed to be movable in the vertical direction to the optical-axis direction and having a protruding member that protrudes on one surface thereof; a shape memory alloy wire part connected to the driving unit to generate driving force in the vertical direction to the optical-axis direction; and an elastic member applying a preload to the shape memory alloy wire part to cause initial transformation.06-27-2013
20130162897CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon.06-27-2013
20130162898IMAGE-PICKUP APPARATUS - An image-pickup apparatus includes a speaker, a movable barrel having a lens, a fixed barrel where a cam groove engaging with a cam pin provided on the movable barrel and configured to drive the movable barrel is formed on its inner periphery and an exterior part where the fixed barrel is attachable. A sound space is formed by concaving an outer periphery of the fixed barrel, the speaker is arranged so as to cover the sound space, an opening connected with the sound space is formed on the exterior part, and a bottom part of the sound space is located closer to an optical axis of the lens than to the bottom part of the cam groove in the fixed barrel.06-27-2013
20120113318Methods of Adjustment Free Manufacture Of Focus Free Camera Modules - Methods are provided for wafer scale manufacturing camera modules without adjustment components to compensate for assembly errors and optical errors incurred within manufacturing tolerances. Camera modules are assembled in wafer arrays from arrays of image sensors, arrays of lens structures and arrays of optical trim elements. At least one of the arrays is a wafer. Lens structures are configured to provide less optical power than necessary to focus an image at infinity on image sensors without trim elements. A test performed during the wafer scale assembly of camera modules, after at least the sensor array and the lens structure array assembled, determines optical errors by identifying optical distortions and aberrations quantified in terms of optical power, astigmatism, coma, optical axis shift and optical axis reorientation deficiencies. Corresponding trim elements are configured to counteract distortions and aberrations prior to singulating useful camera modules from the array.05-10-2012
20110032416CAMERA APPARATUS - Disclosed herein is a camera apparatus, including: a lens block having an image capturing lens provided therein; a substrate having an image pickup element mounted thereto; a housing for accommodating therein the lens block and the substrate; and a supporting block for supporting the substrate so that the image pickup element and the image capturing lens face each other by bonding thereto the substrate by using an adhesive agent, wherein the supporting block has a side surface making a right angle with an adhesion surface to which the substrate is bonded, and a bottom surface parallel with the adhesion surface on the adhesion surface, and a filling groove which is filled with the adhesive agent is formed in the supporting block.02-10-2011
20080291322Method for the Optical Adjustment of a Camerafield of the Invention - During the assembly of cameras, especially for cameras having imaging optical systems with reduced depth of field, an accurate adjustment of an optical sensor medium relative to the imaging optical system may be necessary. Therefore, a method is provided for optically adjusting a camera in which at least one plastically deformable adjustment element is employed that is plastically deformable by the action of at least one force and/or at least one torque. By deforming this adjustment element, it is possible to alter a placement and/or alignment of the optical sensor medium relative to the imaging optical system so that an optimal image quality is ensured. Because of the stability of the method and the low costs associated with it, the method proposed is also suitable for a serial application.11-27-2008
20110069221ALIGNMENT OF LENS AND IMAGE SENSOR - Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package.03-24-2011
20110298971COMPACT IMAGING DEVICE - The subject matter disclosed herein relates to an imaging device including a laminated portion of an actuator or actuator support.12-08-2011
20120105713LOW PROFILE CHIP SCALE MODULE AND METHOD OF PRODUCING THE SAME - A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module.05-03-2012
20110285900CASING OF WEBCAM - A casing of a webcam improves the hand feel of turning a lens ring. A base of the casing includes a sheath hole having a first connection portion, a first ring-shaped flange formed around an upper side of the lens ring, a second connection portion formed between upper and lower sides of the lens ring, and a second ring-shaped flange formed around the lens ring and abutted against an upper side of the sheath hole and a lower side of the first connection portion, and the first and second ring-shaped flanges of the lens ring are separated from the sheath hole by an interval. A flexible ring is clamped between the first and second connection portions and disposed between the first and second ring-shaped flanges, such that the casing can have a greater manufacturing tolerance to reduce manufacturing costs, and provide a better hand feel of turning the lens ring.11-24-2011
20110080515Camera module - The present invention relates to a camera module assembled by using a connector. The present invention provides a camera module including: a main substrate having an image sensor mounted on an upper surface and a connector insertion groove formed at one side of the image sensor; a plurality of connectors mounted in a row in the connector insertion groove; a housing mounted on the main substrate and having a lens barrel vertically movably coupled therein; a flexible printed circuit board mounted to surround an outer peripheral surface of the housing while being electrically connected to a lens transfer device coupled to one side of the housing; and a shield case coupled to the outer peripheral surface of the housing. Since it is possible to minimize a distance between pads which are connectable through the connector, there is an advantage of miniaturizing the camera module as a whole by size reduction of the main substrate.04-07-2011
20110292279CAMERA MODULE - A camera module includes a lens of heat-resistant material, a barrel receiving the lens, a baseboard mounted on the barrel by surface mounted technology, an image sensor mounted on the baseboard receiving optical signals from the lens and converting the optical signals into electrical signals, and a transmitting member transmitting the electrical signals to the circuit board.12-01-2011
20110141346Camera Module and Manufacturing Method Thereof - Disclosed herein are a camera module and a manufacturing method thereof, the camera module including a plurality of lenses, a substrate arranged at the lower part of the plurality of lenses, an infrared blocking agent formed on the upper surface of the substrate to block infrared light, and an image sensor positioned at the lower surface of the substrate to convert an optical image incident through the plurality of lenses into an electrical signal.06-16-2011
20100091179Module Connector - The module connector can accommodate a miniaturized module such as a camera module and reliably fix the module in an electrically connected state, and make the connector itself in lower profile. With this connector (04-15-2010
20090190025Image-capturing module and manufacturing method thereof - An image-capturing module and a manufacturing method thereof are provided. The image-capturing module includes a circuit board, an electric element, a lens set and a carrier. The circuit board has at least a locking hole. The electric element is disposed on the circuit board. The carrier is disposed on the circuit board for carrying the lens set. The carrier has at least a hook locking at the locking hole of the circuit board.07-30-2009
20110194022IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME - An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a lens barrel and a lens layer. The lens barrel is disposed on the image sensor and located in the light non-gathering region and has a through hole exposing a portion of the image sensor in the light gathering region. A material of the lens barrel includes a thermoplastic with a melting point higher than soldering temperature. The lens layer is disposed on an end portion of the lens barrel away from the image sensor and covers the through hole. The lens layer includes a glass substrate and a lens disposed on the glass substrate and located in the light gathering region.08-11-2011
20100002129ELECTRONIC DEVICE HAVING MULTIPLE CAMERA MODULES - An exemplary electronic device includes a lower housing having a mounting panel, a first camera module mounted to the mounting panel, a sliding member mounted to the lower housing, a second camera module mounted to the sliding member, and two hinge assemblies fixed to the sliding member. The first camera module is configured to be covered by the sliding member. The second camera module is configured to be covered by the mounting panel. The hinge assemblies are configured to make the sliding member slidable relative to the lower housing to expose the first camera module and the second camera module out from the sliding member and the mounting panel, respectively, and enable the sliding member rotatably relative to the lower housing.01-07-2010
20090147127LENS HOOD DEVICE, AND IMAGE PICKUP DEVICE USING THE SAME - A lens hood device includes a barrier case (06-11-2009
20090147128Digital photographing apparatus - A digital photographing apparatus is provided that has a reduced number of elements as compared to conventional arrangements and can thus be manufactured through a simple process with low manufacturing costs. The digital photographing apparatus includes a main printed circuit board to which an imaging device converting energy of incident light into electrical signals is directly attached. The digital photographing apparatus also includes an optical tube unit connected to the main printed circuit board and forming an image in the imaging device by receiving an external image. A first contact formed at a surface of the optical tube unit is directly in contact with a second contact formed at a surface of the main printed circuit board.06-11-2009
20110261253CAMERA MODULE - A camera module includes a holder, a barrel, an image sensor module, and a printed circuit board. The barrel receives lenses. The barrel is received in the holder. The image sensor module includes a substrate and an image sensor. The substrate is positioned at one side of the holder. The image sensor is mounted on the substrate and aligned with the lenses. First solder pads are positioned in the substrate. The first solder pads are electrically coupled to the image sensor. The printed circuit board includes second solder pads. The second solder pads are electrically coupled to the first solder pads. The printed circuit board is positioned at an exterior surface of the holder.10-27-2011
20080266447Camera module and electronic device including same - A camera module 10-30-2008
20090021636IMAGE PICKUP MODULE - An image pickup module is provided. The image pickup module includes a lens, a circuit board, an image sensor, a hollow base, and a lens seat. The image sensor is coupled to the circuit board and includes a housing package portion with a side periphery. The hollow base is disposed on the image sensor. The hollow lens seat is used for housing the lens and is disposed on the hollow base. The hollow lens seat is positioned according to the side periphery of the housing package portion.01-22-2009
20100118182CAMERA MODULE MANUFACTURING METHOD AND CAMERA MODULE - It is possible to provide a camera module manufacturing method and a camera model which can improve performance of a camera module without complicating the manufacturing method. A light shield is formed on the side surface of each lens body (05-13-2010
20090079863CAMERA MODULE, MANUFACTURING METHOD OF IMAGING APPARATUS AND HOT MELT MOLDING METHOD - The invention provides a camera module which can make a work for filling up a clearance between a pedestal mount and a circuit board in a post process unnecessary. The invention provides a camera module including a lens unit, an imaging element converting an incoming light formed by the lens unit into an electric signal and a pedestal mount attaching the lens unit thereto and storing the imaging element, in which a lower end portion of a side wall portion of the pedestal mount is provided with a bottom surface portion made of a thermoplastic resin melting at a reflow temperature.03-26-2009
20110267535IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE - An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.11-03-2011
20110267534IMAGE SENSOR PACKAGE AND CAMERA MODULE USING SAME - The image sensor package includes a transparent substrate, a number of conductive patterns, an image sensor, a flexible circuit board. The conductive patterns are distributed on a surface of the transparent substrate. The image sensor is adhered on the transparent substrate and electrically connected to the conductive patterns. The flexible circuit board is electrically connected to the conductive patterns, and defines an opening for receiving the image sensor therein.11-03-2011
20110170000CAMERA DEVICE ADAPTING TO DIFFERENT LENS SENSORS - A camera device includes a lens cover defining a lens opening. Two positioning posts extend from the lens cover. The two positioning posts are arranged at two opposite sides of the lens opening, for selectively mounting a first circuit board having a first lens or a second circuit board having a second lens different from the first lens. The first and second circuit boards are operable to be installed on the lens cover at different positions through being mounted on different positions of the two positioning posts.07-14-2011
20090295986CAMERA LENS ACTUATION APPARATUS - A camera lens actuation apparatus for driving motion of a camera lens supported on a support structure by a suspension system. The apparatus incorporates a subassembly comprising SMA wire connected to at least one mounting member which is mounted to the support structure. At least one pair of lengths of SMA wire are held in tension between the camera lens element and the support structure at respective acute angles to the optical axis applying a tensional force having a component along the optical axis. The lengths of SMA wire in the pair are held at angle as viewed along the optical axis. There may be plural pairs with a balanced arrangement in which the forces generated have no net component perpendicular to the optical axis and generate no net torque around any axis perpendicular to the optical axis. A control circuit controls heating of the SMA wire in response to a measure of its resistance.12-03-2009
20100277640CAMERA APPARATUS FOR PORTABLE ELECTRONIC DEVICE - A camera apparatus is attached to a portable electronic device. The camera apparatus includes an imaging module, a socket and a holder. The imaging module is positioned in the socket. The holder includes a base portion, and two positioning cylinders. The base portion provides a receiving space accommodating the socket and the imaging module, and the positioning cylinders are fixed to the portable electronic device.11-04-2010
20090002549ELECTRONIC CAMERA - An electronic camera includes an imaging device, a drive printed circuit board, a camera main body, an air inlet, an air outlet, and a cooling fan. The imaging device is located inside the camera main body on the optical axis of an imaging lens attached to the camera main body, and receives light passing through the imaging lens to form an image. The drive printed circuit board includes an imaging control device for controlling the imaging device. The camera main body includes a held portion that is located off the optical axis and configured to be held by an operator, and a monitor on its outer surface. The air inlet and the air outlet are located outside the held portion on the outer surface of the camera main body each on either side of the drive printed circuit board. The cooling fan generates an air flow inside the camera main body from the air inlet to the air outlet through the drive printed circuit board.01-01-2009
20090033790CAMERA MODULE - A camera module includes a lens holder, a lens module, an image sensor chip, and a PCB defining a step-shaped recess on the upper thereof. The step-shaped recess comprises a first recess formed on an upper portion thereof and a second recess, for receiving a plurality of electrical elements therein, coaxially formed on a lower portion thereof, and a intermediate step surface formed between the first recess and the second recess. A cover plate received in the first recess and attached on the intermediate step surface defines at least one electronic layer therein and an external point formed on the bottom thereof. At least one zero voltage point is formed on the intermediate step surface thereof. The electronic layer is electrically connected to the zero voltage points by the external points, thereby electromagnetic waves generated by the electronic elements are prevented from affecting the image sensor chip.02-05-2009
20090033789CAMERA MODULE - A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.02-05-2009
20080303939CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP - An exemplary camera module includes a base, an image sensor chip, a lens holder, a lens module, at least one electronic element, and a light transmittance element. The base defines a first cavity. The image sensor chip is disposed on the base and includes a photosensitive area. The image sensor chip covers the first cavity. The lens holder is disposed on the base. The lens holder includes a first chamber and a second chamber disposed on the base. The second chamber covers the image sensor chip. The lens module is partially received in the first chamber. The lens module is optically aligned with the image sensor chip. The at least one electronic element is disposed in the first cavity. The light transmittance element is fixed on the image sensor chip. The light transmittance element is received in the second chamber and contacts the second chamber.12-11-2008
20080278621Camera module - The present invention relates to a camera module capable of being surface mounted (SMT) on a main substrate.11-13-2008
20080252774CAMERA MODULE WITH CIRCUIT BOARD - A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.10-16-2008
20100141830CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE USING SAME - A camera module and a portable electronic device using same are provided. The camera module can be rotated to align with a first camera window and a first aperture in the front of the portable electronic device or a second camera window and second aperture in the rear of the portable electronic device.06-10-2010
20090086088CAMERA DOOR OPENING AND SHUTTING APPARATUS FOR PORTABLE COMMUNICATION DEVICE - The present invention discloses a camera door opening/shutting apparatus for a portable communication device. The apparatus includes a camera door disposed at a main body to expose or cover a camera lens included in the main body according to a sliding movement of the camera door, and a door sliding part disposed between the main body and the camera door to slidably couple the camera door with the main body.04-02-2009
20090161006Image sensor, method of manufacturing the same, and camera module having the same - Provided is an image sensor module including a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads.06-25-2009
20110216238OPTICAL ELEMENT, OPTICAL ELEMENT MANUFACTURING METHOD, AND CAMERA MODULE - According to one embodiment, an optical element includes: a substrate in which a through-hole is formed; a transparent thin film formed on at least one of the rear surface and the front surface of the substrate to cover the through-hole; and a lens formed in contact with the surface of the thin film in an area where the thin film covers the through-hole.09-08-2011
20130120648CAMERA MODULE - A camera module is disclosed, the camera module including a lens barrel including more than one sheet of lens receiving an optical image of an object, an actuator moving the lens barrel, a PCB (Printed Circuit Board) formed with an image sensor at a bottom surface of the lens barrel for converting the optical image to an electrical signal, and a holder for supporting the lens barrel and the actuator and formed with a terminal electrically connected to the actuator, wherein an electrical contact point between the actuator and the terminal is formed with two or more tiers of coated layers.05-16-2013
20090073309DIGITAL CAMERA HAVING PRINTHEAD AND INK SUPPLY - A digital camera is provided having a printhead for printing images digitally captured by the camera, an ink supply for supplying ink to the printhead, and a casing surrounding and encasing the printhead and ink supply so that the ink supply is unable to be accessed without destruction of the casing.03-19-2009
20090141165Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same - In a solid-state image pickup apparatus 06-04-2009
20090015709Camera and direction indicating switch - A camera includes a direction indicating switch to specify an arbitrary indicating direction which is attached to a case member. The direction indicating switch has a switch base having a contact point which is capable of abutting intermittently; an operating section held by the switch base to be capable of tilting for tilting for intermittently abutting of the contact point; and a tilt controlling section which controls a tilt of the operating section. The operating section is capable of tilting in a radial direction from a reference position where the contact point is in a nonconductive state. When the operating section is tilted over a predetermined angle from the reference position, the contact point is in a conductive state. The tilt controlling section allows the operating section to tilt over the predetermined angle in a predetermined indicating direction from the reference position and prevents the operating section from tilting over the predetermined angle in a direction different from the predetermined indicating direction from the reference position.01-15-2009
20110228164IMAGE PICKUP APPARATUS IN WHICH IMAGE PICKUP ELEMENT IS MOVABLE IN OPTICAL AXIS DIRECTION - An image pickup apparatus includes lens barrels 09-22-2011
20090213264MOBILE ENTERTAINMENT AND COMMUNICATION DEVICE - A mobile communication device in a palm-held size housing has a cellular or satellite telephone capable of wireless communication with the Internet and remotely located telephones. The device includes one or more replaceable memory card sockets for receiving a blank memory card for recording data directly from the Internet and, in particular, musical performances that then can be selectively reproduced by the device for the enjoyment of the user, including both audio and visual recordings and reproductions. The device also includes a camera and microphone for recording images and sound within the range of the device that can be wirelessly transmitted, either selectively or automatically to a remote telephone. Further, the device includes sensors for sensing unusual conditions that may also be transmitted to a remote telephone, together with the location of the device as determined by a GPS section of the device. Still further the device includes a connectable stethoscope for detecting and transmitting sounds from the chest of a user to a remote location.08-27-2009
20090244363Video Camera - In a video camera, air outlet holes and air inlet holes are disposed in a panel-facing surface of a camera body. A duct is disposed inside the camera body and guides the air taken in through the air inlet holes to the air outlet holes. A first heat sink is so arranged as to extend from an image sensor into the duct, and the first heat sink releases the heat generated by the image sensor into the duct. A liquid crystal panel unit is movably disposed between a first position in which a first face of the liquid crystal panel unit including a display screen of a liquid crystal panel faces the panel-facing surface of the camera body and a second position in which a second face faces the panel-facing surface. When the liquid crystal panel unit is in the first position, the first face is so formed as to cover the air outlet holes and the air inlet holes. The second surface of the liquid crystal panel unit is formed so that the air outlet holes and the air inlet holes are open to the exterior when the liquid crystal panel unit is in the second position.10-01-2009
20100149410ELECTRONIC COMPONENT APPARATUS - An electronic component apparatus includes a wiring board 06-17-2010
20100149409IMAGE SENSOR HOLDER - An image sensor holder includes a frame, first and second slidable holders, first and second driving devices, first and second driving arms, and at least two elastic members. The first slidable holder is slidably mounted on the frame. The second slidable holder is slidably mounted on the first slidable holder. The first and second driving devices are separately mounted on the frame. The first driving arm is mounted on the frame and contacts to the first slidable holder and the first driving device by opposite ends thereof. The second driving arm is slidably mounted on the frame extending from the second slidable holder, and contacts the second driving device by an end thereof. The two elastic members are separately positioned between the first holder and the frame and between the first holder and the second holder.06-17-2010
20100149408ACCESSORY AND ACCESSORY FOR IMAGE PICKUP APPARATUS - An accessory and an accessory for an image pickup apparatus are provided and are advantageous in reducing cost by reducing the number of parts. A retaining ring is engaged in an annular groove formed in an outer circumference of a cylindrical part of a wide-angle converter lens. Each of retaining ridges has a bottom wall extending from the inner circumference of the annular part in the direction of the width of the annular part in a recess, and a protruded wall extending radially outward of the annular part from the end of the bottom wall, spaced from the annular part, and protruding radially outward from the first outer circumference. When the parts, provided with the retaining ridges, of the annular part are depressed radially inward of the annular part, the protruded wall sink radially inward from the first outer circumference.06-17-2010
20100177237CAMERA MODULE - Disclosed is a camera module. The camera module includes a lens assembly including a wafer level optics lens (WLO), and a sensor assembly on which the lens assembly is mounted through a surface mount technology (SMT). In the camera module, a lens is directly mounted on a sensor die through the SMT, so that the manufacturing process can be simplified and the manufacturing cost can be reduced. A height of the camera module is lowered, so that a slim camera module can be realized.07-15-2010
20100157143Camera module package - A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.06-24-2010
20100165184Camera lens assembly - Disclosed is a camera lens assembly, including a fixed frame; a rotation frame disposed in the fixed frame and configured to rotate about a first axis; an image sensor frame provided in the rotation frame and configured to rotate about a second axis; a first driving part installed in the fixed frame and configured to rotate the rotation frame; and a second driving part installed in the rotation frame and configured to rotate the image sensor frame, wherein the second axis extends in a direction perpendicular to the first axis.07-01-2010
20100188565CIRCUIT-SUBSTRATE SUPPORT STRUCTURE AND IMAGE-ACQUISITION DEVICE - A circuit-substrate support structure includes a circuit substrate having electronic components mounted thereon, a first substrate-holding member provided at one side edge of the circuit substrate to hold the circuit substrate, a second substrate-holding member provided at the other side edge of the circuit substrate, opposite the one side edge, to hold the circuit substrate, and an elastic member provided together with the second substrate-holding member to hold the circuit substrate by applying elasticity in a surface direction of the circuit substrate.07-29-2010
20100182498SOLID-STATE IMAGE PICKUP APPARATUS - A solid-state image pickup apparatus includes a metal plate having at least one of surfaces which consists of a planar surface and an image sensor directly mounted on the surface of the metal plate through an adhesive layer, wherein the metal plate is provided with a hole-shaped or notch-shaped positioning portion for performing positioning in a direction parallel to the surface consisting of the planar surface of the metal plate.07-22-2010
20100259672CAMERA AND PRODUCTION METHOD FOR A CAMERA - An image capturing system includes an optical component, a sensor below and connected to the optical component for capturing radiation, and a chip below the sensor for processing and/or storing and/or transmitting information captured by the sensor. The sensor and the Chip are directly connected to each other. The disclosure further relates to a production method for an image capturing system.10-14-2010
20100188564IMAGING DEVICE HOLDING STRUCTURE AND IMAGING DEVICE - A holding structure 07-29-2010
20130215325ARCUATE MOTION CONTROL IN ELECTROSTATIC ACTUATORS - In one embodiment, an actuator includes a moving frame coupled to a fixed frame by a plurality of elongated parallel motion flexures for generally parallel motion relative to the fixed frame and between an as-fabricated position and a deployed position. The flexures are disposed at a first angle relative to a line extending perpendicularly to both the moving frame and the fixed frame when the moving frame is disposed in the as-fabricated position, and at a second angle relative to that same line when the moving frame is disposed in the deployed position, Arcuate movement of the first frame relative to the second frame is controlled by constraining the first angle to a value of less than about half of the sum of the first and second angles.08-22-2013
20100182497Camera Module - A camera module includes a circuit board; a lens electrically connected to the circuit board; a adjusting base disposed on the circuit board and having at least two through-hole disposed adjacent to opposite sides of the lens; at least two fixed posts; at least two adjusting screw respectively passing through the through-holes of the adjusting base so as to be secured in the fixed posts; and at least two springs respectively encircling the adjusting screws, wherein two ends of each spring are positioned against the adjusting base and one of the fixed post respectively.07-22-2010
20100177238Imaging Device - Provided is an imaging device which simplifies an assembling adjustment so as to reduce the manufacturing time and cost, wherein second lens L07-15-2010
20100253834CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module includes a wiring substrate on which an imaging device is mounted to an upper surface side thereof, and a lens holding frame which is arranged on the wiring substrate and in which a lens portion is housed, wherein a plurality of concave portions are provided side by side to a lower part of an inner wall of the lens holding frame in a height direction, and an end part of the wiring substrate is fitted in the concave portion of the lens holding frame and is fixed thereto. A holding member having elasticity in an upper and lower direction is provided to stand to an inside part of the lens holding frame, and a top end part of the holding member touches an upper surface of the wiring substrate, and thereby the wiring substrate is held.10-07-2010
20090040369LENS BARREL AND IMAGE PICKUP DEVICE THEREFOR - A lens barrel capable of reliably housing a flexible printed circuit board without increasing the number of its component parts and its outer diameter. A guide member is inserted in a through hole of a fixing member and projects from a holding member in a direction opposite to the direction toward the subject when the lens barrel is in a collapsed position.02-12-2009
20090040368IMAGE SENSOR MODULE FOR CAMERA DEVICE - An image sensor module includes a circuit board (02-12-2009
20130128107VOICE COIL MOTOR AND CAMERA MODULE USING SAME - A voice coil motor includes a stationary magnetic field generator having a supporting frame, a moveable magnetic field generator, a case and a double sided adhesive layer. The supporting frame defines a first receiving space receiving the moveable magnetic field generator. The moveable magnetic field generator defines a second receiving space. The case encloses the stationary magnetic field generator, the moveable magnetic field generator and the double sided adhesive layer and includes a bottom plate and side plates. The bottom plate includes a first surface and a second surface facing away the first surface. The side plates extend from the second surface. The bottom plate defines a through hole. A diameter of the through hole is smaller than that of the second receiving space. The double sided adhesive layer is entirely covering the second face.05-23-2013
20130128108CAMERA MODULE - Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.05-23-2013
20130128109WIRING SUBSTRATE, IMAGE PICKUP DEVICE, AND IMAGE PICKUP MODULE - A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes.05-23-2013
20090115891CAMERA MODULE - Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.05-07-2009
20090109329Data connector for an electronics device - One embodiment of the invention sets forth a hand-held electronics device for recording digital video that includes a housing, a processor disposed within the housing, and a data connector coupled to the processor such that data can be transmitted to and from the processor through the data connector. The data connector includes an arm rotationally coupled to the housing, and an adapter portion matable with a corresponding adapter of a computer system. The data connector forms a portion of a top part or a bottom part of the housing when in a retracted position. Among other things, the disclosed hand-held electronics device advantageously enables a user to easily, with one hand, hold the hand-held electronics device and slide the trigger with a thumb or other finger to release the data connector into the extended position.04-30-2009
20090109328Camera module package - There is provided a camera module package. A camera module package according to an aspect of the invention includes a bonding unit at an inner surface of a housing including an optical system and a filter adhered to the bonding unit by an adhesive. Here, the bonding unit corresponding to the filter has a longitudinal central region corresponding to a gate and an overflow unit of a runner hardening unit provided when the housing is injection molded, and left and right regions while the longitudinal central region has a smaller surface height than each of the left and right regions, and the adhesive provided between the bonding unit and the filter has a predetermined thickness so that maximum thermal stress generated in the housing has a relatively smaller value than adhesive strength of the adhesive.04-30-2009
20090109330Case member, sensor module, and electronic information device - A case member has a predetermined surface and a sealable inside, where a first circular area for passing light is provided at the center portion of the predetermined surface, a double-sided light shielding sheet, which is provided with a second circular area for passing light at the center, is adhered to the predetermined surface such that the second circular area is positioned in a concentric circle manner to the first circular area, the second circular area having a diameter smaller than the diameter of the first circular area, a transparent dustproof film is adhered on the light shielding sheet.04-30-2009
20110242408DIGITAL CAMERA - A digital camera includes a bezel and an extending ring. The bezel includes a convex ring and at least one fixing portion. The convex ring is positioned on a center of the bezel. The fixing portion is defined on an outer sidewall of the convex ring. The extending ring includes a sleeve, a flange, and at least one fastening portion. The sleeve is placed around the outer sidewall of the convex ring. The flange extends from an end of the sleeve and abuts the convex ring. The fastening portion cooperates with the fixing portion.10-06-2011
20110043684Imaging device and method of producing the same - An imaging device comprises: a lens housing on which lens groups are mounted and which has a first opening opened along an optical axis direction of the lens groups; and a drive housing on which a drive source for moving the lens groups in the optical axis direction is mounted and which has a drive-use opening to be communicated with the first opening of the lens housing. The lens housing and the drive housing are combined together so as to be separable from each other in a state that the first opening and the drive-use opening are communicated with each other.02-24-2011
20110025908PORTABLE ELECTRONIC DEVICE WITH SLIDABLE IMAGE CAPTURING ASSEMBLY - A portable electronic device includes a shell, an image capturing assembly, a signal processing circuit, and a connection plate. The shell defines a first annular shaped guiding slot. The image capturing assembly includes a camera module. The camera module includes a substrate and a flexible circuit board (FPC). The FPC has one end connected to the substrate and another end electrically coupled to the signal processing circuit. The connection plate includes a first plate positioned on the shell and a second plate perpendicular to the first plate. A second guiding slot is defined on the second plate and aligned with the first guiding slot on the shell. The connection plate, the shell, the first and second annular guiding slots cooperatively define a laid-down T-shaped receiving groove, the image capturing assembly is received in the T-shaped groove and is slidable along the T-shaped groove.02-03-2011
20100328525CAMERA MODULE - A camera module and a method of manufacturing the camera module are provided. The camera module includes a substrate having an opening through which light passes, a circuit pattern for transmitting an electrical signal, and first and second terminals connected to the circuit pattern; an image sensor combined with the substrate so as to receive the light through the opening, and electrically connected to the first terminals; a lead frame disposed around the image sensor and electrically connected to the second terminals of the substrate; a housing combined on a surface of the substrate opposite to another surface on which the image sensor and the lead frame are combined; and a lens disposed in the housing.12-30-2010
20110242409DIGITAL CAMERA - A digital camera includes a bezel and an extending ring. The bezel defines a circular-shaped recess, and N pairs of support arms are positioned on the inner sidewall of the recess. The N is an integer equaling or exceeding 2. Each of the pairs of support arms has different height and the two support arms in each of the pairs of support arms are symmetrically placed with respect to a central axis of the recess. The extending ring defines N−1 pairs of bar-shaped slots. An end of the extending ring contacts an end surface of one of the N pairs of support arms, and the N−1 pairs of bar-shaped slots are positioned corresponding to the other N−1 of the N pairs of support arms.10-06-2011
20110115975IMAGING DEVICE - To produce a subject's image on an imager as accurately as possible, a technique that is effectively applicable to the process of assembling an optical system is provided.05-19-2011
20130155317IMAGING DEVICE - There is provided an imaging device including a lens mount on which a lens is mounted, an image sensor that has an imaging face on which a subject image is formed by the lens, an image sensor holder on which the image sensor is mounted, biasing members that bias the image sensor holder in a direction of the lens mount, and an adjustment mechanism that is provided between the image sensor holder and the lens mount to adjust a distance between the imaging face and the lens mount.06-20-2013
20110075022IMAGING DEVICE, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING IMAGING DEVICE - An imaging device includes an imaging unit, and a panel facing the imaging unit. The panel includes a panel body that has an anti-reflection-coated surface treated with anti-reflection coating and has a portion thereof overlapping an angle of view of the imaging unit, a sheet that is provided on a portion of the anti-reflection-coated surface outside of the angle of view, and a resin layer that has a pattern and is provided on a side of the sheet near the imaging unit.03-31-2011
20110242407CAMERA MODULE AND METHOD FOR MAKING SAME - A camera module includes a lens module, an infrared cut film covering the majority of the outer surface of the lens module, a printed circuit board, and a mass of reflowable solder paste attaching the lens module to the print circuit board.10-06-2011
20110134314IMAGE SENSOR MODULE FOR CAMERA DEVICE - An image sensor module includes a circuit board, an image sensor, and a supporting board. The image sensor is electrically connected to the circuit board. The circuit board defines a through opening therein. The supporting board is arranged on one side of the circuit board and includes a protrusion. The protrusion extends outwardly from the supporting board and includes a square-shaped block no larger than the image sensor. The square-shaped block passes through the through opening. The image sensor is mounted on the block and spaced from the circuit board.06-09-2011
20110085076IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME - An image pickup unit according to the present invention includes: a lens frame that internally holds an image pickup optical system; and a backside illuminated image pickup device which has a light-receiving section that receives light entering the lens frame via the image pickup optical system and which is held inside the lens frame, wherein a claw portion of the lens frame abuts an opposing surface that opposes a light-entering surface of the image pickup device so as to define a position of the image pickup optical system in an optical axis direction L with respect to the light-receiving section using the opposing surface as a reference.04-14-2011
20100013985CAMERA MODULE - An exemplary camera module includes a barrel, a holder engaged with the barrel, a first lens received in the barrel, an image sensor received in the holder and a second lens received in the holder. The holder includes an inner chamber. The second lens is mounted on the holder proximate to the image sensor. The second lens is configured for preventing dust accessing into the inner chamber. The second lens includes a main body and an infrared cut film formed on and in contact with an outside surface of the main body or embedded within the main body.01-21-2010
20120188441CAMERA DRIVE DEVICE - A camera driving apparatus according to the present invention includes: a camera portion having an imaging plane; a movable unit incorporating the camera portion, including an attracting magnet, and having an outer shape formed as a convex partial spherical surface; a fixing unit which includes a magnetic body and a concave portion to which the movable unit is loosely fitted, and in which a magnetic attraction force of the attracting magnet with respect to the magnetic body causes the convex partial spherical surface of the movable unit and the concave portion to be held in point contact or linear contact with each other, thereby enabling the movable unit to freely rotate about a spherical center of the first convex partial spherical surface; a panning drive portion; a tilting drive portion; a rolling drive portion; and a detector for detecting a tilt angle of the camera portion in a panning direction with respect to the fixing unit, a tilt angle of the camera portion in a tilting direction with respect to the fixing unit, and a rotation angle of the camera unit to be rotated in a rolling direction with respect to the fixing unit.07-26-2012
20110096223CAMERA MODULE AND MANUFACTURING METHOD THEREOF - A camera module includes an image sensor, a first substrate, a lens, a second substrate, and a light shading cover. The first substrate includes a first surface and a second surface opposite to the first surface. The first substrate defines a first aperture. The image sensor is attached to the first surface. The lens is attached to the second surface. The second substrate is attached to a surface of the lens away from the first substrate. The second substrate defines a second aperture. The light shading cover defines a third aperture. The light shading cover is covered on the second substrate and defining a third aperture coaxial to the first aperture . The center of the first aperture, the second aperture, and the third aperture are located on the optical axis of the camera module.04-28-2011
20110249176WAFER LEVEL LENS MODULE AND RELATED METHOD FOR FORMING THE SAME - A wafer level lens module includes a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed upon the first optical layer, having a hole through the spacer layer for light passage, wherein a surface of the hole substantially avoids light reflection. And the second optical layer is disposed upon the spacer layer.10-13-2011
20110075024Photographic Device and Holder Thereof - A holder is disclosed, wherein the holder is situated on a circuit board and is used for connecting with an electronic component. The holder comprises an upper surface, a lower surface, and an opening. The upper surface comprises a recess used for laying a flat component, wherein the recess comprises at least one rough area; the lower surface comprises a protruding edge, wherein the protruding edge is connected with the circuit board with glue, and the protruding side and the circuit board delimit a space; and the opening penetrates the upper surface and the lower surface, whereby the gas generated from heating the glue will accumulate in the enclosed space, and the gas will then escape through the opening and out through at least one of the rough areas.03-31-2011
20110075021IMAGING MODULE WITH FIXED-FOCUS LENS - An exemplary imaging module includes a substrate, an image sensor, a lens barrel, a lens, and a holder. The image sensor is fixed on the substrate, the lens barrel is connected to the substrate to enclose the image sensor, the lens is received in the lens barrel, and the holder is connected to the lens barrel and partially receives the lens barrel therein. The lens barrel includes an elastic protruding portion protruding from the inner surface thereof. The inner surface of the protruding portion elastically abuts a side surface of the lens.03-31-2011
20120147259SMALL INDUSTRIAL ELECTRONIC IMAGING CAMERA - A lens mount, a board mount frame, a tri-face cover, and a connector metal bracket attached with an external interface connector which are constitutive elements forming a box-type camera housing are respectively a housing constitutive element common to a back-cable-lead assembly structure and a side-cable-lead assembly structure. The box-type camera housing having a four-piece structure in which a capable of providing an external interface connector in an arbitrary face among five faces as targets excepting a front face is achieved by the lens mount, the board mount frame, the tri-face cover, and the connector metal bracket attached with the external interface connector.06-14-2012
20110043687CAMERA MODULE - An exemplary camera module includes an image sensor package, an enclosure, and a lens module. The image sensor package includes a circuit board and an image sensor mounted on the circuit board. The enclosure is attached on the circuit board and includes four elastic engaging portions protruding from an interior surface thereof. The lens module includes a barrel and at least one optical element received in the barrel. The barrel defines four recesses in an outer surface thereof. The barrel is detachably mounted in the enclosure. The engaging portions engage in the respective recesses.02-24-2011
20110043686IMAGE SENSING MODULE AND CAMERA MODULE HAVING SAME - An exemplary image sensing module includes a base, a transparent plate, many first electrically conductive poles, an image sensor, and many passive components. The base includes a top surface and a recess defined in the top surface. The transparent plate is mounted on the top surface of the base, and covers the recess. The transparent plate includes a first surface facing away from the recess. The first electrically conductive poles extend through the transparent plate. The image sensor is received in the recess of the base. The passive components are attached on the first surface of the transparent plate, and surround the image sensor. The passive elements are connected electrically with the image sensor via the first electrically conductive poles.02-24-2011
20110019075CAMERA MODULE WITH ANTI-SHAKE MECHANISM - An exemplary camera module includes a fixture, a lens module, a movable frame, an image sensor, a position sensor, a first and a second magnet, and a first and a second magnetic field generator. The position sensor is used to detect displacements of the lens module caused by shake. The magnetic field generators are used to apply a magnetic field to the corresponding magnets, each of the magnetic field generators is electrifiable in response to detection by the position sensor of displacement of the lens module caused by shake. Accordingly, at least one of the magnets and the corresponding magnetic field generator cooperatively drive the lens module to move and compensate the displacement of the image sensor.01-27-2011
20110019076IMAGE CAPTURING DEVICE HAVING OBLIQUE IMAGE SENSOR - An image capturing device includes a lens module defining an optical axis, a holder defining an opening and a space communicating with the opening, an image processing unit received in the space, and an image sensor received in the space and fixed on the image processing unit. The holder is configured for receiving the lens module. The image processing unit is electrically connected to the image processing unit and inclined relative to the optical axis. The image sensor is configured for capturing images of objects. The optical axis passes through the center of the sensing surface of image sensor.01-27-2011
20110019077CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE - There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact.01-27-2011
20100315546Imaging Device and Manufacturing method therefor - There is provided an imaging device capable of easily shielding an imaging element. The imaging device comprises a conductive mirror frame, an element unit including an imaging element equipped with a photoelectric converter, and an imaging lens attached within the mirror frame and imaging a subject image on the photoelectric converter of the imaging element. The element unit has an exposed conductive member contactable to the mirror frame.12-16-2010
20100295989IMAGE CAPTURING DEVICE AND MANUFACTURING METHOD OF SEALING STRUCTURE - An image capturing device including a housing, a sealing element, a light-permeable cover and a lens module is provided. The housing has an opening portion, and the opening portion has an inner periphery and an outer periphery. The sealing element is integrated with the housing by injection molding, wherein the inner periphery and the outer periphery of the opening portion are surrounded by the sealing element. The light-permeable cover is integrated with the sealing element by injection molding and corresponding to the opening portion, wherein a periphery portion of the light-permeable cover is surrounded by the sealing element, and a containing space is defined by the housing, the sealing element and the light-permeable cover. The lens module is disposed in the containing space. In addition, a manufacturing method of a sealing structure is also provided.11-25-2010
20100271541CAMERA MODULE WITH PIEZOELECTRIC ACTUATOR - A camera module includes a positioning plate, a positioning frame, a spring member, a lens holder, and a piezoelectric actuator. The positioning frame is fixed to the positioning plate and defines a positioning through hole. The spring member is disposed on the positioning plate and in a compressed state. The lens holder is received in the positioning through hole and movably engaged with the positioning frame. The piezoelectric actuator is sandwiched between the compressed spring member and the lens holder. The piezoelectric actuator is operable to drive the lens holder to rotate about a central axis of the positioning frame, thereby move along the central axis relative to the positioning frame.10-28-2010
20100265389CAMERA SOCKET MODULE - A method of tracking and acting on events related to the delivery of a mail piece is provided. An integrated record associated with an addressee of a mail piece is created. The mail piece is given a unique identifier, is associated with the addressee, and is placed in a mail stream with the date and nature of associated delivery events being recorded. After a predetermined delivery event occurs, a follow-up communication is transmitted to the addressee, and the date of this follow-up communication is recorded. The date of any response by the addressee to the follow-up communication is also recorded. To the integrated record associated with the addressee is added the date and nature of the delivery events associated with the mail piece, the date of the follow-up communication, and the date of any response by the addressee to the follow-up communication.10-21-2010
20100265388LID OPENING AND CLOSING MECHANISM - A container unit (10-21-2010
20100053423Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly - A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.03-04-2010
20120200768LENS BARREL AND IMAGING DEVICE - An interchangeable lens unit is provided that includes a lens housing, a cam frame, a zoom motor mounted to the lens housing, and a transmission mechanism. The zoom motor has a zoom driveshaft that outputs a driving force. The transmission mechanism is configured to transmit the driving force from the zoom driveshaft to the cam frame. The lengthwise direction of the zoom motor is oriented differently than the direction of the optical axis. When viewed along the direction of the optical axis, the zoom motor is disposed on the inner peripheral side of the cam frame.08-09-2012
20090109327CAMERA MODULE - A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.04-30-2009
20110255000CAMERA ALIGNMENT AND MOUNTING STRUCTURES - An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.10-20-2011
20100302437SOLID-STATE IMAGING UNIT, IMAGING APPARATUS, AND METHOD OF FIXING SOLID-STATE IMAGING DEVICE - An embodiment of the invention relates to a solid-state imaging unit including a solid-state imaging device and a supporting member that is provided on the rear side of the solid-state imaging device. An object of the invention is to provide a solid-state imaging unit that is positioned without being affected by a part error of the solid-state imaging device or the supporting member.12-02-2010
20100321563SOLID-STATE IMAGING UNIT - A solid-state imaging unit includes: an imaging device receiving light at a light-receiving surface thereof; and a protective component having a light transmissive member covering the light-receiving surface of the imaging device and a frame securing the light transmissive member at the periphery thereof, the protective component being mounted on a peripheral region of the light-receiving surface of the imaging device, wherein at least the frame is formed using a molding process.12-23-2010
20100321564Camera system and associated methods - A camera system may include an optics stack including two substrates, the optics stack forming an imaging system, each substrate having two surfaces that are parallel to each other and perpendicular to an optical axis of the imaging system, the optics stack including a securing region on opposing surfaces of the two substrates, the two substrates being secured together on a wafer level at their respective securing regions, at least one of the surfaces of the two substrates including a refractive surface of the imaging system, a detector substrate having an active area and a cover structure protecting at least the active area of the detector substrate, the optics stack being secured to an upper surface of the cover structure.12-23-2010
20100321562LENS HOLDER MODULE AND CAMERA MODULE UTILIZING THE SAME - A lens holder module includes a holder and an optical element. The holder has a peripheral sidewall. The peripheral sidewall has a first connection portion formed on an inner surface thereof. The optical element is received in the holder and spaced a distance from the first connection portion. The optical element has a top surface facing the first connection portion. At least one slot is recessed below on the inner surface and located between the first connection portion and the optical element. The at least one slot is proximate to the top surface of the optical element. The width of the at least one slot along an axis of the holder is from 0.01 to 0.2 mm.12-23-2010
20080252775Camera module and method of manufacturing the same - Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.10-16-2008
20110019078LENS BARREL AND IMAGING DEVICE - The lens barrel includes a flexible wire, a first supporting frame, and a second supporting frame. The flexible wire has a first end, a second end, and a flexible mounting portion. The first end includes at least one terminal. The second end includes at least one terminal. The mounting portion is disposed between the first end and the second end. The first supporting frame is configured to support the first end. The second supporting frame includes a storage component configured to support the mounting portion and is movably disposed in a first direction.01-27-2011
20090201414Solid Image capture device and electronic device incorporating same - A solid image capture device 08-13-2009
20110080516IMAGE SENSOR MODULE AND IMAGING DEVICE INCLUDING THE IMAGE SENSOR MODULE - An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module.04-07-2011
20100110282CAMERA LENS MODULE AND MANUFACTURING METHOD THEREOF - The present invention discloses a camera lens module. The present invention places and fixes an image sensor chip in an opening in a substrate and then assembles a frame, a lens holder and a lens, thereby minimizing the superposition height of the camera lens module and ensuring that the assembly is simpler and more effective.05-06-2010
20110187922DIGITAL SINGLE LENS REFLEX CAMERA - To simplify and miniaturize an interface structure for power supply and signal transmission and reception between a camera body and a lens unit and reduce operation restrictions of the interface structure, a digital single lens reflex (DSLR) camera includes a camera body and a lens unit which is attached to or detached from the camera body, in which the camera body includes interface pins formed contactable with the lens unit, the interface pins including power pins and signal pins, a pin housing that receives therein the interface pins, a flexible printed circuit board (FPCB) including a first pattern portion electrically connected with the power pins and a second pattern portion electrically connected with the signal pins, and a lead wire electrically connected with the first pattern portion.08-04-2011
20110187921CAMERA MODULE AND ELECTRONIC DEVICE UTILIZING THE SAME - A camera module includes a substrate, a lens module, a driver circuit and a electromagnetic interference shield. The substrate includes a first surface and a second surface opposite to the first surface, and the lens module is positioned on the first surface of the substrate. The driver circuit is positioned on the first surface of the substrate, and is electrically connected to the lens module. The electromagnetic interference shield is positioned on the first surface of the substrate and covers the driver circuit. The electromagnetic interference shield includes a case and pins. The case covers the driver circuit. The pins extend from the case and pass through the substrate to secure the electromagnetic interference shield on the substrate.08-04-2011
20110149143Image pickup lens, camera module using the same, image pickup lens manufacturing method and camera module manufacturing method - An image pickup lens is provided that includes a substrate; resin layers formed on both respective opposite surfaces of the substrate; a lens portion formed on at least any one of the surfaces of the substrate; and a spacer formed on at least any one of the surfaces of the substrate at an area surrounding the lens portion.06-23-2011
20120147258CAMERA MODULE - The present disclosure relates to a camera module including a fixture; a moving part centrally coupled with a lens and arranged to move relative to the fixture; three or more magnets arranged at a periphery of the moving part; and three or more coils arranged from an inner surface of the fixture to areas opposite to the three or more magnets, where each of the coils independently receives a control signal so that the moving part moves to a height direction and tilted relative to a central axis of the moving part, whereby a lens can be axially moved and tilted at the same time using arrangement of a single set of coils and magnets.06-14-2012
20110025909WAFER-LEVEL CAMERA MODULE AND METHOD FOR COATING THE SAME - A method for coating wafer level camera modules, comprising: providing a wafer level camera module comprising an outer surface, depositing an opaque layer onto the outer surface, applying a photoresist layer onto the opaque layer, exposing a selected area of the photoresist layer to light to remove the selected area, etching part of the opaque layer within the selected area to form an light incident hole, and removing the remaining photoresist layer.02-03-2011
20110115974Integrated lens and chip assembly for a digital camera - A integrated camera module (05-19-2011
20120307139CAMERA MODULE AND FABRICATION METHOD THEREOF - A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.12-06-2012
20120307140VOICE COIL MOTOR AND RELATED IMAGE CAPTURING MODULE - A voice coil motor includes a movable receiving cylinder having protrusions formed at an end; a wire coil surrounding the receiving cylinder; a hollow fixing frame receiving the receiving cylinder and the wire coil; magnetic members fixedly received in the fixing frame, top and bottom elastic members. The top elastic member includes a peripheral portion and a resilient central portion, the central portion having a central opening and cutouts. The protrusions of the receiving cylinder are engaged in the cutouts. The peripheral portion is fixed at a lower position than the central portion, thereby forming an elastic force applied to the receiving cylinder when no current is applied to the wire coil. The bottom elastic member is connected to the receiving cylinder and the fixing frame, and is in an undeformed state when no current is applied to the wire coil.12-06-2012
20110050989MOBILE TERMINAL - A mobile terminal is disclosed, by which a user is facilitated to carry and use a terminal in a simple and easy way. According to the present invention, since a camera module is configured in a manner that a protective cover is provided not to a case but to a module body, it is advantageous in protecting a lens unit provided to the module body before installing the camera module at the case. While light passes through a protective cover, a protective cover physically isolates an inside of a camera module from an outside to prevent external particles from being introduced into the camera module. Therefore, it is advantageous in enhancing durability of the camera module. A loading portion is provided to a case to guide an installation position of a camera module. A separate cover is not added to the case. And, a protective cover of a camera module is directly exposed to outside. Therefore, accumulation of numerical value tolerance is barely generated and an assembly process is simplified.03-03-2011
20110050988Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information device - An optical element module according to the present invention is provided, in which: one or a plurality of optical elements are housed within a light shielding holder; a slanting surface is provided on an outer circumference side of an optical surface of the optical element facing an aperture opening of the light shielding holder; a slanting surface is provided on an inner surface on a back side of the aperture opening of the light shielding holder in such a manner to face the slanting surface of the optical element; and the slanting surface of the optical element and the slanting surface of the light shielding holder are guided together, so that the aperture opening of the light shielding holder and the optical surface of the optical element are positioned.03-03-2011
20110050987LENS UNIT AND IMAGING DEVICE - A lens unit having a first lens (03-03-2011
20110109791CERAMIC PACKAGE AND CAMERA MODULE - According to one embodiment, a ceramic package of which inner space is sealed by a ceramic base plate and a cover portion mounted on the ceramic base plate. The ceramic package has an image sensor, an element unit and a lead electrode. The image sensor and the element unit are mounted on the ceramic base plate. The lead electrode is formed on the ceramic base plate and electrically connected to the image sensor by a bonding wire. A surface on which the lead electrode is formed is the same as a surface on which the cover portion is mounted.05-12-2011
20120147257ELECTRONIC APPARATUS INCORPORATING RECORDING MEDIUM FOR RECORDING DATA SUCH AS IMAGE AND/OR CHARACTER - An electronic apparatus having a mechanism configured to, when disposing of the electronic apparatus, reliably prevent data from being leaked out from a recording medium incorporated in the electronic apparatus with simple work not requiring taking the electronic apparatus apart. A recording board is provided inside an apparatus body. A recording medium is mounted on the recording board. A terminal board is provided inside the apparatus body. A connection terminal is mounted on the terminal board. A terminal hole of the connection terminal connects with an external apparatus and opens externally of the apparatus body. The terminal hole extends through the connection terminal, and a surface of the recording board is disposed so as to intersect with an extension of an axis of the terminal hole.06-14-2012
20090135298DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both side surfaces of the containing portion across the second optical axis of the bending optical system; and shock absorbing means provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto.05-28-2009
20090135297CAMERA MODULE - An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip.05-28-2009
20120044414Thin Image Capturing Apparatus - A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images.02-23-2012
20120044412CAMERA MODULE AND ASSEMBLY METHOD THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the first circuit board. Incident light passes through the lens module and the filter in that order, and finally projects on the image sensor chip.02-23-2012
20120044411CAMERA MODULE AND METHOD FOR ASSEMBLING THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a first receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the first receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the base.02-23-2012
20120044410CAMERA MODULE AND ELECTRONIC DEVICE USING SAME - A camera module includes a printed circuit board and a camera mounted to the printed circuit board. The printed circuit board further defines a at least one cut-out located near the camera.02-23-2012
20120002102CAMERA MODULE - A camera module includes a lens drive device that moves an image pickup lens along an optical axis. The lens drive device has electromagnetic drive means that drives the image pickup lens by electromagnetic force with use of a coil and a magnet. The image pickup lens has a planimetrically rectangular shape. The magnet and the coil are disposed along each of at least one pair of opposite sides of the rectangular shape. By utilizing the characteristics of the image pickup lens having a rectangular shape, the magnet and coil of the lens drive device are disposed along each of the at least one pair of opposite sides. This makes it possible to provide a camera module having a lens drive device with a smaller footprint (amount of space that the camera module uses) than in the case of an arrangement of magnets at the corners of the image pickup lens.01-05-2012
20120044415IMAGE PICKUP MODULE AND CAMERA - An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.02-23-2012
20120044413IMAGING APPARATUS - The image sensor and the imaging substrate are arranged in a space formed between the connection portion and the plane formed by the holding portion.02-23-2012
20120008043IMAGING APPARATUS - The imaging apparatus includes a lens mount to which a lens unit is mountable, an imaging unit operable to generate an image signal, and a shutter unit that is arranged between the lens mount and the imaging unit, and is capable of limiting the light incident on the imaging unit, opening and closing at least at recording and being kept in an opened state during a recording preparation operation, and a main frame to which the lens mount, the shutter unit and the imaging unit are fixed.01-12-2012
20100238346COMPACT IMAGING DEVICE - The subject matter disclosed herein relates to an imaging device having a small form factor.09-23-2010
20120105714IMAGE CAPTURE MODULE OF HANDHELD ELECTRONIC DEVICE WITH POLYDIRECTIONAL ROTATION FUNCTION - An image capture module of a handheld electronic device is provided. In the image capture module, a spherical casing cooperates with a fixing cover and accommodates a camera module. The spherical casing is fixed in a casing of the electronic device by the fixing cover. Thus, the spherical casing can rotate transversely. In addition, the fixing cover has a slot to allow a connecting wire of the camera module to pass through, and thus, the spherical casing may rotate in the fixing cover.05-03-2012
20120062790OPTICAL MEMBER AND OPTICAL MODULE - An optical member is disclosed which can prevent invasion of foreign articles into a space on a light path and can prevent deterioration of the yield in a manufacturing process. The optical member includes a first substrate, a second substrate opposed to the first substrate, a joining element for joining the first and second substrates together in a spaced relationship from each other so as to provide a space between the first substrate and the second substrate, and a porous member provided in the joining element. At least one of the first and second substrates is formed from an optical transmission member. The space between the substrates is closed by the joining element and the porous member.03-15-2012
20120154673Camera module - There is provided a camera module, including: a housing having a reception space formed in a side thereof; an image sensor unit mounted in the housing; and a passive element package mounted in the reception space and connected to the image sensor unit.06-21-2012
20120154674IMAGE-PICKUP APPARATUS - An image-pickup apparatus 06-21-2012
20110075023SUBSTRATE HOLDING APPARATUS - A substrate holding apparatus includes a case having a case body and a case cover, a plurality of substrates held in the case in a thickness direction of the substrates, and a plurality of support portions formed at the case body, the plurality of support portions constituting a plurality of support portion groups, the support portions including end surfaces whose heights in the thickness direction are the same in each of the support portion groups, the heights of the end surfaces of the support portions in one of the plurality of support portion groups being different from the heights of the end surfaces of the support portions in the other of the plurality of support portion groups, one of the substrates including a peripheral edge portion having guide grooves into which the support portions in one of the plurality of support portion groups are inserted.03-31-2011
20110102668CAMERA BODY AND IMAGING UNIT ATTACHABLE TO AND DETACHABLE FROM CAMERA BODY, AND IMAGING APPARATUS - A camera body includes a camera body connector and a recess to which an imaging unit including an optical system, an image pickup device, and an imaging unit connector is detachably attached to be placed therein. The recess includes a back wall, an upper wall, and a side wall to be opened to a lower side, a front side, and a lateral side of the camera body. The camera body has a guide mechanism to control a position of the camera body connector in relation to a position of the imaging unit connector. The imaging unit has a rear surface on which at least two guiding grooves provided to be extended between opposite edges of the imaging unit and an engagement plate section are formed. The imaging unit has a biasing member to bias the imaging unit toward the back wall. The guide mechanism has at least two guide protrusions provided on the back wall and inserted into the at least two guiding grooves and an engagement claw formed on the back wall so as to face the engagement plate section and to engage with the biasing member when the imaging unit is attached to the camera body.05-05-2011
20110102667Camera module with fold over flexible circuit and cavity substrate - A disclosed method of manufacturing a camera module includes providing an image capture device, providing an electronic component, providing a flexible circuit substrate, mounting the image capture device on a first portion of the flexible circuit substrate, mounting the electronic component on the second portion of the flexible circuit substrate, and positioning the second portion above the first portion. The method further includes providing a chip carrier including a bottom surface defining a cavity and a top surface adapted to receive the image capture device and positioning the chip carrier between the image capture device and the flexible circuit substrate. The method further includes mounting a second electronic component within the cavity.05-05-2011
20120120308CAPILLARY ACTUATOR DEPLOYMENT - A method for making an actuator includes forming a substantially planar actuator device of an electrically conductive material, the device incorporating an outer frame, a fixed frame attached to the outer frame, a moveable frame disposed parallel to the fixed frame, a motion control flexure coupling the moveable frame to the outer frame for coplanar, rectilinear movement relative to the outer frame and the fixed frame, an actuator incorporating a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moveable frame, moving the moveable frame to a deployed position that is coplanar with, parallel to and spaced a selected distance apart from the fixed frame, and fixing the moveable frame at the deployed position for substantially rectilinear, perpendicular movement relative to the fixed frame.05-17-2012
20100245661STRUCTURE FOR FIXING CAMERA MODULE ON BIODRIVE - Provided is a structure for fixing a camera module on a biodrive. The structure includes a socket fixed on a top surface of a printed circuit board (PCB) of the biodrive. The camera module is combined with the socket. A holder member is disposed over the camera module and covers the camera module. A plurality of fixing units may fix the holder member to fix the camera module on the PCB. The structure can prevent distortion and deviation of the camera module due to external shock.09-30-2010
20120218467CAMERA MODULE CAPABLE OF CALIBRATION - A camera module includes a circuit board; a lens electrically connected to the circuit board; a adjusting base disposed on the circuit board and having at least two through-hole disposed adjacent to opposite sides of the lens; at least two fixed posts; at least two adjusting screw respectively passing through the through-holes of the adjusting base so as to be secured in the fixed posts; and at least two springs respectively encircling the adjusting screws, wherein two ends of each spring are positioned against the adjusting base and one of the fixed post respectively.08-30-2012
20120249867IMAGING UNIT - An imaging unit includes a mount unit, an imaging element unit, a plurality of elastic members, a plurality of adjusting screws, and at least one restricting member. The mount unit is configured to support the interchangeable lens unit. The imaging element unit is disposed apart from the mount unit and is configured to produce image data for the subject by opto-electrical conversion. The plurality of elastic members is disposed in a compressed state between the mount unit and the imaging element unit. The plurality of adjusting screws is mounted to the mount unit and/or the imaging element unit to adjust the distance between the mount unit and the imaging element unit. The restricting member is mounted to the mount unit and/or the imaging element unit and configured to restrict the imaging element unit from moving close to the mount unit against the elastic force of the elastic members.10-04-2012
20120249868LENS MODULE, IMAGE CAPTURING DEVICE, AND ELECTRONIC APPARATUS - A lens module includes a lens body; a lens holding member that movably holds the lens body along an optical axis of the lens body without tilting the optical axis; a displacement element that has a flat-plate shape of which one end edge on a side of the lens body along the optical axis is disposed as a free end and the free end is displaced to freely approach the lens body by applying a voltage; and a push-up member that is disposed on the free end of the displacement element and is inserted on one end surface side of the lens body, which is perpendicular to the optical axis, by the approach towards the lens body of the displacement element so as to push up the lens body in the optical axis direction.10-04-2012
20100245662IMAGING APPARATUS - An imaging apparatus includes a photoelectric conversion element package, a chassis member arranged at a position opposite a rear surface of the photoelectric conversion element package, a wiring member electrically connected to the photoelectric conversion element package. The wiring member has an opening that exposes the rear surface of the photoelectric conversion element package. The wiring member is arranged between the rear surface of the photoelectric conversion element package and the chassis member. The imaging apparatus further includes a heat conduction member configured to contact the rear surface of the photoelectric conversion element package, exposed by the opening, and the chassis member.09-30-2010
20120162501ELECTRONIC DEVICE AND IMAGING DEVICE - An electronic device comprises a housing, a sliding cover and an internal member. The housing includes a plate-like member that defines a slide opening. The sliding cover includes a cover component disposed on the plate-like member and slidably attached to the slide opening, a detected component fixed to the cover component and extending into the housing, and a first restrictor fixed to the cover component. The internal member is disposed inside the housing and includes a detector switch having a contact component configured to contact the detected component when the detected component is at a specific position and a second restrictor adjacent to the first restrictor when the detected component is at the specific position. The detector switch detects when the contact component contacts the detected component. The first and second restrictors are configured to restrict movement of the plate-like member when the detected component is at the specific position.06-28-2012
20120212664CAMERA MODULE FACILITATING HEAT DISSIPATION - A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust.08-23-2012
20120133825IMAGING DEVICE - An imaging device includes a welded part on a lens barrel side that is hardened after a contact portion of a lens barrel or a contact part on the lens barrel side is softened, where the contact portion of the lens barrel and the contact part on the lens barrel side are fixed, and a welded part on a light-receiving circuit side that is hardened after a contact portion of the light-receiving circuit or a contact part on a light-receiving circuit side is softened, where the contact portion of the light-receiving circuit and the contact part on the light-receiving circuit side are fixed.05-31-2012
20120218466CAMERA HEAD AND CAMERA DEVICE - Provided is a camera head capable of further size reduction. A camera head 08-30-2012
20120162502CAMERA MODULE SOCKET DEVICE - A camera module socket device for blocking a path through which foreign materials may ingress is provided. The camera module socket device having a camera module and a socket into which the camera module is inserted includes a cap for securing the camera module in the socket, and a buffer member for closure formed between a surface of the camera module and the cap to enclose the periphery of a lens portion of the camera module, thereby preventing malfunction of the camera module and image quality degradation due to ingress of foreign materials into the lens portion and absorbing shock forces exerted at the top of the camera module socket device.06-28-2012
20120169922CAMERA MODULE - A camera module includes a lens assembly and a base board assembly. The lens assembly includes a lens, an internally threaded seat, and a barrel receiving the lens. The base board assembly includes a printed circuit board and a light sensing chip for receiving light through the lens. The seat defines a receiving cavity at least partially receiving the printed circuit board and the light sensing chip.07-05-2012
20120169921IMAGE CAPTURE SYSTEM WITH ADJUSTMENT MECHANISM - An image capture system comprises a lens module, a ball joint, and a location element. The ball joint has a spherical joint seat and a hollow socket. The top of the spherical joint seat is coupled to the lens module, and the bottom of the spherical joint seat is coupled to the hollow socket. The location element comprises a bolt, a contact plate and a threaded retainer. The location element is set in the ball joint. Through the cooperation of the threaded retainer and the bolt, the contact plate presses the spherical joint seat and the hollow socket together, thus fixing the position of the lens module. The lens module can be adjusted and rotate about multiple axes with the ball joint.07-05-2012
20120176534CAMERA MODULE - A camera module includes a square substrate, an image sensor, and a lens module. The square substrate includes a mounting surface. The mounting surface includes two opposing first sides and two opposing second sides perpendicular to the two first sides. The square substrate includes two first protrusions respectively arranged on the center of the two first sides and two second protrusions respectively arranged on the center of the two second sides. The image sensor is fixed on the mounting surface. The lens module is mounted on the substrate, abutting against the two first protrusions and the two second protrusions and housing the image sensor.07-12-2012
20120314126MINIATURIZATION IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME - A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.12-13-2012
20120075523IMAGING UNIT - An imaging unit includes a housing having an opening on one of opposite sides in a direction of thickness thereof; an imaging optical system provided in the housing and includes an incident surface and an exit-side prism, wherein object-emanated light being incident on said incident surface and traveling in a lengthwise direction of said housing is reflected by said exit-side prism toward said opening; an image sensor, installed in the housing, with an imaging surface facing the other of the opposite sides of the housing toward an exit surface of the exit-side prism; a spacer projecting from the housing or a fixed member, the spacer contacting the image sensor to create a clearance between the exit surface and the imaging surface; and a cover fixed to the housing to close the opening and press the image sensor so as to come in contact with the spacer.03-29-2012
20100039553Camera module - The present invention relates to a camera module including a substrate; a housing which is coupled to the substrate and includes a support unit extended to an inside of a lower part and a shaft insertion groove at one side of the support unit; a guide shaft vertically coupled inside the housing by inserting a lower end portion into the shaft insertion groove; a conductive pattern extended from a lower end portion of the housing to a bottom surface of the support unit; an image sensor closely coupled to the bottom surface of the support unit by being electrically connected to the conductive pattern; a lens barrel fixed to an upper part of the housing by coupling a lens inside; and a movable lens barrel vertically moved along the guide shaft by mounting lens inside.02-18-2010
20110096224Camera module package - There is provided a camera module package including: a lens barrel having a lens deposited therein; a housing having the lens barrel installed therein; a board bonded to the housing and having an image sensor provided on one surface thereof to coincide with an optical axis of the lens; and a shield can covering the outside of the housing and having a ground portion. The ground portion is protruded outwards from an outer side surface of the shield can and contacts an inner side surface of a socket when the shield can is inserted into the socket.04-28-2011
20090021635CAMERA MODULE - A camera module includes a circuit board (01-22-2009
20120081600DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both sides surfaces of the containing portion across the second optical axis of the bending optical system; and a shock absorbing unit provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto.04-05-2012
20120229701CAMERA MODULE WITH PROTECTIVE AIR VENTILATION CHANNEL - A camera module with a vent in a housing thereof to allow for fluid communication between an interior of the camera module and an exterior of the camera module. A micro-porous membrane filter having a pore size smaller than 10 um is employed to cover the vent so as to reduce the flow of contaminants into the camera module.09-13-2012
20100328526MODULAR CAMERA SYSTEM AND A METHOD OF MANUFACTURING THE SAME - A camera module includes a substrate with a cavity therein. A processor is located in the cavity, and wire bonding is for connecting the processor to the substrate. An imaging module is adapted to overlay the processor in the cavity and rest on at least part of the edge of the cavity. Wire bonding is for connecting the imaging module to the substrate and the processor. The cavity includes a longitudinal cutout section adapted to accommodate at least some wire bonding for connecting the processor to the substrate or associated surface mount components.12-30-2010
20080297651OPTICAL APPARATUS HAVING DEVICE FOR REMOVING FOREIGN SUBSTANCE - An optical apparatus includes a rectangular optical member provided on an optical axis, a supporting member configured to support the optical member, and a rectangular vibrating device stuck to the optical member close to and in parallel with one of four sides of the optical member and configured to vibrate the optical member in a wave fashion having a predetermined wavelength to have a plurality of nodes parallel with the one side. A support position at which the optical member is supported by the supporting member at a side opposite the one side of the optical member is located inward from the opposite side by ¼ the predetermined wavelength.12-04-2008
20110037893Imaging Module - An imaging module includes an imaging substrate mounting an imaging device thereon, a resin holder including a substrate securing portion to which the imaging substrate is secured, a lens support barrel supporting a lens at an inside thereof, and a holding portion which protrudes toward a subject from the substrate securing portion and includes a through hole configured to permit retention of the holder in an external structure, a metal securing member disposed at a side of the substrate securing portion of the holder facing a subject, and a metal holding plate including a securing region which is secured to and electrically connected to the securing member, and a holding portion adjacent region which overlaps a part around the through hole of the holding portion and includes a through hole configured to communicate with the through hole.02-17-2011
20110037892WEBCAM WITH MOVEABLE ZOOM LENS - A webcam with an optical lens that can manually be moved into a position in front of the camera lens. The lens may slide or be rotated to a position in front of the camera lens. The optical lens may be a zoom lens, such that, in combination with the lens of the camera, a fixed zoom or magnification function is provided. Alternately, at least a second lens may also be provided, such as to provide two fixed zoom positions. The two lenses could be moved together with a single mechanical structure, or separately with two different manual controls.02-17-2011
20110043685PORTABLE ELECTRONIC DEVICE WITH CAMERA MODULE - A portable electronic device includes a main body, a number of ball bearings, a spherical retaining member and a camera module. The main body includes a cavity formed therein, and a number of recesses formed in inner walls of the cavity and in communication with the cavity. The ball bearings are received in the respective recesses. The spherical retaining member is located in the cavity and is in contact with the ball bearings. The spherical retaining member defines a receiving space therein and an opening in communication with the receiving space. The camera module is received in the receiving space and facing the opening, the camera module is retained by the spherical retaining member in a manner such that the camera module is rotated by rotating the spherical retaining member relative to the ball bearings.02-24-2011
20120140115DRIVING DEVICE, LENS BARREL, AND OPTICAL APPARATUS INCLUDING THE LENS BARREL - In a driving device, a distance from a guide member to a vibrator is less than that from the guide member to a permanent magnet in a plane perpendicular to a guiding direction of a guide member. An attraction force between the permanent magnet and a magnetic body acts as a force to rotate (i.e., a rotating force) a holding member about an axis of the guide member, and the vibrator is pressed against a contact member by the rotating force.06-07-2012
20110285901SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME AND CAMERA MODULE - A solid-state imaging device is provided. The solid-state imaging device includes an imaging area that includes arrayed pixels having photoelectric converting units and transistor elements; and a peripheral circuit, in which a wiring line in the imaging area that is shifted based on pupil correction amount and a wiring line in the peripheral circuit that is not shifted are connected through a connection expanded portion integrally formed with one or both of the wiring lines.11-24-2011
20120092552IMAGE SENSOR MODULE - An image sensor module including: a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads.04-19-2012
20120092551LENS DRIVING DEVICE AND CAMERA MODULE - A lens driving device prevents its holder from tilting while driving the lens, and has a small number of components, low cost, and small size. The lens driving device includes a base, a holder, magnets, and magnetic plates. The base includes a projection having a hook-shaped cross section. The holder includes a rotation inhibitor which comes into contact with the projection of the base. The holder is supported to the base by one shaft. One magnetic plate is located further from the shaft than the center of the magnet is. The other magnetic plate is located closer to the shaft than the center of the magnet is. The magnetic forces generated between the magnetic plates and the magnets make the holder subjected to a torque on the shaft. The torque allows the rotation inhibitor to be slightly pressed against the projection.04-19-2012
20120092550CAMERA DEVICE AND MANUFACTURING METHOD FOR A CAMERA DEVICE - A camera device (04-19-2012
20120092549PHOTOGRAPHIC DEVICE - A photographic device includes a body, and at least an optical assembly and multiple auxiliary light sources surrounding the optical assembly are disposed in the body. A front cover is disposed on a front end of the body, and a protecting mirror is disposed on the front cover. Light emitted by the auxiliary light sources passes through the protecting mirror and illuminates a photographic area. A light-blocking film is disposed on the protecting mirror corresponding to the optical assembly, so as to prevent the light emitted by the auxiliary light sources from entering the optical assembly after reflected by the protecting mirror.04-19-2012
20100208132CAMERA MODULE - A camera module includes: a case including a first surface formed with a first opening for entering incident light, and a second surface opposite to the first surface, the second surface being formed with a second opening; a lens unit mounted in the case; a first substrate including a front surface and a back surface, wherein the case is bonded to the front surface of the first substrate to seal the second opening; a filter supported by the first substrate to face the lens unit; a circuit component disposed on the front surface of the first substrate; a second substrate including a front face and a back face, wherein the front face of the second substrate is bonded to the back surface of the first substrate; and an image pickup device disposed on the front face of the second substrate to face the filer.08-19-2010
20130016280IMAGE CAPTURE DEVICE WITH LINKED MULTI-CORE PROCESSOR AND ORIENTATION SENSOR - An image capture device that has an image sensor for capturing a scene, a multi-core processor with plurality of linked, identical processing units and an image sensor interface, all incorporated onto a single chip. The device also has an orientation sensor for sensing the device orientation. The processing units are configured for receiving data from the image sensor interface and an output from the orientation sensor, to simultaneously process the data.01-17-2013
20110157462CAMERA MODULE - A camera module includes a lens module, a printed circuit board (PCB), and a connection material. The lens module includes two pins. The PCB defines two conductive grooves. The lens module is disposed on the PCB. The pins are received in the conductive grooves and connected to the PCB through the connection material received within the conductive grooves.06-30-2011
20100085474CAMERA MODULE - A camera module has a sensor unit holding an image sensor and a lens unit holding a taking lens. The sensor unit and the lens unit are joined in such a manner that an imaging plane of the image sensor is orthogonal to an optical axis of the taking lens. Each of top and bottom surfaces of the lens unit has a pair of held members to be held by holding jigs. This held member is a depression of triangular cross section defined by a bottom face that inclines toward rear surface of the lens unit. Each held member contains a positioning member that receives a pin jig when the position and angle of the sensor unit is adjusted relative to the lens unit.04-08-2010
20130093947CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a lens barrel; a housing; an IR filter; an image sensor; a circuit substrate; a shield can; a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor; and a protective cover mounted between the housing and the shield can while surrounding the bottom of the heat transfer member and connecting the housing and the shield can.04-18-2013
20130093946DISPLAY APPARATUS - A display apparatus in which the angle of a display section can be varied freely. The display apparatus includes the display section and arms. The arms connect the display section with an attachment target to which the display section is to be attached in such a manner that inclination angles of the arms with respect to the display section or the attachment target can be changed independently of one another. The number of the arms is a multiple of four.04-18-2013
20130100343CAMERA MODULE - The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.04-25-2013
20130128105VISION SYSTEM CAMERA WITH MOUNT FOR MULTIPLE LENS TYPES - This invention provides a vision system housing having a front plate assembly that accommodates a plurality of lens mount types. The front plate includes a central aperture that is located at a predetermined axial (camera axis) distance from a plane of an image sensor. The aperture is stepped from a wider diameter adjacent to the front to a narrower diameter more adjacent to the sensor. This arrangement enables threaded mounting of a plurality of lens mount types, for example M12 and C-Mount. The exterior (front) surface of the front plate includes threaded holes and a removable spring clip arrangement constructed to accommodate a liquid lens positioned over the aperture with an associated lens assembly mounted within the aperture and in optical communication with the liquid lens. The lens is operated using an electrical connection provided by a cable that interconnects with a multi-pin socket positioned on the front plate.05-23-2013
20130128106CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS - A camera module including a flexible tape substrate (e.g., a flexible printed circuit tape portion) having a plurality of surface mount components and a first frame member mounted to a first side of the substrate and an image sensor and a frame member mounted to an opposing second side of the substrate. The substrate includes a body portion and one or more leads or wing members having conductive contacts thereon extending from the body portion. The wing members may be folded onto the second frame member so that the conductive contacts of the wing members generally face in a different direction than conductive contacts of the body portion to provide an electrical path to the surface mount components in a manner that is free of using vias extending through the substrate. A tubular housing and lens barrel may be mounted to the substrate over the first frame member.05-23-2013
20130141638CAMERA MODULE WITH REDUCED SIZE - A camera module includes a lens barrel and a lens holder. The lens barrel includes a first tubular section and a second tubular section. The first tubular section extends from an end of the second tubular section. The outer diameter of the first tubular section tapers in a direction from the image side to the object side of the lens barrel. The lens holder includes a third tubular section and a fourth tubular section. The third tubular section extends from an end of the fourth tubular section. The outer diameter of the third tubular section tapers in a direction from an image side to an object side of the third tubular section. The lens barrel threadedly inserts into the lens holder and is held by the lens holder.06-06-2013
20130141639CAMERA MODULE AND MOBILE COMMUNICATION TERMINAL INCLUDING THE SAME - A camera module including an optical tube including a lens, a photodetector disposed on a first portion of a substrate, and multiple capacitors disposed on a second portion of the substrate, in which the lens overlaps only the first portion of the substrate among the first portion and the second portion of the substrate. A mobile terminal including an optical tube including a lens, a photodetector disposed on a first portion of a substrate, and a plurality of capacitors disposed on a second portion of the substrate, a bezel unit to overlap a portion of the camera module, in which the lens overlaps only the first portion of the substrate among the first portion and the second portion of the substrate, and the first portion of the substrate is disposed towards an edge portion of the mobile terminal.06-06-2013
20110221956SOLID-STATE IMAGE PICKUP DEVICE, A CAMERA MODULE AND A METHOD FOR MANUFACTURING THEREOF - A solid-state image pickup device includes a solid-state image sensor chip having a solid-state image sensor having a photosensitive element formed on a main surface of a semiconductor substrate and chip electrodes led to the back surface of the semiconductor substrate, a passive chip bonded on the back surface of the solid-state image sensor chips having passive parts mounted in its thickness and electrically connected to the chip electrodes of the solid-state image sensors. The device further includes a lens holder fixed to enclose the photosensitive element of the solid-state image pickup sensor chip and a lens barrel to fit into the lens holders, wherein the passive chip is formed having a size equal to or smaller than a size of the solid-state image sensors.09-15-2011
20130148016CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a housing; a printed circuit board disposed in the housing and having a heat dissipating hole formed at a first side thereof; an image sensor bonded to the printed circuit board and disposed on one surface of the heat dissipating hole; and a heat dissipating part having one side contacting the image sensor and the printed circuit board through the heat dissipating hole and the other side disposed at the outside of the housing to discharge heat generated from the image sensor and the printed circuit board to the outside of the housing.06-13-2013
20100283891METHOD OF SETTING POSITION OF IMAGING DEVICE - A method of setting a location of an imaging device includes (a) preparing a base unit, the base unit including a lens and a mounting boss; (b) mounting an imaging device, on which a reference point is formed, to a circuit board; (c) forming a mounting hole at a predetermined location of the circuit board based on the reference point of the imaging device; and (d) mounting the circuit board to the base unit by inserting the mounting boss into the mounting hole.11-11-2010
20100283890Module Socket - A module socket for use with camera modules has an insulative housing with a base and four walls extending upward. The base and walls have L-shaped terminal-receiving cavities that receive terminal therein. The terminals extend between the two legs of the L-shaped cavities so as to position a terminal contact portion in opposition to contacts on the bottom surface of a camera module. Two metal retainers are applied to two opposing walls of the housing and these retainers have locking arms that extend horizontally into the interior space of the housing. The locking arms each include separate angled guide members and engagement members, the first of which guide a module into the socket and the second of which retain the module in place within the socket.11-11-2010
20120274843Image Capturing Device and Assembly Method Thereof - An image capturing device and its assembly method are disclosed. The image capturing device comprises a main board, a metal plate and a sensing unit. The main board comprises a first hollowed block. The metal plate comprises a second hollowed block corresponded to the first hollowed block and is disposed at one side of the main board. The sensing unit is disposed at the other side of the main board. The metal plate is parallel to the sensing element. The first hollowed block and the second hollowed block are filled by a fastening material. In addition, the image plane of the sensing unit is perpendicular to the optical axis of the lens set. Therefore, image quality is improved.11-01-2012
20110234892HEAT DISSIPATING STRUCTURE FOR AN IMAGING UNIT - A heat dissipating structure for an imaging unit includes an imaging element configured to convert light into an electrical signal, a first heat dissipating plate, a second heat dissipating plate, and a heat dissipating portion. The first heat dissipating plate has a first end and a second end disposed opposite to the first end, and is positioned on the rear face side of the imaging element. The second heat dissipating plate is positioned on the rear face side of the first heat dissipating plate. The heat dissipating portion is fixedly coupled to the first end of the second heat dissipating plate.09-29-2011
20110234893SOLID STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE - A solid state imaging device according to one embodiment of the present invention includes a substrate with a solid state imaging element, a first impurity layer, a plurality of external electrodes, and a translucent substrate. The first impurity layer is formed on a back surface side of the substrate, and forms a pn junction with the substrate. The plurality of external electrodes is formed on the back surface of the substrate and is electrically connected to the solid state imaging element. The translucent substrate is fixed to the substrate.09-29-2011
20120281135Handpiece Camera - A handpiece camera, comprising an illumination device optical elements, and an image converter. A housing is provided with an entrance window, through which an observation light returning from an examination area shines in, which is subsequently conducted to the image converter by the optical elements. The camera has a head part and a handle part, which are detachably connected to one another. The handle part can be adjusted to a wide variety of purposes when combined with different head parts.11-08-2012
20130182180High Density Composite Focal Plane Array - A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.07-18-2013
20130120647IMAGING MODULE - An imaging module includes: a hollow lens holder open at both ends; a lens assembled in the lens holder and collecting light input from one end of the lens holder; a hollow imaging holder having an opening into which the light output from the lens is input; an optical member assembled in the imaging holder and transmitting or deflecting the light input from one end of the imaging holder; and an image sensor assembled in the imaging holder and having a light-receiving region configured to receive the light transmitted or deflected by the optical member and to perform photoelectric conversion of the received light, wherein an optical axis center of the lens and a center of the light received by the light-receiving region of the image sensor are aligned with each other by fitting a light-output-side end portion of the lens holder and the imaging holder to each other.05-16-2013
20130120649CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent.05-16-2013
20130194490LENS HOLDER DRIVING DEVICE CAPABLE OF EASILY MOUNTING UPPER ELASTIC MEMBER TO OUTER YOKE - A lens holder driving device includes a lens holder in which a lens assembly is mounted, a driving coil fixed to the lens holder at outside circumference thereof, a magnet opposite to the driving coil, a yoke including the magnet, an elastic member supporting the lens holder in a direction of an optical axis shiftably, and a base disposed at a lower side of the lens holder. The yoke includes an outer yoke including the magnet at an inner wall surface thereof. The elastic member includes an upper elastic member disposed at an upper side of the lens holder. The upper elastic member is mounted to the inner wall of the outer yoke in a state where the upper elastic member is positioned and fitted to a spacer.08-01-2013
20130201392CAMERA MODULES WITH INERTIAL SENSORS - A camera module includes an actuator that is coupled to one or more lenses of an optical train configured to move relative to an image sensor to provide alignment, zoom and/or autofocus control. The actuator is configured to position one or more, e.g., three, lenses of the optical train by applying one or more bias voltages respectively between one or more pairs of actuator components. A processor uses measured capacitances of the pairs of actuator components and/or the bias voltages thereof to calculate an acceleration or force acting on the camera module and to provide information for the actuator to align the optical train along the optical path in accordance with the information.08-08-2013
20130201391CAMERA MODULE, IMAGE PROCESSING APPARATUS, AND IMAGE PROCESSING METHOD - According to one embodiment, an image processing apparatus includes a refocus filter generating unit and a refocus image generating unit. The refocus image generating unit executes a filtering process using a refocus filter generated by the refocus filter generating unit. A filtering level of the refocus filter is adjusted according to a subject distance of a subject to be focused and sighted among a plurality of subjects projected in a first image and a second image.08-08-2013
20130100342IMAGE CAPTURING DEVICE - An image capturing device includes a base defining a receiving space and having two spaced-apart through holes, first and second lens units disposed within the receiving space, a circuit board connected to a bottom end of the base, and two sensor elements disposed on a top face of the circuit board below the first and second lens units. The first lens unit defines a first light communicating path corresponding in position with one of the through holes. The second lens unit defines a second light communicating path corresponding in position with the other through hole. The first and second lens units and the sensor elements are inclined inwardly, so that the first and second light communicating paths intersect each other in an extended direction and in the area external to the base.04-25-2013
20120300120IMAGE MODULE - An image module including a sensor, a filter, and a shading plate is provided. The filter is disposed on the sensor, and the shading plate is disposed between the sensor and the filter. The shading plate has two opposite surfaces and two adhesion layers disposed thereon separately, such that the sensor and the filter are connected to the opposite surfaces of the shading plate.11-29-2012
20130093948SOLID-STATE IMAGING APPARATUS AND METHOD OF PRODUCING A SOLID- STATE IMAGING APPARATUS - A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided.04-18-2013
20120081599DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both sides surfaces of the containing portion across the second optical axis of the bending optical system; and a shock absorbing unit provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto.04-05-2012

Patent applications in class For internal camera components