Class / Patent application number | Description | Number of patent applications / Date published |
343873000 | Antenna embedded, potted, or coated | 70 |
20080224940 | Semiconductor device and manufacturing method thereof - The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element substrate having a semiconductor element formed using a single crystal semiconductor region, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element substrate and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are fixed together. | 09-18-2008 |
20080224941 | Semiconductor device and manufacturing method thereof - The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a method for manufacturing a highly-reliable semiconductor device, which is not destructed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element layer having a semiconductor element formed using a non-single crystal semiconductor layer, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element layer and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are firmly fixed together. | 09-18-2008 |
20080246683 | Cladding For a Microwave Antenna - A cladding ( | 10-09-2008 |
20080266201 | Antenna for an electronic device - An electronic device comprises a housing having an antenna molded into the housing. | 10-30-2008 |
20080278400 | PACKAGED ANTENNA AND METHOD FOR PRODUCING SAME - Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a clip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate. | 11-13-2008 |
20080303738 | Cladding for a Microwave Antenna - A cladding ( | 12-11-2008 |
20080309581 | SEMICONDUCTOR DEVICE - In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer. | 12-18-2008 |
20080316141 | EMBEDDED ANTENNA - The present invention provides an embedded antenna. It is to form meanders on a radiating element of the embedded antenna for dividing the resonant length of the radiating element into several short resonant length to extend the bandwidth of the radiating element. It is also to form meanders on the radiating element to extend the resonant length. This design can minimize the size of the embedded antenna and achieve the same as performance of a larger size antenna. | 12-25-2008 |
20090015507 | ANTENNA FORMED WITH CASE AND METHOD OF MANUFACTURING THE SAME - There is provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator including a radiation unit tightly fixed to an outer surface of the case unit and terminal units each extending from an end portion of the radiation unit, passing through the case unit, and exposed on the inside of the case unit; and contact pins provided on a board disposed adjacent to the case unit and electrically connected to the individual terminal units. | 01-15-2009 |
20090027297 | ARRANGEMENT WITH A TRANSPONDER AND A METAL ELEMENT - The invention relates to an arrangement with a transponder ( | 01-29-2009 |
20090040128 | MOBILE APPARATUS AND METHOD OF MANUFACTURING THE SAME - There is provided a mobile apparatus including: a thin film provided as a substrate; at least one conductive pattern formed on at least one surface of the thin film; a circuit part formed on the at least one surface of the thin film to connect to the connect to the conductive pattern; and a housing formed integral with the thin film. Also, there is provided a method of manufacturing the same. | 02-12-2009 |
20090109116 | Apparatus and method for covering integrated antenna elements utilizing composite materials - The present invention provides an antenna system for transmitting and receiving radar signals comprising a first non-conductive material embedding a plurality of parasitic antenna elements, where the first non-conductive material interfaces a second non-conductive material embedding a plurality of electrical feed elements, and wherein the first non-conductive material covers one or more adjacent interconnecting joints. | 04-30-2009 |
20090184881 | STRUCTURAL FEED APERTURE FOR SPACE BASED PHASED ARRAY ANTENNAS - A structural phased array antenna and method for manufacturing are disclosed. An integrated structural antenna aperture can be used to reduce net weight, cost, and volume where an array of antenna elements are incorporated into a structural member, e.g. in a spacecraft. A structural material layer, such as a structural foam, may be used with the array of individual antenna element cavities machined into the layer. The antenna element cavities are lined with a conductive material, such as plated aluminum. Facesheets may be bonded to the front and/or backside of the structural material layer in order to increase strength and/or stiffness using an RF transparent material. The array of antenna elements may be coupled to filters at the back side of structural material layer. | 07-23-2009 |
20090184882 | Semiconductor package with an antenna and manufacture method thereof - A manufacture method of semiconductor package with an antenna includes: providing a substrate with a first surface and an opposite second surface, wherein the first surface has a predetermined circuit; arranging a functional element on the first surface and electrically connecting the functional element with the predetermined circuit of the substrate; encapsulating the functional element and a portion of the first surface of the substrate by an encapsulating body; and printing an antenna electrically connected with the predetermined circuit on the surface of the encapsulating body. A semiconductor package with an antenna is also disclosed. | 07-23-2009 |
20090207090 | Integrated antenna and chip package and method of manufacturing thereof - An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device. | 08-20-2009 |
20090295675 | IC package antenna - An IC package antenna of which a metal radiating member is firstly provided on a board to form an antenna base board; the board is formed thereon at least a feed point; and the IC package antenna is packaged with an IC packaging housing and a packaging bottom portion to form an IC chip. The IC packaging housing has a plurality of connecting pins extending outward from inside of itself; wherein the inner end of at least one connecting pin is soldering connected with a feed point of the base board of the antenna. Such an IC package antenna can allow standardized and miniaturized antenna designing, and is applicable to Surface Mount Technology (SMT). | 12-03-2009 |
20090322646 | RECONFIGURABLE ELECTROMAGNETIC ANTENNA - A reconfigurable electromagnetic antenna which comprises a radiating element consisting of a fluid substance that conducts electricity, the volume of the fluid substance being variable and that also comprises a matrix of electrodes on which the fluid substance is moved by electro-wetting. | 12-31-2009 |
20100019985 | Header with integral antenna for implantable medical devices - Antenna assemblies for an implantable medical device are disclosed. The implantable medical device comprises a hermetically sealed housing, typically formed of titanium materials, and electronics, including a transceiver, disposed therein. An antenna is disposed in an air, gas or plastic dielectric filled compartment within a header, which is attached to the housing. The header is premolded so as to create the compartment. The antenna is then placed within the compartment, which is then sealed. | 01-28-2010 |
20100033400 | SPRAY NON-CONTACT CUTTING TYPE ANTENNA AND ITS FABRICATION METHOD - A spray non-contact cutting type antenna fabrication method is disclosed to have an antenna radiator be formed on a plastic shell by means of spray-painting a metallic spray paint on the surface of the plastic shell and then cutting the metallic coating into shape, and then to cover the plastic shell with a cover layer by means of an insert molding or spray paining technique to have the antenna radiator be enveloped in the cover layer. | 02-11-2010 |
20100039347 | HOUSING FUNCTIONING AS AN ANTENNA AND METHOD FOR FABRICATING THE SAME - A housing, functioning as an antenna includes an antenna base including two protruding flanges. The housing is formed by injection molding a molten plastic material over and around the antenna base, whereby the antenna base is embedded in the housing, and the protruding flanges are exposed out of the housing. A method for fabricating the housing is also described. | 02-18-2010 |
20100073255 | Overmolded semiconductor package with an integrated antenna - According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound. | 03-25-2010 |
20100090925 | METHOD FOR ADDING RF POWDER AND RF POWDER-ADDED BASE SHEET - A method is provided for adding an RF powder to a sheet-like object having a high property value, such as a variety of cards, paper money, and securities. The RF powder makes it very difficult to produce, for example, counterfeit cards, documents and bills. Also, an RF powder-added base sheet to which the RF powder has been added is provided. In the method for adding the RF powder, the RF powder includes a plurality of RF powder particles | 04-15-2010 |
20100134380 | ANTENNA DEVICE AND METHOD OF MANUFACTURING THE SAME - An antenna device disposed in an electronic device which has a housing and a control circuit includes a metallic antenna, a carrier film and a plastic base. The metallic antenna is electrically connected with the control circuit for receiving and sending a signal. The carrier film bears the metallic antenna on one surface thereof. The plastic base is integrated with the assembly of the metallic antenna and the carrier film with the metallic antenna and sandwiched between the carrier film and the plastic base. The antenna device prevents the antenna from the wear and tear normally encountered during everyday use. | 06-03-2010 |
20100156750 | Feeding Structure of Housing With Antenna - A feeding structure of a housing with an antenna, in which a flat antenna can be attached inconspicuously to the outer surface of the housing which is hard to be affected by a metal component and power can be supplied to the flat antenna without providing a through hole causing inferior appearance. The feeding structure of the housing with an antenna comprises a housing | 06-24-2010 |
20100177007 | ANTENNA MODULE AND METHOD FOR MAKING THE SAME - An antenna module includes a carrier made of non-conductive resin and an antenna layer made of conductive material attached to the carrier. The invention also discloses a method for making the antenna module. | 07-15-2010 |
20100207838 | Antenna structure - A structure of an antenna is disclosed. The antenna comprises a flexible antenna, a first foam material, a second foam material, a cover plate and a housing. The first foam material and the second foam material together enwrap the flexible antenna. The cover plate and the first foam material match correspondingly. The housing matches with the second foam material, and the housing is joined with the cover plate. The strength of the cover plate and the housing are enhanced respectively by the first and the second foam material to prevent bending and distortion. | 08-19-2010 |
20100245206 | PLANAR ANTENNA AND METHOD OF MANUFACTURING THE SAME - To provide an inexpensive planar antenna of stable quality which has a circuit with low resistance and in which electrical continuity between the antenna and the electronic part such as IC chip is secured, a planar antenna is made to have a circuit pattern comprised of an antenna part and a connecting terminal part on a resin film, wherein the circuit pattern has a metal layer, a conductive layer provided on the top surface of the connecting terminal part of the metal layer, and a protective layer provided on the top surface of the antenna part of the metal layer and on the section from the side surface to a portion of the top surface of the conductive layer. | 09-30-2010 |
20100259461 | Antenna apparatus for explosive environments - Antenna assemblies for wireless communications in explosive environments are described. An example antenna assembly has a housing, a base member at one end of the housing, and an antenna extending through the base member and into the housing. A sealing compound within the base member encapsulates the antenna to seal the antenna at the base member. | 10-14-2010 |
20100271281 | HOUSING WITH BUILT-IN ANTENNA AND METHOD FOR FABRICATING THE SAME - A housing with a built-in antenna includes a film layer, an antenna layer, a base layer; and at least a connecting pole. The antenna layer is comprised from electro-conductive inks and printed on the film layer, the housing is formed by injection molding a molten plastic material over the film layer, the base layer is formed after the molten plastic material cooled, the antenna layer is embedded between the film layer and the base layer, the connecting pole is embedded in the base layer with an end of the connecting pole contacting the antenna and the other end of the connecting pole exposed to the out side. | 10-28-2010 |
20100271282 | EMBEDDED ANTENNA APPARATUS - An embedded antenna apparatus of a communication terminal is provided. The antenna apparatus includes a plate board having a feeding pad disposed on a side of the board; a device carrier mounted on a side of the board to expose the feeding pad; a radiation device including at least two radiation lines extending from the feeding pad to a surface of the device carrier along different paths, the at least two radiation lines radiating at a preset frequency band when electric power is fed through the feeding pad; and a ground plate having a flat plate shape mounted in an edge of the side of the board and disposed perpendicular to the side of the board, and contacting one end each of the at least two radiation lines to ground the radiation device. | 10-28-2010 |
20110102292 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing has a transparent or translucent film, an antenna, and a substrate. The antenna is a conductive coating designed and configured in a pattern and is formed on portions of one surface of the film. The substrate is molded on the antenna and on the area of the film not covered by the antenna. A method for making the device housing is also described. | 05-05-2011 |
20110134012 | HOUSING AND METHOD FOR MAKING THE SAME - A housing includes a first main body, a second main body, and a antenna. The second main body is attached to the first main body. The antenna is formed between the first main body and the second main body by an injection molding process. The antenna is partially exposed from the first main body and the second main body to form a terminal. The present disclosure further discloses a method for making the housing. | 06-09-2011 |
20110134013 | RADIO FREQUENCY ANTENNA IN A HEADER OF AN IMPLANTABLE MEDICAL DEVICE - An apparatus and method for enabling far-field radio frequency communications with an implantable medical device in which an antenna structure is disposed within a header assembly of the device. The antenna structure, in various embodiments, includes a monopole antenna, a dipole antenna, an inverted F antenna, a patch antenna and a slot antenna. | 06-09-2011 |
20110148734 | CABLE CONNECTION PIN AND EMBEDDED ANTENNA TYPE ELECTRONIC DEVICE HAVING THE SAME - A cable connection pin includes: support portions supported by an injection-molded face; a first receiving rack formed to extend from the support portion and receiving one side of a cable; and a second receiving rack receiving the opposite side of the cable. | 06-23-2011 |
20110181488 | ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD - An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module. | 07-28-2011 |
20110205141 | ANTENNA PATTERN FRAME AND MOLD FOR MANUFACTURING ELECTRONIC DEVICE CASE INCLUDING THE SAME - There is provided an antenna pattern frame including: a radiator comprising an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; and a radiator frame manufactured by injection molding on the radiator, allowing the antenna pattern portion to be embedded in a case of the electronic device, and supporting the radiator. The radiator frame includes a hydraulic recess introducing a resin material to a mold for manufacturing a case of the electronic device in which the radiator is embedded through injection molding, so that the radiator frame contacts the mold by injection pressure. | 08-25-2011 |
20110215983 | Antenna device including helical antenna - In an antenna device, a first helical part of a first antenna and a second helical part of a second antenna is disposed in a dielectric body on a ground plane. Each helical part is helically wound up in a direction perpendicular to the ground plane and includes a plurality of one-turn portions. Each one-turn portion of the first helical part has a peripheral length of M times a wavelength λ of use, where M is a positive natural number. One of the one-turn portions of the second helical part closest to the ground plane has a peripheral length Ks that is N times the wavelength λ of use, where N is a positive natural number greater than M. One of the one-turn portions of the second helical part farthest away from the ground plane has a peripheral length Ke, and (M·λ)09-08-2011 | |
20110260945 | Coating Composition and Article Using the Same - To provide a coating composition which is excellent in water resistance, insulating properties and ultraviolet degradation resistance, and is also excellent in transparency of a coating film formed after coating. | 10-27-2011 |
20110273356 | RADIO WAVE TRANSMITTING DECORATIVE MEMBER AND THE PRODUCTION METHOD THEREOF - The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering. | 11-10-2011 |
20110316759 | HOUSING OF PORTABLE ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME - A portable electronic device includes a base, an antenna radiator, an outer layer, and at least one conductive contact. The antenna radiator is formed on the activated base by plating. The antenna radiator is sandwiched between the base and the outer layer. One end of each conductive contact is electrically connected to the antenna radiator, and the other end of the each conductive contact is exposed. | 12-29-2011 |
20120056798 | INJECTION MOLDED CASE HAVING ANTENNA PATTERN AND MANUFACTURING METHOD THEREOF - An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process. | 03-08-2012 |
20120068908 | MOBILE COMMUNICATION TERMINAL CASING EQUIPPED WITH INTERNAL ANTENNA - Disclosed herein is a mobile communication terminal casing equipped with an internal antenna. The mobile communication terminal casing includes an antenna sheet having contact terminals, and an injection-molded casing product including an inner surface having an internal groove that is coupled to the antenna sheet and an outer surface opposite to the inner surface. A second surface opposite to a first surface of the antenna sheet on which the contact terminals are located comes into contact with the internal groove of the injection-molded casing product, and the first surface is injection-molded to be exposed outside of the injection-molded casing product. | 03-22-2012 |
20120119972 | GSM ANTENNA, IN PARTICULAR FOR A DEVICE USING THE PUBLIC NETWORK - The invention relates to a GSM antenna for transmitting or receiving information between a machine or a network of machines and a server, said antenna including a metal strand ( | 05-17-2012 |
20120235879 | THREE DIMENSIONAL ANTENNA - An antenna shape can be inked onto a thin film and then the thin film can be shaped to form a three dimensional (3D) flex-film. The 3D flex-film can then be integrated into a carrier using conventional molding processes. The resultant housing includes a carrier that supports the 3D flex-film on an inner or outer surface of the carrier. The resultant housing thus allows for improved integration of an antenna with a housing so as to provide a more desirable housing for devices that can benefit from the corresponding antenna, such as, but not limited to, mobile devices. | 09-20-2012 |
20120287013 | ANTENNA MODULE AND METHOD FOR MAKING THE SAME - An antenna module includes a main body and a three-dimensional radiator embedded in the main body. The main body is made of foamed ceramic material. A method for making the antenna is also described. | 11-15-2012 |
20120319923 | HOUSING OF ELECTRONIC DEVICE AND METHOD - In the present disclosure, a housing for electronic device and method for making the housing is disclosed. The housing includes a base, an antenna radiator, and a decoration layer. The antenna is formed on the base by injection molding and is covered by the decoration layer. The antenna radiator includes a primary layer and a plating layer. The antenna is covered and protected by the decoration layer, thus, the housing can be used for a long period. | 12-20-2012 |
20130027274 | INTEGRATED MILLIMETER WAVE TRANSCEIVER - A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on an electronic device; at least one integrated circuit chip assembled on the upper surface of the interposer; at least one antenna including at least one track formed on the upper surface of the interposer; and at least one block attached under the plate and including in front of each antenna a cavity having a metalized bottom, the distance between each antenna and the bottom being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials. | 01-31-2013 |
20130127684 | PLASTIC UNIT INTERNALLY EMBEDDED WITH ANTENNA AND MANUFACTURING METHOD OF THE SAME - The present invention provides a plastic unit internally embedded with an antenna and a manufacturing method of the same. The manufacturing method comprises the steps of preparing a plastic housing, installing an antenna metal wiring on the plastic housing, and covering a heated and softened thermoplastic material on the antenna metal wiring and the plastic housing. The cooled thermoplastic material and the plastic housing are combined as a plastic member. The antenna metal wiring is internally embedded in the plastic member. | 05-23-2013 |
20130181881 | ANTENNA ASSEMBLY - Among the embodiments disclosed herein is an antenna assembly comprising the combination of a dielectrically loaded antenna and a housing, the housing incorporating a connector for coupling the antenna to host equipment. The antenna comprises an insulative core which has an outer surface and is shaped to define a central axis, and a laminate board on the central axis, the laminate board extending proximally from a proximal core surface portion oriented transversely with respect to the axis. The housing comprises a housing body which forms a hollow conductive shield for the laminate board, and is centred on the antenna axis, and the housing is shaped to provide a mounting surface which, in a cross-sectional plane perpendicular to the axis, defines a periphery of an area in the said plane which area is at least as great as the cross-sectional area of the said proximal portion of the antenna. | 07-18-2013 |
20130194157 | ANTENNA FOR AN ELECTRONIC DEVICE IN A TYRE - An antenna includes a core and is intended to be integrated into a rubber compound for a tyre. The antenna further includes an electromagnetic-signal conduction layer, which is made of copper and coats the core, and a chemical isolation layer, which coats the conduction layer and is intended to chemically isolate the rubber compound from an object coated by the isolation layer. | 08-01-2013 |
20130207874 | ANTI-CRACK MEANS FOR WIRE ANTENNA IN TRANSPONDER - The invention concerns a support for an antenna, such as a RFID antenna, used in a flexible cover, for example a passport cover, whereby said antenna is surrounded by material of said cover. Said support comprises means for disconnecting the antenna from the surrounding material so that bending stress applied to said material is not transferred to the antenna. The support may be used in different products, for example in passports. | 08-15-2013 |
20130321238 | RADIO COMMUNICATION APPARATUS WITH BUILT-IN ANTENNA - According to one embodiment, the radio communication apparatus has a printed-wiring board, an electronic element, a first electrode, a second electrode, an antenna, and a molded member. The first electrode is conductor-connected to the printed-wiring board. The second electrode has the same size as the first electrode, is disposed parallel to the first electrode, and capacitively coupled to the first electrode. The molded member buries the printed-wiring board, the electronic element, the first electrode, the second electrode, and the antenna. | 12-05-2013 |
20130328743 | COAXIAL HELICAL ANTENNA - A coaxial helical antenna for transmitting or receiving information through electromagnetic waves includes a first helical antenna comprising a first helix comprising a first diameter and a center cavity; a second helical antenna comprising a second helix comprising a second diameter, wherein the second diameter is smaller than the first diameter, and wherein the second helical antenna is seated within the center cavity of the first helical antenna; a shaped ground plate coupled to the first helical antenna and the second helical antenna; and two microstrip impedance transformers coupled to the first helical antenna, the second helical antenna, and the shaped ground plate. | 12-12-2013 |
20130342423 | ELECTRONIC DEVICE, DECORATED ARTICLE, DECORATION FILM, MANUFACTURING METHOD FOR DECORATED ARTICLE AND MANUFACTURING METHOD FOR DECORATION FILM - An electronic device, a decorated article, a decoration film, a manufacturing method for the decorated article and a manufacturing method for the decoration film are provided. The decoration film includes a substrate, a releasing layer formed on the substrate, a durable layer formed on the releasing layer, an antenna formed on the durable layer and an adhesive layer covering the durable layer and the antenna. The durable layer has an opening. The antenna covers the opening. The electronic device includes a casing and an electronic module disposed inside the casing. The casing includes a body, an antenna transferred on a surface of the body and a durable layer covering the surface of the body and part of the antenna. The durable layer has an opening, and other part of the antenna is exposed in the opening. The electronic module is electrically connected to the antenna. | 12-26-2013 |
20140028522 | COVER HAVING AN ANTENNA RADIATING ELEMENT FOR A WIRELESS ACCESS POINT - An antenna assembly includes a cover having a plurality of layers including electrical insulator layers and an antenna radiating element between the electrical insulator layers. | 01-30-2014 |
20140071019 | ANTENNA APPARATUS AND METHOD OF MANUFACTURING THE SAME - Disclosed are an antenna apparatus and a method of manufacturing the same. The antenna apparatus includes a base, a radiation device on the base, and a protective layer formed on the radiation device to expose a partial region of the radiation device. The outer appearance failure of the antenna apparatus can be prevented, and the electrical performance of the antenna apparatus can be ensured. | 03-13-2014 |
20140232609 | WINDOW ASSEMBLY FOR DISPLAY DEVICE WITH ANTENNA AND METHOD OF MANUFACTURING THE SAME - A window assembly for a display device with an antenna includes a cover window, an antenna pattern, an insulating layer, and an antenna pad. The cover window includes a receiving recess having a bottom surface with a concavo-convex shape. The antenna pattern is accommodated in the receiving recess to cover the bottom surface and the antenna pattern has a lower surface with a concavo-convex shape corresponding to the concavo-convex shape of the bottom surface. The insulating layer is accommodated in the receiving recess to cover the antenna pattern. The antenna pad is disposed on the insulating layer and electrically coupled to the antenna pattern. Thus, a volume of the antenna pattern is increased, and a radiation capability of the antenna may be improved. | 08-21-2014 |
20140232610 | ANTENNA DEVICE - An antenna device includes a first antenna element made of a conductive metallic plate and formed in a shape of a meander; a second antenna element made of another conductive metallic plate and formed in another shape of a meander; and a sealing material which is made of a high-dielectric material and is configured to seal the first and second antenna elements by the sealing material, wherein the first antenna element is arranged in parallel with the second antenna element, and wherein the first and second antenna elements are embedded inside the sealing material by insert molding. | 08-21-2014 |
20140247195 | SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate. | 09-04-2014 |
20150048994 | ANTENNA MODULE AND MANUFACTURING METHOD THEREOF - An antenna module includes: a first injection-molded part which is formed to have a base portion and a protrusion portion to be protruded from the base portion by an injection molding; an antenna pattern which is positioned on the protrusion portion; and a second injection-molded part which is formed to cover the antenna pattern by an injection molding. Since the antenna pattern is formed on the protrusion portion of the first injection-molded part, the thickness of a portion of the second injection-molded part on the antenna pattern can be minimized, and accordingly the antenna module and the mobile terminal case can be formed to be thin, light-weight and slim while the transmitting/receiving efficiency of the antenna can be maximized. | 02-19-2015 |
20150145747 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF - An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package. | 05-28-2015 |
20150295305 | Encapsulated Molded Package with Embedded Antenna for High Data Rate Communication Using a Dielectric Waveguide - An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC. | 10-15-2015 |
20150303586 | MODULAR ANTENNA ASSEMBLY - Embodiments of the present disclosure provide an antenna assembly that includes a plurality of separate and distinct antenna modules that are interconnected together to form an antenna layer. Each of the antenna modules may include a support structure including a core frame connected to a core support, and a backskin connected to one or both of the core frame and the core support. The antenna assembly may also include an alignment grid configured to receive and align each of the antenna modules, and/or a matching layer configured to receive and align each of the antenna modules. | 10-22-2015 |
20150303589 | QUADRI-POLARIZED ANTENNA OSCILLATOR, QUADRI-POLARIZED ANTENNA AND QUADRI-POLARIZED MULTI-ANTENNA ARRAY - A quadri-polarized antenna oscillator, a quadri-polarized antenna, and a quadri-polarized multi-antenna array are provided. The quadri-polarized antenna oscillator comprises four polarized oscillators, wherein midpoints of the four polarized oscillators are coincident; a polarization direction of a first polarized oscillator is a horizontal direction; a polarization direction of a second polarized oscillator is perpendicular to the horizontal direction; a polarization direction of a third polarized oscillator has a 45° angle with the horizontal direction; and a polarization direction of a fourth polarized oscillator has a −45° angle with the horizontal direction. By integrating four polarized oscillators having different polarization directions into one antenna oscillator, the width of the MIMO multi-antenna is reduced, and the horizontal space between two columns of dual-polarized antennas is not required any more, thus the deployment of LTE and 4G networks are favourably implemented without extra space requirement to the top surface of a base station. | 10-22-2015 |
20150333395 | PACKAGED ANTENNA AND METHOD FOR PRODUCING SAME - Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a chip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate. | 11-19-2015 |
20150349416 | WIRELESS MODULE WITH PLURAL IN-PLANE TERMINALS - The wireless module according to the present invention includes a wireless IC chip for processing transmission/reception signals, a substrate on which the wireless IC chip is mounted, an antenna provided on the substrate, and a plurality of terminals extending off from the substrate in an in-plane direction of the substrate. | 12-03-2015 |
20160006107 | Glazing - A compact arrangement of antennas in a glazing is disclosed, which allows a plurality of antenna wires to be connected to an external circuit by a single contact. Parallel conductors, in direct current isolation from each other so that alternating current coupling occurs between them, are embedded at different depths in the thickness of a ply of plastic material. In plan view, conductors at different depths may be positioned closer to each other than in the prior art, so antennas connected to them are less obtrusive and may even be hidden completely under an obscuration band. Different widths of parallel conductor may be used. A thin antenna, connected to a thin conductor, may be positioned in a vision area of a glazing without impeding the view. | 01-07-2016 |
20160013547 | LOW-FREQUENCY ANTENNA | 01-14-2016 |
20160087333 | INTEGRATED CIRCUIT PACKAGE - An integrated circuit package has a first side and an opposite second side. The integrated circuit package comprises: a stack of layers comprising at least a first and second electrically isolating layers, a dielectric material arranged on the stack of layers at the second side for encapsulating the integrated circuit package, a first integrated antenna structure for transmitting and/or receiving a first radio frequency signal, and a first array of electrically conductive vias extending through at least the first electrically isolating layer and the dielectric material. The first integrated antenna structure is arranged between the first and second electrically isolating layers and is surrounded by the electrically conductive vias which are electrically connected to respective first metal patches arranged on the dielectric material at the second side. | 03-24-2016 |
20160181206 | SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER | 06-23-2016 |