Class / Patent application number | Description | Number of patent applications / Date published |
338315000 | WITH MOUNTING OR SUPPORTING MEANS | 6 |
20090102599 | Duplex-attachment of ceramic disk PTC to substrates - This is a ceramic disk PTC and heater assembly, and a method for attaching one to the other, the combination useful in the heating elements of solid ink printing apparatus. The ceramic disk PTC attachment method is made up of a low melting temperature solder and a high operating temperature adhesive. The solder attaches the disk to a substrate, and provides a low resistance electrical and thermal bond to the substrate. The adhesive is used to substantially completely encircle the solder, containing the solder when melted, and keeping the PTC attached when the solder is melted. The adhesive can also partially encircle the solder to a degree sufficient to substantially prevent substantial escape of molten solder from the attachment area. | 04-23-2009 |
338320000 | Plural resistors | 5 |
20080303627 | RESISTOR FOR MICROWAVE APPLICATIONS - A resistor assembly for use at microwave frequencies, has a substrate with first and second contacts or metalizations at either end of the substrate. A third contact or metallization is provided on one side of the substrate generally in the middle thereof. First and second resistors, as thin film resistors, are provided on the substrate extending between the first and second contacts and the third, central contact. A third resistor is provided on the other side of the substrate, connecting the first and second contacts, so as to form a delta configuration of three resistors. This then provides a resistor configuration that can be used to implement a three port Wilkinson splitter or combiner. | 12-11-2008 |
20090212900 | SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS - A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor. | 08-27-2009 |
20120223806 | INSULATION STRUCTURE FOR RESISTOR GRIDS - An insulation board for a resistor grid and methods for manufacturing the same are disclosed. The insulation board consists of a plurality of longitudinal voids. One or more longitudinal structural members are disposed in the longitudinal voids. The longitudinal structural members may be shaped to conform to the shape of the longitudinal voids. The method of constructing the insulation board includes providing a profiled block and inserting one or more longitudinal structural members in the longitudinal voids. Alternatively, the insulation board may be constructed by providing one or more longitudinal structural members and molding a profiled block over the longitudinal structural members. One or more rows of transverse pin holes may be provided along the length of the insulation board for engaging pins of resistive elements of the resistor grid. | 09-06-2012 |
20140306796 | Circuitry Apparatus - An apparatus for easing installation of electronic devices. A plurality of resistors and wires in various configurations and values join to form a unitary circuit. The unitary circuit includes a predetermined Ohm value, or other electrical value. The unitary circuit allows for facilitated installation onto additional circuits, such as security system. A first resistor and a second resistor join in series-parallel or parallel-series to each other. The first resistor joins to a first black wire and a first gray wire. The second resistor joins to a first black wire, a second black wire, and a second gray wire. The components are twist tied together and joined with shrink tube, hard tube, and finally labeled shrink tube. This forms a prepackaged bundle of electrical components with labeled resistor values. The first resistor and second resistor each have a value of 1 kilohm or 2 kiliohms. | 10-16-2014 |
20150310970 | RESISTANCE ASSEMBLY FOR MOBILE DEVICE AND MANUFACTURING METHOD THEREOF - A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit. | 10-29-2015 |