Class / Patent application number | Description | Number of patent applications / Date published |
338308000 | Resistance element coated on base | 52 |
20090002123 | Ti(N) thin-film resistor deposited on ALN substrate and attenuator using same - The present invention relates to a thin-film resistor for an attenuator that is utilized in the fourth generation mobile communication, and more specifically, to a thin-film resistor having a Ti(N) thin film formed on an aluminum nitride (ALN) substrate. | 01-01-2009 |
20090002124 | Apertured chip resistor and method for fabricating same - An apertured fixed chip resistor and method for fabricating the same are disclosed according to the present invention, wherein a bonding layer is applied to accordingly bond together a substrate and a metallic sheet structure that has central aperture, and then a passivation layer is applied to partially cover the exposed surface of the metallic sheet structure and to divide the surface of the metallic sheet structure into a central covered region separating two uncovered regions, wherein the uncovered regions are provided to serve as electrode zones, thereby eliminating unnecessary current transmission impedance as in prior art as well as efficiently and stably reducing the temperature coefficient of resistance. The bonding design of the substrate and the metallic sheet structure of the present invention is capable of overcoming the drawback of the high cost of semiconductor processing as applied in prior art, and it provides a simple fabrication process that is capable of increasing process yield and decreasing total production costs. | 01-01-2009 |
20090091418 | COATED WIRE AND FILM RESISTOR - A coated wire is solderable with soft solder while maintaining separate phases of the core and the coating. A 100 μm to 400 μm thick nickel wire may be coated galvanically with silver. For a film resistor with coated wires as connection wires, including a platinum measurement resistor on an electrically insulating substrate and connection wires connected to the measurement resistor, the connection wires have a coated nickel core. The coating may be made of silver or glass or ceramic or a mixture of these materials, or on its outside may be made of glass or ceramic or a mixture of these materials. For producing film resistors a thin metal or glass component is deposited on a connection wire connected to a track conductor arranged on an electrically insulating substrate, and a thick glass paste is deposited and fired on this metal or glass component. For mass production of film, several film resistors encased together in glass may be partitioned by fracturing. | 04-09-2009 |
20090134967 | RESISTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a glazed metal film resistor device excellent in TCR characteristics with using an economical base body containing glass by reducing affection to TCR characteristics caused by glass contained in the base body. The resistor device comprises base body | 05-28-2009 |
20090206981 | MATCHED RF RESISTOR HAVING A PLANAR LAYER STRUCTURE - The invention relates to an RF resistor, and in particular an RF terminating resistor, having a planar layer structure which has, on a substrate ( | 08-20-2009 |
20090206982 | THIN-FILM RESISTOR WITH A LAYER STRUCTURE AND METHOD FOR MANUFACTURING A THIN-FILM RESISTOR WITH A LAYER STRUCTURE - A thin-film resistor with a layer structure with a Ti layer and a TiN layer is described, wherein a layer thickness of the Ti layer and a layer thickness of the TiN layer are selected such that a resulting temperature coefficient of resistance (TCR) is smaller than 1000 ppm/° C. | 08-20-2009 |
20090261941 | SURFACE-MODIFIED RUTHENIUM OXIDE CONDUCTIVE MATERIAL, LEAD-FREE GLASS(ES), THICK FILM RESISTOR PASTE(S), AND DEVICES MADE THEREFROM - The invention relates to a surface-modified RuO | 10-22-2009 |
20090261942 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - An electronic component and a method for producing the electronic component achieve efficient production of resistive elements with various resistances. The electronic component includes a pair of terminals opposite each other and a resistive element disposed between the pair of terminals. The resistive element includes a plurality of dots arranged so as to overlap each other in a reference arrangement pattern excluding a portion of the arrangement pattern. To produce the electronic component, an electronic component is prototyped in advance and includes a resistive element in which the dots are arranged in the entire reference arrangement pattern between the pair of terminals. The prototyped resistive element is then partially removed so as to attain a desired resistance. An electronic component is then produced in which the dots are arranged in the reference arrangement pattern with a portion of the arrangement pattern excluded on the basis of the shape of the partially removed resistive element. | 10-22-2009 |
20090267726 | METAL FOIL RESISTOR - The metal foil resistor having a metal foil resistive element | 10-29-2009 |
20100039213 | METHOD FOR PRODUCING AN ELECTRICAL RESISTOR ON A SUBSTRATE - A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment. | 02-18-2010 |
20100134239 | Method of using a switchable resistive perovskite microelectronic device with multi-Layer thin film structure - A switchable resistive device has a multi-layer thin film structure interposed between an upper conductive electrode and a lower conductive electrode. The multi-layer thin film structure comprises a perovskite layer with one buffer layer on one side of the perovskite layer, or a perovskite layer with buffer layers on both sides of the perovskite layer. Reversible resistance changes are induced in the device under applied electrical pulses. The resistance changes of the device are retained after applied electric pulses. The functions of the buffer layer(s) added to the device include magnification of the resistance switching region, reduction of the pulse voltage needed to switch the device, protection of the device from being damaged by a large pulse shock, improvement of the temperature and radiation properties, and increased stability of the device allowing for multivalued memory applications. | 06-03-2010 |
20100237982 | METAL STRIP RESISTOR FOR MITIGATING EFFECTS OF THERMAL EMF - A metal strip resistor includes a resistor body having a resistive element formed from a strip of an electrically resistive metal material and a first termination electrically connected to the resistive element to form a first junction and a second termination electrically connected to the resistive element to form a second junction, the first termination and the second termination formed from strips of electrically conductive metal material. The resistive element, the first termination, and the second termination being arranged mitigate thermally induced voltages between the first junction and the second junction. | 09-23-2010 |
20100245031 | Electrical Multilayer Component and Method for Producing an Electrical Multilayer Component - An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. Electrode layers of identical electrical polarity are jointly contacted to an external contact arranged at a side face of the stack. A resistor sintered to the stack and containing ceramic resistance material is arranged on an end face of the stack. | 09-30-2010 |
20100301989 | Sputter deposition of cermet resistor films with low temperature coefficient of resistance - A solution for producing nanoscale thickness resistor films with sheet resistances above 1000Ω/□ (ohm per square) and low temperature coefficients of resistance (TCR) from −50 ppm/° C. to near zero is disclosed. In a preferred embodiment, a silicon-chromium based compound material (cermet) is sputter deposited onto a substrate at elevated temperature with applied rf substrate bias. The substrate is then exposed to a process including exposure to a first in-situ anneal under vacuum, followed by exposure to air, and followed then by exposure to a second anneal under vacuum. This approach results in films that have thermally stable resistance properties and desirable TCR characteristics. | 12-02-2010 |
20110018678 | POLY-RESISTOR, AND LINEAR AMPLIFIER - The present invention provides a poly-resistor with an improved linearity. Majority charge carrier wells are provided under the poly-strips and are biased in such way that the non-linearity of the resistor is reduced. Further, when such poly-resistors are used in amplifier circuits, the gain of the amplifier remains constant against the poly-depletion effect. | 01-27-2011 |
20110304423 | Method of using a buffered electric pulse induced resistance device - A switchable resistive device has a multi-layer thin film structure interposed between an upper conductive electrode and a lower conductive electrode. The multi-layer thin film structure comprises a perovskite layer with one buffer layer on one side of the perovskite layer, or a perovskite layer with buffer layers on both sides of the perovskite layer. Reversible resistance changes are induced in the device under applied electrical pulses. The resistance changes of the device are retained after applied electric pulses. The selected duration of the electrical pulse is in the range of from about 8 nanosecond to about 100 milliseconds. The selected maximum value of the electrical pulse is in the range of from about 1 V to about 150 V. The electrical pulse may have square, saw-toothed, triangular, sine, oscillating or other waveforms, and may be of positive or negative polarity. | 12-15-2011 |
20120098635 | RESISTIVE ELEMENT AND MANUFACTURING METHOD THEREFOR - A higher precision resistive element suppresses variation of the resistance value due to variation of film thickness. A resistive element includes a first portion having a first film thickness and a first width, and a second portion having the first film thickness and a second width determined by the first width. The sum of the first and second widths is constant. The first portion has an upper surface at a position at which a height from the bottom surface of the resistive element first portion is a first height. The resistive element second portion has an upper surface of the resistive element second portion at a position at which a height from a surface including the bottom surface of the resistive element first portion is the first height. The resistive element first portion and the resistive element second portion are coupled to each other via a coupling portion. | 04-26-2012 |
20120306611 | THIN FILM RESISTOR - The present disclosure relates to a thin film resistor that is formed on a substrate along with other semiconductor devices to form all or part of an electronic circuit. The thin film resistor includes a resistor segment that is formed over the substrate and a protective cap that is formed over the resistor segment. The protective cap is provided to keep at least a portion of the resistor segment from oxidizing during fabrication of the thin film resistor and other components that are provided on the semiconductor substrate. As such, no oxide layer is formed between the resistor segment and the protective cap. Contacts for the thin film resistor may be provided at various locations on the protective cap, and as such, are not provided solely over a portion of the resistor segment that is covered with an oxide layer. | 12-06-2012 |
20140015635 | METAL FOIL HAVING ELECTRICAL RESISTANCE LAYER, AND MANUFACTURING METHOD FOR SAME - The present invention provides a metal foil provided with an electrical resistance layer, in which peeling between the metal foil and the electrical resistance layer disposed on the metal foil can be prevented and variation in the resistivity of the resistance layer can be reduced, and a method of manufacturing the same. The present invention includes a metal foil with an electrical resistance layer including a metal foil having a surface of a ten-point mean roughness Rz, which is measured by an optical method according to 1 μm or less and the surface being treated by irradiation with ion beams at an ion beam intensity of 0.70-2.10 sec·W/cm | 01-16-2014 |
20140111301 | High-Resistance Thin-Film Resistor and Method of Forming the Resistor - The resistance of a thin-film resistor is substantially increased by forming the thin-film resistor to line one or more non-conductive trenches. By lining the one or more non-conductive trenches, the overall length of the resistor is increased while still consuming approximately the same surface area as a conventional resistor. | 04-24-2014 |
20140167911 | Resistor Component - A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability. | 06-19-2014 |
20150022312 | CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF - A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board. | 01-22-2015 |
20160027562 | PRECISION RESISTOR TUNING AND TESTING BY INKJET TECHNOLOGY - A method of additive tuning a resistor includes measuring resistance across a recessed area of the resistor using at least two terminals, depositing resistance material from an ink jet across the recessed area of the resistor device concurrently with the measuring resistance, and ceasing the depositing upon obtaining a measurement of a resistance threshold value. | 01-28-2016 |
20160163432 | THERMALLY SPRAYED THIN FILM RESISTOR AND METHOD OF MAKING - A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition. | 06-09-2016 |
20160196902 | CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF | 07-07-2016 |
338309000 | Terminal coated on | 27 |
20080197967 | Circuit boards with embedded resistors - The present invention relates to an adjustable resistor embedded in a circuit board and a method of fabricating the same. The adjustable resistor comprises a resistor with a number of connection terminals, and a number of via holes extending to contact with the resistor. The resistive value of the resistor is variable depending on the size of the via holes, the number of the via holes, or the distance between the via holes. | 08-21-2008 |
20080211619 | SULFURATION RESISTANT CHIP RESISTOR AND METHOD FOR MAKING SAME - A chip resistor includes an insulating substrate | 09-04-2008 |
20080218306 | Chip resistor and method of making the same - A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface of the substrate is formed with a raised portion in the form of a plateau which is smaller in size than the substrate in a second direction perpendicular to the first direction. The paired electrodes are formed on the raised portion. The resistor element is equal in size to the raised portion in the second direction. | 09-11-2008 |
20080224818 | Chip Resistor and Manufacturing Method Thereof - A chip resistor (A | 09-18-2008 |
20080290984 | EMBEDDED RESISTOR DEVICES - An embedded resistor device includes a resistor, a ground plane located near a first side of the resistor and electrically coupled to a first end of the resistor, at the ground plane a hole is provided, a first dielectric layer exists between the resistor and the ground plane, a conductive wire, which is electrically coupled to a second end of the resistor different from the first end of the resistor and partially surrounds the resistor, is used as an auxiliary for supporting a resistor-coating process of the resistor and to provide a terminal of the embedded resistor device at the conductive wire, a conductive region located near a second side of the ground plane different from the first side of the resistor, a second dielectric layer exists between the ground plane and the conductive region, and a conductive path to electrically couple the conductive wire to the conductive region through the hole. | 11-27-2008 |
20090040010 | Embedded resistor and capacitor circuit and method of fabricating same - An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor. | 02-12-2009 |
20090040011 | Chip Resistor and Its Manufacturing Method - A chip resistor ( | 02-12-2009 |
20090108986 | Chip Resistor - [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield. | 04-30-2009 |
20090115568 | Chip Resistor and Method for Producing the Same - The chip resistor ( | 05-07-2009 |
20090115569 | Chip Resistor - [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance. | 05-07-2009 |
20090160602 | Chip Resistor - The chip resistor ( | 06-25-2009 |
20090231086 | TERMINAL STRUCTURE OF CHIPLIKE ELECTRIC COMPONENT - A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-based front electrode | 09-17-2009 |
20090322468 | Chip Resistor and Manufacturing Method Thereof - [Problem] To provide a chip resistor and a method for manufacturing thereof, the chip resistor keeping easily soldering strength even if mounted in a horizontal position, and never projects from a holding recess of a positioning jig in a mounting process, and further does not hinder miniaturization thereof from being promoted, while keeping a good appearance thereof. | 12-31-2009 |
20100102923 | CHIP RESISTOR AND METHOD OF MAKING THE SAME - A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface of the substrate is formed with a raised portion in the form of a plateau which is smaller in size than the substrate in a second direction perpendicular to the first direction. The paired electrodes are formed on the raised portion. The resistor element is equal in size to the raised portion in the second direction. | 04-29-2010 |
20100171584 | CHIP RESISTOR AND METHOD OF MAKING THE SAME - A chip resistor of the present invention includes a substrate, a pair of electrode elements, a resistive layer, and a protective layer. The substrate is made of an insulating material and includes a first surface, a second surface opposite the first surface and a thickness defined between the first surface and the second surface. The electrode elements are formed on the first surface of the substrate and spaced apart from each other. The resistive layer is formed on the first surface of the substrate and electrically connected to the electrode elements. The protective layer is provided to cover the resistive layer. The first surface of the substrate is a mount side surface to face toward a mounting target, on which the chip resistor is mounted. Each of the electrode elements comprises an electrode layer and a conductive layer. The electrode layer is electrically connected directly to the resistive layer. The conductive layer is formed on the electrode layer. The boundary between the electrode layer and the conductive layer in each of the electrode elements is positioned closer to the substrate than the end surface of the protective layer in the thickness direction of the substrate. | 07-08-2010 |
20100201477 | CHIP RESISTOR AND METHOD FOR MAKING THE SAME - The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance. | 08-12-2010 |
20100225439 | ARRAY RESISTOR AND METHOD OF FABRICATING THE SAME - An array resistor may include a body, a first resistor, and a second resistor. The body may have a front surface, a rear surface opposite to the front surface, and side surfaces connecting the front surface and the rear surface. The first resistor may be disposed on the front surface, the first side surface, and the second side surface opposite to the first side surface. The second resistor may be disposed on the rear surface, the third side surface, and the fourth side surface opposite to the third side surface. | 09-09-2010 |
20100328022 | METHOD FOR FABRICATING METAL GATE AND POLYSILICON RESISTOR AND RELATED POLYSILICON RESISTOR STRUCTURE - An integrated method includes fabricating a metal gate and a polysilicon resistor structure. A photoresistor layer is defined by an SAB photo mask and covers a part of a polysilicon structure of the polysilicon resistor. When the gate conductor of a poly gate transistor is etched, the part of the polysilicon structure is protected by the patterned photoresistor layer. After the polysilicon resistor and the metal gate are formed. The polysilicon resistor still has sufficient resistance and includes two metal structures for electrical connection. | 12-30-2010 |
20110057767 | ARRAY TYPE CHIP RESISTOR - The present invention provides an array type chip resistor including: a substrate formed in a rectangular parallelepiped shape; lower electrodes disposed on both sides of a bottom surface of the substrate at equal spaces; side electrodes extended from some of lower electrodes, formed on outermost edges of both sides of the substrate, in all lower electrodes, to a side surface of the substrate; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate. | 03-10-2011 |
20110234365 | CHIP RESISTOR HAVING LOW RESISTANCE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a chip resistor having low resistance and a method for manufacturing the same. The chip resistor includes a substrate, a resistive layer, a pair of conducting layers and at least one protective layer. The substrate has a first surface. The resistive layer is disposed on the first surface of the substrate. The conducting layers are disposed adjacent to the first surface of the substrate. The at least one protective layer is disposed on the resistive layer or the conducting layers. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, thereby improving yield rate and efficiency while reducing manufacturing cost. | 09-29-2011 |
20120126934 | SULFURATION RESISTANT CHIP RESISTOR AND METHOD FOR MAKING SAME - A chip resistor includes an insulating substrate | 05-24-2012 |
20120235782 | CHIP RESISTOR DEVICE AND A METHOD FOR MAKING THE SAME - A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed. | 09-20-2012 |
20130027175 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME - A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion. | 01-31-2013 |
20130127587 | CO-FIRED MULTI-LAYER STACK CHIP RESISTOR AND MANUFACTURING METHOD - A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction. The multi-layer stack resistance structure monomer and the ceramic substrate are sintered and shaped with the predetermined sintering temperature and the predetermined sintering time in a kiln stove. | 05-23-2013 |
20130154790 | CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR). | 06-20-2013 |
20140049358 | CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME - There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni). | 02-20-2014 |
20150357097 | CHIP RESISTOR - The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes. | 12-10-2015 |