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Printed circuit-type coil

Subclass of:

336 - Inductor devices

336199000 - COIL OR COIL TURN SUPPORTS OR SPACERS

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DocumentTitleDate
20130027172METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR AND STRUCTURE THEREOF - A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.01-31-2013
20130027171ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR SAME - An electronic component and manufacturing method for preparing an electronic component includes providing a first insulator layer having a first nickel content rate. A coil conductor and a second insulator layer having a first bismuth content rate and a second nickel content rate higher than the first nickel content rate are provided on the first insulator layer. The first insulator layer, the coil conductor, and the second insulator layer constitute a first unit layer. The first unit layer and an exterior insulator layer are laminated to obtain a laminate. After a step of firing the laminate, a nickel content rate in a first portion of the first insulator layer, the first portion being sandwiched between the coil conductors from both sides facing in a lamination direction, is lower than a nickel content rate in a second portion of the first insulator layer other than the first portion.01-31-2013
20130027169MAGNETIC COMPONENTS AND METHODS OF MANUFACTURING THE SAME - Magnetic component assemblies and core structures including coil coupling arrangements, that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers.01-31-2013
20130027168MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product.01-31-2013
20090278650INDUCTOR - An inductor includes a casing, a coil and a core. The casing is provided with a slot. The coil is constituted of a first terminal, a bottom ring, a top ring and a second terminal. The first terminal is formed into a T-shaped strip and is partially inserted into the slot. The bottom ring wraps from a distal end of the first terminal. The top ring wraps from the distal end of the bottom ring and is overlapped on the bottom ring. The distal end of the top ring is bent downwardly to be located at the outside of the bottom ring. The second terminal extends from the distal end of the top ring and is partially inserted into the slot. The shape of the second terminal is the same as that of the first terminal. All of the first terminal, the bottom ring and the top ring have the same cross-sectional area. The core penetrates the coil and is accommodated in the casing.11-12-2009
20090051477PLANAR TRANSFORMER, TRANSMISSION LINE BALUN AND METHOD OF FABRICATION - A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.02-26-2009
20090195344CONTACTLESS DATA COMMUNICATIONS COUPLER - The embodiments of the present invention provide a non-contact data connection that is adaptable to transmit data across an air gap. The data connection includes a first substrate (08-06-2009
20090195343Planar inductor - A planar inductor (08-06-2009
20100164671INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION - An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.07-01-2010
20100164672SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and a method for manufacturing the same improves performance of an inductor, wherein a PGS pattern formed in a spiral shape, like inductors, blocks electric current induced to a semiconductor substrate, removes effects of parasitic capacitance thereon and thereby improves performance of the inductor. In accordance with the method, the PGS pattern is formed in a spiral shape, like the inductor, to inhibit flow of induced current. As a result, flow of current induced to the semiconductor substrate, one of resistant conductors, can be blocked. In addition, the PGS pattern acts between the inductor and the semiconductor substrate, thus preventing current leakage to the semiconductor substrate. Furthermore, the PGS pattern is interposed between the inductor and the semiconductor substrate to form an inductor-inserted structure, thus enabling reduction in effects of parasitic capacitance generated between the inductor and the semiconductor substrate on the semiconductor substrate arranged thereunder.07-01-2010
20130027170ISOLATED POWER CONVERTER WITH MAGNETICS ON CHIP - An integrated circuit fabricated with a number of layer may include a substrate, a transformer having a first winding, a second winding and a magnetic core. The first winding and the second winding may surround the magnetic core. The transformer may be disposed above a first side of the substrate. A flux conductor may be disposed on a second surface of the substrate opposite to the first surface.01-31-2013
20110193671ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME - An electronic component and manufacturing method are provided that allow an increase in a size of a circuit element included therein and suppression of a short-circuit-preventing insulator film from easily peeling off from a laminated body. The laminated body includes a plurality of insulator layers laminated on one another. The laminated body has an upper face and a lower face opposing each other in a z-axis direction and lateral faces connecting the upper face to the lower face. The insulator film is provided on the lateral faces. A circuit element such as a coil is included in the laminated body and has a part protruding from the lateral faces of the laminated body toward the insulator film.08-11-2011
20130082813COIL PARTS - A coil part is provided. The coil part includes a coil layer, a lower magnetic layer, and an upper magnetic layer. The coil layer includes a primary coil pattern, a secondary coil pattern, and a dielectric including the primary coil pattern and the secondary coil pattern. The lower magnetic layer is disposed under the coil layer. The upper magnetic layer is disposed on the lower magnetic layer to fill up the center and the periphery of the coil layer and cover the coil layer. Accordingly, the coil part can improve filtering characteristics by more smoothly increasing a magnetic flux surrounding the coil pattern. Also, the coil part can cut fabrication costs by reducing the length of the coil pattern with respect to the same characteristics.04-04-2013
20130076474COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.03-28-2013
20130043968VERTICALLY ORIENTED SEMICONDUCTOR DEVICE AND SHIELDING STRUCTURE THEREOF - The present disclosure provides a semiconductor device. The semiconductor device includes a substrate that spans in an X-direction and a Y-direction that is orthogonal to the X-direction. The semiconductor device includes an interconnect structure formed over the substrate in a Z-direction that is orthogonal to both the X-direction and the Y-direction. The interconnect structure includes a plurality of metal lines interconnected together in the Z-direction by a plurality of vias. The interconnect structure contains a transformer device that includes a primary coil and a secondary coil. The primary coil and the secondary coil are each wound at least partially in the Z-direction.02-21-2013
20130043967ROGOWSKI COIL ASSEMBLIES AND METHODS FOR PROVIDING THE SAME - Rogowski coil assemblies and methods for providing or forming Rogowski coil assemblies are provided. A Rogowski coil assembly may include a printed circuit board and a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces. The circuit traces may retain and connect the plurality of Rogowski coil sections.02-21-2013
20100033286LAMINATED DEVICE - A laminated device comprising pluralities of magnetic ferrite layers, conductor patterns each formed on each magnetic ferrite layer and connected in a lamination direction to form a coil, and a non-magnetic ceramic layer formed on at least one magnetic ferrite layer such that it overlaps the conductor patterns in a lamination direction, the non-magnetic ceramic layer comprising as main components non-magnetic ceramics having higher sintering temperatures than that of the magnetic ferrite, and further one or more of Cu, Zn and Bi in the form of an oxide.02-11-2010
20130082812COIL PARTS AND METHOD OF FABRICATING THE SAME - A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.04-04-2013
20090273427COMPACT SIZED CHOKE COIL AND FABRICATION METHOD OF SAME - The present invention relates to a compact sized choke coil and fabrication method of same, an enameled metal wire or metal wire enclosed with insulated material is firstly prepared, then the wire is wound into helical coil, and then a magnetic film on the helical coil is formed by sputtering a layer of magnetic substance with a thickness greater than 1011-05-2009
20130033353SUBSTRATE INDUCTIVE DEVICES AND METHODS - Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.02-07-2013
20100045419INDUCTOR - Parasitic capacitance between upper and lower adjacent wirings of an inductor using a multilayer wiring layer in an insulating film formed on a base substrate is reduced. An inductor is characterized by having one go-around of go-around wiring (A-B or B-C) formed in each of at least two of adjacent wiring layers of a plurality of wiring layers 02-25-2010
20130038419LAMINATED INDUCTOR - A laminated inductor having a laminate structure constituted by magnetic layers and internal conductive wire-forming layers, wherein the magnetic layer is formed by soft magnetic alloy grains, the internal conductive wire-forming layer has an internal conductive wire and a reverse pattern portion around it, and the reverse pattern portion is formed by soft magnetic alloy grains whose constituent elements are of the same types as those of, and whose average grain size is greater than that of, the soft magnetic alloy grains constituting the magnetic layer.02-14-2013
20130038418CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.02-14-2013
20090108978Cross-coupled Inductor Pair Formed in an Integrated Circuit - Cross-coupled first and second helical inductors formed in an IC. The cross-coupled first and second helical inductors comprise a first helical conductor having a first portion and a second portion, and a second helical conductor having a first portion and a second portion. The second helical conductor is in close proximity to the first helical conductor. The first helical inductor is formed by the first portion of the first helical conductor and the second portion of the second helical conductor. The second helical inductor is formed by the second portion of the first helical conductor and the first portion of the second helical conductor.04-30-2009
20100109829ELECTRONIC COMPONENT - A multilayer body is formed by laminating multiple insulating layers. External electrodes are provided on the opposed side surfaces of the multilayer body and extend in the z axis direction. Coil conductors are laminated together with the insulating layers and form a coil. Coil conductors other than coil conductors connected to the external electrodes are made up of pairs of adjacent coil conductors having an identical shape, and coil conductors forming each pair are connected in parallel to each other. None of the coil conductors connected to the external electrodes is connected in parallel to coil conductors with an identical shape.05-06-2010
20100026439Antenna For Near Field And Far Field Radio Frequency Identification - In accordance with an embodiment of the invention, there is disclosed an antenna for radio frequency identification. The antenna comprises a first radiating element for operating a first mode of radio frequency identification using a first current. The antenna further comprises a second radiating element for operating a second mode of radio frequency identification using a second current. Specifically, at least one of a portion of the first radiating element forms a portion of the second radiating element and a portion of the second radiating element forms a portion of the first radiating element. When the first radiating element is excited by the first current, the first radiating element generates a first field for providing the first mode of radio frequency identification, and when the second radiating element is excited by the second current, the second radiating element generates a second field for providing the second mode of radio frequency identification.02-04-2010
20090045904INTER-HELIX INDUCTOR DEVICES - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end.02-19-2009
20090045903INDUCTOR STRUCTURE - An inductor structure including a coil layer and at least a gain lead is disclosed. The coil layer is disposed over a substrate and has a plurality of coil turns, wherein one of the coil turns is grounded. The gain lead is disposed under at least one of the inner side and the outer side of the grounded coil turn and is electrically connected in parallel to the grounded coil turn. The width of the gain lead is less than the width of the grounded coil turn.02-19-2009
20100328010DC TO DC CONVERTER MODULE - Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.12-30-2010
20130049916SEMICONDUCTOR STRUCTURE WITH GALVANICALLY-ISOLATED SIGNAL AND POWER PATHS - A galvanic die has signal structures and a transformer structure that provide galvanically-isolated signal and power paths for a high-voltage die and a low-voltage die, which are both physically supported by the galvanic die and electrically connected to the signal and transformer structures of the galvanic die.02-28-2013
20130049917CONDUCTOR PATTERN AND ELECTRONIC COMPONENT HAVING THE SAME - Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.02-28-2013
20130069752LAMINATED INDUCTOR - There is provided a laminated inductor including: a body in which a plurality of magnetic layers are stacked; at least one non-magnetic layers interposed between the magnetic layers and including a Al03-21-2013
20130069753HIGH FREQUENCY PCB COILS - Described herein designs for high frequency printed circuit board (PCB) resonator coils. The resonator coils are printed or etched on a thin substrate. The number of loops of the resonator coil, the width of each trace, the spacing between the traces, and the like are adjusted to increase the quality factor Q of the resonator coils.03-21-2013
20130088316ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the eletronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.04-11-2013
20090040000INTEGRATED CIRCUITS WITH INDUCTORS - The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways. Particular embodiments involve core elements having different compositions and/or sizes.02-12-2009
20090039999INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An inductor device formed on a semiconductor substrate includes an inductor body penetrating the semiconductor substrate, taking a spiral shape and having a conductivity, and an insulating film provided between a side surface of the inductor body and the semiconductor substrate.02-12-2009
20130057379PRINTED CIRCUIT BOARD - A printed circuit board includes metallization layers are stacked along a vertical direction and separated mechanically from one another by electrically insulating layers. A coil extends along a vertical winding axis and has turns formed by conductive tracks made in respective metallization layers, the turns being electrically connected to one another by pads going through at least one of the electrically insulating layers. A superimposition, in a plane parallel to the metallization layers, of the conductive tracks of the coil, made in a first metallization layer and a second metallization layer, that are immediately consecutive in the vertical direction, forms a pattern having two axial symmetries relative to X and Y axes orthogonal to each other and parallel to the metallization layers. The conductive tracks of each of the superimposed metallization layers are devoid, of themselves, of axial symmetry relative to the X or Y axes.03-07-2013
20080290980CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS - An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.11-27-2008
20090273428INDUCTIVE MODULE - An inductive module includes an electrically insulating basic substrate unit having opposite first and second trace-forming sides, a ferromagnetic core unit embedded in the basic substrate unit and having horizontal sides substantially parallel to and respectively spaced apart from the first and second trace-forming sides, and a coil unit. The coil unit includes first and second conductive vias respectively formed in the basic substrate unit adjacent to vertical sides of the core unit, and respectively spaced apart from the vertical sides, and first and second conductive traces, each of which is disposed on a corresponding one of the first and second trace-forming sides, and interconnects electrically a corresponding pair of the first and second conductive vias. The conductive traces and the conductive vias of the coil unit cooperate to form an electric current path that substantially winds around the core unit.11-05-2009
20110037557MULTILAYER COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A multilayer coil component includes internal conductors made of silver (Ag) having metal films provided on surfaces thereof to suppress migration of Ag contained in the internal conductors and/or relieve internal stress between magnetic ceramic layers and internal conductor layers without forming gaps at interfaces between the internal conductors including the metal films and a magnetic ceramic surrounding the internal conductors and the interfaces between the internal conductors and the magnetic ceramic. In a manufacturing method for forming a multilayer coil, an acidic solution containing a metal is allowed to penetrate a magnetic ceramic through side surfaces thereof and side gap sections that are regions between side portions of internal conductors and the side surfaces to reach the interfaces between the internal conductors and a surrounding magnetic ceramic, whereby the metal is deposited on surfaces of the internal conductors.02-17-2011
20120223798Partial conformal coating of electronic ceramic component and method making the same - A partial conformal coating covers the ceramic portion of leadless type electroceramic component but not the metalized terminals to improve the surface condition without altering the solderability of the component. And the methods to form the partial conformal coating to cover the desired area of the electroceramic component in simple processes suitable for mass production.09-06-2012
20130063238CHIP INDUCTOR - Disclosed herein is a laminated chip inductor including: a laminate including a plurality of first sheets having conductive patterns printed thereon and laminated in order; and a sheet having a discrimination via hole and provided on and/or under the laminate.03-14-2013
20130162385COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside.06-27-2013
20090058589SUSPENSION INDUCTOR DEVICES - Suspension inductor devices are provided. A suspension inductor device includes a dielectric substrate and a suspension induction coil. The suspension induction coil includes an input end disposed on the dielectric substrate. A spiral coil is wound from the dielectric substrate to an interconnection. The interconnection is disposed in the spiral coil and connects the input end and the spiral coil. An output end is disposed on the dielectric substrate and adjacent to the input end.03-05-2009
20110018671Glass-Ceramic Substrate - A glass-ceramic substrate with improved bonding strength between an insulating and ferrite layer, and method of manufacturing same are disclosed. The glass-ceramic substrate comprises a glass-ceramic layer, a ferrite layer, and interlayer means between the glass-ceramic layer and the ferrite layer. The glass-ceramic layer comprises a glass phase and a glass comprising a first crystal. The ferrite layer comprises a ferrite crystal.01-27-2011
20120235779MICRO COIL APPARATUS AND MANUFACTURING METHODS THEREFOR - A method for manufacturing a conductive coil, the method comprising using a semiconductor fabrication process (e.g. TSV) to manufacture a coil, typically a planar spiral conductive coil.09-20-2012
20120112869COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component 05-10-2012
20120112868THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMPEDANCE DISCONTINUITY - Methods, systems, and apparatuses are provided for three-dimensional coiling via structures. A substrate includes a plurality of insulating layers, a plurality of trace layers interleaved with the insulating layers, and a three-dimensional coiling via. The three-dimensional coiling via includes a plurality of electrically conductive traces and a plurality of electrically conductive vias through the insulating layers. The electrically conductive traces are present in at least two of the traces layers and are coupled together by the electrically conductive vias. The electrically conductive traces are arranged to form at least one partial turn around an axis through the substrate.05-10-2012
20090115562SPIRAL INDUCTOR - A spiral inductor is provided. The spiral inductor includes a first spiral conductive trace with at least one turn, a second spiral conductive trace, and a connector. The first spiral conductive trace comprises an outer end and an inner end. The second spiral conductive trace surrounds a portion of the outermost turn of the first spiral conductive trace, and comprises a first end and a second end. The connector electrically connects to the inner end and the first end.05-07-2009
20110018670ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR - Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.01-27-2011
20120119868WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE - Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (05-17-2012
20120229243INTEGRATED CIRCUIT FOR INFORMATION TRANSFER - An integrated circuit for information transfer, having a substrate, at least one Hall element which is integrated into the substrate or situated on the substrate, a first coil which is situated essentially concentrically with respect to the Hall element and at a distance from the Hall element in the vertical direction and galvanically separated therefrom, and at least one second coil which is situated essentially concentrically with respect to the Hall element and galvanically separated therefrom and situated at a distance from the Hall element and the first coil in the vertical direction. The first coil and the second coil are electrically connected in series so that a current flow in the same direction results in the coils.09-13-2012
20110227689Method of Creating Spiral Inductor having High Q Value - A method for fabricating an inductor structure having an increased quality factor (Q) is provided. In one embodiment, a substrate is provided and a plurality of metal layers are formed on the substrate. A spirally patterned conductor layer is formed over and in the substrate and in the metal layers to produce a planar spiral inductor. A via hole is formed over and in the substrate and in the metal layers within the spirally patterned conductor layer, the via hole being formed by a through silicon via (TSV) process. Thereafter, the via hole is filled with a core layer, wherein the core layer extends from a bottom surface of the substrate to a top surface of the metal layers.09-22-2011
20120098634METHOD AND APPARATUS FOR TRANSMITTING POWER AND DATA WITHOUT CONTACT - In a power and data transmission method which can transmit power and information (data) simultaneously and contactlessly, and an apparatus therefor, a pair of coil units are magnetically coupled to each other. Each of the coil units has: a power transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil; and an information transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil, the coil diameter of the information transmission coil is made different from that of the power transmission coil, and the information transmission coil and the power transmission coil are stacked. Data are transmitted while power is transmitted.04-26-2012
20130015936CONVERTER AND METHOD FOR MANUFACTURING THE SAME - A converter includes a main board, at least one first connecting member, and a magnetic component. The first connecting member is defined on a surface of the main board. The magnetic component is assembled with the main board. The magnetic component includes a winding board, at least one second connecting member and a core. The second connecting member is defined on a surface of the winding board, and the second connecting member is in electrical contact with the first connecting member. The core is assembled with the winding board. A method for manufacturing a converter is also disclosed herein.01-17-2013
20100001824Autotransformer using printed wireboard - An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.01-07-2010
20120286917ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component capable of preventing the occurrence of magnetic saturation due to a magnetic flux surrounding each coil conductor and a method of manufacturing the electronic component are provided. The electronic component includes a laminate formed by stacking unit layers, where each unit layer includes a first insulating layer, and a coil conductor and second insulating layer formed on the first insulating layer. Each second insulating layer has a Ni content greater than a Ni content of each first insulating layer. Portions of the first insulating layers have a Ni content lower than a Ni content of the second portions after the laminate is calcined.11-15-2012
20110279213LAMINATED INDUCTOR - This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion. The plural first mixed layers and the plural second mixed layers are formed as different layers.11-17-2011
20100171582MONOLITHIC INDUCTIVE COMPONENT, METHOD FOR THE PRODUCTION OF THE COMPONENT, AND APPLICATION OF THE COMPONENT - A method for manufacturing a monolithic inductive component is provided. The method may include providing a green body comprising a green sheet composite for forming a multilayer ceramic body with an integrated winding and a shaped body of terrific core material, the green sheet composite being combined with an encapsulation so as to create a cavity with a cavity opening between the encapsulation and the green sheet composite, and the cavity being filled with the ferritic core material through the cavity opening; and heat-treating the green body, a multilayer ceramic body with an integrated winding being created from the green sheet composite and a magnetic core comprising the ferritic core material being created from the green sheet composite.07-08-2010
20110169596System and Method for Integrated Inductor - In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seemless ferromagnetic material surrounding at least a first portion of the conductor.07-14-2011
20120032767LAMINATED COIL - A laminated coil includes a laminated body insulating layers and coil patterns are integrally stacked in a desired order, a coil formed by connecting the coil patterns, a pair of external electrodes provided at opposite ends of the laminated body, and an insulating film provided on an outer peripheral surface of the laminated body. At least one of the coil patterns is in contact with an outer peripheral edge of the corresponding insulating layer at least a part of an outer peripheral edge of the coil pattern, but is not in contact with corners of the insulating layer in a manner such that the at least one coil-pattern is absent at portions of the corresponding insulating layer near the corners of the corresponding insulating layer.02-09-2012
20090072942MEANDER INDUCTOR AND SUBSTRATE STRUCTURE WITH THE SAME - A meander inductor is disclosed, the inductor is disposed on a substrate or embedded therein. The meander inductor includes a conductive layer composed of a plurality of sinusoidal coils with different amplitudes and in series connection to each other, wherein the sinusoidal coils with different amplitudes are laid out according to a periphery outline. The profile of the meander inductor is designed according to an outer frame range available for accommodating the meander inductor and is formed by coils with different amplitudes. Therefore, under a same area condition, the present invention enables the Q factor and the resonant frequency fr of the novel inductor to be advanced, and further expands the applicable range of the inductor.03-19-2009
20100060402BALUN CIRCUIT MANUFACTURED BY INTEGRATE PASSIVE DEVICE PROCESS - A Balun circuit manufactured by integrate passive device (IPD) process is provided. The Balun circuit includes a substrate, a first coplanar spiral structure, and a second coplanar spiral structure. At least two first left half coils of the first coplanar spiral structure are electrically connected to the corresponding two first right half coils through a first intersecting structure. At least two second left half coils of the second coplanar spiral structure are electrically connected to the corresponding two second right half coils through a second intersecting structure. The two ends of the second coplanar spiral structure are electrically connected to the innermost second left half coil and the second right half coil respectively. The first left half coils and the second left half coils are interlaced, and so are the first right half coils and the second right half coils interlaced.03-11-2010
20090167476INDUCTOR STRUCTURE - An inductor structure disposed over a substrate and including a coil layer is provided. The coil layer has a plurality of coil turns electrically connected with each other. An innermost coil turn of the coil layer has a portion with a narrower width in a region with a higher magnetic flux density than that in the other region with lower magnetic flux density.07-02-2009
20110285493HIGH Q VERTICAL RIBBON INDUCTOR ON SEMICONDUCTING SUBSTRATE - A method of making a semiconductor device and devices thereof are provided. The semiconductor device (11-24-2011
20110285494MULTILAYER TYPE INDUCTOR - A multilayer type inductor includes: an inductor main body formed by laminating a plurality of sheets; a coil part including conductive patterns and conductive vias formed on the respective sheets; a first withdrawal via formed at one end of the coil part and withdrawn to one surface of the inductor main body through the inductor main body; a second withdrawal via formed at the other end of the coil part and withdrawn in the same direction as that of the first withdrawal via; and first and second external terminals formed on one surface of the inductor main body and electrically connected to the first and second withdrawal vias.11-24-2011
201100320678-SHAPED INDUCTOR - In a first aspect, the invention provides to a device comprising a substrate and an electrical conductor arranged between two terminals (A, B) and shaped for forming an inductor comprising at least two loops (02-10-2011
20110291789PLANAR INDUCTOR DEVICES - A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.12-01-2011
20110291787PLANAR INDUCTOR DEVICES - A planar inductor device includes a ferrite body and a conductive pathway. The ferrite body extends around an opening in the ferrite body. The conductive pathway includes an input section, a current-splitting section, a coil section, a current-combining section, and an output section connected with each other, the input section extending toward the opening in the ferrite body. The current-splitting section includes a plurality of conductive coils joined with the conductive pathway and electrically disposed parallel to each other. The coil section includes the conductive coils helically wrapped around the ferrite body. The current-combining section includes the conductive coils joined with each other. The output section includes the joined conductive coils extending out of the ferrite body.12-01-2011
20110291788PLANAR INDUCTOR DEVICES - A planar inductor device includes a substrate, a ferrite body in the substrate, upper and lower conductors, and conductive vias. The substrate vertically extends from an upper surface to an opposite lower surface. The substrate laterally extends from a first edge to a second edge. The upper conductors are disposed above the ferrite body. The lower conductors are disposed below the ferrite body. The conductive vias extend through the substrate and are conductively coupled with the upper conductors and with the lower conductors. The vias, the upper conductors, and the lower conductors form one or more conductive coils that encircle the ferrite body in the substrate. At least one of the first edge or the second edge of the substrate passes through one or more of the vias such that the vias are exposed at the at least one of the first edge or the second edge.12-01-2011
20110291786Through Via Inductor Or Transformer In A High-Resistance Substrate With Programmability - A through via inductor or transformer in a high-resistance substrate in an electronic package. In one embodiment, the package comprises a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. In another embodiment, a transformer can comprise a primary loop and a secondary loop, each of which includes a plurality of through-vias that are coupled to a plurality of conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio.12-01-2011
20110291790COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.12-01-2011
20090261935INDUCTOR DEVICE - An inductor device is provided. The inductor includes: a first inductor; a second inductor, wherein the first inductor and the second inductor are arranged such that a magnetic field generated by the first inductor and passing through the inside of a loop formed from the second inductor comprises a first magnetic field and a second magnetic field, the first magnetic field passing from the topside of the loop to the downside of the loop, the second magnetic field passing from the downside of the loop to the topside of the loop.10-22-2009
20100265024SEMICONDUCTOR DEVICE - In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls.10-21-2010
20100265023TRANSFORMER - A printed circuit board transformer comprises at least one primary winding and one secondary winding, each in the form of at least one layer of turns inside or at the surface of a printed circuit board. The transformer is designed for a step-up/down-operation. Each of the two layers (10-21-2010
20100079232MULTI-LAYERED DEVICE - A multilayered device comprises an insulation sheet 04-01-2010
20100033288Thin inductor, method of producing the thin inductor, and ultra small size power conversion apparatus using the thin inductor - Two coil conductors of the same spiral shape are cut out from a lead frame. The two coil conductors are disposed back to back so that the front of a first coil conductor is superimposed over the rear of a second coil conductor. Central end portions of the first and second coil conductors are connected to each other through a connection layer. Outer end portions of the spirals of the first and second coil conductors are connected to corresponding ones of first and second terminals of the thin inductor, respectively. A sintered green sheet as a magnetic substance is disposed in gaps between the first and second coil conductors. In this manner, the invention can provide a thin inductor small in size, strong in mechanical strength and inexpensive, a method of producing the thin inductor, and an ultra small size power conversion apparatus using the thin inductor.02-11-2010
20100033289Miniaturized Wide-Band Baluns for RF Applications - A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.02-11-2010
20100033290Miniaturized Wide-Band Baluns for RF Applications - A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.02-11-2010
20110215893PLANAR AUDIO AMPLIFIER OUTPUT INDUCTOR WITH CURRENT SENSE - An audio amplifier, that includes a planar inductor structure that includes a first plurality of windings, formed on layers of a first circuit board and a second plurality of windings, formed on layers of a second circuit board. The planar inductor structure may further include a sense winding.09-08-2011
20090189727Inductor device - An inductor device includes at least one printed circuit board, a magnetic device and a metal wire. The printed circuit board has through holes disposed on it. The magnetic device passes through the through holes on the printed circuit board. The metal wire surrounds the magnetic device with an eddy shape.07-30-2009
20100259350INDUCTOR OR TRANSFORMER FOR MICROELECTRIC SYSTEM - A microinductor comprises an insulating substrate, a lower conductive winding, an upper conductive winding, and a core. The lower conductive winding is disposed on an upper surface of the substrate. The core is made of a material with high permeability and stacked over the lower conductive winding. The upper conductive winding is disposed on an upper surface of the core. The upper conductive winding electrically interconnects with the lower conductive winding so as to form an inductor coil.10-14-2010
20090153283MINIATURE TRANSFORMERS ADAPTED FOR USE IN GALVANIC ISOLATORS AND THE LIKE - A component coil for constructing transformers and the transformer constructed therefrom are disclosed. The component coil includes a substrate having an insulating layer of material having top and bottom surfaces. First and second traces are included on the top and bottom surfaces. Each trace includes a spiral conductor. The inner ends of the spiral conductors are connected by a conductor that passes through the insulating layer. The first and second spiral conductors are oriented such that magnetic fields generated by the first and second spiral conductors have components perpendicular to the top surface and in the same direction. The component coils can be used to construct a power transformer or a galvanic isolator.06-18-2009
20090153282ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREOF - There is provided an electronic component formed by adopting an adhesion reinforcement structure to an external electrode or the like, which is embedded in a protecting section made of a resin and part of which is exposed. Even when an external force is applied through the external electrode, the external force can be broadly dispersed all over a connecting section with the protecting section due to the adhesion reinforcement structure, to suppress an influence of the external force on a wiring, and whereby it is possible to omit a substrate that has been one of constitutional elements of a conventional electronic component, so as to realize reduction in height of the electronic component by the height of the substrate.06-18-2009
20090146770PLANAR-LIKE INDUCTOR COUPLING STRUCTURE - A planar-like inductor coupling structure includes a first planar inductor embedded in an insulating material layer and a second planar inductor also embedded in the insulating material layer. The first planar inductor and the second planar inductor are substantially at the same height, and have a portion in a horizontal distribution serving as a coupled overlapping region with electric insulation from each other. In addition, the first planar inductor and the second planar inductor may be at different heights.06-11-2009
20080303621COMMON MODE CHOKE COIL - A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C<(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased.12-11-2008
20080266043PLANAR TRANSFORMER ARRANGEMENT - A planar transformer arrangement and method provide isolation between an input signal and an output signal. The planar transformer arrangement includes a planar medium having a first layer, a second layer, and a dielectric interlayer arranged between the first and second layers; at least one meandering primary winding arranged on the first layer of the planar medium, a current flow being induced within the primary winding in accordance with the input signal; at least one meandering secondary winding arranged on the second layer of the planar medium, the primary and secondary windings forming a planar transformer, whereby a voltage is induced across the secondary winding in accordance with the current flow within the primary winding; and a mode elimination arrangement configured to produce a compensated voltage by compensating for a common mode interference on the voltage induced across the secondary winding, the mode elimination arrangement being further configured to generate the output signal in accordance with the compensated voltage; wherein the dielectric interlayer of the planar medium provides a voltage isolation between the primary and secondary windings.10-30-2008
20120001715TRANSFORMER ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, a second spiral wound inductive coil formed on the first surface, and a third spiral wound inductive coil formed on the first surface, the first, second and third spiral wound inductive coils forming a triple spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil and the third coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described.01-05-2012
20090309688Circuit apparatus and method of manufacturing the same - A circuit apparatus includes a first insulating layer, a first inductor, a first terminal, a second terminal, a first interconnect, and a wire. The first inductor is located at one surface of the first insulating layer and configured by a spiral conductive pattern. The first terminal and the second terminal are exposed from one surface of the first insulating layer. The first interconnect is formed on one surface of the first insulating layer to connect the first terminal and an external end of the first inductor. The wire is located on a one-surface side of the first insulating layer to connect the second terminal and a central end of the first inductor.12-17-2009
20090309687METHOD OF MANUFACTURING AN INDUCTOR FOR A MICROELECTRONIC DEVICE, METHOD OF MANUFACTURING A SUBSTRATE CONTAINING SUCH AN INDUCTOR, AND SUBSTRATE MANUFACTURED THEREBY, - A method of manufacturing an inductor for a microelectronic device comprises providing a substrate (12-17-2009
20100225436MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS - The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.09-09-2010
20100079233PLANAR TRANSFORMER - A planar transformer includes first and second windings that may be comprised of electrically conductive traces etched onto one or more printed circuit boards. The printed circuit boards may be arranged in various orientations so as to change the turns ratio of the planar transformer. In one embodiment, the printed circuit boards are substantially similar and may be electrically connected via connectors that separate the circuit boards. Insulating sleeves may be inserted between the printed circuit boards in an interleaved configuration.04-01-2010
20110267166ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME - An electronic component that reduces resistance and prevents occurrence of an edge effect, includes a laminated body formed by stacking insulator layers. Conductor layers are linear conductors, and define coils included in the laminated body. The conductor layers face each other, with the insulator layer interposed therebetween, and allow signals of substantially the same phase to pass therethrough. The conductor layers define regions, each having a shape which decreases in thickness in the z-axis direction with increasing distance from a center thereof in a line width direction.11-03-2011
20090066462COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF - A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.03-12-2009
20090284339Transformers, balanced-unbalanced transformers (baluns) and Integrated circuits including the same - A transformer of fully symmetric structure includes a primary coil assembly and a secondary coil assembly. The primary coil assembly includes a plurality of primary coils formed in a plurality of metal layers, and a first interlayer connection unit for connecting the primary coils. The secondary coil assembly includes a plurality of secondary coils formed in the plurality of metal layers, and a second interlayer connection unit for connecting the secondary coils. The primary and secondary coils formed in the same metal layer are concentric and axisymmetric with respect to a diameter line passing through a planar center point. A balanced-unbalanced transformer (balun) is a type of transformer that may be used to convert an unbalanced signal to a balanced one or vice versa. An integrated circuit may include a semiconductor substrate and a transformer. Electrical elements such as transistors may be formed on the semiconductor substrate.11-19-2009
20090009278INDUCTOR - An inductor includes: a substrate; an insulator layer; a conductive coil; and a permeability-enhancing film of a multi-layer structure. The multi-layer structure includes at least one repeating unit that has at least two layers. The two layers exhibit an exchange-coupling effect and include a first ferromagnetic layer of a first ferromagnetic material and an exchange-coupling layer.01-08-2009
20090273429INDUCTOR AND METHOD FOR FABRICATING THE SAME - An inductor includes a flat substrate and a conductor in a spiral shape having a plurality of turns. The plane on which the conductor is formed is substantially in parallel with a principal surface of the substrate. The turns of the conductor are equally spaced from each other in a direction parallel to the plane on which the conductor is formed. An outer one of the turns of the conductor is wider and thinner than an inner one of the turns of the conductor. A level of at least one of a top and a bottom of the conductor differs from one turn to another in a cross section vertical to the plane on which the conductor is formed.11-05-2009
20090278651COIL UNIT AND ELECTRONIC APPARATUS USING THE SAME - A coil unit includes a coil including a coil wire, a magnetic substance for receiving magnetic force lines generated by the coil, a first substrate, and a temperature detection element disposed on the first substrate.11-12-2009
20090261937INTEGRATED INDUCTOR - An integrated inductor includes a winding consisting of an aluminum layer atop a passivation layer, wherein the aluminum layer does not extend into the passivation layer and has a thickness that is not less than about 2.0 micrometers. The passivation layer has a thickness not less than about 0.8 micrometers. By eliminating copper from the integrated inductor and increasing the thickness of the passivation layer, the distance between the bottom surface of the inductor structure and the main surface of the semiconductor substrate is increased, thus the parasitic substrate coupling may be reduced and the Q-factor may be improved. Besides, the increased thickness of the aluminum layer may help improve the Q-factor as well.10-22-2009
20090261936THIN FILM STRUCTURES WITH NEGATIVE INDUCTANCE AND METHODS FOR FABRICATING INDUCTORS COMPRISING THE SAME - An inductor structure comprising a substrate and a planar conductor structure on a surface of the substrate, and methods for fabricating an inductor structure. The planar conductor structure may comprise a vertical stack of three or more multilayer films. Each multilayer film may comprise a first layer of a first metal, defining a first vertical thickness, and a second layer of a second metal, defining a second vertical thickness. The metals and thicknesses are chosen such that the inductor exhibits a negative electrical self-inductance when an electrical signal is transmitted from a first contact point to a second contact point.10-22-2009
20080238601Inductive devices with granular magnetic materials - An inductive device is provided, comprising a conductor configured in a spiral and a first layer of granular magnetic material having a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3. A transformer is also provided, comprising a core and a first inductor. The first inductor includes a first conductor configured in a spiral surrounding a first portion of the core, and a first layer of granular magnetic material. The transformer further comprises a second inductor. The second inductor includes a second conductor configured in a spiral surrounding a second portion of the core, and a second layer of granular magnetic material. The first and second layers of granular magnetic material have a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3.10-02-2008
20090167477Compact Inductive Power Electronics Package - An inductive power electronics package is disclosed. It has a circuit substrate with power inductor attached atop. The power inductor has inductor core of closed magnetic loop with an interior window. The closed magnetic loop can include air gap for inductance adjustment. The circuit substrate has bottom half-coil forming elements constituting a bottom half-coil beneath the inductor core. Also provided are top half-coil forming elements interconnected with the bottom half-coil forming elements to form an inductive coil enclosing the inductor core. An inner connection chip can be added in the interior window for interconnecting bottom half-coil forming elements with top half-coil forming elements. An outer connection chip can be added about the inductor core for interconnecting bottom half-coil forming elements with top half-coil forming elements outside the inductor core. A power Integrated Circuit can be attached to the top side of the circuit substrate as well.07-02-2009
20100201473MULTILAYER COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A highly reliable multilayer coil component is provided without forming voids between magnetic ceramic layers and internal conductor layers. According to the multilayer coil component, an internal stress problem is reduced, the direct current resistance is low, and fracture of internal conductors caused by the surge or the like is not likely to occur. An acidic solution is allowed to permeate a magnetic ceramic element from a side surface thereof through a side gap portion which is a region between side portions of the internal conductors and the side surface of the magnetic ceramic element and to reach interfaces between the internal conductors and a magnetic ceramic located therearound. A pore area ratio of the magnetic ceramic of the side gap portion which is located between the side portions of the internal conductors and the side surface of the magnetic ceramic element is set in the range of 6% to 28%.08-12-2010
20080284553TRANSFORMER WITH EFFECTIVE HIGH TURN RATIO - Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5 p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes.11-20-2008
20080284552INTEGRATED TRANSFORMER AND METHOD OF FABRICATION THEREOF - An integrated transformer structure includes a first coil element associated with a transverse axis, the first coil element having at least one turn. The first coil element includes a first portion provided on a first lateral level, and a second portion provided on a second lateral level. The first and second lateral levels being mutually spaced apart along said transverse axis. The first and second portions being displaced laterally from said axis by different respective distances. At least one crossover portion of the first coil element, in which the first coil element being configured to provide a conducting path through at least a portion of the first portion of the first coil element to the crossover portion, through the crossover portion and subsequently through at least a portion of the second portion of the first coil element, in which any change of flow direction along said path is less than 90° in a lateral direction.11-20-2008
20100039205SPIRAL INDUCTOR WITH MULTI-TRACE STRUCTURE - A spiral inductor with a multi-trace structure having an insulating layer disposed on a substrate. A first spiral conductive trace with multiple turns is disposed on the insulating layer, wherein the outermost turn and the innermost turn of the first spiral conductive trace have a first end and a second end, respectively, and one of the first and second ends is connected to ground. A second spiral conductive trace with a single turn is disposed on the insulating layer and adjacent to the first spiral conductive trace, wherein the second spiral conductive trace is electrically connected to the turn that is connected to the ground and belongs to the first spiral conductive trace. The first spiral conductive trace has a relative outside and a relative inside, wherein the end of the first spiral conductive trace connected to ground and the second spiral conductive trace are located at different sides respectively.02-18-2010
20080303623Inductor structure - An inductor structure comprising a substrate; a plurality of insulation layers on the substrate; a first spiral electric conductive coil positioned in the insulation layers to form an inductor having a first direction of magnetic field; a second spiral electric conductive coil positioned in the insulation layers to form an inductor having a second direction of magnetic field, in which, the two or more inductors are independently positioned in a same 3-D space and have a good integration.12-11-2008
20080303622SPIRAL INDUCTOR - There is provided a spiral inductor including an insulation board formed into a flat-plate shape; a conductive pattern having a spiral shape and formed at least one surface of the insulation board, wherein the conductive pattern varies in line width according to a distance from one end of the conductive pattern forming a spiral.12-11-2008
20080246578OPEN PATTERN INDUCTOR - Various embodiments includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. Embedding the stacked open pattern inductor in a magnetic oxide or in an insulator and a magnetic material increases the inductance of the inductor and allows the magnetic flux to be confined to the area of the inductor. A layer of magnetic material may be located above the inductor and below the inductor to confine electronic noise generated in the stacked open pattern inductor to the area occupied by the inductor. The stacked open pattern inductor may be fabricated using conventional integrated circuit manufacturing processes, and the inductor may be used in connection with computer systems.10-09-2008
20080284554Compact robust linear position sensor - The present invention is directed to a position sensor, comprising a printed circuit board; a pair of stationary planar air-core coils formed in a trapezoidal or rectangular shape and side-by-side one another on the printed circuit board, coil windings being relatively uniformly distributed over a predetermined area of the printed circuit board; and a moving target formed by a sheet of copper on the printed circuit board.11-20-2008
20100265026PASSIVE ELECTRICAL COMPONENTS WITH INORGANIC DIELECTRIC COATING LAYER - A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer.10-21-2010
20100141371Magnetic Core-Coil Device and Method for Making the Same - A magnetic core-coil device includes: a printed circuit board having a stack of plate layers, a loop-shaped magnetic core, a primary winding, and an auxiliary winding. The loop-shaped magnetic core has two side portions extending through two rows of through holes of the printed circuit board. The primary winding includes a plurality of primary coil sections formed respectively on the plate layers and each looping around one of the side portions. The auxiliary winding includes a plurality of auxiliary coil sections formed respectively on the plate layers and each looping around the other one of the side portions.06-10-2010
20100141370Multilayer inductor - A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power routing between the top magnetic layer signal/power contacts and the bottom magnetic layer signal/power contacts. The top external conductive pattern accommodates a semiconductor chip in a flip chip configuration.06-10-2010
20090179723Method For Making Magnetic Components With M-Phase Coupling, And Related Inductor Structures - An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg.07-16-2009
20130120095METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.05-16-2013
20130120096MULTILAYERED MINIATURE COIL COMPONENT - A multilayered miniature coil component, comprising a plurality of coil layers and insulating layers, the plurality of coil layers and insulating layers being alternately overlapped on each other. Each of the plurality of coil layers includes a plurality of coils and wires, each of the coils has a first and a second end, and a plurality of first conductive portions is disposed on each of the coil layers, at least one second conductive portion is disposed on at least one of the coil layers, and each of the plurality of insulating layers has a plurality of conductive through holes disposed correspondingly to the first conductive portions and the second conductive portions, thus through the plurality of wires, the first and the second conductive portions and the conductive through holes, the plurality of coils in each of the coil layers are composed as a circuit loop05-16-2013
20130120097COIL-TYPE ELECTRONIC COMPONENT - A coil-type electronic component having a coil inside or on the surface of a base material, characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains whose main ingredients are iron, silicate and chromium, and that an oxide layer is formed on the surface of each soft magnetic alloy grain, where the oxide layer is produced as a result of oxidization of the grain and has more chromium than the alloy grain, and this oxide layer has a two-layer structure constituted by an inner layer whose main ingredient is chromium oxide and an outer layer whose main ingredient is iron-chromium oxide, and the outer layers of soft magnetic alloy grains are inter-bonded.05-16-2013
20090160595Compact Power Semiconductor Package and Method with Stacked Inductor and Integrated Circuit Die - A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. It has a bonded stack of power IC die at bottom, a power inductor at top and a circuit substrate, made of leadframe or printed circuit board, in the middle. The power inductor has a inductor core of closed magnetic loop. The circuit substrate has a first number of bottom half-coil forming conductive elements beneath the inductor core. A second number of top half-coil forming conductive elements, made of bond wires, three dimensionally formed interconnection plates or upper leadframe leads, are located atop the inductor core with both ends of each element connected to respective bottom half-coil forming conductive elements to jointly form an inductive coil enclosing the inductor core. A top encapsulant protectively encases the inductor core, the top half-coil forming conductive elements, the bottom half-coil forming conductive elements and the circuit substrate.06-25-2009
20110012701MULTILAYER INDUCTOR - A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power routing between the top magnetic layer signal/power contacts and the bottom magnetic layer signal/power contacts. The top external conductive pattern accommodates a semiconductor chip in a flip chip configuration.01-20-2011
20090184794LAMINATED COIL - A laminated coil includes a laminated body having magnetic body sections that are provided on both main surfaces of a non-magnetic body section and include a plurality of stacked magnetic layers, the non-magnetic body section including at least one non-magnetic layer, and a coil including helically connected coil conductors provided in the laminated body. The conductor width of at least one of the coil conductors provided inside the non-magnetic body sections and the coil conductors provided on both main surfaces of the non-magnetic body sections is greater than the conductor width of the other coil conductors in the laminated body.07-23-2009
20110032066LAMINATED INDUCTOR WITH ENHANCED CURRENT ENDURANCE - A laminated inductor includes a plurality of magnetic plates, each having a surface to which a high-permeability magnetic body is attached, and at least one spacer assembly interposed between the magnetic plates. The spacer assembly includes two magnetic boards having moderate magnetic permeability and a magnetic board having low magnetic permeability interposed between the two moderate-permeability magnetic boards. Both moderate-permeability and low-permeability boards are provided, at a surface of each board, with a magnetic body having high permeability. A magnetic top lid and a magnetic bottom lid are respectively set on outside surfaces of the topmost and bottommost ones of the magnetic plates. The high-permeability magnetic bodies mounted to the magnetic plates and the arrangement of the spacer assembly help improve the characteristic of DC superimposition of the laminated inductor thereby enhancing current endurance thereof.02-10-2011
20090201116ANTENNA CIRCUIT AND TRANSPONDER - A transponder is provided capable of having desired characteristics by a method for forming a resonance circuit, despite the fact that its cost is low and its structure is simple. An antenna circuit is provided in the transponder and comprises an antenna conductor having a predetermined conductor pattern formed on the front surface of a substrate and a sheet metal disposed on the rear surface of the substrate. A part of the sheet metal is provided with a slit so formed that its start end and terminal end are opened to the area at which the sheet metal does not exist.08-13-2009
20090284340COMMON MODE FILTER - A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter 11-19-2009
20110140824PLANAR TRANSFORMER - A planar transformer suitable for intrinsically safe electronic circuits with a core, a first printed circuit board and a second printed circuit board. The first printed circuit board has a first winding and the second printed circuit board has a second winding. The planar transformer can be produced at a low cost and is compact, but is still suitable for connection to intrinsically safe operating circuits is implemented by at least one gap being asymmetrically split on the first printed circuit board and the second printed circuit board.06-16-2011
20090085708ELECTRONIC DEVICE - An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8.04-02-2009
20090085707ELECTRONIC DEVICE - An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.04-02-2009
20090085704CHIP INDUCTOR - A chip inductor includes a first substrate and a second substrate. The first substrate includes at least one first conductive strip line having end terminals at a surface of the first substrate and the second substrate includes at least one second conductive strip line having end terminals at a surface of the second substrate, wherein a pitch of the end terminals on the first substrate corresponds to a pitch of the end terminals on the second substrate. Furthermore, conductive studs are provided which connect the end terminals on the first substrate with the end terminals on the second substrate to form an inductor loop.04-02-2009
20090085705TRANSFORMER - A transformer including: a multilayer board; one or more input conductive lines formed on the multilayer board, whose both ends connected to input terminals of a positive signal and a negative signal, respectively; one output conductive line formed adjacent to the one or more input conductive lines to form an electromagnetic coupling with the one or more input conductive lines, whose one end is connected to an output terminal and another end is connected to a ground; a power supply pad formed in an area of the one or more input conductive lines; and a harmonics remover formed between the one end and the another end of the output conductive line to remove harmonics components of a signal outputted from the output conductive line, wherein a part of the one or more input conductive lines is formed on a top surface of the multilayer board and rest of the one or more input conductive lines is formed on a different layer from the top surface of the multilayer board, which are connected to each other via a via hole, and a portion of the output conductive line is formed on the top surface of the multilayer board and another portion of the output conductive line is formed on the different layer from the top surface of the multilayer board, which are connected to each other via the via hole, not to be directly connected to the one or more input conductive lines.04-02-2009
20090096567INDUCTOR STRUCTURE - An inductor structure includes a winding turn layer, a shielding layer, and a number of vias. The winding turn layer disposed above a substrate is formed by a number of turns connected in series and t has a first end and a second end. The first end is grounded. The shielding layer disposed between the winding turn layer and the substrate has a third end and a fourth end. At least two turns starting from the first end of the winding turn layer are projected onto the shielding layer. The vias are disposed between the winding turn layer and the shielding layer to at least electrically connect the third end and the fourth end of the shielding layer to a first turn of the winding turn layer. The first turn starts from the first end, and the winding turn layer and the shielding layer are electrically coupled in parallel.04-16-2009
20090015363INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn.01-15-2009
20110221560INTEGRATED CIRCUITS WITH SERIES-CONNECTED INDUCTORS - An integrated circuit inductor may have upper and lower loop-shaped line portions that are connected in series. The upper and lower portions may have 45° bends that form hexagonal or octagonal loops. Each loop portion may have one or more turns. Intervening metal-free regions of metal routing layers may be formed between the two layers to reduce capacitive coupling. Each loop portion may have sets of two or more metal lines shorted in parallel by vias. The upper and lower loops may be laterally offset or nested to reduce capacitive coupling.09-15-2011
20090201117CONTAINER WITH ELECTROMAGNETIC COUPLING MODULE - A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system.08-13-2009
20090002115METHOD TO IMPROVE INDUCTANCE WITH A HIGH-PERMEABILITY SLOTTED PLATE CORE IN AN INTEGRATED CIRCUIT - An inductor structure (01-01-2009
20090243781METHOD OF MANUFACTURING A CONDUCTOR CIRCUIT, AND A COIL SHEET AND LAMINATED COIL - A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the of the continuous conductor pattern.10-01-2009
20090243779METHOD AND SYSTEM FOR RECONFIGURABLE DEVICES FOR MULTI-FREQUENCY COEXISTENCE - Aspects of a method and system for reconfigurable devices for multi-frequency coexistence are provided. In this regard, an IC may be configured based on a frequency of signals processed by the IC. In instances that the IC may process signals of a first frequency, the IC may be configured such that a loop communicatively coupled to the integrated circuit may function as an inductor. In instances that the IC may process signals of a second frequency, the IC may be configured such that the loop may function as an antenna for transmitting and/or receiving the signals. The loop may be within and/or on the IC and/or a package such as a multilayer package to which the IC may be bonded. The loop may be fabricated with stripline and/or microstrip transmission line. In instances that the loop may function as an inductor, the loop may be communicatively coupled as part of a VCO tank circuit.10-01-2009
20090102592Multi-Primary Distributed Active Transformer Amplifier Power Supply and Control - An integrated power combiner is disclosed. The power combiner includes a first circular geometry primary winding having one or more inductive elements, such as an active winding with one or more driver stages. A circular geometry secondary winding is disposed adjacent to the first primary winding, such as an active winding with one or more driver stages. A second circular geometry primary winding is disposed adjacent to the secondary winding and has one or more inductive elements. One or more connections are provided between one or more of the inductive elements of the first circular geometry primary winding and one or more of the inductive elements of the second circular geometry primary winding.04-23-2009
20090102591Inductive Component and Method for Manufacturing an Inductive Component - A method for manufacturing an inductive component which is formed from a plurality of layers, wherein the method comprises the steps of a) arrangement of an electrically conductive material as a winding of the component on a first non-magnetic, dielectric ceramic layer; b) formation of at least one cutout which passes all the way through in the non-magnetic, dielectric ceramic layer; c) arrangement of a first magnetic ceramic layer on an upper face and a second magnetic ceramic layer on a lower face of the non-magnetic, dielectric ceramic layer; and d) carrying out a process step in which at least one of the magnetic ceramic layers is plastically deformed such that contact is made with the two magnetic ceramic layers in the area of the cutout, and the two magnetic ceramic layers form a magnetic core of the component.04-23-2009
20090243783Minimizing Electromagnetic Interference in Coil Transducers - Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.10-01-2009
20090243780FLAT MAGNETIC ELEMENT AND POWER IC PACKAGE USING THE SAME - A planar magnetic device 10-01-2009
20090243784LAMINATED COIL COMPONENT AND METHOD FOR PRODUCING THE SAME - A laminated coil component includes a laminate including laminated magnetic layers and a coil disposed in the laminate and including a plurality of internal electrodes. The number of the magnetic layers laminated in a non-superimposed area that does not overlap with the internal electrodes in the lamination direction is greater than the number of the magnetic layers laminated in a superimposed area that overlaps with the internal electrodes in the lamination direction.10-01-2009
20090243778INDUCTOR HAVING OPENING ENCLOSED WITHIN CONDUCTIVE LINE AND RELATED METHOD - Embodiments of an inductor including a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line are disclosed. Embodiments of a related method of designing the inductor are also disclosed.10-01-2009
20090315662INDUCTOR ELEMENT, INDUCTOR ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE WITH INDUCTOR ELEMENT MOUNTED THEREON - An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.12-24-2009
20120194314LOW-PROFILE INDUCATOR AND ITS FABRICATION METHOD - A low-profile inductor includes 08-02-2012
20100148910ELECTRONIC CIRCUIT DEVICE - An electronic circuit device 06-17-2010
20090079531Multipole coils - Multipole coils (03-26-2009
20090079530Forming a helical inductor - In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and claimed.03-26-2009
20100188182Narrowbody Coil Isolator - Disclosed herein are various embodiments of narrowbody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.07-29-2010
20100259352MINIATURE POWER INDUCTOR AND METHODS OF MANUFACTURE - Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.10-14-2010
20130214890High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application - A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer.08-22-2013
20130214891CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated.08-22-2013
20100013589SUBSTRATE INDUCTIVE DEVICES AND METHODS - Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.01-21-2010
20100001823Flexible Coil - The present invention is to provide a coil having flexibility even if it includes a core body. A flexible coil 01-07-2010
20100259349Magnetic Film Enhanced Inductor - An integrated magnetic film enhanced transformer and a method of forming an integrated magnetic film enhanced transformer are disclosed. The integrated magnetic film enhanced transformer includes an transformer metal having a first portion and a second portion, a top metal coupled to the transformer metal, a bottom metal coupled to the transformer metal, and an isolation film disposed between the first portion and the second portion of the transformer metal. The isolation film includes a magnetic material that can enhance a magnetic flux density B of the transformer, increase an electromotive force (EMF) of the transformer, and increase a magnetic permeability of the transformer.10-14-2010
20090295528AC/DC PLANAR TRANSFORMER - An inductive element including a magnetic core with a section received in a central opening defined in each of the layers in a multilayer circuit board. A primary winding, an auxiliary winding, and a secondary winding are each realized in conductive coils located on a plurality of layers in the circuit board. The secondary winding is separated from the other windings by a relatively-thick dielectric layer. Other dielectric layers separate each of the layers with the coils. EMI shields are provided on other layers. The coils are located in a central region of each layer so as to provide an adequate safety margin from the side edges of the inductive element.12-03-2009
20100225435Magnetic Film Enhanced Inductor - An integrated magnetic film enhanced inductor and a method of forming an integrated magnetic film enhanced inductor are disclosed. The integrated magnetic film enhanced inductor includes an inductor metal having a first portion and a second portion, a top metal or bottom metal coupled to the inductor metal, and an isolation film disposed one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal. The isolation film includes a magnetic material, such as a magnetic film.09-09-2010
20100148911Miniature Transformers Adapted For Use In Galvanic Isolators And The like - A component coil for constructing transformers and the transformer constructed therefrom are disclosed. The component coil includes a substrate having an insulating layer of material having top and bottom surfaces. First and second traces are included on the top and bottom surfaces. Each trace includes a spiral conductor. The inner ends of the spiral conductors are connected by a conductor that passes through the insulating layer. The first and second spiral conductors are oriented such that magnetic fields generated by the first and second spiral conductors have components perpendicular to the top surface and in the same direction. The component coils can be used to construct a power transformer or a galvanic isolator.06-17-2010
20100225434STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING SAME - A stacked semiconductor device assembly (09-09-2010
20100237976LOW-PROFILE INDUCTIVE COIL AND METHOND OF MANUFACTURE - Disclosed is an inductive coil comprising a non-conductive substrate, a plurality of insulator layers laminated in a stack over the non-conductive substrate, and a plurality of conductive layers interleaved between the insulator layers. A hole passes through the conductive and insulator layers, and a magnetic core is placed in the hole and over the substrate. Each of the conductive layers includes a single-layer conductive trace coiled around the hole with an isolating gap between each turn of the conductive trace. At least one plated via passes through at least one of the insulator layers to connect traces of at least two conductive layers. The inductive coil may be a Hearing Aid Compliant (HAC) T-coil, includable in a wireless communication device, such as a cellular phone. A method of manufacturing the inductive coil is also disclosed.09-23-2010
20120188047INDUCTOR STRUCTURE HAVING INCREASED INDUCTANCE DENSITY AND QUALITY FACTOR - Disclosed is an inductor structure. The inductor structure includes a base material, at least one bottom spiral conductor disposed on the base material, a middle spiral conductor disposed on the bottom spiral conductor, a top spiral conductor disposed on the middle spiral conductor, and dielectric material separating the bottom, middle and top spiral conductors. The at least one bottom spiral conductor is connected electrically in parallel to the middle spiral conductor and the middle spiral conductor is connected electrically in series to the top spiral conductor. The top spiral conductor is thicker, narrower and less tightly wound than the middle spiral conductor and the bottom spiral conductor.07-26-2012
20100219926LOW-PROFILE TRANSFORMER - The present invention provides an improved transformer (09-02-2010
20100253463INDUCTANCE PART AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an inductance part including a coiled conductor formed from a metal conductor, a magnetic body formed by pressure-molding a mixture of metal magnetic powder and bonding material in such a manner that the coiled conductor is embedded in the mixture, and a terminal derived from the coiled conductor. The coiled conductor is formed in a single layer with no insulating film on its surface. The metal magnetic powder of the magnetic body penetrates into the surface of the coiled conductor so as to make the filling factor of the metal magnetic powder in the magnetic body not less than 80% by volume.10-07-2010
20100253462SHORT HYBRID MICROSTRIP MAGNETIC RESONANCE COILS - A hybrid microstrip coil for magnetic resonance imaging including a microstrip assembly aligned in the superior/inferior (S/I) direction. In one example, the microstrip assembly has conductive strips disposed on one side of a substrate corresponding shield planes disposed on the other side of the substrate. The microstrip assemblies are coupled together by coaxial sections forming a continuous transmission line and having a specific overall electrical length.10-07-2010
20100141369Planar Inductor06-10-2010
20130127577Micromagnetic Device and Method of Forming the Same - A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.05-23-2013
20090278649Laminated Ceramic Electronic Component and Method for Producing the Same - A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of lead conductor pattern layers also overlaps each other to form lead conductors. One lead conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each lead conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil.11-12-2009
20090115563Laminated inductor and method of manufacture of same - A laminated inductor, in which there is extremely little tendency for cracking to occur between adjacent conductor patterns in portions of a laminate in the lamination direction even when the conductor pattern thickness is large, as well as a method of manufacturing such a laminated inductor, are provided.05-07-2009
20110032065Two Layer Transformer - One aspect of the invention relates to a symmetrical transformer with a stacked coil structure comprising two coils each having at least two turns, said coils being located in two conductive planes. The structure comprises four identical basic elements, each basic element providing a conductive path for part of said coils. The terminals of the transformer are located at opposite sites of the structure so that the structure can be easily connected in a chain.02-10-2011
20100219927ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face.09-02-2010
20130135074INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.05-30-2013
20130141206COMMON MODE NOISE FILTER - Disclosed herein is a common mode noise filter including: a plurality of insulation layers configuring a laminated body formed on a substrate; internal electrode coils included in the plurality of insulation layers; external electrode terminals connected to an end portion of the internal electrode coils; and a magnetic layer formed on a surface of the laminated body. According to the present invention, the common mode noise filter has the magnetic layer including the conductive metal on the uppermost layer thereof, such that the permeability of the ferrite composite may be increased and the ferrite powder may be effectively compensated for the eddy current loss of the internal electrode coil, thereby making it possible to improve the impedance characteristics of the common mode noise filter.06-06-2013
20110121934Lead Frame-based Discrete Power Inductor - A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.05-26-2011
20130147591MULTILAYERED INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered inductor, including: an inductor body; a coil part formed on the inductor body and having a conductive circuit and a conductive via; and external electrodes formed on both end surfaces of the inductor body, wherein the inductor body includes 65 to 95 wt % of a metallic magnetic material and 5 to 35 wt % of an organic material.06-13-2013
20130147592COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same.06-13-2013
20110006868ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.01-13-2011
20090066461PLANAR INDUCTIVE STRUCTURE - A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.03-12-2009
20110109416INDUCTOR OF CIRCUIT BOARD - An exemplary inductor of a circuit board includes a base portion of the circuit board, a plurality of through holes defined in two opposite sides of the base portion and a conductive wiring passing through the through holes and wrapping the base portion. The inductor arranged in the circuit board allows height of the printed circuit board to be minimized.05-12-2011
20110109415INDUCTOR STRUCTURE - The present invention discloses an improved inductor structure, which applies to the semiconductor field, particularly to a system-on-chip, and which comprises a substrate, a first conductive patterned film, and a first insulating layer formed between the substrate and the first conductive patterned film. The substrate has a base and an accommodation portion formed in the base. A magnetic material is filled into the accommodation portion to form a magnetic region. The accommodation portion is fabricated via etching the base or drilling a through-hole in the base. A plurality of conductive wires is arranged in a spiral way to form the first conductive patterned film. A protective layer covers the surface of the first conductive patterned film and isolates the contact of the first conductive patterned film and moisture.05-12-2011
20110025442COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.02-03-2011
20110109417POWER TRANSFORMER FOR RADIOFREQUENCY SIGNALS - The present invention relates to a power transformer for radiofrequency signals. The transformer is made in a low-cost, multilayer printed circuit board comprising at least the following stacked layers in succession: a first conductive layer, a first layer of dielectric substrate, a second conductive layer, a second layer of dielectric substrate, and a third conductive layer, the primary winding being formed by a turn printed in the second conductive layer, the secondary winding being formed by a first turn printed in the first conductive layer, this first turn being connected to a second turn printed in the third conductive layer, the turns of the secondary winding being placed opposite to the turn of the primary winding, the board being tightly held above and below by two plates of ferromagnetic material. Capacitive components connected between winding(s) on the one hand and ground on the other hand can improve the behavior of the proposed transformer. The invention applies notably to the production of HF transmitting radioelectric terminals.05-12-2011
20110043318GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die.02-24-2011
20110018672Integrated High Frequency BALUN and Inductors - Integrated high frequency balanced-to-unbalanced transformers and inductors suitable for operation in high frequencies, such as radio frequencies. Embodiments disclosed give consideration to issues related to the layout of the top and bottom inductors for the minimization of capacitive effects between layers. A displacement between the conductive paths of the top inductor and the bottom inductor is shown that provides for superior performance over prior art solutions.01-27-2011
20110115597TRANSFORMER DEVICES - A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.05-19-2011
20100148909HIGH ENERGY DENSITY INDUCTOR - A substrate layer for use in an inductor is provided. The substrate layer comprises traces disposed on a first side of the substrate layer, wherein the traces are configured to facilitate conduction of current in a winding of the inductor, a sealing layer disposed on a second side of the substrate layer, wherein the sealing layer is configured to provide a sealing border for an electrically isolated cooling channel and an interconnect foil disposed on the second side of the substrate layer, wherein the interconnect foil is configured to facilitate operationally coupling the substrate layer to a second substrate layer. Further, the first substrate layer and the second substrate layer may be operationally coupled to form a winding for use in an inductor with an electrically isolated cooling channel in between.06-17-2010
20130154786LAMINATED COMMON-MODE CHOKE COIL - A laminated common-mode choke coil offering higher insulation reliability has a glass ceramic layer, two spiral internal conductors facing each other and sandwiching the glass ceramic layer in between, and insulation layers sandwiching the two internal conductors, wherein the glass ceramic layer contains segregated Al regions and the maximum dimension t06-20-2013
20110084791MULTI-BAND LOW NOISE AMPLIFIER AND MULTI-BAND RADIO FREQUENCY RECEIVER INCLUDING THE SAME - An integrated circuit (IC) includes multiple circuits isolated with respect to one another. Each circuit of the multiple circuits includes an inductor pair formed in a loop pattern on a same layer as at least one other inductor pair from another circuit of the multiple circuits, such that the inductor pair surrounds and is isolated from the at least one other inductor pair.04-14-2011
20100164670COIL SUBSTRATE STRUCTURE, SUBSTRATE HOLDING STRUCTURE, AND SWITCHING POWER SUPPLY - A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 07-01-2010
20100164669PASSIVE ELECTRICAL COMPONENTS WITH INORGANIC DIELECTRIC COATING LAYER - A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer.07-01-2010
20100026440Co-Fired Ceramic Inductors With Variable Inductance, and Voltage Regulators Having Same - Ceramic inductors are made from stacked sheets of co-fired ceramic. At least one of the ceramic sheets has a slot with a conductor disposed in the slot. The conductor has a thickness equal to a thickness of the ceramic sheet containing the slot. The conductor has a large thickness (compared to prior art co-fired ceramic inductors) and therefore can carry large currents. The present ceramic inductor can be used in power electronics applications due to the ability to carry large currents. The present ceramic inductor preferably has an inductance that decreases with increasing current. A decreasing inductance characteristic tends to increase energy efficiency in a voltage regulator when the inductor is used as an output inductor. Specifically, the variable inductance tends to substantially increase energy efficiency at low current loads without adversely affecting efficiency at high loads.02-04-2010
20110128108TRANSFORMER - A transformer may include a semiconductor layer coil, a trench coil connected with the semiconductor layer coil in parallel, and a metal layer coil opposing both of the semiconductor layer coil and the trench coil. The semiconductor layer coil and the trench coil may be insulated from the metal layer coil by an insulating layer.06-02-2011
20110128109Laminate Device and Module Comprising Same - The laminate device of the present invention comprises magnetic layers and coil patterns alternately laminated, the coil patterns being connected in a lamination direction to form a coil, and pluralities of magnetic gap layers being disposed in regions in contact with the coil patterns.06-02-2011
20100225437MULTILAYER COIL COMPONENT - A multilayer coil component is provided in which solder fusibility and a self-alignment property are prevented from being degraded due to absorption of a flux in a soldering step. The multilayer coil component has no voids present at interfaces between internal conductors 09-09-2010
20090096566SPIRAL INDUCTOR DEVICE - A spiral inductor device is provided. The spiral inductor device comprises an insulating layer disposed on a substrate. A spiral conductive trace with multiple turns is disposed on the insulating layer, wherein the outermost turn and the innermost turn of the spiral conductive trace have a first end and a second end, respectively, and one of the first and second ends is connected to ground. A non-continuous spiral conductive trace with a single turn is disposed on the insulating layer, parallel and adjacent to the turn that belongs to the spiral conductive trace and is extended from the end of the spiral conductive trace without being connected to ground, wherein the non-continuous spiral conductive trace is connected to the ground.04-16-2009
20100182118Solid State Components Having an Air Core - Solid state components having an air core and methods of producing such components are presented. An air core component preferably has lower conducting bands, upper conducting, and conducting posts that collectively form a conducting coil. A coating material placed at least over the upper bands of the coil provides structural support for the coil. The coil can be built around or in a sacrificial core material that can be removed leaving an air core behind.07-22-2010
20090251267Inductors and methods of operating inductors - An inductor may include a conductive line including a material in which an electrical resistance varies depending on an electric field applied to the material and/or first and second electrodes electrically connected to first and second end portions of the conductive line, respectively. A method of operating an inductor may include applying current to a conductive line of the inductor. The conductive line may include a material in which an electrical resistance may vary depending on an electric field applied to the material. The current may be applied to the conductive line via first and second electrodes electrically connected to first and second end portions of the conductive line, respectively.10-08-2009
20080297300High Voltage Transformer12-04-2008
20110102123MULTILAYER INDUCTOR - This disclosure provides a multilayer inductor that includes a coil formed from coil electrodes each looping through a length of one turn and that is capable of preventing the occurrence of delamination. Each of a plurality of coil electrodes loops through a length of one turn on one of magnetic plurality of insulating layers so as to make a ring-shaped track when viewed in plan in a z-axis (stacking) direction. The coil electrodes include end portions located on the ring-shaped track and end portions located off the ring-shaped track, respectively. Additional coil electrodes are electrically connected to the plurality of coil electrodes. The additional coil electrodes include land portions, respectively, each overlapping a region surrounded by the end portions of the plurality of coil electrodes when viewed in plan in the z-axis direction.05-05-2011
20110102122INDUCTOR AND ELECTRIC POWER SUPPLY USING IT - A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.05-05-2011
20090153281METHOD AND SYSTEM FOR AN INTEGRATED CIRCUIT PACKAGE WITH FERRI/FERROMAGNETIC LAYERS - Methods and systems for an integrated circuit package with ferri/ferromagnetic layers are disclosed and may include processing a received signal via a hybrid including an integrated circuit bonded to a multi-layer package including integrated layers of ferrimagnetic material and/or ferromagnetic material, metal interconnect materials and insulating materials. The received signal may be filtered, amplified, and/or impedance matched via the integrated layers of ferrimagnetic material and/or ferromagnetic material. The integrated circuit may be hybridized to the multi-layer package utilizing a flip-chip bonding technique. The hybridized multi-layer package and integrated circuit may be coupled to a printed circuit board utilizing a flip-chip bonding technique. The ferromagnetic material and/or ferrimagnetic material may be deposited on the multi-layer package. The magnetic material may be deposited on the multi-layer package using an ink printing technique and/or a spin-on technique. One or more surface mount devices may be coupled to the multi-layer package.06-18-2009
20110074537info@sbpatentlaw.com - An electronic component having a coil includes a laminated body formed by laminating a plurality of magnetic body layers. The coil is formed by connecting coil electrodes in the laminated body. Nonmagnetic body layers are disposed on the laminated body to have a gap with the coil when seen in a plan view from a coil axis direction of the coil. The embodiment of an electronic component has a stair-like direct-current superposition characteristic.03-31-2011
20110074536ELECTRONIC CIRCUIT WITH AN INDUCTOR - An electronic device which includes an electronic component having a substrate and a plurality of metal interconnection layers, the plurality of metal interconnection layers having a top surface. It further comprises a dielectric layer situated above said metal interconnection layers, a conductive layer situated above said dielectric layer, an inductor coil and a ground shield, the inductor coil being formed in the conductive layer and the ground shield being formed in a layer of said plurality of metal interconnection layers.03-31-2011
20110068887ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS - Some embodiments include a die having a transformer. The transformer includes windings formed from a set of lines, such that no two lines belonging to any one winding are nearest neighbors. The lines are formed within one layer on the die. Other embodiments are described.03-24-2011
20120119866NON-MAGNETIC MATERIAL COMPOSITION FOR CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME, AND METHOD OF MANUFACTURING THE CERAMIC ELECTRONIC COMPONENT - There is provided a non-magnetic material composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a method of manufacturing the ceramic electronic component. The non-magnetic material composition for the ceramic electronic component includes a compound represented by Chemical Formula Zn05-17-2012
20110254649INTEGRAL PLANAR TRANSFORMER AND BUSBAR - The primary and/or secondary coils of a relatively high power planar transformer are integrated together with a laminated busbar, thereby incorporating together the planar transformer and the busbar as a single component. A coil is cut out or otherwise formed in at least one busbar conductor, and when electrically connected, the busbar coils act as part of the primary and/or secondary circuit of the transformer. One or more coil lead frames are embedded in the laminated stack, and when electrically connected, form the primary and/or secondary circuit, respectively, of the transformer. Insulating material coils are also embedded within the laminated stack. The center leg of an E-shaped ferrite core passes through the center opening of each of the busbar coils, the coil lead frames, and the insulating material coils. The E-shaped core is located next to (i.e., with an opening) or closed with, an I-shaped or E-shaped core.10-20-2011
20110248811STACKED DUAL INDUCTOR STRUCTURE - The dual inductor structure can include a first inductor including a first plurality of coils. Each coil of the first plurality of coils can be disposed within a different one of a plurality of conductive layers. The coils of the first plurality of coils can be vertically stacked and concentric to a vertical axis. The dual inductor structure further can include a second inductor including a second plurality of coils. Each of the second plurality of coils can be disposed within a different one of the plurality of conductive layers. The coils of the second plurality of coils can be vertically stacked and concentric to the vertical axis. Within each conductive layer, a coil of the second plurality of coils can be disposed within an inner perimeter of a coil of the first plurality of coils.10-13-2011
20100295648STACKED STRUCTURE OF A SPIRAL INDUCTOR - A stacked structure of a spiral inductor includes a first metal layer, a second metal layer, a first set of vias, and a second set of vias. The first metal layer includes a first segment, a second segment, and a third segment, wherein the layout direction of the third segment is different from the layout direction of the first and second segments. The second metal layer includes a fourth segment, a fifth segment, and a sixth segment connected to the fifth segment, wherein the layout direction of the sixth segment is different from the layout direction of the fourth and fifth segments. The first set of vias connects the first and fourth segments, and they construct a first shunt winding. The second set of vias connects the second and fifth segments, and they construct a second shunt winding. The third and sixth segments construct a crossover region.11-25-2010
20100295649INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn.11-25-2010
20100253464ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME - An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.10-07-2010
20080231406SURFACE MOUNT MAGNETIC DEVICE - A surface mount magnetic device includes a magnetic core assembly, a winding coil and an extension region. The magnetic core assembly includes a first magnetic part and a second magnetic part. The second magnetic part has a first surface and a second surface. The first surface of the second magnetic part is connected to second magnetic part such that a receptacle is formed between the first magnetic part and the second magnetic part. The winding coil is partially accommodated within the receptacle and includes at least two pins, wherein the pins are attached on the second surface of the second magnetic part. The extension region is integrally formed on the second surface of the second magnetic part.09-25-2008
20100265025INDUCTOR UTILIZING PAD METAL LAYER - An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnect is connected to the other end of the metal bridge. In addition, resistivity of the pad metal layer is lower than that of the metal spiral.10-21-2010
20090256668MULTILAYER ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME - A multilayer electronic component that can suppress the formation of projections and depressions on a surface, and an electronic component unit including the multilayer electronic component, are provided. In the multilayer electronic component, coil electrodes (10-15-2009
20080231407Coupled inductor structure - A coupled inductor structure applied in a first dielectric layer and a second dielectric layer disposed under the first dielectric layer includes a first inductor element disposed on the first dielectric layer and a second inductor element disposed on the second dielectric layer. The first inductor element has a first bending segment, a second bending segment connected to the first bending segment, and a third bending segment connected to the second bending segment. The second bending segment of the first inductor element has on the second dielectric layer a projection intersecting a second bending segment of the second inductor element. A relative position of the first bending segment of the first inductor element to a first bending segment of the second inductor element is opposite to another relative position of the third bending segment of the first inductor element to a third bending segment of the second inductor element.09-25-2008
20080284555Process for refurbishing an electrical device component comprising a laminate electrical insulation part and electrical device component comprising said part - This invention relates to an improved process for removing conductors and electrical insulation parts from electrical device components so that these devices can be refurbished with new insulation and conductors. This invention also relates to an electrical device component having an electrical winding support, a laminate electrical insulation part, an electrical conductor, and an encapsulating resin, that has a special laminate electrical insulation part that allows more efficient and environmentally friendly refurbishing.11-20-2008
20110163831Fully Differential, High Q, On-Chip, Impedance Matching Section - An inductor circuit is disclosed. The inductor circuit includes a first in-silicon inductor and a second in-silicon inductor each having multiple turns. A portion of the multiple turns of the second in-silicon inductor is formed between turns of the first in-silicon inductor. The first and second in-silicon inductors are configured such that a differential current flowing through the first in-silicon inductor and the second in-silicon inductor flows in a same direction in corresponding turns of inductors.07-07-2011
20110187487INDUCTOR FORMED ON A SEMICONDUCTOR SUBSTRATE - An inductor formed on a semiconductor substrate, comprising a coil formed with at least a single metal layer having a plurality of slots and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top surface of the single metal layer.08-04-2011
20110187486ELECTRONIC COMPONENT - This disclosure provides an electronic component that can suppress a decrease in the resonant frequency. The electronic component includes a multilayer body having plural insulating layers stacked in a staking direction. Outer electrodes are provided on facing lateral sides of the multilayer body and extend in the stacking direction. Coil conductors are stacked together with the insulating layers to form a coil. The thickness in the stacking direction of at least one of the coil conductors that is directly connected to one of the outer electrodes is smaller than that of the coil conductors that are not directly connected to any of the outer electrodes.08-04-2011
20110163832LAMINATED ELECTRONIC COMPONENT - The invention presents a laminated electronic component configured to include: first coil pattern formed on a plurality of insulating layers, and second coil pattern disposed to face first coil pattern through at least one insulating layer. Both ends of first coil pattern are coupled with external electrodes; both ends of second coil pattern are not coupled with the external electrodes.07-07-2011
20110254650ELECTRONIC COMPONENT - In an electronic component having a built-in coil composed of coil conductors with a length of one turn, the inductance value can be increased while suppressing generation of short circuits inside the coil conductors. The electronic component includes a multilayer body formed by stacking a plurality of magnetic layers on top of one another. The built-in coil includes coil conductors and via hole conductors. The coil conductors each have a ring-shaped coil portion having a cut out portion in one side of one corner thereof, and a connecting portion that form an obtuse angle with a side extending from one end portion of the coil portion and is positioned in a region enclosed or surrounded by the coil portion. Via hole conductors connect the plurality of coil conductors to one another.10-20-2011
200802041833D-COIL FOR SAVING AREA USED BY INDUCTANCES - Some embodiments discussed relate to an apparatus, including a planar coil that is disposed in a metallization above and perpendicular to a substrate. Some embodiments include a plurality of planar coils that are disposed in the metallization above and perpendicular to the substrate, and that may be electrically connected, or only inductively coupled. A process includes the formation of the planar coil. A method includes using the planar coil as an inductor that is disposed perpendicular to the substrate. A method includes a plurality of spaced apart planar coils that are used as a transformer apparatus.08-28-2008
20100245011Integrated or printed margarita shaped inductor - An integrated printed inductor has a set of open petal loops, connected together in series. For a given inductance value higher quality factor and higher frequency value result using an equal chip surface area. With the same fabrication cost and equal occupied area, higher quality factor values at higher frequency can be achieved. The innovative shape is such that secondary mutual coupling effects occur and contribute to increases of overall inductance values. Small current loops arranged as petals corresponding to inductance value LO are connected in series for the inductance value to add up to a higher value. The loops are connected along a circular path to minimize the total chip area occupied. A secondary loop in the center of the inductor results in a stronger magnetic flux and a higher inductance value, due to both self inductance of the secondary loop and mutual inductance of it with the petals.09-30-2010
20120146757THREE DIMENSIONAL INDUCTOR - A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.06-14-2012
20100283570NANO-ENCAPSULATED MAGNETIC PARTICLE COMPOSITE LAYERS FOR INTEGRATED SILICON VOLTAGE REGULATORS - A method of forming an integrated silicon voltage regulator (ISVR) comprises providing a nano-encapsulated magnetic particle (NEMP) suspension, depositing a first layer of the NEMP suspension on an integrated circuit (IC) device, curing the first layer of the NEMP suspension to form a first NEMP composite layer, forming at least one inductor wire on the NEMP composite layer, depositing an interlayer dielectric material over the inductor wire, depositing a second layer of the NEMP suspension on the interlayer dielectric material, and curing the second layer of the NEMP suspension to form a second NEMP composite layer.11-11-2010
20110133879STACKED INDUCTOR - A stacked inductor with combined metal layers is represented in this invention. The stacked inductor includes: a top layer metal coil, and at least two lower layer metal coils, the metal coils being aligned with each other; adjacent metal coils being connected at the corresponding ends through a via; wherein, each of the lower layer metal coils is consisted of plural layers of metal lines which are interconnected. With the same chip area, the stacked inductor of the present invention can achieve higher inductance and Q factor because of the mutual inductance generated from the plural layers of metal lines and the reduced parasitic resistance.06-09-2011
20110133880INTEGRATED CIRCUIT INDUCTOR WITH INTEGRATED VIAS - Integrated circuit inductors (06-09-2011
20110133881LAMINATED INDUCTOR, METHOD FOR MANUFACTURING THE LAMINATED INDUCTOR, AND LAMINATED CHOKE COIL - Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor (06-09-2011
20110133874MAGNETIC COMPONENTS AND METHODS FOR MAKING THE SAME - A method for making a magnetic component is provided. The method comprises providing a core with one or more ridges protruding from one or more surfaces of the core, depositing one or more electrically conductive materials on the core, and removing at least a portion of the one or more ridges to form one or more continuous conductors wound around the core. Each of the one or more continuous conductors defines at least one insulating gap. Further, a magnetic component and methods for making the magnetic component are also presented.06-09-2011
20110133877Stacked inductor with multi paths for current compensation - A multi-path stacked inductor for current compensation is represented in this invention. This structure includes top and bottom metal trace, which are aligned with each other. Each metal trace consists of multi paths. The inner path in top metal flips over to the outer path in the bottom metal, while the outer path in top metal flips over to the inner path in the bottom metal. These paths join together at the end of the metal trace with via holes. Skin effect and current crowding effect are reduced by means of this method. This stacked inductor possesses larger inductance than single layer spiral inductor, with relatively higher Q factor.06-09-2011
20110133876Manufacture method for IC process with TOP and TOP-1 metal layers thickened and stacked inductor manufactured by this method - A manufacture method for IC process with top and top-1 metal layers thickened and stacked inductor manufactured by this method is represented in this invention. This method includes: with multi metal layers, and the thickness of top and top-1 metal layers are more than 2.8 um. Thickened top and top-1 metal layers can reduce the resistance of top and top-1 metal layers, so can increase the Q factor of inductor.06-09-2011
20110133875Stack inductor with different metal thickness and metal width - A stacked inductor with different metal thickness and metal width is represented in this invention, this structure comprise: top and bottom metal trace, which is aligned with each other. The thickness and width of top and bottom metal trace are different. The top and bottom metal trace are connected at the end of metal trace with via holes. The inductance is increased with the use of the mutual inductance between top and bottom metal layers, and the parasitic resistor is reduced by means of different top and bottom metal width. This stacked inductor possesses larger inductance than single layer spiral inductor with relatively higher Q factor.06-09-2011
20110260823TRANSMISSION LINE IMPEDANCE TRANSFORMER AND RELATED METHODS - A transmission line impedance transformer may include a printed circuit board (PCB) having a dielectric layer and an electrically conductive layer thereon defining a medial interconnection portion, and first and second lateral loop portions extending laterally outwardly from opposing first and second sides of the medial interconnection portion. The PCB also may have first ferrite body receiving openings therein adjacent the first lateral loop portion and second ferrite body receiving openings therein adjacent the second lateral loop portion. The transmission line impedance transformer may also include a first ferromagnetic body extending through the first ferrite body receiving openings to surround the first lateral loop portion, and a second ferromagnetic body extending through the second ferrite body receiving openings to surround the second lateral loop portion.10-27-2011
20110001599LAMINATED INDUCTOR - A laminated inductor includes a laminate having a plurality of insulating layers, a helical coil and first and second external electrodes on an underside of the laminate. The helical coil has coiled electrodes, each coiled up in one turn, and the first and second external electrodes are connected to respective, or corresponding, ends of the helical coil. Each of the coiled electrodes of the helical coil follow a path along the periphery of one of the insulating layers and include first end located in the path and second end located outside the path. The helical coil and the first external electrode are connected to each other by a lead via conductor formed in a space that is enclosed by parts of the coiled electrodes including the first and second ends.01-06-2011
20110133878Stacked differential inductor - A structure of stack differential inductor is represented in this invention; this structure includes top and bottom metal traces, which are aligned with each other and symmetric. Starting from one port and after half turn, the top metal trace is connected to bottom metal trace through via holes. Meanwhile, after another half turn, the bottom trace is connected to top trace through via holes. The inductance is increased by means of this method. With the same chip area, this stack differential inductor possesses larger inductance and higher Q factor because of the larger mutual inductance between top and bottom metal than conventional differential inductor.06-09-2011
20110169597INDUCTOR DEVICES - An inductor device comprising a first conductive pattern on a first layer of a substrate, a second conductive pattern on a second layer of the substrate, and a first region between the first layer and the second layer through which at least one hole is coupled between the first dielectric layer and the second dielectric layer, wherein a magnetic field induced by at least one of the first conductive pattern or the second conductive pattern at the first region is more intensive than that induced by at least one of the first conductive pattern or the second conductive pattern at a second region between the first conductive layer and the second conductive layer.07-14-2011
20100117779INDUCTOR AND ELECTRIC POWER SUPPLY USING IT - An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.05-13-2010
20130009740COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.01-10-2013
20100176905Magnetic Device Having a Conductive Clip - A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.07-15-2010
20080218302Inductive conductivity sensor - A conductivity sensor for measuring conductivity of a medium surrounding the conductivity sensor includes a first toroidal coil bounding a medium-receiving passageway and serving for inducing an electrical current in the medium, and a second toroidal coil also bounding the passageway and serving for registering a magnetic field produced by the electrical current. At least one of the toroidal coils has a plurality of first conductor segments, which extend in a plane of a multi-ply circuit board, a plurality of second conductor segments, which extend in a second plane of the circuit board, and a plurality of through-contacts, which connect the first conductor segments with the second conductor segments, wherein the first conductor segments, the second conductor segments and the through-contacts form, together, the windings of a toroidal coil.09-11-2008
20100194514COUPLED INDUCTOR STRUCTURE - A coupled inductor structure applied in a first dielectric layer and a second dielectric layer disposed under the first dielectric layer includes a first inductor element disposed on the first dielectric layer and a second inductor element disposed on the second dielectric layer. The first inductor element has a first bending segment, a second bending segment connected to the first bending segment, and a third bending segment connected to the second bending segment. The second bending segment of the first inductor element has on the second dielectric layer a projection intersecting a second bending segment of the second inductor element. A relative position of the first bending segment of the first inductor element to a first bending segment of the second inductor element is opposite to another relative position of the third bending segment of the first inductor element to a third bending segment of the second inductor element.08-05-2010
20100194513LAYERED INDUCTOR - A layered inductor 08-05-2010
20110148563PLANAR TRANSFORMER AND WINDING ARRANGEMENT SYSTEM BACKGROUND - A winding arrangement system of a planar transformer includes a primary winding arranges on a number of first circuit layers of a printed circuit board (PCB), and two secondary winding arranged on a number of second circuit layers. The turns of the primary winding are coupled in series. Each second circuit layer has a winding turn. A first half of the winding turn belongs to one of the two secondary winding. A second half of the winding turn belongs to the other of the two secondary winding. The first and second halves of winding turns on each of the second secondary circuit layers share a common grounded node. All of the first halves of winding turns are coupled in parallel. All of the second halves of winding turns are also coupled in parallel.06-23-2011
20110181383Micromagnetic Device and Method of Forming the Same - A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.07-28-2011
20090085706PRINTED CIRCUIT BOARD COIL - A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.04-02-2009
20090201115INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE - An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality.08-13-2009
20120306609COMMON MODE CHOKE COIL AND HIGH-FREQUENCY COMPONENT - A common mode choke coil includes a first coil element and a second coil element connected in series between a first port and a second port, and a third coil element and a fourth coil element connected in series between a third port and a fourth port. With normal mode current flow through the first and second transmission lines, a first closed magnetic circuit forms in which magnetic flux passing through the first and second coil elements forms a closed loop, and a second closed magnetic circuit forms in which a magnetic flux passing through the third coil element and the fourth coil element forms a closed loop. With common mode current flow in the first and second transmission lines, a third closed magnetic circuit forms in which a magnetic flux passing through the first through fourth coil elements forms a closed loop.12-06-2012
20120306608WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure.12-06-2012
20110304422TRANSFORMER ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, and a second spiral wound inductive coil formed on the first surface; the first and second spiral wound inductive coils forming a double spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described.12-15-2011
20100259351LOW PROFILE LAYERED COIL AND CORES FOR MAGNETIC COMPONENTS - A low profile magnetic component includes at least one coil layer defining a generally planar coil winding having a center area and a number of turns extending about the center area. A body encloses the coil layer, and is fabricated from one of a dielectric material and a magnetic material. A magnetic core material occupies at least the center area of the coil layer.10-14-2010
20110050381METHOD OF PRODUCING A MULTI-TURN COIL FROM FOLDED FLEXIBLE CIRCUITRY - A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.03-03-2011
20110050380COIL APPARATUS - A coil apparatus comprising: a core-insertion hole; a plurality of wiring layers including a first wiring layer and a second wiring layer; a coil pattern, which is formed on each of the plurality of wiring layers into a spiral shape around the core-insertion hole, wherein the coil patterns is connected in series and integrated so as to form a single coil formed of laminated wiring layers; and a slit, which divides at least part of each of the coil patterns formed on each of the respective the first wiring layer and the second wiring layer into a plurality of wiring patterns, wherein an outermost wiring pattern on the first wiring layer is connected to an innermost wiring pattern on the second wiring layer, and wherein an innermost wiring pattern on the first wiring layer is connected to an outermost wiring pattern on the second wiring layer.03-03-2011
20110050379PLANAR TRANSFORMER - There is provided a planar transformer having a dual-bobbin structure. The planar transformer includes a core unit including a pair of cores that are electromagnetically coupled to each other, and a bobbin unit including an inner bobbin part and a board part. The inner bobbin part includes a bobbin body having a predetermined volume and having a through hole into which the core is inserted, and a first winding wound around an outer circumferential surface of the bobbin body, and the board part includes at least one board including a board body having a predetermined surface area and having a through hole into which the inner bobbin part and the core are inserted, and a second winding formed on at least one surface of the board body and causing electromagnetic action with the first winding.03-03-2011
20100127812CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated.05-27-2010
20110316658THIN TYPE COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A thin type common mode filter includes an insulating flexible substrate, a first magnetic material layer, a first coil leading layer, a coil main body multi-layer, a second coil leading layer, and a second magnetic material layer. The first coil leading layer is formed on a first surface of the flexible substrate, and the first coil leading layer is formed on a second surface of the flexible substrate opposite to the first surface. The coil main body multi-layer, the second coil leading layer, and the second magnetic material layer are sequentially stacked on the first coil leading layer.12-29-2011
20110316657Three Dimensional Wire Bond Inductor and Transformer - A three-dimensional inductor or transformer for an electronic packaging system that includes a plurality of conductive traces and a plurality of conductive wire bonds. The traces are located in a single layer, and each have a first and second pad. Each of the wire bonds couples the second pad of one trace to the first pad of another trace. The trace and wire bonds create a continuous conductive path from the first pad of a first trace to the second pad of a last trace. Passing a current from the first trace to the last trace creates an electromagnetic field between the single layer and the wire bonds. The transformer includes two independent and electromagnetically coupled inductors that can be interleaved. The continuous conductive path can be solenoid-shaped. A shielding layer can also be included that blocks the substrate from the electromagnetic field of the inductor or transformer.12-29-2011
20100033287INTEGRATED PASSIVE DEVICE AND IPD TRANSFORMER - Provided are an integrated passive device (IPD) and an IPD transformer. The integrated passive device includes a dielectric laminated substrate, a first conductive layer, a buffer layer, and a second conductive layer. The first conductive layer is formed in the dielectric laminated substrate. The buffer layer is formed on one region of the first conductive layer in the dielectric laminated substrate. The second conductive layer is formed on the buffer layer such that a portion of the second conductive layer is exposed to the outside of the dielectric laminated substrate.02-11-2010
20120044034SYMMETRICAL INDUCTOR - A symmetrical inductor having at least one inductor turn. Each inductor turn has a plurality of separate conductive paths having substantially equal inductance. The inductor also comprises a plurality of crossing points. At each crossing point, some of the conductive paths within a given inductor turn cross over each other to change the order in which they appear within the inductor turn.02-23-2012
20100060403DUAL INDUCTANCE STRUCTURE - A dual inductance structure including a substrate, a first inductance element, a second inductance element and a grounding element is provided. The substrate has a layout layer and a grounding layer. The first inductance element has a first and a second conductor. The second inductance element has a third and a fourth conductor. The grounding element has a first and a second grounding portion. The first grounding portion is on the grounding layer and located at an area between the first conductor and the third conductor. At least a part of the second grounding portion is on the grounding layer and located at an area between the first conductor and the second conductor. At least another part of the second grounding portion is on the grounding layer and located at an area between the third conductor and the fourth conductor.03-11-2010
20110156854Spiral Inductor Device - A spiral inductor device is provided. The spiral inductor device includes a first spiral conductive trace with multiple turns and a second spiral conductive trace with multiple turns adjacent thereto, disposed on an insulating layer over a substrate, wherein the outermost turn and the innermost turn of the first spiral conductive trace have a first end and a second end, respectively, the outermost turn and the innermost turn of the second spiral conductive trace have a third end and a fourth end, respectively, and the second and fourth ends are connected to ground. A non-continuous spiral conductive trace with a single turn is disposed on the insulating layer, parallel and adjacent to the outermost turn of the first spiral conductive trace, wherein the non-continuous spiral conductive trace is connected to the ground and at least a portion thereof is disposed between the first and the second spiral conductive traces.06-30-2011
20110025443APPARATUS AND METHOD FOR WAFER LEVEL FABRICATION OF HIGH VALUE INDUCTORS ON SEMICONDUCTOR INTEGRATED CIRCUITS - An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits. The apparatus and method includes fabricating a semiconductor wafer including a plurality of dice, each of the dice including power circuitry and a switching node. Once the wafer is fabricated, then a plurality of inductors are fabricated directly onto the plurality of dice on the wafer respectively. Each inductor is fabricated by forming a plurality of magnetic core inductor members on an interconnect dielectric layer formed on the wafer. An insulating layer, and then inductor coils, are then formed over the plurality of magnetic core inductor members over each die. A plated magnetic layer is formed over the plurality of inductors respectively to raise the permeability and inductance of the structure.02-03-2011
20090002114INTEGRATED INDUCTOR - An integrated inductor has a winding. The winding includes a first level metal layer inlaid in a first dielectric layer, a second level metal layer inlaid in a second dielectric layer above the first dielectric layer, and a first line-shaped via structure inlaid in a slot of a third dielectric layer interposed between the first and second dielectric layers for interconnecting the first and second level metal layers.01-01-2009
20120007709CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component 01-12-2012
20120013429MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Provided is a multilayer inductor and a method of manufacturing the same. The multilayer inductor includes a plurality of deposited ferrite sheets, a coil part constituted by a plurality of internal electrode patterns and internal electrode vias formed on the plurality of ferrite sheets, non-magnetic vias formed at arbitrary positions of the plurality of ferrite sheets and filled with a non-magnetic material of paste so that a magnetic flux formed around the coil part can be dispersed, and a gap layer formed of a non-magnetic ferrite disposed at a center of the deposited ferrite sheets. Since a non-magnetic via is formed in the multilayer inductor, a magnetic flux propagation path in a coil can be dispersed and blocked to suppress magnetization at a high current and thus improve variation in inductance according to current application.01-19-2012
20120056705LAYERED INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided a layered inductor and a manufacturing method of the layered inductor. There is provided a layered inductor, comprising: a main body in which a plurality of non-magnetic layers are stacked; coil parts ha-ving a plurality of conductor patterns and a plurality of via electrodes formed on the plurality of non-magnetic layers; a plurality of magnetic paths formed in the inner central portion of the coil parts and passing the magnetic flux induced from the coil parts therethrough; and first and second external electrodes formed on the external surface of the main body to be connected to both ends of the coil part, respectively.03-08-2012
20120154097PLANAR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING - A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein.06-21-2012
20110063066SPACE TRANSFORMER FOR PROBE CARD AND METHOD OF REPAIRING SPACE TRANSFORMER - A space transformer for a probe card includes: a multilayered circuit board having first and second faces which face each other and a plurality of side faces connecting the first and second faces; a plurality of channels including a first pad formed on the first face and receiving an electrical signal applied from the exterior, a second pad formed on the second face, to which a probe is connected, and a through wiring penetrating the multilayered circuit board and connecting the first and second pads; and side wirings formed on the side faces and connecting first and second pads of a damaged channel among a plurality of channels. When a portion of channels transferring an electrical signal to probes is damaged, the space transformer can repair the damaged channel by means of the side wirings.03-17-2011
20110080245MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first dielectric layer, a second dielectric layer, a first conductor path, a second conductor path and a soldered joint. The first dielectric layer has a first side and a second side. The second dielectric layer has a first side and a second side, where the first side of the second dielectric layer facing towards the first side of the first dielectric layer. The first conductor path is disposed on the first side of the first dielectric layer. The second conductor path is disposed on the first side of the second dielectric layer. The soldered joint is disposed between the first dielectric layer and the second dielectric layer, where the soldered joint electrically connects the first conductor path to the second conductor path. The first dielectric layer extends continuously through an area surrounding the soldered joint.04-07-2011
20090134964Lead frame-based discrete power inductor - A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.05-28-2009
20120154096Transformer - The invention discloses an RF ASIC, (06-21-2012
20110063067Inter-Helix Inductor Devices - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end.03-17-2011
20120105188STACKED INDUCTOR USING MAGNETIC SHEETS, AND METHOD FOR MANUFACTURING SAME - The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics. In order to achieve the objective, the present invention provides a multilayered chip power inductor using a magnetic sheet, characterized in that a plurality of magnetic sheets are laminated, wherein an electrical conductive circuit is formed on the surfaces of said sheets; that a terminal is formed at an outermost part; that said electrical conductive circuit and said terminal are electrically connected through via holes, and form a circuit in the form of a coil; and that a magnetic core is inserted into said circuit, and a method for manufacturing the same.05-03-2012
20120119867MULTILAYER COIL COMPONENT - A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.05-17-2012
20110102124ELECTRONIC COMPONENT - In an electronic component, a multilayer body includes a plurality of insulator layers stacked on top of one another. A first coil is provided in the multilayer body, includes a first coil axis and extends toward the positive side in the z-axis direction while circling counterclockwise around the first coil axis. A second coil is connected to the first coil, is provided in the multilayer body, includes a second coil axis, and extends toward the negative side in the z-axis direction while circling counterclockwise around the second coil axis. When viewed in plan from the z-axis direction, the first coil axis is disposed inside the second coil and the second coil axis is disposed inside the first coil.05-05-2011
20100253461PLANAR TRANSFORMER WITH BOARDS - Transformers (10-07-2010
20100245012Integrated Spiral Inductor - An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors with shields to increase circuit Q. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator. The VCOs in the PLLs are centered using a control circuit to center the tuning capacitance range. A differential crystal oscillator is advantageously used as a frequency reference. Differential signal transmission is advantageously used throughout the receiver. ESD protection is provided by a pad ring and ESD clamping structure that maintains signal integrity. Also provided are shunts at each pin to discharge ESD build up. The shunts utilize a gate boosting structure to provide sufficient small signal RF performance, and minimal parasitic loading.09-30-2010
20100245013MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component is provided which includes layers composed of different materials and bonded together and which is capable of suppressing the occurrence of delamination at a bonded portion between the layers composed of different materials. A magnetic first layer is composed of a material with relatively high magnetic permeability. A second magnetic layer is composed of a material with relatively low magnetic permeability. Boundary magnetic layers are provided between the two magnetic layers and include a partial magnetic layer composed of the same material as the first magnetic layer and a partial magnetic layer composed of the same material as the second magnetic layer. The partial magnetic layers are provided to be adjacent to each other in the boundary magnetic layers.09-30-2010
20120126927COIL APPARATUS - Disc-type coil lamination work is facilitated, and a manufacturing cost is reduced. A plurality of disc-type coils each including a discoid insulating substrate 05-24-2012
20120161914TRANSFORMER - There is provided a transformer having a minimized thickness. The transformer includes: insulating layers; and coil units including primary and secondary coils disposed on the insulating layers to have a common center.06-28-2012
20100207715CHOKE INTEGRATED INTO A PRINTED CIRCUIT - Choke printed on a material of thickness H, the choke including one or more turns characterized in that a turn includes a first metallized track deposited on a first face of the material, of a second metallized track deposited on a second face of the material, a track deposited on the first face being united with a track deposited on the second face by means of at least one metallized hole passing through the thickness of the material.08-19-2010
20120133474DISC-TYPE COIL - In a disc-type coil that enables assuring a sufficiently high value of a flowing current to increase an output and comprises: a discoid insulating substrate 05-31-2012
20120133473INDUCTIVE COMPONENT HAVING TERMINAL WINDING - An inductive component formed on a substrate (05-31-2012
20120133472ELECTRONIC COMPONENT - An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.05-31-2012
20120133471High-k Transformers Extending into Multiple Dielectric Layers - A device includes a first plurality of dielectric layers over a substrate and a second plurality of dielectric layers over the first plurality of dielectric layers. A metal inductor includes a first metal portion, a second metal portion, a third metal portion, and a fourth metal portion, wherein each of the first, the second, the third, and the fourth metal portions extends into the first and the second plurality of dielectric layers. A first metal bridge connects the first metal portion to the second metal portion, wherein the first metal bridge extends into the first plurality of dielectric layers and not into the second plurality of dielectric layers. A second metal bridge connects the third metal portion to the fourth metal portion, wherein the second metal bridge extends into the second plurality of dielectric layers and not into the first plurality of dielectric layers.05-31-2012
20120249281INDUCTOR AND EDDY CURRENT SENSOR INCLUDING AN INDUCTOR - An inductor and an eddy current sensor including an inductor are disclosed. The inductor includes a patterned metal layer arranged on an insulating substrate. The inductor is capable of sensing eddy current within a high temperature region.10-04-2012
20120169447NANOCOMPOSITE POWDER FOR INNER ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.07-05-2012
20120313743LAMINATED ELECTRONIC COMPONENT EQUIPPED WITH INDUCTOR - A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.12-13-2012
20100052838ELECTRONIC COMPONENT - An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed.03-04-2010
20100052837Integrated Circuit Multilevel Inductor - An integrated circuit (IC) multilevel inductor structure is provided. The IC multilayer inductor structure is made from an IC including a plurality of circuit layers, where the inductor is a three-dimensional (3D) loop formed over a plurality of the circuit layers. In a simple example, if the IC includes a first circuit layer and a second circuit layer, then the inductor 3D loop includes a first partial loop portion formed on the first circuit layer, a second partial loop portion formed on the second circuit layer, and a via connecting the first and second partial loop portions. More generally, the inductor typically includes a plurality of 3D loops. A first plurality of 3D loops is formed between the input and an nth circuit layer, and a second plurality of 3D loops is formed between the nth circuit layer and the output.03-04-2010
20120075050CIRCUIT DEVICE - The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern.03-29-2012
20100271163OPEN MAGNETIC CIRCUIT MULTILAYER COIL COMPONENT AND PROCESS FOR PRODUCING THE OPEN MAGNETIC CIRCUIT MULTILAYER COIL COMPONENT - An open magnetic circuit multilayer coil component includes a laminate with magnetic layers, a coil, and a nonmagnetic layer provided within the laminate so as to cross a magnetic path formed by energization of the coil. A nonmagnetic material constituting the nonmagnetic layer is a Zn—Cu-based ferrite nonmagnetic material, and a magnetic material constituting the magnetic layer is a magnetic material containing 100 parts by weight of an Ni—Zn—Cu-based magnetic ferrite material and 0.1 to 2.0 parts by weight, in terms of Co10-28-2010
20100007456MANUFACTURING OF AN ELECTRONIC CIRCUIT HAVING AN INDUCTANCE - An electronic circuit has an inductor. The inductor comprises a first number of electrically conductive tracks (01-14-2010
20090027150INDUCTANCE WITH A SMALL SURFACE AREA AND WITH A MIDPOINT WHICH IS SIMPLE TO DETERMINE - An inductance formed in a stack of insulating layers, the inductance comprising first and second access terminals and first and second half-loops distributed in the stack of insulating layers on a number of distinct levels greater than or equal to four. For each level, each first half-loop is at least partly symmetrical to one of the second half-loops. All the first half-loops are series-connected according to a first succession of first half-loops to form first loops between the first access terminal and a midpoint and all the second half-loops are series-connected according to a second succession of second half-loops to form second loops between the second output terminal and the midpoint.01-29-2009
20100328011MODE-SWITCHING TRANSFORMER - A mode-switching transformer comprising a first line in common mode and a second line in differential mode, each line comprising two sections in series respectively coupled with one of the two sections of the other line and all sections having the same lengths, the common mode line being connected in series with a capacitor, to lower the central frequency of the transformer passband, the λ/4 lengths of the sections being chosen to correspond to a central frequency greater than the central frequency desired for the transformer.12-30-2010
20100328009ELECTRONIC COMPONENT - An electronic component includes overlapping coils in a rectangular laminate to form a substantially annular orbit. The orbit passes about an intersection of diagonal lines of an insulator layer of the laminate and is divided into a first orbit portion and a second orbit portion by a straight line parallel to a short side of the insulator layer. When an orbit obtained by the axisymmetric movement of the first orbit portion relative to the straight line is defined as a third orbit portion, a part of the second orbit portion overlaps with a part of the third orbit portion, and the non overlapped portion of the second orbit portion is positioned closer to the intersection than the non overlapped portion of the third orbit portion. A via hole conductor is provided in a region outboard an outer side of the non overlapping portion of the second orbit portion and inboard an outer side of the non overlapping portion of the third orbit portion.12-30-2010
20080297299VERTICALLY FORMED INDUCTOR AND ELECTRONIC DEVICE HAVING THE SAME - Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.12-04-2008
20080297298TUNABLE EMBEDDED INDUCTOR DEVICES - The invention provides tunable embedded high frequency inductor devices. The inductor device comprises a dielectric substrate. A first conductive line is disposed on a first surface of the dielectric substrate. A second conductive line is disposed on a second surface of the dielectric substrate. An interconnection is disposed perforating the dielectric substrate and connecting the first conductive line with the second conductive line. A coupling region is defined between the first and the second conductive lines. A conductive plug connecting the first conductive line and the second line is disposed in the coupling region. Alternatively, an opening is disposed in the first and second conductive lines to tune inductance of the inductor.12-04-2008
20110018673ELECTRONIC COMPONENT - An electronic component includes a coil whose inductance changes in accordance with the magnitude of a current and in which abrupt reduction in the inductance due to magnetic saturation is suppressed. A stack formed by a plurality of stacked first magnetic layers includes a coil formed by coil electrodes connected to one another in the stack. A first nonmagnetic layer is arranged in such a manner as to cut across the coil. When viewed in a stacking direction, a second nonmagnetic layer is formed in a region outside of a region in which the coil is formed. The structure of the second nonmagnetic layer on the upper side of the first nonmagnetic layer in the stacking direction is different from a structure of the second magnetic layer on the lower side of the first nonmagnetic layer in the stacking direction.01-27-2011
20110037556PRINTED CIRCUIT BOARD - A printed circuit board includes a first layer, a second layer, a number of vias each passing through the first and second layers, and a number of transmission lines. Each transmission line is connected between bonding pads of the two of the number of vias to form a helical-shaped transmission path by the vias and the transmission lines. As a result, the printed circuit board can generate inductive effect.02-17-2011
20110037555TRANSFORMER-BASED CIRCUIT WITH COMPACT AND/OR SYMMETRICAL LAYOUT DESIGN - A transformer-based circuit has at least a first port and a plurality of second ports. The transformer-based circuit includes a first winding conductor and a plurality of second winding conductors. The first winding conductor is electrically connected to the first port, and has a plurality of sectors connected in series to thereby form a plurality of loops, where the loops are arranged in a concentric-like fashion. The second winding conductors are magnetically coupled to the first winding conductor; besides, the second winding conductors are electrically connected to the second ports, respectively. Overall layout patterns of the second winding conductors are identical to each other. The first winding conductor acts as one of a primary winding conductor and a secondary winding conductor, and each of the second winding conductors acts as the other of the primary winding conductor and the secondary winding conductor.02-17-2011
20120268230MULTILAYER TYPE POWER INDUCTOR - Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.10-25-2012
20120268229Compact Vertical Inductors Extending in Vertical Planes - A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.10-25-2012
20120319811MANUFACTURING METHOD OF COMMON MODE FILTER AND STRUCTURE OF THE SAME - A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced.12-20-2012
20120081202HIGH SPEED TRANSFORMER - Embodiments of the present invention provide novel techniques for creating a high speed transformer such as a pulse transformer. In particular, a secondary coil of the high speed transformer may include a single turn. The use of a single turn secondary coil simplifies the design and manufacture of the transformer and aids in more efficient inspections. Further, the single turn secondary coil transformer may reduce the number of vias used to interconnect the components of the transformer. Additionally, the embodiments described herein may significantly improve voltage isolation by single turn coils, and eliminate vias between board layers.04-05-2012
20100231344INDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME - An inductor device includes a first magnetic body pattern layer in which slits are provided and which is made to a pattern, a lower insulating layer formed on the first magnetic body pattern layer, a planar coil layer formed on the lower insulating layer, an upper insulating layer formed on the planar coil layer, and a second magnetic body pattern layer formed on the upper insulating layer and in which slits are provided and which is made to a pattern, wherein the first magnetic body pattern layer and the second magnetic body pattern layer are arranged to intersect orthogonally with the planar coil layer.09-16-2010
20110241816PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - There are is a planar transformer and a method of manufacturing the same that can prevent resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board. A planar transformer according to an aspect of the invention may include: a core part having a pair of cores electromagneticaliy coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon.10-06-2011
20120326827BUILT-IN-COIL SUBSTRATE - In a built-in-coil substrate, when viewed in perspective in a stacking direction in which insulating layers of a substrate body are stacked, mutually superposed second coil elements are located further inward than inner peripheries of mutually superposed first coil elements. A cavity is continuous between at least one of the second coil elements and one insulating layer that is in contact with the second coil element(s), and another insulating layer that opposes the second coil element(s) such that the second coil element(s) are exposed, and, when viewed in perspective in the stacking direction, the cavities have annular shapes and extend further inward than the outer peripheries of the mutually superposed first coil elements, there being an interval provided between the cavities and these outer peripheries, and further outward than the inner peripheries of the mutually superposed second coil elements.12-27-2012
20110285495MULTILAYER INDUCTOR - This disclosure provides a multilayer inductor that has a built-in coil composed of coil conductors each having a length of one turn and that can suppress the occurrence of delamination. The inductor includes plural laminated magnetic layers. Coil conductors loop along a ring-shaped path each through a length of one-turn on the magnetic layers, and include connection portions including end portions that are located on the loop and connection portions including end portions that are located inside the ring-shaped path. Lands are provided on the insulating layers so as to overlap a region as viewed in plan, and the region is surrounded by the first connection portions and the second connection portions.11-24-2011
20120092119MULTIPLE-LOOP SYMMETRICAL INDUCTOR - A symmetrical inductor includes pairs of half-loops, first and second terminal electrodes, and a center-tap electrode. The half-loop pairs are in respective conductive layers of an integrated circuit. Each half-loop pair includes a first and second half-loop in the respective conductive layer. The first and second terminal electrodes are in a first conductive layer, and the center-tap electrode is in a second conductive layer. The first terminal electrode and the center-tap electrode are coupled through a first series combination that includes the first half-loop of each half-loop pair. The second terminal electrode and the center-tap electrode are coupled through a second series combination that includes the second half-loop of each half-loop pair.04-19-2012
20120326828CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ferrite material magnetic body part and a Cu conductive part, the ferrite containing 20 to 48% trivalent Fe in terms of Fe12-27-2012
20130009741INTEGRATED CIRCUIT TRANSFORMER - The invention provides an integrated circuit transformer disposed on a substrate. The integrated circuit transformer includes a first coiled metal pattern disposed on the substrate, comprising an inner loop segment and an outer loop segment. A second coiled metal pattern is disposed on the substrate, laterally between the inner loop segment and the outer loop segment. A dielectric layer is disposed on the first coiled metal pattern and the second coiled metal pattern. A first via is formed through the dielectric layer, electrically connecting to one of the first and second coiled metal patterns. A first redistribution pattern is disposed on the dielectric layer, electrically connecting to and extending along the first via, wherein the first redistribution pattern covers at least a portion of the first coiled metal pattern and at least a portion of the second coiled metal pattern.01-10-2013
20130015937ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAMEAANM SEKO; AtsushiAACI Kyoto-fuAACO JPAAGP SEKO; Atsushi Kyoto-fu JP - A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface.01-17-2013
20130015935COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAANM CHANG; YU CHIAAACI TAICHUNG CITYAACO TWAAGP CHANG; YU CHIA TAICHUNG CITY TWAANM LIN; CHI LONGAACI HSINCHU COUNTYAACO TWAAGP LIN; CHI LONG HSINCHU COUNTY TWAANM WANG; CHENG YIAACI NEW TAIPEI CITYAACO TWAAGP WANG; CHENG YI NEW TAIPEI CITY TWAANM TAI; SHIN MINAACI TAOYUAN COUNTYAACO TWAAGP TAI; SHIN MIN TAOYUAN COUNTY TW - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.01-17-2013
20130169402Compact Planar VHF/UHF Power Impedance Transformer - An RF impedance transformer having a parallel low-impedance access Eb and serial high-impedance access Eh and intended for connection onto a printed circuit. The transformer includes a multilayer circuit that includes a long side and at least three layers. A first outer layer is separated from a second outer layer of the same thickness by at least one inner layer having a thickness at least four times greater than the thickness of the outer layers, each outer layer comprising an electrical conductor on each surface for forming a microstrip line, the serial high-impedance access Eh and the parallel low-impedance access Eb being on the long side of the multilayer circuit and near to each other so as to limit the area for connection with the printed circuit.07-04-2013
20130169403MAGNETIC COMPONENT AND MANUFACTURING METHOD THEREOF - A magnetic component and manufacturing method thereof are described. The manufacturing method includes the following steps: (1) coating an insulation material on the surface of a magnetic core to form an insulation magnetic core; (2) bending the conducting material into a predetermined shape to form a preformed conductive body; and (3) assembling the mold conducting body with the insulation magnetic core to form a magnetic component. The method of the present invention easily manufactures the magnetic component with a shrinkage size and good insulation characteristic between the preformed conductive body and the insulation magnetic core.07-04-2013
20080224811Magnetic core-coil device - A core-coil device includes: a printed circuit board having upper and lower surfaces and formed with a pair of through-holes that are spaced apart from each other and that extend through the upper and lower surfaces, the printed circuit board being further formed with at least one conductive coil winding that surrounds one of the through-holes; and at least one loop-shaped magnetic core of an integrally molded single piece extending through said one of the through-holes in the printed circuit board.09-18-2008
20110273258INTEGRATED TRANSFORMER - A transformer comprising primary and secondary windings is disclosed. Each winding has first and second metal capping layers coupled together electrically in parallel by a metal connector passing through a substrate lying between the first and second metal capping layers.11-10-2011
20130169404MULTILAYER INDUCTOR - Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.07-04-2013
20130176096LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A laminated electronic component with adjacent wires (such as coil conductors) in insulator layers inter-connected through via holes, wherein its laminate is structured in such a way that a coil-embedded layer constituted by first insulator layers and second insulator layers laminated alternately is sandwiched between a top magnetic layer and bottom magnetic layer, with external electrodes formed on both end faces. First coil conductors are formed on the first insulator layers and second coil conductors are formed on the second insulator layers, with these coil conductors connected through via holes. Formed at the end of each second coil conductor is a connection conductor of a size sufficiently large to block off the top of the via hole provided in the insulator sheet. By discharging the air in the via hole by means of pressure-bonding the laminate, the connection conductor will have a part filling inside the via hole and another part projecting on top of the via hole, with the center of the via hole recessed, to prevent shorting and cracking07-11-2013
20090243782High Voltage Hold-Off Coil Transducer - Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material.10-01-2009
20120249282LARGE INDUCTANCE INTEGRATED MAGNETIC INDUCTION DEVICES AND METHODS OF FABRICATING THE SAME - Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings.10-04-2012
20090251268LAMINATED COIL COMPONENT - In an open magnetic circuit type laminated coil component having a laminate formed by laminating a magnetic layer and a non-magnetic layer or a low magnetic permeability layer and a coil conductor disposed in the laminate, a zirconium oxide is included in the non-magnetic layer or the low magnetic permeability layer forming the laminate. The content of the zirconium oxide in the low magnetic permeability layer is in the range of about 0.02 wt % to about 1.0 wt %. A zirconium oxide is also included in the magnetic layer in a proportion of less than about 1.0 wt %. As the magnetic layer, a material including Ni—Cu—Zn ferrite as a main component is preferably used. As the non-magnetic layer or the low magnetic permeability layer, a material including Cu—Zn ferrite as a main component is preferably used.10-08-2009
20130135075ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A stack is configured by stacking magnetic layers and non-magnetic layers, and has a rectangular-parallelepiped shape. A coil is provided in the stack, and has a coil axis that is substantially parallel to a stacking direction of the stack. The stacking direction and the coil axis are not parallel to sides that configure the stack.05-30-2013
20130113594STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same.05-09-2013
20130113593MULTILAYER TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer type inductor, incluing: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material.05-09-2013
20130113595MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREFOR - A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween.05-09-2013
20130093557ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability μ04-18-2013
20130093556MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.04-18-2013
20110267165INDUCTOR ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - An inductor assembly includes a substrate having a first surface and an opposing second surface, a first spiral electrical conductor formed on the first surface, a second spiral electrical conductor formed on the second surface, at least one opening extending through the first and second surfaces, and a metallic pin configured to be inserted in the opening, the pin coupling the first conductor to the second conductor. An RF coil including the inductor assembly and a method of fabricating an inductor assembly are also described.11-03-2011
20130127576LAMINATED INDUCTOR - A laminated inductor offers higher magnetic permeability, high inductance, low resistance and high rated current, while also supporting downsizing of device, by using a soft magnetic alloy as the magnetic material. Provided is a laminated inductor, comprising: an internal conductor forming area and a top cover area and a bottom cover area formed in a manner sandwiching the internal conductor forming area from above and below, wherein the internal conductor forming area has a magnetic material part formed by soft magnetic alloy particles, and internal conductors buried in the magnetic material part, and at least one of the top cover area and bottom cover area is formed by soft magnetic alloy particles exhibiting a two-peak particle size distribution curve (based on count).05-23-2013
20130187742INDUCTIVE TOUCH SENSOR USING A FLEXIBLE COIL - An inductive touch sensor comprises an inductors disposed in or on a deformable substrate. When a force is applied to the deformable substrate the physical shape of the inductor will change and thereby change its inductance value. The change in the inductance value can be detected and used to indicate actuation of an associated touch key of the inductive touch sensor. A plurality of inductive touch sensors may be used to form a touch panel.07-25-2013
20130141205CONDUCTOR PATTERN AND COIL PARTS HAVING THE SAME - A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.06-06-2013
20130127578METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH METAL CORE AND STRUCTURE THEREOF - A method for fabricating a inductor carrier comprises the steps of providing a substrate with a protective layer; forming a first photoresist layer on protective layer; patterning the first photoresist layer to form a first opening and first apertures; forming a first metal layer within first opening and first apertures; removing the first photoresist layer; forming a first dielectric layer on protective layer; forming a second photoresist layer on first dielectric layer; patterning the second photoresist layer to form a second aperture and a plurality of third apertures; forming a second metal layer within second aperture and third apertures; removing the second photoresist layer; forming a second dielectric layer on first dielectric layer; forming a third photoresist layer on second dielectric layer; patterning the third photoresist layer to form a fifth aperture and sixth apertures; forming a third metal layer within fifth aperture and sixth apertures.05-23-2013
20080197963BALUN TRANSFORMER, MOUNTING STRUCTURE OF BALUN TRANSFORMER, AND ELECTRONIC APPARATUS HAVING BUILT-IN MOUNTING STRUCTURE - There is provided a balun transformer, in which first to fourth layer coils are stacked and coupled magnetically; one end of each coil of the first to fourth layer coils is grounded; the second and third layer coils are connected in parallel, an unbalanced signal is input/output to/from a common terminal of the second and third layer coils; a first balanced signal is input/output to/from the other end of the first layer coil; and a second balanced signal is input/output to/from the other end of the fourth layer coil.08-21-2008
20110221561Planar inductor - [Problems] To provide a planar inductor that can be easily designed in any size without restricting coil characteristics, that supplies the necessary power corresponding to the area when a pair of inductors are placed facing each other to carry out non-contact power transmission, and that has greater design flexibility that allows for setting separation cut-off lines with relative freedom.09-15-2011
20110227688PLANAR TRANSFORMER - There is provided a planar transformer having improved performance through a reduction in heat generation by removing part of a conductor from a substrate. The planar transformer includes a core part having a pair of cores being electromagnetically coupled to each other; a substrate part having at least one substrate disposed between the pair of cores; a pattern part formed on the at least one substrate and including a conductor having an adjustable width; and an opening part including a non-conductor allowing for variations in the width of the conductor of the pattern part.09-22-2011
20130147593ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A multilayer body includes a plurality of insulator layers that are stacked together and has top and bottom surfaces that oppose each other in a stacking direction and side surfaces that connect the top and bottom surfaces to each other. A coil is incorporated in the multilayer body. A connecting conductor is provided on the top surface of the multilayer body so as not to be in contact with the side surfaces of the multilayer body. An outer electrode is provided on the top surface of the multilayer body so as to cover the connecting conductor. A via-hole conductor connects an end portion of the coil and the connecting conductor to each other and extends through at least one of the insulator layers in the stacking direction.06-13-2013
20120274436THROUGH VIA INDUCTOR OR TRANSFORMER IN A HIGH RESISTANCE SUBSTRATE WITH PROGRAMMABILITY - A through via inductor or transformer in a high-resistance substrate in an electronic package. The package may comprise a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. A transformer can comprise a primary loop and a secondary loop, each of which includes through-vias coupled to conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio.11-01-2012
20120274435CHIP-TYPE COIL COMPONENT - There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased.11-01-2012
20120274434INTEGRATED TRANSFORMER - A device having a substrate and a dielectric layer disposed over the substrate is disclosed. The device includes a transformer layout disposed in the dielectric layer. The transformer layout includes an integrated transformer having primary and secondary coil elements. The first and second coil elements are configured to result in noise-self cancellation effect.11-01-2012
20110234358Laminated Inductive Device - An inductive electrical device comprises multiple laminations, each lamination comprising: a generally planar electrically nonconductive substrate that has a central axis normal to its plane, a first surface and a second surface; at least one electrically conductive layer pattern along the first surface in the form of a narrow strip that starts from a first point displaced from the central axis and extends along the first surface about the central axis through a first angle of rotation to a second point; a least one electrically conductive layer pattern along the second surface in the form of a narrow strip that starts from the second point and extends along the second surface about the central axis through a second angle of rotation to at least the first point; an electrically conductive coupling region passing through the substrate proximate the second point that couples the electrically conductive layer pattern along the first surface to the electrically conductive layer pattern along the second surface; wherein stacking the laminations upon each other form at least one winding with multiple turns for the inductive device.09-29-2011
20110234357Three Dimensional Inductor and Transformer Design Methodology of Glass Technology - An inductor or transformer for use in integrated circuit devices that includes a high-resistivity substrate. The inductor includes a plurality of conductive traces around the substrate forming a continuous conductive path from a first to a second port. The conductive path can be solenoid-shaped. Some of the conductive traces can be formed during back-end-of-line processing or backside plating of an integrated circuit die. The transformer includes a first inductor with input and output ports, and a first continuous conductive path therebetween; and a second inductor with input and output ports, and a second continuous conductive path therebetween. The second inductor is independent of and electromagnetically coupled to the first inductor. The first and second conductive paths can be solenoid-shaped. The first conductive path can be interleaved with the second conductive path.09-29-2011
20100315191Patterned magnetic inductors - A patterned inductor includes a conductive path and a nanostructured magnetic composition deposited on the conductive path. The magnetic composition can be screen printed, inkjetted, electrodeposited, spin coated, physical vapor deposited, or chemical vapor deposited onto the conductive path.12-16-2010
20130154785LAMINATED TYPE INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR - In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.06-20-2013
20130154784COIL-TYPE ELECTRONIC COMPONENT - A coil-type electronic component having a coil inside or on the surface of a base material is characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains inter-bonded via oxide layers, multiple crystal grains are present in each soft magnetic alloy grain, and the oxide layers preferably have a two-layer structure whose outer layer is thicker than the inner layer.06-20-2013
20130154783HIGH-FREQUENCY TRANSFORMER, HIGH-FREQUENCY COMPONENT, AND COMMUNICATION TERMINAL DEVICE - In a high frequency transformer, when a current flows between input-output ports, a magnetic flux produced by first and third coil conductor patterns of a primary coil is interlinked with a second coil conductor pattern of a secondary coil. A magnetic flux produced by the second coil conductor pattern of the primary coil is interlinked with the first and third coil conductor patterns of the secondary coil. The coil conductor patterns are wound so that when a current flows through a transformer, the directions of magnetic fields occurring within the first and third coil conductor patterns of the primary coil and the second coil conductor pattern of the secondary coil are the same and the directions of magnetic fields occurring within the first and third coil conductor patterns of the secondary coil and the second coil conductor pattern of the primary coil are the same.06-20-2013
20110291785POWER INDUCTOR STRUCTURE - A variety of power inductor structures are obtained by arranging a magnetic material block between a plurality of wires and a plurality of bond fingers or bond finger pairs. The power inductor structure can provide high inductance and high currents and at the same time afford smaller sizes.12-01-2011
20130187743INDUCTOR STRUCTURE - An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.07-25-2013
20130187744ELECTRONIC COMPONENT - A multilayer body is formed of a plurality of insulator layers that are stacked on top of one another. A coil is a helical coil provided in the multilayer body and includes a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together. The path includes corners that project outward and corners that project inward. Each of the via hole conductors are provided at one of the corners, which project outward.07-25-2013
20130187745TRANSMISSION-LINE TRANSFORMER IN WHICH SIGNAL EFFICIENCY IS MAXIMISED - Provided is a transmission line transformer having increased signal efficiency. The transmission line transformer is formed on an integrated circuit (IC), wherein a first transmission line disposed in one direction. Second and third transmission lines have same length direction as the first transmission line and are spaced apart from each other in a lateral direction above or below the first transmission line. Accordingly, an area of the first transmission line and areas of the second and third transmission lines, which face each other, are increased, thereby improving a coupling factor. Also, since a secondary transmission line is divided into two regions and uses the second and third transmission lines that have narrower widths than the first transmission line, parasitic capacitance components generated between the first through third transmission lines and a semiconductor substrate may be decreased.07-25-2013
20130200981TRANSMISSION LINE TRANSFORMER WHICH MINIMIZES SIGNAL LOSS - Provided is a transmission line transformer, and more particularly, a transmission line transformer capable of decreasing a power loss caused by a parasitic resistance component of the transmission line transformer and improving a coupling factor by forming a primary transmission line and a secondary transmission line parallel to each other on an integrated circuit (IC) by using a highest layer metal line, and forming a lower layer metal line immediately below the highest layer metal line in addition to the highest layer metal line in a region where the primary transmission line and the secondary transmission line face each other, while forming the transmission line transformer used in a high frequency circuit via a semiconductor process.08-08-2013
20130200979LAMINATED INDUCTOR - A laminated inductor includes a laminate constituted by multiple insulator layers, and a coil conductor formed in a spiral shape inside the laminate; wherein the coil conductor has conductor patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns; wherein conductor patterns formed on some insulator layers each represent a C-shaped pattern that includes the four corners and has an open part on one side, of a roughly rectangular shape, while a conductor pattern formed on other insulator layer(s) represents a line-shaped pattern corresponding to the open part of one side of the aforementioned C-shaped pattern of the roughly rectangular shape; and wherein an insulator layer on which the C-shaped pattern is formed, and insulator layer(s) on which the line-shaped pattern is formed, adjoin each other at least in one part of the laminate.08-08-2013
20130200980LAMINATED INDUCTOR - A laminated inductor includes: a laminate constituted by multiple insulator layers; external electrodes formed on the outside of the laminate; and a coil conductor formed spirally inside the laminate, wherein the coil conductor has leaders that electrically connect to the external electrodes and a coil body other than the leaders, wherein the coil conductor has conductive patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, wherein all of the conductor patterns constituting the coil body are either a C-shaped pattern or line-shaped pattern, wherein the coil body has a partial structure where two or more C-shaped pattern layers are stacked together successively, and wherein the number of C-shaped patterns in the coil body is greater than that of line-shaped patterns.08-08-2013
20120299683ASYMMETRIC DIFFERENTIAL INDUCTOR - An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout.11-29-2012
20130093558ELECTRONIC COMPONENT - An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.04-18-2013
20120086537PLANAR COIL AND METHOD OF MAKING THE SAME - A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.04-12-2012

Patent applications in class Printed circuit-type coil