Entries |
Document | Title | Date |
20080238574 | MULTILAYER FILTER - A multilayer filter | 10-02-2008 |
20080258840 | MULTILAYER FILTER - A multilayer filter comprises an inductor stacked-layer portion and a varistor stacked-layer portion. The varistor stacked-layer portion has a varistor layer the main component of which is ZnO and a hot electrode and ground electrode positioned in opposite with the varistor layer intervening, and the region enclosed between the opposing hot electrode and ground electrode does not contain a Cu component. Because the region enclosed between the opposing hot electrode and ground electrode is a region which manifests varistor characteristics, and thus the region does not contain a Cu component, degradation of the attenuation characteristics can be suppressed. | 10-23-2008 |
20080266026 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size. | 10-30-2008 |
20090009267 | Electronic Component - The magnetic material constituting a magnetic portion is a ferrite mainly containing 31-42 mol % of NiO, 2-10 mol % of ZnO, 43-48 mol % of Fe | 01-08-2009 |
20090021326 | ELECTRONIC PART - A sixth coil electrode forming a first coil is electrically connected to a twelfth coil electrode forming a second coil, for example, via a second capacitor electrode in a second capacitor electrode layer. Thus, an induction body has a permeability significantly smaller than the permeability of a magnetic body (for example permeability μ=1). Accordingly, it is possible to minimize the permeability to such a degree that it is possible to ignore the connection between the first coil and the second coil appearing equivalently and to obtain a desired frequency characteristic. | 01-22-2009 |
20090033439 | MULTILAYER FILTER - A multilayer filter wherein the capacitances of capacitors are reduced to reduce the size of the filter without substantially affecting the filter frequency characteristics. A predetermined filter circuit includes plural electrodes in a dielectric ceramic device body. Each of the capacitors is respectively disposed at input and output ends of the filter circuit and has one end connected to one of input/output terminals. Winding-type inductors, interposed between the input/output terminals and the one ends of the capacitors, are in the device body. | 02-05-2009 |
20090058559 | MICROPROCESSOR COMMON-MODE EMISSIONS REDUCTION CIRCUIT - An apparatus with reduced common-mode (CM) emissions from of a microprocessor includes a circuit board, first and second capacitors and a common-mode (CM) choke. The circuit board has a connector configured for connection to an external wire harness, which may act as an antenna generating CM RF emissions. The microprocessor includes a power pin (VCC), a ground pin (VSS), and at least one high impedance input pin. The first capacitor is connected across the power and ground pins. The second capacitor is connected across the high impedance input pin and the ground pin. The common-mode (CM) choke is electrically intermediate the power and ground pins, on the one hand, and the corresponding power and ground terminals of the connector on the other hand. The CM choke is disposed a preselected distance from the microprocessor. The preselected distance, which may be as close as possible, is configured to achieve an effective amount of common-mode emissions attenuation. The power and ground terminals are coupled to electrically conductive first traces on the circuit board, while the power and ground pins are coupled to electrically conductive second traces on the circuit board. The first traces are located outside a predefined isolation zone surrounding the second traces. The isolation zone is configured in size and shape so as to substantially minimize capacitive coupling between the second traces and the first traces. | 03-05-2009 |
20090058560 | Power plane and a manufacturing method thereof - A power plane includes a first circuit region and a second circuit region. The length of the first circuit region or second circuit region is related to the noise frequency to be filtered out. The width of the first circuit region can be wider or narrower than the width of the second circuit region. While manufacturing the power plane, a predetermined length is decided according to the resonance frequency of an original power plane, then the proposed power plane is formed with the first circuit region and the second circuit region of a predetermined length, and making the width of the first circuit region wider or narrower than the width of the second circuit region, such that the noises with the resonance frequency can be mitigated. | 03-05-2009 |
20090085691 | Printed circuit board with embedded chip capacitor and chip capacitor embedment method - A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board. | 04-02-2009 |
20090102580 | SYSTEMS, METHODS, AND APPARATUS FOR ELECTRICAL FILTERS AND INPUT/OUTPUT SYSTEMS - An electronic filtering device includes continuous trace on a dielectric substrate and a dissipation layer communicatively coupled to the trace. The dissipation layer may include disconnected metal particles, which may be embedded in a substrate, for example in an epoxy. The continuous trace may be meandering, for example crenulated, coil or spiral signal path. At least a second continuous trace may be spaced from the first by the substrate, and conductively coupled by a via. The electronic filtering device may be used in one or more printed circuit boards (PCBs) that form stages of an input/output system. | 04-23-2009 |
20090115551 | Noise filter - The invention can provide a miniaturized noise filter. The noise filter for reducing noise comprises a coil with a conductive wire ( | 05-07-2009 |
20090121807 | Electronic component - An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked. | 05-14-2009 |
20090134956 | MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ARRAY ELECTRONIC COMPONENT - A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor. | 05-28-2009 |
20090160580 | COIL LEADING STRUCTURE AND FILTER THEREOF - A filter includes a coil leading structure and at least one coil. The coil leading structure includes a board and at least one pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The core is disposed on the board and has at least one end to be coupled with the pin. | 06-25-2009 |
20090189714 | Layered low-pass filter - A layered low-pass filter includes: a first inductor and a second inductor that are connected in series and are located between an input terminal and an output terminal; a first capacitor connected in parallel to the first inductor; a second capacitor connected in parallel to the second inductor; and third to fifth capacitors and third to fifth inductors. The output of the first inductor and the input of the second inductor are connected to the ground via the third capacitor and the third inductor connected in series. The input of the first inductor is connected to the ground via the fourth capacitor and the fourth inductor connected in series. The output of the second inductor is connected to the ground via the fifth capacitor and the fifth inductor | 07-30-2009 |
20090189715 | Layered low-pass filter - A layered low-pass filter includes: a layered substrate; an input terminal, an output terminal and a grounding terminal each disposed on a periphery of the layered substrate; first and second inductors connected in series and provided between the input terminal and the output terminal; first to fifth capacitors formed within the layered substrate; a grounding conductor layer provided within the layered substrate; and a conducting portion formed within the layered substrate. The conducting portion includes a conductor layer connected to the grounding terminal, and a conducting path formed of a plurality of through holes. The conducting portion connects the grounding conductor layer to the grounding terminal via a path longer than the shortest distance between the grounding conductor layer and the grounding terminal. | 07-30-2009 |
20090237178 | CIRCUIT DEVICE HAVING INDUCTOR AND CAPACITOR IN PARALLEL CONNECTION - A circuit device having an inductor and a capacitor in parallel connection includes a planar inductor embedded in an insulating material layer, wherein the planar inductor has a winding wire portion, a first connection terminal and a second connection terminal. The first connection terminal and the second connection terminal are located at different elevations and have an overlapping region. A capacitor dielectric layer is located within the overlapping region between the first connection terminal and the second connection terminal, and the capacitor dielectric layer and the first connection terminal and the second connection terminal together form a capacitor. | 09-24-2009 |
20090278626 | BAND PASS FILTER - A band pass filter is suitable to be formed in a multi-layered circuit substrate of a wireless communication module. The band pass filter includes an input port, a first inductor, a first capacitor, a first parasitic capacitor, a second capacitor, a second inductor, a second parasitic capacitor, a third inductor, a third parasitic capacitor and a output. The input port, first inductor, first capacitor, second capacitor, third inductor and output port are sequentially electrically connected in series. The first parasitic capacitor is induced between the first inductor, first capacitor and a ground. The second inductor is electrically connected to the first capacitor, second capacitor and ground. The second parasitic capacitor is induced between the second inductor, first capacitor, second capacitor and ground. The second parasitic capacitor is electrically connected in parallel with the second inductor. The third parasitic capacitor is induced between the third inductor, second capacitor and ground. | 11-12-2009 |
20090278627 | Dielectric ceramic composition, multilayer complex electronic device, multilayer common mode filter, multilayer ceramic coil and multilayer ceramic capacitor - A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component. | 11-12-2009 |
20090284329 | Electric circuit device - Electric circuit device comprises electric element and two conductive plates. The electric element includes two anode electrodes and two cathode electrodes and has relatively low impedance in a frequency range between 1×10-5 to 10 GHz. The one conductive plate has lower impedance than that of the conductive plate comprising the electric element and is connected between two anode electrodes. The other conductive plate has lower impedance than that of the conductive plate comprising the electric element and is connected between two cathode electrodes. As a result, the electric circuit device which has relatively low impedance and is capable of preventing the temperature rise is provided. | 11-19-2009 |
20090309675 | Structure for a Through-Silicon-Via On-Chip Passive MMW Bandpass Filter - A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silicon layer and a dielectric layer on a top side of the silicon layer. Additionally, the design structure includes a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer and a plurality of contacts in the dielectric layer in contact with the top-side interconnect. Further, the design structure includes a plurality of through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer. | 12-17-2009 |
20090322446 | Methods of Fabricating a BEOL Wiring Structure Containing an On-Chip Inductor and an On-Chip Capacitor - Methods for fabricating a back-end-of-line (BEOL) wiring structure that includes an on-chip inductor and an on-chip capacitor, as well as methods for tuning and fabricating a resonator that includes the on-chip inductor and on-chip capacitor. The fabrication methods generally include forming the on-chip capacitor and on-chip inductor in different metallization levels of the BEOL wiring structure and laterally positioned to be substantially vertical alignment. The on-chip capacitor may serve as a Faraday shield for the on-chip inductor. Optionally, a Faraday shield may be fabricated either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the directly-connected electrodes of the on-chip capacitor for tuning, during circuit operation, a resonance frequency of an LC resonator that further includes the on-chip inductor. | 12-31-2009 |
20090322447 | BEOL Wiring Structures That Include an On-Chip Inductor and an On-Chip Capacitor, and Design Structures for a Radiofrequency Integrated Circuit - Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in different metallization levels, are vertically aligned with each other. The on-chip capacitor, which is located between the on-chip inductor and the substrate, may serve as a Faraday shield for the on-chip inductor. Optionally, the BEOL wiring structure may include an optional Faraday shield located vertically either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the top surface of the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the electrodes of the on-chip capacitor to permit tuning, during circuit operation, of a resonance frequency of an LC resonator that further includes the on-chip inductor. | 12-31-2009 |
20100007441 | Coaxial connector having a dielectric material for impedance matching - A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor. | 01-14-2010 |
20100019863 | COMPOSITE RIGHT/LEFT-HANDED LINE DEVICE - A composite right/left-handed line device includes plural electrodes, plural dielectric substances and plural magnetic substances. The plurality of electrodes each include a pair of electrode plates, and a connection piece connected to the pair of electrode plates. The plurality of electrodes are disposed at regular intervals in a thickness direction between a pair of input terminals and a pair of output terminals. The plurality of dielectric substances are interposed between opposite surfaces of the pairs of electrode plates of adjacent two of the electrodes. The plurality of magnetic substances are disposed adjacently to the dielectric substances, respectively. The plurality of magnetic substances are interposed between opposite surfaces of the connection pieces of adjacent two of the electrodes. | 01-28-2010 |
20100026420 | BAND-PASS FILTER CIRCUIT AND MULTI-LAYER STRUCTURE AND METHOD THEREOF - A band-pass filter includes a plurality of resonators, a feedback capacitive device and a grounding inductance device. A first end of each resonator is connected to a first node, and a second end of each resonator is connected to a second node. The feedback capacitive device is formed on the feedback circuit from the first node to the second node. The grounding inductance device is connected to the second node and ground. In an embodiment, the resonator essentially consists of a capacitive device and an inductance device. | 02-04-2010 |
20100039189 | LAMINATED BAND-PASS FILTER - In a laminated band-pass filter, a capacitance is formed between a ground electrode of a ground electrode formation layer and each of capacitor electrodes of capacitor electrode formation layers. An even number of LC parallel resonators is arranged such that via electrodes and line electrodes define a plurality of inductor electrodes and, when viewed in a direction in which the inductor electrodes are arranged, the surfaces of the loops of the inductor electrodes overlap each other at least partially. The loops defined by the inductor electrodes of neighboring LC parallel resonators have opposite directions. The capacitor electrodes have a shape and distribution or arrangement having point symmetry in plan view. | 02-18-2010 |
20100045405 | MULTI-LAYERED DEVICE AND ELECTRONIC EQUIPMENT USING THEREOF - A multi-layered device includes an inductor electrode layer connected between one end of a first viahole inductor conductor and a side-surface ground electrode, and arranged substantially in parallel to a dielectric sheet, when the first and second viahole inductor conductors are arranged in such a positional relation that a distance between the first and second viahole inductor conductors is smaller than 1.5 times a length of the first viahole inductor conductor. | 02-25-2010 |
20100066466 | RF monoblock filter assembly with lid filter - An RF filter assembly comprising a monoblock of dielectric material defining a first RF filter and a lid of dielectric material defining a second RF filter. In one embodiment, the monoblock defines a peripheral wall of dielectric material extending upwardly from a top surface thereof and first and second posts of dielectric material also extending upwardly from the top surface of the monoblock including regions of metallization thereon defining respective conductive input/output pads. The lid is seated against the top of the wall of the monoblock in a relationship spaced from the top surface of the monoblock and defines at least one region of metallization on one of the surfaces thereof defining a filter and a conductive input/output pad in coupling relationship with the input/output pad defined on one of the first and second posts on the monoblock. | 03-18-2010 |
20100109807 | TRANSMISSION LINE FILTER - A stop band or a pass band is generated in a transmission line filter by providing a plurality of dielectric bodies having a periodic structure in the length direction of the transmission line filter and causing Bragg reflection of transmission wave. A voltage is applied to some or all of the dielectric bodies and the frequency of the stop band or the pass band is changed or controlled by adjusting the voltage. | 05-06-2010 |
20100171569 | ACTIVE DOUBLE OR MULTI GATE MICRO-ELECTRO-MECHANICAL DEVICE WITH BUILT-IN TRANSISTOR - The present invention exploits the combination of the amplification, provided by the integration of a FET (or any other active device with two or more terminals), with the signal modulation, provided by the MEM resonator, to build a MEM resonator with built-in transistor (hereafter called active MEM resonator). In these devices, a mechanical displacement is converted into a current modulation and depending on the active MEM resonator geometry, number of gates and bias conditions it is possible to selectively amplify an applied signal. This invention integrates proposes to integrate transistor and micro-electro-mechanical resonator operation in a device with a single body and multiple surrounding gates for improved performance, control and functionality. Moreover, under certain conditions, an active resonator can serve as DC-AC converter and provide at the output an AC signal corresponding to its mechanical resonance frequency. | 07-08-2010 |
20100194498 | MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD - A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance. | 08-05-2010 |
20100214037 | FILTER WITH INTEGRATED LOADING CAPACITORS - There is provided an improved filter having resonators substantially disposed between conductive planes which form one or more loading capacitors that are in turn coupled to the resonators. Further, inclusion of a designed void or slot in one or more of the conductive planes allows for control of an introduced transmission zero to manipulate the performance of the filter to achieve desired results, such as improved skirt performance. | 08-26-2010 |
20100214038 | CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR AND CHIP-TYPE FILTER - A solid electrolytic capacitor is formed by stacking flat solid electrolytic capacitor elements. Negative electrode sections of a part of the solid electrolytic capacitor elements and negative electrode sections of the remaining part of the solid electrolytic capacitor elements are led out so as to be faced to each other, and are connected to the first and second negative electrode lead frames which are independent to each other, respectively. Two of negative electrode sections are insulated from each other in the solid electrolytic capacitor. | 08-26-2010 |
20100225420 | LC COMPOSITE ELECTRONIC COMPONENT - An LC composite electronic component, having a large noise suppression effect without increasing in size, includes a multilayer structure in which first and second capacitor units ( | 09-09-2010 |
20100231328 | ELECTRONIC COMPONENT AND PASSIVE COMPONENT - An electronic component and a passive component define correlation between a distance between a pair of identical patterns and a distance between pairs of identical patterns adjacent to each other in a laminating direction, and a value of an inductor is further improved, attenuation in adjacent frequency bands is ensured and low power consumption is achieved with low loss. A first inductor is composed of a pair of inductor forming electrodes, a pair of inductor forming electrodes and a pair of inductor forming electrodes. A relationship between a distance (Da) between the two electrodes configuring each pair of inductor forming electrodes and a distance (Db) between the pairs of inductor forming electrodes adjacent to each other in the laminating direction satisfy the following inequalities; 009-16-2010 | |
20100244987 | Ceramic electronic component - Provided is a ceramic electronic component that, even if it is formed by building up dielectric layers of different compositions, can ensure that the built-up dielectric layers are prevented from separating from each other. The ceramic electronic component according to the present invention has: a first dielectric layer containing, as major components thereof, BaO, Nd | 09-30-2010 |
20100265009 | STACKED LC RESONATOR AND BANDPASS FILTER OF USING THE SAME - A stacked LC resonator includes a parallel-plate capacitor, a dielectric layer and a spiral inductor. The parallel-plate capacitor has a first metal layer, a second metal layer opposed to the first metal layer and a middle dielectric layer formed between the first and second metal layers. The dielectric layer is formed on the second metal layer of the parallel-plate capacitor. The spiral inductor is formed on the dielectric layer and electrically connected with the first and second metal layers of the parallel-plate capacitor. | 10-21-2010 |
20100301966 | MULTILAYER COMMON MODE FILTER - A multilayer common mode filter is provided, which can inhibit cracks from occurring, while securing the magnetic coupling between coil conductors. | 12-02-2010 |
20110037536 | CAPACITANCE ELEMENT AND RESONANCE CIRCUIT - A capacitance element includes a first electrode, a second electrode, a third electrode, a fourth electrode, a first dielectric portion, a second dielectric portion, and a third dielectric portion. To the first electrode, a signal having a first polarity is applied. To the second electrode, a signal having a second polarity is applied. The second polarity is opposite to the first polarity. To the third electrode, the signal having the second polarity is applied. The third electrode is disposed on a position opposed to the second electrode. To the fourth electrode, the signal having the first polarity is applied. The first dielectric portion is provided between the first electrode and the second electrode. The second dielectric portion is provided between the second electrode and the third electrode. The third dielectric portion is provided between the third electrode and the fourth electrode. | 02-17-2011 |
20110043304 | LEFT-HANDED RESONATOR AND LEFT-HANDED FILTER USING THE SAME - A left-handed resonator according to the present invention includes: a series body in which an inductor component and a capacitor component are connected in series; and a parallel body in which an inductor component and a capacitor component are connected in parallel, wherein one end of the series body and one end of the parallel body are connected, the other end of the parallel body is grounded, and the other end of the series body is grounded. With this configuration, a −1-order mode is excited using only one unit cell including the series body and the parallel body, so that dimensions of the left-handed resonator can be miniaturized. | 02-24-2011 |
20110050364 | PRINTED MULTILAYER FILTER METHODS AND DESIGNS USING EXTENDED CRLH (E-CRLH) - Printed multilayer filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell. | 03-03-2011 |
20110050365 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes a first ground layer, a second ground layer and a band pass filter. The band pass filter includes a first transmission line positioned in a void defined in the first ground layer and a second transmission line positioned in a void defined in the second ground layer. Each of the first transmission line and the second transmission line includes a coil with a plurality of turns spirally extending in the same plane, a gasket extending from the coil and located in the center of the coil, and a signal terminal extending from extremity of the coil. According to employing the band pass filter, the signal transmission apparatus has filtering function, therefore, quality of signals transmitted through the signal transmission apparatus is improved. | 03-03-2011 |
20110074526 | MULTILAYER BANDPASS FILTER - In a multilayer bandpass filter, a first capacitor is defined between a first capacitor electrode and a ground electrode. A second capacitor is defined between a second capacitor electrode and the ground electrode. A first inductor is defined by first and second via electrodes and a first inductor electrode. A second inductor is defined by third and fourth via electrodes and a second inductor electrode. Two LC parallel resonators, one of which includes the first inductor and the first capacitor and the other one of which includes the second inductor and the second capacitor, are provided. The second via electrode included in one of the LC parallel resonators and the fourth via electrode included in the other one of the LC parallel resonators are electrically connected to each other by a via coupling electrode. | 03-31-2011 |
20110090025 | Electromagnetic wave transmission filters and electromagnetic cameras including the same - An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate. | 04-21-2011 |
20110133854 | METHOD OF MANUFACTURING AN INSTANT PULSE FILTER USING ANODIC OXIDATION AND INSTANT PULSE FILTER MANUFACTURED BY SAID METHOD - The instant pulse filter according to the present invention, which may cause a malfunction or a short life span of a semiconductor device, is made using an aluminum anodic oxidation, comprising—a first step for forming an aluminum thin film layer on an upper side of an insulator substrate; a second step for forming an aluminum oxide thin film layer having a pore by oxidizing the aluminum thin film layer by means of an anodic oxidation; a third step for depositing a metallic material on an upper side of the aluminum thin film layer for filling the pore; a fourth step for forming a nano rod in the interior of the aluminum oxide thin film layer by eliminating the metallic material deposited except in the pore; a fifth step for forming an internal electrode on an upper side of the aluminum oxide thin film layer having the nano rod; a sixth step for forming a protective film layer on an upper side of the same in order to protect the aluminum oxide thin film layer and the internal electrode from the external environment; and a seventh step for forming an external electrode on both sides of the substrate in which the protective film layer is formed. | 06-09-2011 |
20110140806 | LAMINATED BALANCE FILTER - A laminated balance filter includes a first capacitor electrode and a ground electrode that are disposed opposite to each other to define a capacitor at an unbalanced side. An unbalanced side coil is provided in a dielectric layer. Three balanced side coils are provided in three dielectric layers. The three balanced side coils preferably have a substantially helical shape and are wound in the same winding directions. The coil located in the center of the three balanced side coils is disposed near the unbalanced side coil so as to be electromagnetic-field-coupled to the unbalanced side coil. | 06-16-2011 |
20110140807 | HIGH EFFICIENCY RESONATOR FOR WIRELESS POWER TRANSMISSION - Provided is a resonator for a wireless power transmission, the resonator including a transmission line unit including a plurality of transmission line sheets arranged in parallel, and a capacitor provided at a predetermined position of the transmission line unit. | 06-16-2011 |
20110148545 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES - According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a heat dissipating element configured dissipating heat generating from the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing. | 06-23-2011 |
20110148546 | Multilayer Component - A multilayer component includes at least one inductive region and at least one capacitive region. The inductive region includes a ferrite ceramic. Electrode structures are arranged on the outwardly facing top side of the inductive region. The electrode structures form at least one coil structure having an inductance. | 06-23-2011 |
20110163827 | CAPACITANCE DEVICE AND RESONANCE CIRCUIT - To suppress changes in capacitance due to displacement between electrodes opposing each other across a dielectric layer, thereby allowing stable manufacturing of a capacitance device having a desired capacitance. | 07-07-2011 |
20110227670 | MEDIUM / HIGH VOLTAGE INDUCTOR APPARATUS AND METHOD OF USE THEREOF - The invention comprises an inductor configured for filtering medium and/or high voltage power. The inductor includes an inductor core formed of a plurality of coated magnetic particles, each of a majority of the coated magnetic particles including: a magnetic particle core and a non-magnetic coating about a corresponding magnetic particle core. The inductor optionally includes: (1) a main inductor spacer separating a first turn of a winding from a terminal turn of the winding and (2) a segmenting spacer separating two consecutive turns of the winding about said core. The inductor is configured to convert power into an output current, such as power of at least one thousand five hundred volts with an input current of at least fifty amperes. | 09-22-2011 |
20110279197 | COMMON MODE FILTER - To sufficiently attenuate a common mode signal by passing an ultra-high speed differential signal through an ultra-high speed differential transmission line. A common mode filter comprises: a pair of conductive lines formed on a first dielectric layer to transmit a differential signal; a plurality of first divided floating grounds in a state of being separated from an external ground potential, and facing the conductive lines, with the first dielectric layer interposed between them, and formed by being divided into a plurality of numbers in a length direction of the conductive lines, and forming a distribution constant type differential transmission line for the differential signal, together with the conductive lines; and a first passive two-terminal network connected between the first divided floating grounds located at least at an input side or an output side of the first divided floating grounds, and the external ground potential. | 11-17-2011 |
20110285477 | COMMON MODE NOISE FILTER - A common mode noise filter includes: a common mode filter inserted into a pair of signal lines; and a pair of capacitively coupled coils having one ends connected respectively to the corresponding signal lines and the other ends opened. According to the present invention, common mode noise can be removed by a common mode filter, as well as, differential mode noise in a desired frequency band can be removed by a pair of coils whose other ends are opened. | 11-24-2011 |
20110298563 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines. | 12-08-2011 |
20110309895 | MULTILAYER FILTER - A multilayer filter includes: a ceramic body in which a plurality of dielectric layers are laminated; an external ground electrode provided on an outer surface of the ceramic body and connected to a ground; an inductor pattern electrode provided on at least one of the dielectric layers and having one end connected to the external ground electrode; a capacitor pattern electrode provided on at least one of the dielectric layers; an external terminal electrode electrically connecting the inductor pattern electrode to the capacitor pattern electrode and forming a closed loop for generating inductance through the external ground electrode; and a variable dielectric layer provided between the capacitor pattern electrode and the inductor pattern electrode and adjusting a magnitude of inductance generated by the inductor pattern electrode. | 12-22-2011 |
20120001703 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including an insulating material layer made of a first dielectric material and a second insulating material layer made of a second dielectric material having a relative dielectric constant greater than that of the first dielectric material that are laminated to one another. An LC filter is defined by a coil included in the laminated body and a capacitor. The coil includes a coil conductor layer provided on the insulating material layer. The coil conductor layer is provided within a region including the insulating material layer. | 01-05-2012 |
20120032757 | Multilayer Component and Production Method - A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions. | 02-09-2012 |
20120032758 | ELECTRONIC COMPONENT - In an electronic component, a first LC resonant circuit includes a first coil including coil portions that extend from a first external electrode to a second external electrode while turning in a first direction. A second LC resonant circuit includes a second coil including coil portions that extend from a third external electrode to a fourth external electrode while turning in the first direction. A third LC resonant circuit includes a third coil and a capacitor. The third coil includes coil portions that extend from the capacitor of the third LC resonant circuit to the second external electrode while turning in a second direction opposite to the first direction around the coil portions of the first coil and the second coil. | 02-09-2012 |
20120038434 | Composite Inductor/Capacitor - A composite inductor/capacitor including spaced apart sheets of conductive material formed into a spiral with the sheets being spaced apart by a dielectric material with terminals being provided on opposing sheets at opposite ends. A gaped or ungapped ferrite core may form a magnetic loop path about the component Multiple conductive layers may be used to vary capacitance, inductance and load handling. The component may find application in high frequency (above 20 kHz) power converters (such as series-resonant power converters, phase-shifted Zero Voltage Transition full-bridge converters, asymmetric half-bridge ZVT converters or parallel-resonant converters), high frequency induction heater circuits, high frequency welder circuits and the like. | 02-16-2012 |
20120062338 | ELECTROSTATIC CAPACITANCE ELEMENT, METHOD OF MANUFACTURING ELECTROSTATIC CAPACITANCE ELEMENT, AND RESONANCE CIRCUIT - An electrostatic capacitance element includes: a dielectric layer; and a pair of electrodes or a plurality of pairs of electrodes having one electrode formed on one surface of the dielectric layer and the other electrode formed on the other surface of the dielectric layer by interposing the dielectric layer therebetween. The one electrode and the other electrode are arranged such that longitudinal directions of the electrodes intersect with each other. In addition, the one electrode and/or the other electrode have at least two electrode widths. In a case where the one electrode is formed to be relatively shifted with respect to the other electrode, an area of the electrodes overlapping in a thickness direction of the dielectric layer by interposing the dielectric layer can be changed in a continuous manner or a stepwise manner. | 03-15-2012 |
20120068789 | HIGH POWER BAND PASS RF FILTER HAVING A GAS TUBE FOR SURGE SUPPRESSION - A high power band pass RF filtering device having a housing defining an interior chamber and having one or more walls for substantially dividing the interior chamber into one or more sections. A circuit with filtering components for achieving strong attenuation of out-of-band signals is disposed within the interior chamber, certain components of the circuit being separated from one another by the walls. Ports on the housing electrically connect to a respective input node and output node of the circuit and also connect to surge protection elements for dissipating surge conditions present at the ports. A non-surge signal can travel between the ports and through the filtering components. An oil or other fluid is disposed and completely contained within the housing and contacts the circuit components for cooling the circuit components. | 03-22-2012 |
20120081194 | Vehicle-Mounted Noise Filter - Disclosed is a vehicle-mounted noise filter capable of suppressing electric field coupling between a pair of capacitors in the FM radio band, thereby allowing the intrinsic noise attenuation performance of a noise filter circuit to be exerted even in the FM radio band. The vehicle-mounted noise filter comprises a ground plate, a coil, a pair of capacitors, and a conductive shielding plate. The ground plate is grounded in a vehicle body. A lead wire is wound around the coil. The pair of capacitors are disposed such that the coil is interposed therebetween, and are electrically connected to the coil and the ground plate so as to form π-type filter circuit. The conductive shielding plate is grounded in the ground plate and is disposed between the pair of capacitors so as to shield the electric field coupling between the pair of capacitors. | 04-05-2012 |
20120098622 | MULTILAYER FILTER - A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. First and second balanced-side capacitors connected in series between first and second balanced terminals are defined by the inner layer electrodes. An inner-layer plate electrode not connected to any outer terminals is provided on the first dielectric layer. A first plate electrode connected to the first balanced terminal and a second plate electrode connected to the second balanced terminal are provided on the second dielectric layer in opposing relation to the inner-layer plate electrode. The inner-layer plate electrode and the first plate electrode and the first dielectric layer constitute the first balanced-side capacitor, and the inner-layer plate electrode and the second plate electrode and the first dielectric layer constitute the second balanced-side capacitor. | 04-26-2012 |
20120098623 | MULTILAYER FILTER - A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. A second coil electrode constituting a balanced-side inductor is defined by one of the inner layer electrodes. The second coil electrode has a coiled shape, and includes a first end connected to a first coil electrode through a via electrode and a second end connected to a third coil electrode through a via electrode. The second coil electrode is connected at a predetermined position along the winding direction thereof to a ground terminal, as one of the outer terminals, through an electrode for connection to a ground. The position where the ground connection electrode is connected to the second coil electrode is determined based on a balance characteristic in the balanced terminal side. | 04-26-2012 |
20120112856 | LAMINATED LC FILTER - A substantially loop-shaped inductor including a via electrode is arranged such that its loop surface is parallel to a mounting board. Thus, a direction of magnetic flux of the inductor is perpendicular to the mounting board, and influence of the magnetic flux on an adjacent electronic component is significantly reduced and minimized. In addition, the via electrode defines a principal portion of the inductor. Thus, an inductor with a great Q value is obtained, and the insertion loss of a laminated LC filter is significantly reduced and minimized. | 05-10-2012 |
20120169434 | FILTER - A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction. | 07-05-2012 |
20120188028 | MULTILAYER ELECTRONIC COMPONENT AND MOUNTED STRUCTURE OF ELECTRONIC COMPONENT - A ferrite bead inductor comprises a ferrite bead element body having magnetic layers and inner electrodes stacked therein, and first and second outer electrodes arranged on first and second side faces of the ferrite bead element body. The inner electrode extends in the direction of shorter sides which are shorter than longer sides, so as to connect with the first and second outer electrodes. The ferrite bead element body has an interstice for allowing the magnetic layers adjacent to each other in the stacking direction to join together within an inner electrode region adapted to form the inner electrode on the magnetic layer. | 07-26-2012 |
20120200372 | Filter Having Electrical Circuit Arrangement with Concentrated Elements in Multi-layer Substrates - An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement. | 08-09-2012 |
20120249264 | LAYERED BANDPASS FILTER - A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors. | 10-04-2012 |
20120256704 | RF FILTER FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD - An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies. | 10-11-2012 |
20120262251 | NOISE FILTERING CIRCUIT FOR SUPPRESSING EMI - A noise filtering circuit for suppressing electromagnetic interference (EMI) is provided. The noise filtering circuit filters out high multiplied-frequency noise of a digital signal being transmitted and includes a reference voltage structure formed from conductors, a signal transmitting structure formed from a transmission conductor, a ground layer, and a ground structure electrically connected to the reference voltage structure and the ground layer. The ground structure is configured to form an inductor-capacitor oscillating structure in coordination with the electric-magnetical coupling between the reference voltage structure and the signal transmitting structure as well as the inductance of the ground structure, so that a digital signal is filtered out at a specific frequency and the passband of the digital signal can be transmitted. | 10-18-2012 |
20120274420 | FILTER CIRCUIT - A bandpass filter includes a multilayer body, which includes a plurality of dielectric layers stacked on top of one another, a first inductor and a second inductor connected in series with each other, and a third inductor connected to a connection point between the first and second inductors, and a ground potential. The first inductor is defined by substantially open-loop-shaped first electrode patterns provided on the dielectric layers being superposed with one another in the stacking direction of the multilayer body. The second inductor and the third inductor are defined by second electrode patterns and third electrode patterns provided on the dielectric layers being superposed with one another in the stacking direction. | 11-01-2012 |
20120280766 | MULTI-LAYER CIRCUIT MEMBER WITH REFERENCE CIRCUIT - A multi-layer circuit member includes first and second electrically connected reference regions. At least a portion of a signal conductor is in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions. | 11-08-2012 |
20120313730 | LAMINATED BANDPASS FILTER - A BPF comprises a first resonator and a second resonator connected in order between input/output terminals. The resonators each include an inductor conductor and a capacitor conductor formed in a laminate. The inductor conductors of both resonators have one open end and the other short-circuited end. The BPF further comprises a connection conductor for interconnecting the inductor conductors of the two resonators. This connection conductor connects the inductor conductor of the first resonator at a position close to the open end with the inductor conductor of the second resonator at a position close to the open end. | 12-13-2012 |
20120319800 | ELECTRONIC COMPONENT - An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors. | 12-20-2012 |
20120319801 | HIGH-FREQUENCY LAMINATED COMPONENT AND LAMINATED HIGH-FREQUENCY FILTER - A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes. | 12-20-2012 |
20120326805 | RF Monoblock Filter with Recessed Top Pattern and Cavity Providing Improved Attenuation - An electrical signal filter defined by a block of dielectric material with a top surface, a bottom surface, side surfaces, and through-holes extending between the top and bottom surfaces. In one embodiment, first and second walls protrude outwardly from the top surface and extend the length of first and second opposed longitudinally extending side surfaces. A surface-layer pattern of metallized and unmetallized areas is defined on selected surfaces of the block including an area of metallization that covers the top surface. In one embodiment, first and second surface-layer input/output electrodes are defined by first and second respective isolated strips of conductive material that extend from the top surface of the block and onto the first and second walls respectively. | 12-27-2012 |
20120326806 | RF Monoblock Filter Assembly with Wall Filter - An RF filter assembly comprising two filters. In one embodiment, the RF filter assembly comprises a core of dielectric material including a plurality of through-holes and a surface-layer pattern of conductive areas on a top surface of the core that define a first RF filter and a second RF low pass filter is defined, and extends between respective conductive input/output electrodes, on a wall that protrudes outwardly and upwardly from a top surface of the RF filter assembly. | 12-27-2012 |
20130009726 | LOW-PASS FILTER - A low pass filter includes a laminate including a plurality of insulating layers stacked in a z-axis direction and a mounting surface on a negative side in the z-axis direction. An external electrode is disposed on a lower surface of the laminate and is grounded. The laminate houses a substantially spiral coil having a central axis extending in the z-axis direction. Via-hole conductors extend from the end on the positive side in the z-axis direction of the coil toward the negative side in the z-axis direction. The external electrode and the end on the positive side in the z-axis direction of the coil are electrically coupled to each other through the via-hole conductors. | 01-10-2013 |
20130009727 | SURFACE MOUNTABLE MULTI-LAYER CERAMIC FILTER - An improved electronic filter is provided with capacitance and integral inductance properties. The filter has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes. A third termination is provided and a conductive trace on a surface of the capacitor is between the third termination and the first termination. A ferromagnetic or ferrimagnetic material is coupled to the conductive trace. | 01-10-2013 |
20130027155 | CERAMIC MULTILAYER COMPONENT - The multilayer component has a base body ( | 01-31-2013 |
20130049887 | Electromagnetically transparent metamaterial - The present disclosure relates to an electromagnetically transparent metamaterial, which comprises a substrate and a plurality of man-made metal microstructures arranged periodically inside the substrate. When an electromagnetic wave propagates through the metamaterial, each of the man-made metal microstructures is equivalent to two identical two-dimensional (2D) circuits, which are placed respectively in a direction perpendicular to an incident direction of the electromagnetic wave and in a direction parallel to the incident direction of the electromagnetic wave, and each of which comprises an inductor branch and two identical capacitor branches that are symmetrically connected in parallel with the inductor branch. The 2D circuits are associated with a waveband of the electromagnetic wave so that both a dielectric constant and a magnetic permeability of the metamaterial are substantially 1 when the electromagnetic wave propagates through the metamaterial. | 02-28-2013 |
20130076456 | COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers. | 03-28-2013 |
20130076457 | BAND PASS FILTER - Provided is a band pass filter constituted by a printed circuit board (PCB) and a multi-layer ceramic chip (MLCC) to be mounted in a circuit, without additional parts such as a low temperature co-fired ceramic (LTCC) based filter, and so on, and it is an object to produce a band pass filter constituted by an inductor formed of a PCB pattern and a capacitor formed of an MLCC to implement a high performance and compact band pass filter. The band pass filter includes an inductor pattern part formed of a plurality of PCB patterns and having inductance; an MLCC part constituted by a plurality of MLCCs mounted in a lower end side of the inductor pattern part and having a capacitance; and a port part formed of a plurality of PCB patterns and connected to the PCB patterns extending from the inductor pattern part. | 03-28-2013 |
20130093536 | MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD - A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance. | 04-18-2013 |
20130154767 | FILTER FOR REMOVING NOISE - The present invention discloses a filter for removing noise, which includes: a lower magnetic substrate; a coil layer disposed on the lower magnetic substrate and including at least one conductor pattern and an insulating layer covering the conductor pattern; an upper magnetic substrate disposed on the coil layer; and a magnetic permeability enhancing layer disposed on the magnetic substrate with lower magnetic permeability of the lower magnetic substrate and the upper magnetic substrate. | 06-20-2013 |
20130154768 | LAMINATED BALANCED FILTER - A laminated balanced filter includes one unbalanced terminal, two balanced terminals, a ground terminal, an unbalanced-side LC parallel resonator, an intermediate LC parallel resonator, and a balanced-side inductor. The inductor electrode pattern of the balanced-side inductor includes a first portion extending from one end portion to a connection portion and a second portion extending from the other end portion to the connection portion. A direction of a current flowing through the first portion is opposite to a direction of a current flowing through the inductor electrode pattern of the intermediate LC parallel resonator. A direction of a current flowing through the second portion of the balanced-side inductor is the same as a direction of a current flowing through the inductor electrode pattern of the intermediate LC parallel resonator. The laminated balanced filter further includes a coupling capacitor connected between a balanced terminal connected to the first portion and an unbalanced terminal. | 06-20-2013 |
20130154769 | BAND-PASS FILTER - A capacitor of a certain LC resonator, among multiple LC resonators in a band-pass filter, is arranged at a side of one main surface in a stacking direction of a multilayer body of the band-pass filter and the capacitors of the remaining LC resonators are arranged at a side of the other main surface in the stacking direction of the multilayer body. One of a pair of capacitor electrodes of the capacitor of the certain LC resonator is grounded. The one capacitor electrode that is grounded covers at least the plurality of LC resonators, as viewed from the stacking direction of the multilayer body. | 06-20-2013 |
20130154770 | FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer disposed on the lower magnetic body and including at least one conductor pattern; input and output stud terminals electrically connected to the conductor pattern for electrical input and output of the conductor pattern; and an upper magnetic body consisting of an inner upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer surface of the lower magnetic body. | 06-20-2013 |
20130162371 | FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same. | 06-27-2013 |
20130162372 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes at least two types of stacked ceramic layers having different dielectric constants and also includes internal electrodes partially disposed along boundaries between the ceramic layers having different dielectric constants. The internal electrodes include an additive component common to a component included in at least one of the ceramic layers adjacent to each other with the internal electrodes placed therebetween. | 06-27-2013 |
20130169381 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same. | 07-04-2013 |
20130169382 | COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes. | 07-04-2013 |
20130194056 | ELECTRONIC COMPONENT - In an electronic component, a laminated body includes a plurality of insulator layers laminated on each other. First, second and third LC parallel resonators are loop-shaped LC parallel resonators that include via hole conductors extending in a z-axis direction and conductor layers provided on the insulator layers, and define a band pass filter. Loop planes of the first and third LC parallel resonators and a loop plane of the second LC parallel resonator are parallel to the z-axis direction and not parallel to each other. | 08-01-2013 |
20130207745 | 3D RF L-C FILTERS USING THROUGH GLASS VIAS - Three-dimensional (3D) Radio Frequency (RF) inductor-capacitor (LC) band pass filters having through-glass-vias (TGVs). One such L-C filter circuit includes a glass substrate, a first portion of a first inductor formed on a first surface of the glass substrate, a second portion of the first inductor formed on a second surface of the glass substrate, and a first set of TGVs configured to connect the first and second portions of the first inductor. Additionally the L-C filter circuit can include a second inductor similar to the first inductor, and a metal-insulator-metal (MIM) capacitor formed between the first and second inductor, such that the first and second inductor are coupled through the MIM capacitor. | 08-15-2013 |
20130229241 | MULTILAYER BAND PASS FILTER - In a multilayer band pass filter, via-electrodes and strip electrodes define inductors of LC parallel resonators in four stages. A capacitor electrode and a ground electrode define a capacitor of a first-stage LC parallel resonator. A capacitor electrode and the ground electrode define a capacitor of a fourth-stage LC parallel resonator. Capacitor electrodes define a second-stage LC parallel resonator. Capacitor electrodes define a third-stage LC parallel resonator. Among four or more of the LC parallel resonators, the coupling between certain LC parallel resonators is easily defined, and the attenuation characteristic of a filter is definable with a high degree of freedom. | 09-05-2013 |
20130249646 | FILTER ELEMENT - A filter element includes a laminate including insulator layers. A ring conductor pattern is provided on one of the insulator layers. Linear conductor patterns of a first inductor having a helical shape with an axial direction thereof being a laminating direction of the laminate and linear conductor patterns of a second inductor having a helical shape with an axial direction thereof being the laminating direction are provided on predetermined ones of the insulator layers. The ring conductor pattern is arranged such that inner regions of the linear conductor patterns of the first inductor and inner regions of the linear conductor patterns of the second inductor are included in an inner region of the ring conductor pattern. | 09-26-2013 |
20130265121 | PASSIVE DEVICE CELL AND FABRICATION PROCESS THEREOF - An embodiment of the invention provides a passive device cell. The passive device cell has a substrate layer, a passive device, and an intermediary layer formed between the substrate layer and the passive device. The intermediary layer includes a plurality of LC resonators. | 10-10-2013 |
20130300520 | STACKED LC RESONATOR AND BAND PASS FILTER USING THE SAME - Provided are a stacked LC resonator and a band pass filter using the same. The stacked LC resonator includes a flat metal base layer; a plurality of spiral inductors disposed layer by layer, corresponding to the flat metal base layer; and a plurality of dielectric layers, formed between the spiral inductors, and between the flat metal base layer and the spiral inductor corresponding to the flat metal base layer. The band pass filter includes two resonators with symmetrical structures, wherein the spiral inductors of the two resonators are disposed corresponding to each other. | 11-14-2013 |
20130314176 | ELECTRONIC COMPONENT - A laminated body includes a plurality of insulator layers that are laminated to one another. First and second LC parallel resonators are loop-shaped or substantially loop-shaped and include via hole conductors extending in a z-axis direction and conductor layers provided on the insulator layers, and define a band pass filter. A first loop surface surrounded by the first LC parallel resonator is parallel or substantially parallel to a second loop surface surrounded by the second LC parallel resonator, and is disposed within the second loop surface in planar view in an x-axis direction. | 11-28-2013 |
20130342283 | ELECTRONIC COMPONENT - An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors. | 12-26-2013 |
20140055213 | VERY LOW INDUCTANCE DISTRIBUTED CAPACITIVE FILTER ASSEMBLY - A capacitive filter assembly and method including a housing having a power terminal connection for receiving electrical power. A plurality of capacitors in an electrically parallel configuration coupled to one or more side walls of the housing. The plurality of capacitors electrically communicating with a plurality of respective printed wiring boards (PWB) coupled to the capacitors inside the housing, and the plurality of capacitors being positioned between the power terminal connection in the housing and respective housing ground connections in the housing. A plurality of support structures coupled to the plurality of capacitors, respectively, the plurality of support structures being configured to mate with the respective printed wiring boards, the support structures being mounted in the housing such that the capacitors are coupled to the housing using their respective support structures. | 02-27-2014 |
20140062615 | THIN FILM TYPE COMMON MODE FILTER - Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode. | 03-06-2014 |
20140062616 | FILTER - In a filter, a plurality of coils include a plurality of line conductor layers that are each provided on an insulator layer, a plurality of via hole conductors that extend from one end of the line conductor layers in the y-axis direction to the negative direction side of the z-axis direction, and are electrically connected to a plurality of capacitor conductor layers, and a plurality of via hole conductors that extend from the other end of the line conductor layers in the y-axis direction to the negative direction side of the z-axis direction, and are electrically connected to a ground conductor layer. The distance between the via hole conductor layers connected to the ground conductor layer differs from the distance between the via hole conductor layers connected to the capacitor conductor layers. | 03-06-2014 |
20140062617 | FILTER ASSEMBLY - A filter assembly is provided. The filter assembly includes a printed circuit board (PCB) including a plurality of electronic components, a base disposed under the PCB, and an inductor coupled to the base, the inductor including a core and a coil to which current is applied, wherein the PCB has a through-hole through which at least one portion of the coil pass. | 03-06-2014 |
20140062618 | ELECTROMAGNETIC INTERFERENCE FILTER FOR IMPLANTED ELECTRONICS - An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes. | 03-06-2014 |
20140077895 | HIGH-FREQUENCY FILTER - In a high-frequency filter, four LC parallel resonators include four capacitors and four resonance coils, and are aligned in a predetermined direction. The four capacitors are defined by a ground conductor and a resonance capacitor conductor. The four coils are defined by a first via conductor, a second via conductor, and a line conductor. A floating conductor is provided astride within the four coils, and a sum of electrostatic capacitance between line conductors and the floating conductor is larger than electrostatic capacitance between the resonance capacitor conductor and the floating conductor, the line conductors overlapping with the floating conductor in planar view from a lamination direction. | 03-20-2014 |
20140077896 | VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOARD HAVING THE SAME - The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided. | 03-20-2014 |
20140132366 | FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME - Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components. | 05-15-2014 |
20140145797 | COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product. | 05-29-2014 |
20140145798 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including insulating layers that are stacked on each other. First and second LC parallel resonators each include via hole conductors extending in a z-axis direction and loop shaped conductive layers provided on the insulating layers. The first and second LC parallel resonators define a band pass filter. A first loop plane of the first LC parallel resonator and a second loop plane of the second LC parallel resonator are parallel or substantially parallel to the z-axis direction, are parallel or substantially parallel to each other, and are overlapped with each other at at least a portion of the first loop plane and the second loop plane in a plan view from the direction perpendicular or substantially perpendicular to the first loop plane. The first loop plane protrudes from the second loop plane at the positive direction in the z-axis direction. | 05-29-2014 |
20140152402 | COMMON MODE NOISE CHIP FILTER AND METHOD FOR PREPARING THEREOF - Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles. | 06-05-2014 |
20140159832 | CHOKE FOR AN OVEN - A choke is disclosed. The choke is configured to attenuate propagation of an electromagnetic (EM) wave between a cavity and a door adjacent to an opening of the cavity. The choke includes one or more choke components having a mechanical wave attenuating structure. | 06-12-2014 |
20140167884 | SERIES INDUCTOR ARRAY IMPLEMENTED AS A SINGLE WINDING AND FILTER INCLUDING THE SAME - There are provided a series inductor array implemented as a single winding capable of decreasing a layout area for providing a plurality of inductors, and a filter including the same, the series inductor array including a winding structure having both ends, and one or more terminal parts electrically connected to a region between the both ends of the winding structure to form an external electrical connection, wherein the winding structure has a structure in which a plurality of inductors having inductance formed in regions of the winding structure disposed between the both ends thereof and the terminal parts or between the terminal parts are connected in series. | 06-19-2014 |
20140184357 | BAND PASS FILTER - There is provided a band pass filter including: a first substrate including a plurality of capacitors and a plurality of conductive patterns provided thereon; and a second substrate laminated with the first substrate and connected to the plurality of first conductive patterns through a plurality of via holes, wherein an attenuation frequency is determined according to the amount and shape of the plurality of via holes. | 07-03-2014 |
20140191824 | MULTILAYER COMMON MODE FILTER - A first coil is configured in such a structure that first and second coil conductors are connected by a first through-hole conductor. A second coil is configured in such a structure that third and fourth coil conductors are connected by a second through-hole conductor. The first and second coils are arranged in a nonmagnetic section consisting of nonmagnetic layers. A portion located inside the first coil and the second coil in the nonmagnetic section includes a first regional portion and a second regional portion adjacent to each other when viewed from a laminated direction of the nonmagnetic layers. The first and second through-hole conductors are located in the first regional portion so as to be adjacent to each other, when viewed from the laminated direction. A magnetic core section comprised of a magnetic material is located in the second regional portion when viewed from the laminated direction. | 07-10-2014 |
20140203892 | CERAMIC MULTILAYER COMPONENT - A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side. | 07-24-2014 |
20140240061 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including a plurality of insulating layers stacked on top of one another. An LC parallel resonator is provided in the multilayer body, includes a coil and a capacitor, and has a ring shape when viewed in plan in the x-axis direction. The capacitor includes a capacitor conductor layer connected to one end of the coil and a resonant ground conductor layer that is connected to the other end of the coil and that is provided on the positive z-axis direction side of the capacitor conductor layer. The resonant ground conductor layer faces the capacitor conductor layer with one of the plurality of insulating layers therebetween. An outer electrode is provided on the negative z-axis direction side of the LC parallel resonator and faces the capacitor conductor layer with one of the plurality of insulating layers therebetween. | 08-28-2014 |
20140247097 | CAPACITANCE DEVICE AND RESONANCE CIRCUIT - To suppress changes in capacitance due to displacement between electrodes opposing each other across a dielectric layer, thereby allowing stable manufacturing of a capacitance device having a desired capacitance. | 09-04-2014 |
20140266508 | BANDPASS FILTER IMPLEMENTATION ON A SINGLE LAYER USING SPIRAL CAPACITORS - A planar capacitor includes, in part, a first metal line forming spiral-shaped loops around one of its end point, and a second metal line forming spiral-shaped loops between the loops of the first metal line. The first and second metal lines are coplanar, formed on an insulating layer, and form the first and second plates of the planar capacitor. The planar capacitor may be used to form a filter. Such a filter includes a first metal line forming first spiral-shaped loops, a second metal line forming second spiral-shaped loops, and a third metal line—coplanar with the first and second metal lines—forming loops between the loops of the first and second metal lines. The filter further includes a first inductor coupled between the first and third metal lines, and a second inductor coupled between the second and third metal lines. | 09-18-2014 |
20140312992 | COMMON MODE FILTER - Disclosed herein is a common mode filter having improved insertion loss characteristics. The common mode filter includes: first and second coil electrode patterns formed at an upper layer and alternately disposed; and first and second coil electrode patterns formed at a lower layer and alternately disposed, wherein the outermost pattern of the upper layer and the outermost pattern of the lower layer are coil electrode patterns having the same order. | 10-23-2014 |
20140347146 | FILTER - A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction. | 11-27-2014 |
20140354377 | VECTOR INDUCTOR HAVING MULTIPLE MUTUALLY COUPLED METALIZATION LAYERS PROVIDING HIGH QUALITY FACTOR - An inductor component includes a plurality of conductive elements, each formed as an individual patch of conductive material, with the conductive elements arranged in a vertical stack and tightly coupled to one another. Dielectric is disposed between more adjacent conductive elements, the dielectric has a permittivity and is sufficiently thin so as to provide a mutual inductance factor of at least one-half or greater between adjacent ones of the conductive elements. The dielectric is typically thinner than the adjacent conductors. | 12-04-2014 |
20140354378 | DESIGN FOR HIGH PASS FILTERS AND LOW PASS FILTERS USING THROUGH GLASS VIA TECHNOLOGY - A filter includes a glass substrate having through substrate vias. The filter also includes capacitors supported by the glass substrate. The capacitors may have a width and/or thickness less than a printing resolution. The filter also includes a 3D inductor within the substrate. The 3D inductor includes a first set of traces on a first surface of the glass substrate coupled to the through substrate vias. The 3D inductor also includes a second set of traces on a second surface of the glass substrate coupled to opposite ends of the through substrate vias. The second surface of the glass substrate is opposite the first surface of the glass substrate. The through substrate vias and traces operate as the 3D inductor. The first set of traces and the second set of traces may also have a width and/or thickness less than the printing resolution. | 12-04-2014 |
20140368298 | CERAMIC BUSHING WITH FILTER - On aspect relates to an electrical bushing for use in a housing of an implantable medical device. The bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element is set up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The at least one conducting element comprises at least one cermet such that the conducting element is hermetically sealed with respect to the base body. The bushing includes an electrical filter structure. The at least one conducting element provides at least a one conducting section of the filter structure and the base body provides at least one dielectric section of the filter. | 12-18-2014 |
20150008989 | NOISE FILTER DEVICE - A noise filter device includes a ground connection terminal ( | 01-08-2015 |
20150015344 | COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral. | 01-15-2015 |
20150028969 | HIGH FREQUENCY COMPONENT AND FILTER COMPONENT - A high frequency component includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, linear conductors extending along the insulating layers, interlayer connection conductors extending through at least one of the insulating layers, and planar conductors extending along the insulating layers. The high frequency component further includes transverse coils and internal capacitors. Each of the transverse coils includes the linear conductors and the interlayer connection conductors spirally wound in a plane in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction. Each of the internal capacitors includes the planar conductors being opposed to each other such that at least one of the insulating layers is disposed therebetween, the internal capacitor being arranged within a coil opening of the transverse coil when viewed along the winding axis of the transverse coil. | 01-29-2015 |
20150042415 | Multilayer Electronic Structures with Embedded Filters - A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter; | 02-12-2015 |
20150042416 | NOISE FILTER DEVICE - A noise filter device has a coil ( | 02-12-2015 |
20150054599 | HIGH FREQUENCY MODULE - A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view. | 02-26-2015 |
20150061791 | HIGH FREQUENCY COMPONENT - A high frequency component includes transverse inductors each including a first end and a second end and capacitors including planar conductors connected to the first ends of the transverse inductors, planar conductors connected to the second ends of the transverse inductors, and insulating layers disposed between the planar conductors. Each of the transverse inductors is helical and wound at least more than one turn. | 03-05-2015 |
20150070106 | FILTER AND LAYOUT STRUCTURE THEREOF - A circuit structure is disclosed, wherein the circuit structure comprises: a substrate comprising a top surface, a bottom surface and lateral surfaces connecting the top surface and the bottom surface; a plurality of conductive layers disposed over the top surface of the substrate, wherein a dielectric layer is disposed between each two adjacent conductive layers, wherein at least one capacitor is formed by a first portion of the plurality of conductive layers with the dielectric layers therebetween, and wherein at least one first inductor is formed by a second portion of the plurality of conductive layers; and at least one conductive pattern layer disposed over at least one of the lateral surface to form at least one second inductor, wherein a third portion of the plurality of conductive layers electrically connects with said at least one capacitor, said at least one first inductor and said at least one second inductor. | 03-12-2015 |
20150109074 | COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME - A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor. | 04-23-2015 |
20150116055 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - A composite electronic component may include: a ceramic body including a plurality of dielectric layers, first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an inductor part including a first internal electrode disposed in the ceramic body and exposed to the first end surface and second side surface and a second internal electrode disposed in the ceramic body and exposed to the second end surface and second side surface; first and second internal connection conductors disposed in the ceramic body; and first to fourth external electrodes disposed on outer portions of the ceramic body and electrically connected to the first and second internal electrodes and the first and second internal connection conductors. The inductor part and the first and second internal connection conductors may be connected in parallel with each other. | 04-30-2015 |
20150116056 | ELECTRONIC COMPONENT - In an electronic component, first through n-th LC parallel resonators respectively include first through n-th inductors disposed in a device body such that they are sequentially arranged in a first direction in an order from the first inductor to the n-th inductor. The first and the n-th inductors are wound around respective winding axes extending along the first direction. At least one predetermined inductor among the second through the (n−1)-th inductors is wound around a winding axis extending in a second direction which is perpendicular or substantially perpendicular to the first direction. A center of the predetermined inductor in the second direction is positioned toward one side of the second direction with respect to the winding axes of the first and the n-th inductors, as viewed from a plane of the device body in a third direction which is perpendicular or substantially perpendicular to the first and second directions. | 04-30-2015 |
20150145616 | STACK TYPE COMMON MODE FILTER FOR HIGH FREQUENCY - A stack type common mode filter (CMF) for high frequency may improve high frequency characteristics, like removing an impedance difference between terminals by not overlapping terminal portions of multiple stack structures with upper and lower magnetic substances, and removing noise in a common mode and removing a signal distortion in a differential mode by removing an unnecessary parasitic impedance from terminal portions, and thus the stack type CMF for high frequency may be applicable at a high frequency compared to a conventional CMF. | 05-28-2015 |
20150145617 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter a manufacturing method thereof are disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a receiving groove formed on the magnetic substrate; a dielectric layer formed in the receiving groove and having a coil pattern included therein; and a magnetic layer formed on upper surfaces of the dielectric layer and the magnetic substrate. | 05-28-2015 |
20150145618 | COMMON MODE FILTER AND ELECTRONIC DEVICE INCLUDING THE SAME - A common mode filter in which at least one surface of all of external electrodes and ground electrodes are exposed to a first surface, at least one side of each of two of the external electrodes and at least one side of one of the ground electrodes contact a first side of the first surface, and at least one side of each of the external electrodes and the ground electrodes of which sides do not contact the first side contact a second side of the first surface, thereby making it possible to improve sticking strength and decrease a short-circuit phenomenon occurrence rate. | 05-28-2015 |
20150303890 | COMPOSITE LC RESONATOR AND BAND PASS FILTER - A composite LC resonator includes a ground electrode adjacent to a first principal surface of a multilayer body, a first capacitor electrode farther inward than the ground electrode and defining a first capacitor together with the ground electrode, a first electrode of a second capacitor, a second electrode of the second capacitor defining a second capacitor together with the first electrode of the second capacitor, a first via-electrode defining a first inductor, a first end of the first via-electrode electrically connected to the first capacitor electrode and a second end of the first via-electrode electrically connected to the first electrode of the second capacitor, and a second via-electrode defining a second inductor, a first end of the second via-electrode electrically connected to the second electrode of the second capacitor and a second end of the second via-electrode being electrically connected to the ground electrode. | 10-22-2015 |
20150303893 | COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer. | 10-22-2015 |
20150318104 | COMMON MODE FILTER, SIGNAL PASSING MODULE AND METHOD OF MANUFACTURING COMMON MODE FILTER - Disclosed herein is a common mode filter including: at least four coil layers having a primary coil and a secondary coil; and discontinuous parts each connecting starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layer to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers with each other in series. The common mode filter is able to be miniaturized and to improve impedance characteristics. | 11-05-2015 |
20150325378 | MULTILAYER CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer chip electronic component may include: a ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body; a capacitor part disposed within the ceramic body; a first dummy electrode disposed within the ceramic body and a second dummy electrode disposed within the ceramic body; and first to sixth external electrodes disposed on first and second main surfaces of the ceramic body, a first connection terminal disposed on the second main surface and first end surface of the ceramic body, and a second connection terminal disposed on the second main surface and second end surface of the ceramic body. The inductor part may include first and second inductor parts, and the inductor part and the capacitor part are connected to each other. | 11-12-2015 |
20150325384 | MULTILAYER CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer chip electronic component may include: ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body and including first and second internal electrodes; a capacitor part disposed within the ceramic body and including third to fifth internal electrodes; and first and second external electrodes disposed on first and second end surfaces of the ceramic body, a third external electrode extended from second main surface of the ceramic body to first and second side surfaces, and a fourth external electrode extended from first main surface of the ceramic body to the first and second side surfaces. The capacitor part may include first and second capacitor parts and the inductor part and the capacitor part are connected to each other. | 11-12-2015 |
20150333722 | COMMON MODE FILTER AND MANUFACTURING METHOD THEREOF - Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed. | 11-19-2015 |
20150341010 | Production-Process-Optimized Filter Device - A filter device for filtering electrical currents or electromagnetic interference, particularly common-mode interference. The filter device has a soft-magnetic core with a passage, a printed circuit board with a plurality of electronic components, and a holding section. The holding section of the printed circuit board can be put through the core passage wherein the passage is designed such that the holding section and the electronic components arranged on the holding section can be put through the passage. | 11-26-2015 |
20150372655 | Filter Component - A filter component includes a housing body. A first and at least one second busbar each have a first end section, and a second end section, between which in each case a center section is arranged. The end sections of the busbars each have connections for connecting electrical conductors to the filter component. The first and second end section and the center section of the first busbar are arranged in a first plane and the first and second end section and the center section of the at least one second busbar are arranged in a second plane, which is different from the first plane. | 12-24-2015 |
20150380147 | FILTER DEVICE - A filter device is electrically connected between a power supply and a power converter including a converter unit for rectifying inputs and an inverter unit for inversely converting outputs of the converter unit. The filter device includes a casing; a filter reactor housed inside the casing, for removing a high-frequency component; and a booster reactor housed inside the casing and disposed below the filter reactor, for boosting a voltage of a current having passed through the filter reactor. The booster reactor includes an iron core, a coil wound around the iron core, and a spacer interposed between inner and outer circumferential portions of the coil to form an air passage for passing air introduced into the casing. The booster reactor is stored in the casing so that the air that has passed through the air passage passes through a periphery of the filter reactor disposed immediately above the booster reactor. | 12-31-2015 |
20150381138 | LC PARALLEL RESONANT ELEMENT - An LC parallel resonant element includes a first planar or substantially planar conductor on a first base material layer and second and third planar or substantially planar conductors on second and third base material layers. The first and third planar or substantially planar conductors extend over nearly the entire surfaces of the first and third base material layers. The second planar or substantially planar conductor extends over nearly the entire length of the second base material layer in a second direction such that a space from the other end portion of two end portions of a multilayer body in a first direction is provided. The first and third planar or substantially planar conductors are connected to each other by interlayer conductors near the other end portion of the multilayer body. The first and second planar or substantially planar conductor are connected to each other by interlayer conductors near one end portion of the multilayer body. | 12-31-2015 |
20160013770 | CAPACITANCE DEVICE, RESONANCE CIRCUIT, AND ELECTRONIC APPARATUS | 01-14-2016 |
20160020746 | HIGH-FREQUENCY LAMINATED COMPONENT AND LAMINATED HIGH-FREQUENCY FILTER - A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes. | 01-21-2016 |
20160028358 | SIGNAL TRANSMISSION CABLE AND COMMUNICATION DEVICE MODULE - A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer. | 01-28-2016 |
20160028359 | PASSIVE DEVICE CELL AND FABRICATION PROCESS THEREOF - An implementation of the invention is directed to a passive device cell having a substrate layer, and intermediary layer formed above the substrate layer, and a passive device formed above the intermediary layer. The intermediary layer includes a plurality of LC resonators and a plurality of segmented conductive lines, wherein the plurality of segmented conductive lines are disposed between the plurality of LC resonators. | 01-28-2016 |
20160072170 | HARMONICS SUPPRESSION FILTER - A harmonics suppression filter includes a main circuit, a first inner circuit, a first outer circuit, a first inner node and a first outer node. The first inner circuit, the first outer circuit and the main circuit are in the same layer of the base board. Meanwhile, the first inner circuit is located inside of the main circuit. There is an inner gap between the first inner circuit and the main circuit. The first outer circuit is located outside of the main circuit. There is an outer gap between the first outer circuit and the main circuit. The first inner node is located in the inner gap to couple the first inner circuit with the main circuit. The first outer node is located in the outer gap to couple the first outer circuit with the main circuit. | 03-10-2016 |
20160072476 | RF Component With Reduced Coupling and Suitable for Miniaturization - An RF component can have a reduced electromagnetic internal coupling and may be suitable for miniaturization as a result. The component includes a micro acoustic filter of ladder-type design in a housing and a double coil having a first coil segment and a second coil segment. The two coil segments are oriented in opposite directions. The two coil segments are arranged without crossover in one layer and the double coil is arranged in proximity to a parallel branch resonator of the ladder-type filter structure. | 03-10-2016 |
20160093937 | COMMON MODE FILTER - A common mode filter includes a ground element, a transmission line pair and an extension element, which are disposed in first to third signal layers of a circuit board. The ground element includes a ground portion and a first ground line electrically connected with each other. The first ground line is disposed in a slot of the ground portion, and extends from a bottom portion to an opening of the slot. An orthogonal projection of the transmission line pair on the first signal layer is partially overlapped with an orthogonal projection of the ground portion on the first signal layer. The orthogonal projection of the transmission line pair on the first signal layer is not overlapped with an orthogonal projection of the first ground line on the first signal layer. The extension element is electrically connected to the first ground line through at least one conductive via. | 03-31-2016 |
20160126917 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween. | 05-05-2016 |
20160126918 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component includes a body including a dielectric layer and/or a magnetic layer, a terminal part including an input terminal, an output terminal, and a ground terminal connected to the body, and a filter part including a coil part disposed in the body and a capacitor part connected to the coil part and filtering a high frequency component of an input signal input to the input terminal. The capacitor part includes a plurality of first internal electrodes connected to the coil part and a plurality of second internal electrodes exposed to an exterior of the body. | 05-05-2016 |
20160126925 | SEMICONDUCTOR RESONATORS WITH REDUCED SUBSTRATE LOSSES - A resonator includes a laminate, an inductive element on the laminate, and a semiconductor die attached to the inductive element and the laminate. The semiconductor die includes a substrate and a device layout area. The device layout area is separated into a number of device layout sub-areas, each of which has an area between about 1.0 μm | 05-05-2016 |
20160142032 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked. | 05-19-2016 |
20160142033 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked. | 05-19-2016 |
20160142034 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body including a common mode filter and a resistor that are coupled to each other, the common mode filter including a common mode choke coil; and a plurality of input terminals disposed on a first side surface of the composite body, a plurality of output terminals, and a ground terminal. | 05-19-2016 |
20160149551 | ELECTRONIC COMPONENT - An electronic component includes a spiral or substantially spiral first inductor extending along a stacking direction while turning around a ring-shaped or substantially ring-shaped path. The first inductor includes first inductor conductors and a first interlayer connecting conductor connected to each other. The first interlayer connecting conductor passes through some insulating layers. A second interlayer connecting conductor passes through some insulating layers, and is connected in series and is located within the ring-shaped path. A first capacitor conductor is disposed closer to one side of the stacking direction than the first inductor is. The first capacitor conductor is at least partially superposed on the ring-shaped path to define a first capacitor between the first capacitor conductor and the first inductor, and is superposed on a portion of a region surrounded by the ring-shaped path to be connected to the second interlayer connecting conductor. | 05-26-2016 |
20160156324 | ELECTRONIC COMPONENT | 06-02-2016 |
20160156326 | COMMON MODE FILTER | 06-02-2016 |
20160164483 | COMMON MODE FILTER - A common mode filter includes external electrodes formed by printing and curing a conductive paste. The external electrodes of a multilayer structure having a lower electrode layer are formed by curing the conductive paste and an upper electrode layer formed of a solder. | 06-09-2016 |
20190149116 | CONDUCTIVE PATH WITH NOISE FILTER | 05-16-2019 |