Entries |
Document | Title | Date |
20080211599 | Method for Determining Cable Termination Resistances in Communication Networks and a Corresponding Communication Network - The invention relates in general to a method for determining cable termination resistances in communication networks and a corresponding communication network, and is applicable especially to high-speed communication networks in automobiles, which uses dual-wire harnesses like FlexRay e.g. For this purpose a method for determining cable termination resistances in communication networks is proposed, where a termination resistance is assigned to at least a part of the cable ends of the network in accordance with the following steps determining for each cable end the cable length to any other cable end, assigning a weight value to each length where lengths with greater values are combined with higher weights than lengths with smaller values, for all cable ends: summing up the weights assigned to all lengths starting from a specific cable end and assigning this sum to the respective cable end as the weight of this cable end, determining the termination resistance of a specific cable end by multiplying the cable impedance Z with a constant of proportionality and the sum of the weights of all cable ends divided by the weight of the specific cable end. | 09-04-2008 |
20080218290 | Automatic Driver/Transmission Line/Receiver Impedance Matching Circuitry - An impedance matcher that automatically matches impedance between a driver and a receiver. The impedance matcher includes a phase-locked loop (PLL) circuit that locks onto a data signal provided by the driver. The impedance matcher also includes tunable impedance matching circuitry responsive to one or more voltage-controlled oscillator control signals within the PLL circuit so as to generate an output signal that is impedance matched with the receiver. | 09-11-2008 |
20080218291 | System and method for a digitally tunable impedance matching network - The present disclosure relates generally to digitally tunable impedance matching networks. In one example, a digitally tunable impedance matching network is configured to produce an overall reactance value of approximately X, and includes multiple reactive components that are configured to produce a reactance value in the range of approximately zero to X with a minimum resolution of approximately X/2 | 09-11-2008 |
20080231390 | Matching impedance method, impedance matching circuit, and personal computer employing the impedance matching circuit - An exemplary impedance matching circuit ( | 09-25-2008 |
20080238569 | Variable Matching Circuit - A variable matching circuit includes a variable capacitance circuit formed of a capacitor coupled to varactor diode and provided between terminals, and a resonator-type circuit includes a plurality of inductors and a variable capacitance circuit formed of a capacitor and a varactor diode. The inductors and the variable capacitance circuit are coupled in parallel together. The resonator-type circuit is connected in shunt with the terminal. The foregoing structure forms an L-type matching circuit. The bias of the varactor diodes can be thus varied, and plural values of the inductance of the resonator-type circuit can be switched over with a FET. The variable matching circuit can electrically control an impedance conversion available for wider ranges of frequency bandwidths. | 10-02-2008 |
20080266021 | Impedance Detector - The invention relates to an antenna which is coupled to an RF amplifier. Environmental conditions change the impedance of the antenna, which reduces output power, efficiency and linearity. A circuit is provided which is designed to detect the impedance of the antenna. With the measured impedance, impedance matching can be accomplished. The circuit for detecting the impedance detects the signal travelling from the RF amplifier to the antenna, and measures the peak voltage and the peak current of this signal. Furthermore, the phase difference between the voltage and the current is measured. The advantage of the circuit is its compactness allowing for an easy integration on a chip. Furthermore, an impedance matching circuit is suggested which makes use of the above circuit for detecting the impedance. | 10-30-2008 |
20080266022 | RF BACKSCATTER TRANSMISSION WITH ZERO DC POWER CONSUMPTION - A method for minimizing power consumption in a wireless device which utilizes backscatter transmission in half-duplex mode, wherein a switching device is interposed between an antenna and a transmitter-receiver, and the switching device is capable of causing the antenna load impedance characteristic to be either a short, a value which substantially matches the antenna impedance, or an open, depending on the portion of the half-duplex mode. | 10-30-2008 |
20080278259 | Methods for designing switchable and tunable broadband filters using finite-width conductor-backed coplanar waveguide structures - This invention uses the structures of the finite-sized conductor-backed coplanar waveguides for designing broadband switchable and tunable signal filters. The design methods construct a plurality of configurations, which including waveguides, via holes, metallic posts, and conductor planes in the structures, for selecting, coupling, converting, and dissipating of the signals with specific electromagnetic modes and frequencies propagating through the structures. The dominant electromagnetic modes of the signals include Coplanar Waveguide Modes and Microstrip-Like Modes. The design methods thereby produce a plurality of filter types, such as bandstop filters, bandpass filters, multiband filters, etc. The design methods can apply to the structures with single and multi-layer dielectric and metallic materials, such as Integrated Circuits, Thin-film transistor Circuits, Low Temperature/High Temperature Co-fired Ceramics (LTCC/HTCC), PCB, and others. In addition, the design methods add switches to perform electrically controllable functions including frequency band selection and filter type selection. The design methods can also perform impedance matching of broadband signals by electrically tuning the values of inductance and capacitance in conjunction with the structures. | 11-13-2008 |
20080278260 | MATCHING CIRCUIT - First, second and third matching parts | 11-13-2008 |
20080290959 | MILLIMETER WAVE INTEGRATED CIRCUIT INTERCONNECTION SCHEME - A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition. | 11-27-2008 |
20080290960 | APPARATUS OF IMPEDANCE MATCHING FOR BIDIRECTIONAL DATA LINE - An apparatus includes a bidirectional data line to couple to a device and an impedance to provide an impedance matching between the data line and the device. In some embodiments, when a direction of data flow in the data line is away from the device, the impedance is of a first impedance value, and when the direction of the data flow is toward the device, the impedance is of a second impedance value. In one embodiment, the second impedance value is substantially zero. | 11-27-2008 |
20080290961 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device including an input/output circuit having a terminal capacitance adjustment circuit connected to a signal line between an external pin and an initial-stage circuit; a command decoder for decoding an entered command and detecting a terminal capacitance adjustment command; and a terminal capacitance control circuit, which has a terminal capacitance adjustment register that holds information for controlling terminal capacitance, for controlling a capacitance value of the terminal capacitance adjustment circuit based upon the information in the terminal capacitance adjustment register. The information held by the terminal capacitance adjustment register is set based upon the output from the command decoder. | 11-27-2008 |
20090002091 | ON DIE TERMINATION DEVICE THAT CAN CONTROL TERMINAL RESISTANCE - An on die termination controls a terminal resistance value in accordance with a test signal. The one die termination device comprises an on die termination control unit and an on die termination resistor unit and can change the terminal resistance value in accordance with the test signal, so that the terminal resistance can be easily analyzed. The one die termination control unit comprises a resistance control enable signal generating unit and a resistance control signal generating unit and generates at least one resistance increment signal and at least one resistance decrement signal. The on die termination resistor unit comprises a resistor and a plurality of switch units that are connected in parallel and is driven by a driving signal and uses the resistance increment signal and resistance decrement signal to control the on die termination resistance value. | 01-01-2009 |
20090051460 | MODULE AND PASSIVE PART - A passive part includes a filter unit having first resonance electrode to a third resonance electrode and an impedance matching circuit unit electrically connected to the third resonance electrode of the filter unit arranged on a dielectric substrate. The entire passive part has a configuration including a circuit unit equivalent to characteristic containing the second impedance matching circuit by an impedance component of the third resonance electrode. For example, by modifying the width of the third resonance electrode, it is possible to adjust the impedance in the same way as when a capacitance as the impedance matching circuit unit is connected, without connecting any capacitance. | 02-26-2009 |
20090058552 | HIGH-FREQUENCY MODULE, AND MOBILE TELEPHONE AND ELECTRONIC DEVICE PROVIDED THEREWITH - A high-frequency module includes: a mixer circuit performing frequency conversion by mixing a local oscillation signal with a reception signal; a filter circuit eliminating an unnecessary frequency component from the signal outputted from the mixer circuit; a controllable-gain amplifier circuit amplifying and outputting the signal outputted from the filter circuit; and an impedance circuit (such as a resistive element, inductance element, or a chip bead) interposed between the output terminal of the amplifier circuit and the input terminal of a demodulation circuit in the succeeding stage so as to apparently increase the input impedance of the demodulation circuit. | 03-05-2009 |
20090066439 | INPUT CIRCUITRY FOR TRANSISTOR POWER AMPLIFIER AND METHOD FOR DESIGNING SUCH CIRCUITRY - A circuit having: an input matching network; a transistor coupled to an output of the input matching network; and wherein the input matching network has a first input impedance when such input matching network is fed with an input signal having a relatively low power level and wherein the input matching network has an input impedance different from the first input impedance when such input matching network is fed with an input signal having a relatively high power level. | 03-12-2009 |
20090066440 | METHOD FOR AUTOMATIC IMPEDANCE MATCHING FOR A RADIOFREQUENCY CIRCUIT AND TRANSMISSION OR RECEPTION SYSTEM WITH AUTOMATIC MATCHING - The invention relates to a method for automatically matching the antenna impedance for a radiofrequency transmission circuit having an amplifier. An impedance matching network is inserted between the amplifier and the antenna. The output current i and voltage V from the amplifier and their phase shift are measured, and from this the complex impedance, defined by V/i, is deduced. The antenna impedance is calculated as a function of this complex impedance and as a function of the known present values of the adjustable impedances of the matching network. New values are calculated, from the calculated value of the antenna impedance, for the adjustable impedances of the matching network that allow an overall load impedance of the amplifier to be obtained which is as close as possible to the nominal load impedance Z | 03-12-2009 |
20090108955 | Semiconductor Device and Method for Adjusting Characteristics Thereof - The object of the invention is to provide a semiconductor device including signal-transmission interconnections preferable for transmitting high frequency signal and capability to adjust characteristics of the above signal-transmission interconnections. A semiconductor device according to the present invention consists of a signal-transmission interconnection | 04-30-2009 |
20090128250 | POWER LINE TRANSMISSION - A device including an element for receiving an electrical signal comprising a high-frequency data signal component and a low-frequency power supply component. The electrical signal is conveyed in an electrical cable of an electrical installation. The device further includes impedance matching operative in a band of frequencies of the high-frequency signal component, the impedance matching being determined as a function of one or more characteristics of the electrical cable. Such a device can be integrated into a socket outlet or an electrical device or take the form of a socket adaptor. | 05-21-2009 |
20090128251 | DUAL-FREQUENCY MATCHING CIRCUIT - The connection topology of input terminals ( | 05-21-2009 |
20090128252 | DUAL-FREQUENCY MATCHING CIRCUIT - The connection topology of input terminals ( | 05-21-2009 |
20090134952 | POWER HARVESTING SIGNAL LINE TERMINATION - In various embodiments of the invention, a power-harvesting termination circuit may be used to 1) match the impedance of a signal line being terminated, and 2) recover a portion of electrical power from a signal on the signal line and provide the recovered power as an electrical voltage to be used to power other circuits. The power may be harvested at either the receiving device or at the transmitting device. | 05-28-2009 |
20090146756 | OUTPUT CIRCUIT FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING OUTPUT CIRCUIT, AND METHOD OF ADJUSTING CHARACTERISTICS OF OUTPUT CIRCUIT - To decrease the circuit scale necessary for the calibration of the output circuit and to decrease the time required for the calibration operation. The invention includes a first output buffer and a second output buffer that are connected to a data pin, and a calibration circuit that is connected to a calibration pin. The first output buffer and the second output buffer include plural unit buffers. The unit buffers have mutually the same circuit structures. With this arrangement, the impedances of the first output buffer and the second output buffer can be set in common, based on the calibration operation using the calibration circuit. Consequently, both the circuit scale necessary for the calibration operation and the time required for the calibration operation can be decreased. | 06-11-2009 |
20090153260 | METHOD AND SYSTEM FOR A CONFIGURABLE TRANSFORMER INTEGRATED ON CHIP - Aspects of a method and system for a configurable transformer integrated on-chip are provided. In this regard, an integrated circuit may comprise a transformer with a configurable windings ratio, and the windings ratio may be configured to enable transmitting and/or receiving signals via an antenna communicatively coupled to said transformer. The windings ratio may be configured based on an impedance of the antenna, a transmitter communicatively coupled to the transformer, a receiver communicatively coupled to the transformer, and/or a power level or transmitted and/or received signals. The windings ratio may be configured via one or more switching elements which may be active devices integrated on-chip. The transformer may comprise a plurality of loops fabricated on a corresponding plurality of metal layers in said integrated circuit and the loops may be coupled with one or more vias. The IC may also comprise ferrimanetic and/or ferromagnetic materials. | 06-18-2009 |
20090167456 | HIGH SPEED WIDEBAND DIFFERENTIAL SIGNAL DISTRIBUTION - An exemplary device that operates as a differential splitter includes a plurality of differential signal conductors. Each of the conductors is coupled to at least one other of the conductors by a connector and a resistor. The coupled conductors are impedance matched by a combination of a spacing between the connector and the resistor, an impedance of the conductors and a resistive value of the resistor. An input is associated with two of the differential signal conductors. A plurality of outputs are each associated with a respective two of the differential conductors. | 07-02-2009 |
20090167457 | APPARATUS AND METHOD OF SELECTING COMPONENTS FOR A RECONFIGURABLE IMPEDANCE MATCH CIRCUIT - A method of selecting component values for an analog circuit includes identifying a cost function that evaluates similarity between an approximate frequency response function and a preferred frequency response function for at least one characteristic of the functions, determining the approximate frequency response function of the analog circuit based on an approximate component value, and changing the approximate component value based on a determined magnitude of similarity between the preferred frequency response function and the approximate frequency response function for the at least one characteristic. An impedance matching apparatus includes a mismatch detection circuit that produces a difference between source and load impedances, a match network controller that produces a control value based on the difference, and a reconfigurable varactor match network including at least one stub mounted varactor having a capacitance controlled by the control value to match the source and load impedances. | 07-02-2009 |
20090167458 | MATCHING CIRCUIT - The present invention has for its object to provide a matching circuit with multiband capability which can be reduced in size, even if the number of handled frequency bands rises. The matching circuit of the present invention comprises a load having frequency-dependent characteristics, a first matching block connected with one end to the load with frequency-dependent characteristics, and a second matching block formed by lumped elements connected in series to the first matching block. And then, when a certain frequency band is used, matching is obtained with the series impedance of the first matching block and the second matching block. When a separate frequency band is used, a π-type circuit is constituted by connecting auxiliary matching blocks to both sides of the second matching block. Next, at the same frequency, by taking the combined impedance of this π-type circuit and a load whose characteristics do not depend on the frequency to be Z | 07-02-2009 |
20090179711 | MATCHING CIRCUIT - The present invention has for its object to provide a matching circuit with multiband capability which can be reduced in size, even if the number of handled frequency bands rises. The matching circuit of the present invention comprises a load having frequency-dependent characteristics, a first matching block connected with one end to the load with frequency-dependent characteristics, and a second matching block formed by lumped elements connected in series to the first matching block. And then, when a certain frequency band is used, matching is obtained with the series impedance of the first matching block and the second matching block. When a separate frequency band is used, a π-type circuit is constituted by connecting auxiliary matching blocks to both sides of the second matching block. Next, at the same frequency, by taking the combined impedance of this π-type circuit and a load whose characteristics do not depend on the frequency to be Z | 07-16-2009 |
20090189710 | DUAL-FREQUENCY MATCHING CIRCUIT - The connection topology of input terminals ( | 07-30-2009 |
20090195325 | DIFFERENTIAL INTERNALLY MATCHED WIRE-BOND INTERFACE - In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over-mold of the millimeter wave package. | 08-06-2009 |
20090195326 | DUAL-FREQUENCY MATCHING CIRCUIT - The connection topology of input terminals | 08-06-2009 |
20090212880 | Electrical Circuit Comprising a Differential Signal Path and Component with Such a Circuit - The invention relates to an electrical circuit that includes a first signal path having differential partial paths. An interface circuit arranged in the first signal path suppresses the common-mode signals in a blocking region of the signal path, but essentially does not influence differential signal parts. | 08-27-2009 |
20090219107 | ADJUSTABLE LOW-LOSS INTERFACE - In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit | 09-03-2009 |
20090219108 | APPARATUS AND METHOD FOR INCREASING SENSITIVITY OF ULTRASOUND TRANSDUCERS - An acoustical stack for use within an ultrasound transducer that has a center frequency has a poled piezoelectric material layer and at least one impedance matching layer. The poled piezoelectric material layer has top and bottom sides and is formed of poled piezoelectric material that has a first acoustic impedance. The poled piezoelectric material layer has a first thickness and the acoustical stack has an output electrical impedance based on the first thickness. The impedance matching layers are configured to be attached to the top and bottom sides of the poled piezoelectric material layer and have second or third thicknesses. The impedance matching layers are formed of one or more materials that have an acoustic impedance substantially similar to the first acoustic impedance. The poled piezoelectric layer and impedance matching layers form an acoustic resonance thickness. The center frequency of the transducer is based on the acoustic resonance thickness. | 09-03-2009 |
20090256644 | RADIO FREQUENCY COMMUNICATION DEVICES AND METHODS - One embodiment relates to a radio frequency (RF) communication device. The RF communication device includes an antenna interface coupled to an antenna that exhibits a time-varying impedance. The RF communication device also includes a test interface coupled to RF test equipment that exhibits a test impedance. A tuning circuit in the RF communications device selectively provides a matched impedance to either the time-varying impedance or the test impedance based on feedback derived from the test interface. Other methods and systems are also disclosed. | 10-15-2009 |
20090267703 | DYNAMICALLY ADAPTABLE IMPEDANCE MATCHING CIRCUITRY BETWEEN AN ELECTRO-OPTICAL LOAD AND A DRIVING SOURCE - A system including a driving source that supplies an alternating current (AC) electrical signal is provided. At least one electro-optical device is coupled as an electrical load of the driving source. The system further includes an apparatus configured to provide a dynamically adaptable electrical impedance matching between the driving source and the electro-optical load over a frequency range. | 10-29-2009 |
20090273412 | Very high efficiency transmission line driver - This circuit is a back terminated transmission line driver which dissipates no outgoing power across its back terminating resistor by using both a voltage source and a current source. | 11-05-2009 |
20090289735 | System and Method for Dynamic Impedance Tuning to Minimize Return Loss - A system for tuning an impedance at a node comprises a first component associated with a first impedance when the first component is operating and a second impedance when the first component is not operating. The system further comprises a second component coupled to the first component at a node. The second component is associated with a third impedance when the second component is operating and a fourth impedance when the second component is not operating. An impedance tuning circuit is coupled to the second component at the node and operable to tune an impedance at the node based at least in part upon a plurality of the first impedance, the second impedance, the third impedance, and the fourth impedance. | 11-26-2009 |
20090302968 | DEVICE COMPRISING A CONTROLLED MATCHING STAGE | 12-10-2009 |
20100019857 | HYBRID IMPEDANCE MATCHING - Impedance matching techniques can be used to match an amplifier to an antenna for signal transmission. Some impedance matching techniques use an integrated passive component and an integrated transformer. Some impedance matching techniques include the use of an integrated n:m transformer, where n≠m. Several n:m transformer implementations are described. | 01-28-2010 |
20100019858 | N:M TRANSFORMER AND IMPEDANCE MATCHING - Impedance matching techniques can be used to match an amplifier to an antenna for signal transmission. Some impedance matching techniques use an integrated passive component and an integrated transformer. Some impedance matching techniques include the use of an integrated n:m transformer, where n≠m. Several n:m transformer implementations are described. | 01-28-2010 |
20100026413 | DIFFERENTIAL SIGNAL TERMINATION BLOCK - A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second pair of connectors, and an electrical circuit having passive elements that connect the first and second pair of connectors and provide impedance matching. | 02-04-2010 |
20100045402 | APPARATUSES AND A METHOD FOR CONTROLLING ANTENNA SYSTEMS IN A TELECOMMUNICATIONS SYSTEM - The present invention relates to a method and an apparatus ( | 02-25-2010 |
20100052809 | METHOD AND APPARATUS FOR ADJUSTING LOAD IMPEDANCE OF A DISTRIBUTED AMPLIFIER - The application discloses a method and apparatus for adjusting internal load impedances, by section, at feed points present on a distributed amplifier's output transmission line. The method includes determining a summing-point load impedance (Z | 03-04-2010 |
20100052810 | ANTENNA CIRCUIT STRUCTURE AND ANTENNA STRUCTURE - An antenna circuit structure and an antenna structure are provided. The antenna structure includes an antenna circuit structure and a chip antenna. The antenna circuit structure includes a PCB and a feed-in point, an electrical point, a main circuit system and a matching circuit disposed on the PCB. Two electrical pins of the chip antenna are soldered in the feed-in point and the electrical point, respectively. The main circuit system is electrically connected to the feed-in point, and the matching circuit is electrically connected to the electrical point. Thus, the antenna structure can be easily calibrated to get preferable matching performance. | 03-04-2010 |
20100085129 | IMPEDANCE MATCHING APPARATUS FOR PLASMA-ENHANCED REACTION REACTOR - An impedance matching apparatus adapted to be connected between a reaction chamber and a power source for plasma processing includes a transformer, a coil unit, and a capacitor connected in series. A primary side of the transformer is adapted to be connected to the power source, and a secondary side of the transformer has multiple taps positioned at different windings; and the coil unit is comprised of multiple coils having different inductances and arranged in parallel, wherein each tap is connected to a different coil or coils. The impedance matching circuit further includes a switch unit provided between the coil unit and the capacitor. | 04-08-2010 |
20100097156 | Semiconductor device and manufacturing the same - A semiconductor device including a MISFET formed in a well at a main surface of a substrate, a second MISFET formed at a main surface of the substrate, and a passive element formed over the main surface of the substrate and having two terminals. A conductive film is formed at a rear face of the semiconductor substrate. The conductive film is connected with a fixed potential and also electrically connected with the conductive film. | 04-22-2010 |
20100097157 | SEMICONDUCTOR DEVICE AND MANUFACTURING THE SAME - A semiconductor device including a MISFET formed in a well at a main surface of a substrate, a second MISFET formed at a main surface of the substrate, and a passive element formed over the main surface of the substrate and having two terminals. A conductive film is formed at a rear face of the semiconductor substrate. The conductive film is connected with a fixed potential and also electrically connected with the conductive film. | 04-22-2010 |
20100109794 | Circuit and method for driving at least one differential line - In the case of a circuit arrangement which can be supplied by way of at least one voltage source, in particular a driver output stage, for driving at least one differential line which can be connected to at least one first output connection as well as to at least one second output connection for the purpose of, in particular digital, data transmission, wherein the circuit arrangement has at least two paths which are arranged in a mirror-image fashion relative to one another and which connect the voltage source to at least one reference potential, in particular earth potential or ground potential or zero potential, as well as in the case of a method for driving at least one differential line using at least one such circuit arrangement, an increased output impedance is avoided during the switching phase, and this ensures high signal quality. | 05-06-2010 |
20100148884 | IMPEDANCE MATCHED TRANSMITTING ARRANGEMENT - A transmitting arrangement includes a matching circuit, a reference circuit and a comparator. The output of the matching circuit can be coupled to an antenna and comprises an adjustable impedance. The reference circuit is connected to an input of the matching circuit and comprises a reference impedance. Inputs of the comparator are coupled to the matching circuit and the reference circuit and its output is coupled to the adjustable impedance via a control input of the matching circuit. | 06-17-2010 |
20100156553 | METHOD AND LOCALIZATION UNIT FOR DETECTING AND LOCATING LOAD COILS IN A TRANSMISSION LINE - A method and localization unit for localizing load coils within a transmission line. The load coil localization is achieved using a measurement of a Single-Ended Line Testing (SELT) parameter for the transmission line and an approximation of the SELT parameter obtained from a model of the transmission line. The model is based on a parameter vector θ including parameters describing the transmission properties of each load coil and cable section and the length of a plurality of individual cable sections as unknown independent parameters. The location of at least one load coil is determined by substantially minimizing a criterion function that represents a deviation between the measurement of the SELT parameter and the approximation of the SELT parameter obtained from the model. The load coil localization method and unit can be used for both symmetric and asymmetric transmission lines. | 06-24-2010 |
20100164645 | Tunable Impedance Matching Circuit - The tunable impedance circuit comprises capacitors C | 07-01-2010 |
20100176895 | CIRCUIT COMPRISING A VOLTAGE-DEPENDENT COMPONENT AND METHOD FOR OPERATING THE CIRCUIT - A circuit is proposed by means of which a ceramic component having two electrodes can be provided with a uniform, but periodically alternating BIAS voltage. The component has properties dependent on the level of the BIAS voltage and, for the purpose of an increased service life, is connected to a generator for generating a BIAS voltage and to means for periodically reversing the polarity of the BIAS voltage present at the electrodes. In a method for operating the component having variable properties, a uniform BIAS voltage, the polarity of which is periodically reversed, however, is applied to the electrodes, and the service life of the component is thus increased. | 07-15-2010 |
20100182097 | HIGH-FREQUENCY DEVICE AND HIGH-FREQUENCY CIRCUIT USED THEREIN - A high-frequency device having a high-frequency circuit comprising a high-frequency amplifier, and an output-matching circuit receiving high-frequency power output from the high-frequency amplifier, in and on a multilayer substrate obtained by laminating pluralities of dielectric layers, the output-matching circuit comprising a first transmission line transmitting the high-frequency power from the high-frequency amplifier side to the output terminal side, and at least part of the first transmission line being formed by series-connecting pluralities of conductor patterns formed on pluralities of dielectric layers in a laminate direction. | 07-22-2010 |
20100194487 | MULTIBAND MATCHING CIRCUIT AND MULTIBAND POWER AMPLIFIER - A multiband matching circuit includes a first matching unit for converting an impedance in a signal path to Z | 08-05-2010 |
20100201456 | COMBINED MATCHING AND FILTER CIRCUIT - A combined matching and harmonic rejection circuit with increased harmonic rejection provided by a split resonance for one or more of the capacitive or inductive elements of the circuit. At a fundamental frequency, the circuit comprises an inductive series arm with capacitive shunt arms. The capacitance of a shunt arm may be provided by two or more parallel paths, each having a capacitor and an inductor in series so that, in addition to providing the effective capacitance necessary for impedance matching at the fundamental frequency, two separate harmonics represented by the series resonances of the parallel paths are rejected. In this manner, an extra null in the circuit's stop-band may be achieved using the same number of shunt elements necessary to achieve impedance matching at the fundamental frequency. | 08-12-2010 |
20100214036 | Common-Mode Noise Reduction Circuit - A system operating in a process control environment includes a field device to perform a process control function in the process control environment, a remote device disposed away from the field device to perform an auxiliary function associated with the process control function of the field device, a first wired communication link communicatively coupled to the field device and to the remote device to support data communication between the field device and the remote device, and a common-mode noise reduction circuit coupled to the field device and to the wired communication link to reduce common-mode noise generated in the first wired communication link. | 08-26-2010 |
20100225411 | Impedance Matching - In an impedance matching circuit selectively operable in a normal matching mode and a protection mode, the impedance matching circuit includes a set of reactances in a first reactance arrangement configured to transform an impedance of a load to an impedance within a range of a nominal impedance of an HF generator in the normal matching mode, and a PIN diode switch having a first invariable switching state in the normal matching mode and a second switchomg state that reconfigures the set of reactances into a second reactance arrangement in the protection mode, such that the second reactance arrangement is configured to transform the impedance of the load to prevent damage to the HF generator or to transmission circuitry arranged between the HF generator and the load. | 09-09-2010 |
20100231319 | Apparatus and method for wireless communications - An apparatus including: a first transistor including a first port configured for connection to an antenna having a first impedance at a first frequency band, and a second port configured for connection to radio circuitry, the first port of the first transistor being configured to have an impedance at the first frequency band substantially equal to the complex conjugate of the first impedance. | 09-16-2010 |
20100265003 | IMPEDANCE MATCHING METHOD - An impedance matching method which is used to save electrical energy by virtue of the fact that the method switches between modes for controlling impedance matching and modes for regulation of the impedance matching depending on the situation. An algorithm which, on the basis of control signals from an external circuit environment, controls or regulates the impedance of a variable-impedance circuit element is implemented in a logic circuit LC. | 10-21-2010 |
20100289596 | IMPEDANCE MATCHED CIRCUIT BOARD - An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein. | 11-18-2010 |
20100308933 | TUNABLE MATCHING CIRCUITS FOR POWER AMPLIFIERS - Tunable matching circuits for power amplifiers are described. In an exemplary design, an apparatus may include a power amplifier and a tunable matching circuit. The power amplifier may amplify an input RF signal and provide an amplified RF signal. The tunable matching circuit may provide output impedance matching for the power amplifier, may receive the amplified RF signal and provide an output RF signal, and may be tunable based on at least one parameter effecting the operation of the power amplifier. The parameter(s) may include an envelope signal for the amplified RF signal, an average output power level of the output RF signal, a power supply voltage for the power amplifier, IC process variations, etc. The tunable matching circuit may include a series variable capacitor and/or a shunt variable capacitor. Each variable capacitor may be tunable based on a control generated based on the parameter(s). | 12-09-2010 |
20100315176 | ACTIVE BACK-END TERMINATION CIRCUIT - The invention discloses an active back-end termination circuit, which comprises a first resistor, a first transistor, a second resistor, and a second transistor. The first resistor and the first transistor are connected in series for forming a first impendence unit. A first source of the first transistor is connected to a working voltage with V | 12-16-2010 |
20110050357 | Transformer Signal Coupling for Flip-Chip Integration - Methods and apparatuses for transformer signal coupling for flip-chip circuit assemblies are presented. A device for coupling dies in flip-chip circuit assembly may include a first die associated with a first fabrication process and a first inductor physically coupled to the first die, where the first inductor receives an RF input signal. The device may further include a second die associated with a second fabrication process, and a second inductor physically coupled to the second die, where the second inductor is positioned so the first inductor can inductively couple the RF signal in the second inductor. A method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. | 03-03-2011 |
20110050358 | Electromagnetic Interference Noise Separator - Improved performance of a noise separator circuit capable of separating common mode (CM) and differential mode (DM) components of electromagnetic interference (EMI) noise are provided by arrangement of terminating impedances such that the circuit is fully symmetric with respect of a pair of input ports. The noise separator circuit is further improved by perfecting features for canceling effects of parasitic inductances and capacitances, parasitic capacitance and inductance between circuit connections such as printed circuit board traces, minimizing leakage inductance effects of pairs of coupled inductors and mutual inductance effects between pairs of coupled inductors, providing sufficient magnetizing inductance for low frequency response, and preventing saturation of inductors using switched attenuators, providing a plurality of ground planes, choices of terminating resistors and circuit layout. | 03-03-2011 |
20110068878 | POWER DISTRIBUTION SYSTEM FOR INTEGRATED CIRCUITS - A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over. | 03-24-2011 |
20110074520 | I/O Circuit Calibration Method and Associated Apparatus - An I/O calibration method and an apparatus are provided for calibrating a driving impedance at an output end of an I/O circuit in a chip. The chip further includes a plurality of basic impedances and a non-volatile memory. The I/O circuit calibration method includes: measuring an impedance value of one basic impedance and recording the measured impedance value in the non-volatile memory; synthesizing a calibration impedance by selectively conducting the basic impedance(s); adjusting the number of the conducted basic impedance(s) in the calibration impedance and estimating an impedance value of the driving impedance according to the measured result and a voltage divided by the calibration impedance and the driving impedance at the output end. | 03-31-2011 |
20110090021 | Circuit for Impedance Matching - A circuit provided for impedance matching includes an input, an output and four impedance elements arranged between them. In this case, two of the impedance elements are connected in series in a main path and form a T configuration with a third component. In addition, a fourth component is connected in parallel with the main path of the circuit. By way of example, the components arranged in the main path are variable capacitances and the further components are inductances. | 04-21-2011 |
20110095840 | CATV FACE PLATE DEVICE AND METHOD WITH EXTENDED FREQUENCY RANGE - A face plate for cable-TV networks, the face plate adapted to operate in frequencies as high as 1.8 GHz. The face plate comprising terminals, electronic circuitry, impedance matching units and a disturbances suppressor. The disturbances suppressor is designed to suppress the parasitic resonance of the transmission line that appears inside the extended operational frequency band of 1000 to 1800 MHz. The impedance matching units are adapted to match the impedance of the terminal with that of electronic circuitry. | 04-28-2011 |
20110115572 | METHODS AND APPARATUS FOR A RESONANT TRANSMIT/RECEIVE SWITCH WITH TRANSFORMER GATE/SOURCE COUPLING - Methods and apparatus for a resonant transmit/receive switch with transformer gate/source coupling. The resonant transmit/receive (T/R) switch includes a switchable inductor having a first inductance value for use in receive (Rx) mode and a second inductance value for use in transmit (Tx) mode. The first inductance value is used for input matching to a low noise amplifier in Rx mode. The second inductance value is selected to resonant with parasitic capacitance of the antenna port to produce a high impedance in Tx mode. In one implementation, the switchable inductor is gate sourced coupled to at least one of first and second inductors of a low noise amplifier (LNA), thereby allowing use of smaller inductors due to the resulting coupling factor. | 05-19-2011 |
20110148543 | Integrated Circuit With Inductive Bond Wires - An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die. | 06-23-2011 |
20110175687 | TUNABLE MATCHING NETWORK CIRCUIT TOPOLOGY DEVICES AND METHODS - Methods and devices for modifying a tunable matching network are disclosed. In one aspect, a method of modifying a tunable matching network can include connecting one or more shunt inductors to a tunable matching network exhibiting parasitic capacitance to ground, whereby high-frequency performance of the tunable matching network is improved. | 07-21-2011 |
20110227666 | METHOD AND APPARATUS FOR ADAPTING A VARIABLE IMPEDANCE NETWORK - The present disclosure may include, for example, a tunable capacitor having a decoder for generating a plurality of control signals, and an array of tunable switched capacitors comprising a plurality of fixed capacitors coupled to a plurality of switches. The plurality of switches can be controlled by the plurality of control signals to manage a tunable range of reactance of the array of tunable switched capacitors. Additionally, the array of tunable switched capacitors is adapted to have non-uniform quality (Q) factors. Additional embodiments are disclosed. | 09-22-2011 |
20110304408 | METHOD AND APPARATUS FOR ADAPTIVE IMPEDANCE MATCHING - A system that incorporates teachings of the present disclosure may include, for example, an adaptive impedance matching network having an RF matching network coupled to at least one RF input port and at least one RF output port and comprising one or more controllable variable reactive elements. The RF matching network can be adapted to reduce a level of reflected power transferred from said at least one input port by varying signals applied to said controllable variable reactive elements. The one or more controllable variable reactive elements can be coupled to a circuit adapted to map one or more control signals that are output from a controller to a signal range that is compatible with said one or more controllable variable reactive elements. Additional embodiments are disclosed. | 12-15-2011 |
20120001702 | Output Impedance Compensation for Voltage Regulators - Method and circuit topology for an impedance compensation circuit (ICC), for compensating a DC voltage regulator circuit (RC). The ICC comprises individual components that are workable in combination with an inherent output impedance characteristic of the RC. The components are optimizable for providing a substantially uniform AC output impedance characteristic and impedance phase over a first defined frequency range and an operating idle current under a load, by creating a condition where a source impedance and a load impedance are complex conjugates. The source impedance is a series combination of the inherent output impedance characteristic of the RC and a first impedance due to a first portion of the individual components. The load impedance is a parallel combination of a second impedance due to a second portion of the individual components and the load, when the ICC is configured with the RC and the load. | 01-05-2012 |
20120007690 | Adaptive Impedance Matching Network - An adjustable impedance matching network for providing an adjustable matching impedance (Rm) is presented. The matching network includes first and second impedance adjusting circuits. The first impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance whilst substantially maintaining the value of a real part of the matching impedance based on frequency information frequency and a target reference value. The second impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance to be substantially equal to zero based on the frequency information, so as to adjust the real part of the matching impedance to be substantially equal to the target reference value. | 01-12-2012 |
20120019334 | IMPEDANCE MATCHING DEVICE - The present invention intends to provide a small-sized impedance matching device with a small variation in quality and large-current tolerance. The above described intention of the present invention is achieved by an impedance matching device, which comprises a wiring portion comprising a conductor pattern for wiring, embedded inside or formed on the surface of first dielectric material, and either one or both of an inductor portion comprising a conductor pattern for inductor, embedded inside or formed on the surface of the first dielectric material, or a capacitor portion comprising at least one pair of conductor patterns for capacitor and second dielectric material with a dielectric constant larger than that of the first dielectric material, existing between the pair of conductor patterns for capacitor wherein the thicknesses of the conductor pattern for wiring and the conductor pattern for inductor are 20 μm or more. | 01-26-2012 |
20120032751 | VARIABLE IMPEDANCE MATCHING CIRCUIT - A variable impedance matching circuit includes a series or parallel connection of a fixed inductive element and a first variable capacitive element and a second variable capacitive element connected in series with the serial or parallel connection. The susceptance of the circuit can be changed by changing the capacitances of the variable capacitive elements. | 02-09-2012 |
20120062332 | VARIABLE CAPACITANCE MODULE AND MATCHING CIRCUIT MODULE - In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate. | 03-15-2012 |
20120075033 | SINGLE MATCHING NETWORK FOR MATCHING MULTI-FREQUENCY AND METHOD OF CONSTRUCTURING THE SAME AND RADIO FREQUENCY POWER SOURCE SYSTEM USING THE SAME - A single matching network is adapted to input at least two frequencies, which is used to selectively provide an RF power match at any one of the at least two frequencies to a plasma load, and the single matching network includes an input terminal connected to a multi-frequency input and an output terminal connected to the plasma load. A capacitor and an inductor connected in series with each other are provided between the input terminal and the output terminal to form a branch, the capacitance value of the capacitor is C | 03-29-2012 |
20120105168 | Method and System for Matching Networks Embedded in an Integrated Circuit Package - Methods and systems for matching networks embedded in an integrated circuit package are disclosed and may include controlling impedance within an integrated circuit via one or more impedance matching networks. The impedance matching networks may be embedded within a multi-layer package bonded to the integrated circuit. The impedance of one or more devices within the integrated circuit may be configured utilizing the impedance matching networks. The multi-layer package may include one or more impedance matching networks. The impedance matching networks may provide impedance matching between devices internal to the integrated circuit and external devices. The impedance matching networks may be embedded within the multi-layer package, and may include transmission lines, inductors, capacitors, transformers and/or surface mount devices. The impedance matching networks may be deposited on top of and/or on bottom of the multi-layer package. The integrated circuit may be flip-chip bonded to the multi-layer package. | 05-03-2012 |
20120112849 | DATA TRANSMISSION SYSTEM AND SEMICONDUCTOR CIRCUIT - A data transmission system is provided in which it is possible to perform both of suppressing the degrading of the slew rate and suppressing the ringing even if load capacitance of an input buffer is changed. | 05-10-2012 |
20120112850 | MATCHING SEGMENT CIRCUIT TO WHICH RADIO FREQUENCY IS APPLIED AND RADIO FREQUENCY INTEGRATED DEVICES USING THE MATCHING SEGMENT CIRCUIT - Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match. | 05-10-2012 |
20120154070 | Closed Loop Antenna Tuning Using Transmit Power Control Commands - A method and apparatus for closed loop antenna tuning uses power control feedback from a serving base station to infer the best impedance settings for an impedance matching circuit. The mobile terminal receives periodic power control commands from a base station and varies a transmit power of the transmit signal responsive to said power control commands. An antenna tuning circuit determines an impedance setting for an impedance matching circuit based on observed variations in the power control commands following adjustment in the impedance matching circuit. | 06-21-2012 |
20120200368 | Filter Having Impedance Matching Circuits - A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device impedance matching circuits, and at least one ground structure. | 08-09-2012 |
20120206214 | DEVICE AND METHOD FOR COMPENSATING IMPEDANCE AND GAIN OF TRANSMISSION INTERFACE - A device for compensating impedance and gain of a transmission interface is provided. The device includes a correcting and compensating unit, a clock data recovering unit, a decoder, a calculating unit, and an adaptive control unit. The correcting and compensating unit is used to receive a channel signal, and compensate the channel signal according to a control signal to generate a compensation signal. The clock data recovering unit is used to receive the compensation signal and generate a data signal. The decoder is used to decode the data signal and perform detection to generate error information and correct information. The calculating unit is used to count times of generating the error information and times of generating the correct information to accordingly generate reference data. The adaptive control unit is used to receive the reference data and perform calculation to generate the control signal. | 08-16-2012 |
20120235765 | BALANCED OUTPUT SIGNAL GENERATOR - The balanced output signal generator uses four interconnected plus-type second-generation current conveyors, a couple of load resistors and a single input resistor that can provide both current- and voltage-mode outputs. No matching conditions are required. | 09-20-2012 |
20120249259 | RF impedance detection using two point voltage sampling - An adaptive impedance matching module having an adjustable impedance matching network with an input for receiving an RF power source and an output to be connected to an antenna, and first and second voltage measurement device configured to sense a voltage at respective first and second nodes on the impedance matching network. A network adjuster circuit is provided to switch the impedance matching network between a first state where first and second voltages are sensed on the respective first and second nodes and a second state where third and fourth voltages are sensed on the respective first and second nodes. Processing circuitry is provided which determines the matched load impedance based upon the first, second, third and fourth sensed voltages and including matching adjustment circuitry configured to adjust the matching impedance in the event the matched load impedance differs from a target load impedance by more that a predetermined amount. | 10-04-2012 |
20120274412 | REMOVABLE COLLAR FOR MATCHING HIGH FREQUENCY IMPEDANCE AND HIGH FREQUENCY CABLE TELEVISION USING THE SAME - A cable television device with high frequency impedance matching includes a housing and a removable collar. The removable collar is disposed on a signal inputting port or a signal outputting port of the housing and a cable wire is connected to the signal inputting port or a signal outputting port. When a high frequency is inputted, the impedance of the removable collar is substantially close to the impedance of the cable wire to reduce the reflected amount of the transmitting signal and the attenuation of the transmitting high frequency signal. | 11-01-2012 |
20120280761 | Impedance matching component - The present disclosure discloses an impedance matching component disposed between a first medium and a second medium, which is formed by stacking a plurality of homogeneous metamaterial sheet layers in a direction perpendicular to surfaces thereof. Each of the metamaterial sheet layers comprises a substrate and a plurality of man-made microstructures attached thereon. A first and last metamaterial sheet layers have impedances identical to those of the first and second media respectively. The man-made microstructures attached on the first metamaterial sheet layer have a first pattern, the man-made microstructures attached on the last metamaterial sheet layer have a second pattern, and the man-made microstructures attached on intermediate ones of the metamaterial sheet layers have patterns that are combinations of the first and second patterns, with the first pattern becoming smaller continuously and the second pattern becoming larger continuously in the stacking direction of the metamaterial sheet layers. | 11-08-2012 |
20120326800 | Impedance Matching Component and Hybrid Wave-Absorbing Material - Embodiments of the present disclosure relate to an impedance matching component and a hybrid wave-absorbing material. The impedance matching component is disposed between a first medium and a second medium, and comprises a plurality of functional sheet layers. Impedances of the functional sheet layers vary continuously in a stacking direction of the functional sheet layers, with the impedance of a first one of the functional sheet layers being identical to that of the first medium and the impedance of a last one of the functional sheet layers being identical to that of the second medium. | 12-27-2012 |
20130002368 | Circuits and Methods for Providing an Impedance Adjustment - An apparatus includes a signal generator and a control circuit. The signal generator includes a control terminal and includes a current electrode coupled to a terminal that is configured to couple to a power line to receive direct current (DC) power from a power generator. The control circuit is coupled to the current electrode and the control terminal of the signal generator. The control circuit determines an impedance associated with the power generator and applies a control signal to the control terminal of the signal generator to produce an impedance adjustment signal on the current electrode for communication to the power generator through the power line in response determining the impedance. | 01-03-2013 |
20130002369 | ETHERNET END STATION - A communication system ( | 01-03-2013 |
20130009724 | NON-FOSTER CIRCUIT STABILIZATION METHOD - A method of and circuit for improving stabilization of a non-Foster circuit. The method comprises steps of and the circuit includes means for measuring a noise hump power at an antenna port or an output port of the non-Foster circuit, comparing the measured noise hump power with a desired level of noise power that corresponds to a desired operating state of the non-Foster circuit, and tuning the non-Foster circuit to generate the desired level of noise power to achieve the desired operating state of the non-Foster circuit. | 01-10-2013 |
20130015924 | RF TRANSISTOR PACKAGES WITH HIGH FREQUENCY STABILIZATION FEATURES AND METHODS OF FORMING RF TRANSISTOR PACKAGES WITH HIGH FREQUENCY STABILIZATION FEATURES - A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells, an RF input lead coupled to the plurality of RF transistor cells, an RF output lead, and an output matching network coupled between the plurality of RF transistor cells and the RF output lead. The output matching network includes a plurality of capacitors having respective upper capacitor plates, wherein the upper capacitor plates of the capacitors are coupled to output terminals of respective ones of the RF transistor cells. The plurality of capacitors may be provided as a capacitor block that includes a common reference capacitor plate and a dielectric layer on the reference capacitor plate. The upper capacitor plates may be on the dielectric layer. | 01-17-2013 |
20130038402 | WIRELESS POWER COMPONENT SELECTION - A method includes providing a source resonator including a first conductive loop in parallel with a first capacitive element and in series with a first adjustable element the source resonator having a source target impedance, providing a plurality of device resonators each including a conductive loop and having a device target impedance, connecting, for each of the plurality of device resonators, a resistor corresponding to the device target impedance in series with the conductive loop of each of the plurality of device resonators, connecting a network analyzer in series with the first conductive loop and adjusting at least one of the first capacitive element and the first adjustable element until a measured impedance of the source resonator is within a predetermined range of the source target impedance. | 02-14-2013 |
20130057359 | ADJUSTABLE CAPACITATIVE ELEMENT - The invention relates to an adjustable capacitative element which can assume discrete capacity values the impedance values Z, of which that it can assume are distributed as evenly as possible in the Smith Chart. An adjustable capacitative element comprises a capacitor which can assume discrete capacity values. The phase of the reflection factor or the impedance values of the capacity values are interspaced equidistantly. | 03-07-2013 |
20130063223 | IMPEDANCE MATCHING CIRCUITS WITH MULTIPLE CONFIGURATIONS - Reconfigurable impedance matching circuits with multiple configurations are disclosed. A reconfigurable impedance matching circuit may be implemented with a set of reactive elements (e.g., inductors and/or capacitors) and a set of switches. Different configurations may be obtained with different settings of the switches and may be associated with different impedance tuning curves. This may enable the reconfigurable impedance matching circuit to provide better impedance matching for a load circuit (e.g., an antenna). In an exemplary design, the reconfigurable impedance matching circuit includes at least one variable reactive element configured to tune the impedance of the reconfigurable impedance matching circuit in order to provide better impedance matching. In an exemplary design, the reconfigurable impedance matching circuit may include at least one reconfigurable reactive element, each of which can be connected as a series element or a shunt element. | 03-14-2013 |
20130069737 | ADAPTIVE TUNING OF AN IMPEDANCE MATCHING CIRCUIT IN A WIRELESS DEVICE - Techniques for adaptively tuning an impedance matching circuit are disclosed. In an aspect, the impedance matching circuit is pre-characterized. The performance of the impedance matching circuit is determined for multiple settings of the impedance matching circuit, stored in memory, and used to tune the impedance matching circuit. In another aspect, the impedance matching circuit is tuned based on measurements for one or more parameters such as delivered power, return loss, power amplifier current, antenna/load impedance, etc. In an exemplary design, an apparatus includes a memory and a control unit. The memory stores information for multiple settings of an impedance matching circuit. The control unit selects one of the multiple settings of the impedance matching circuit based on the information for the multiple settings and measurements for the impedance matching circuit. The impedance matching circuit performs impedance matching for a load circuit (e.g., an antenna) based on the selected setting. | 03-21-2013 |
20130099874 | METHOD FOR DESIGNING AN ELECTRONIC CIRCUIT - An electronic circuit and method for designing an electronic circuit is provided that includes a first source element, a second source element, a first matching network, and a second matching network. The first matching network and the second matching network are designed by means of a method using the Poincaré distance, in which the second source element is designed to output a signal with a center frequency, in which the load has a load impedance, in which the second matching network has line-like series elements that carry the signal. The line-like series elements only have line impedances less than the load impedance or a sum of the electrical lengths of the line-like series elements, each of which has a line impedance greater than the load impedance, is less than one quarter of a wavelength associated with the signal. | 04-25-2013 |
20130135058 | TCCT MATCH CIRCUIT FOR PLASMA ETCH CHAMBERS - A match circuit includes the following: a power input circuit coupled to an RF source; an inner coil input circuit coupled between the power input circuit and an input terminal of an inner coil, the inner coil input circuit including an inductor and a capacitor coupled in series to the inductor, the inductor connecting to the power input circuit, and the capacitor connecting to the input terminal of the inner coil, a first node being defined between the power input circuit and the inner coil input circuit; an inner coil output circuit coupled between an output terminal of the inner coil and ground, the inner coil output circuit defining a direct pass-through connection to ground; an outer coil input circuit coupled between the first node and an input terminal of an outer coil; and an outer coil output circuit coupled between an output terminal of the outer coil and ground. | 05-30-2013 |
20130147575 | CAPACITIVE BONDING STRUCTURE FOR ELECTRONIC DEVICES - A bonding structure is applied to electrically connect a chip and a circuit board, such as a micro-strip line, for signal transmission between each other. The bonding structure includes a metallic plate and a capacitor. The chip and the micro-strip line are placed on the metallic plate but do not overlap or contact with each other. In particular, the capacitor is used to connect a signal pad of the chip and a signal line of the micro-strip line for signal transmission at high frequencies. | 06-13-2013 |
20130181788 | MATCHING CIRCUIT SYSTEM - A matching circuit system includes a first inductor, a first capacitor, a second inductor, a second capacitor, a third inductor, and a third capacitor. The first inductor has a first terminal and a second terminal. The first capacitor has a first terminal coupled to the first terminal of the first inductor, and a second terminal. The second inductor has a first terminal coupled to the second terminal of the first capacitor, and a second terminal coupled to ground. The second capacitor has a first terminal coupled to the first terminal of the first capacitor, and a second terminal. The third capacitor has a first terminal coupled to the second terminal of the second capacitor, and a second terminal. The third inductor has a first terminal coupled to the first terminal of the second capacitor, and a second terminal coupled to the second terminal of the second capacitor. | 07-18-2013 |
20130207738 | HIGH FREQUENCY SOLID STATE SWITCHING FOR IMPEDANCE MATCHING - In accordance with this invention the above and other problems are solved by a switching apparatus and method that uses a switching circuit having a pair of parallel solid-state diodes (e.g., PN or PIN diodes), one of which is connected to a transistor (e.g., power MOSFET or IGBT), to switch a capacitor (or reactance element) in or out of a variable capacitance element (or variable reactance element) of an impedance matching network. Charging a body capacitance of the transistor reverse biases one of the two diodes so as to isolate the transistor from the RF signal enabling a low-cost high capacitance transistor to be used. Multiple such switching circuits and capacitors (or reactance elements) are connected in parallel to provide variable impedance for the purpose of impedance matching. | 08-15-2013 |
20130222075 | Methods and Apparatuses for use in Tuning Reactance in a Circuit Device - Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies. | 08-29-2013 |
20130241665 | VARIABLE CAPACITOR, IMPEDANCE MATCHING DEVICE, MOBILE TERMINAL THEREOF AND METHOD FOR MATCHING IMPEDANCE - Disclosed is an impedance matching device. Variable devices of the impedance matching device installed in a mobile terminal, such as a portable terminal, are configured to have a MEMS structure. The MEMS structure and other components are integrated as one package, so the manufacturing cost is reduced and the manufacturing efficiency is improved. | 09-19-2013 |
20130257558 | TUNABLE CAPACITOR - Disclosed is a tunable capacitor. The tunable capacitor according to a first embodiment of the present invention includes: a variable capacitor unit placed between a first terminal and a second terminal; and a bypass switch which on/off controls a bypass connection between the first terminal and the second terminal, wherein the variable capacitor unit and the bypass switch are integrated on one semiconductor die or on one module. The tunable capacitor according to a second embodiment of the present invention includes: a variable capacitor unit placed between a first terminal and a second terminal; an impedance tuner placed between aground terminal and either the first terminal or the second terminal; and a tuning switch which on/off controls the connection between the variable capacitor unit and an impedance tuner, wherein the variable capacitor unit, the impedance tuner and the tuning switch are integrated on one semiconductor die or on one module. | 10-03-2013 |
20130285761 | VARIABLE CAPACITOR MODULE - Disclosed herein is a variable capacitor module, including: a capacitor circuit part including a plurality of capacitor units connected in parallel with each other; and a switching circuit part including a plurality of switch units connected between the plurality of capacitor units, and varying a capacitance of the capacitor circuit part by selecting at least one capacitor unit according to operations of the switch units, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed. | 10-31-2013 |
20140002208 | TUNABLE CAPACITOR | 01-02-2014 |
20140015622 | HEAT DISSIPATING OUTPUT NETWORK - A heat dissipating output network ( | 01-16-2014 |
20140035696 | COMMON MODE TERMINATION WITH C-MULTIPLIER CIRCUIT - Embodiments of the present disclosure provide input termination circuits that overcome the deficiencies of conventional designs. Specifically, embodiments eliminate large-on chip bypass capacitors that are commonly used for common mode termination, and instead use an active capacitor-multiplier (C-multiplier) circuit at the common mode node. The C-multiplier circuit mimics a large capacitor at high frequency. By eliminating large on-chip bypass capacitors, the IC design (e.g., receiver) is reduced in size, without affecting common mode return loss performance. Embodiments may be used with any applications that require input termination, and particularly with differential applications that require common mode termination. | 02-06-2014 |
20140097912 | IMPEDANCE MATCHING DEVICE, LINEAR MOTION MODULE, AND RADIO FREQUENCY POWER SUPPLY DEVICE - An impedance matching device includes a first variable capacitor connected to an RF power source and including a first shaft moving linearly, a first linear motion unit axially coupled to the first shaft of the first variable capacitor to provide linear motion, a first insulating joint connecting the first shaft to a first driving shaft of the first linear motion unit, and a first displacement sensor adapted to measure a movement distance of the first driving shaft of the first linear motion unit. | 04-10-2014 |
20140159829 | VARIABLE CAPACITANCE CIRCUIT - There is provided a variable capacitance circuit, including a capacitance circuit unit connected between a first terminal and a second terminal and providing a preset capacitance, a variable capacitance circuit unit including a first transistor connected to the capacitance circuit unit in series between the first terminal and the second terminal, the first transistor being operated according to a gate voltage, and a switching unit connected between a body of the first transistor and an input terminal of a preset body voltage, wherein the switching unit is turned off when the first transistor is turned on and turned on when the first transistor is turned off. | 06-12-2014 |
20140197900 | SYSTEMS AND METHODS FOR IMPEDANCE SWITCHING - Systems and methods for switching impedance are provided. In some aspects, a system includes first and second impedance elements and an impedance switch module, which includes a third impedance element coupled between the first and second impedance elements and a switch parallel to the third impedance element. The switch is coupled between the first and second impedance elements, and is configured to switch between an open configuration and a closed configuration. An electrical path is completed between the first impedance element and the second impedance element via the first switch in the closed configuration. The electrical path is not completed in the open configuration. A total impedance of the first impedance element, the second impedance element, and the impedance switch module is varied based on the switching between the open configuration and the closed configuration. | 07-17-2014 |
20140210568 | MATCHING NETWORK - A matching network for matching the impedance of a load to an impedance of an electrical energy source has an output, an input, an inductance, a capacitance, and a series connection of a nonlinear impedance and the inductance or the capacitance. The series connection is connected in parallel to the output or parallel to the input. | 07-31-2014 |
20140240057 | IMPEDANCE TRANSFORMATION NETWORK FOR IMPROVED DRIVER CIRCUIT PERFORMANCE - This disclosure provides systems, methods and apparatus for reducing harmonic emissions. One aspect of the disclosure provides a transmitter apparatus. The transmitter apparatus includes a driver circuit characterized by an efficiency and a power output level. The driver circuit further includes a filter circuit electrically connected to the driver circuit and configured to modify the impedance of the transmit circuit to maintain the efficiency of the driver circuit at a level that is within 20% of a maximum efficiency of the driver circuit when the impedance is within the complex impedance range. The filter circuit is further configured to maintain a substantially constant power output level irrespective of the reactive variations within the complex impedance range. The filter circuit is further configured to maintain a substantially linear relationship between the power output level and the resistive variations within the impedance range. | 08-28-2014 |
20140266494 | INTEGRATION OF A REPLICA CIRCUIT AND A TRANSFORMER ABOVE A DIELECTRIC SUBSTRATE - A particular device includes a replica circuit disposed above a dielectric substrate. The replica circuit includes a thin film transistor (TFT) configured to function as a variable capacitor or a variable resistor. The device further includes a transformer disposed above the dielectric substrate and coupled to the replica circuit. The transformer is configured facilitate an impedance match between the replica circuit and an antenna. | 09-18-2014 |
20140266495 | HIGH FREQUENCY POWER AMPLIFIER - A high frequency power amplifier includes an FET chip, a wire connected at a first end to the FET chip, an input-side matching circuit substrate, a resistive element on the input-side matching circuit substrate and connected in series with the FET chip, a transmission portion of a conductive material on the input-side matching circuit substrate, in contact with one end of the resistive element, and connected to an input electrode, a wire connection portion of a conductive material on the input-side matching circuit substrate, in contact with a second end of the resistive element, and connected to a second end of the wire, and a shorting portion of a conductive material having a smaller width than the resistive element and on the resistive element, connecting the transmission portion to the wire connection portion. | 09-18-2014 |
20140320232 | NETWORK SIGNAL TRANSMISSION MATCH DEVICE - A network signal transmission match device includes at least a substrate, at least a signal transmission component set, and at least a signal transformer connected in series with the signal transmission component set. The signal transmission component set is formed of at least a capacitor and an inductor connected in series and is mounted through SMT to the substrate. The signal transformer is electrically connected with the signal transmission component set. With the above structure, when the device is put into use, due to the correspondence and collaboration between the capacitor and the inductor, there is no impedance matching problem and the IEEE property is made better so as to greatly improve the operation characteristics thereof. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability are achieved. | 10-30-2014 |
20140320233 | NETWORK SIGNAL TRANSMISSION MATCH STRUCTURE USED IN ELECTRICAL CONNECTOR - A transmission match structure is arranged in an RJ connector and includes two substrates, a plurality of signal transmission sets and a plurality of signal transformers mounted to the substrates, and two coupling devices arranged between the substrates. The signal transmission sets are formed by respectively connecting in series a plurality of capacitors and inductors. The signal transformers includes a plurality of magnetic coils connected respectively in series with each of the capacitors and each of the inductors to form electrical connection. Each of the coupling devices is electrically connected, via each of the substrates, to each of the signal transmission sets and each of the signal transformers. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability can be achieved. | 10-30-2014 |
20140327492 | METHOD AND APPARATUS FOR ADAPTING A VARIABLE IMPEDANCE NETWORK - The present disclosure may include, for example, a tunable capacitor having a decoder for generating a plurality of control signals, and an array of tunable switched capacitors comprising a plurality of fixed capacitors coupled to a plurality of switches. The plurality of switches can be controlled by the plurality of control signals to manage a tunable range of reactance of the array of tunable switched capacitors. Additionally, the array of tunable switched capacitors is adapted to have non-uniform quality (Q) factors. Additional embodiments are disclosed. | 11-06-2014 |
20140368290 | VARIABLE INDUCTOR CIRCUIT AND HIGH FREQUENCY CIRCUIT - A first transistor and a second transistor cascade-connected, a wiring which connects a drain of the first transistor and a gate of the second transistor, a capacitor whose one terminal is connected between the first transistor and the second transistor cascade-connected and whose other terminal is grounded, and a control circuit are included. The control circuit adjusts an inductance value by controlling a capacitance value of the capacitor or gate voltage of the first transistor or the second transistor. | 12-18-2014 |
20150022281 | Capacitors Adapted for Acoustic Resonance Cancellation - An embodiment of the present invention provides a method, comprising reducing the losses due to electro-mechanical coupling and improving Q in a multilayered capacitor by placing a first capacitor layer adjacent at least one additional capacitor layer and sharing a common electrode in between the two such that the acoustic vibration of the first layer is coupled to an anti-phase acoustic vibration of the at least one additional layer. | 01-22-2015 |
20150070104 | COMPONENTS AND CIRCUITS FOR OUTPUT TERMINATION - A lossy electrical-signal transmission line having first and second ends, the transmission line being configured such that: its characteristic impedance at the first end has a first value; its characteristic impedance at the second end has a second value, lower than the first value; and its series resistance measured from its first end to its second end is within a given range of the difference between said first and second values. | 03-12-2015 |
20150070105 | SIGNAL OUTPUT DEVICE, COMMUNICATION SYSTEM, SIGNAL OUTPUT METHOD, AND COMMUNICATION METHOD - A signal output device, in a signal level non-transition period, matches an output impedance of an output section to a characteristic impedance of an output transmission path, and also matches the output impedance of the output section to the characteristic impedance of the output transmission path in a signal level transition period in a case in which a second bit of output-target data is a first value, and generates a mismatch between the output impedance of the output section and the characteristic impedance of the output transmission path in the signal level transition period in a case in which the second bit of the output-target data is a second value, so as to cause generation of a change in waveform in an output signal in the signal level transition period such that an absolute value of a signal level of the output signal exceeds a preset threshold value. | 03-12-2015 |
20150091666 | TRANSMISSION MODULE - As a capacitor Cj is connected in parallel to a non-reciprocal circuit | 04-02-2015 |
20150137906 | MATCHING SEGMENT CIRCUIT TO WHICH RADIO FREQUENCY IS APPLIED AND RADIO FREQUENCY INTEGRATED DEVICES USING THE MATCHING SEGMENT CIRCUIT - Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match. | 05-21-2015 |
20150293159 | MULTI-BAND IMPEDANCE DETECTOR - An impedance detector with improved multi transmission system and multi band behavior is provided. The impedance detector comprises a sensing circuit with an adjustable impedance. The sensing circuit is coupled to a signal path. Further, an evaluation circuit is coupled to the sensing circuit. | 10-15-2015 |
20150371762 | LAMINATED COIL COMPONENT AND MATCHING CIRCUIT - In a laminated coil component, first coil conductor patterns define a coil opening that generates a magnetic flux in a first direction, second coil conductor patterns define a first coil opening that generates a magnetic flux in the first direction, and a second coil opening that generates a magnetic flux in a second direction. A difference in area between the first coil opening and the second coil opening determines a degree of coupling of the coil defined by the first coil conductor pattern and the coil defined by the second coil conductor pattern. This provides a close proximal arrangement of a plurality of coils proximally while significantly reducing or preventing unnecessary coupling between the coils. | 12-24-2015 |
20160105157 | CIRCUITS AND METHODS FOR PROVIDING AN IMPEDANCE ADJUSTMENT - An apparatus includes a signal generator and a control circuit. The signal generator includes a control terminal and includes a current electrode coupled to a terminal that is configured to couple to a power line to receive direct current (DC) power from a power generator. The control circuit is coupled to the current electrode and the control terminal of the signal generator. The control circuit determines an impedance associated with the power generator and applies a control signal to the control terminal of the signal generator to produce an impedance adjustment signal on the current electrode for communication to the power generator through the power line in response determining the impedance. | 04-14-2016 |
20160126920 | OUTPUT MATCHING NETWORK HAVING A SINGLE COMBINED SERIES AND SHUNT CAPACITOR COMPONENT - A matching network requiring a predetermined shunt capacitance in a transformation of the impedance at the output to a transistor to a load. The matching network includes a vertically stacked shunt capacitor, for providing the entire predetermined capacitance, and a series DC blocking capacitor. | 05-05-2016 |
20160134260 | RF IMPEDANCE MATCHING NETWORK - A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array. | 05-12-2016 |
20160173057 | Method, System, and Apparatus for Resonator Circuits and Modulating Resonators | 06-16-2016 |
20160204757 | IMPEDANCE MATCHING METHOD AND IMPEDANCE MATCHING SYSTEM | 07-14-2016 |
20160380610 | VOLTAGE REDUCTION CIRCUIT - In one embodiment, the invention can be an impedance matching network including an input configured to operably couple to a radio frequency (RF) source; an output configured to operably couple to a load; a first variable capacitor; a second variable capacitor; and a third capacitor in series with the second variable capacitor and reducing a voltage on the second variable capacitor. | 12-29-2016 |
20180025829 | LAMINATED COIL COMPONENT AND MATCHING CIRCUIT | 01-25-2018 |
20180026000 | Integrated Passive Device for RF Power Amplifier Package | 01-25-2018 |
20190149135 | METHOD AND APPARATUS FOR SENSING ENVIRONMENTAL CONDITIONS | 05-16-2019 |