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Crystal

Subclass of:

331 - Oscillators

331154000 - ELECTROMECHANICAL RESONATOR

Patent class list (only not empty are listed)

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Class / Patent application numberDescriptionNumber of patent applications / Date published
331160000 With means to limit crystal current or voltage 5
20080211593Oscillation circuit - Provided is an oscillation circuit capable of obtaining a plurality of oscillation frequencies using a single oscillation resonator. The oscillation circuit includes the oscillation resonator, an oscillation inverter, a dumping resister connected between an output of the oscillation inverter and an output terminal, a feedback resistor connected with input and output of the oscillation inverter, and a feedback resistor switch for varying a feedback resistance value or an oscillation inverter switch for varying a mutual conductance value of the oscillation inverter. When the feedback resistance value or the mutual conductance value of the oscillation inverter is varied by the feedback resistor switch or the oscillation inverter switch, a frequency band of the oscillation circuit is adjusted to select a harmonic component of the oscillation resonator. Therefore, an oscillation frequency can be switched, so it is possible to obtain a plurality of oscillation frequencies using a single oscillation resonator.09-04-2008
20090079510INTEGRATED CIRCUIT AND RECEIVER OF A GLOBAL POSITIONING SYSTEM (GPS) - A Global positioning system and integrated circuit, and a method for starting an associated quartz oscillator with an oscillator circuit that has terminals for a quartz crystal in order to generate a reference signal, and with a status circuit connected to the oscillator circuit, wherein the status circuit has first means for producing a constant operating current of an operating state and a constant starting current of a starting state for the oscillator circuit, the status circuit has second means for producing a quantity dependent on the amplitude of the reference signal, the status circuit has a comparator for comparing the quantity to a switch-on threshold value, and the status circuit has a current switch that is connected to the comparator in such a manner that when the switch-on threshold is exceeded by the quantity, the current switch switches from the starting current to the operating current.03-26-2009
20090039972PULSE SHAPING CIRCUIT FOR CRYSTAL OSCILLATOR - A circuit arrangement and method utilize a variable threshold, multi-stage pulse shaping circuit to pulse shape a signal output by a crystal oscillator circuit. Each stage of the pulse shaping circuit includes a Schmitt trigger that drives an input of a latch, and that has a programmable trip point controlled to reject distorted pulses generated by the crystal oscillator circuit. A variable threshold, multi-stage pulse shaping circuit may be used, for example, to generate a clock signal for an electronic circuit that is more resistant to noise and other environmental effects, thereby reducing the likelihood of clock-related errors in the electronic circuit.02-12-2009
20100066458OSCILLATOR AND DRIVING CIRCUIT AND OSCILLATION METHOD THEREOF - An oscillator, a driving circuit and an oscillation method are provided. The driving circuit and a crystal are coupled in parallel to generate a clock signal. The driving circuit includes a buffer unit and a control unit. The buffer unit is coupled in parallel to the crystal, and used to amplify an oscillation signal outputted from the crystal to generate the clock signal. The control unit is coupled to the buffer unit, and used to generate a control signal to the buffer unit. The control unit determines a voltage level of the control signal by detecting whether the clock signal or the oscillation signal satisfies an oscillation condition of the crystal, so as to control a gain value of the buffer unit. Therefore, noise of different frequency bands loaded into the clock signal can be avoided.03-18-2010
20100271147LOW-POWER PIEZOELECTRIC AMPLIFIER AND METHOD THEREOF - The invention relates to a switched low-energy consumption amplifier for a piezoelectric element, which comprises: (a) an inductor, which together with the capacitance of said piezoelectric element forms an LC circuit; (b) a battery connected to said LC circuit; (c) a set of controlled switches capable of connecting and disconnecting circuit components at a rate which is significantly higher than the frequency of an input signal to said circuit; (d) a comparator for receiving an input signal, comparing a present voltage value of the input signal with a present voltage value over said piezoelectric element or a part, thereof, and conveying an indication regarding said comparison to a switching control unit; and (e) a switching control unit for receiving said indication from said comparator, and determining repeatedly every period P, which is significantly shorter than the period of the highest frequency included within said input signal, whether the piezoelectric element should be charged or discharged, and accordingly providing a control signal to each of said controlled switches with a certain duty cycle of P, thereby causing energy transfer from the piezoelectric element to the inductor and/or battery, or from the battery and/or inductor to the piezoelectric element, thereby retaining the energy within the amplifier circuit.10-28-2010
331163000 Crystal having three or more electrodes in circuit 3
20100301958Unit, oscillator having unit and electronic apparatus having oscillator - A unit comprising a quartz crystal resonator vibratable in a flexural mode and having a base portion including a length less than 0.5 mm, and first and second vibrational arms connected to the base portion, at least one groove being formed in each of two of opposite main surfaces of each of the first and second vibrational arms, and an electrode being disposed on a surface of the at least one groove formed in each of the two of the opposite main surfaces of each of the first and second vibrational arms so that the electrode disposed on the surface of the at least one groove formed in each of the two of the opposite main surfaces of the first vibrational arm has an electrical polarity opposite to an electrical polarity of the electrode disposed on the surface of the at least one groove formed in each of the two of the opposite main surfaces of the second vibrational arm.12-02-2010
20120139653SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND ELECTRONIC APPARATUS - A surface acoustic wave resonator which can realize favorable frequency-temperature characteristics and suppress frequency variations is provided. The surface acoustic wave resonator includes a quartz crystal substrate with Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, and 42.79°≦|Ψ|≦49.57°), and an IDT that is provided on the quartz crystal substrate, includes a plurality of electrode fingers, and excites a stop band upper end mode surface acoustic wave, wherein inter-electrode finger grooves are provided between the electrode fingers in a plan view, and wherein if a line occupation rate of convex portions of the quartz crystal substrate disposed between the inter-electrode finger grooves is ηg, and a line occupation rate of the electrode fingers disposed on the convex portions is ηe, η06-07-2012
20110221538Piezoelectric oscillator - To provide a technique capable of suppressing electric energy by a fundamental wave vibration and reducing phase noise in a piezoelectric oscillator using an overtone of a thickness shear vibration in a piezoelectric piece. An excitation electrode portion in an electrode 09-15-2011
331162000 Plural crystals in circuit 2
20100117750CRYSTAL OSCILLATOR WITH REDUCED ACCELERATION SENSITIVITY - A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.05-13-2010
20120223785CRYSTAL OSCILLATOR WITH REDUCED ACCELERATION SENSITIVITY - A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.09-06-2012
Entries
DocumentTitleDate
20090108949TEMPERATURE COMPENSATION FOR CRYSTAL OSCILLATORS - Methods and apparatus for generating a temperature compensated frequency estimate for a crystal oscillator, wherein the temperatures of the crystal and oscillator are both accounted for. A crystal temperature measurement is used to generate a first frequency component. The difference between the oscillator temperature measurement and a second temperature is scaled, and used to generate a second frequency component. The first and second frequency components may be summed to produce a frequency estimate for the crystal oscillator. In an embodiment, the computations may be performed in the slope domain.04-30-2009
20080309424Digital Tuning of Crystal Oscillators - Embodiments feature techniques and systems for digitally tuning a crystal oscillator circuit. In one aspect, embodiments feature a method for making a digitally tuned crystal oscillator circuit. The method involves receiving a multi-bit input signal into a digital modulator, modulating the multi-bit input signal with the digital modulator by oversampling or by noiseshaping and oversampling to produce a digitally-modulated output signal having a lower number of bits than the multi-bit input signal. The method also involves coupling a tuning capacitor with the crystal oscillator circuit, and coupling the digitally-modulated output signal from the digital modulator to the crystal oscillator circuit and the tuning capacitor. In some embodiments, the digital modulator can a delta-sigma modulator, a noiseshaping modulator, a delta modulator, a pulse width modulator, a differential modulator, or a continuous-slope delta modulator.12-18-2008
20110193647METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrating reed from a wafer, the piezoelectric vibrating reed including a pair of vibration arm portions that is arranged in parallel, a base portion that integrally fixes proximal end sides of the pair of vibration arm portions, and groove portions which are formed on both surfaces of the pair of vibration arm portions along the longitudinal direction of the vibration arm portions, respectively, the method including a protective film forming process of forming a protective film in an area other than a position corresponding to the groove portions in the wafer; and a groove portion forming process of forming the groove portions by using the protective film as a mask to perform dry etching with respect to the wafer, wherein, in the protective film forming process, a first protective film forming process of forming the protective film of a predetermined thickness with respect to a first surface of the wafer and a second protective film forming process of forming the protective film of a predetermined thickness with respect to a second surface of the wafer are alternatively performed several times.08-11-2011
20110193646PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.08-11-2011
20110193645PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode formed between a mounting portion of a base substrate and a first through-electrode is formed in a peripheral region so as not to overlap with first and second excitation electrodes formed on outer surfaces of a piezoelectric vibrating reed for driving, thereby reducing the resistance of the first lead-out electrode.08-11-2011
20110193643METHOD OF MANUFACTURING PACKAGE AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - Provided is a method of manufacturing a package capable of providing a plurality of through-electrodes in a base substrate made of a glass material with high position precision. An electrode member having a plurality of pins erected on a base is prepared, the plurality of pins is inserted into a plurality of through-holes of a glass substrate provided with the plurality of through-holes, the resultant is heated to a temperature higher than the softening point of the glass substrate to weld the corresponding through-holes and the pins to each other, the glass substrate is ground after cooling to remove the base, and the pins are exposed from both surfaces of the glass substrate, thereby forming through-electrodes which are electrically separated from each other.08-11-2011
20110193642PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a conductor film is formed from a bonding member on a bonding surface where the base substrate and a lid substrate are bonded to each other, the first lead-out electrode and the conductor film are electrically connected to each other via the first connection portion in the vicinity of the mounting portion and via the second connection portion in the vicinity of the first through-electrode, thereby reducing the resistance of the first lead-out electrode.08-11-2011
20130043960RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING VEHICLE, AND METHOD OF MANUFACTURING RESONATING ELEMENT - A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion.02-21-2013
20130043959RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A piezoelectric resonating element includes a piezoelectric substrate that includes a rectangular vibrating section and a thick section integrally formed with the vibrating section, excitation electrodes, and lead electrodes. The thick section includes a first thick section and a second thick section of which one end is formed continuous to the first thick section. The first thick section includes a first inclined section of which the thickness changes and a first thick section main body of a quadrangle column shape, and at least one slit is provided in the first thick section.02-21-2013
20130082792PIEZOELECTRIC VIBRATION REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC INSTRUMENT, AND RADIO TIMEPIECE - A piezoelectric vibration reed includes a pair of vibrating arm portions arranged in parallel to each other and a base portion. The base portion is integrally coupled to proximal ends of the pair of the vibrating arm portions in a longitudinal direction that the vibrating arm portions extend. The base portion includes a connecting portion, a mount portion, and a narrow portion between the connecting portion and the mount portion. The base portion further includes a pair of notched portions notched respectively inwardly from both sides of the base portion in the width direction and ribs projecting outwardly in the width direction of the base portion and arranged in the interiors of the notched portions.04-04-2013
20130082791OSCILLATION DEVICE - There are disclosed a constant voltage circuit which can realize a low consumption current, and a crystal oscillation circuit using the constant voltage circuit. When the constant voltage circuit is provided with a temperature characteristic regulation element, it is possible to minimize a difference between a negative tilt of a constant voltage to a temperature change and a negative tilt of the smallest operation voltage that can oscillate in the crystal oscillation circuit to the temperature change, so that the consumption current of the crystal oscillation circuit can be decreased. Furthermore, when a constant current generated by the constant voltage circuit is decreased, the consumption current of the constant voltage circuit can be decreased, and the consumption current of the whole oscillation device can be decreased.04-04-2013
20100127787VOLTAGE CONTROL TYPE TEMPERATURE COMPENSATION PIEZOELECTRIC OSCILLATOR - A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit.05-27-2010
20130076452OSCILLATOR CIRCUIT, OSCILLATOR, ELECTRONIC APPARATUS, AND ACTIVATION METHOD OF OSCILLATOR CIRCUIT - An oscillator circuit includes a resonator (SAW resonator), an amplifier circuit, and a switching element (NMOS switch). The amplifier circuit has a feedback path from one end to the other end of the resonator, a first inductance element (elongated coil) provided in the feedback path, and a variable capacitance element (variable capacitance diode) provided in the feedback path in series with the first inductance element. The switching element is provided in parallel to a circuit part including the first inductance element and the variable capacitance element.03-28-2013
20100045393Crystal oscillator - A crystal oscillator is provided to secure a space for housing the IC and electronic components, even if the vibrator is small in size. In this crystal oscillator, there is not a hindrance to the wire connections between the IC and the electronic components, and the limitation on the vibrator and oscillator design is reduced. Also, the influence of the heat from the IC and the electronic components is made smaller. Thus, desired characteristics can be readily achieved with this crystal oscillator. In this crystal oscillator, the IC and the electronic components are housed in a concave portion formed in the ceramic package. A pedestal formed with a crystal plate made of the same material as the vibrator is provided to cover almost the entire opening of the concave portion, and the vibrator is placed on the pedestal.02-25-2010
20130038400TEMPERATURE-COMPENSATED CRYSTAL OSCILLATOR - A temperature-compensated crystal oscillator includes a crystal resonator; and an oscillator circuit for performing temperature compensation. The oscillator circuit has a temperature sensor unit that measures an ambient temperature of the crystal resonator, a temperature compensation unit that outputs a first voltage for temperature compensation based on the measured temperature, a high-temperature load capacitance adjustment unit that outputs a second voltage for temperature compensation based on the temperature measured in a high temperature area exceeding a particular temperature range, an oscillator unit having first and second variable capacitance elements used for temperature compensation within a particular temperature range, third and fourth variable capacitance elements used for temperature compensation in the high temperature area, and an oscillation integrated circuit (IC) connected to the crystal resonator to perform an oscillation operation, and a buffer that amplifies the output from the oscillator unit.02-14-2013
20090039971METHOD OF FABRICATING HERMETIC TERMINAL AND HERMETIC TERMINAL, METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATOR, OSCILLATOR, ELECTRONIC APPLIANCE, AND RADIO CLOCK - A method of fabricating a hermetic terminal includes: joining and firing wherein a bar-shaped member to be a lead is inserted into a ring, and they are fired to form a hermetic terminal intermediate having the bar-shaped member fixed in the ring; flattening wherein an end part of the bar-shaped member to be the inner lead portion of the lead is flattened to form a stair portion; and shaping wherein an end part of the stair portion is cut to shape the stair portion into a predetermined shape, wherein in the joining and firing step, a solid round bar longer than the lead is used as the bar-shaped member, and one end side of the bar-shaped member to be the inner lead portion is inserted into the ring so that the one end side is longer than the inner lead portion in the hermetic terminal as a completed product.02-12-2009
20130027147SURFACE ACOUSTIC WAVE RESONATOR AND SURFACE ACOUSTIC WAVE OSCILLATOR - A surface acoustic wave resonator includes: an IDT which is disposed on a quartz crystal substrate with an Euler angle of (−1.5°≦φ≦1.5°, 117°≦θ≦142°, 41.9°≦|ψ|≦49.57°) and which excites a surface acoustic wave in an upper mode of a stop band; and an inter-electrode-finger groove formed by recessing the quartz crystal substrate between electrode fingers of the IDT, wherein the following expression:01-31-2013
20090302961RESONANT ACTUATOR - A piezoelectric ceramic base member is formed of a bismuth layer compound to have a bar shape. Main electrodes and are provided on two end surfaces of the piezoelectric ceramic base member in an oscillation direction, and connection electrodes are formed at side-surface central portions of the piezoelectric ceramic base member and are electrically connected to the main electrodes through extraction conductors interposed therebetween, respectively. In addition, the oscillation and polarization directions are set in the same direction, and the piezoelectric ceramic base member is driven at a resonant frequency or at a frequency in the vicinity thereof. In the piezoelectric ceramic base member, the crystal c axis is preferably oriented in a direction orthogonal to the polarization direction. Accordingly, a resonant actuator can be realized which is able to obtain a high oscillation speed since having a large mechanical quality factor Qm, and the oscillation of which is not disturbed by mechanical factors.12-10-2009
20130057355PIEZOELECTRIC VIBRATION DEVICE AND OSCILLATOR - A piezoelectric vibration device is provided that can reduce the stress and strain that transmit through a base substrate. The piezoelectric vibration device includes a piezoelectric vibrating reed that oscillates in an AT mode, and that includes excitation electrodes respectively formed on the front and back surfaces of the reed. One of the excitation electrodes is connected to the base substrate via a metal bump on a center line passing across the shorter sides of the piezoelectric vibrating reed and in the vicinity of one of the shorter sides of the piezoelectric vibrating reed. The other excitation electrode is connected to the base substrate via a metal bump on the same side as the above shorter side, and in the vicinity of a portion where the shorter side of the piezoelectric vibrating reed crosses one of the longer sides of the piezoelectric vibrating reed.03-07-2013
20120223784VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC APPARATUS - A quartz crystal vibrator element having the weight section is provided with the intermediate weight section formed to have an arm width W09-06-2012
20120235761SURFACE MOUNTED CRYSTAL OSCILLATOR - A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.09-20-2012
20080266009Ultra-low power crystal oscillator - An ultra-low power crystal oscillator architecture that draws less than 2 μA during steady state operation. An amplifier stage is self biased and has input and output clamp circuits that limit its signal swing. Circuit values are selected such that there is sufficient transient load current for the first amplifier stage to oscillate, while at the same time the input and output clamp circuits maintain a sufficiently low swing of the stage such that the steady state average load current is on the order of less than 1 μA.10-30-2008
20110298555VIBRATOR ELEMENT, VIBRATOR, VIBRATION DEVICE, ELECTRONIC APPARATUS, AND FREQUENCY ADJUSTMENT METHOD - A vibrator element includes: a base section formed on a plane including a first direction and a second direction perpendicular to the first direction; and a vibrating arm extending from the base section in the first direction, wherein the vibrating arm flexurally vibrates in a normal direction of the plane, and has a first surface one of compressed and extended due to the flexural vibration and a second surface one of extended when the first surface is compressed and compressed when the first surface is extended, the first surface is provided with a first mass section, and the second surface is provided with a second mass section, and at least one of the first mass section and the second mass section has a portion, which fails to be opposed to the other of the first mass section and the second mass section in a plan view in the normal direction.12-08-2011
20110037527FAST START-UP CRYSTAL OSCILLATOR - An exemplary fast start-up crystal oscillator with reduced start-up time. The exemplary oscillator reduces the start-up time (i.e., the time taken to attain sustained stable oscillations after the power is turned on) by increasing the negative resistance of a circuit. Increasing the negative resistance increases the rate of growth of the oscillations, thereby reducing start-up time. The exemplary crystal oscillator includes a gain stage with negative resistance. A crystal with shunt capacitance is placed in the feedback loop of the gain stage. A buffer is coupled to the gain stage such that it blocks the crystal shunt capacitance from loading the gain stage, effectively increasing the negative resistance of the gain stage. Further, an oscillation detection and control circuit is coupled between the crystal and the gain stage. The oscillation detection and control circuit connects the buffer during start-up, and disconnects the buffer once an oscillation signal attains sustained stable oscillations.02-17-2011
20120098609Crystal Oscillator With Low-Power Mode - Circuits having corresponding methods and computer-readable media comprise: an amplifier; a crystal port configured to be electrically coupled to a crystal, wherein a first terminal of the crystal port is electrically coupled to an input of the amplifier, and wherein a second terminal of the crystal port is electrically coupled to an output of the amplifier; a first capacitor, wherein a first terminal of the first capacitor is electrically coupled to ground; a second capacitor, wherein a first terminal of the second capacitor is electrically coupled to ground; a first switch configured to selectively electrically couple the input of the amplifier to a second terminal of the first capacitor; and a second switch configured to selectively electrically couple the output of the amplifier to a second terminal of the second capacitor.04-26-2012
20090189705Crystal oscillator for surface mounting - A crystal oscillator includes an oscillator circuit, a main body, a first switching circuit, a second switching circuit, and a voltage detecting circuit. The oscillator circuit includes an IC chip including an output circuit and a function circuit. The crystal element includes a first excitation electrode and a second excitation electrode. The main body houses the oscillator circuit and the crystal element and includes a power supply terminal, a ground terminal, an output terminal, and a function terminal. The output terminal is electrically connected to the output circuit and the first excitation electrode via the first switching circuit. The function terminal is electrically connected to the function circuit and the second excitation electrode via the second switching circuit. The first switching circuit and the second switching circuit are operated on the basis of a switching signal from the voltage detecting circuit connected to the power supply terminal.07-30-2009
20110193644PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a second lead-out electrode is formed on a surface of a lid substrate on the base substrate side, the first and second lead-out electrodes are electrically connected to the first and second connection portions in the vicinities of the mounting portion and the first through-electrode, respectively, thereby reducing the resistance of the lead-out electrode.08-11-2011
20120139652VIBRATION DEVICE, OSCILLATOR, AND ELECTRONIC APPARATUS - A vibration device includes: a first vibrator having a 3rd-order function temperature characteristic in which a 3rd-order temperature coefficient is −γ06-07-2012
20110260803CRYSTAL OSCILLATOR CLOCK CIRCUIT - A crystal oscillator clock circuit which facilitates switching its output between an internally generated clock signal and an externally generated clock signal. A feedback loop detects the presence of an externally generated clock signal applied to an output pin of a crystal oscillator circuit and powers down the internally generated clock signal. As a result, the crystal oscillator clock circuit simply passes the externally generated clock signal as its output signal.10-27-2011
20110063041RESONATOR ELEMENT, RESONATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A resonator element includes: a base portion; and a resonating arm extending in a first direction from the base portion, wherein the resonating arm includes a first surface, a second surface facing the first surface, a first side surface extending in the first direction so as to connect the first and second surfaces, and a second side surface facing the first side surface, wherein the resonating arm includes a first width portion having a first width and a second width portion provided at a root of the resonating arm so as to have a second width larger than the first width, wherein the resonating arm includes a groove portion provided on at least one of the first and second surfaces so as to extend in the first direction, the groove portion in the second width portion having a width larger than a width of the groove portion in the first width portion, and wherein a sum of the width between the groove portion in the second width portion and the first side surface and the width between the groove portion in the second width portion and the second side surface is smaller than a sum of the width between the groove portion in the first width portion and the first side surface and the width between the groove portion in the first width portion and the second side surface.03-17-2011
20090212878Oven-controlled crystal oscillator - An oven-controlled crystal oscillator includes a circuit board, a crystal unit surface-mounted on the circuit board, and a temperature control circuit that maintains operating temperature of the crystal unit constant. The temperature control circuit includes a heating resistor, a power transistor that supplies power to a heating resistor, and a temperature sensitive resistor that detects temperature of the crystal unit. The heating resistor is formed, as a film resistor, on a surface of the circuit board in an area thereof in which the crystal unit is located. The temperature sensitive resistor is provided on the circuit board as a film resistor.08-27-2009
20100123524OSCILLATOR - An oscillator that includes a movable element formed of silicon, the movable element vibrating by electrostatic force, a stationary element supporting the movable element, a temperature detector located in contact with the stationary element, the temperature detector detecting the temperature of the stationary element, a supporting element joined to a joint surface between the movable element and the stationary element, the supporting element supporting the movable element, the stationary element, and the temperature detector on a surface opposite to the joint surface, a surrounding element contacted with the supporting element, the surrounding element and the supporting element surround the movable element, and electrodes provided on a surface of the surrounding element opposite to a surface of surrounding element contacted with the supporting element.05-20-2010
20110199163SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - In a surface acoustic wave resonator in which an IDT having electrode fingers for exciting surface acoustic waves is formed on a crystal substrate, the line occupying ratio causing the maximum electromechanical coupling coefficient and the line occupying ratio causing the maximum reflection of the surface acoustic waves in the IDT are different from each other, the center of the IDT has the line occupying ratio causing an increase in electromechanical coupling coefficient in comparison with the edges of the IDT, and the edges of the IDT have the line occupying ratio causing an increase in reflection of the surface acoustic waves in comparison with the center of the IDT.08-18-2011
20110199161Voltage controlled oscillator - A voltage controlled oscillator (VCO) securing a wide range of variable amount of oscillatory frequency is provided. In the VCO, a resistor R08-18-2011
20110169584PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND ATOMIC TIMEPIECE - To provide a piezoelectric vibrator manufacturing method that curbs a dispersion of a bonding film at a time of a gettering step and with which good electrical characteristics can be obtained, and an oscillator, electronic device, and atomic timepiece, in which is mounted a piezoelectric vibrator with which good electrical characteristics can be obtained. A manufacturing method includes a gettering step whereby a getter material is irradiated with a first laser penetrating a base substrate from the outer side of the base substrate, activating the getter material so that it adsorbs gas existing inside a cavity, and a frequency adjustment step whereby a weight metal film formed at leading ends of vibrating arms of a piezoelectric vibrating piece is irradiated with a second laser penetrating the base substrate from the outer side of the base substrate, thus adjusting the frequency of the piezoelectric vibrating piece, wherein the intensity of the first laser in the gettering step is weaker than the intensity of the second laser in the frequency adjustment step.07-14-2011
20110215879PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity. The method includes: a bonding film forming step of forming a bonding film on at least one of the first substrate and the second substrate using a low-melting-point glass so as to bond the two substrates; a mounting step of electrically connecting the piezoelectric vibrating reed to the extraction electrodes formed on the first substrate; and a bonding step of superimposing the first substrate and the second substrate onto each other with the bonding film disposed therebetween while heating the bonding film to a predetermined bonding temperature to thereby bond the two substrates by the bonding film.09-08-2011
20090261915Crystal Device for Surface Mounting - There is provided a crystal device in which an area inside a ceramic case is made larger to increase the design freedom of a crystal unit (crystal element).10-22-2009
20090261914CRYSTAL OSCILLATOR CIRCUITS - An oscillator circuit. A gain stage element is coupled between both terminals of the crystal. The gain stage element provides a transconductance for oscillation according to a current provided by a current source, and outputs a periodic signal through an output terminal. A bias element is coupled between an input terminal and the output terminal of the gain stage element to bias the gain stage element. A first capacitor is coupled to the input terminal of the gain stage element. A second capacitor is coupled to the output terminal of the gain stage element. A controller detects the periodic signal, and adjusts the current when the periodic signal is obtained.10-22-2009
20110204986METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity by suppressing the occurrence of voids in a baked glass, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. The package manufacturing method includes a second glass frit filling step of filling a second glass frit in a penetration hole to be overlapped on a first glass frit and temporarily drying the second glass frit; and a baking step of baking and curing the first and second glass frits filled in the penetration hole. The second particle size of the second glass particles contained in the second glass frit is larger than the first particle size of the first glass particles contained in the first glass frit.08-25-2011
20110199162PACKAGE, METHOD OF MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate.08-18-2011
20080284535Two-level mounting board and crystal oscillator using the same - The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.11-20-2008
20080238561PIEZOELECTRIC OSCILLATOR - For a piezoelectric oscillator according to the present invention, an oscillator circuit includes: a piezoelectric vibrator; an NMOS transistor and a PMOS transistor that constitute an amplifier connected in parallel to the piezoelectric vibrator; and load capacitors connected in parallel to the piezoelectric vibrator. The gate terminals of the NMOS transistor and the PMOS transistor, which are constituents of the amplifier, are connected by a DC cut capacitor, and the gate terminal of the NMOS transistor and the output terminal of the amplifier are connected by a feedback resistor. An arbitrary bias voltage, to be applied to the gate terminal of the PMOS transistor via a high-frequency elimination resistor, is generated by a circuit provided by a diode-connected, second PMOS transistor.10-02-2008
20080258829Integrated quartz oscillator on an active electronic susbtrate - An oscillator having a quartz resonator, and a base wafer containing active electronics, wherein the quartz resonator is bonded directly to the base wafer and subsequently hermetically capped.10-23-2008
20110140796PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material.06-16-2011
20110140794PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator including a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel, a pair of excitation electrodes that vibrate the pair of vibration arm portions, and a mount electrode that is electrically connected to the pair of excitation electrodes, the piezoelectric vibrating reed being mounted on the base substrate within the cavity via the mount electrode; an insulation film which is formed on the piezoelectric vibrating reed so as to cover the excitation electrodes; and a getter material formed of the metallic material that is formed on any of the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated.06-16-2011
20110140793PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes 06-16-2011
20120105165SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE DEVICE - A surface acoustic wave resonator includes a piezoelectric substrate and an interdigital transducer (IDT) that includes electrode fingers exciting a surface acoustic wave on the piezoelectric substrate, a first region at a center of the IDT, and a second region and a third region at opposite sides of the IDT. In the IDT, a line occupation rate at which an electromechanical coupling coefficient becomes a maximum is different from the line occupation rate at which reflection of the surface acoustic wave becomes a maximum.05-03-2012
20120194284OSCILLATION CIRCUIT HAVING SHIELD WIRE, AND ELECTRONIC APPARATUS - There is provided an oscillation circuit including a crystal vibrator that is connected between input and output terminals of a CMOS inverter making up the oscillation circuit; an input wiring line that includes a crystal vibrator-side input terminal connected to an input terminal pad of the CMOS inverter; an output wiring line that includes a crystal vibrator-side output terminal connected to an output terminal pad of the CMOS inverter; a ground power source wiring line that includes a crystal vibrator-side ground power source terminal; and a capacitative element that is connected between the input wiring line and the ground power source wiring line, and between the output wiring line and the ground power source wiring line, wherein the ground power source wiring line is disposed at least a part of between the input wiring line and the output wiring line.08-02-2012
20120194285VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base portion; and three vibrating arms that extend from the base portion in the Y axis direction. The vibrating arms are arranged in the X axis direction, include excitation electrodes on a principal face, and vibrate in the Z axis direction . When an arm width of the vibrating arm, which is located at the center of the arrangement, in the X axis direction is W1, each arm width of the other vibrating arms in the X axis direction is W, an electrode width of the excitation electrode of the vibrating arm, which is located at the center of the arrangement, in the X axis direction is Al, and each electrode width of the excitation electrodes of the other vibrating arms in the X axis direction is A, 1.3508-02-2012
20100237959LAMB-WAVE RESONATOR AND OSCILLATOR - A Lamb-wave resonator includes: a piezoelectric substrate; an IDT electrode disposed on one principal surface of the piezoelectric substrate, having bus bar electrodes each connecting one ends of a plurality of electrode finger elements, the other ends of the plurality of electrode finger elements being interdigitated with each other to form an apposition area; and a pair of reflectors disposed on the one principal surface of the piezoelectric substrate, and respectively arranged on both sides of the IDT electrode in a propagation direction of a Lamb wave, wherein denoting a thickness of the piezoelectric substrate in the apposition area of the electrode finger elements as ti, a thickness of the piezoelectric substrate in areas between respective ends of the apposition area in a direction perpendicular to the propagation direction of the Lamb wave and the bus bar electrodes as tg, and a wavelength of the Lamb wave as λ, the thickness ti exists in a range represented by 009-23-2010
20090322437SYSTEM, METHOD AND APPARATUS EMPLOYING CRYSTAL OSCILLATOR - In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die. In some embodiments, a method includes providing a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; mounting an integrated circuit die to one of the outer surfaces, mounting a crystal oscillator to one of the outer surfaces; and electrically connecting the crystal oscillator to the integrated circuit die.12-31-2009
20090039970Crystal Oscillator Frequency Tuning Circuit - Embodiments feature techniques and systems for analog and digital tuning of crystal oscillators. In one aspect, some implementations feature a method for tuning a frequency of a crystal oscillator that can include adjusting the tuning frequency of the crystal oscillator from a nominal frequency via a switched-capacitor frequency tuning circuit, the switched-capacitor frequency tuning circuit can have switchable sections to adjust the tuning of the crystal oscillator. The method can include controlling an analog control input that is coupled to a varactor within each of the switchable sections, where each of the switchable sections can include a fixed capacitor in series with the varactor and a switch. The method can involve controlling a digital control input, where the digital control input can electrically connect or disconnect one or more of the switchable sections from the crystal. There can be independent control between the digital and analog tuning mechanisms.02-12-2009
20130141179OSCILLATING DEVICE FOR FREQUENCY DETECTION, ULTRASONIC TRANSCEIVER SYSTEM AND FREQUENCY DETECTION METHOD THEREOF - The present invention discloses an oscillating device for frequency detection, an ultrasonic transceiver system and a frequency detection method thereof. The oscillating device for frequency detection, which is applicable for detecting a transducer having a lowest impedance frequency and a highest impedance frequency, comprises an oscillating circuit. The oscillating circuit has a loop gain whose maximum value occurs at the lowest impedance frequency of the transducer and whose minimum value occurs at the highest impedance frequency of the transducer, wherein a difference of a phase of the loop gain and an impedance phase of the transducer is zero between the lowest impedance frequency and the highest impedance frequency, and the loop gain is of a value greater than 1 at a frequency where the phase difference is zero.06-06-2013
20110018649ELECTRICAL RESONATOR DEVICE WITH A WIDE FREQUENCY VARIATION RANGE - An electrical resonator device, capable of operating at variable frequency ω, including: an acoustic wave resonator, a first electrical circuit coupled in parallel to the resonator with an adjustable complex impedance whose imaginary part is equal to01-27-2011
20110043295Semiconductor device having an ESD protection circuit - A semiconductor integrated circuit, includes an operational amplifier including a first input terminal, a second input terminal, and an output terminal, a first transistor which has a source-drain route connected between an external terminal and a first voltage, and a gate terminal connected to the output terminal of the operational amplifier; and a second transistor which has a source-drain route connected between the first input terminal of the operational amplifier and the first voltage, and a gate terminal connected to the output terminal of the operational amplifier.02-24-2011
20120242420RESONANT FREQUENCY ADJUSTABLE OSCILLATION CIRCUIT - An oscillation circuit includes a parallel resonant quartz crystal oscillator and a variable capacitor which are connected with each other in parallel. In addition, the oscillation circuit can further include a first variable resistor and a second variable resistor. The first resistor is connected to the quartz crystal oscillator in parallel. The second resistor is connected to the variable capacitor in series first and then connected to the quartz crystal oscillator in parallel.09-27-2012
20110241792PACKAGE, PIEZOELECTRIC VIBRATOR AND PIEZOELECTRIC OSCILLATOR - A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other.10-06-2011
20110241791OSCILLATING SIGNAL GENERATING DEVICE AND RELATED METHOD - An oscillating signal generating device includes an oscillating circuit and a control circuit. The oscillating circuit includes: a resonator having a first terminal and a second terminal for generating an oscillating signal, a resistive element having a first terminal coupled to the first terminal of the resonator, and a second terminal coupled to the second terminal of the resonator, and an oscillating start-up circuit having an input terminal coupled to the first terminal of the resonator and an output terminal coupled to the second terminal of the resonator. The control circuit generates a control signal to change the oscillating start-up circuit into a disable mode from an enable mode when the oscillating circuit generates an oscillating output signal under an operation mode, and outputs the oscillating signal generated by the resonator as the oscillating output signal of the oscillating circuit.10-06-2011
20110210802HBAR Resonator with a High Level of Integration - The invention relates to a resonator of the high bulk acoustic resonator HBAR type, for operating at a pre-determined working frequency, comprising: a piezoelectric transducer (09-01-2011
20110074516PIEZOELECTRIC CERAMIC COMPOSITION, PIEZOELECTRIC CERAMIC, PIEZOELECTRIC ELEMENT, AND OSCILLATOR - A piezoelectric ceramic composition is provided which contains Perovskite oxides expressed by General Formula 1 below and an aluminum compound, and in which the content ratio of the aluminum compound to the Perovskite oxides is from 1% by mass to 11% by mass,03-31-2011
20110074517Hybrid system having a non-MEMS device and a MEMS device - A hybrid system having a non-MEMS device and a MEMS device is described. The apparatus includes a non-MEMS device and an integrated circuit including a MEMS device, the integrated circuit formed on a substrate. The integrated circuit includes a control circuit for the non-MEMS device and a MEMS control circuit for the MEMS device.03-31-2011
20120146737MULTIPLE-OUTPUT CLOCK SOURCE SIGNAL GENERATOR - A multiple-output clock source signal generator for use with a fiber-optic communication apparatus for multi-dwelling units (MDU) includes a piezoelectric crystal, an input capacitor, an output capacitor, and a buffer unit having output ends. The piezoelectric crystal, the input capacitor, and the output capacitor are connected to the buffer unit so as to form a feedback circuit whereby the piezoelectric crystal oscillates and generates clock source signals to be output from the output ends, respectively. The multiple-output clock source signal generator is advantageously characterized by low costs and multiple output.06-14-2012
20110068876VIBRATING REED, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrating reed includes: a base; at least one vibrating arm extending from the base; at least one support arm extending from the base, and at least a part of which extends in parallel to the vibrating arm; and at least one receiving section formed of a part of the support arm, the part extending to have a shape of a projection so that a distance from the vibrating arm is reduced.03-24-2011
20090027133Crystal oscillator with variable-gain and variable-output-impedance inverter system - A crystal oscillator with variable gain and variable output impedance inverter system includes an inverter, a variable impedance feedback circuit, connected between the output and input of the inverter, a crystal oscillator system, having a crystal with first and second electrodes connected across the input and output of the inverter; a serial variable impedance circuit connected between the inverter output and an electrode of the crystal and a control circuit for temporarily, during start up mode, increasing the impedance of the feedback circuit and decreasing the impedance of the serial circuit relative to the stationary mode impedances and then returning the feedback impedance to the lower impedance level and the serial circuit to the higher impedance level that promotes high frequency stability of the oscillator in the normal, stationary mode, of operation.01-29-2009
20120200366OSCILLATOR - An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.08-09-2012
20110187471PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion.08-04-2011
20100277251OSCILLATOR, OSCILLATOR ARRAY AND AN ELECTRONIC APPARATUS - A oscillator include: a vibrator that vibrates in a thickness shear vibration mode; a first adsorption film formed in a first region in a first surface of the vibrator; a second adsorption film formed in a second region in a second surface of the vibrator opposing to the first surface; and a substrate with a surface on which the vibrator is erected, wherein the vibrator contacts the substrate in a third surface that is different from the first surface and the second surface.11-04-2010
20110133848Thin-Film Piezoelectric-on-Insulator Resonators Having Perforated Resonator Bodies Therein - A micro-electromechanical resonator self-compensates for process-induced dimensional variations by using a resonator body having a plurality of perforations therein. These perforations may be spaced along a longitudinal axis of the resonator body, which extends orthogonal to a nodal line of the resonator body. These perforations, which may be square or similarly-shaped polygonal slots, may extend partially or entirely though the resonator body and may be defined by the same processes that are used to define the outer dimensions (e.g., length, width) of the resonator body.06-09-2011
20110095835Hybrid system having a non-mems device and a mems device - A hybrid system having a non-MEMS device and a MEMS device is described. The apparatus includes a non-MEMS device and an integrated circuit including a MEMS device, the integrated circuit formed on a substrate. The integrated circuit includes a control circuit for the non-MEMS device and a MEMS control circuit for the MEMS device.04-28-2011
20110095834Dual table temperature compensated voltage controlled crystal oscillator system and method - Dual table temperature compensation for a voltage controlled crystal oscillator is achieved by sensing the temperature of the voltage controlled crystal oscillator (VCXO), retrieving from a first table the frequency error with variations in the temperature sensed, retrieving from a second table the oscillator control voltage corresponding to the frequency error from the first table and applying the oscillator control voltage to the VCXO.04-28-2011
20120098611INTEGRATED ACOUSTIC BANDGAP DEVICES FOR ENERGY CONFINEMENT AND METHODS OF FABRICATING SAME - The present invention is directed to monolithic integrated circuits incorporating an oscillator element that is particularly suited for use in timing applications. The oscillator element includes a resonator element having a piezoelectric material disposed between a pair of electrodes. The oscillator element also includes an acoustic confinement structure that may be disposed on either side of the resonator element. The acoustic confinement element includes alternating sets of low and high acoustic impedance materials. A temperature compensation layer may be disposed between the piezoelectric material and at least one of the electrodes. The oscillator element is monolithically integrated with an integrated circuit element through an interconnection. The oscillator element and the integrated circuit element may be fabricated sequentially or concurrently.04-26-2012
20120098610OVEN-CONTROLLED CRYSTAL OSCILLATOR AND MANUFACTURING METHOD OF THE SAME - Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.04-26-2012
20110148539PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; an external electrode that is formed on a lower surface of the base substrate; an internal electrode that is formed on an upper surface of the base substrate so as to be accommodated in the cavity; a through electrode which is formed so as to pass through the base substrate and electrically connect the external electrode with the internal electrode; a piezoelectric vibrating reed which is accommodated in the cavity in a state of being electrically connected to the internal electrode; and a getter material that is formed in the cavity, the getter material being formed of chromium or a metallic material consisting of chromium as a main ingredient.06-23-2011
20120146738PIEZOELECTRIC OSCILLATOR - Provided is a piezoelectric oscillator which can easily perform adjustment of oscillation frequency at a low cost and which can restrain frequency changes due to power supply voltage variations. The piezoelectric oscillator includes a frequency adjustment circuit and an oscillator circuit and is configured such that: a cathode of a variable-capacitance diode D06-14-2012
20110304406QUARTZ CRYSTAL RESONATOR ELEMENT, QUARTZ CRYSTAL DEVICE, AND METHOD FOR PRODUCING QUARTZ CRYSTAL RESONATOR ELEMENT - A quartz crystal resonator element includes an AT-cut quartz crystal substrate, the substrate having edges parallel to each of a Z″ axis obtained by rotating a Z′ axis in a range of −120° to +60° about a Y′ axis and an X′ axis perpendicular to the Z″ axis when an angle formed by rotating a +Z′ axis in a direction of a +X axis about the Y′ axis is a positive rotation angle; a thin section that forms a resonating section; and a thick section adjacent to the resonating section, the thin section and the thick section being formed on the quartz crystal substrate by wet etching. The thin section is formed either on a main surface of the substrate corresponding to a +Y′-axis side or on a main surface of the substrate corresponding to a −Y′-axis side. When the thin section is formed by the etching on the main surface of the +Y′-axis side, the thick section is provided at least a +Z″-axis-side end of the thin section, whereas when the thin section is formed by the etching on the main surface of the −Y′-axis side, the thick section is provided at least a −Z″-axis-side end of the thin section.12-15-2011
20110304405MEMS RESONATORS - A crystalline semiconductor resonator device comprises two matched resonators which are aligned differently with respect to the crystal structure of the crystalline semiconductor. The resonators each comprise a portion of a material having a different temperature dependency of the Young's modulus to the temperature dependency of the Young's modulus of the crystalline semiconductor material. In this way, the suspension springs for the resonators have different properties, which influence the resonant frequency. The resonant frequency ratios between the first and second resonators at a calibration temperature and an operation temperature are measured. A frequency of one (or both) of the resonators at the operation temperature can then be derived which takes into account the temperature dependency of the one of the resonators.12-15-2011
20120044025ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.02-23-2012
20110156831BENDING VIBRATION PIECE, VIBRATION DEVICE, AND ELECTRONIC APPARATUS - A flexural mode resonator element includes: a vibration arm extending from a base end toward a tip; a base joined to the vibration arm at the base end; and supporting arms arranged on both sides of the base in a width direction perpendicular to an extending direction of the vibration arm and joined to the base, wherein the base has a reduced cross-section portion disposed along the extending direction of the vibration arm between a joint portion with the vibration arm and a joint portion with the supporting arms, and the reduced cross-section portion is disposed so as to satisfy a relationship 2×W06-30-2011
20120013415Method of manufacturing packages, package, piezoelectric, vibrator, and oscillator - A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side.01-19-2012
20120013414CRYSTAL OSCILLATOR CIRCUIT FOR ADJUSTING RESONANT FREQUENCY OF CRYSTAL OSCILLATOR - A crystal oscillator includes a clock generator, first and second capacitors, a crystal oscillator, a variable capacitance diode, and a voltage generating circuit. The crystal oscillator is connected between the input pin and the output pin of the clock generator, and connected between the first terminal of the first capacitor and the first terminal of the second capacitor. The variable capacitance diode is connected between the second terminal of the first capacitor and the second terminal of the second capacitor. The voltage generating circuit is connected between two terminals of the variable capacitance diode to supply different voltages for the variable capacitance diode to change a junction capacitance of the variable capacitance diode, to change a resonant frequency of the crystal oscillator.01-19-2012
20120056686VIBRATOR ELEMENT, VIBRATOR, VIBRATION DEVICE, AND ELECTRONIC DEVICE - A vibrator element includes: a base portion; a plurality of vibrating arms which extends in the Y-axis direction from the base portion so as to be arranged in a line in the X-axis direction, and piezoelectric elements which are formed on the vibrating arms so as to allow the vibrating arms to perform flexural vibration in the Z-axis direction. The respective vibrating arms include first surfaces which are compressed or expanded in response to flexural vibration and second surfaces which are expanded when the first surfaces are compressed and which are compressed when the first surfaces are expanded. The vibrating arms have the piezoelectric elements which are formed close to the first surfaces, and the other vibrating arm has the piezoelectric element which is formed close to the second surface.03-08-2012
20120154068CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME - A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.06-21-2012
20110080225SURFACE ACOUSTIC WAVE DEVICE, MODULE DEVICE, OSCILLATION CIRCUIT, AND METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE - An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle θ of a rotary Y cut quartz substrate is set in a range of −64.0°<η<−49.3° in a counter-clockwise direction from a crystal axis Z and in which a surface acoustic wave propagation direction is set at 90°±5° with respect to a crystal axis X. An electrode film thickness H/λ standardized by a wavelength of the IDT electrode is 0.0404-07-2011
20120206211PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A piezoelectric vibrating piece includes a pair of vibration arm portions that is placed in a row in a width direction; a base portion to which proximal end sides in the pair of vibration arm portions in an extending direction are connected; and weight metal films that are formed on outer surfaces of the vibration arm portions, wherein the weight metal films are formed in positions that avoid regions of tip portions in the vibration arm portions in a longitudinal direction.08-16-2012
20120025923VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base having a mounting surface; a vibrating arm which is extended from the base and has a first surface and a second surface that faces the first surface and is positioned on the mounting surface side, and which performs flexural vibration in a direction normal to the first and second surfaces; and a laminated structure which is provided on at least one of the first and second surfaces of the vibrating arm, and which includes at least a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, in which the vibrating arm is warped toward the mounting surface side.02-02-2012
20120249255CRYSTAL DEVICE AND MANUFACTURING METHOD THEREOF - A crystal device includes; a base, a framed crystal vibrating blank in which a mesa section is formed on an upper face end bonded to a seal path on an upper surface of the base via a low melting point glass layer or a resin adhesive layer, and a lid bonded to a seal path on an upper surface of the framed crystal vibrating blank via a low melting point glass layer or a resin adhesive layer. A pillow made of low melting point glass or a resin adhesive that suppresses vibration amplitude at the time of a drop impact of the framed crystal vibrating blank is formed on a rear surface of the lid simultaneously with the low melting point glass layer or the resin adhesive layer.10-04-2012
20100244973FLEXURAL VIBRATION PIECE AND OSCILLATOR USING THE SAME - A flexural vibration piece includes: a flexural vibrator that has a first region on which a compressive stress or a tensile stress acts due to vibration and a second region having a relationship in which a tensile stress acts thereon when a compressive stress acts on the first region and a compressive stress acts thereon when a tensile stress acts on the first region, and performs flexural vibration in a first plane; and a heat conduction path, in the vicinity of the first region and the second region, that is formed of a material having a thermal conductivity higher than that of the flexural vibrator and thermally connects between the first region and the second region, wherein when m is the number of heat conduction paths, α09-30-2010
20100207697METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, AND OSCILLATOR - The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes. The method includes a inner electrodes forming step of forming the inner electrodes, a metal bump forming step of forming the metal bumps, and a mount step of bonding the mount electrodes of the piezoelectric vibrating piece to the metal bumps, wherein, in the mount step, the piezoelectric vibrating piece is mounted and fixed in such a manner that tips of the metal bumps are not in contact with the crystal plate.08-19-2010
20100207698METHOD FOR MANUFACTURING GLASS-SEALED PACKAGE, APPARATUS FOR MANUFACTURING GLASS-SEALED PACKAGE, AND OSCILLATOR - The invention provides a method and an apparatus for manufacturing a glass-sealed package, whereby anodic bonding of a pair of wafers is ensured over substantially the whole area of the wafers, and whereby a vacuum is ensured inside the cavity during the anodic bonding of the wafers. The invention also provides an oscillator having such characteristics. The manufacturing method of a glass-sealed package includes the step of anodically bonding a pair of wafers by applying voltage to positions corresponding to circumferential portions of the wafers stacked in layers, and the step of dividing the pair of anodically bonded wafers into individual pieces. A through hole is formed at a central portion of at least one of the wafers, and the anodic bonding of the wafers is made by applying voltage using a plurality of electrodes disposed at the positions corresponding to the circumferential portions of the wafers.08-19-2010
20100207696PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, AND OSCILLATOR - There is provided a piezoelectric vibrator that can hold the crystal plate parallel to the base substrate regardless of the shape of the crystal plate. A method for manufacturing the piezoelectric vibrator, and an oscillator are also provided. The piezoelectric vibrator includes a base substrate; a lid substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes and mount electrodes; through electrodes provided in through holes formed through the base substrate; inner electrodes formed on the upper surface of the base substrate; and metal bumps formed at predetermined positions of the inner electrodes. The piezoelectric vibrating piece is tapered towards the ends along the longitudinal direction, and mounted on the metal bumps in a cantilever fashion. The metal bumps are provided in a plurality along the longitudinal direction of the piezoelectric vibrating piece, and have heights that become higher towards a position corresponding to an end of the piezoelectric vibrating piece along the longitudinal direction.08-19-2010
20120133451FUNCTION GENERATOR CIRCUIT - A function generator circuit for outputting a control signal to an oscillating circuit includes a temperature detecting circuit for outputting a detection voltage corresponding to an ambient temperature and having a linear temperature characteristic, a zeroth-order component generating circuit for generating a zeroth-order component of the control signal, a first-order component generating circuit for generating a first-order component of the control signal, a second-order component generating circuit for generating a second-order component of the control signal, a third-order component generating circuit for generating a third-order component of the control signal based on the detection voltage, and an adder-subtractor that generates the control signal by obtaining a sum of the zeroth-order component, the first-order component, and the third-order component and adding or subtracting the second-order component to or from the sum. The second-component generating circuit is configured to correct a temperature at an inflection point of the control signal.05-31-2012
20120235762PIEZOELECTRIC VIBRATION ELEMENT, PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC OSCILLATOR, AND ELECTRONIC DEVICE - A piezoelectric vibration element includes: a piezoelectric substrate; excitation electrodes that are arranged so as to face each other on both principal faces of the piezoelectric substrate; drawn-out electrodes; and pads. The piezoelectric substrate includes an excitation portion that is located at the center and a peripheral portion that is thin-walled to be thinner than the thickness of the excitation portion and is disposed on a peripheral edge thereof. The pads have support areas that fix the piezoelectric substrate to a support member at positions of the piezoelectric substrate corresponding to corner portions. The excitation electrodes are formed over the excitation portion and a vibration area that is at least a part of the peripheral portion.09-20-2012
20090058547METHOD OF FABRICATING HERMETIC TERMINAL AND HERMETIC TERMINAL, METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATOR, OSCILLATOR, ELECTRONIC APPLIANCE, AND RADIO CLOCK - A method of fabricating a hermetic terminal having an annular ring, a lead arranged to penetrate through the ring in which one end side thereof is an inner lead portion electrically connected to a piezoelectric vibrating piece and the other end side thereof is an outer lead portion electrically connected to outside as the ring is between them, and a filler fixing the lead to the ring, wherein the hermetic terminal seals the piezoelectric vibrating piece inside a case, the method includes the steps of: applying plating to a hermetic terminal intermediate having the lead fixed in the ring with the filler to plate the ring and the lead; setting the hermetic terminal intermediate after subjected to plating on a holding member; and flattening an end part of an inner lead portion in the lead to form a stair portion in the hermetic terminal intermediate set on the holding member.03-05-2009
20120212301SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND ELECTRONIC INSTRUMENT - A SAW resonator which, using a quartz crystal substrate with Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, and 41.9°≦|ψ|≦49.57°), includes an IDT that excites a stop band upper end mode SAW, and an inter-electrode finger groove provided between electrode fingers configuring the IDT. When a wavelength of the SAW is λ, a first depth of the inter-electrode finger groove is G, a line occupation rate of the IDT is η, and an electrode film thickness of the IDT is H, λ, G, η and H satisfy the relationship of 008-23-2012
20110187472PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrating reed capable of securing a stable bonding strength between a bump and the piezoelectric vibrating reed, a piezoelectric vibrator having the piezoelectric vibrating reed, a method for manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A piezoelectric vibrating reed includes: a vibrating portion; a base portion adjacent to the vibrating portion; excitation electrodes formed in the vibrating portion; mount electrodes formed in the base portion; and extraction electrodes for electrically connecting the excitation electrodes and the mount electrodes to each other. A bonding film made of gold is formed on the surfaces of the mount electrodes, and the bonding film is formed to a thickness such that, when the bonding film is ultrasonically bonded to a bump made of gold, mutual diffusion occurs over approximately the entire area in the thickness direction of the bonding film.08-04-2011
20120313721ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.12-13-2012
20100271146TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR, PRINTED-CIRCUIT BOARD, AND ELECTRONIC DEVICE - A temperature compensated crystal oscillator includes an oscillation circuit including a crystal oscillator; a variable capacitor inserted in series in the oscillation circuit; a thermosensitive circuit element whose resistance value changes in accordance with a temperature of the crystal oscillator, the thermosensitive circuit element being formed on the crystal oscillator by vapor deposition; and a correction circuit configured to correct capacitance of the variable capacitor based on a current value that is used when applying current to the thermosensitive circuit element.10-28-2010
20100271145CRYSTAL OSCILLATOR CIRCUIT AND ELECTRONIC DEVICE USING THE SAME - A crystal oscillator circuit is connected between first and second oscillator pins of a chip and provides clock signals for the chip. The crystal oscillator circuit comprises a crystal, a first capacitor, a second capacitor and a third capacitor. The first capacitor is connected between the first and second oscillator pins of the chip. The second capacitor is connected between the first oscillator pin and ground. The third capacitor comprises one end connected to the second oscillator pin of the chip, and the other end grounded by way of the crystal.10-28-2010
20120229225PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.09-13-2012
20120229226Micromechanical Resonator - The invention relates to a micromechanical resonator comprising a substrate (09-13-2012
20100327987Method of manufacturing crystal element and crystal resonator manufactured thereby - The present invention relates to a crystal element manufacturing method for manufacturing a plurality of crystal elements at a wafer level, and to a crystal resonator manufactured by this method. The method is comprised when the frequencies of the crystal elements are adjusted by adjusting the thickness of a crystal wafer that constitutes the crystal element in two stages by partial wet etching, the thicknesses of a large number of the step sections are coarse-adjusted in a first stage by collectively subjecting the step sections to partial wet etching, and then variations in the thicknesses of each group of a small number of the step sections are fine-adjusted in a second stage by collectively subjecting the step sections to partial wet etching. Alternatively, variations in the thicknesses of a small number of the step sections are coarse-adjusted and made uniform by means of partial wet etching, and then in a second stage, the thicknesses of a group of a plurality of the step sections having equal thicknesses are fine-adjusted by collectively subjecting the step sections to partial wet etching. Step sections having different areas are respectively formed on both of the front and back surfaces of a crystal wafer; at a crystal wafer level, these step sections are first collectively subjected to partial wet etching and thereby coarse-adjusted; then the thickness of each of the step sections is individually fine-adjusted by means of partial wet etching; and thereby the tact (the amount of operation time) required in partial wet etching is reduced.12-30-2010
20120319792PIEZOELECTRIC DEVICE AND FABRICATING METHOD THEREOF - A piezoelectric device and a fabricating method thereof are provided. Variation of output frequency is suppressed by forming an organic resin to protect an IC chip that is mounted in a cavity of a container body, and damage that may occur to the IC chip during the mounting process is prevented. The piezoelectric device includes a container body, a crystal resonator, an IC chip and a cover body. A surface of the IC chip, which is a mounting surface for mounting to the container body, has bumps thereon for connecting to terminal pads of a circuit wiring pattern configured on a bottom surface of a bottom cavity of the container body, and the other surface of the IC chip has an insulating protective sheet adhered and fixed thereon.12-20-2012
20110227661GLASS SUBSTRATE BONDING METHOD, GLASS ASSEMBLY, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a glass substrate bonding method capable of securely anodically bonding a bonding material and a glass substrate even when Si having a large resistance value is used as a material for the bonding material, a glass assembly obtained by the glass substrate bonding method, a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A glass substrate bonding method includes an anodic bonding step of anodically bonding a bonding material fixed to an inner surface of a lid substrate wafer to a base substrate wafer. The bonding material is formed of an ITO film and a Si film which are sequentially formed on the inner surface of the lid substrate wafer.09-22-2011
20110140795METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films.06-16-2011
20130021110SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - It is possible to reduce the size of a surface acoustic wave resonator by enhancing the Q value. In a surface acoustic wave resonator in which an IDT having electrode fingers for exciting surface acoustic waves is formed on a crystal substrate, a line occupying ratio is defined as a value obtained by dividing the width of one electrode finger by the distance between the center lines of the gaps between one electrode finger and the electrode fingers adjacent to both sides thereof, and the IDT includes a region formed by gradually changing the line occupying ratio from the center to both edges so that the frequency gradually becomes lower from the center to both edges than the frequency at the center of the IDT.01-24-2013
20080224787ACCELERATION FEEDBACK CONTROL FOR CRYSTAL OSCILLATORS - Methods and apparatus for controlling frequency in a crystal oscillator are provided that allows for continued reception of GPS signal solution in a continuous high G environment. One method comprises measuring G-forces asserted on the crystal oscillator, determining a shift in frequency of the crystal oscillator due to the measured G-forces, determining a temperature that would shift the crystal oscillator's frequency back to a rate that would occur without the measured G-forces, and changing the temperature of the crystal oscillator based on the determined temperature to shift the crystal oscillator's frequency back to a rate that would occur if the G-forces were not present.09-18-2008
20110221537PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.09-15-2011
20080258830IC FOR CONTROL OF TEMPERATURE-COMPENSATED CRYSTAL OSCILLATOR - A temperature-compensated crystal oscillator includes a mode selector circuit 10-23-2008
20110248788GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam.10-13-2011
20110234330ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT - An electronic component includes: a base material having a first conductive section; an oscillation piece having a second conductive section; a first member which is covered with a third conductive section making conductive contact with the first and second conductive sections and is provided between the base material and the oscillation piece; and a second member which is provided so as to be surrounded with the base material, the oscillation piece, and the first member and holds the base material and the oscillation piece.09-29-2011
20130187723PIEZOELECTRIC MODULE - A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.07-25-2013
20130187724Micromechanical resonator and method for manufacturing thereof - The invention relates to a temperature compensated micromechanical resonator and method of manufacturing thereof. The resonator comprises a resonator element comprising a semiconductor crystal structure, which is doped so as to reduce its temperature coefficient of frequency, transducer means for exciting to the resonator element a vibrational mode. According to the invention the crystal orientation and shape of the resonator element are chosen to allow for a shear mode having a saddle point to be excited to the resonator element, and said transducer means are adapted to excite said shear mode to the resonator element. Accurate micromechanical resonators with now temperature drift can be achieved by means of the invention.07-25-2013
20130194049VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base having a mounting surface; a vibrating arm which is extended from the base and has a first surface and a second surface that faces the first surface and is positioned on the mounting surface side, and which performs flexural vibration in a direction normal to the first and second surfaces; and a laminated structure which is provided on at least one of the first and second surfaces of the vibrating arm, and which includes at least a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, in which the vibrating arm is warped toward the mounting surface side.08-01-2013
20120062329SURFACE ACOUSTIC WAVE DEVICE, ELECTRONIC APPARATUS, AND SENSOR APPARATUS - A SAW device 03-15-2012
20120086516OVEN CONTROLLED CRYSTAL OSCILLATOR - Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.04-12-2012
20130207735VIBRATING DEVICE AND OSCILLATOR - The vibrating device of the invention includes a base member, a lid member joined the base member to constitute a cavity, and a vibrating strip housed in the cavity. The vibrating strip includes a thick center portion and a thin outer peripheral portion, the center portion includes an exciting electrode exciting vibration, and the outer peripheral portion includes terminal electrode electrically connected to exciting electrode and having a thickness larger than that of the exciting electrode. The base member is provided with a connecting portion on the surface thereof, and the connecting portion is connected to the terminal electrode and holds the vibrating strip in a cantilevered manner. Accordingly, the vibrating strip is supported by a very small bonding surface, and a compact vibrating device subjected to little deterioration in frequency characteristics with respect to the temperature change is realized.08-15-2013

Patent applications in class Crystal

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