Class / Patent application number | Description | Number of patent applications / Date published |
331068000 | WITH OUTER CASING OR HOUSING | 56 |
20080238557 | Tuning fork flexural crystal vibration device, crystal vibrator, and crystal oscillator - A tuning fork flexural crystal vibration device includes a base, two vibration arms, grooves, electrodes, and wirings. The base has a flat plate shape. The two vibration arms have flat panel shapes extending from a side surface of the base in the same direction. The grooves are provided for the two vibration arms so as to extend from base-side end portions of the vibration arms along the longitudinal direction of the vibration arms and are depressed in the thickness direction of the vibration arms. The grooves include front-side grooves which open in the front main surfaces of the vibration arms and are provided at least one by one for each vibration arm, and rear-side grooves which open in the rear main surfaces of the vibration arms and are provided at least one by one for each vibration arm. The bottom surface of the front-side groove does not face the bottom surface of the rear-side groove provided in the same vibration arm in which the front-side groove is provided. The electrodes are formed on the surfaces of the base and the two vibration arms. The wirings electrically connect the electrodes to each other. A crystal vibrator and crystal oscillator are also disclosed. | 10-02-2008 |
20080266003 | SURFACE-MOUNTED PIEZOELECTRIC OSCILLATORS AND PIEZOELECTRIC VIBRATORS - Surface-mounted piezoelectric oscillators are disclosed that include a package in which a piezoelectric vibrating piece and an electronic circuit (IC) are mounted. At least two external terminals are formed on the external surface of the package and electrically connected to the piezoelectric vibration piece and the electronic circuit. The front surfaces of the external terminals are recessed inwardly (AZ) from the external surface of the package. | 10-30-2008 |
20080290956 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes a container body having a recess and made up of laminated ceramic, a crystal blank accommodated in the container body, and an IC chip made up of a semiconductor substrate in which at least an oscillation circuit using the crystal blank is formed. The IC chip is electrically and mechanically connected to an inner bottom surface of the recess so that a circuit formation surface thereof faces the inner bottom surface. The IC chip has a first electrode formed on a surface thereof which is opposite the inner bottom surface, and a second electrode is formed on a surface which is disposed in the recess, the first and second electrodes being connected together by wire bonding. Alternatively, an outer peripheral side surface of the IC chip is thermally coupled to an inner peripheral surface of the recess by a conductive adhesive. | 11-27-2008 |
20080309418 | Bonding-type surface-mount crystal oscillator - A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering. | 12-18-2008 |
20090021315 | SURFACE-MOUNT CRYSTAL OSCILLATOR - In a surface-mount crystal oscillator, an IC chip having an IC terminal at each of at least four corner portions is housed in a substantially rectangular recess. Circuit terminals to which the IC terminals are fixed via bumps are provided on an inner bottom surface of the recess, and external terminals electrically connected to the circuit terminals are provided at the four corner portions of an opening end surface surrounding the recess. In each of at least three vertices or corners on the inner bottom surface of the recess, an external terminal corresponding to the vertex is formed into an L-shape to be in contact with a longer side and a shorter side of an outer perimeter of the recess, and an exposed part in which the inner bottom surface is exposed is formed between the circuit terminal which is the closest to the vertex and its external terminal. | 01-22-2009 |
20090021316 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator has: a container body having a bottom wall and a frame wall having an opening and provided on one principal surface of the bottom wall; a quartz crystal blank hermetically encapsulated in a recess of the container body, which is formed by the opening of the frame wall; and an IC chip on which an oscillating circuit using the crystal blank is integrated. A region which is a region on the one principal surface of the bottom wall and other than formation regions of the frame wall and the recess is made a flat part, and the IC chip is fixed to the one principal surface of the bottom wall by flip-chip bonding, in the flat part. A crystal inspection terminal electrically connected to the crystal blank is provided on a surface of the flat part. | 01-22-2009 |
20090146745 | NOISE REDUCING DIELECTRIC RESONATOR OSCILLATOR - Systems, devices, and methods are provided for reducing noise in communication systems. An example resonator system comprises: a housing comprising a top portion and a floor portion, a dielectric resonator positioned with the housing, a substrate, and a stripline transmission line adjacent the substrate. In this exemplary embodiment, the stripline transmission line within the housing is electromagnetically coupled to the dielectric resonator, the substrate is positioned away from the floor portion and top portion of the housing, and the dielectric resonator coupled with the suspended stripline transmission line is connected to an active device to form an oscillator. The positioning of the substrate relative to the housing may reduce the amount of the electromagnetic field from the stripline transmission line that is absorbed into the housing. In a further embodiment, the board has no metallic backing on at least a portion of the back of the board. | 06-11-2009 |
20090160563 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes a container body with a recess, a first holding terminal and a second holding terminal provided in the recess, a crystal blank secured to the first and second holding terminals, and an IC chip including a first terminal and a second terminal on respective opposite sides of one end of the IC chip, the first and second terminals being used to electrically connect the amplification element within the IC chip to the crystal blank. In the recess, the first connection terminal is connected, by wire bonding, to one of a first circuit terminal connected to the first holding terminal and a second circuit terminal connected to the second holding terminal. The second connection terminal is connected, by wire bonding, to one of a third circuit terminal connected to the first holding terminal and a fourth circuit terminal connected to the second holding terminal. | 06-25-2009 |
20090167448 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator comprises: a crystal blank; an IC chip on which at least an oscillation circuit using the crystal blank is integrated; a container that accommodates the crystal blank and the IC chip; a pair of inspection terminals provided on an outer surface of the container and electrically connected to the crystal blank, and used for inspecting characteristics of the crystal blank; a communication terminal provided on the outer surface of the container; and first switching means for switchably and electrically connecting and disconnecting the inspection terminals to and from the crystal blank in accordance with a selecting signal supplied from the communication terminal. | 07-02-2009 |
20090195323 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes: a container body including a base wall and a frame wall, the frame wall being arranged on one principal surface of the base wall as including an opening; a crystal blank hermetically encapsulated inside a recess of the container body, the recess being formed by the opening of the frame wall; and an IC chip in which an oscillation circuit that uses the crystal blank is integrated. A flat portion which is a part of the base wall protrudes outwardly from an outer circumference of the frame wall. The IC chip is fixed to the one principal surface of the base wall at the flat portion. A testing terminal which is electrically connected with the crystal blank is provided on the one principal surface of the base wall at the flat portion. | 08-06-2009 |
20090206938 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes: a container body with a first recess and a second recess; a crystal blank including excitation electrodes on respective principal surfaces thereof and hermetically encapsulated in the first recess; and an IC chip which is accommodated in the second recess and into which at least an oscillation circuit using the crystal blank is integrated. The container body includes a bottom wall and a frame wall provided on the bottom wall. Two openings which make up the first and second recesses, respectively, are formed in juxtaposition in the frame wall. A pair of inspection terminals are provided in an area of a top surface of the frame wall which surrounds the second recess. The inspection terminals are electrically connected to the excitation electrodes of the crystal blank. | 08-20-2009 |
20090261912 | Crystal device for surface mounting - A surface-mounted device includes a ceramic case, which has a concave portion formed by a bottom wall layer, a frame wall intermediate layer and a frame wall upper layer, and which houses at least a crystal element inside the concave portion. The ceramic case includes: arc-formed notched parts at outer circumference four corners thereof; and mounting terminals, which are extended to notched parts in the bottom wall layer among the notched parts, on an outer bottom face thereof. A radius of curvature of the notched parts in the frame wall intermediate layer is made identical to or greater than a radius of curvature of the notched parts in the bottom wall layer, and a radius of curvature of the notched parts in the frame wall upper layer is less than the radii of curvature of the notched parts in the bottom wall layer and the frame wall intermediate layer. | 10-22-2009 |
20090261913 | Crystal device for surface mounting - A crystal device for surface mounting, in which a metal cover is jointed to the metal ring by seam welding, satisfies relationships A | 10-22-2009 |
20100013565 | Surface mount type crystal oscillator - A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface. | 01-21-2010 |
20100026398 | Surface mount type crystal oscillator - A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface. | 02-04-2010 |
20100060367 | CRYSTAL OSCILLATOR FOR SURFACE MOUNTING - The crystal oscillator for surface mounting includes: a container body having first and second recesses on both principal surfaces thereof; a crystal blank hermetically encapsulated within the first recess; and an IC chip in which an oscillation circuit using the crystal blank is integrated, the IC chip being accommodated within the second recess. The IC chip is provided with a plurality of IC terminals including a pair of crystal terminals used for electrical connection with the crystal blank. A plurality of mounting electrodes to which the IC terminals are connected through flip-chip bonding are formed on a bottom surface of the second recess in correspondence with the IC terminals. A pair of mounting electrodes corresponding to the pair of crystal terminals are electrically connected to the crystal blank and also formed as a pair of dual-purpose electrodes having greater areas than the other mounting electrodes. | 03-11-2010 |
20100117745 | Surface mount type crystal oscillator - There is provided a configuration in which a lead-out electrode that extends out from an excitation electrode provided on a lower surface of a crystal piece facing an inner bottom surface of a container main body, is connected to a crystal terminal of an IC chip via a conducting path provided on the inner bottom surface of the container main body, and the conducting path is superimposed, in plan view, on the excitation electrode of the lower surface of the crystal piece, and the excitation electrode of the lower surface and the conducting path have the same electric potential, to thereby suppress the occurrence of stray capacity therebetween. As a result, stray capacity occurring in the conducting path that connects the excitation electrode and the IC terminal is made small, thereby preventing variations in oscillating frequency. | 05-13-2010 |
20100117746 | Surface mount crystal oscillator - An object of the invention is to provide a surface mount type crystal oscillator in which a probe can be easily brought into contact with a crystal inspection terminal. The surface mount type crystal oscillator is such that a crystal piece and an IC chip are housed within a container main body having a bottom wall and frame wall formed with laminated ceramics, and a communication terminal is provided on an outer side surface of the container main body. The communication terminal is provided so as to span from the outer side surface of the bottom wall to the outer bottom surface of the outer wall, the communication terminal is made the crystal inspection terminal, and the crystal piece and the IC chip are arranged in parallel on the inner bottom surface within the container main body. | 05-13-2010 |
20100127784 | Oscillating device - A low-price, compact oscillating device having a good temperature characteristic of a frequency intermediate between a temperature compensated crystal oscillator (TCXO) and an oven-controlled crystal oscillator (OCXO) is provided. The oscillating device having a TCXO is provided with a base on which the TCXO is mounted, that is formed into a box shape having a recess, with a plane area substantially equal to that of the TCXO; and a semiconductor chip including a temperature control circuit, a temperature sensor, and a heating element, mounted in the recess. An opening of the recess is provided in a surface opposite a surface in which the temperature compensated crystal oscillator is mounted, and sealed by a cover. A temperature of the TCXO can be kept constant to provide a oscillating device having an excellent temperature characteristic of a frequency compared with the single TCXO. | 05-27-2010 |
20100156546 | Surface mount crystal oscillator - There is provided a surface mount oscillator of a junction type in which the size of an IC chip is increased while maintaining high performance thereof, and the outer dimension of the oscillator in plan view are small. In a surface mount crystal oscillator which: a surface of an IC chip opposite to one principal surface thereof on which IC terminals are formed, is fixed on a mount substrate; external terminals that are constituted by a pair of crystal terminals and dummy terminals, at least one of which serves as a ground terminal, and that are formed in four corner sections of an outer bottom surface of a surface mount vibrator, are electrically connected to the IC terminals provided in four corner sections of the one principal surface; and IC terminals provided in positions other than the four corner sections are connected to circuit terminals of the mount substrate by means of wire bonding, the configuration is such that the external terminals of the surface mount vibrator constituted by the crystal terminals and the dummy terminals are electrically joined by means of joining balls to the IC terminals formed in the four corner sections of the IC chip. | 06-24-2010 |
20100201453 | Crystal oscillator with pedestal - An object of the invention is to provide an oscillator with a pedestal that facilitates soldering operations and offers a high level of productivity. A surface mount crystal oscillator with a pedestal comprises a crystal oscillator with lead wires led out from a bottom surface of a metallic base thereof; and a pedestal having a substantially rectangular outer shape in plan view, has insertion holes through which the lead wires pass, and is attached to a bottom surface of the crystal oscillator, and has mount terminals to be electrically connected to the lead wires formed on a bottom surface thereof. The configuration is such that the insertion holes are provided in four corner sections of the pedestal, in the four corner sections of the bottom surface of the pedestal where the insertion holes are formed there is provided a recess with an open outer periphery, and the lead wire is connected to a terminal electrode formed inside the recess, using solder. | 08-12-2010 |
20110109394 | Surface mount crystal oscillator and manufacturing method of the same - There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; and on the back surface of the ceramic base, mount terminals connected to the through terminals are formed in the surface mount crystal oscillator. | 05-12-2011 |
20110133844 | Surface mount crystal oscillator and manufacturing method of the same - There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; on the back surface of the ceramic base, mount terminals connected to the through terminals are formed; and the opening end face of a metal cover joined onto the ceramic base via the molten resin comprises a flange having an inclined face in the surface mount crystal oscillator. | 06-09-2011 |
20110181368 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members | 07-28-2011 |
20110193637 | Surface mounted oven controlled type crystal oscillator - The invention relates to an oven controlled crystal oscillator for surface mounting with reduced height (low profile). The oven controlled crystal oscillator for surface mounting comprises: a flat first substrate made of ceramic and on which are installed a crystal device and a heat resistor; and a second substrate made of a glass epoxy resin which is quadrangular in plan view and which faces the first substrate and has a larger external shape in plan view than the first substrate. The second substrate has an opening into whose center the crystal device is inserted, and has terminal sections on four locations corresponding to the surface outer periphery of the first substrate and the peripheral surfaces of the opening in the second substrate, and the terminal sections of the first substrate and second substrate are connected by solder. A front end side head section of the crystal device inserted into the opening section of the second substrate is positioned inside the open surface of the opening section, and from terminal sections provided at four locations on the second substrate, conductive paths extend via the outside surface of the second substrate to external terminals formed on the outside bottom surface of the second substrate. | 08-11-2011 |
20110221535 | Surface mount crystal oscillator and manufacturing method of the same - There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; on the back surface of the ceramic base, mount terminals connected to the through terminals are formed; and an insulating film projected especially in a corner portion direction is formed at such a position as to face the opening end face of a metal cover. | 09-15-2011 |
20110234325 | Voltage controlled temperature compensated crystal oscillator - The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals. Two of the additional IC terminals are two functions among the additional functions, which are selectively connected according to changes in a circuit pattern of a surface layer of the circuit formation surface, and the basic mounting terminals are provided on four corner portions of an outside bottom surface of the chamber body, and the two additional mounting terminals that are connected to the two additional IC terminals are provided on a central portion of a long side facing the outside bottom surface. | 09-29-2011 |
20120133447 | SURFACE MOUNT TYPE CRYSTAL UNIT - An object of the invention is to provide a surface mount oscillator that can suppress a change with the lapse of time in frequency characteristics. A surface mount type crystal unit | 05-31-2012 |
20120154061 | CRYSTAL OSCILLATOR AND METHOD OF MANUFACTURING THE SAME - A crystal oscillator with improved tolerance to radiation such as X-rays includes: a container body; a quartz crystal blank accommodated in a first recess formed on one main surface of the container body and hermetically encapsulated in the first recess by a metal cover; and an IC chip that integrates electronic circuits including at least an oscillator circuit using the crystal blank and is accommodated in the second recess formed on the other main surface of the container body. The IC chip is fixed to the bottom surface of the second recess by flip-chip bonding such that a circuit formation plane of the IC chip is opposed to the bottom surface of the second recess. A radiation protective film is formed on the main surface other than the circuit formation plane of the IC chip. | 06-21-2012 |
20120256695 | BASE SUBSTRATE, RESONATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A package of a quartz resonator includes a tabular base substrate, a base material of which is a single layer, a lid section that has a recess and covers the base substrate, and a bonding material provided over the entire periphery of one principal plane of the base substrate and including low-melting glass for bonding the base substrate and the lid section. Internal electrodes are provided on the one principal plane of the base substrate. External electrodes are provided on the other principal plane of the base substrate. A wire contains an Ag—Pd alloy having a glass component and crosses the bonding material on the one principal plane. | 10-11-2012 |
20130063217 | SURFACE-MOUNTED CRYSTAL OSCILLATOR AND MANUFACTURING METHOD THEREOF - There are provided a surface-mounted crystal oscillator and a manufacturing method thereof which can realize miniaturization, improve quality, reduce a manufacturing cost, and enhance productivity. According to the surface-mounted crystal oscillator and the manufacturing method thereof, through terminals and of AgPd are formed on wall surfaces of through holes formed at corner portions of a rectangular ceramic substrate, a metal electrode of a support electrode lower portion of AgPd which is connected to the through terminal and forms a lower layer of a support electrode is formed on a front side of the substrate, the support electrode which holds a crystal piece is formed on the support electrode lower layer portion by using Ag, and a cover is mounted on an insulating film formed on the inner side of the periphery of the substrate and effect airtight sealing. | 03-14-2013 |
20130257549 | CRYSTAL CONTROLLED OSCILLATOR - A crystal controlled oscillator includes a crystal package and an IC chip board that includes an IC chip integrating an oscillator circuit. The crystal package includes a first container, a crystal resonator, a lid body, and an external terminal at an outer bottom surface of the first bottom wall layer of the first container. The IC chip integrates an oscillator circuit disposed at an outer bottom surface of the first bottom wall layer of the crystal package. The oscillator circuit connects to the lower side excitation electrode of the crystal resonator from the external terminal to an input side with high impedance. The oscillator circuit connects to the upper side excitation electrode to an output side with low impedance. The upper side excitation electrode is a shielding electrode of the crystal resonator. | 10-03-2013 |
20130285754 | THROUGH SILICON VIA-BASED OSCILLATOR WAFER-LEVEL-PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals. | 10-31-2013 |
20140022024 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, AND ELECTRONIC APPARATUS - A resonator element includes a base section, at least one pair of vibrating arms protruding from the base section, a support arm protruding from the base section, and a first through hole provided to the support arm, and penetrating the support arm in a thickness direction, and is fixed to an object via an adhesive entering the first through hole. | 01-23-2014 |
20140035685 | RESONATOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A resonator device includes a base substrate having a fixation section to be attached to a mounting board and a free end, a resonator element having one end connected to a connection section located on the free end side of the base substrate, and a lid member adapted to airtightly seal the resonator element in a space between the lid member and the base substrate. | 02-06-2014 |
20140062607 | ULTRA SLIM RF PACKAGE FOR ULTRABOOKS AND SMART PHONES - A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core layer of the package substrate, wherein an in-situ electromagnetic shield is formed on the sidewalls of the cavity. In another embodiment, a crystal oscillator is at least partially embedded within the core layer of the package substrate. In another embodiment, a package having a component embedded in the core layer is mounted on a PCB, and a crystal oscillator generating a clock frequency for the package is mounted on the PCB. By embedding components within the core or removing components from the package to be mounted directly on the PCB, the x, y, and z dimensions of a package may be reduced. In addition, in-situ electromagnetic shield may reduce EM noise emitted from the active die. | 03-06-2014 |
20140085014 | HERMETICALLY SEALED ATOMIC SENSOR PACKAGE MANUFACTURED WITH EXPENDABLE SUPPORT STRUCTURE - A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact. | 03-27-2014 |
20140152392 | OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed. | 06-05-2014 |
20140232477 | SEALED CRYSTAL OSCILLATOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal. | 08-21-2014 |
331069000 | With temperature modifier | 17 |
20080315962 | APPARATUS FOR PROVIDING OSCILLATOR FREQUENCY STABILITY - An apparatus for providing oscillator frequency stability is disclosed. The apparatus includes an internally ovenized oscillator module having an oscillator and an inner heater to maintain the oscillator at a first temperature during operation. The apparatus also includes a thermally conductive cover for forming a first compartment to contain the internally ovenized oscillator module along with multiple heaters. The heaters are in thermal communication with the thermally conductive cover and the substrate to form an oven to keep the internally ovenized oscillator module at a stable second temperature during operation. In addition, the apparatus includes a thermally insulative cover for forming a second compartment to contain the first compartment. | 12-25-2008 |
20090051446 | Ovenized oscillator - An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon. | 02-26-2009 |
20090058544 | SURFACE-MOUNT CRYSTAL OSCILLATOR - A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip. | 03-05-2009 |
20090102567 | HEATING SYSTEM FOR A DOUBLE-OVENIZED OSCILLATOR ON A SINGLE PRINTED CIRCUIT BOARD - A system is provided for the regulation of temperature of a crystal oscillator, that system having a thermally conductive support disposed upon a substrate and upon which is disposed the crystal oscillator, an array of thermal vias disposed around the crystal oscillator within the substrate, at least one primary heater communicating with the support, a thermal enclosure communicating with the array of thermal vias, and a at least one secondary heater communicating with the enclosure. | 04-23-2009 |
20100052801 | TEMPERATURE CONTROL DEVICE - A thermostatic-chamber temperature control device includes: a heating element for heating a thermostatic chamber; a bridge circuit having a temperature sensitive element whose resistance value varies in accordance with the temperature of the heating element; a detection circuit for detecting an unbalanced voltage of the bridge circuit; a PWM signal generating circuit for generating a PWM signal corresponding to the unbalanced voltage detected by the detection circuit; and a switching element that has a current output terminal connected to the heating element and a current input terminal connected to a power supply circuit and is driven on the basis of the PWM signal generated by the PWM signal generating circuit. | 03-04-2010 |
20100052802 | Constant-temperature type crystal oscillator - A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes. | 03-04-2010 |
20100073098 | Constant-temperature type crystal oscillator - A constant-temperature type crystal oscillator includes: a crystal unit including a case main body, in which two crystal terminals and two dummy terminals are provided on an outer bottom face thereof, and a crystal element housed in the case main body; an oscillator output circuit including an oscillating stage and a buffering stage; a temperature control circuit for keeping an operational temperature of the crystal unit; and a circuit substrate, on which circuit elements of the crystal unit, the oscillator output circuit and the temperature control circuit are installed. The temperature control circuit includes: heating chip resistors; a power transistor; and a temperature sensing element. The dummy terminals are connected to a circuit terminal for dummy on the circuit substrate. The circuit terminal for dummy is connected to an electrically-conducting path, to which one terminal of the heating chip resistors is electrically connected, on the circuit substrate. | 03-25-2010 |
20100123522 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a crystal unit including a case main body including a first power source terminal on an outer bottom surface thereof; a surface-mounted oscillator; a temperature control circuit including a heating resistor and a temperature sensor; and a circuit substrate including a second power source terminal. One ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal. The first power source terminal of the surface-mounted oscillator and the one ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal of the circuit substrate. The first power source terminal of the surface-mounted oscillator is directly and electrically connected to, at least, the one end of the temperature sensor via an electrically-conducting path. | 05-20-2010 |
20100164635 | Oven controlled multistage crystal oscillator - An object of the invention is to provide an oven controlled crystal oscillator that prevents a reduction in characteristics due to temperature rise in the crystal vibrator and circuit elements other than the oscillating stage, and that increases energy efficiency of a heater element, to thereby facilitate temperature control. The oven controlled crystal oscillator of the invention is an oven controlled multistage crystal oscillator provided with: a crystal vibrator; circuit elements of an oscillating stage, a buffering stage, and a temperature control circuit; and first, second, and third circuit substrates, wherein the configuration is such that: on the first circuit substrate or the second circuit substrate, there are arranged the heater element and the circuit element of the oscillating stage thermally bonded to the heater element; on the third circuit substrate, there are arranged the circuit element of the buffering stage, and at least the circuit elements of the temperature control circuit excluding the heater element and the temperature sensor element; and the third circuit substrate is distanced in the vertical direction and thermally isolated, with a clearance, from the first and second circuit substrates. | 07-01-2010 |
20100231309 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a surface-mount crystal unit, in which a crystal element is housed in a case main body to hermetically encapsulate the crystal element with a metal cover, and which includes a crystal terminal serving as a mounting terminal that is electrically connected to at least the crystal element on an outer bottom face of the case main body; a thermistor that detects an operational temperature of the surface-mount crystal unit; and a circuit substrate, on which elements forming an oscillator circuit and elements forming a temperature control circuit along with the thermistor are installed. The thermistor includes a first and second terminal electrode and a temperature detecting electrode that is electrically independent of the first and second terminal electrode. The temperature detecting electrode is electrically connected to the crystal terminal of the surface-mount crystal unit through a circuit pattern formed on the circuit substrate. | 09-16-2010 |
20120146735 | SURFACE MOUNTED OVEN CONTROLLED CRYSTAL OSCILLATOR - A surface mounted oven controlled crystal oscillator includes a crystal oscillator shell, a crystal oscillation circuit, several functional pins and a base plate. The crystal oscillation circuit is accommodated in a cavity that is formed by the crystal oscillator shell and the base plated and electrically connects with the functional pins. The functional pins drill through the base plate from the cavity. An insulating layer is formed between each functional pin and the base plate. The surface mounted oven controlled crystal oscillator further includes several pads formed at an outer surface of the base plate. The insulating layer is also formed between each pad and the base plate, and the functional pins are electrically connected with the corresponding pads respectively. Added pads, the oven controlled crystal oscillator has high stability, simple manufacturing process, and low manufacturing cost. Moreover, the oven controlled crystal oscillator is mounted on the product by using surface mounted technology, thereby achieving mechanized batch production with high efficiency. | 06-14-2012 |
20120299662 | DEVICES, SYSTEMS, AND METHODS FOR CONTROLLING THE TEMPERATURE OF RESONANT ELEMENTS - A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements. | 11-29-2012 |
20120306582 | OVEN-CONTROLLED CRYSTAL OSCILLATOR - A crystal unit and a thermistor with negative resistance-temperature characteristics are housed in a thermostatic oven heated by a heater. A transistor driving the heater is controlled by an output of a differential amplifier, the thermistor is placed between a power supply voltage and an inverting input of the amplifier, and a first resistor used to adjust the temperature of a zero temperature coefficient point of the crystal unit is installed between the inverting input and a ground point. A second resistor is installed between the power supply voltage and a non-inverting input of the amplifier and a third resistor is installed between the non-inverting input and ground point. One of the second and third resistors is a resistor assembly made up of a plurality of resistance elements and one of these resistance elements is provided with positive resistance-temperature characteristics and adapted to detect ambient temperature. | 12-06-2012 |
20130300510 | OSCILLATING DEVICE AND ELECTRONIC APPARATUS - An oscillating device includes an atomic oscillator, an oven controlled crystal oscillator, a correcting unit configured to correct an output signal of the oven controlled crystal oscillator on the basis of an output signal of the atomic oscillator, a housing configured to house the atomic oscillator and the oven controlled crystal oscillator, and a temperature adjusting unit configured to adjust the temperature in the housing to a predetermined temperature. | 11-14-2013 |
20140132361 | HEATER DEVICE AND OSCILLATION APPARATUS - A heater device includes a temperature detector, a heater control circuit, a heater, a voltage supply path, and an overheat prevention circuit. The overheat prevention circuit includes a positive-temperature-coefficient thermistor and a pull-up resistor. The positive-temperature-coefficient thermistor is interposed on the voltage supply path in a position for being heated by the heater. The pull-up resistor that includes: one end connected between the heater and the positive-temperature-coefficient thermistor, and another end connected to a direct current power source. The control voltage to be applied to the heater is restricted to a voltage at a connection point between the positive-temperature-coefficient thermistor and the pull-up resistor when the control voltage from the heater control circuit is abnormally decreased. | 05-15-2014 |
20140218121 | SURFACE MOUNT DEVICE-TYPE LOW-PROFILE OSCILLATOR - A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit. | 08-07-2014 |
20160204759 | RESONATION DEVICE, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT | 07-14-2016 |