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Having particular substrate biasing

Subclass of:

327 - Miscellaneous active electrical nonlinear devices, circuits, and systems

327524000 - SPECIFIC IDENTIFIABLE DEVICE, CIRCUIT, OR SYSTEM

327530000 - With specific source of supply or bias voltage

Patent class list (only not empty are listed)

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Class / Patent application numberDescriptionNumber of patent applications / Date published
327535000 Having stabilized bias or power supply level 495
Entries
DocumentTitleDate
20110175673SEMICONDUCTOR DEVICE AND DATA PROCESSING SYSTEM INCLUDING THE SAME - A pair of power nodes of a logic circuit that needs to output a high level at the time of standby is connected to third and fifth dummy power lines and a pair of power nodes of a logic circuit that needs to output a low level at the time of standby are connected to second and sixth dummy power lines. Fourth, third, sixth, and fifth potentials of the second, third, fifth, and sixth dummy power lines satisfy fourth potentialfifth potential>second potential. With this configuration, a leakage current flowing between a substrate and a gate of a transistor that becomes on at the time of standby, and a leakage current flowing between the substrate and a drain of a transistor that becomes off at the time of standby can be reduced.07-21-2011
20100156510SOI RADIO FREQUENCY SWITCH FOR REDUCING HIGH FREQUENCY HARMONICS - First doped semiconductor regions having the same type doping as a bottom semiconductor layer and second doped semiconductor regions having an opposite type doping are formed directly underneath a buried insulator layer of a semiconductor-on-insulator (SOI) substrate. The first doped semiconductor regions and the second doped semiconductor regions are electrically grounded or forward-biased relative to the bottom semiconductor layer at a voltage that is insufficient to cause excessive current due to forward-biased injection of minority carriers into the bottom semiconductor layer, i.e., at a potential difference not exceeding 0.6 V to 0.8V. The electrical charges formed in an induced charge layer by the electrical signal in semiconductor devices on the top semiconductor layer are drained through electrical contacts connected to the first and second doped semiconductor regions, thereby reducing of harmonic signals in the semiconductor devices above and enhancing the performance of the semiconductor devices as a radio-frequency (RF) switch.06-24-2010
20100117717SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS WHICH IS CAPABLE OF CONTROLLING A SUBSTRATE VOLTAGE UNDER THE LOW SOURCE VOLTAGE DRIVING OF A MINIATURIZED MOSFET - Provided is a semiconductor integrated circuit apparatus capable of controlling the substrate voltage of a MOSFET so that the drain current for an arbitrary gate voltage value in a subthreshold region or a saturated region will be free from temperature dependence and process variation dependence, thereby enhancing the stable operation thereof. The semiconductor integrated circuit apparatus includes: an integrated circuit main body having a plurality of MOSFETs on a semiconductor substrate; a monitor unit for monitoring at least one of the drain currents of the plurality of MOSFETs; and a substrate voltage regulating unit for controlling the substrate voltage of the semiconductor substrate so as to keep constant the drain current. The monitor unit includes a constant current source and a monitoring MOSFET formed on the same substrate as the plurality of MOSFETs, the substrate voltage regulating unit includes a comparison unit for comparing the source potential of the monitoring MOSFET with a predetermined reference potential with the drain terminal of the monitoring MOSFET and the drain terminals of the plurality of MOSFETs connected to ground, and the substrate voltage regulating unit feeds back the output voltage output based on the comparison result by the comparison unit to the substrate voltage of the monitoring MOSFET.05-13-2010
20100085109SWITCH CIRCUIT, VARIABLE CAPACITOR CIRCUIT AND IC OF THE SAME - A first terminal T04-08-2010
20090091375SYSTEM AND METHOD TO MINIMIZE TRANSITION TIME BETWEEN CIRCUIT OPERATING MODES - A system is disclosed. The system includes a first circuit, the first circuit includes a bias device for allowing the first circuit to transition between a first mode and a second mode. The system further includes a second circuit which controls the bias device. The second circuit provides a bias voltage at a sub-threshold voltage level to the bias device when the first device is in one of the first and the second mode. The second circuit provides a bias voltage at a threshold voltage level or higher when the first device is in one of the first and the second mode. Accordingly, the transition time between modes of the first circuit is minimized.04-09-2009
20110193619SEMICONDUCTOR ELECTRONIC COMPONENTS AND CIRCUITS - An electronic component includes a high-voltage depletion-mode transistor and a low-voltage enhancement-mode transistor both encased in a single package. A source electrode of the high-voltage depletion-mode transistor is electrically connected to a drain electrode of the low-voltage enhancement-mode transistor, a drain electrode of the high-voltage depletion-mode transistor is electrically connected to a drain lead of the single package, a gate electrode of the low-voltage enhancement-mode transistor is electrically connected to a gate lead of the single package, a gate electrode of the high-voltage depletion-mode transistor is electrically connected to an additional lead of the single package, and a source electrode of the low-voltage enhancement-mode transistor is electrically connected to a conductive structural portion of the single package.08-11-2011
20090121779METHOD AND APPARATUS FOR CONTROLLING A CIRCUIT WITH A HIGH VOLTAGE SENSE DEVICE - A control circuit with a high voltage sense device. In one embodiment, a circuit includes a first transistor disposed in a first substrate having first, second and third terminals. A first terminal of the first transistor is coupled to an external voltage. A voltage provided at a third terminal of the first transistor is substantially proportional to a voltage between the first and second terminals of the first transistor when the voltage between the first and second terminals of the first transistor is less than a pinch-off voltage of the first transistor. The voltage provided at the third terminal of the first transistor is substantially constant and less than the voltage between the first and second terminals of the first transistor when the voltage between the first and second terminals of the first transistor is greater than the pinch-off voltage of the first transistor. The circuit also includes a control circuit disposed in the first substrate and coupled to the third terminal of the first transistor. The circuit further includes a second transistor disposed in a second substrate. A first terminal of the second transistor coupled to the external voltage.05-14-2009
20100117718METHOD AND APPARATUS FOR CONTROLLING A CIRCUIT WITH A HIGH VOLTAGE SENSE DEVICE - A control circuit with a high voltage sense device. In one embodiment, a circuit includes a first transistor disposed in a first substrate having first, second and third terminals. A first terminal of the first transistor is coupled to an external voltage. A voltage provided at a third terminal of the first transistor is substantially proportional to a voltage between the first and second terminals of the first transistor when the voltage between the first and second terminals of the first transistor is less than a pinch-off voltage of the first transistor. The voltage provided at the third terminal of the first transistor is substantially constant and less than the voltage between the first and second terminals of the first transistor when the voltage between the first and second terminals of the first transistor is greater than the pinch-off voltage of the first transistor. The circuit also includes a control circuit disposed in the first substrate and coupled to the third terminal of the first transistor. The circuit further includes a second transistor disposed in a second substrate. A first terminal of the second transistor coupled to the external voltage.05-13-2010
20100066436ACTIVE-TIME DEPENDENT BIAS CURRENT GENERATION FOR SWITCHED-CAPACITOR CIRCUITS - Exemplary embodiments of the disclosure include adaptively generating a bias current for a switched-capacitor circuit. An exemplary apparatus includes a first phase signal and a second phase signal operating at a sampling rate. An asserted time of the first phase signal and an asserted time of the second phase signal are separated by a predefined non-overlap time. The apparatus also includes a switched-capacitor circuit with a plurality of switched capacitors operably coupled to the first phase signal and the second phase signal. An amplifier is operably coupled to the switched-capacitor circuit and has a response time inversely proportional to an adaptive bias current. A bias generator is coupled to the amplifier and operates to modify the adaptive bias current responsive to the asserted time of the first phase signal.03-18-2010
20090174464APPARATUS AND METHOD FOR IMPROVED LEAKAGE CURRENT OF SILICON ON INSULATOR TRANSISTORS USING A FORWARD BIASED DIODE - Use of a forward biased diode to reduce leakage current of transistors implemented on silicon on insulator (SOI) is a particular challenge due to the difficulty of achieving effective contact with the region beneath the gate of the transistor. An improved implementation in SOI gate fingers that reach under the source through tunnels that are contacted with a region outside the transistor. A further embodiment uses drain extension implants to provide good channel connection.07-09-2009
20100073076SYSTEM FOR SUBSTRATE POTENTIAL REGULATION DURING POWER-UP IN INTEGRATED CIRCUITS - An integrated circuit with body-bias inputs coordinated by a switch at initial power application. A switch coupled to the N-well bias and P-type substrate bias lines of an integrated circuit selectively couples the substrate to ground or the substrate bias supply, depending upon the state of the bias supply lines. During power-up and the initial application of the N-well bias, the substrate is coupled to ground to prevent a leakage induce rise in the substrate potential. Upon sensing the presence of the substrate bias potential on the substrate bias line, the switch couples the substrate to the substrate bias line instead of ground. In another embodiment, a switch indirectly senses the availability of the substrate bias potential by sensing a charge pump enable signal.03-25-2010
20100073075SYSTEM FOR SUBSTRATE POTENTIAL REGULATION DURING POWER-UP IN INTEGRATED CIRCUITS - An integrated circuit with body-bias inputs coordinated by a switch at initial power application. A switch coupled to the N-well bias and P-type substrate bias lines of an integrated circuit selectively couples the substrate to ground or the substrate bias supply, depending upon the state of the bias supply lines. During power-up and the initial application of the N-well bias, the substrate is coupled to ground to prevent a leakage induce rise in the substrate potential. Upon sensing the presence of the substrate bias potential on the substrate bias line, the switch couples the substrate to the substrate bias line instead of ground. In another embodiment, a switch indirectly senses the availability of the substrate bias potential by sensing a charge pump enable signal.03-25-2010
20100073074MICROPROCESSOR WITH SELECTIVE SUBSTRATE BIASING FOR CLOCK-GATED FUNCTIONAL BLOCKS - A microprocessor according to one embodiment includes a supply node providing a core voltage, a functional block, a charge node, select logic, and substrate bias logic. The functional block has multiple power modes and includes one or more semiconductor devices and a substrate bias rail routed within the functional block and coupled to a substrate connection of at least one semiconductor device. The select logic couples the substrate bias rail to the charge node when the functional block is in a low power mode and clamps the substrate bias rail to the supply node when the functional block is in a full power mode. The substrate bias logic charges the charge node to a bias voltage at an offset voltage relative to the core voltage when the functional block is in the low power mode. Semiconductor devices may be provided to clamp or otherwise couple the bias rail.03-25-2010
20100073073MICROPROCESSOR WITH SUBSTRATE BIAS CLAMPS - A microprocessor including a substrate bias rail providing a bias voltage during a first operating mode, a supply node providing a core voltage, a clamp device coupled between the bias rail and the supply node, and control logic. The control logic turns on the clamp device to clamp the bias rail to the supply node during a second operating mode and turns off the clamp device during the first operating mode. The clamp devices may be implemented with P-channel and N-channel devices. Level shift and buffer circuits may be provided to control the clamp devices based on substrate bias voltage levels. The microprocessor may include a substrate with first and second areas each including separate substrate bias rails. The control logic separately turns on and off clamp devices to selectively clamp the substrate bias rails in the first and second areas based on various power modes.03-25-2010
20100045364ADAPTIVE VOLTAGE BIAS METHODOLOGY - The present disclosure provides an integrated circuit. The integrated circuit includes a frequency detector coupled with a logic circuit; a supply voltage regulator coupled with the frequency detector and designed to provide an adaptive voltage supply to the logic circuit based on a frequency error from the frequency detector; and a substrate bias regulator coupled with the frequency detector and designed to provide an adaptive body bias voltage to the logic circuit based on the frequency error.02-25-2010
20090160531MULTI-THRESHOLD VOLTAGE-BIASED CIRCUITS - A circuit and a method of operation to reduce dynamic and static power dissipation in the circuit are disclosed. The circuit is multi-threshold, voltage-biased and includes a p-channel field effect transistor (FET) and an n-channel FET. A source terminal of the p-channel FET interconnects to a higher-voltage rail of a power supply and a source terminal of the n-channel FET interconnects to a lower-voltage rail of the power supply. At least one of the FETs includes a back contact. The circuit may be operated by applying a fixed bias voltage to the back contact. The fixed bias voltage is independent of the power supply voltage which may be varied. In a normal state, the supply voltage is adjusted to decrease dynamic power consumption. In a low power state, the supply voltage is further adjusted to limit leakage current. The circuit may optionally include a second fixed biasing voltage source so that both FETs are biased.06-25-2009
20120206190SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a semiconductor circuit and an electric-power supply. The semiconductor circuit includes a main element including a switching element and an antiparallel diode, a reverse voltage application circuit including a high-speed free wheeling diode, a capacitor and an auxiliary element, a main element drive circuit, and an auxiliary element drive circuit. The electric-power supply is configured to supply electric-power to the capacitor, the main element drive circuit and the auxiliary element drive circuit, and has a voltage lower than the withstand voltage of the main element.08-16-2012
20100109756SEMICONDUCTOR DEVICE - A substrate voltage control technique that prevents the operating speed from being decreased and suppresses a leakage current due to a lower threshold voltage with respect to a low voltage use. Since a center value of the threshold voltages is detected by plural replica MOS transistors, and a substrate voltage is controlled to control a center value of the threshold voltages, thereby making it possible to satisfy a lower limit of the operating speed and an upper limit of a leakage current of the entire chip. On the other hand, the substrate voltage is dynamically controlled during the operation of the chip, thereby making it possible to decrease the center value of the threshold voltages when the chip operates to improve the speed, and to increase the center value of the threshold voltages after the operation of the chip to reduce the leakage current of the entire chip.05-06-2010
20100109755SEMICONDUCTOR DEVICE - A semiconductor device capable of improving the breakdown voltage in the overall device is provided. The semiconductor device includes: a semiconductor substrate; a p-MOS formed on a surface layer portion of the semiconductor substrate; an n-MOS formed on the surface layer portion of the semiconductor substrate and serially connected with the p-MOS between a power source and a ground; and a substrate potential control circuit for controlling the potential of the back surface of the semiconductor substrate to an intermediate potential higher than the ground potential and lower than the potential of the power source.05-06-2010
20130069710POWER TRANSISTOR WITH CONTROLLABLE REVERSE DIODE - An electronic circuit includes a transistor device that can be operated in a reverse operation mode and a control circuit. The transistor device includes a source region, a drain region, a body region and a drift region, a source electrode electrically connected to the source region, a pn junction formed between the body region and the drift region, a gate electrode adjacent the body region and dielectrically insulated from the body region, and a depletion control structure adjacent the drift region. The depletion control structure has a control terminal and is configured to generate a depletion region in the drift region dependent on a drive signal received at the control terminal. The control circuit is coupled to the control terminal of the depletion control structure and configured to drive the depletion control structure to generate the depletion region when the transistor device is operated in the reverse operation mode.03-21-2013
20100001787DYNAMICALLY-DRIVEN DEEP N-WELL CIRCUIT - A circuit includes an NMOS transistor having a drain and a source, a p-well containing the drain and the source, an n-well under the p-well, and a first well switch configured to selectively connect the n-well to a predetermined voltage in response to an enable phase of a first switching signal. The first well switch can be configured to connect the n-well to the predetermined voltage during the enable phase of the first switching signal and to electrically float the n-well during a non-enable phase of the first switching signal.01-07-2010
20130088283TYPE-SWITCHING TRANSISTORS, ELECTRONIC DEVICES INCLUDING THE SAME, AND METHODS OF OPERATING THE TYPE-SWITCHING TRANSISTORS AND ELECTRONIC DEVICES - Type-switching transistors, electronic devices including the same, and methods of operating thereof are provided. A type-switching transistor may include a plurality of gates corresponding to a channel layer. The plurality of gates may include a first gate for switching a type of the transistor and a second gate for controlling ON/OFF characteristics of the channel layer. The first and second gates may be disposed on one side of the channel layer so that the channel layer is not disposed between the first and second gates.04-11-2013
20090302929Methods and Apparatus for Varying a Supply Voltage or Reference Voltage Using Independent Control of Diode Voltage in Asymmetrical Double-Gate Devices - Methods and apparatus are provided for varying one or more of a supply voltage and reference voltage in an integrated circuit, using independent control of a diode voltage in an asymmetrical double-gate device. An integrated circuit is provided that is controlled by one or more of a supply voltage and a reference voltage. The integrated circuit comprises an independently controlled asymmetrical double-gate device to adjust one or more of the supply voltage and the reference voltage. The independent control may comprise, for example, a back gate bias. The independently controlled asymmetrical double-gate device may be employed in a number of applications, including voltage islands, static RAM, and to improve the power and performance of a processing unit.12-10-2009
20090289696Apparatus and Methods for Adjusting Performance of Integrated Circuits - A programmable logic device (PLD) includes a delay circuit and a body-bias generator. The delay circuit has a delay configured to represent a delay of user circuit implement in the PLD. The body-bias generator is configured to adjust the body bias of a transistor within the user circuit. The body-bias generator adjusts the body bias of the transistor in response to a level derived from the signal propagation delay of the delay circuit.11-26-2009
20120223765Method and System for Passive Signal Detector for Chip Auto Power on and Power Down - While an IC chip is in idle mode with no power being supplied to the IC chip, the IC chip may be operable to detect a signal pulse received by the IC chip using energy associated with the signal pulse. The IC chip may be operable to control a control signal for a power switch using the energy associated with the signal pulse. The power switch may allow power to be provided to the IC chip based on the control signal. The IC chip may comprise a pulse detector, a latch circuit and an ON/OFF logic circuit within the IC chip. While the IC chip is fully powered and communication with a partner chip is finished, the IC chip may be operable to control the control signal to turn off the power switch for powering down the IC chip based on a turn-off signal.09-06-2012
20120194261CASCODED COMPARATOR WITH DYNAMIC BIASING FOR COLUMN PARALLEL SINGLE SLOPE ADCS - Aspects of the invention may include receiving a first input signal and a second input signal via respective first and second input transistors. A biasing signal, generated by a cascode bias generator, tracks the first input signal, where the biasing signal has a fixed offset with respect to the first input signal. The biasing signal may be applied to the first and second cascode transistors that may be cascoded to the first and second input transistors, respectively.08-02-2012
20080309397Semiconductor device including a bias voltage generator - A semiconductor device including a bias voltage generator formed from a junction field effect transistor (JFET). The JFET includes a control gate terminal and a first and a second source/drain terminal. The first and second source/drain terminals can form a first terminal of a p-n junction and the control gate terminal can form a second terminal of the p-n junction. The first terminal of the p-n junction can be provided with a first potential. The second terminal can be left essentially floating to provide a bias voltage. A bias receiving circuit can receive the bias voltage. The bias receiving circuit can be in close proximity on the semiconductor device to the bias voltage generator.12-18-2008
20130162330PHOTO CELL DEVICES FOR PHASE-SENSITIVE DETECTION OF LIGHT SIGNALS - Embodiments relate to photo cell devices. In one embodiment, a trench-based photo cells provides very fast capture of photo-generated charge carriers, particularly when compared with conventional approaches, as the trenches of the photo cells create depleted regions deep within the bulk of the substrate that avoid the time-consuming diffusion of carriers.06-27-2013
20130162331DIODE STRING VOLTAGE ADAPTER - A diode string voltage adapter includes diodes formed in a substrate of a first conductive type. Each diode includes a deep well region of a second conductive type formed in the substrate. A first well region of the first conductive type formed on the deep well region. A first heavily doped region of the first conductive type formed on the first well region. A second heavily doped region of the second conductive type formed on the first well region. The diodes are serially coupled to each other. A first heavily doped region of a beginning diode is coupled to a first voltage. A second heavily doped region of each diode is coupled to a first heavily doped region of a next diode. A second heavily doped region of an ending diode provides a second voltage. The deep well region is configured to be electrically floated.06-27-2013
20130162332INTEGRATED CIRCUITS WITH REDUCED VOLTAGE ACROSS GATE DIELECTRIC AND OPERATING METHODS THEREOF - An integrated circuit includes a first pad configured to carry a signal, a first receiver having an input node, a second receiver having an input node, a first pass gate, and a second pass gate. The first pass gate is coupled between the first pad and the input node of the first receiver. The first pass gate is configured to be turned on when the signal on the first pad is greater than a first voltage level. The second pass gate is coupled between the first pad and the input node of the second receiver. The second pass gate is configured to be turned on when the signal on the first pad is less than a second voltage level.06-27-2013
20100102872Dynamic Substrate Bias for PMOS Transistors to Alleviate NBTI Degradation - This invention discloses a system and method for suppressing negative bias temperature instability in PMOS transistors, the system comprises a PMOS transistor having a source connected to a power supply, and a voltage control circuitry configured to output a first and a second voltage level, the first and second voltage levels being different from each other, the first voltage level is lower than the power supply voltage, the second voltage level is equal to or higher than the power supply voltage, wherein when the PMOS transistor is turned on, the first voltage level is applied to a substrate of the PMOS transistor, and when the PMOS transistor is turned off, the second voltage level is applied to the substrate of the PMOS transistor.04-29-2010
20110169556ANALOG CIRCUIT AND DISPLAY DEVICE AND ELECTRONIC DEVICE - The invention provides an analog circuit that decreases an effect of variation of a transistor. By flowing a bias current in a compensation operation, a voltage between the gate and source of the transistor to be compensated is held in a capacitor. In a normal operation, the voltage stored in the compensation operation is added to a signal voltage. As the capacitor holds the voltage according to the characteristics of the transistor to be compensated, the effect of variation can be decreased by adding the voltage stored in the capacitor to the signal voltage. Further, an analog circuit which decreases the effect of variation can be provided by applying the aforementioned basis to a differential circuit, an operational amplifier and the like.07-14-2011
20100085108SYSTEM AND METHOD FOR ADJUSTING SUPPLY VOLTAGE LEVELS TO REDUCE SUB-THRESHOLD LEAKAGE - A voltage regulation module which includes an adjustable voltage which reduces the positive supply voltage and increases the negative supply voltage during a lower power mode. The voltage regulation module includes a voltage generator which provides an N-type substrate bias voltage at the normal operating voltage level of the positive supply voltage and which provides a P-type substrate bias voltage at the normal operating voltage level of the negative supply voltage during the lower power mode. Thus, the supply voltage levels are adjusted rather than the substrate bias voltages during the lower power mode. The voltage generator may be implemented as a voltage regulator, or may be implemented as a bias generator or charge pump or the like.04-08-2010
20110063017SEMICONDUCTOR DEVICE - A semiconductor device includes a first circuit, a second circuit, and a first voltage dividing circuit. The first circuit is coupled to a first terminal. The first circuit is operable by a first voltage supplied from the first terminal. The second circuit is coupled through a first resistive element to the first terminal. The second circuit is operable by a second voltage supplied through the first resistive element from the first terminal. The second voltage is smaller in absolute value than the first voltage. The first voltage dividing circuit is coupled to a first node between the first resistive element and the second circuit. The first voltage dividing circuit has a conductive state and a non-conductive state. The first voltage dividing circuit is kept in the conductive state while applying the first voltage to the first terminal to allow the first circuit to operate by the first voltage.03-17-2011
20090206913Edge Termination with Improved Breakdown Voltage - A MOSFET switch which has a low surface electric field at an edge termination area, and also has increased breakdown voltage. The MOSFET switch has a new edge termination structure employing an N-P-N sandwich structure. The MOSFET switch also has a polysilicon field plate configuration operative to enhance any spreading of any depletion layer located at an edge of a main PN junction of the N-P-N sandwich structure.08-20-2009
20110169555Mitigating Side Effects Of Impedance Transformation Circuits - The present disclosure relates to mitigating side effects of impedance transformation circuits.07-14-2011
20080211570Systems, Methods, and Integrated Circuits with Inrush-Limited Power Islands - A new approach for managing turn-on of power islands uses a precharge phase to begin the process of bringing up the island's internal supply voltage, while minimizing transients and associated power-control-logic instability.09-04-2008
20090273390METHOD OF MEDIATING FORWARD VOLTAGE DRIFT IN A SIC DEVICE - A method of reversing Shockley stacking fault expansion includes providing a bipolar or a unipolar SiC device exhibiting forward voltage drift caused by Shockley stacking fault nucleation and expansion. The SiC device is heated to a temperature above 150° C. A current is passed via forward bias operation through the SiC device sufficient to induce at least a partial recovery of the forward bias drift.11-05-2009
20090295463SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate, a first lower-layer line for supplying power to a transistor formed on the semiconductor substrate, a first interlayer line which is connected to the first lower-layer line, and an allowable current of which is larger than that of the first lower-layer line; and an upper-layer line which is provided above the first interlayer line and receives power input from outside. The first interlayer line is connected to the upper-layer line through a switch circuit formed on the semiconductor substrate.12-03-2009
20120119821INTEGRATED CIRCUIT FOR EMULATING A RESISTOR - An integrated circuit for emulating a resistor is based on the output resistance of a non-linear circuit element, such as a transistor. In the case of a transistor, it is biased into operation in its linear region, and a voltage dependent on the ac source-drain voltage is coupled to the gate voltage, thereby to improve linearity of the drain-source resistance with respect to the drain-source voltage. This modification to the gate voltage can be used to alter the transfer function such that the drain-source resistance is no longer dependent on the drain-source voltage.05-17-2012
20100102871ELECTRONIC CIRCUIT AND METHOD FOR CONTROLLING A POWER FIELD EFFECT TRANSISTOR - An electronic circuit and a method for controlling a power field effect transistor. The electronic circuit comprises a power field effect transistor having a semiconductor body, which has a drain zone, a drift zone, a source zone and a bulk zone. The power field effect transistor further comprises a gate and a field plate. The field plate is placed adjacent to the drift zone and is isolated from the drift zone. A switch circuitry is provided for electrically connecting the field plate depending on the drain-source voltage such that the field plate is electrically connected to the drain zone, if |UDS|>UT, where UT is a predetermined voltage, and if |UDS|>UT, the field plate is connected to an electrode having an electrode-source voltage UES.04-29-2010
20090033406INTERNAL VOLTAGE GENERATOR OF SEMICONDUCTOR INTEGRATED CIRCUIT - The internal voltage generator of a semiconductor integrated circuit includes at least one variable reference voltage generating unit that generates a base reference voltage increased or decreased according to the variation in temperature, at least one level shifting unit that transforms the base reference voltage outputted by the at least one variable reference voltage generating unit into at least one prescribed reference voltage for generating internal voltage and outputs the transformed reference voltage, and at least one internal voltage generating unit that generates an internal voltage by using the at least one reference voltage for generating internal voltage outputted by the at least one level shifting unit.02-05-2009
20080246533METHODS AND CIRCUITS TO REDUCE THRESHOLD VOLTAGE TOLERANCE AND SKEW IN MULTI-THRESHOLD VOLTAGE APPLICATIONS - A circuit and a method for adjusting the performance of an integrated circuit, the circuit includes: first and second sets of FETs having respective first and second threshold voltages, the first threshold voltage different from the second threshold voltage; a first monitor circuit containing at least one FET of the first set of FETs and a second monitor circuit containing at least one FET of the second set of FETs; a compare circuit configured to generate a compare signal based on a performance measurement of the first monitor circuit and a performance measurement of the second monitor circuit; and a control unit configured to generate a control signal to a voltage regulator based on the compare signal, the voltage regulator configured to supply a bias voltage to wells of FETs of the second set of FETs, the value of the bias voltage based on the control signal.10-09-2008
20100201434PRECISE CONTROL COMPONENT FOR A SUBSTRATE POTENTIAL REGULATION CIRCUIT - A control circuit for substrate potential regulation for an integrated circuit device. The control circuit includes a current source configured to generate a reference current. A variable resistor is coupled to the current source. The variable resistor is configured to receive the reference current and generate a reference voltage at a node between the current source and the variable resistor. The reference voltage controls the operation of a substrate potential regulation circuit coupled to the node.08-12-2010
20100127759Method of operating semiconductor device - Provided is a method of operating a semiconductor device, in which a gate voltage or a drain voltage is adjusted in order to add carriers to or remove carriers from a body region, thereby realizing semiconductor having a plurality of data states.05-27-2010
20080278219BIAS SWITCHING CIRCUIT - An embodiment of a bias switching circuit may include a first transfer switch that transmits a bias voltage to a first output node in response to a first switching signal, a second transfer switch that transmits a first power voltage to the first output node in response to a second switching signal, a third transfer switch that transmits the bias voltage to a second output node in response to the second switching signal, a fourth transfer switch that transmits the first power voltage to the second output node in response to the first switching signal. The circuit may further include a first transistor that transmits a second power voltage to the first output node in response to a third switching signal, and a second transistor that transmits the second power voltage to the second output node in response to a fourth switching signal.11-13-2008
20080238532SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - With an ultrasound pulser suitable for application to a medical ultrasound system, and so forth, a high voltage power supply of a transducer drive circuitry, on both high potential and low potential sides, is rendered variable in a range of 0 V on the order of ±200 V, thereby implementing a semiconductor integrated circuit wherein a plurality of the ultrasound pulsers corresponding to a plurality of channels, respectively, are integrally formed on a small area. The ultrasound pulser has a configuration wherein, in a MOSFET gate drive circuitry, an input voltage pulse is converted into a current pulse, and the current pulse is converted again into a voltage pulse on the basis of a high potential side voltage +HV, and a low potential side voltage −HV, applied to a transducer drive circuitry, whereupon voltage level shift in the input voltage pulse is attained, and a voltage pulse swing of an output buffer of the MOSFET gate drive circuitry receiving a shifted voltage pulse is generated by the MOSFET gate drive circuitry similarly on the basis of the high potential side voltage +HV, and the low potential side voltage −HV, applied to the transducer drive circuitry. The MOSFET gate drive circuitry is DC-coupled with the transducer drive circuitry.10-02-2008
20130120054DIE POWER STRUCTURE - A die including a first set of power tiles arranged in a first array and having a first voltage; a second set of power tiles arranged in a second array offset from the first array and having a second voltage; a set of power mesh segments enclosed by the second set of power tiles and having the first voltage; a first power rail passing underneath the set of power mesh segments and the first set of power tiles; and a set of vias operatively connecting the power rail with the set of power mesh segments and the first plurality of power tiles.05-16-2013
20100141330POWER-DOWN CIRCUIT WITH SELF-BIASED COMPENSATION CIRCUIT - A circuit includes a first power supply node at a first power supply voltage; a gated-node; and a first control device coupled between the first power supply node and the gated-node. The first control device is configured to pass the first power supply voltage to the gated-node or to disconnect the gated-node from the first power supply voltage. A second control device is coupled between the first power supply node and the gated-node. The second control device is configured to pass a gated-voltage to the gated-node or disconnect the gated-node from the gated-voltage. A voltage-drop device is coupled between the first power supply node and the gated-node, wherein the voltage-drop device is serially connected with the second control device. A negative-feedback current source is connected in parallel with the voltage-drop device. The negative-feedback current source is configured to provide a current tracking a variation of the gated-voltage at the gated-node.06-10-2010
20110140766BOOSTER CIRCUIT AND VOLTAGE SUPPLY CIRCUIT - A booster circuit includes a pump circuit having a plurality of charge pump circuits for outputting a boosted voltage to a first output terminal. The booster circuit also includes a clock adjusting circuit that generates, from a first clock signal, a second clock signal for operating the charge pump circuits. A pump controlling circuit outputs the first clock signal for operating the pump circuit. A first comparator outputs a first output signal. A second comparator outputs a second output signal. A third comparator outputs a third output signal. A gradient of the boosted voltage is decreased when the first output signal is output. A frequency of the first clock signal is reduced when the second output signal is output. The third output signal is output when the boosted voltage is higher than a set value of the boosted voltage.06-16-2011
20090085648Sampling Device And Circuit Having A Single Voltage Supply - In embodiments of the present invention a device, circuit, and method are described for sampling input signal voltages, which may include voltages below a negative supply voltage for the device or circuit, without requiring static current from the input. Various embodiments of the invention obviate the requirement of an external negative supply voltage or attenuation resistors to allow sampling between a positive and negative voltage range. These embodiments result in a lower power sampling solution as well as simplifying any driver circuitry required by the sampler. The embodiments of the invention may be applied to sampling processes within analog-to-digital converters and may also be applicable to various other types of circuits in which a sampling input having input voltages that are lower than its negative supply voltage.04-02-2009
20090096507Integrated Semiconductor Metal-Insulator-Semiconductor Capacitor - An integrated MIS capacitor has two substantially identical MIS capacitors. A first capacitor comprises a first region of a first conductivity type adjacent to a channel region of the first conductivity type in a semiconductor substrate. The semiconductor substrate has a second conductivity type. A gate electrode is insulated and spaced apart from the channel region of the first capacitor. The second capacitor is substantially identical to the first capacitor and is formed in the same semiconductor substrate. The gate electrode of the first capacitor is electrically connected to the first region of the second capacitor and the gate electrode of the second capacitor is electrically connected to the first region of the first capacitor. In this manner, the capacitors are connected in an anti-parallel configuration. A capacitor which has high capacitance densities, low process complexity, ambipolar operation, low voltage and temperature coefficient, low external parasitic resistance and capacitance and good matching characteristics for use in analog designs that can be integrated with existing semiconductor processes results.04-16-2009
20120194262SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - Data is written in the following manner: potentials of first and second control gates of a transistor are set at a potential for making a storage gate of the transistor a conductor, a potential of data to be stored is supplied to the storage gate, and at least one of the potentials of the first and second control gates is set at a potential for making the storage gate an insulator. Data is read in the following manner: the potential of the second control gate is set at a potential for making the storage gate an insulator; a potential is supplied to a wiring connected to one of a source and a drain of the transistor; then, a potential for reading is supplied to the first control gate to detect a change in the potential of a bit line connected to the other of the source and the drain.08-02-2012
20090201075Method and Apparatus for MOSFET Drain-Source Leakage Reduction - A method and apparatus are taught for reducing drain-source leakage in MOS circuits. In an exemplary CMOS logic gate, a first transistor causes the body of an affected transistor to be at a first body potential. A second transistor brings the body potential of the affected transistor to a second body potential by providing an accurate body voltage from a body voltage source. The first transistor's gate is controlled by a digital voltage source having a same polarity as that of an output of the CMOS logic gate and the second transistor is controlled by a digital voltage source having a same polarity as that of an input to the CMOS logic gate.08-13-2009
20090072888Semiconductor integrated circuit - A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.03-19-2009
20080231345Silicon Wafer For Semiconductor With Powersupply System on the Backside of Wafer - Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.09-25-2008
20100295606SEMICONDUCTOR INTEGRATED CIRCUIT DESIGN SUPPORT SYSTEM, DESIGN SUPPORT METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit design support system having a partial power control mechanism includes a partial power control simulation program configured to perform a partial power control simulation on the basis of a circuit description of the semiconductor integrated circuit and a power specifications description, a power mode transition detection program configured to detect a power mode which is run during execution of the partial power control simulation and record power mode information of an examined power mode, and a power mode transition check program configured to check whether the examined power mode recorded at the time of execution of partial power control is used and output a check result.11-25-2010
20130135036SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Efficient reduction in power consumption is achieved by combinational implementation of a power cutoff circuit technique using power supply switch control and a DVFS technique for low power consumption. A power supply switch section fed with power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in a DEEP-NWELL region formed over a semiconductor substrate. Another power supply switch section fed with another power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in another DEEP-NWELL region formed over the semiconductor substrate. In this arrangement, there arises no possibility of short-circuiting between different power supplies via each DEEP-NWELL region formed over the semiconductor substrate.05-30-2013
20110025407DYNAMICALLY DRIVEN DEEP N-WELL CIRCUIT - A circuit can include an NMOS transistor having a drain and a source, a p-well containing the drain and the source, an n-well under the p-well, a circuit node, and a connection element connecting the n-well to the circuit node. The connection element can include a diode having an anode terminal connected to the circuit node and a cathode terminal connected to the n-well, a resistor having a first terminal connected to the circuit node and a second terminal connected to the n-well, a conductor directly connecting the n-well to the circuit node, or a well switch configured to connect the n-well to the circuit node during an enable phase of a switching signal and to electrically float the n-well during a non-enable phase of the switching signal. The diode can include a diode-connected transistor. The circuit node can be configured to receive a predetermined voltage having a magnitude equal to or greater than an upper supply voltage.02-03-2011
20110025406Power Semiconductor Component Including a Potential Probe - A power semiconductor component including a semiconductor body and two load terminals is provided. Provided furthermore is a potential probe positioned to tap an electric intermediate potential of the semiconductor body at a tap location of the semiconductor body for an electric voltage applied across the two load terminals, the intermediate potential being intermediate to the electric potentials of the two load terminals, but differing from each of the two electric potentials of the two load terminals.02-03-2011
20110128069METHOD OF AND STRUCTURE FOR RECOVERING GAIN IN A BIPOLAR TRANSISTOR - A method of recovering gain in a bipolar transistor includes: providing a bipolar transistor including an emitter, a collector, and a base disposed between junctions at the emitter and the collector; reverse biasing the junction disposed between the emitter and the base with an operational voltage and for an operational time period, so that a current gain β of the transistor is degraded; idling the transistor, and generating a repair current I06-02-2011
20100039164FIELD EFFECT TRANSISTOR WITH SHIFTED GATE - A field effect transistor has a shifted gate such that the gate-source distance depends on the ratio of the threshold voltage to the drain voltage. In one embodiment, a switch may include two FETs: one FET in a series configuration and one FET in a shunt configuration. Providing a switch having at least one FET with a shifted gate allows increasing switching speed and decreasing insertion loss.02-18-2010
20100039163SEMICONDUCTOR INTEGRATED CIRCUIT - To provide a semiconductor integrated circuit including: a detection circuit that detects an occurrence of latch up and can be configured while adopting a layout configuration that suppresses the occurrence of latch up; and a recovery unit that enables a recovery from the latch up without cutting off a positive potential. The semiconductor integrated circuit includes: a n-channel MOS transistor 02-18-2010
20100066437Application of Control Signal and Forward Body-Bias Signal to an Active Device - The present disclosure relates to constructing and operating a transistor or other active device with significantly reduced flicker noise.03-18-2010
20110095813MOS TRANSISTOR RESISTOR, FILTER, AND INTEGRATED CIRCUIT - A MOS transistor including a first MOS transistor M04-28-2011
20120200338Dynamic Biasing Systems and Methods - Dynamic biasing methods and circuits are described. The described methods generate bias voltages that are continuously varied so as to control stress voltages across transistors used within a cascode stack.08-09-2012
20110163794POWER SUPPLY CONTROL CIRCUIT - A power supply control circuit comprises an output transistor which controls supply of electric power to a load and a gate driving circuit which generates control signals “a” and “b” for controlling on/off of the output transistor 07-07-2011
20110001553METHOD OF DRIVING REVERSE CONDUCTING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND POWER SUPPLY DEVICE - A technique for a reverse conducting semiconductor device including an IGBT element domain and a diode element domain that utilize body regions having a mutual impurity concentration, that makes it possible to adjust an injection efficiency of holes or electrons to the diode element domain, is provided. When a return current flows in the reverse conducting semiconductor device that uses an NPNP-type IGBT, a second voltage that is higher than a voltage of an emitter electrode is applied to second trench gate electrodes of the diode element domain. N-type inversion layers are formed in the periphery of the second trench gate electrodes, and the electrons flow therethrough via a first body contact region and a drift region which are of the same n-type. The injection efficiency of the electrons to the return current is increased, and the injection efficiency of the holes is decreased. Due to this, an increase in a reverse recovery current can be prevented, and a switching loss caused in the diode element domain can be decreased.01-06-2011
20100321098SYSTEMS AND METHODS FOR INTEGRATED CIRCUITS COMPRISING MULTIPLE BODY BIASING DOMAINS - Systems and methods for integrated circuits comprising multiple body biasing domains. In accordance with a first embodiment of the present invention, a semiconductor structure comprises a substrate of first type material. A first closed structure comprising walls of second type material extends from a surface of the substrate to a first depth. A planar deep well of said second type material underlying and coupled to the closed structure extends from the first depth to a second depth. The closed structure and the planar deep well of said second type material form an electrically isolated region of the first type material. A second-type semiconductor device is disposed to receive a first body biasing voltage from the electrically isolated region of the first type material. A well of the second-type material within the electrically isolated region of the first type material is formed and a first-type semiconductor device is disposed to receive a second body biasing voltage from the well of second-type material.12-23-2010
20120200339CONSTANT-VOLTAGE CIRCUIT AND SEMICONDUCTOR DEVICE THEREOF - A reference-voltage generating circuit of an embodiment includes a first FET; a second FET; a first resistor in which one end is connected to a power supply while the other end is connected to a drain of the first FET; and a second resistor that is connected between the drain and a gate of the first FET, wherein a gate and a source of the second FET are connected, a drain of the second FET is connected to the gate of the first FET, the drain of the first FET outputs a reference voltage, and the source of the first FET and the source of the second FET are connected to a ground or another circuit.08-09-2012
20110018614SEMICONDUCTOR SWITCH - A challenge in outputting a voltage near the midpoint potential in a semiconductor switch which operates based on a low voltage power supply is to avoid a decrease in operation speed and a deterioration in accuracy of the output voltage which would be caused due to an increase in ON-resistance or occurrence of current leakage. Thus, a structure including a gray level generation circuit, an analog switch circuit and a backgate voltage control circuit is provided wherein the backgate voltage of each of an N-channel MOS transistor and a P-channel MOS transistor of the analog switch circuit to which the voltage of the gray level generation circuit is input is supplied from the backgate voltage control circuit which has an equal structure as that of the gray level generation circuit.01-27-2011
20110175672TUNABLE METAMATERIALS - Examples of the present invention include a metamaterial comprising a plurality of resonators disposed on a substrate, the substrate comprising a dielectric support layer and a relatively thin semiconductor layer, having a Schottky junction between at least one conducting resonator and the semiconductor layer. The properties of the resonator may be adjusted by modifying the physical extent of a depletion region associated with the Schottky junction.07-21-2011
20100214009METHOD FOR DIGITAL PROGRAMMABLE OPTIMIZATION OF MIXED-SIGNAL CIRCUITS - A method for digital programmable optimization of a mixed-signal circuit is provided. The method comprises dividing up one or more transistor devices of the mixed-signal circuit into one or more transistor segments, with each transistor segment including a body tie bias terminal. Each body tie bias terminal is coupled to at least one voltage bias, either by placing each body tie bias terminal in signal communication with one or more bias nodes in the mixed-signal circuit, or by placing each body tie bias terminal in signal communication with a non-precision bias voltage source. Each body tie terminal is also arranged to be in signal communication with a separate one of one or more digital programmable storage elements.08-26-2010
20110304385BIAS CIRCUIT AND WIRELESS COMMUNICATION DEVICE INCLUDING THE BIAS CIRCUIT - A bias circuit according to the present invention includes: a transistor for supplying a bias current from the emitter of the transistor; an emitter potential generating device for supplying a potential to the emitter of the transistor; a switch element; and a voltage supply circuit for supplying a base voltage to the base of the transistor in response to the on/off of the switch element, wherein the emitter potential generating device generates a potential causing a potential difference between the base and emitter of the transistor to fall below a saturation voltage at the junction of the transistor, even in the case where the base of the transistor is fed with a voltage not lower the saturation voltage at the junction of the transistor.12-15-2011
20100097124Method of operating semiconductor device - Provided is a method of operating a semiconductor device, wherein an operating mode is set by adjusting timing of a voltage pulse or by adjusting a voltage level of the voltage pulse.04-22-2010
20120044015Universal Digital Input Module in a Process Automation Controller - In a process automation controller, a universal digital input module is provided. The universal digital input module comprises a plurality of digital input channels, each channel to sink a first current at a first voltage level associated with an input having a digital high value and to sink a second current at a second voltage level associated with the input having a digital high value, wherein the first current is greater than the second current and wherein the first voltage is less than the second voltage.02-23-2012
20120001680ISOLATION CIRCUIT - The present disclosure includes various method, device, and system embodiments for isolation circuits. One such isolation circuit embodiment includes: a first transistor configured for connection to a supply voltage via a first terminal; a register connected to the first transistor; a second transistor in parallel with a resistor, wherein the second transistor is configured for connection to the first terminal, with a gate of the second transistor configured for connection to an output of the register; and wherein the second transistor is configured for connection to a second terminal, the second transistor having a state that depends on a status of the register.01-05-2012
20120306567ADJUSTABLE CAPACITANCE STRUCTURE - A capacitance structure comprises a plurality of metal oxide silicon (MOS) capacitors. A first end of each MOS capacitor of the plurality of MOS capacitors is coupled together at an effective node. A second end of each MOS capacitor of the plurality of MOS capacitors is configured to receive a respective different signal. Each first end of each MOS capacitor of the plurality of MOS capacitors thereby functions as an input end of a capacitor with a capacitance value determined based on the respective different signal. An effective capacitance value thereby results at the effective node.12-06-2012
20120154021INTEGRATED CIRCUIT AND METHOD OF FABRICATING SAME - A method includes providing a wide bandgap semiconductor substrate that includes a first transistor and a second transistor defined thereon. The method also includes coupling the first transistor to the second transistor. The method further includes coupling a bias circuit to the first transistor and the second transistor and forming a junction therebetween. The method also includes coupling the first transistor to a first voltage source and coupling the second transistor to a second voltage source. The first voltage source and the second voltage source are configured to define a predetermined differential input voltage.06-21-2012
20110089995Graphene device and method of manufacturing the same - Provided is a graphene device and a method of manufacturing the same. The graphene device may include an upper oxide layer on at least one embedded gate, and a graphene channel and a plurality of electrodes on the upper oxide layer. The at least one embedded gate may be formed on the substrate. The graphene channel may be formed on the plurality of electrodes, or the plurality of electrodes may be formed on the graphene channel.04-21-2011
20110089994Threshold Voltage Modification Via Bulk Voltage Generator - The present disclosure relates to threshold voltage modification via a voltage generator connected to bulk nodes of transistors.04-21-2011
20120313691ELECTROMAGNETIC SHIELD AND ASSOCIATED METHODS - Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material, a terminal coupled to the diffusion region, and a field plate coupled to the terminal and extending from the terminal over the diffusion region to shield the diffusion region. Additional embodiments are also described.12-13-2012
20100207683ULTRA-THIN SOI VERTICAL BIPOLAR TRANSISTORS WITH AN INVERSION COLLECTOR ON THIN-BURIED OXIDE (BOX) FOR LOW SUBSTRATE-BIAS OPERATION AND METHODS THEREOF - The present invention provides a “collector-less” silicon-on-insulator (SOI) bipolar junction transistor (BJT) that has no impurity-doped collector. Instead, the inventive vertical SOI BJT uses a back gate-induced, minority carrier inversion layer as the intrinsic collector when it operates. In accordance with the present invention, the SOI substrate is biased such that an inversion layer is formed at the bottom of the base region serving as the collector. The advantage of such a device is its CMOS-like process. Therefore, the integration scheme can be simplified and the manufacturing cost can be significantly reduced. The present invention also provides a method of fabricating BJTs on selected areas of a very thin BOX using a conventional SOI starting wafer with a thick BOX. The reduced BOX thickness underneath the bipolar devices allows for a significantly reduced substrate bias compatible with the CMOS to be applied while maintaining the advantages of a thick BOX underneath the CMOS.08-19-2010
20120256680SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A layout for a semiconductor integrated circuit device can maintain a sufficient capacitance of a capacity cell even when a height of the cell is lowered. In this layout, power supply wiring extending along a first direction supplies a first supply voltage, power supply wiring and power supply wiring extending in parallel with the power-supply wiring supply a second and a third supply voltages respectively. Capacitive element is formed of a transistor that receives the first supply voltage at its source and drain, and receives the second or the third supply voltages at its gate. Capacitive element is disposed under power supply wiring such that it strides over a portion at power supply wiring side and a portion at power supply wiring side.10-11-2012
20120176183SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING SAME - The present invention is directed to an MIS type semiconductor device, including a channel layer between a semiconductor body region and a gate insulating film, the channel layer having an opposite semiconductor polarity to that of the semiconductor body region. Since Vfb of the semiconductor device is equivalent to or less than a gate rated voltage Vgcc07-12-2012
20120176181ACTUATING TRANSISTOR INCLUDING MULTIPLE REENTRANT PROFILES - A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. The second electrically conductive material layer includes a reentrant profile. The second electrically conductive material layer also overhangs the first electrically conductive material layer. An electrically insulating material layer is conformally positioned over the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer. A third electrically conductive material layer is nonconformally positioned over and in contact with a first portion of the semiconductor material layer. A fourth electrically conductive material layer is nonconformally positioned over and in contact with a second portion of the semiconductor material layer. A voltage is applied between the third electrically conductive material layer and the fourth electrically conductive material layer. A voltage is applied to the first electrically conductive material layer to electrically connect the third electrically conductive material layer and the fourth electrically conductive material layer.07-12-2012
20120176182ACTUATING TRANSISTOR INCLUDING MULTI-LAYER REENTRANT PROFILE - A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. A third electrically conductive material layer is in contact with and positioned on the second electrically conductive material layer. The third electrically conductive material layer overhangs the second electrically conductive material layer. An electrically insulating material layer is conformally positioned over the third electrically conductive material layer, the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer. A fourth electrically conductive material layer is in contact with the semiconductor material layer. A fifth electrically conductive material layer is in contact with the semiconductor material layer. A voltage is applied between the fourth electrically conductive material layer and the fifth electrically conductive material layer. A voltage is applied to the first electrically conductive material layer to electrically connect the fourth electrically conductive material layer and the fifth electrically conductive material layer.07-12-2012
20120075008GRAPHENE DEVICE AND METHOD OF MANUFACTURING THE SAME - The graphene device may include an upper oxide layer on at least one embedded gate, and a graphene channel and a plurality of electrodes on the upper oxide layer. The at least one embedded gate may be formed on the substrate. The graphene channel may be formed on the plurality of electrodes, or the plurality of electrodes may be formed on the graphene channel.03-29-2012
20120075007REFERENCE CURRENT GENERATING CIRCUIT, REFERENCE VOLTAGE GENERATING CIRCUIT, AND TEMPERATURE DETECTION CIRCUIT - A reference current generating circuit with high current mirror accuracy is provided by low power supply voltage operation. The reference current generating circuit includes a cascode current mirror circuit 03-29-2012
20100271112SPIN TRANSISTOR AND METHOD OF OPERATING THE SAME - Disclosed are a spin transistor and a method of operating the spin transistor. The disclosed spin transistor includes a channel formed of a magnetic material selectively passing a spin-polarized electron having a specific direction, a source formed of a magnetic material, a drain, and a gate electrode. When a predetermined voltage is applied to the gate electrode, the channel selectively passes a spin-polarized electron having a specific direction and thus, the spin transistor is selectively turned on.10-28-2010
20110121887SEMICONDUCTOR DEVICE - An object is to achieve low power consumption and a long lifetime of a semiconductor device having a wireless communication function. The object can be achieved in such a manner that a battery serving as a power supply source and a specific circuit are electrically connected to each other through a transistor in which a channel formation region is formed using an oxide semiconductor. The hydrogen concentration of the oxide semiconductor is lower than or equal to 5×1005-26-2011
20100327958Leakage Current Mitigation in a Semiconductor Device - A dormant mode target semiconductor device within a leakage current target unit is identified for mitigating leakage current to prevent it from reaching catastrophic runaway. A leakage current shift monitor unit is electrically connected to the output node of the leakage current target unit and collects leakage current from the selected target semiconductor device for two consecutive predefined temporal periods and measures the difference between the collected leakage currents. A comparator receives and compares the outputs of the current shift monitor unit and a reference voltage generator. The comparator propagates an alert signal to the leakage current target unit when the leakage voltage output from the leakage current shift monitor unit exceeds the reference voltage, a condition that indicates that the leakage current is about to approach catastrophic runaway levels. This alert signal switches the target semiconductor device to an active mode for leakage mitigation, which includes a repair voltage from a repair voltage generator applied to the gate of the target semiconductor device.12-30-2010
20130015910DEVICE FOR TRANSFERRING PHOTOGENERATED CHARGES AT HIGH FREQUENCY AND APPLICATIONSAANM Tubert; CedricAACI SassenageAACO FRAAGP Tubert; Cedric Sassenage FRAANM Roy; FrancoisAACI SeyssinsAACO FRAAGP Roy; Francois Seyssins FRAANM Mellot; PascalAACI Lans en VercorsAACO FRAAGP Mellot; Pascal Lans en Vercors FR - A device for transferring charges photogenerated in a portion of a semiconductor layer delimited by at least two parallel trenches, each trench including, lengthwise, at least a first and a second conductive regions insulated from each other and from the semiconductor layer, including the repeating of a first step of biasing of the first conductive regions to a first voltage to form a volume accumulation of holes in the area of this portion located between the first regions, while the second conductive regions are biased to a second voltage greater than the first voltage, and of a second step of biasing of the first regions to the second voltage and of the second regions to the first voltage.01-17-2013
20110133818SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor layer of a first conductivity type; a deep well of a second conductivity type formed in a portion of an upper layer portion of the semiconductor layer; a well of the first conductivity type formed in a portion of an upper layer portion of the deep well; a source layer of the second conductivity type formed in the well; a drain layer of the second conductivity type formed in the well apart from the source layer; and a contact layer of the second conductivity type formed outside the well in an upper layer portion of the deep well and connected to the drain layer. The drain layer is electrically connected to the deep well via the well by applying a driving voltage between the source layer and the drain layer.06-09-2011
20130120055SOLUTIONS FOR CONTROLLING BULK BIAS VOLTAGE IN AN EXTREMELY THIN SILICON-ON-INSULATOR (ETSOI) INTEGRATED CIRCUIT CHIP - Solutions for optimizing a bulk bias across a substrate of an ETSOI device are disclosed. In one embodiment, an apparatus for optimizing a bulk bias across a substrate of an ETSOI device is disclosed, including: a sensing circuit for sensing at least one predetermined circuit parameter; a charging circuit for applying a bias voltage to the substrate of the ETSOI device; and a processing circuit connected to the sensing circuit and the charging circuit, the processing circuit configured to receive an output of the sensing circuit, and adjust the bias voltage applied to substrate of the ETSOI device in response to determining whether the bias voltage deviates from a target amount.05-16-2013
20130141157SIGNAL PROCESSING CIRCUIT AND METHOD FOR DRIVING SIGNAL PROCESSING CIRCUIT - A memory element capable of operating at high speed and reducing power consumption and a signal processing circuit including the memory element are provided. As a writing transistor, a transistor which is formed using an oxide semiconductor and has significantly high off-state resistance is used. In a memory element in which a source of the writing transistor is connected to an input terminal of an inverter, a control terminal of a transfer gate, or the like, the threshold voltage of the writing transistor is lower than a low-level potential. The highest potential of a gate of the writing transistor can be a high-level potential. When the potential of data is the high-level potential, there is no potential difference between a channel and the gate; thus, even when the writing transistor is subsequently turned off, a potential on the source side hardly changes.06-06-2013
20090002060NEGATIVE N-EPI BIASING SENSING AND HIGH SIDE GATE DRIVER OUTPUT SPURIOUS TURN-ON PREVENTION DUE TO N-EPI P-SUB DIODE CONDUCTION DURING N-EPI NEGATIVE TRANSIENT VOLTAGE - A high-side driver in a driver circuit for driving a half-bridge stage having high- and low-side power switching devices series connected at a switched node, the high-side driver driving the high-side power switching device. The high-side driver including first and second complementary switched MOSFET series connected at a high-side node, driving the high-side power switching device, one of the MOSFETs having a parasitic bipolar transistor formed between the substrate, an N+ epitaxial region connected to the high-side driver supply voltage and the switched node, with the parasitic transistor having a base electrode formed by the N+ epitaxial region, an emitter electrode formed by the substrate and a collector electrode formed by the switched node, such that if a transient voltage that is negative with respect to the substrate is present at the high-side driver supply voltage, the parasitic transistor will conduct a short circuit current between the switched node and the substrate; a first circuit for controlling the conduction of the first and second MOSFETs to switch the high-side switching device ON and OFF; a diffusion in the N+ epitaxial region in which a terminal connected to the switched node is provided by the diffusion forming the collector of the parasitic transistor; and a second circuit coupled to the diffusion for sensing the high-side driver supply voltage at the epitaxial region and providing a signal to the controller circuit to prevent turn-ON of the high-side power switching device.01-01-2009
20110221510SOI RADIO FREQUENCY SWITCH WITH ENHANCED SIGNAL FIDELITY AND ELECTRICAL ISOLATION - A doped contact region having an opposite conductivity type as a bottom semiconductor layer is provided underneath a buried insulator layer in a bottom semiconductor layer. At least one conductive via structure extends from an interconnect-level metal line through a middle-of-line (MOL) dielectric layer, a shallow trench isolation structure in a top semiconductor layer, and a buried insulator layer and to the doped contact region. The doped contact region is biased at a voltage that is at or close to a peak voltage in the RF switch that removes minority charge carriers within the induced charge layer. The minority charge carriers are drained through the doped contact region and the at least one conductive via structure. Rapid discharge of mobile electrical charges in the induce charge layer reduces harmonic generation and signal distortion in the RF switch. A design structure for the semiconductor structure is also provided.09-15-2011
20110254614System and Method of Transistor Switch Biasing in a High Power Semiconductor Switch - A system and method are provided for biasing transistor switches in a semiconductor based high power switch. Off-state Vgsd biasing for the off transistor switches is based upon acceptable levels of spurious harmonic emissions and linearity.10-20-2011
20110309876THIN FILM TRANSISTOR AND DISPLAY DEVICE - A thin film transistor is provided that includes a gate electrode, a source electrode, and a drain electrode, an oxide semiconductor active layer formed over the gate electrode, a fixed charge storage layer formed over a portion of the oxide semiconductor active layer, and a fixed charge control electrode formed over the fixed charged storage layer.12-22-2011
20120299641TRANSPONDER WITH A MODULATOR - A RFID transponder includes an electronic circuit and an antenna, the electronic circuit being integrated in a p-type substrate and comprising a modulator formed by a PMOS transistor whose drain, electrically connected to a pad of the antenna, and source, connected to the ground of the electronic circuit, are arranged in an n-type well provided in the p-type substrate. The PMOS transistor has a gate driven by a driving circuit which is arranged for providing at least a negative voltage, this negative voltage being low enough for turning on this PMOS transistor in response to a control signal provided by a logical unit of the electronic circuit.11-29-2012

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