Class / Patent application number | Description | Number of patent applications / Date published |
324158100 | MISCELLANEOUS | 28 |
20080203999 | TEST TRAY TRANSFERRING APPARATUS FOR A TEST HANDLER, TEST HANDLER, AND METHOD OF TRANSFERRING TEST TRAYS FOR A TEST HANDLER - A test handler is disclosed. First and second gripping blocks for respective front and rear test trays to be transferred along a circulation path move together in a circulation direction, but move independently in a direction perpendicular to the circulation path and grip and release independently. The test trays can be transferred by a single power source and interference between an assisting a test and a transferring can be minimized. | 08-28-2008 |
20080211486 | AUTO-HANDLER COMPRISING PUSHERS EACH INCLUDING PELTIER DEVICE - In an auto-handler for use in conjunction with an IC tester including a plurality of sockets in which a plurality of target devices are inserted, the auto-handler includes a plurality of pushers corresponding to the plurality of sockets and a plurality of temperature sensors for detecting temperatures of the plurality of target devices. Each pusher is mounted on a heat sink via a Peltier device. Each Peltier device and each temperature sensor are connected to a current controlling apparatus. The current controlling apparatus controls, on the basis of an output of each temperature sensor, a current supplied to the corresponding Peltier device. Accordingly, it is possible to individually control temperatures of the plurality of target devices with accuracy. | 09-04-2008 |
20080211487 | APPARATUS, METHOD, AND COMPUTER PROGRAM PRODUCT FOR MONITORING AND CONTROLLING A MICROCOMPUTER USING A SINGLE EXISTING PIN - A method, apparatus, and computer program product are disclosed for monitoring and controlling a device using only one input/output (I/O) communication pin of the device. The pin is configured to be used to both transmit and receive data. Logical ones are generated using pulses that are a first length and logical zeros are generated using pulses that are a second length. The device is communicated with utilizing the generated logical ones and generated logical zeros by transmitting the logical ones and zeros to the device, and receiving the logical ones and zeros from the device utilizing the single I/O pin. | 09-04-2008 |
20080231260 | PUSHER FOR MATCH PLATE OF TEST HANDLER - A pusher for a match plate of a test handler is disclosed which assists a tester to test the produced semiconductor devices. The pusher includes: a body part installed to an installation plate; and a pushing part that extends forward from a front side of the body part, for pushing a semiconductor device placed on an insert of a test tray. The pusher forms: an air through hole that extends through from a rear side of the body part to the front side of the pushing part, for guiding air of a certain temperature, supplied to the rear side of the body part from a duct, to be supplied to the semiconductor device; and at least one or more air outflow holes that extend through from at least one side of the pushing part and communicate with the air through hole, for allowing part of the air supplied from the duct through the air through hole to flow out to a test site. The pusher can reduce the temperature deviation of semiconductor devices at the test site. | 09-25-2008 |
20080246464 | Pusher block - An electronic device testing apparatus for conducting a test by pressing input/output terminals of an IC to be tested against sockets ( | 10-09-2008 |
20080258712 | MODULAR INTERFACE - An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the peripheral system, a second unit having a second connection member for providing electrical communication with the test system, and pivot members coupling the first unit and the second unit. The pivot members enable motion in the following sequence as one of the first and second unit moves towards the other: a) pivotal motion between the first connection member and the second connection member; and b) linear motion which decreases linear distance between the first connection member and the second connection member while maintaining respective contact surfaces of the first and second connection members in parallel. | 10-23-2008 |
20080258713 | MODULAR INTERFACE - An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the peripheral system, a second unit having a second connection member for providing electrical communication with the test system, and pivot members coupling the first unit and the second unit. The pivot members enable motion in the following sequence as one of the first and second unit moves towards the other: a) pivotal motion between the first connection member and the second connection member; and b) linear motion which decreases linear distance between the first connection member and the second connection member while maintaining respective contact surfaces of the first and second connection members in parallel. | 10-23-2008 |
20080258714 | Delay circuit and test apparatus - There is provided a delay circuit that delays an input signal to output the delayed signal. The delay circuit includes a first delay element operable to receive the input signal and delay the input signal to output the delayed signal, a buffer operable to receive the delay signal output from the first delay element and correct a dullness of a waveform of the delay signal generated from the first delay element to output the corrected signal, and a second delay element operable to receive the delay signal output from the buffer and delay the delay signal to output the delayed signal. | 10-23-2008 |
20080265874 | TEST HANDLER - A test handler includes a loading unit for loading semiconductor devices from customer trays onto a test tray; a test chamber for performing a test for the semiconductor devices loaded on the test tray; a pushing unit having at least one pushing member for pushing the test tray located in the test chamber to be tested, and a press unit for operating the pushing member; a position control unit for adjusting a position of the pushing member to compensate a deviation between the pushing member and the test tray due to a thermal expansion or contraction of any one of the pushing member and the test tray; and an unloading unit for unloading the semiconductor devices loaded on the test tray onto the customer trays after a test for the semiconductor devices is completed. | 10-30-2008 |
20080272764 | TEST TRAY FOR TEST HANDLER - The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated. | 11-06-2008 |
20080278146 | GUIDE DEVICE AND TEST APPARATUS FOR ELECTRONIC DEVICES - The present invention relates to a guide device comprising a baseplate unit having formed therein a guide channel for guiding electronic devices, wherein at least two portions of the baseplate unit are spatially fixed, said guide device being characterized in that means for compensating the thermal expansion of the baseplate unit are provided. The invention additionally relates to a test apparatus which comprises the guide device according to the present invention. | 11-13-2008 |
20080284412 | SYSTEM FOR TRANSFERRING TEST TRAYS AND A HANDLER HAVING SAME - A system and method is provided for transferring multiple test trays within a test handler. The system includes at least one moving member having a pushing member that pushes a first test tray and a pulling member that pulls on a projection on a second test tray to move the first and second test trays simultaneously with the moving member. The system also includes a second plate to which the at least one moving member is fixed, and a first plate to which the second plate is movably fixed. A handler may be equipped with this system so that two test trays may be moved at the same time to decrease overall processing time and improve efficiency and productivity of the handler. | 11-20-2008 |
20080297140 | SYSTEM AND METHOD FOR TRANSFERRING TRAYS WITHIN A TEST HANDLER - A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented. | 12-04-2008 |
20080297141 | MANIPULATOR FOR POSITIONING A TEST HEAD ON A TESTER - A manipulator for positioning a test head is provided with a positioning means by which the test head is three-dimensionally positionable and with a cradle to which the test head is securable and which is connected to the positioning means. The manipulator includes a compensator which can be loaded by the mass of the test head. The positioning means includes a column and at least one lead screw extending in the vertical direction. The compensator is connected to the cradle and can be moved by the lead screw in the vertical direction. The compensator includes a driver cooperating with the lead screw and is guided in the vertical direction on the column. The compensator has a spring element which is biased and supported by the driver. | 12-04-2008 |
20080297142 | CONTACT INSERT FOR A MICROCIRCUIT TEST SOCKET - A system for testing a microcircuit having a center ground (CG) terminal has an insert for electrically connecting the CG terminal with a ground contact on a load board. The insert is held within a housing having an aperture that includes at least one shelf facing toward the load board. The shelf interacts with a resilient projection on the insert to distort the projection. The projection's resilient distortion generates continual force pressing the insert against the load board. The continual force limits migration of debris created by the testing operations into the interface between the insert and the load board. | 12-04-2008 |
20090015240 | Detection Circuit - A detection circuit includes: a control signal updating circuit configured to update a digital control signal for controlling drive of a sensor based on a clock having a predetermined frequency; a digital to analog converter configured to convert the digital control signal output from the control signal updating circuit to an analog control signal for driving the sensor; a comparator configured to compare a voltage level of a detection signal from the sensor which changes depending on the analog control signal with a reference voltage having a predetermined voltage level to output a comparison result signal; and a counter configured to count to measure a time period depending on the detection signal based on the comparison result signal output from the comparator and a clock having a predetermined frequency. | 01-15-2009 |
20090079419 | APPARATUS AND METHODS OF INTEGRATED-CIRCUIT DEVICE TESTING - A motherboard device (MB) interface board (DIB) configured as universal interface to a family of integrated circuit (IC) devices provides the electrical connectivity to automated test equipment (ATE) and physical mating commonality with an IC device handler for reduced time to market and enhanced economy for design validation and production verification testing. In particular, use of one or more daughter cards (DC) that mount to the MB DIB avoid redesign of the entire DIB assembly for a new IC design. Each DC can be more quickly designed at a lower cost than the entire DIB assembly, enabling replacement of any defective site. The DC increases the available surface area for mounting of support components for the device under test (DUT). | 03-26-2009 |
20090102457 | Automated Test Equipment Interface - An automated test equipment interface system, e.g., for attaching a handler to a test head, includes a device interface board assembly. The device interface board assembly includes a stiffener frame having a frame body that is configured for attachment to a test head, alignment brackets connected to the frame body, and cam followers connected to the alignment brackets. The system also includes a docking device. The docking device includes a docking plate that is configured for attachment to a handler, pull-down ramps connected to the docking plate and movable between a retracted position and an extended position, an actuator operable to initiate movement of the pull-down ramps, and a coupling that translates movement of the actuator to corresponding movements of the pull-down ramps. The pull-down ramps can include cam surfaces that are configured to engage the cam followers of the device interface board assembly during movement between the retracted and extended positions to pull the device interface board assembly towards the docking plate. | 04-23-2009 |
20090128133 | Duty Cycle Measurement Method and Apparatus for Various Signals Throughout an Integrated Circuit Device - A method and apparatus for measuring the absolute duty cycle of a signal anywhere on an integrated circuit device are provided. The mechanism employs a circuit having a plurality of substantially identical pulse shaper elements, each of which expand the pulse of an input signal whose duty cycle is to be measured by a same amount. The outputs of the pulse shaper elements may be coupled to substantially identical divider circuits whose outputs are coupled to a multiplexer that selects two inputs for output to a set of master/slave configured flip-flops, one input serving as a clock and the other as data to the flip-flops. The flip-flops sample the divider outputs selected by the multiplexer to detect if the dividers have failed or not. The outputs of the flip-flops are provided to an XOR gate which outputs a duty cycle signal indicative of the duty cycle of the input signal. | 05-21-2009 |
20090128134 | SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS, MEASUREMENT RESULT MANAGEMENT SYSTEM, AND MANAGEMENT SERVER - A semiconductor integrated circuit apparatus, and more particularly a technology for measuring and managing a physical amount of factors that exert an influence upon an operation of a semiconductor integrated circuit is provided; more particularly, a semiconductor integrated circuit that is an object of measurement, and a measurement circuit which measures a physical factor that exerts an influence upon the actual operation of the semiconductor integrated circuit, such as jitter or noise jitter, and noise of this semiconductor integrated circuit are provided on an identical chip; also, a measurement result of the measurement circuit of the present invention is analyzed, and is fed back to a circuit for adjusting the semiconductor integrated circuit that is the object of measurement. | 05-21-2009 |
20090160432 | PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT - A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder. | 06-25-2009 |
20090167294 | TEST HANDLER, METHOD FOR LOADING AND MANUFACTURING PACKAGED CHIPS, AND METHOD FOR TRANSFERRING TEST TRAYS - A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture. The transferring unit may transfer the test tray. | 07-02-2009 |
20090261817 | TEST HANDLER, METHOD OF UNLOADING AND MANUFACTURING PACKAGED CHIPS AND METHOD FOR TRANSFERRING TEST TRAYS - A test handler, a method for unloading packaged chips, a method for transferring test trays, and a method for manufacturing packaged chips are provided. The test handler may include: a loading unit having a loading picker to perform a loading process on a test tray located at a loading position, a chamber system in which the packaged chips contained in the test tray transferred from the loading unit are connected to a hi-fix board and tested, and an unloading unit having at least one unloading buffer to move along an unloading moving path formed over a test tray located at an unloading position and an unloading picker to perform an unloading process on the test tray located at the unloading position. The test handler may further include a passage site disposed between the loading unit and the unloading unit and connecting the loading unit and the unloading unit to the chamber system, and a transferring unit transferring the test trays. | 10-22-2009 |
20100052658 | BUILT-IN TEST FOR HIGH-SPEED ELECTRICAL NETWORKS - An apparatus for providing auxiliary signals on a high speed electrical signal network is provided such that the auxiliary signals may be used for independent monitoring or communication of monitored information without affecting data or bit error rates for the primary high speed data signals. The auxiliary signals may be used as part of a built-in testing of a network, including electrical time-domain reflectometry measurements to determine fault locations in a network. | 03-04-2010 |
20100109652 | APPARATUS FOR CORRECTING POSITION OF A USER TRAY AND A TEST HANDLER - The present invention relates to an apparatus for correcting position of a user tray including at least one first position member and at least one second position member that determine position of a user tray, a plate where the user tray is received, a first correcting unit that moves the user tray in a direction where the first position member is installed, a second correcting unit that moves the user tray in a direction where the second position member is installed, and an operating unit that operates the first correcting unit and the second correcting unit, which has a simple configuration, and moves a user tray to the accurate position, thereby reducing manufacturing costs and maintenance costs | 05-06-2010 |
20100164482 | CENTERING DEVICE FOR ELECTRONIC COMPONENTS, PARTICULARLY ICS - A centering device for electronic components, particularly for ICs, has at least one centering unit comprising two L-shaped centering elements and two coupling elements. The centering elements and coupling elements are hinged together such that a pivoting movement of the coupling elements is forcibly coupled to a parallel displacement of the centering elements, thus causing a widening or narrowing of a centering opening for the components. | 07-01-2010 |
20100237854 | Electromagnetic Profiling To Validate Electronic Device Authenticity - Counterfeit electronic devices are detected by comparing a thermal profile of the counterfeit device and an authentic device under predetermined operating conditions. A thermal profile for an authentic electronic device is recorded executing an instruction set over time, such as with static infrared images at predetermined times, video infrared images over a predetermined time period or temperature measurements made at predetermined locations of the electronic device. In one embodiment, a thermal profile indicates that a processor device has been used in the place of a field programmable grid array device. In an alternative embodiment, an electromagnetic profile is detected instead of or in addition to the thermal profile. The electromagnetic profile of an authentic device is used to create an expected profile for comparison with an electromagnetic profile of electronic devices under test. | 09-23-2010 |
20100264907 | TEST HEAD POSITIONING SYSTEM AND METHOD - An apparatus for supporting a load includes pneumatic units and couplers coupled to opposite sides of the load. The couplers move the load parallel to a first axis responsive to actuation of the pneumatic units. At least one of the couplers rotate the load about a second axis orthogonal to the first axis. The load is compliant along the first axis and about the second axis At least one of the pneumatic units provides compliance along the first axis and about the second axis. | 10-21-2010 |