Class / Patent application number | Description | Number of patent applications / Date published |
324761000 | Pin | 51 |
20080204060 | Vertical-Type Electric Contactor And Manufacture Method Thereof - A vertical-type electric contactor connected to a bump of an electric contactor is provided. The vertical-type electric contactor includes a support beam, vertically bonded with the bump, in which at least two elastic parts are spaced apart from each other; a fixed part disposed at the bottom end of the support beam for fixing the support beam; and a tip part disposed at the bottom end of the fixed part, the tip part and the fixed part being a single body. According to the vertical-type electric contactor, a reaction force generated at a tip part is effectively distributed to test electric devices without damage of the vertical-type electric contactor. | 08-28-2008 |
20080204061 | Spring loaded probe pin assembly - A method and apparatus for constructing a probe card assembly is provided. A probe pin is inserted into an aperture of an inverted socket enclosure to cause a probe pin shoulder of the probe pin to make contact with an aperture shoulder of the aperture. An upper end of the probe pin protrudes from the aperture after the probe pin shoulder makes contact with the aperture shoulder. A compressible member is inserted into the aperture to position an upper end of the compressible member to make contact with a lower portion of the probe pin. A substrate is aligned over the inverted socket enclosure so that the lower end of the compressible member is in contact with a substrate contact located on the substrate. The substrate is affixed in a non-permanent manner to the inverted socket enclosure. | 08-28-2008 |
20080224721 | APPARATUS, UNIT AND METHOD FOR TESTING IMAGE SENSOR PACKAGES - The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light. | 09-18-2008 |
20080231305 | CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS - An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure. | 09-25-2008 |
20080246500 | HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE - An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles. | 10-09-2008 |
20080252325 | Vertical probe array arranged to provide space transformation - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. | 10-16-2008 |
20080252326 | Probe - A conductive plunger | 10-16-2008 |
20080252327 | SUBSTRATE TEST PROBING EQUIPMENT HAVING FORCING PART FOR TEST HEAD AND FORCE-RECEIVING PATTERN FOR PROBE CARD AND METHODS OF USING THE SAME - Substrate test probing equipment having a force-receiving pattern for a probe card and a forcing part for a test head, and methods of using the same, in which with the force-receiving pattern for the probe card and the forcing part for the test head, thermal expansion and contraction of the probe card can be suppressed when the semiconductor substrate is being tested at high and low temperatures. To this end, to substrate test probing equipment having a substrate mover, a probe card, and a test head is prepared, in which the test head has a forcing part and the probe card has a force-receiving plate. A semiconductor substrate is placed on the substrate mover to be electrically connected with the probe card. The semiconductor substrate is electrically tested by the probe card and the test head. When the semiconductor substrate is being tested, the forcing part of the test head is brought into contact with the force-receiving pattern of the probe card. | 10-16-2008 |
20080265926 | TEST HEAD - Disclosed is a test head comprising: a supporting member configured on an end face of a test head housing on a side of connection with a device under test; a pin electronics circuit disposed in the test head housing, the pin electronics circuit outputting a test signal; flexible wiring including one end connected to the pin electronics circuit and another end provided to elongate onto the supporting member on an outside of the test head housing; and a connection section with a side of the device under test, the connection section annexed on the other end of the flexible wiring, wherein a load loaded at a time of connection of the device under test to the connection section is supported by the supporting member. | 10-30-2008 |
20080278187 | Test pin, method of manufacturing same, and system containing same - A test pin includes a compression element ( | 11-13-2008 |
20080315905 | Electrical Connecting Apparatus - The present invention provides an electrical connecting apparatus that does not cause lack of mechanical strength in a probe board. The electrical connecting apparatus comprises a probe board spaced from a support member and arranged with its one surface opposed to the support member. On one surface of the probe board is provided a fixed portion having an opened screw hole at its top portion, and on the other surface are provided probes that are connected to a tester. The electrical connecting apparatus comprises a cylindrical spacer keeping a distance from the support member to a top surface of the fixed portion and a male screw member screwed in the screw hole for the purpose of tightening the support member and the probe board at a distance in accordance with the length of the spacer. The probe board has a support plate in which a plurality of conductive paths penetrating in the plate thickness direction and connected to the tester are formed and a wiring plate in which wiring paths connected to the corresponding conductive paths are formed, whose one surface is fixed to the support plate, and on the other surface of which are provided the probes corresponding to the wiring paths. The fixed portion is constituted by a female screw member fixed to the support plate at an area where no conductive paths are formed. | 12-25-2008 |
20090009205 | Microcontactor probe assembly having a plunger and electric probe module using the same - In order for a conduction path to have a reduced number of sliding portions for conduction, without increase in inductance nor resistance, thereby permitting an enhanced accuracy of inspection, a pair of plungers ( | 01-08-2009 |
20090015284 | SEMI-GENERIC IN-CIRCUIT TEST FIXTURE - A semi-generic test fixture for testing printed circuit boards (PCBs) and/or for testing printed circuit boards assemblies (PCBAs) is presented. The semi-generic test fixture implements a combination of generic and customized parts for tester-to-fixture interface instead of a static dedicated in-circuit test (ICT) fixture which is able to interconnect only one kind of unit under test (UUT) to an ICT tester test-head. The semi-generic ICT fixture (SGICTF) is able to interconnect an ICT test-head with a variety of UUT types with a minimum of adaptation. Accordingly, the SGICTF generally comprises two generic PCB connected to the tester and two customized PCB connected to the generic PCB and adapted to interface the particular UUT via testing probes. | 01-15-2009 |
20090021276 | Probe or Measuring Head with Illumination of the Contact Region - A probe or measuring head for measuring an electrical signal of an electrical contact has an electrically conducting feeler ( | 01-22-2009 |
20090039910 | TEST APPARATUS FOR SEMICONDUCTOR MODULES - A test apparatus for semiconductor modules. One embodiment provides a test system. The test system includes a handler configured to receive at least one semiconductor module. The test system is equipped with a plurality of different pin cards. The handler has at least two independent groups of test receptacles. | 02-12-2009 |
20090058447 | FAULT ANALYZER - The objective of the invention is to provide a type of fault analyzer and a method therefore that can easily specify fault locations in semiconductor devices. Fault analyzer | 03-05-2009 |
20090085596 | SYSTEM AND METHOD FOR TESTING SEMICONDUCTOR DEVICES - A system for testing semiconductor devices is disclosed. In one embodiment, the test system being configured to be electrically connected via parallel wiring paths to a plurality of contact pins of a number of devices under test. The test system having at least one signal distribution matrix arranged in the wiring path to provide signals for testing and/or power supply to the devices. | 04-02-2009 |
20090102500 | Interposer and probe card having the same - An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board. | 04-23-2009 |
20090108862 | Testing system module - A testing system module for testing printed circuit board (PCB) includes a first robot having a pogo pin for moving to a first testing point of a first surface of the PCB and the pogo pin contacting the first testing point; a second robot having another pogo pin for moving to a second point of a second surface of the PCB and the pogo pin contacting the second testing point; and a source meter for forcing the signals to the pogo pins and sensing the signals from the pogo pins. | 04-30-2009 |
20090121734 | Integrated compound nano probe card and method of making same - An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer. | 05-14-2009 |
20090121735 | METHOD AND SYSTEM FOR TESTING A SEMICONDUCTOR PACKAGE - A method and system for testing a semiconductor package. At least some of the illustrative embodiments are methods comprising testing a semiconductor package unit ( | 05-14-2009 |
20090134898 | Coaxial Spring Probe Grounding Method - The present invention provides a spring probe array for use in a semiconductor test fixture wherein the spring probes provide electrical continuity between a device under test and a test system. The array includes a spring probe retaining device with sockets for supporting spring probes. Fixed within the retaining device are a plurality of signal spring probes and a plurality of ground spring probes. A grounding board is fixed internal and captive to the spring probe retaining device and provides a common grounding connection between coaxial spring probes and adjacent non-coaxial spring probes in the spring probe retaining device. | 05-28-2009 |
20090134899 | PROBE ASSEMBLY WITH MULTI-DIRECTIONAL FREEDOM OF MOTION AND MOUNTING ASSEMBLY THEREFOR - An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT. | 05-28-2009 |
20090201041 | Vertical Probe Array Arranged to Provide Space Transformation - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. | 08-13-2009 |
20090212805 | PROBE OF VERTICAL PROBE CARD - A probe of a vertical probe card is disclosed. The probe has a probe tip and a surface region extended from the probe tip about 1-10 mil. The surface region is coated with a nano-film of high electro-conductive nano-material, and the thickness of the nano-film is about 1-20 nm. The nano-film of the probe can efficiently provide excellent no-clean property and higher electro-conductivity for lowering contact force and elongating usage lifetime of the probe of vertical probe card. Accordingly the yield of wafer testing can be improved, the frequency of cleaning probe can be lowered, and the total testing cost can be reduced. | 08-27-2009 |
20090212806 | System for Making Contact Between a Transmit/Receive Module and a Testing Device - A system for making electrical contact between a transmit/receive module and a testing device for the transmission of high-frequency signals includes a mechanically guided, frame-shaped contacting unit having a plurality of contact elements for contacting the TR module. The contacting unit surrounds the T/R module and is positioned relative to the T/R module such that the contact with the T/R module is established in one operation via the contact elements. A line substrate, which is arranged on the contacting unit and electrically connected with it, is constructed as a shielded triplate line by which the high-frequency signals can be conducted to the testing device. | 08-27-2009 |
20090256583 | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes - Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both. | 10-15-2009 |
20090278561 | PROBE CARD HAVING REDISTRIBUTED WIRING PROBE NEEDLE STRUCTURE AND PROBE CARD MODULE USING THE SAME - The probe card is comprised of a probe card wafer, a plurality of through via electrodes penetrating the probe card wafer; and a plurality of redistributed wiring probe needle structures, each being connected to the through via electrodes protruding from a surface of the probe card wafer. | 11-12-2009 |
20090289652 | POGO PROBE, PROBE SOCKET, AND PROBE CARD - A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package. | 11-26-2009 |
20090295417 | TEST SYSTEM, ELECTRONIC DEVICE, AND TEST APPARATUS - Provided is a test system that tests a device under test, including a plurality of internal test circuits that are provided inside the device under test and that are used for testing an operation circuit of the device under test; a device control section that is electrically connected to the plurality of internal test circuits via a common bus and that controls the plurality of internal test circuits by supplying the common bus with an intra-device control signal corresponding to a received external signal; and a test apparatus that supplies the device control section with the external signal. | 12-03-2009 |
20090302877 | Reduced Ground Spring Probe Array and Method for Controlling Signal Spring Probe Impedance - A reduced ground spring probe array and a method for controlling the impedance of the signal spring probes in the reduced ground spring probe array. Signal spring probes are positioned in a row-column format across the surface of the spring probe tower. Ground spring probes are positioned in a row/alternating-column format across the surface of the spring probe tower such that one ground probe is positioned between two or more signal probes. In doing so, a void space exists for every other ground probe column such that one or more signal lines may be routed within the void space or the array may be compressed to establish a smaller overall spring probe tower footprint. | 12-10-2009 |
20100007365 | SOCKET FOR DOUBLE ENDED PROBE, DOUBLE ENDED PROBE, AND PROBE UNIT - A socket for a double ended probe with a first probe and a second probe includes a hollow pipe member housing the first probe and the second probe, the first probe and the second probe are arranged in an axial direction of the socket, and the socket includes an abutment holding the first probe and the second probe at predetermined positions on an inner side of the hollow pipe member. | 01-14-2010 |
20100026333 | TEST APPARATUS AND PROBE CARD - Provided is a test apparatus including a test head main body | 02-04-2010 |
20100033201 | MEMS PROBE FABRICATION ON A REUSABLE SUBSTRATE FOR PROBE CARD APPLICATION - A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate. | 02-11-2010 |
20100045325 | Test Pad Design for Reducing the Effect of Contact Resistances - An integrated circuit structure includes a semiconductor wafer; integrated circuit devices in the semiconductor wafer; and a plurality of test pads on a top surface of the semiconductor wafer and connected to the integrated circuit devices. Test pads are grouped in pairs, with the test pads in a same pair are interconnected. | 02-25-2010 |
20100052721 | TEST SOCKET AND TEST MODULE - The present invention discloses a test socket for testing an image sensor that comprises a sensing area facing a light source. The test socket comprises a signal-connecting mechanism for transmitting a signal between the image sensor and a source of the test signal, a bearing layer having an opening and being arranged at the surface facing the light source, and a transparent layer arranged between the image sensor and the bearing layer for supporting the image sensor. | 03-04-2010 |
20100073021 | ELECTRICAL CONTACT PROBE - A contact probe assembly, for placement within a probe receptacle for performing tests on an electrical device, includes the following elements. The hollow barrel has two openings at two opposite ends thereof, wherein the hollow barrel is adapted to be axially disposed within the probe receptacle. The first plunger is slidably disposed within one of the two openings at one end of the hollow barrel. The second plunger is slidably disposed within the other of the two openings at the opposite end of the hollow barrel. The resilient member is disposed within the hollow barrel and interconnected between the first plunger and second plunger, wherein the first plunger, the resilient member and the second plunger are formed as single one unitary member and made of the same electrically-conductive material. | 03-25-2010 |
20100079161 | PROBE APPARATUS - A probe apparatus includes a holding frame holding a test head through a biasing unit biasing the test head. An annular member is rotatably mounted in an opening of a ceiling plate of a main body. Cam followers are rotatably provided circumferentially on the annular member. An intermediate connecting member is provided in a lower surface of the test head, for bringing the test head into electrical contact with an upper surface of the probe card. Protrusions for guiding the cam followers are provided corresponding thereto at an outer periphery of the intermediate connecting member, upper surfaces of the protrusions being inclined. The cam followers are moved relatively upward along the respective inclined surfaces of the protrusions by rotating the annular member so that the intermediate connecting member is pushed downward against a biasing force of the biasing unit to bring the test head into press-contact with the probe card. | 04-01-2010 |
20100109697 | PROBE CARD, NEEDLES OF PROBE CARD, AND METHOD OF MANUFACTURING THE NEEDLES OF PROBE CARD - A probe card for use in the test of the semiconductor devices, a needle of the probe card, and a method of manufacturing the needle are disclosed. This invention is to strengthen the beam portion of the needle, to reduce the contact area between a probing portion and a pad of a wafer die, and to prevent the test apparatus from malfunctioning. The needle of a probe card includes: a probing portion for contacting a pad of a wafer die at a certain pin pressure; a soldered portion soldered to a circuit board of the probe card, for transmitting an electrical signal to the probing portion; and a beam portion integrally connecting the probing portion and the soldered portion and having elasticity to exhibit a certain pin pressure by which the probing portion | 05-06-2010 |
20100117673 | Interface structure of wafer test equipment - A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface. | 05-13-2010 |
20100117674 | SYSTEMS AND METHODS FOR CHARGED DEVICE MODEL ELECTROSTATIC DISCHARGE TESTING - Systems and methods for testing an integrated circuit device using transmission path and charged device model electrostatic discharge testing. The method includes measuring a electrostatic discharge signal from a charged transmission path of the system, measuring a electrostatic discharge signal from the charged transmission path of the system and a charged integrated circuit device coupled with the charged transmission path, and determining a charged device model waveform based upon distinctions between these electrostatic discharge signals. | 05-13-2010 |
20100134131 | Electrochemically Fabricated Microprobes - Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided. | 06-03-2010 |
20100141290 | MICROSPRING ARRAY HAVING REDUCED PITCH CONTACT ELEMENTS - Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region. | 06-10-2010 |
20100176833 | PROBE PIN - There is provided a material having an excellent conductivity and oxidation resistance as well as a sufficient hardness for probe pins. The present invention provides a probe pin material including Au, Ag, Pd and Cu, wherein the concentration of Au is 40 to 55% by weight, the concentration of Ag is 15 to 30% by weight and the total concentration of Pd and Cu is 15 to 40% by weight. This material can further include 0.6 to 5% by weight of any one element from among Ni, Zn and Co. Furthermore, this alloy can be precipitation-hardened by being heated at 300 to 500° C., enabling provision of a material having a higher hardness. | 07-15-2010 |
20100194419 | MULTI-CONTACT PROBE ASSEMBLY - A multi-contact probe assembly may include a housing, a plurality of probe members, a plurality of spring members, and a plurality of electrical connectors. The housing may comprise a plurality of shafts in a pre-determined pattern. The plurality of probe members may be partially and moveably disposed within the plurality of shafts. The plurality of spring members may be disposed within the plurality of shafts spring-loading the probe members to partially and moveably extend beyond the plurality of shafts out of the housing in the pre-determined pattern. The plurality of electrical connectors may extend into the plurality of shafts for communicating signals from electrical testing equipment to the probe members. The pre-determined pattern may be substantially identical to a pattern of contacts on a circuit board being tested by the multi-contact probe assembly. In such manner, a circuit board which has a pattern of contacts that is substantially identical to the pre-determined pattern of probe members may be tested. | 08-05-2010 |
20100201392 | Semiconductor test system with self-inspection of electrical channel for Pogo tower - A semiconductor test system with self-inspection of an electrical channel for a Pogo tower is disclosed, which provides a short board and closed loops are formed respectively by providing various kinds of contacts to correspondingly electrically contact various kinds of Pogo pins in the Pogo tower on a load board. A self-inspection controller outputs different inspection signals, through the above-mentioned closed loops, respectively to each power channel, each I/O channel and each drive channel, and a plurality of parameter detection units detect response signals, and the response signals are judged by the self-inspection controller. Based on it, before inspecting a wafer to be tested, the invention is capable of self-inspecting each electrical channel and each Pogo pin on the Pogo tower to see if they are respectively in a normal condition, either in an open or short circuit, or if there exists a leakage condition. | 08-12-2010 |
20100207654 | MEMS Interconnection Pins Fabrication on a Reusable Substrate for Probe Card Application - A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects. | 08-19-2010 |
20100213963 | SEMICONDUCTOR INTEGRATED CIRCUIT TEST METHOD - A wafer of semiconductor integrated circuits with wafer-level chip-scale packages is tested in two stages. The chip-scale packages include conductive posts extending through a sealing layer and capped by terminals. Measurements strongly affected by contact resistance are carried out before the terminals are formed, using a first probe card having probe pins that contact the ends of the conductive posts. Other measurements are carried out after the terminals are formed, using a second probe card having probe pins that contact the terminals. Accurate measurements can be made in this way even if the terminals are lead-free solder bumps with variable contact resistance. Fabrication yields are improved accordingly. | 08-26-2010 |
20100231251 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface. | 09-16-2010 |
20100271063 | TEST APPARATUS - Multiple test pins receive, as input data, multiple data output from a DUT. Multiple multiplexers receive the multiple data input to the multiple test pins and selects one of the data thus input, and outputs the data thus selected. Multiple logical comparators are respectively provided for the multiple multiplexers and judge whether or not the data selected by the corresponding multiplexers match the expected values. | 10-28-2010 |
20100283495 | Probe substrate and probe card having the same - Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins. | 11-11-2010 |