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Probe alignment or positioning

Subclass of:

324 - Electricity: measuring and testing

324500000 - FAULT DETECTING IN ELECTRIC CIRCUITS AND OF ELECTRIC COMPONENTS

324537000 - Of individual circuit component or element

324754000 - With probe elements

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Entries
DocumentTitleDate
20090230983SOCKET FOR INSPECTION - A support block is provided with a plurality of through holes for supporting probes. The probes for signals, for power supply and for grounding are secured in the through holes of the support block and electrically interconnect electrode terminals of a device to be inspected, which is provided on one face side of the support block, and wiring terminals connected t an inspection unit, which is provided on the other face side of the support block. A device guide is integrally formed with or separately fixed to the one face side of the support block, and includes an opening having a square shape in a plan view for guiding the device to be inspected. A centering mechanism adjusts a position of the device to be inspected at a center position of the opening of the device guide.09-17-2009
20090195263PROBE APPARATUS, PROBING METHOD AND STORAGE MEDIUM - A probe apparatus includes a first stage, a second stage, a third stage and an image pickup. A Z position measuring unit measures a Z direction position of the mounting table and has a Z scale extending in the Z direction and a reading unit for reading the Z scale. A computation unit obtains a calculated contact position between the probes and the electrode pads of the substrate to be inspected based on images picked up by the image pickup with respect to a coordinate position on coordinates of a driving system which includes a Z direction position and X and Y direction positions measured by a measuring unit for measuring X and Y direction positions of the mounting table. A correcting unit corrects the Z direction position of the contact position based on the change amount thereof for a next contact operation.08-06-2009
20100052717LOW TEMPERATURE PROBING APPARATUS - A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage.03-04-2010
20100164524ZIF CONNECTORS AND SEMICONDUCTOR TESTING DEVICE AND SYSTEM USING THE SAME - A ZIF connector, a semiconductor testing device using the ZIF connectors, and a semiconductor testing system using the ZIF connectors are proposed. The ZIF connector comprises a body portion and a clamping portion. The body portion is a print circuit board provided with circuit patterns, and further comprises a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of corresponding signal cables and a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two lateral sides of the body portion for electrically connecting a plurality of corresponding electrical pads of a substrate. The circuit patterns are provided in the body portion to connect to the electrical terminals through the signal holes accordingly. The clamping portion is horizontally extended on one lateral side of the body portion for securing the ZIF connector in a connector board.07-01-2010
20090121733TEST CIRCUIT FOR USE IN A SEMICONDUCTOR APPARATUS - A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.05-14-2009
20100045324HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF - The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.02-25-2010
20100045323TEST HEAD POSITIONING SYSTEM AND METHOD - An apparatus for supporting a device, comprising a base assembly, a plurality of carrier columns extending from the base unit, and a plurality of vertical support plates, each vertically movable along a respective carrier column and including a pivotal device mounting bracket. A pneumatic unit including a piston rod is associated with each vertical support plate such that vertical motion of the piston rod controls vertical motion of the respective vertical support plate.02-25-2010
20100045322Probe Head Apparatus for Testing Semiconductors - One embodiment is a probe head for contacting microelectronic devices substantially lying in a test plane, the probe head including: (a) one or more substrate tiles having one or more probe tips disposed on a top surface thereof; and (b) a registration-alignment apparatus that holds the one or more substrate tiles: (i) in position so that the one or more probe tips are held in the test plane, and (ii) aligned so that the one or more probe tips are substantially coplanar to the test plane, which registration-alignment apparatus includes: (i) one or more capture elements affixed, directly or indirectly, to a frame; (ii) three or more posts mechanically supporting each of the one or more substrate tiles; and (iii) alignment actuators affixed, directly or indirectly, to the frame and the posts, which alignment actuators may be actuated to enable the posts to move in response to forces applied thereto from the one or more substrate tiles, and may be actuated to prevent the posts from moving.02-25-2010
20100109695Chuck for holding a device under test - A chuck for a probe station.05-06-2010
20090045830AUTOMATED CONTACT ALIGNMENT TOOL - A method for determining the alignment of a plurality of contacts in an electronic testing machine is disclosed. The contacts are swept over an electronic component taking a plurality of electrical readings. These electrical readings are charted against a desired orientation to determine alignment. Alignment can be corrected as necessary using an adjustment mechanism.02-19-2009
20100134128Thermocentric Alignment Of Elements On Parts Of An Apparatus - A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.06-03-2010
20090302876COMPONENT FOR TESTING DEVICE FOR ELECTRONIC COMPONENT AND TESTING METHOD OF THE ELECTRONIC COMPONENT - A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.12-10-2009
20090237101METHOD FOR CORRECTING DISPLACEMENT OF MULTI CARD AND METHOD FOR TESTING CIRCUIT ELEMENT - A method for correcting displacement of a multi card with respect to a product wafer, includes displacing a predetermined wafer on a stage of a probing device and forming a contact trace of a probe needle on a surface of the wafer by bringing the probe needle into contact with the wafer disposed on the stage; localizing, based on the contact trace, a displaced area from the surface of the wafer, the area being displaced with respect to the multi card, and determining a displacement amount of the displaced area; and setting a parameter based on the displacement amount, the parameter to be referred in the case of positioning of the multi card to the displaced area. The displacement of the multi card is corrected in a case of testing electric characteristics of a plurality of circuit elements formed on the product wafer with the use of the multi card capable of bringing the probe needles into contact with the plurality of circuit elements all at once.09-24-2009
20090201040COMPONENT TEST APPARATUS - A component test apparatus performing a test on an electronic component is disclosed. The component test apparatus includes a component loading device, a transport hand, and a component unloading device. The transport hand includes a plurality of index units each one of which is capable of holding the electronic component and operating independently from the other ones of the index units. The index units are aligned adjacently in a transport direction of the electronic component extending from a loading position at which the component loading device loads the electronic component toward a test position at which a test socket is provided.08-13-2009
20090079452COMPONENT ASSEMBLY AND ALIGNMENT - A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.03-26-2009
20100194418Method of correcting a position of a prober - A method of correcting a position of a prober, the method including obtaining a first image of a pad, the pad having a predetermined reference contact position, contacting the prober to the pad after obtaining the first image of the pad, obtaining a second image of the pad after contacting the prober to the pad, determining an actual contact position of an actual contact mark on the pad, the actual contact mark being produced by the contacting of the prober to the pad, comparing the second image to the first image to obtain an offset data, the offset data relating the actual contact position to the reference contact position, and correcting the position of the prober by aligning the actual contact position with the reference contact position based on the offset data.08-05-2010
20100066397ALIGNMENT FEATURES IN A PROBING DEVICE - An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For example, such a feature may be a corner of one of the tips. An array of probes may be formed to have such alignment features.03-18-2010
20100033200PROBING METHOD AND PROBING PROGRAM - Disclosed is a probing method including, when the probes are configured to make contact with a chip row including four chips continuously arranged in an oblique direction so that the probe card test four chips at a time, finding a first reference oblique chip row extending in the oblique direction and containing a center chip positioned at the center of the wafer and a plurality of first additional oblique chip rows arranged in parallel with the first reference oblique chip row at an upper side of the first reference oblique chip row, and setting contact positions between the probes and the first oblique chip rows wherein the contact positions are positions of the probes obtained by shifting the probes; setting contact positions between the probes and the second oblique chip rows in an opposite direction to a first step; and setting a plurality of index group and test order.02-11-2010
20090189627Methods And Apparatus For Planar Extension Of Electrical Conductors Beyond The Edges Of A Substrate - Concurrent electrical access to the pads of integrated circuits on a wafer is provided by an edge-extended wafer translator that carries signals from one or more pads on one or more integrated circuits to contact terminals on the inquiry-side of the edge-extended wafer translator, including portions of the inquiry-side that are superjacent the wafer when the wafer and the edge-extended wafer translator are in a removably attached state, and portions of the inquiry side that reside outside a region defined by the intersection of the wafer and the edge-extended wafer translator. In a further aspect of the present invention, access to the pads of integrated circuits on a wafer is additionally provided by contact terminals in a second inquiry area located on the wafer-side of the edge-extended wafer translator in a region thereof bounded by its outer circumference and the circumference of the attached wafer.07-30-2009
20090153169PROBE HAVING A FIELD-REPLACEABLE TIP - A probe is provided for testing the electrical characteristics of a device. The probe includes a housing, a plurality of cables, a circuit board located within the housing, and a field-replaceable probe tip. The probe tip includes an array of contacts. Each of the plurality of cables is connected to a corresponding contact. The probe includes a retractable shroud that retracts as the probe is connected to the device. The contacts have bifurcated tips.06-18-2009
20090146675PLANARIZING PROBE CARD - A novel planarizing probe card for testing a semiconductor device is presented. The probe card is adapted to come into contact with a probe card mount that is in adjustable contact with the prober. The probe card includes a printed circuit board affixed to a stiffener and a probe head that is in electrical contact with the printed circuit board. The probe head also includes a plurality of probe contactor tips that define a first plane. The stiffener further contains at least two planarizing adjusters that comes into contact with the probe card mount. The adjusters may be actuated to alter the position of first plane. A surface of the semiconductor device under test may define a second plane, and the adjusters may be adjusted to position the first plane to be substantially parallel to the second plane.06-11-2009
20090289651PROBE CARD LAYOUT - Multi-touchdown, parallel test probe cards having probe elements arranged to provide greater efficiency during testing of a substrate having a plurality of die thereon. Probe elements may be arranged in a number of configurations that allow for efficient usage of the probe elements.11-26-2009
20090206861SEMICONDUCTOR INSPECTING DEVICE - In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.08-20-2009
20090206860APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES - A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.08-20-2009
20090009202Methods of Retaining Semiconductor Component Configurations within Sockets - The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.01-08-2009
20090009201Probe for Electrical Test and Probe Assembly - A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips.01-08-2009
20090009200Method for Providing Alignment of a Probe - A method for aligning a probe relative to a Supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.01-08-2009
20080211525Probe card assembly and method of forming same - A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.09-04-2008
20090284277PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card.11-19-2009
20090102498Laser Targeting Mechanism - an automated test equipment system includes a peripheral including first mechanical alignment features; a test head including second mechanical alignment features arranged in a pattern corresponding to the first mechanical alignment features and configured to engage the first mechanical alignment features. The automated test equipment system also includes a laser assisted alignment system including laser devices mounted to the peripheral and operable to emit laser beams; target plates mounted to the test head and including target symbols visible on surfaces of the target plates. The target symbols are arranged in a pattern corresponding to the laser devices such that, when laser beams from the laser devices are substantially aligned with the target symbols, the first mechanical alignment features are substantially aligned with the second mechanical alignment features.04-23-2009
20080238460Accurate alignment of semiconductor devices and sockets - Methods and apparatus to provide accurate alignment for semiconductor sockets are described. In one embodiment, a carrier is utilized to align a device under test with a test socket. In some embodiments, alignment features on a carrier, a device under test, and/or a test socket are used to align the devices relative to each other.10-02-2008
20080238461Multi-type test interface system and method - Efficient automated testing systems and methods are presented. In one embodiment, an automated testing system includes a plurality of bucket modules, and a device under test transition interface. The plurality of bucket modules have similar external connection form factors for a variety of instruments. The interface is for transitioning connections from the plurality of bucket modules to a device under test.10-02-2008
20080265924Contactor nest for an IC device and method - An improved contactor nest for receiving and holding IC devices against a pin board interposer during the test or burn-in of the devices includes a frame having an IC pocket with a top opening, which is oversized in relation to the footprint of the IC device for which the contactor is designed, and centering guide walls for guiding an IC device to be tested into the pocket from the oversized top opening to the IC device seating plane. The centering guide walls have a gradual angle relative to the insertion axis of the IC pocket, and extend down to a bottom perimeter portion of the IC pocket immediately adjacent the IC seating plane for gradually centering the IC device in the pocket as the IC device approaches the seating plane. Preferably, the angled guide walls extend far enough into the IC pocket to allow the spring pins of the pin board interposer to scrub the contact pads of the IC devices as the IC device is being centered.10-30-2008
20080238463PROBE APPARATUS, PROBING METHOD AND STORAGE MEDIUM - A probe apparatus for sequentially testing electrical characteristics of chips includes an imaging unit for capturing images of the electrode pads of the inspection substrate, and a unit for calculating contact positions at which the probes are expected to contact with the electrode pads. The probe apparatus further includes a storage unit for storing correction data in which reference points on a reference substrate are associated with correction amounts corresponding to differences between actual and calculated contact positions of the reference points, and a unit for obtaining actual contact positions for the electrode pads by measuring relative positions of the electrode pads with respect to the reference points and correcting the calculated contact positions of the electrode pads based on the relative positions and the correction data.10-02-2008
20080238462TEST DEVICE FOR SEMICONDUCTOR DEVICES - A test device for semiconductor devices is disclosed. One embodiment provides a probe card, having at least one contact test body for contacting a semiconductor device. The probe card includes self-alignment devices and/or a penetration restriction device, or parts thereof. A semiconductor device is provided having at least one contact field adapted to be contacted by contact test bodies of a test device. The semiconductor device includes self-alignment devices and/or a penetration restriction device, or parts thereof, for the contact test body in the region of the contact field.10-02-2008
20080284457METHOD AND APPARATUS FOR CONTROL OF A POSITIONING DEVICE - In a device and a method for positioning an object, a drive of a movement device is controlled. To this end, a visual joystick is actuated, as a result of which a moveable actuator is moved, at least linearly by means of a display of a control unit of the movement device, into a position, in which a direction of movement, which can be implemented with the drive, is displayed symbolically. The drive for the movement of the object in the displayed direction of movement is initiated by means of a switching function of the actuator.11-20-2008
20080290885Probe test system and method for testing a semiconductor package - In a method and system for testing a device under test (DUT), a replaceable test connector (RTC) is disposed between a probe pin of a tester and the DUT. The RTC includes an upper test bond pad that is electrically coupled to a lower test bond pad. The probe pin is capable of being positioned to make a physical contact with the upper test bond pad, the physical contact enabling an electrical coupling there between. The lower test bond pad is capable of being positioned to make physical contact with a device bond pad of the DUT, the physical contact enabling an electrical coupling between the lower test bond pad and the device bond pad. The device bond pad is protected from potential damage from the probe pin by the RTC that is replaceable.11-27-2008
20080309360Testing apparatus for surface mounted connectors - This invention describes a device for testing a surface mounted connector using a test probe assembly that utilizes a vacuum to force the test wires and the test probe's wire array into intimate contact with the connector to be tested.12-18-2008
20080309359SUSPENSION SYSTEM AND ADJUSTMENT MECHANISM FOR AN INTEGRATED CHIP AND METHOD - Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a pressure plate member adapted to fit compatibly within the clamp assembly. A hinge assembly applies and releases pressure through the pressure plate member. The hinge assembly has a first open position where pressure is released and a second closed position where pressure is applied. A spring member between the pressure plate member and the hinge assembly has predetermined travel limits controlling the amount of pressure to be applied. In an exemplary embodiment of the invention disclosed herein the suspension system includes an adjustment mechanism which adjusts to the pressure to a fine degree. The adjustment mechanism includes a housing which applies and releases pressures in response to the turning of a control knob. The control knob is connected to a gear apparatus within the housing which responds to the movement of the control knob by moving the housing.12-18-2008
20080218190TESTING DEVICE - A printed-circuit-board testing device that tests an electronic component disposed on a printed circuit board includes printed-circuit-board-tilt measuring means for measuring tilting of the printed circuit board, measuring means for measuring tilting of an arm having a probe that comes into contact with and tests the electronic component, correcting means for correcting the tilting of the arm on the basis of the tilting of the printed circuit board and the tilting of the arm, inputting means for inputting positional information of the electronic component, arm disposing means for disposing the arm to a predetermined position in accordance with the positional information and printed-circuit-board testing means for performing testing as a result of protruding the probe from the disposed arm.09-11-2008
20080290886PROBE APPARATUS - A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.11-27-2008
20080315904METHOD FOR REGISTERING PROBE CARD AND A STORAGE MEDIUM STORING PROGRAM THEREOF - A probe card registration method is for registering a probe card for use in inspecting electrical characteristics of a target object in a probe apparatus for performing the inspecting. The probe card registration method includes detecting a height of a load sensor provided at a mounting table for mounting thereon the target object by using a first imaging unit disposed above the mounting table; contacting the load sensor with a probe by moving the load sensor by the mounting table; and stopping the movement of the load sensor when the load sensor starts to make contact with the probe. The method further includes calculating a height of a needle of the probe based on a height of the load sensor and a stop height thereof.12-25-2008
20090160471Contact Alignment Verification/Adjustment Fixture - In an electronic testing machine including at least one test module having a plurality of contacts for testing electronic components, the improvement of a contact alignment tool for aligning the contacts including a body to be positioned relative to the testing machine such that the body can be radially indexed along a path to a contact alignment test position proximate the contacts of the test module, and a plurality of circuits associated with the body, each circuit including at least one output signal connection and at least one open contact station, each open contact station defined by at least one open circuit trace pattern, such that each open contact station will be closed by the contacts when the body is located at the contact test position proximate the contacts and the contacts are properly aligned. A method and apparatus for aligning contacts of an electronic testing machine including at least one test module having a plurality of contacts.06-25-2009
20090160470SEMICONDUCTOR AND METHOD - A semiconductor and method is disclosed. One embodiment includes a detector arrangement to detect the position of a connection element. A probe tip, the detector arrangement including first connection pads are arranged on a substrate surface. A first circuit is connected to the first connection pads.06-25-2009
20090128178WAFER INSPECTING APPARATUS, WAFER INSPECTING METHOD AND COMPUTER PROGRAM - There is provided a wafer inspecting apparatus which reduces a preheating time of a probe, and prevents the probe and a wafer from being damaged. The apparatus has a stage (05-21-2009
20090134897APPARATUS AND METHOD FOR LIMITING OVER TRAVEL IN A PROBE CARD ASSEMBLY - Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.05-28-2009
20090184729INSPECTION METHOD AND PROGRAM STORAGE MEDIUM STORING THE METHOD - Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the electrode pads and making the electrode pads repeatedly contact the probes at high accuracy. In the inspection method, under the control of a control unit 07-23-2009
20090021275METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD - A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.01-22-2009
20090015280METHOD FOR CORRECTING DISPLACEMENT OF MULTI CARD AND METHOD FOR TESTING CIRCUIT ELEMENT - A method for correcting displacement of a multi card with respect to a product wafer, includes displacing a predetermined wafer on a stage of a probing device and forming a contact trace of a probe needle on a surface of the wafer by bringing the probe needle into contact with the wafer disposed on the stage; localizing, based on the contact trace, a displaced area from the surface of the wafer, the area being displaced with respect to the multi card, and determining a displacement amount of the displaced area; and setting a parameter based on the displacement amount, the parameter to be referred in the case of positioning of the multi card to the displaced area. The displacement of the multi card is corrected in a case of testing electric characteristics of a plurality of circuit elements formed on the product wafer with the use of the multi card capable of bringing the probe needles into contact with the plurality of circuit elements all at once.01-15-2009
20090206862Adjustable Electrical Probes for Circuit Breaker Tester - An electrical probe assembly includes a first probe housing pivotally connected to a base structure and receiving a first probe therein. The first probe is configured to interface with a first contact of an electrical component. A second probe housing is pivotally connected to the base structure and receives a second probe therein. The second probe is configured to interface with a second contact of the electrical component wherein the first and second contacts have a spatial relationship therebetween. An adjustment mechanism is connected to the first and second housing and configured to independently adjust an amount of rotation of the each of the housings to accommodate the spatial relationship.08-20-2009
20080238464SYSTEM AND METHOD OF MITIGATING EFFECTS OF COMPONENT DEFLECTION IN A PROBE CARD ANALYZER - A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed electrical planarity measurements with fast optical planarity measurements to produce “effectively loaded” planarity measurements.10-02-2008
20090167335Probe Card - Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.07-02-2009
20090085594PROBE APPARATUS AND PROBING METHOD - A probe apparatus includes an imaging unit imaging probes and a first and a second imaging unit imaging the wafer surface. The apparatus further includes a control unit obtaining positions of a mounting table at which focuses of the imaging unit and the first imaging unit are made to coincide with each other and then the focuses of the image unit and the second imaging unit are made to coincide with each other by moving the mounting table; obtaining positions of the mounting table at which the images of the wafer are sequentially taken by the first and the second imaging unit by moving the mounting table; obtaining a position of the mounting table at which the probes are imaged by the imaging unit, and calculating a position of the mounting table at which the wafer contacts with the probes based on the obtained positions of the mounting table.04-02-2009
20090085595METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD - A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.04-02-2009
20090015281METHOD OF POSITIONING AN ANISOTROPIC CONDUCTIVE CONNECTOR, METHOD OF POSITIONING THE ANISOTROPIC CONDUCTIVE CONNECTOR AND A CIRCUIT BOARD FOR INSPECTION, ANISOTROPIC CONDUCTIVE CONNECTOR, AND PROBE CARD - The method is a method for positioning a three-layered rectangular frame-like anisotropic conductive connector in order to inspect the electrical properties of an object for inspection. The positioning is carried out in the following manner. The three-layered anisotropic conductive sheet is composed of a first anisotropic conductive sheet, a center substrate and a second anisotropic conductive sheet. Markings and through-holes are formed on the center substrate, and semi-transparent protrusions and through-holes are formed on each of the first anisotropic conductive sheet and the second anisotropic conductive sheet. The markings are identified through the semi-transparent protrusions by detecting means disposed on the side of the first anisotropic conductive sheet and the second anisotropic conductive sheet and thereby the positioning of the semi-transparent protrusions to the markings is carried out, whereby performing the positioning of the first anisotropic conductive sheet, the center substrate and the second anisotropic conductive sheet.01-15-2009
20090230984DEFECTIVE PRODUCT INSPECTION APPARATUS, PROBE POSITIONING METHOD AND PROBE MOVING METHOD - For adjusting a positional relationship between a specimen and a probe to measure an electric characteristic of the specimen through a contact therebetween, a base table holding a specimen table holding the specimen and a probe holder holding the probe is positioned at a first position to measure the positional relationship between the probe and the specimen at the first position, and subsequently positioned at a second position to measure the positional relationship therebetween at the second position so that the probe and the specimen are contact each other at the second position, the specimen table and the probe holder are movable with respect to each other on the base table at each of the first and second positions to adjust the positional relationship between the probe and the specimen, and a measuring accuracy at the second position is superior to a measuring accuracy at the first position.09-17-2009
20090002009MULTI-OFFSET DIE HEAD - An upper die portion of a die head for aligning probes having different offsets in a first array of first micro-holes formed in a lower die portion of the die head. The upper die portion includes a spacer portion and a first assembly aid film. The spacer portion includes first and second surfaces. The first surface contacts the lower die portion. The first assembly aid film is attached with the second surface and has a second array of second micro-holes for receiving the probes having different offsets. The second micro-holes include at least a first micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a first offset and at least a second micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a second offset that is not the same as the first offset.01-01-2009
20090212804NEEDLE TRACE TRANSFER MEMBER AND PROBE APPARATUS - A needle trace transfer member to which needle traces of probes are transferred is installed at a movable mounting table to align the probes before electrical characteristics of a target object on the mounting table are inspected by bringing the probes into electrical contact with the target object. The needle trace transfer member is made of a shape memory polymer transformed reversibly and rapidly between a glass state with a high modulus elasticity and a rubber state with a low modulus of elasticity near its glass transition temperature. The glass transition temperature is set to a temperature close to a set temperature of the mounting table. The shape memory polymer is mainly made of polyurethane-based resin.08-27-2009
20090212803PROBE APPARATUS, PROBING METHOD, AND STORAGE MEDIUM - A probe apparatus is capable of being scaled-down and reducing a manufacturing cost thereof in a probe apparatus having a plurality of probe apparatus main bodies. A loader unit for transferring a wafer between carriers accommodating therein wafers and the probe apparatus main bodies includes: an upper camera for imaging the arrangement of chips to be inspected of the wafer; a lower camera for imaging probe needles; an X-Y-Θ stage for moving the position of the wafer W in a horizontal direction and a second loader mechanism for moving the wafer in a vertical direction. Accordingly, a fine alignment of the wafer is performed by the loader unit to adjust the position of the wafer.08-27-2009
20090251163ALIGNMENT METHOD, TIP POSITION DETECTING DEVICE AND PROBE APPARATUS - An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the probes by using the tip position detecting device, detecting the tip positions of the probes, previously detected by the tip position detecting device, by using the second imaging unit, transferring needle marks of the probes onto a soft member provided at the tip position detecting device by allowing the probes to come into contact with the soft member, detecting the needle marks of the probes formed on the soft member by using the first imaging unit, and detecting inspection electrodes of the object corresponding to the probes by using the first imaging unit.10-08-2009
20100148813APPARATUS AND METHOD FOR COMBINED MICRO-SCALE AND NANO-SCALE C-V, Q-V, AND I-V TESTING OF SEMICONDUCTOR MATERIALS - Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.06-17-2010
20090315580PROBE APPARATUS - A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably connect the cylinder mechanisms to a head plate horizontally supporting a probe card. When a semiconductor wafer, mounted on the mount, comes into contact with probes of the probe card, a control unit operates the cylinder mechanisms and the connecting mechanism to connect the cylinder mechanisms to the head plate. Thereafter, the control unit further operates the cylinder mechanisms, to move the chuck top upward from the mounting table main body by a predetermined overdrive amount. Accordingly, the probe apparatus achieves an originally required contact load between the semiconductor wafer and the probes of the probe card while preventing the probe card from being displaced upward during overdriving of the semiconductor wafer, thereby enabling a highly reliable test.12-24-2009
20100148814COMPLIANCE CONTROL METHODS AND APPARATUSES - Methods and apparatuses for modifying a stage position and measuring at least one parameter of a motor connected with a stage during a commanded stage position are described. In one embodiment of one aspect of the invention, the motor is configured to move the stage in a first direction in response to the at least one parameter and determine whether the at least one parameter is within a threshold range.06-17-2010
20080315903METHOD FOR MEASUREMENT OF A DEVICE UNDER TEST - A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.12-25-2008
20100176832Vertical Guided Layered Probe - The present invention is a set of layered probes that make electrical contact to a device under test. The layered probes are disposed within openings of at least one guide plate. The guide plate surrounds the probes via the openings.07-15-2010
20100001752PARALLELISM ADJUSTING MECHANISM OF PROBE CARD - A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card (01-07-2010
20100141289PROBE CARD - A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.06-10-2010
20100219854PROBE AND ELECTRICAL CONNECTING APPARATUS USING IT - A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.09-02-2010
20090072849Flexible Test Fixture - A system for testing an electronic circuit board (ECB) having a plurality of test points in a pre-defined arrangement on a measurement device having a plurality of resources includes an interface fixture having a plurality of contact pads arranged in an array on a first surface. The contact pads can be electrically coupled to the plurality of resources of the measurement system according to a pre-defined pattern, where at least two of the contact pads are electrically coupled to one of the plurality of resources in a many-to-one relationship. The system also includes a test fixture removably attached to the first surface of the interface fixture. The test fixture includes an upper probe plate having a plurality of openings and a lower probe plate parallel to the upper probe plate. The lower probe plate includes a plurality of openings associated with the openings in the upper probe plate. The test fixture also includes a plurality of probes extending through the associated openings in the upper and the lower probe plates, contacting one of the contact pads, and guided to test points of the ECB by the associated openings.03-19-2009
20080231299Vacuum chamber with two-stage longitudinal translation for circuit board testing - A circuit board tester that uses a dual-stage translation to bring a unit under test (UUT) into physical and electric contact first with a series of tall probes, then with a series of short probes. Initially, the UUT is mounted on a support plate, and spaced apart from both the tall and short probes. First, in order to perform a functional test on the UUT, a first vacuum stage is engaged, and atmospheric pressure translates the UUT longitudinally until contact is made with a first hard stop, defining a first position. At this first position, the UUT is in contact with a series of tall probes, and is spaced apart from a series of short probes. After a function test is performed, a second vacuum stage is engaged in addition to, and independent of, the first vacuum stage. Atmospheric pressure translates the UUT longitudinally until contact is made with a second hard stop, defining a second position.09-25-2008
20090108861STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES - A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.04-30-2009
20100301890PROBING APPARATUS WITH MULTIAXIAL STAGES FOR TESTING SEMICONDUCTOR DEVICES - A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.12-02-2010
20100225345APPARATUS AND METHOD FOR TESTING A SEMICONDUCTOR DEVICE - Provided are an apparatus and a method of testing a semiconductor device. A horizontal maintaining unit provided inside a test head applies load to a probe card in a direction perpendicular to the probe card to hold the probe card in a horizontal state. Probe needles of the probe card are uniformly placed on a central region of pads of the semiconductor device, thereby providing an apparatus and a method of testing a semiconductor device capable of improving productivity and reducing a yield loss of a test process.09-09-2010
20090219045TESTBED FOR TESTING ELECTRONIC CIRCUITS AND COMPONENTS - There is disclosed an electronic testbed, an electronic testbed board, and a method for positioning receptacles for nails in the electronic testbed board. In an embodiment, the electronic testbed board includes a mounting through-hole for mounting a receptacle for a nail. The mounting through-hole is drilled to a suitably precise diameter for mounting the receptacle substantially perpendicular to the testbed board. One or more via-holes are located adjacent the mounting through-hole, and are adapted to allow an electrical connection between any conductive layers provided at the one or more via-holes. The receptacle may be mounted more accurately and the electronic test bed may be built more accurately by separating the functions of the via-holes and the mounting through-hole.09-03-2009
20090219046PROBE CARD INCLINATION ADJUSTING METHOD, INCLINATION DETECTING METHOD AND STORAGE MEDIUM STORING A PROGRAM FOR PERFORMING THE INCLINATION DETECTING METHOD - An inclination adjusting method adjusts an inclination of a probe card installed at a probe apparatus to make the probe card be in parallel with a mounting surface of a movable mounting table for mounting thereon an object to be inspected. The method includes: detecting an average tip height of multiple probes disposed at each of plural locations of the probe card by using a tip position detecting device; obtaining an inclination of the probe card with respect to the mounting table based on differences in the average tip heights detected from the plural locations of the probe card; and adjusting the inclination of the probe card based on the obtained inclination.09-03-2009
20100013508PROBE CARD CASSETTE AND PROBE CARD - A holding section (01-21-2010
20100052719DEVICE AND METHOD FOR TESTING DISPLAY PANEL - A testing device is provided for testing a display panel including a first circuit board. The testing device includes a second circuit board and a pressing element. The second circuit board includes a main body, multiple test pads, multiple testing circuits and multiple conducting elements. The test pads are arranged on a first surface of the main body and corresponding to respective pins of the first circuit board. The testing circuits are formed on the second surface of the main body and corresponding to respective test pads. The first circuit board is stacked on the second circuit board. The testing circuits are electrically with respective pins through respective conducting elements and respective test pads. The pressing element presses a stacking region between the first circuit board and the second circuit board, thereby facilitating close contact between the first circuit board and the second circuit board.03-04-2010
20100117672PROBE TIP TO DEVICE PAD ALIGNMENT IN OBSCURED VIEW PROBING APPLICATIONS - A method of performing alignment of an array of probe tips of a probe card to corresponding contact pads for wafer probing applications by performing the steps of: obtaining a backside image of the wafer; overlaying a mapping of the contact pads over the backside image; selecting contact pads as landing points; obtaining an image of the probe tips array; comparing the landing points to corresponding positions of probe tips; and, if the positions of probe tips are not aligned with the landing point, rotating the probe card to align the positions of probe tips to the landing points.05-13-2010
20100253378PROBE FOR HIGH FREQUENCY SIGNAL TRANSMISSION - A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.10-07-2010
20090153170INSPECTION APPARATUS - An inspection apparatus includes a movable mounting table having a temperature control device, an elevation drive unit for vertically moving the mounting table, a controller for controlling the elevation drive unit and a probe card having probes arranged above the mounting table. The elevation drive unit includes first and second driving shafts connected to each other through coupling members to drive the mounting table, a motor for driving the first and second driving shafts, and a torque detection unit for detecting a torque between the first and second driving shafts based on a contact load between the probes and the at least one device. The controller includes a torque controller for controlling the torque based on detection results of the torque detection unit when the probe card expands or contracts due to temperature variation.06-18-2009
20080252318METHOD FOR TESTING MICRO SD DEVICES USING EACH TEST CIRCUITS - A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD devices and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding one of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.10-16-2008
20080252320Apparatus for testing micro SD devices - Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray: and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.10-16-2008
20080252322Method for testing system-in-package devices - A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.10-16-2008
20080252319Apparatus for testing system-in-package devices - Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time.10-16-2008
20080231301INSPECTION APPARATUS - An inspection apparatus includes a mounting table movable in X and Y directions and an alignment mechanism which performs an alignment of a target object placed on the mounting table. Further, the alignment mechanism includes an image pickup device which is movable in either one of the X and Y directions and is capable of being stopped at a desired position and a controller for performing a preliminary alignment of the target object by moving the image pickup device and the mounting table in respectively movable directions.09-25-2008
20100277198SYSTEM AND METHOD FOR TESTING A CHARACTERISTIC IMPEDANCE OF AN ELECTRONIC COMPONENT - A method for testing a characteristic impedance of an electronic component includes sending a positioning command to a control computer through a switch, so as to drive a probe holder of a mechanical arm to position probes of a time domain reflectometer (TDR) on a position of the electronic component. The method further receives measured data collected by the TDR, and compares the measured data with preset standard values to determine if the measured data is acceptable.11-04-2010
20080204059Probe Tile for Probing Semiconductor Wafer - A tile used to hold one or more probes for testing a semiconductor wafer is disclosed. The tile has one or more sites for inserting one or more probes to test the semiconductor wafer. Each site has one or more holes. Each hole is coupled with a slot forming an angle. A probe is inserted into the tile from a top of the tile through the hole and seated on the slot. The probe has a probe tip. The probe top is in contact with the semiconductor wafer at one end of the slot at a bottom of the tile. The probe tip is aligned with an X and Y coordinate of a bond pad on the semiconductor wafer.08-28-2008
20100039133PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES - A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first and second probe heads in a first direction substantially parallel to the respective surfaces more than in a second direction substantially normal to the respective surfaces.02-18-2010
20100117671Simulated mounting structure for testing electrical devices - A testing apparatus or test jig is configured to accept a electrical device for testing prior to final assembly. In one example, a pair of conductive conveying belts compliantly engage a partially assembled photovoltaic (PV) module by its sides, and electrodes engage orthogonal sides of the module. The test apparatus or jig can be use for a variety of electrical tests, and may, for example be connected to a high potential (HiPot) tester.05-13-2010
20080218189Method and System for Automatically Managing Probe Mark Shifts - Disclosed is a method and a system for automatically managing probe mark shifts. A determination is made from test data as to whether a die on a wafer is defective. A probe mark check on the wafer is made to determine whether a probe mark is shifted. Necessary recovery action is performed in response to the probe mark being shifted. In the probe mark check, a plurality of probe mark positions are selected from the test data. A determination is then made as to whether at least one of the plurality of probe mark positions violates an engineering rule.09-11-2008
20100182032PRINTED CIRCUIT BOARD TESTING FIXTURE - A printed circuit board (PCB) testing fixture secures at least one PCB, each having a port. The PCB testing fixture includes a fixing frame and a testing plate. The fixing frame defines at least one first sliding groove to receive an edge of the at least one PCB. The testing plate is adjustably fixed on the fixing frame, and includes at least one backplane each including a connector corresponding to the at least one first sliding groove individually. The connector connects to the port of the at least one PCB. A location on which the testing plate is fixed to the fixing frame can be altered to test PCBs of different sizes.07-22-2010
20100026332DEVICE AND METHOD FOR SENSING A POSITION OF A PROBE - A device for sensing a position of a probe relative to a reference medium, the probe comprising a heater element with a temperature dependent electrical resistance and being adapted to determine probe position by measuring a parameter associated to a thermal relaxation time of the heater element.02-04-2010
20100019793CIRCUIT BOARD TESTING DEVICE WITH SELF ALIGNING PLATES - A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral sideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.01-28-2010
20100019792TESTING MODULE - A testing module is provided including a driving assembly, a positioning assembly and a testing head mechanism. The positioning assembly positions the driving assembly and the testing head mechanism therein. The positioning assembly includes a positioning member. The positioning member includes a base seat. The base seat defines a receiving cavity. The testing head mechanism includes a cushioning mechanism accommodated in the receiving cavity and driven by the driving assembly to move relative to the positioning assembly.01-28-2010
20090174424Apparatus for testing semiconductor device package and multilevel pusher thereof - A semiconductor package testing apparatus comprises a test substrate that electrically tests a semiconductor package chip; a socket having an electrical contact between the test substrate and the semiconductor package; an insert block inserted into the socket, wherein the semiconductor package is mounted to the insert block; and a pusher that brings the socket into contact with the semiconductor package by compressing an upper part of the semiconductor package, wherein the pusher is multilevel-controlled to compress the semiconductor package by a predefined pressure according to a thickness of the semiconductor package.07-09-2009
20100213962BALLAST AND WIRING LAMP FIXTURE TESTER - Apparatus and methods for testing a light fixture power circuit are therefore provided. The light fixture power circuit may energize a fluorescent lamp by providing power at first and second power terminals. The lamp holder may include a lamp pin guide for guiding the tube's contact pins toward the first and second power terminals. The apparatus may have probes that simulate the tube's contact pins. The probes may be robotically inserted into the lamp holder in a manner that is similar to the manner in which the contact pins would be inserted. This may eliminate the requirement to use fluorescent tubes to test the light fixture power circuit. The apparatus may include circuitry for testing the impedance of the light fixture power circuit at the first and second power contacts.08-26-2010
20090134896Interface for testing semiconductors - A system that includes an imaging device for effectively positioning a probe for testing a semiconductor wafer.05-28-2009
20090134895HIGH PERFORMANCE PROBE SYSTEM - A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.05-28-2009
20090096474DIE DESIGN WITH INTEGRATED ASSEMBLY AID - Methods and systems for inserting and replacing swaged probe pins in a lower die portion of a head having an array of micro-holes for receiving the probe pins are disclosed. The methods and systems include the following: swaged probe pins including substantially cylindrical ends and a swaged center portion; and an assembly aid film including an array of slotted holes, each of the slotted holes including a substantially round portion for receiving the substantially cylindrical ends of the swaged probe pins and slot portions for receiving the swaged center portion of the swaged probe pins. The array of slotted holes is configured to properly align the swaged probe pins with the array of micro-holes.04-16-2009
20100244877METHOD AND APPARATUS FOR CONTROLLING POSITION OF Z-AXIS FOR WAFER PROBER - The present invention relates to a method and apparatus for controlling the Z axis position of a wafer prober. The apparatus includes a first sensor unit (09-30-2010
20100052718Method For Verifying A Completeness Of An Antenna - A method verifies a completeness of an antenna disposed on a window. The antenna is electrically conductive and has a first end and a second end spaced from each other. The method comprises the step of placing the window on a fixture for supporting the window. The method also includes the steps of automatically aligning a distributing probe and the first end of the antenna and automatically aligning a receiving probe and the second end of the antenna. The method further includes the step of activating a current source to pass an electrical current from the distributing probe to the receiving probe through the antenna. The method also includes the step of indicating passage of the electrical current from the antenna to the receiving probe with the indicator to verify a completeness of the antenna.03-04-2010
20080231300METHOD FOR DETECTING TIP POSITION OF PROBE, ALIGNMENT METHOD, APPARATUS FOR DETECTING TIP POSITION OF PROBE AND PROBE APPARATUS - An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable contact body belonging to the sensor unit, the method used in inspecting electrical characteristics of an object to be inspected by bringing the object supported on a movable mounting table into electrical contact with the probes. The method includes a first step for moving the tip position detecting device by using the mounting table to thereby bring the contact the object into contact with the tips of the probes; a second step for further moving the mounting table to thereby move the contact body toward the sensor unit without causing elastic deformation to the probes; and a third step of determining a movement starting position of the contact body as the tip positions of the probes.09-25-2008
20100277197SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON PRODUCTION-LEVEL BOARDS WITH INCREMENTAL ACCURACY AND PRODUCTIVITY LEVELS - A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer, product-level PCB boards, for large volume testing, by people who are not familiar with advanced, delicate, measurement techniques, who need robust test facilities, and cannot afford the time or expense of other lab-type approaches.11-04-2010
20100271062METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM - Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly10-28-2010
20080297187LOCATION DEVICE FOR CONTACT PROBES - A location device for holding a number of probes is provided. The probes include a body, a first needle and a second needle respectively and coaxially disposed at opposite ends of the body. The location device includes a first support structure, a second support structure overlapping the first support structure and a number of through holes running through the first support structure and the second support structure. Each of the through holes includes a locating hole, a first aperture and a second aperture respectively disposed at opposite ends of and communicated with the locating hole and configured for respectively receiving the first, second needle of the probe. The first, second needle respectively extend out of the first, second aperture. The probes are clamped by the first, second support structure and located by the locating hole of the support device.12-04-2008
20100231249Probe Head Structure For Probe Test Cards - A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.09-16-2010
20080252323Method for testing micro SD devices - A method and apparatus for testing micro SD devices each having a plurality of electrical leads is described. The method and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.10-16-2008
20080252321Apparatus for testing micro SD devices - Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.10-16-2008
20090295416REPLACEABLE PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER - A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing location on a base plate. The probe tile is configured into a self-contained assembly which includes a chassis body containing a plurality of probes for probing devices on a wafer, a dielectric block for supporting the probes, and a wireguide for guiding a plurality of cables from the testing equipment into the chassis body. A wafer station having replaceable base plates and replaceable probe tiles are also provided.12-03-2009
20080231302Wafer translator having metallization pattern providing high density interdigitated contact pads for component - A metallization pattern for a wafer translator provides a high density layout of interdigitated contact pads, suitable for component placement, along with larger contact pads suitable for connection to external equipment terminals. In another aspect, electrically conductive material may be added to, or removed from, the high density layout of interdigitated contact pads and larger contact pads to modify, or reconfigure, the electrical pathways of the wafer translator.09-25-2008
20080265925Double sided probing structures - A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.10-30-2008
20080197868CIRCUIT BOARD TESTING DEVICE WITH SELF ALIGNING PLATES - A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral sideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.08-21-2008

Patent applications in class Probe alignment or positioning