Class / Patent application number | Description | Number of patent applications / Date published |
324757000 | Probe contact enhancement | 43 |
20080258748 | METHOD FOR FABRICATING A PROBING PAD OF AN INTEGRATED CIRCUIT CHIP - A method for fabricating a probing pad is disclosed. A substrate having thereon a dielectric layer is provided. An inlaid metal wiring is formed in the dielectric layer. The inlaid metal wiring and the dielectric layer are covered with a passivation dielectric film. A portion of the passivation dielectric film is then etched away to form a reinforcement pattern on the inlaid metal wiring. The reinforcement pattern has inter-space that exposes a portion of the underlying inlaid metal wiring. A conductive pad is formed over the reinforcement pattern and the passivation dielectric film. The conductive pad fills the inter-space of the reinforcement pattern. | 10-23-2008 |
20090002008 | Inspection Method, Inspection Apparatus and Control Program | 01-01-2009 |
20090039909 | SEMICONDUCTOR DEVICE HAVING CONTACT FAILURE DETECTOR - A semiconductor device having a circuit for detecting a defective connection to the semiconductor device. A semiconductor device including multiple internal circuits; multiple pads respectively connected to the internal circuits; and a contact failure detector coupled between the pads and a common node and configured to detect contact failures between tips of a probe card and the pads. | 02-12-2009 |
20090058445 | CIRCUIT BOARD TESTING USING A PROBE - A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation. | 03-05-2009 |
20090066353 | PROBE ASSEMBLIES AND METHODS FOR HOUSING AND PROVIDING ELECTRICAL CONTACT TO PLANAR OR CHIP-TYPE SENSORS AND HEATERS - A probe assembly for planar or chip-type sensors and heaters, which includes a probe housing having a tip end and a feed-through end, and a sensor or heater element within the housing which includes electrode pads and has a bottom surface that is in thermal contact with the probe tip. The assembly includes a means of applying a first compressive force to the element such that thermal contact between its bottom surface and the probe tip is maintained. Electrical lead wires (ELWs) within the housing provide respective conductive paths between the electrode pads and the feed-through end, each ELW including at least one spring portion which provides a second compressive force that acts to maintain physical and electrical contact between the ELW and its respective electrode pad. The assembly is arranged such that the first compressive force is independent of the second compressive force. | 03-12-2009 |
20090096473 | TESTING PROBE AND ELECTRICAL CONNECTION METHOD USING THE SAME - A testing probe including a shaft body and a plurality of claws is provided. Each cross section of the shaft body has a substantially identical shape and a substantially identical outer diameter. The claws are formed integrally with the shaft body at an end thereof. An orthogonal projection of the claws on any one of the cross sections of the shaft body is within the contour of the cross section. Contacting a solder bump on a test pad of a circuit board with the claws of the testing probe increases the test yield of the circuit board. | 04-16-2009 |
20090102497 | PUSHER, PUSHER UNIT AND SEMICONDUCTOR TESTING APPARATUS | 04-23-2009 |
20090115440 | TESTING INTEGRATED CIRCUITS - A testing apparatus for a radiation sensing integrated circuit comprises a load board ( | 05-07-2009 |
20090121732 | TEMPORARY PLANAR ELECTRICAL CONTACT DEVICE AND METHOD USING VERTICALLY-COMPRESSIBLE NANOTUBE CONTACT STRUCTURES - A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface. | 05-14-2009 |
20090184728 | CONTACT DEVICE AND METHOD FOR PRODUCING THE SAME - Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film on the second conductive film; and a step of forming a surface layer on the third conductive film, the surface layer containing an oxidative product of the metal in the second conductive film, which metal has been diffused to be precipitated out from the surface of the third conductive film and oxidized. | 07-23-2009 |
20090243644 | SOCKET, TEST DEVICE AND TEST METHOD FOR TESTING ELECTRONIC ELEMENT PACKAGES WITH LEADS - The present invention relates to a socket, test device and test method for testing electronic element packages with leads, and particularly relates to a socket, test device and test method for testing image sensors with leads. The test device comprises a socket, a plurality of test probes and a test circuit board. The socket comprises a base having a plurality of first holes, a guiding structure having a plurality of second holes and at least one floating member used to connect the base and the guiding structure. In the socket, test device and test method of the present invention, each test probe is received into one first hole and one second hole to maintain the top surface of guiding structure to be even for preventing the deflective placing of the electronic element packages, and for preventing the damage to the test probes. The test probes are controlled by compressing the floating member for protruding form the top surface of the guiding structure and for providing a shorter delivering path of the electronic signals between the test circuit board and the electronic element packages. This shorter delivering path of the electronic signals can improve the accuracy and reliability of the test process for the electronic element packages with leads. | 10-01-2009 |
20090261851 | SPRING PROBE - According to some example embodiments, an interconnect has a crown with contact tips, in which each of the contact tips is structured to physically contact a substantially spherical solder ball along a curved inner surface of the contact tip. | 10-22-2009 |
20090267630 | TESTING DEVICE OF SEMICONDUCTOR DEVICE - A testing device of a semiconductor device includes a first board having a plurality of openings; a frame body provided in the openings, the frame body having a frame in which a plurality of probe needles is provided; and a plurality of second boards provided perpendicular to the first board in the periphery of the openings, the second boards being connected to the first board; wherein the probe needles pierce the frame so as to be connected to the second boards from the periphery of the frame body via the openings. | 10-29-2009 |
20090289650 | PROBE CARD AND METHOD FOR SELECTING THE SAME - A probe card includes a probe unit having multiple through holes arranged therein, multiple probe needles respectively press-fitted to the multiple through holes, a printed board having convex portions which presses down the probe needles located in predetermined positions, and a unit holder which supports the probe unit and the printed board. | 11-26-2009 |
20090302874 | METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS - A method and apparatus for probing a circuit board, is provided. One implementation involves a signal probe including a tip having a plurality of strands of flexible conductive material surrounding the tip, the strands extending out from the tip to provide multiple points of contact with the rim of a via or a conductive barrel of the via when the tip is inserted into the via, the probe tip and probe strands being made of same conductive material; such that aligning the signal probe with the via for engaging the probe tip strands with the via, and inserting the tip into the via, causes bending and flexing of the strands for making contact with a conductor on a top rim of the barrel and inside an inner wall of the barrel. | 12-10-2009 |
20090302875 | CHIP TEST METHOD - A chip test method is disclosed and includes: loading chips on a chip tray and fastening a cover plate on the chip tray; loading the chip tray with the cover plate in a chip test device; aligning a probe card of the chip test device with a test unit of the chip tray; testing chips in the chip tray; sorting the passed chips from the failed chips | 12-10-2009 |
20100019791 | ELECTRONIC COMPONENT PRESSING DEVICE AND ELECTRONIC COMPONENT TEST APPARATUS - An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member. | 01-28-2010 |
20100026331 | Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies - Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability. | 02-04-2010 |
20100045320 | HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF - The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer. | 02-25-2010 |
20100045321 | HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF - The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer. | 02-25-2010 |
20100066395 | Wafer Prober Integrated With Full-Wafer Contacter - Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer. | 03-18-2010 |
20100066396 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting apparatus for use in electrical measurement of a device under test comprises a supporting member and a flat plate-like probe base plate. On one surface of the probe base plate are provided multiple probes abutting on electrical connecting terminals of the device under test undergoing an electrical test. Also, on the other surface of the probe base plate is formed a securing portion provided with a screw hole opened at the top portion. It further has a generally cylindrical spacer and a screw member passing through the spacer and whose tip end is screwed in the screw hole of the securing portion. As for the spacer, movement in the axial direction is restricted in relation to the supporting member by a restricting means. The spacer has a head portion whose underside is mounted on the other surface of the supporting member and a body portion communicating with the head portion at one end, arranged to pass through a through hole formed in the supporting member, and whose other end is arranged to abut on the top face of the securing portion. | 03-18-2010 |
20100102841 | DEVICE, METHOD AND PROBE FOR INSPECTING SUBSTRATE - A device for inspecting a substrate, including a probe and a support member configured to hold the probe is disclosed. The probe comprises a compression spring and includes a conductive material to measure an electric property of a substrate under inspection. | 04-29-2010 |
20100109694 | UNIVERSAL CURRENT LEAKAGE TESTING ADAPTER - In one embodiment, a universal current leakage measurement device is disclosed. A universal current leakage testing adapter has the ability to couple with at least two differently sized or shaped probe connectors. The universal current leakage testing adapter is configured to couple with differently sized or shaped probe connectors by conductive planes either functioning independently or in concert to contact the pins of a probe connector. | 05-06-2010 |
20100117669 | PROBE CARD ACTUATOR - A probe card test interface is described. The probe card test interface includes a first frame configured to support a probe card circuit card assembly (CCA). The probe card CCA is configured to contact a semiconductor wafer with one or more test probes. The first frame is also configured to support a first group of electrical contact points, the first group of electrical contact point being electrically coupled to circuitry of the probe card CCA. A second frame is coupled to a test interface CCA, where the test interface CCA includes a second group of electrical contact points. A number of actuation devices are slidably mounted on the second frame. The actuation devices have a tip member configured to engage a lip of the first frame when the corresponding actuation device is moved to an engagement position. When all of the actuation devices are in the engagement position, simultaneous actuation of the actuation devices moves the first frame toward the second frame to couple the first and second groups of electrical contact points. The first group of electrical contact points is supported by the first frame such that the probe card CCA experiences little or no deflection during actuation of the actuation devices, thereby preventing damage to the probe card CCA. | 05-13-2010 |
20100117670 | CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME - A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time. | 05-13-2010 |
20100123476 | CONDUCTIVE CONTACT - A conductive contact includes a first plunger | 05-20-2010 |
20100127723 | PROBE POINT - A system and method for reliably probing an internal node from the backside of an integrated circuit are disclosed herein. In accordance with at least some embodiments, an integrated circuit includes a device that outputs a signal, and a probe structure. The probe structure includes a transistor having each terminal of the transistor connected to all other terminals of the transistor and connected to the device output. The device output signal is applied to each terminal of the transistor. | 05-27-2010 |
20100127724 | ANISOTROPIC CONDUCTIVE CONNECTOR, PROBE MEMBER AND WAFER INSPECTION SYSTEM - Provided is an anisotropic conductive connector and a prove member, each of which ensures that all of the conductive parts exhibit uniform conductivity when a pressing force is applied, even when the inspection target wafer has a large area and total number of inspection target electrodes of integrated circuits is 10,000 or more, and a wafer inspection system including the probe member. The anisotropic conductive connector includes a frame plate in which a plurality of anisotropic conductive film placement holes are formed, and elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by a peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance; and an insulating part that insulates the connection conductive parts to one another, and the connection conductive parts of the elastic anisotropic conductive films disposed in a peripheral area of the frame plate having a thickness smaller than that of the connection conductive parts of the elastic anisotropic conductive films disposed in a center area of the frame plate. | 05-27-2010 |
20100127725 | Replaceable coupon for a probing apparatus - The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer. | 05-27-2010 |
20100127726 | FIXING APPARATUS FOR A PROBE CARD - A fixing apparatus for fixing a probe card to a holder includes a screw fixed to the holder and binding the probe card onto the holder in a vertical direction, a first bearing member intervening between a head of the screw and the probe card and allowing expansion and contraction of the probe card with respect to the screw in a horizontal direction, and a second bearing member intervening between the probe card and the holder and allowing expansion and contraction of the probe card with respect to the holder in the horizontal direction. | 05-27-2010 |
20100134126 | PROBE AND METHOD FOR MANUFACTURING THE SAME - A probe for making electric contact with a contact target includes a first part ( | 06-03-2010 |
20100134127 | MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE - A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface. | 06-03-2010 |
20100176831 | Probe Test Card with Flexible Interconnect Structure - A probe test card assembly for testing of a device under test includes a printed circuit board (PCB), a space transformer, a probe head structure and a flexible interconnect structure. The space transformer has a first plurality of electrical contacts disposed thereon for providing electrical connections with a plurality of contacts disposed on the PCB and a second plurality of electrical contacts disposed thereon for making contact with a plurality of test probes. Each test probe from the plurality of test probes has a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer. The flexible interconnect structure provides electrical connections between the first plurality of electrical contacts on the space transformer and the plurality of electrical contacts on the PCB. | 07-15-2010 |
20100194417 | Interface Device - In a preferred embodiment, the present invention is an interface device comprising a receiver and a test adapter. The receiver has on each outer side a groove or ridge for use in initial engagement of the test adapter with the receiver. The test adapter has an engagement member having a plurality of clips arranged such that at least one clip engages with the groove or ridge on a side of the receiver. The test adapter further has a screw mechanism for drawing the engagement in and out of the test adapter to engage and disengage the test adapter with the receiver. | 08-05-2010 |
20100237887 | MICROELECTRONIC CONTACTOR ASSEMBLY, STRUCTURES THEREOF, AND METHODS OF CONSTRUCTING SAME - A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates. | 09-23-2010 |
20100237888 | PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, AND METHODS OF MAKING SAME - Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate. | 09-23-2010 |
20100237889 | PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, THE PROBE HEAD HAVING SMT ELECTRONIC COMPONENTS THEREON - A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mount technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through-hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor and space transformer substrates. | 09-23-2010 |
20100244875 | SCRUB INDUCING COMPLIANT ELECTRICAL CONTACT - The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site. | 09-30-2010 |
20100244876 | METHOD FOR SETTING CONTACT PARAMETER AND RECORDING MEDIUM HAVING PROGRAM FOR SETTING CONTACT PARAMETER RECORDED THEREON - Disclosed is a method to set contact parameters, which can simulate the entire contact process of devices of a semiconductor wafer with probes while visually checking the contact parameters. The method includes preparing a coordinate graph including a time axis and a height axis, and setting contact parameters of the semiconductor wafer by specifying a plurality of points on the coordinate graph by a plurality of upward/downward movement positions of the semiconductor wafer during electrical contact of the electrode pads of the semiconductor wafer with the plurality of probes or separation of the electrode pads of the semiconductor wafer from the plurality of probes, and time required for the semiconductor wafer to move until reaching the upward/downward movement positions, respectively, and displaying a broken-line graph through connecting the specified points with straight-lines. | 09-30-2010 |
20100271061 | CONTACT PROBE AND SOCKET - A contact probe include: a first plunger to be connected to an object to be inspected; a second plunger to be connected to a board for inspection; and a spring operable to urge the first and second plungers in directions of moving the first and second plungers apart from each other. A pillar part of one of the first and second plungers is slidably engaged with an inner periphery of a tubular part of the other of the first and second plungers. The pillar part includes an elastically deformable part which is in contact with a part of the inner periphery of the tubular part. | 10-28-2010 |
20100277196 | SEMICONDUCTOR TEST SYSTEM AND METHOD - A method of testing semiconductor devices, the method includes the steps of making a first set of electrical connections to a first set of devices to allow a first set of tests to be performed on that set of devices and concurrently making a second set of electrical connections to a second set of devices to allow a second set of tests to be performed on the second set of devices, wherein the first and second sets of tests are different, and concurrently performing the first set of tests on the first set of devices and the second set of tests on the second set of devices. | 11-04-2010 |
20100295570 | Probe Connector - A probe connector for being sucked by a suction nozzle and then soldered to a PCB by moving the suction nozzle has a barrel. One end of the barrel has a base, the other end of the barrel is formed with an opening. A periphery of the barrel has a portion protruded outwards to form a ring-shaped flange. The flange has a ring-shaped flat surface back to the base for engaging with a bottom of the suction nozzle. A probing pin includes a base portion received in the barrel and a contact portion projecting outside the barrel through the opening. An elastic element received in the barrel is disposed between the base and the base portion of the probing pin. | 11-25-2010 |